CN117153996A - Backlight module, display device and preparation method of backlight module - Google Patents

Backlight module, display device and preparation method of backlight module Download PDF

Info

Publication number
CN117153996A
CN117153996A CN202211279373.8A CN202211279373A CN117153996A CN 117153996 A CN117153996 A CN 117153996A CN 202211279373 A CN202211279373 A CN 202211279373A CN 117153996 A CN117153996 A CN 117153996A
Authority
CN
China
Prior art keywords
circuit layer
metal circuit
flexible substrate
led chip
backlight module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211279373.8A
Other languages
Chinese (zh)
Inventor
郑鹤
请求不公布姓名
李健林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huizhou Shiwei New Technology Co Ltd
Original Assignee
Huizhou Shiwei New Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huizhou Shiwei New Technology Co Ltd filed Critical Huizhou Shiwei New Technology Co Ltd
Priority to CN202211279373.8A priority Critical patent/CN117153996A/en
Priority to PCT/CN2023/114845 priority patent/WO2024082816A1/en
Publication of CN117153996A publication Critical patent/CN117153996A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133605—Direct backlight including specially adapted reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G02F1/133607—Direct backlight including a specially adapted diffusing, scattering or light controlling members the light controlling member including light directing or refracting elements, e.g. prisms or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

Abstract

The embodiment of the application provides a backlight module, a display device and a preparation method of the backlight module, wherein the backlight module comprises a flexible substrate and an LED chip arranged on the flexible substrate; the LED chip comprises a chip main body and an electrode part connected with the chip main body, wherein the electrode part is electrically connected with the metal circuit layer; one side of the electrode part, which is away from the chip main body, is provided with a convex hull, and the convex hull is embedded into the metal circuit layer. Before the metal circuit layer is solidified, the LED chip is attached to the bonding pad corresponding to the metal circuit layer, the convex hulls are firstly contacted and embedded into the metal circuit layer in a semi-solidified state during the bonding process, so that the surface resistance of the metal circuit layer is reduced, then the electrode part is gradually immersed into the metal circuit layer, and finally the metal circuit layer is solidified, so that the LED chip is firmly bonded on the flexible substrate, the reliability and the bonding yield of the LED chip bonding are improved, and the production cost of the backlight module is reduced.

Description

Backlight module, display device and preparation method of backlight module
Technical Field
The present application relates to the field of display technologies, and in particular, to a backlight module, a display device and a method for manufacturing the backlight module.
Background
With the continuous development of display technology, the MiniLED backlight has the advantages of high brightness, regional light control, high contrast, product ultrathin and the like, and a liquid crystal display mode matched with the Mini LED backlight gradually becomes the main stream of the market.
In the existing Mini LED backlight module, because the size of the Mini-LED is smaller, the distance between the positive and negative electrode bonding pads is very short, when the MiniLED is attached to the substrate, because the metal paste on the substrate is not completely solidified, the bonding pads of the Mini LED are directly contacted with the metal paste and squeeze the metal paste, the metal paste flows between the two bonding pads of the Mini LED, so that the short circuit occurs between the positive and negative electrode bonding pads, the welding yield of the Mini LED is reduced, and the cost of the backlight module is further affected.
Disclosure of Invention
The embodiment of the application provides a backlight module, a display device and a preparation method of the backlight module.
The embodiment of the application provides a backlight module, which comprises:
the flexible substrate is provided with a metal circuit layer;
the LED chip is arranged on the flexible substrate and comprises a chip main body and an electrode part connected with the chip main body, and the electrode part is electrically connected with the metal circuit layer;
the electrode part is provided with a convex hull at one side deviating from the chip main body, and the convex hull is embedded into the metal circuit layer.
In some embodiments, the electrode portion includes a first electrode portion and a second electrode portion, where the first electrode portion is provided with at least two convex hulls at intervals, and the second electrode portion is provided with at least one convex hull, and the convex hulls are distributed in four corners or in a triangle shape.
In some embodiments, the convex hull is spherical or square or elliptical or irregular in shape.
In some embodiments, the height of the convex hull is greater than or equal to 10 microns, and the thickness of the metal line layer is greater than the height of the convex hull.
In some embodiments, the flexible substrate is a reflective sheet, the reflective sheet includes a reflective surface, and the metal circuit layer is located on the reflective surface.
In some embodiments, the flexible substrate comprises a flexible transparent substrate and a first reflecting layer arranged on the flexible transparent substrate, and the metal circuit layer is positioned on one side of the first reflecting layer away from the flexible transparent substrate.
In some embodiments, the backlight module further comprises a lens, and the lens wraps the LED chip.
In some embodiments, the backlight module further includes a second reflective layer, the second reflective layer is disposed on a side of the metal circuit layer away from the flexible substrate, the second reflective layer includes a plurality of hollow areas, and the LED chip is located on the flexible substrate exposed by the hollow areas.
The embodiment of the application also provides a display device, which comprises the backlight module set in any embodiment.
The embodiment of the application also provides a preparation method of the backlight module, which comprises the following steps:
providing a flexible substrate;
a metal circuit layer is arranged on the flexible substrate, and the metal circuit layer is in a semi-solid state;
attaching an LED chip to the metal circuit layer, wherein the LED chip comprises a chip main body and an electrode part connected with the chip main body, and the electrode part is electrically connected with the metal circuit layer; wherein, one side of the electrode part, which is away from the chip main body, is provided with a convex hull, and the convex hull is embedded into the metal circuit layer;
and baking or irradiating UV light on the flexible substrate to cure the metal circuit layer.
In some embodiments, after baking or UV light irradiation is performed on the flexible substrate to cure the metal line layer, the method further includes:
and a lens is arranged on the flexible substrate, and the LED chip is coated by the lens.
In some embodiments, the disposing a lens on the flexible substrate, after the lens wraps the LED chip, further includes:
a second reflecting layer is arranged on one side, away from the flexible substrate, of the metal circuit layer, the second reflecting layer comprises a plurality of hollowed-out areas, and the LED chip is located on the flexible substrate exposed in the hollowed-out areas
The backlight module provided by the embodiment of the application comprises a flexible substrate and an LED chip arranged on the flexible substrate; the LED chip comprises a chip main body and an electrode part connected with the chip main body, wherein the electrode part is electrically connected with the metal circuit layer; wherein, one side of electrode portion that deviates from the chip main part is provided with the convex closure, and the convex closure embedding is in the metal line layer. Before the metal circuit layer is solidified, the LED chip is attached to the bonding pad corresponding to the metal circuit layer, the convex hull is arranged on the electrode part of the LED chip, and the convex hull can be firstly contacted with and embedded into the metal circuit layer in a semi-solidified state during the bonding process so as to reduce the surface resistance of the metal circuit layer, then the electrode part is gradually immersed into the metal circuit layer, and finally the metal circuit layer is solidified, so that the LED chip is firmly bonded on the flexible substrate. It can be understood that when the LED chip is attached to the flexible substrate, the convex hull is inserted into the semi-cured metal circuit layer and contacts the flexible substrate to play a supporting role, so that the electrode part and the metal circuit layer are prevented from being directly contacted and extruded in a large area to cause the diffusion of semi-cured metal paste to the periphery to cause the occurrence of short circuit of the positive electrode part and the negative electrode part, the reliability and the patch yield of the LED chip patch are improved, and the production cost of the backlight module is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is evident that the drawings in the following description are only some embodiments of the application and that other drawings may be obtained from these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a first structure of a backlight module according to an embodiment of the application.
Fig. 2 is a schematic structural diagram of the LED chip shown in fig. 1 at a first viewing angle.
Fig. 3 is a schematic structural diagram of the LED chip shown in fig. 1 at a second viewing angle.
Fig. 4 is a schematic diagram of a first arrangement of convex hulls of LED chips.
Fig. 5 is a schematic diagram of a second arrangement of convex hulls of LED chips.
Fig. 6 is a schematic diagram of a third arrangement of convex hulls of LED chips.
Fig. 7 is a schematic diagram of a second structure of a backlight module according to an embodiment of the application.
Fig. 8 is a schematic view of a scenario of a method for manufacturing a backlight module according to an embodiment of the present application.
Fig. 9 is a flowchart of a method for manufacturing a backlight module according to an embodiment of the application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to fall within the scope of the application.
In the existing Mini LED backlight module, because the size of the Mini-LED is small, the distance between the positive and negative electrode bonding pads is very short, when the Mini LED is attached to the substrate, because the metal paste on the substrate is not completely solidified, the bonding pads of the Mini LED are directly contacted with the metal paste and squeeze the metal paste, the metal paste flows between the two bonding pads of the Mini LED, so that the short circuit occurs between the positive and negative electrode bonding pads, the yield of the Mini LED is reduced, and the cost of the backlight module is further affected.
The embodiment of the application provides a backlight module, a display device and a preparation method of the backlight module. The following description will be made specifically with reference to the drawings.
The backlight module provided by the embodiment of the application is mainly a direct type backlight module, which is provided with a plurality of backlight partitions and can realize partition light control function. The direct type backlight module is mainly applied to display devices such as liquid crystal televisions, smart phones and tablet personal computers so as to provide a backlight source for a liquid crystal display panel.
Referring to fig. 1 to 3, fig. 1 is a schematic diagram of a first structure of a backlight module according to an embodiment of the application, fig. 2 is a schematic diagram of a first viewing angle of the LED chip shown in fig. 1, and fig. 3 is a schematic diagram of a second viewing angle of the LED chip shown in fig. 1.
The backlight module 100 provided by the embodiment of the application comprises a flexible substrate 10 and an LED chip 20 arranged on the flexible substrate 10. The flexible substrate 10 is provided with a metal circuit layer 13, and the led chip 20 is electrically connected with the metal circuit layer 13. Specifically, the LED chip 20 includes a chip main body 21 and an electrode portion 22 connected to the chip main body 21, the electrode portion 22 being electrically connected to the metal wiring layer 13; wherein, the side of the electrode part 22 facing away from the chip main body 21 is provided with a convex hull 221, and the convex hull 221 is embedded in the metal line layer 13.
Wherein a metal wiring layer 13 is provided on the flexible substrate 10, for example, a metal paste is printed on the flexible substrate 10 using a screen printing process to form the metal wiring layer 13. The metal circuit layer 13 is provided with solder joints so as to attach the LED chip 20 to the corresponding solder joint of the metal circuit layer 13, so that the electrode portion 22 of the LED chip 20 is electrically connected with the metal circuit layer 13. The metal wiring layer 13 corresponds to a driving circuit of the LED chip 20, and can drive the LED chip 20 to emit light.
The LED chip 20 may be a Micro-LED chip or a Mini-LED chip. Preferably, the LED chip 20 is a flip-chip Mini-LED chip. The LED chip 20 is disposed on the flexible substrate 10 and electrically connected to the flexible substrate 10. In the embodiment of the present application, the number of the LED chips 20 is plural, and the plural LED chips 20 are arranged at intervals and are arranged on the flexible substrate 10 in an array manner, or are arranged on the flexible substrate 10 in other regular or irregular manners, which is not particularly limited. For example, the LED chips 20 are disposed on the surface of the flexible substrate 10 in an arrangement of M rows by N columns, where M and N are positive integers not smaller than each other.
In the prior art, a substrate of the backlight module is usually a PCB, white ink needs to be printed on the PCB to reflect light emitted by the LED chip to the PCB, but the white ink on the PCB undergoes yellowing after high-temperature reflow soldering, so that the reflectivity of the white ink is greatly reduced, and therefore, the existing backlight module adopting the PCB is low in brightness, low in LED light utilization rate and high in energy consumption; and the PCB is a hard board and can not be bent, so that the application range of the backlight module is affected.
The substrate in the embodiment of the application is a flexible substrate, and the thickness of the flexible substrate is far smaller than that of a conventional PCB, so that the thickness of the backlight module can be reduced; meanwhile, the light and thin and bendable backlight module can be manufactured by utilizing the advantages of the light and thin and bendable flexible substrate, and can be matched with a flexible display screen to realize display products such as curved televisions and folding mobile phones.
As shown in fig. 1, in some embodiments, the flexible substrate 10 is a reflective sheet, and the reflective sheet 14 includes a reflective surface 141, and the metal circuit layer 13 is located on the reflective surface 141. For example, a metal paste is printed on the reflective surface 141 using a screen printing process to form the metal wiring layer 13. The LED chip 20 is disposed on the reflective sheet 14 and electrically connected to the metal circuit layer 13.
By adopting the reflecting sheet 14 as the flexible substrate, the reflecting sheet 14 is light, thin and easy to bend, and can be manufactured into a bendable backlight module; the reflectivity of the reflecting sheet 14 is more than 95%, and the reflectivity is high, so that white ink does not need to be printed on the reflecting sheet 14, which is beneficial to reducing the process steps, improving the light utilization rate of the LEDs and improving the brightness of the backlight module 100.
It can be understood that a part of the light emitted by the LED chip 20 exits to the side away from the reflective sheet 14, but still a part of the light exits to the side of the reflective sheet 14, and the reflective sheet 14 has a strong reflection effect, so that the part of the light exiting to the reflective sheet 14 can be reflected to the LED chip 20 again to exit to the side away from the reflective sheet 14, thereby enabling more light exiting from the light source to be utilized and improving the utilization efficiency of the light source.
With continued reference to fig. 2 and 3, in an embodiment of the present application, the LED chip 20 includes a chip body 21 and an electrode portion 22 connected to the chip body 21, where the electrode portion 22 is electrically connected to the metal circuit layer 13. The convex hull 221 is also understood as a solder bump disposed on the electrode portion 22, and the convex hull 221 may be made of a metal alloy such as SnPb, snAgCu, snAg, or the like.
It should be noted that, the convex hull 221 may be prefabricated on the electrode portion 22 of the LED chip 20 at the wafer stage, so as to control the uniformity of the size of the convex hull 221. For example, the bump 221 may be formed on the side of the electrode portion 22 facing away from the chip body 21 by means of electro-spray printing or printing of solder paste reflow or laser solder ball implantation or electroplating.
Since the LED chip 20 is attached to the pad corresponding to the metal circuit layer 13 before the metal circuit layer 13 is cured, the convex hull 221 is disposed on the electrode portion 22 of the LED chip 20, and the convex hull 221 can be firstly contacted with and embedded into the metal circuit layer 13 in a semi-cured state to reduce the surface resistance of the metal circuit layer 13, then the electrode portion 22 is gradually immersed into the metal circuit layer 13, and finally the metal circuit layer 13 is cured, so that the LED chip 20 is firmly attached to the flexible substrate 10. As can be appreciated, when the LED chip 20 is attached to the flexible substrate 10, the convex hull 221 is inserted into the metal circuit layer 13 in the semi-cured state and contacts the flexible substrate 10 to play a supporting role, so as to prevent the electrode portion 22 from diffusing to the periphery due to direct large-area contact extrusion of the metal circuit layer 13, which causes short circuit between the positive electrode portion 22 and the negative electrode portion 22, thereby improving the reliability and the yield of the LED chip 20, and reducing the production cost of the backlight module 100.
It should be noted that, in the embodiment of the present application, the LED chip 20 is attached to the flexible substrate 10, there is no need to provide a solder paste layer between the LED chip 20 and the flexible substrate 10, the electrode portion 22 of the LED chip 20 is directly attached to the semi-cured metal circuit layer 13, and then the metal circuit layer 13 is cured, so that the LED chip 20 is firmly attached to the flexible substrate 10.
It should be noted that, after the metal paste is printed on the flexible substrate 10 by using the screen printing process to form the metal circuit layer 13, the metal circuit layer 13 on the flexible substrate 10 is still in the semi-cured state without baking or UV light irradiation on the flexible substrate 10. The metal paste in the semi-cured state has adhesiveness, and the LED chip 20 can be adhered to the metal line layer 13 in the semi-cured state. The metal paste is illustratively silver paste.
Referring to fig. 4 to 6 in combination with fig. 2 and 3, fig. 4 is a schematic view of a first arrangement of convex hulls of LED chips, fig. 5 is a schematic view of a second arrangement of convex hulls of LED chips, and fig. 6 is a schematic view of a third arrangement of convex hulls of LED chips.
In the embodiment of the present application, the electrode portion 22 includes a first electrode portion 222 and a second electrode portion 223, the first electrode portion 222 is a positive electrode of the LED chip 20, the second electrode portion 223 is a negative electrode of the LED chip 20, or the first electrode portion 222 is a negative electrode of the LED chip 20, and the second electrode portion 223 is a positive electrode of the LED chip 20. The polarities of the first electrode portion 222 and the second electrode portion 223 are not particularly limited.
At least two convex hulls 221 are disposed at intervals on the first electrode portion 222, at least one convex hull 221 is disposed on the second electrode portion 223, and the convex hulls 221 are distributed in four corners or in a triangle. Through setting up a plurality of convex hulls 221 to form stable support to LED chip 20, prevent that LED chip 20 from appearing the risk of deflection slope when the paster on flexible substrate 10, thereby improve LED chip 20's paster effect.
As shown in fig. 2 to 4, the first electrode portion 222 of the LED chip 20 is provided with two convex hulls 221 on a side facing away from the chip body 21, and the second electrode portion 223 is provided with two convex hulls 221 on a side facing away from the chip body 21. Also, equivalently, the LED chip 20 includes four convex hulls 221, the four convex hulls 221 are symmetrically distributed on the first electrode part 222 and the second electrode part 223, and the four convex hulls 221 are arranged in a quadrangle.
As shown in fig. 5, in other embodiments, two convex hulls 221 are disposed on a side of the first electrode portion 222 of the LED chip 20 facing away from the chip body 21, and one convex hull 221 is disposed on a side of the second electrode portion 223 facing away from the chip body 21; or one convex hull 221 is arranged on one side of the first electrode portion 222, which faces away from the chip main body 21, and two convex hulls 221 are arranged on one side of the second electrode portion 223, which faces away from the chip main body 21. Also, the LED chip 20 includes three convex hulls 221, and the three convex hulls 221 are arranged in a triangle.
As shown in fig. 6, in other embodiments, three convex hulls 221 are disposed on a side of the first electrode portion 222 of the LED chip 20 facing away from the chip main body 21, and the three convex hulls 221 are arranged in a triangle shape; the side of the second electrode portion 223 facing away from the chip body 21 is also provided with three convex hulls 221, and the three convex hulls 221 are arranged in a triangle. Preferably, the convex hull 221 on the first electrode part 222 is symmetrically arranged with the convex hull 221 on the second electrode part 223.
The arrangement of the convex hulls 221 on the first electrode portion 222 and the second electrode portion 223 is not limited to the illustrated embodiments, and may include other symmetrical or asymmetrical arrangements, and the present application is not particularly limited thereto.
The shape of the convex hull 221 may be a sphere, a square, an ellipsoid, or an irregular shape, and the shape of the convex hull 221 is not particularly limited. Preferably, the convex hull 221 on the first electrode and the convex hull 221 on the second electrode are identical in shape.
Wherein the height of the convex hull 221 is 10 micrometers or more, and the thickness of the metal wiring layer 13 is greater than the height of the convex hull 221. It will be appreciated that if the height of the convex hull 221 is too small, the convex hull 221 does not function as intended; if the height of the convex hull 221 is too large, the difficulty of manufacturing the convex hull 221 increases. Preferably, the height of the convex hull 221 is greater than or equal to 10 micrometers, and the heights of the convex hull 221 on the first electrode portion 222 and the convex hull 221 on the second electrode portion 223 are the same, so as to improve the supporting effect of the convex hull 221. Illustratively, the overall height of the convex hull 221 and the first electrode portion 222 or the second electrode portion 223 is consistent with the height of the metal wiring layer 13 to ensure good contact of the first electrode portion 222, the second electrode portion 223 of the LED chip 20 with the metal wiring layer 13.
It can be understood that, by providing the electrode portion 22 of the LED chip 20 with the plurality of convex hulls 221, the convex hulls 221 can be firstly contacted with and embedded in the semi-cured metal line layer 13 to reduce the surface resistance of the metal line layer 13, then the electrode portion 22 is gradually immersed in the metal line layer 13, and finally the metal line layer 13 is cured, so that the LED chip 20 is firmly attached to the flexible substrate 10. As can be appreciated, when the LED chip 20 is attached to the flexible substrate 10, the convex hull 221 is inserted into the metal circuit layer 13 in the semi-cured state and contacts the flexible substrate 10 to play a supporting role, so as to prevent the electrode portion 22 from diffusing to the periphery due to direct large-area contact extrusion of the metal circuit layer 13, which causes short circuit between the positive electrode portion 22 and the negative electrode portion 22, thereby improving the reliability and the yield of the LED chip 20, and reducing the production cost of the backlight module 100.
It should be noted that, in the backlight module 100 according to the embodiment of the present application, the flexible substrate 10 is adopted, and the metal paste is printed on the flexible substrate 10 to form the metal circuit layer 13 in a semi-cured state; when the LED chip 20 is attached to the flexible substrate 10, the convex hull 221 is first contacted with and embedded into the metal circuit layer 13 in the semi-cured state to reduce the surface resistance of the metal circuit layer 13, then the electrode portion 22 is gradually immersed into the metal circuit layer 13, and finally the metal circuit layer 13 is cured, so that the LED chip 20 is firmly attached to the flexible substrate 10.
Therefore, the backlight module 100 in the present application is a flexible backlight module, and the flexible backlight module can be matched with a flexible display screen to realize display products such as a curved television and a folding mobile phone.
Referring to fig. 7, fig. 7 is a schematic diagram of a second structure of a backlight module 100 according to an embodiment of the application. The embodiment shown in fig. 7 differs from the embodiment shown in fig. 1 in the structure of the flexible substrate 10.
In the embodiment of the application, the flexible substrate 10 includes a flexible transparent substrate 11 and a first reflective layer 12 disposed on the flexible transparent substrate 11, and the metal circuit layer 13 is located on a side of the first reflective layer 12 facing away from the flexible transparent substrate 11. The LED chip 20 is electrically connected to the metal wiring layer 13. Specifically, the LED chip 20 includes a chip body 21 and an electrode portion 22 connected to the chip body 21, the electrode portion 22 being electrically connected to the metal wiring layer 13; wherein, the side of the electrode part 22 facing away from the chip main body 21 is provided with a convex hull 221, and the convex hull 221 is embedded in the metal line layer 13.
The flexible transparent substrate 11 may be made of polyethylene terephthalate (PET), polyimide (PI), or the like. The first reflective layer 12 is disposed on the flexible transparent substrate 11, and the first reflective layer 12 is configured to reflect incident light toward the LED chip 20, so as to improve the light utilization of the LED chip 20.
Illustratively, a layer of white ink is silk screened onto the flexible transparent substrate 11 to form a first reflective layer. It should be noted that, in the embodiment of the present application, the LED chip 20 is directly attached to the metal circuit layer 13, and a solder paste layer and an excessively high temperature reflow soldering process are not required, so that the white ink screen printed on the flexible transparent substrate 11 will not yellow, and the reflection effect of the first reflection layer 12 will not be affected by the chip attaching process of the LED chip 20.
It should be noted that, in the embodiment of the present application, the thickness of the flexible transparent substrate 11 is much smaller than that of a conventional PCB, so that the thickness of the backlight module 100 can be reduced; meanwhile, the light and thin and bendable backlight module can be manufactured by utilizing the advantages of the light and thin and bendable flexible transparent substrate 11, and the light and thin and bendable backlight module can be matched with a flexible display screen to realize display products such as curved televisions and folding mobile phones.
Referring to fig. 1 and fig. 7, in the embodiment of the application, the backlight module 100 further includes a lens 30, the lens 30 is disposed on the flexible substrate 10, and the lens 30 encapsulates the LED chip 20. The LED chip 20 is packaged by the lens 30, so that the air tightness of the LED chip 20 can be maintained, the LED chip 20 is protected from the influence of the temperature and the humidity in the surrounding environment, and the LED chip 20 is prevented from being damaged or the light emitting performance is prevented from being influenced by the change of the characteristics caused by the mechanical vibration and the impact.
The lens 30 may be shaped as a convex lens, and the lens 30 may refract, reflect or scatter the light emitted by the LED chip 20, so as to increase the light emitting angle and the light mixing uniformity of the LED chip 20, thereby being beneficial to reducing the number of the LED chips 20 and reducing the cost of the backlight module 100.
The lens 30 layer is made of transparent material, especially high transparent material, so as not to affect the color effect of the emergent light. In order to convert the light emitted from the LED chip into white light, in some embodiments, phosphor particles are disposed within the lens 30, and the phosphor particles are uniformly dispersed within the lens 30. Since the light emitted by the LED chip 20 is blue light and the backlight source required by the backlight module 100 is white light, the light emitted by the LED chip 20 is converted into white light by the fluorescent powder particles disposed in the lens 30, and is provided to the backlight module 100 as the backlight source.
The material of the lens 30 may be epoxy, silicone, polycarbonate, etc., which is not particularly limited.
In some embodiments, the lens 30 may be formed by dispensing glue on the flexible substrate 10 to cover the LED chip 20, molding the LED chip, and curing the LED chip with baking or UV light.
In other embodiments, the lens 30 layer may also be formed by injection molding, and then the lens 30 is adhered and fixed on the LED chip 20, so as to form the effect of the lens 30 on the LED chip 20 package.
Referring to fig. 1 and fig. 7, in the embodiment of the application, the backlight module 100 further includes a second reflective layer 40, the second reflective layer 40 is disposed on a side of the metal circuit layer 13 away from the flexible substrate 10, the second reflective layer 40 includes a plurality of hollow areas, and the LED chips 20 are disposed on the flexible substrate 10 exposed by the hollow areas.
The second reflective layer 40 may be, for example, a reflective coating, such as a white ink, that is highly reflective to light, that is sprayed onto the flexible substrate 10. When the reflective coating is sprayed, the hollowed-out area can be covered, and the reflective coating is sprayed on the uncovered area to form the second reflective layer 40.
It should be noted that, the second reflective layer 40 not only can protect the metal circuit layer 13, but also can prevent the metal circuit from being scratched when exposed; meanwhile, the second reflective layer 40 can further improve the brightness of the backlight module 100, so as to maximize the utilization ratio of the light emitted from the LED chip 20 and improve the uniformity of light mixing. Meanwhile, the light emitted from the LED chip 20 to the flexible substrate 10 can enter the lens 30 again after being reflected by the second reflective layer 40, so that the light leakage problem of the LED chip 20 can be prevented, and the performance of the backlight module 100 can be further improved.
In some embodiments, the backlight module 100 further includes a diffusion plate disposed on a side of the lens 30 facing away from the flexible substrate 10. The diffusion plate has the functions of uniform light and atomization, and the diffusion plate enables light to be refracted or scattered towards different directions, so that the advancing route of the light is changed, the light is fully scattered to generate the effect of optical diffusion, and the light emitted into the liquid crystal display module is softer.
The embodiment of the application also provides a display device, which comprises the backlight module 100 shown in any one of the embodiments, wherein the backlight module 100 provides a backlight source for the display device. The display device may be: any product or component with display function such as a liquid crystal display panel, electronic paper, mobile phone, tablet computer, television, display, notebook computer, digital photo frame, navigator, etc., which is not limited in the embodiment of the present application. The display device provided by the embodiment of the application adopts the backlight module 100, so that the reliability and the surface mounting yield of the LED chip 20 surface mounting can be improved, and the production cost of the backlight module 100 can be reduced.
The embodiment of the application also provides a preparation method of the backlight module. The preparation method of the backlight module is used for producing the backlight module 100. The backlight module 100 can be applied to the display device. In the following method, the order may be appropriately adjusted without affecting the effect of use.
Referring to fig. 8 and fig. 9 in conjunction with fig. 1 to fig. 7, fig. 8 is a schematic view of a scenario of a method for manufacturing a backlight module according to an embodiment of the present application, and fig. 9 is a schematic flow chart of a method for manufacturing a backlight module according to an embodiment of the present application.
The preparation method of the backlight module 100 comprises the following steps:
s210, providing a flexible substrate, and arranging a metal circuit layer on the flexible substrate, wherein the metal circuit layer is in a semi-solid state.
The thickness of the flexible substrate is far smaller than that of a conventional PCB, so that the thickness of the backlight module can be reduced; meanwhile, the light and thin and bendable backlight module can be manufactured by utilizing the advantages of the light and thin and bendable flexible substrate, and can be matched with a flexible display screen to realize display products such as curved televisions and folding mobile phones.
In some embodiments, the flexible substrate 10 may be a reflective sheet. In other embodiments, the flexible substrate 10 includes a flexible transparent substrate 11 and a first reflective layer 12 disposed on the flexible transparent substrate 11. The flexible transparent substrate 11 may be made of polyethylene terephthalate (PET), polyimide (PI), or the like. The first reflective layer 12 is formed by screen printing a layer of white ink on the flexible transparent substrate 11.
The flexible substrate 10 is provided with a metal wiring layer 13, and for example, a metal paste, which may be silver paste, is printed on the flexible substrate 10 using a screen printing process to form the metal wiring layer 13. The metal wiring layer 13 is provided with a solder joint so as to attach the LED chip 20 to the solder joint, so that the electrode portion 22 of the LED chip 20 is electrically connected with the metal wiring layer 13. The metal wiring layer 13 corresponds to a driving circuit of the LED chip 20, and can drive the LED chip 20 to emit light.
The metal circuit layer 13 formed on the flexible substrate 10 is not baked or irradiated with UV light, and the metal circuit layer 13 on the flexible substrate 10 is still in a semi-cured state, and the metal paste in the semi-cured state has a certain viscosity.
S220, welding the LED chip 20 on the flexible substrate 10, wherein the LED chip 20 comprises a chip main body 21 and electrode parts 22 connected with the chip main body 21, and the electrode parts 22 are respectively and electrically connected with the metal circuit layer 13; wherein, the side of the electrode portion 22 facing away from the chip main body 21 is provided with a convex hull 221, and the convex hull 221 is embedded in the metal line layer 13.
The convex hull 221 may be understood as a solder bump provided on the electrode portion 22, and the convex hull 221 may be made of a metal alloy such as SnPb, snAgCu, snAg, or the like. It should be noted that, the convex hull 221 may be prefabricated on the electrode portion 22 of the LED chip 20 at the wafer stage, so as to control the uniformity of the size of the convex hull 221. For example, the bump 221 may be formed on the side of the electrode portion 22 facing away from the chip body 21 by electro-spray printing or printing of solder paste reflow or laser solder ball implantation or electroplating, respectively.
The electrode portion 22 includes a first electrode portion 222 and a second electrode portion 223, where the first electrode portion 222 is provided with at least two convex hulls 221 at intervals, and the second electrode portion 223 is provided with at least one convex hull 221, and the convex hulls 221 are distributed in four corners or in a triangle shape. Through setting up a plurality of convex hulls 221 to form stable support to LED chip 20, prevent that LED chip 20 from appearing the risk of deflection slope when the paster on flexible substrate 10, thereby improve LED chip 20's paster effect.
Since the LED chip 20 is attached to the pad corresponding to the metal circuit layer 13 before the metal circuit layer 13 is cured, the convex hull 221 is disposed on the electrode portion 22 of the LED chip 20, and the convex hull 221 can be firstly contacted with and embedded into the metal circuit layer 13 in the semi-cured state during the attaching process, so as to reduce the surface resistance of the metal circuit layer 13, then the electrode portion 22 is gradually immersed into the metal circuit layer 13, and finally the metal circuit layer 13 is cured, so that the LED chip 20 is firmly attached to the flexible substrate 10. As can be appreciated, when the LED chip 20 is attached to the flexible substrate 10, the convex hull 221 is inserted into the metal circuit layer 13 in the semi-cured state and contacts the flexible substrate 10 to play a supporting role, so as to prevent the electrode portion 22 from diffusing to the periphery due to direct large-area contact extrusion of the metal circuit layer 13, which causes short circuit between the positive electrode portion 22 and the negative electrode portion 22, thereby improving the reliability and the yield of the LED chip 20, and reducing the production cost of the backlight module 100.
It should be noted that, in the embodiment of the present application, the LED chip 20 is attached to the flexible substrate 10, there is no need to provide a solder paste layer between the LED chip 20 and the flexible substrate 10, the electrode portion 22 of the LED chip 20 is directly attached to the semi-cured metal circuit layer 13, and then the metal circuit layer 13 is cured, so that the LED chip 20 is firmly attached to the flexible substrate 10.
And S230, baking or UV light irradiation is performed on the flexible substrate 10 to cure the metal wiring layer 13.
In some embodiments, during the baking process of the flexible substrate 10, the metal paste of the metal circuit layer 13 undergoes a crosslinking reaction and solidifies at a certain temperature, and is converted from a semi-solid state to a solid state, so that the LED chip 20 is firmly attached to the flexible substrate 10.
In other embodiments, the metal paste of the metal circuit layer 13 contains a photoinitiator or a photosensitizer, and during the UV light irradiation process of the flexible substrate 10, the metal paste is polymerized, crosslinked, and solidified, and is converted from a semi-solid state to a solid state, so that the LED chip 20 is firmly attached to the flexible substrate 10. In the embodiment of the present application, after step S230, the method further includes: and a lens is arranged on the flexible substrate, and the LED chip is coated by the lens.
The LED chip 20 is packaged by the lens 30, so that the air tightness of the LED chip 20 can be maintained, the LED chip 20 is protected from the influence of the temperature and the humidity in the surrounding environment, and the LED chip 20 is prevented from being damaged or the light emitting performance is prevented from being influenced by the change of the characteristics caused by the mechanical vibration and the impact. Meanwhile, the lens 30 can also refract, reflect or scatter the light emitted by the LED chip 20, so as to increase the light emitting angle and the light mixing uniformity of the LED chip 20, thereby being beneficial to reducing the number of the LED chips 20 and reducing the cost of the backlight module 100.
In some embodiments, the LED chip 20 is first dispensed on the flexible substrate 10, then molded by a compression molding method, and finally cured by baking or UV light to form the lens 30.
In other embodiments, the lens 30 may be formed by injection molding, and the lens 30 is adhered and fixed to the LED chip 20 to form the effect of the lens 30 on the encapsulation of the LED chip 20.
In an embodiment of the present application, a lens is disposed on the flexible substrate, and after the lens wraps the LED chip, the method further includes:
a second reflective layer 40 is disposed on a side of the metal circuit layer 13 facing away from the flexible substrate 10, the second reflective layer 40 includes a plurality of hollow areas, and the LED chip 20 is located on the flexible substrate 10 exposed in the hollow areas.
The second reflective layer 40 may be, for example, a reflective coating, such as a white ink, that is highly reflective to light, that is sprayed onto the flexible substrate 10. When the reflective coating is sprayed, the hollowed-out area can be covered, and the reflective coating is sprayed on the uncovered area to form the second reflective layer 40.
It should be noted that, the backlight module 100 prepared by the method is a flexible backlight module, and the flexible backlight module can be matched with a flexible display screen to realize display products such as a curved television and a folding mobile phone.
The backlight module 100 provided by the embodiment of the application comprises a flexible substrate 10 and an LED chip 20 arranged on the flexible substrate 10; the flexible substrate 10 is provided with a metal circuit layer 13, the LED chip 20 comprises a chip main body 21 and an electrode part 22 connected with the chip main body 21, and the electrode part 22 is electrically connected with the metal circuit layer 13; wherein, the side of the electrode portion 22 facing away from the chip main body 21 is provided with a convex hull 221, and the convex hull 221 is embedded in the metal line layer 13. Since the LED chip 20 is attached to the pad corresponding to the metal circuit layer 13 before the metal circuit layer 13 is cured, the convex hull 221 is disposed on the electrode portion 22 of the LED chip 20, and the convex hull 221 can be firstly contacted with and embedded into the metal circuit layer 13 in the semi-cured state during the attaching process, so as to reduce the surface resistance of the metal circuit layer 13, then the electrode portion 22 is gradually immersed into the metal circuit layer 13, and finally the metal circuit layer 13 is cured, so that the LED chip 20 is firmly attached to the flexible substrate 10. As can be appreciated, when the LED chip 20 is attached to the flexible substrate 10, the convex hull 221 is inserted into the metal circuit layer 13 in the semi-cured state and contacts the flexible substrate 10 to play a supporting role, so as to prevent the electrode portion 22 from diffusing to the periphery due to direct large-area contact extrusion of the metal circuit layer 13, which causes short circuit between the positive electrode portion 22 and the negative electrode portion 22, thereby improving the reliability and the yield of the LED chip 20, and reducing the production cost of the backlight module 100.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
The backlight module, the display device and the preparation of the backlight module provided by the embodiment of the application are described in detail. Specific examples are set forth herein to illustrate the principles and embodiments of the present application and are provided to aid in the understanding of the present application. Meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, the present description should not be construed as limiting the present application.

Claims (12)

1. A backlight module, comprising:
the flexible substrate is provided with a metal circuit layer;
the LED chip is arranged on the flexible substrate and comprises a chip main body and an electrode part connected with the chip main body, and the electrode part is electrically connected with the metal circuit layer;
the electrode part is provided with a convex hull at one side deviating from the chip main body, and the convex hull is embedded into the metal circuit layer.
2. The backlight module according to claim 1, wherein the electrode portion comprises a first electrode portion and a second electrode portion, at least two convex hulls are arranged on the first electrode portion at intervals, at least one convex hull is arranged on the second electrode portion, and the convex hulls are distributed in a four-corner or triangular shape.
3. A backlight module according to claim 1, wherein the convex hull is in the shape of a sphere, square, oval or irregular.
4. A backlight module according to claim 1, wherein the height of the convex hull is greater than or equal to 10 μm, and the thickness of the metal circuit layer is greater than the height of the convex hull.
5. A backlight module according to any one of claims 1 to 4, wherein the flexible substrate is a reflective sheet, the reflective sheet comprises a reflective surface, and the metal circuit layer is located on the reflective surface.
6. A backlight module according to any one of claims 1 to 4, wherein the flexible substrate comprises a flexible transparent substrate and a first reflective layer disposed on the flexible transparent substrate, and the metal circuit layer is located on a side of the first reflective layer facing away from the flexible transparent substrate.
7. A backlight module according to any of claims 1 to 4, further comprising a lens, the lens surrounding the LED chip.
8. A backlight module according to any one of claims 1 to 4, further comprising a second reflective layer disposed on a side of the metal circuit layer facing away from the flexible substrate, the second reflective layer comprising a plurality of hollow areas, and the LED chip being disposed on the flexible substrate exposed by the hollow areas.
9. A display device, characterized in that the display device comprises a backlight module according to any one of claims 1 to 8.
10. The preparation method of the backlight module is characterized by comprising the following steps:
providing a flexible substrate;
a metal circuit layer is arranged on the flexible substrate, and the metal circuit layer is in a semi-solid state;
attaching an LED chip to the metal circuit layer, wherein the LED chip comprises a chip main body and an electrode part connected with the chip main body, and the electrode part is electrically connected with the metal circuit layer; wherein, one side of the electrode part, which is away from the chip main body, is provided with a convex hull, and the convex hull is embedded into the metal circuit layer;
and baking or irradiating UV light on the flexible substrate to cure the metal circuit layer.
11. The method of claim 10, wherein after baking or UV light irradiation is performed on the flexible substrate to cure the metal circuit layer, further comprising:
and a lens is arranged on the flexible substrate, and the LED chip is coated by the lens.
12. The method for manufacturing a backlight module according to claim 11, wherein a lens is disposed on the flexible substrate, and after the lens wraps the LED chip, the method further comprises:
and a second reflecting layer is arranged on one side, away from the flexible substrate, of the metal circuit layer, the second reflecting layer comprises a plurality of hollowed-out areas, and the LED chip is positioned on the flexible substrate exposed out of the hollowed-out areas.
CN202211279373.8A 2022-10-19 2022-10-19 Backlight module, display device and preparation method of backlight module Pending CN117153996A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202211279373.8A CN117153996A (en) 2022-10-19 2022-10-19 Backlight module, display device and preparation method of backlight module
PCT/CN2023/114845 WO2024082816A1 (en) 2022-10-19 2023-08-25 Backlight module, display device, and manufacturing method for backlight module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211279373.8A CN117153996A (en) 2022-10-19 2022-10-19 Backlight module, display device and preparation method of backlight module

Publications (1)

Publication Number Publication Date
CN117153996A true CN117153996A (en) 2023-12-01

Family

ID=88910741

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211279373.8A Pending CN117153996A (en) 2022-10-19 2022-10-19 Backlight module, display device and preparation method of backlight module

Country Status (2)

Country Link
CN (1) CN117153996A (en)
WO (1) WO2024082816A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200001672A (en) * 2018-06-28 2020-01-07 주식회사 루멘스 flexible illuminator using micro LED chips
CN110970456B (en) * 2018-09-27 2022-04-19 成都辰显光电有限公司 Micro-LED chip, preparation method thereof and display device
CN110957411B (en) * 2018-09-27 2021-07-23 成都辰显光电有限公司 Micro-LED chip, preparation method thereof and display device
CN110398857A (en) * 2019-07-15 2019-11-01 青岛海信电器股份有限公司 Micro-led lamp plate, its production method, backlight module and display device
CN113471240A (en) * 2021-06-30 2021-10-01 上海天马微电子有限公司 Light-emitting module, preparation method thereof and display device

Also Published As

Publication number Publication date
WO2024082816A1 (en) 2024-04-25

Similar Documents

Publication Publication Date Title
US11476396B2 (en) Light source circuit unit, illuminator, and display
CN210982988U (en) Display device
TWI409975B (en) Illumination device with wide output angle and manufacture method thereof
CN113777826B (en) Display device
US10761373B2 (en) Display device
US20210333634A1 (en) Backlight module and display device having the backlight module
US11822115B2 (en) Display apparatus
CN213240753U (en) Backlight module and display device thereof
CN109445180B (en) Backlight module and display device
CN211786492U (en) Display device
CN113725346A (en) Mini LED backlight source, backlight module and manufacturing method thereof
CN217061299U (en) Backlight module and direct type backlight device
CN114578615A (en) Backlight module and display device
CN217334128U (en) Backlight module and display device
CN117153996A (en) Backlight module, display device and preparation method of backlight module
CN217387154U (en) Display device
KR101086997B1 (en) Light emitting device package, method for fabricating the same and camera flash module using the same
CN112882281A (en) Display device
CN114779525A (en) Backlight module, preparation method thereof and display device
CN114007342A (en) Preparation method of backlight source
KR20110052937A (en) Light emitting device package
CN113721383A (en) Display device
CN219873581U (en) Backlight module and display device
CN216597633U (en) Mini LED backlight source and backlight module
CN114280845B (en) Mini LED backlight source, backlight module and manufacturing method thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination