CN117153763A - Substrate mounting mechanism and substrate processing apparatus using the same - Google Patents

Substrate mounting mechanism and substrate processing apparatus using the same Download PDF

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Publication number
CN117153763A
CN117153763A CN202210568053.8A CN202210568053A CN117153763A CN 117153763 A CN117153763 A CN 117153763A CN 202210568053 A CN202210568053 A CN 202210568053A CN 117153763 A CN117153763 A CN 117153763A
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CN
China
Prior art keywords
pin
substrate
lifting
mounting
coil
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CN202210568053.8A
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Chinese (zh)
Inventor
陈兴松
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Intel NDTM US LLC
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Intel NDTM US LLC
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Priority to CN202210568053.8A priority Critical patent/CN117153763A/en
Publication of CN117153763A publication Critical patent/CN117153763A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention provides a substrate loading mechanism and a substrate processing apparatus using the same. A substrate mounting mechanism of the present invention mounts a substrate in a processing container of a substrate processing apparatus for processing a substrate, the substrate mounting mechanism comprising: a mounting table for mounting the substrate on a mounting surface, the mounting table having a cavity formed therein and having a plurality of through holes penetrating from the mounting surface to the cavity; a plurality of lift pins respectively inserted into the through holes; and a lifting mechanism including an electromagnetic assembly for lifting the lifting pin so that the lifting pin can protrude from or retract into the mounting table from the mounting surface, the lifting mechanism being provided in the mounting table. Thus, a substrate mounting mechanism and a substrate processing apparatus using the same can be obtained which are easy to maintain and can improve the quality of products, the production efficiency and the yield.

Description

Substrate mounting mechanism and substrate processing apparatus using the same
Technical Field
The present invention relates to the field of semiconductor manufacturing, and more particularly, to a substrate mounting mechanism and a substrate processing apparatus using the same.
Background
In a substrate processing apparatus for processing a substrate such as a semiconductor wafer, a plurality of lift pins capable of extending and retracting with respect to a substrate mounting surface are provided in a substrate mounting table for mounting the substrate. When the lift pins protrude from the substrate mounting surface, the substrates can be transferred to and from the lift pins, and when the lift pins are submerged in the substrate mounting surface, the substrates are mounted on the substrate mounting surface for subsequent processing.
In the prior art, a driving mechanism such as a pneumatic motor or a servo motor is generally used to raise and lower the lift pins. Specifically, a substrate processing apparatus is provided with a chamber for processing a substrate such as a wafer, and a substrate mounting table in the chamber is provided with a plurality of through holes into which lift pins are inserted. Further, as the elevating mechanism, a driving motor, a position sensor, a supporting mechanism such as a U-ring for supporting a plurality of elevating pins, and the like are provided in addition to the substrate mounting table. Therefore, when the driving motor drives the U-shaped ring to lift, the lifting pin can be driven to lift along the through hole.
However, such a lifting mechanism is complicated in structure and a plurality of constituent parts are provided separately, thereby being costly to manufacture and maintain. In addition, in the process of maintaining the plurality of components of the lifting mechanism, the damage to the structure in the chamber may be caused, and the leakage of the chamber may be caused. In addition, unbalance of the supporting mechanism such as the U-shaped ring may cause a height difference between the plurality of lifting pins, thereby adversely affecting the quality of the product. And when breakage or the like caused by shaking, collision or the like occurs in the lifting process of the lifting pin, the yield of products is reduced.
Accordingly, it is desirable to provide a substrate mounting mechanism and a substrate processing apparatus using the same that are easy to maintain and capable of improving product quality, production efficiency, and yield.
Disclosure of Invention
The invention provides a substrate loading mechanism which is easy to maintain and can improve the product quality, the production efficiency and the yield, and a substrate processing device using the substrate loading mechanism.
According to one aspect of the present invention, there is provided a substrate mounting mechanism for mounting a substrate in a processing container of a substrate processing apparatus that processes a substrate, the substrate mounting mechanism comprising: a mounting table for mounting the substrate on a mounting surface, the mounting table having a cavity formed therein and having a plurality of through holes penetrating from the mounting surface to the cavity; a plurality of lift pins respectively inserted into the through holes; and a lifting mechanism including an electromagnetic assembly for lifting the lifting pin so that the lifting pin can protrude from or retract into the mounting table from the mounting surface, the lifting mechanism being provided in the mounting table.
In the present invention, an electromagnetic component for elevating the elevating pin is provided in the mounting table. The present invention can improve the compactness of the equipment and reduce the size of the equipment compared with the structure of dispersing the lifting mechanism in the processing container in the prior art. Furthermore, the electromagnetic assembly of the present invention is formed as a unitary assembly. Therefore, the electromagnetic assembly is easily taken out from the mounting table as a whole and maintained or replaced. In the prior art, the lifting mechanism is formed by arranging a plurality of components in a split mode, so that a plurality of components are required to be maintained respectively during maintenance, and the time consumption is long and the efficiency is low. Compared with the prior art, the structure of the invention can improve the maintenance efficiency and reduce the production cost. In the prior art, in the process of maintaining the plurality of components of the elevating mechanism, there is a possibility that the components collide with the internal structure of the mounting table or the processing container, resulting in structural damage, and thus leakage of the chamber may occur. In the present invention, the electromagnetic assembly is taken out as a whole for maintenance, so that the possibility of damage to the internal structure of the mounting table or the processing container can be reduced.
In some embodiments, the electromagnetic assembly includes a magnetic core provided on a bottom surface of the cavity, a coil wound around the magnetic core, a plurality of pin holders for respectively mounting the lift pins, and a pin support plate for fixing the plurality of pin holders, the pin support plate being a permanent magnet disposed opposite to the magnetic core around which the coil is wound, and configured such that when the coil is energized, the pin support plate moves in a direction away from the magnetic core so that the lift pins protrude from the mounting surface.
In the invention, a plurality of lifting pins are arranged by one pin supporting plate, and the coils corresponding to the lifting pins are electrified simultaneously, so that the lifting pins can be lifted simultaneously, the balance of the whole lifting mechanism is improved, and the influence on the product quality caused by different heights of the lifting pins can be prevented.
In some embodiments, the electromagnetic assembly includes a lower core, a lower coil wound around the lower core, an upper coil wound around the upper core, a plurality of pin holders for respectively mounting the lift pins, and a pin support plate for fixing the plurality of pin holders, the lower core is disposed at a bottom surface of the cavity, the upper core is mounted at a bottom surface of the pin support plate, the upper core around which the upper coil is wound is disposed opposite to the lower core around which the lower coil is wound, and the pin support plate is disposed to move in a direction away from the lower core when the upper coil and the lower coil are energized, so that the lift pins protrude from the mounting surface.
In this embodiment, the electromagnetic assembly is able to achieve lifting of the lift pin by the interaction of the lower core and lower coil with the upper core and upper coil. Thus, the material for forming the pin support plate does not need to be a permanent magnet, so that the degree of freedom in designing the pin support plate is improved, and the pin support plate can be easily manufactured.
In some embodiments, the lift pin is removably inserted into the pin holder. This makes it possible to stably hold the lift pin by the pin holder, and to easily insert and remove the lift pin, thereby facilitating maintenance and replacement of the lift pin.
In some embodiments, the pin support plate is provided with a plurality of guide holes, in each of which a guide rod for guiding the lifting movement of the pin support plate is inserted, and upper and lower elastic bodies are respectively provided around the guide rods at upper and lower sides of the pin support plate. By providing the upper and lower elastic bodies, the movement of the pin support plate can be cushioned. In addition, the guide pin support plate is guided by the guide rod to move smoothly and stably, so that the problems of shaking, breakage and the like of the lifting pin can be reduced, and the yield of products can be improved.
In some embodiments, the electromagnetic assembly includes a magnetic core, a coil wound around the magnetic core, and a plurality of pin holders for respectively mounting the lift pins, each of the pin holders having a pin support magnet at a bottom thereof, the pin support magnets being disposed opposite to the magnetic core around which the coil is wound, and configured such that when the coil is energized, the pin support magnets move in a direction away from the magnetic core so that the lift pins protrude from the mounting surface.
In this embodiment, by adopting a structure in which the pin support magnet provided individually for each lift pin is provided in the through hole for inserting the lift pin in the stage, the size of the electromagnetic assembly can be significantly reduced, and the size of the cavity for providing the electromagnetic assembly can be reduced, so that the entire stage can be made more compact and miniaturized. Moreover, due to the smaller size of the pin support magnet, production materials can be saved and cost can be reduced correspondingly.
In some embodiments, the through hole in the stage for inserting the lift pin includes: a small diameter hole for guiding the lifting pin; and a large-diameter hole having a larger diameter than the small-diameter hole and accommodating the pin holder, wherein a pin supporting elastic body is provided between a flange portion of the large-diameter hole connected to the small-diameter hole and the pin holder. Thus, the through hole of the mounting table can stably guide the lift pin, and can allow the movement of the pin supporting magnet, and the pin supporting elastomer can play a role of buffering the movement of the pin supporting magnet.
In some embodiments, the lift pin is removably inserted into the pin holder. This makes it possible to stably hold the lift pin by the pin holder, and to easily insert and remove the lift pin, thereby facilitating maintenance and replacement of the lift pin.
In some embodiments, the pin holder has an insertion hole for inserting the lifting pin, a pin-fitting magnet is provided in the insertion hole, the pin-fitting magnet and the pin-supporting magnet are of opposite polarities, a lower end portion of the pin-fitting magnet is attracted to the pin-supporting magnet, and an upper end portion of the pin-fitting magnet is fitted to the lifting pin.
This allows the lifter pin to be stably attached to the pin holder, and also allows the lifter pin to be easily inserted and removed, thereby facilitating maintenance and replacement of the lifter pin.
According to another aspect of the present invention, there is provided a substrate processing apparatus having the above substrate mounting mechanism.
Drawings
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The drawings are merely exemplary and are not intended to limit the embodiments. In the drawings, like reference numerals refer to like elements.
Fig. 1 schematically shows a longitudinal sectional view of a simplified structure of a substrate processing apparatus of an embodiment.
Fig. 2A shows a schematic structural view of an electromagnetic assembly for performing position adjustment of a lift pin according to an embodiment.
Fig. 2B is an enlarged view of the structure of the pin holder in fig. 2A, schematically showing a longitudinal sectional view of the structure of the pin holder holding the lift pin.
Fig. 3 is a longitudinal sectional view schematically showing a state after the electromagnetic component of the substrate processing apparatus according to one embodiment is energized.
Fig. 4 is a longitudinal sectional view schematically showing a state in which an electromagnetic component of a substrate processing apparatus according to another embodiment is not energized.
Fig. 5 is a longitudinal sectional view schematically showing a state in which an electromagnetic component of a substrate processing apparatus according to another embodiment is energized.
Fig. 6A is a longitudinal sectional view schematically showing a state in which an electromagnetic component of the substrate processing apparatus according to still another embodiment is not energized.
Fig. 6B is an enlarged view of the structure of the pin holder in fig. 6A, schematically showing a longitudinal sectional view of the structure of the pin holder holding the lift pin.
Fig. 7 is a longitudinal sectional view schematically showing a state of an electromagnetic component of a substrate processing apparatus according to still another embodiment in the energized state.
It will be appreciated that for simplicity and/or clarity of illustration, elements illustrated in the figures have not necessarily been drawn to scale. For example, the dimensions of some of the elements may be exaggerated relative to other elements for clarity. Furthermore, elements known in the art are omitted in the drawings in order to make the concept of the present invention easier to understand. The dimensions of the figures do not represent the exact dimensions and/or dimensional proportions of the various elements depicted herein.
Detailed Description
In the following description, numerous specific details are set forth. However, the embodiments described herein may be practiced without some specific details. In specific embodiments, well-known structures and techniques have not been shown in detail in order not to obscure the understanding of this description.
Furthermore, the phrases "in one embodiment," "in an embodiment," and/or "in some embodiments" may be used repeatedly herein. The phrase generally does not refer to the same embodiment; however, it may refer to the same embodiment. The terms "comprising," "having," and "including" are synonymous, unless the context indicates otherwise. The phrases "A or B" and "A/B" mean "(A), (B) or (A and B)".
Example 1
Fig. 1 schematically shows a longitudinal sectional view of a simplified structure of a substrate processing apparatus 100 according to an embodiment of the present invention. The present invention is an example of the case where the substrate processing apparatus 100 is used to perform plasma etching processing on a wafer W. However, the substrate processing apparatus 100 is not limited thereto, and may be used to perform other processes such as film formation, exposure, and development on the wafer W.
The substrate processing apparatus 100 includes a processing container 1, a transfer port (not shown) for taking in and out a wafer W is provided in the processing container 1, and the processing container 1 can be set to a predetermined air pressure by exhausting air through an exhaust port (not shown).
A shower head 2 is provided above the processing container 1, and the shower head 2 seals an upper portion of the processing container 1 to discharge the processing gas into the processing container 1. A power supply for generating plasma may be connected to the shower head 2. By supplying high-frequency power from the power supply, an electric field can be generated in the process container 1, and the process gas supplied from the showerhead 2 into the process container 1 can be plasmatized.
A mounting table 3 is provided below the shower head 2 in the processing container 1. As shown in fig. 1, the stage 3 is capable of adsorbing the wafer W to the upper surface of the stage 3, that is, the mounting surface 31 by electrostatic adsorption.
A support base 4 is provided below the mounting table 3, and in the present invention, the support base 4 also serves as an electrode (cathode) connected to a power source, and by supplying power from the power source, a potential difference is generated between the generated plasma and the mounting surface 31, and ions are introduced to the wafer W mounted on the mounting surface 31, thereby performing a corresponding process on the wafer W.
In the mounting table 3, a cavity 7 for providing the elevating mechanism is formed, and the cavity 7 can be formed by joining two mounting table members having recesses formed therein so that openings of the recesses are aligned, for example. As shown in fig. 1, the cavity 7 is located in the stage 3 and has an upper wall 71 and a lower wall 72. The upper wall 71 of the cavity 7 is a wall of the mounting table 3 near the cavity 7 from above, and is a top surface of the cavity 7, and the lower wall 72 of the cavity 7 is a wall of the mounting table 3 near the cavity 7 from below, and is a bottom surface of the cavity 7.
In the mounting table 3, a plurality of through holes 32 (3 are shown in fig. 1, but not limited thereto) penetrating from the mounting surface 31 to the cavity 7 are formed in the longitudinal direction. Fig. 1 shows a state in which a plurality of lift pins 8 are inserted into the through holes 32, respectively.
An electromagnetic assembly 9 for mounting the lift pin 8 and performing positional adjustment of the lift pin 8 is provided in the cavity 7, and a specific structure thereof will be described later with reference to fig. 2A and 2B.
A control cable 5 connects the controller 6 via the bearing block 4 with an electromagnetic assembly 9. Thus, the electromagnetic assembly 9 can be controlled to operate according to the instruction of the controller 6, so as to adjust the position of the lift pin 8.
The structure of the electromagnetic assembly 9 is described in detail below with reference to fig. 2A and 2B.
Fig. 2A schematically shows the structure of the electromagnetic assembly 9. The electromagnetic assembly 9 includes a magnetic core 91, a coil 92, a pin support plate 93, and a pin holder 94. The coil 92 is wound around the core 91, and the core 91 is provided on the lower wall 72, which is the bottom surface of the cavity 7. The pin support plate 93 is disposed opposite the core 91 and the coil 92. As shown in fig. 1 and 2A, the pin support plate 93 and the magnetic core 91 are common to the plurality of lift pins 8, and for example, as shown in the drawing, the magnetic core 91 is formed in a plate shape in a range opposed to the entire pin support plate 93, and a convex portion for winding the coil 92 is provided at a position corresponding to each lift pin 8, and the coil 92 is wound around each convex portion, so that a force generated when each coil 92 is energized acts on each corresponding lift pin 8. By simultaneously energizing the plurality of coils 92, the plurality of lift pins 8 can be simultaneously lifted, thereby improving the balance of the entire lift mechanism and avoiding the influence on the product quality due to the difference in the heights of the plurality of lift pins 8.
The pin holder 94 is integrally formed with the pin support plate 93 or is fixed to the pin support plate 93. The lifting pin 8 inserted into the pin holder 94 is thereby fixed with respect to the pin support plate 93. Fig. 2B is an enlarged view of the structure of the pin holder 94 in fig. 2A, schematically showing a longitudinal sectional view of the structure of the pin holder 94 holding the lift pin 8. As shown in fig. 2B, the pin holder 94 has therein an insertion hole 941, and an inner diameter D of the insertion hole 941 is larger than an outer diameter D of the lift pin 8 for insertion of the lift pin 8 therein. Further, two elastic holders 942 supported by an elastic body protrude into the insertion holes 941, respectively, and sandwich the lifter pins 8 from both sides. This allows not only the lift pin 8 to be stably held by the pin holder 94, but also the lift pin 8 to be easily inserted and removed, and maintenance and replacement of the lift pin 8 to be easily performed. The fixing structure of the lift pin 8 to the pin holder 94 shown in fig. 2B is merely an example, and the structure is not particularly limited as long as the lift pin 8 can be detachably fixed.
The pin support plate 93 is a permanent magnet, and as a material for forming the same, an alloy, ferrite, intermetallic compound, or the like can be used. When the coil 92 is not energized, the pin support plate 93 is positioned proximate to the core 91 and the coil 92. When the coil 92 is energized via the control cable 5 according to an instruction of the controller 6, a magnetic field is generated. The magnetism of the pin support plate 93 is designed so that a repulsive force acts on the pin support plate 93 when the coil 92 is energized, and thus the pin support plate 93 is pushed upward, thereby driving the lifting pin 8 to move upward.
As shown in fig. 2A, a plurality of guide holes 931 are formed in the pin support plate 93. Fig. 2A illustrates a case where the pin support plate 93 is formed in a disc shape, and 3 guide holes 931 are arranged at intervals on the periphery of the pin support plate 93, but the shape of the pin support plate 93 and the number of the guide holes 931 are not limited thereto. Fig. 1 shows a state in which a plurality of guide rods 932 are inserted into the guide holes 931, respectively, and both ends of the guide rods 932 are fixed to the upper wall 71 and the lower wall 72 of the cavity, respectively, and the guide rods 932 are used for guiding the elevating movement of the guide pin support plate 93. An upper elastic body 933 and a lower elastic body 934 are provided around the guide rod 932 on the upper and lower sides of the pin support plate 93, respectively. By providing the upper elastic body 933 and the lower elastic body 934, the movement of the pin support plate 93 can be cushioned. As an example, in the initial state, the force of the upper elastic body 933 pushing down the pin support plate 93 is larger than the force of the lower elastic body 934 pushing up the pin support plate 93. While the use of a spring as the elastic body is illustrated in fig. 1, the present invention is not limited thereto, and other modes such as a rubber sleeve may be used.
As shown in fig. 1, an upper recess 935 for accommodating an upper elastic body 933 is formed in the upper wall 71 of the cavity 7, and a lower recess 936 for accommodating a lower elastic body 934 is formed in the lower wall 72 of the cavity 7. That is, the upper elastic body 933 is located between the bottom surface of the upper concave portion 935 and the pin support plate 93, and the lower elastic body 934 is located between the bottom surface of the lower concave portion 936 and the pin support plate 93.
Further, a plurality of fitting recesses 943 into which the plurality of pin holders 94 can be fitted are formed in the upper wall 71 of the cavity 7.
The manner in which the position of the lift pin 8 is adjusted using the electromagnetic assembly 9 of the present invention will be described below with reference to fig. 1 and 3. Fig. 1 shows a normal state when the electromagnetic assembly 9 is not energized, and the lift pins 8 are immersed in the mounting table 3, whereby the wafer W is electrostatically attracted to the mounting surface 31. Fig. 3 is a longitudinal sectional view schematically showing a state after the electromagnetic assembly 9 of the substrate processing apparatus 100 according to the embodiment of the present invention is energized, and the shower head 2 and the processing container 1 are omitted. At this time, the lift pins 8 protrude from the mounting table 3, and processes such as placing and taking out the wafer W can be performed.
Specifically, in the normal state shown in fig. 1, that is, in a state in which no current is supplied to the electromagnetic assembly, the pin support plate 93 is positioned at a position where the magnetic core 91 and the coil 92 are bonded as shown in fig. 1 due to the difference between the forces of the upper elastic body 933 and the lower elastic body 934 and the action of gravity. Thus, the lift pins 8 are stored in the mounting table 3 and do not protrude from the mounting surface 31. Then, the wafer W is placed on the placement surface 31 and electrostatically attracted. In this case, various processes can be performed on the wafer W. In the state shown in fig. 3 in which the electromagnetic assembly 9 is energized via the control cable 5 by the command of the controller 6, a magnetic field generated by energizing the coil 92 is made to act as a repulsive force on the pin support plate 93. The pin support plate 93 is then moved in a direction away from the core 91 and the coil 92 (upward in the drawing) against the gravity thereof and the urging force of the upper elastic body 933. At this time, the lift pins 8 move upward and protrude from the mounting surface 31. In this state, the wafer W can be placed and taken out. After the lifting pin 8 is lifted, the pressed upper elastic body 933 is accommodated in the upper concave portion 935. The pin holder 94 is fitted in the fitting recess 943, and the pin support plate 93 can be easily and stably positioned.
Fig. 3 shows a state in which the pin support plate 93 is raised to the upper wall 71 of the cavity 7 when the current is supplied, and the lift pins 8 protrude from the mounting surface 31 to the maximum extent. However, the height of the lift pins 8 extending from the mounting surface 31 may be adjusted by adjusting the magnetic field strength when the coil 92 is energized by the control of the controller 6. The height of the lift pins 8 protruding from the mounting surface 31 can also be adjusted by the elastic forces of the upper elastic body 933 and the lower elastic body 934, the height of the pin holders 94, and the like. The same applies to the following examples.
In the present invention, an electromagnetic unit 9 for elevating and lowering a lift pin 8 is provided in a cavity 7 inside a mounting table 3. The present invention can thereby improve the compactness of the apparatus and achieve miniaturization, compared with the structure in which the elevating mechanisms are provided in the process container 1 in a dispersed manner in the related art.
Furthermore, the electromagnetic assembly 9 of the present invention is formed as a unitary assembly. Therefore, the electromagnetic assembly 9 is easily taken out from the mounting table 3 as a whole and maintained or replaced. In the prior art, the lifting mechanism is formed by arranging a plurality of components in a split mode, so that a plurality of components are required to be maintained respectively during maintenance, and the time consumption is long and the efficiency is low. Compared with the prior art, the structure of the invention can improve the maintenance efficiency and reduce the production cost.
In the prior art, in the process of maintaining the plurality of components of the elevating mechanism, there is a possibility that the components collide with the inner structure of the mounting table 3 or the processing container 1, which may cause structural damage, and the chamber may leak. In the present invention, however, the electromagnetic assembly 9 is entirely removed and maintained, so that the possibility of damage to the internal structure of the mounting table 3 or the processing container 1 can be reduced.
In the present invention, the plurality of lift pins 8 are provided by the single pin support plate 93, and the coils 92 corresponding to the plurality of lift pins 8 are energized simultaneously, so that the plurality of lift pins 8 can be lifted simultaneously, the balance of the entire lift mechanism can be improved, and the influence of the difference in height of the plurality of lift pins 8 on the quality of the product can be prevented.
Example 2
Next, embodiment 2 of the present invention will be described with reference to fig. 4 and 5. Fig. 4 schematically shows a longitudinal section of the electromagnetic assembly 9 according to embodiment 2 of the present invention when not energized. Fig. 5 schematically shows a longitudinal sectional view of the electromagnetic assembly 9 according to embodiment 2 of the present invention when energized. The basic structure of example 2 is the same as that of fig. 1, and the shower head 3 and the process container 1 are omitted. The same reference numerals are given to the same constituent parts as those of embodiment 1, and detailed description thereof is omitted, and the portions different from embodiment 1 will be mainly described with reference to fig. 4 and 5. The main difference between embodiment 2 of fig. 4 and 5 and embodiment 1 of fig. 1 is the magnetic core and coil in the electromagnetic assembly 9 having the upper and lower two sets.
As shown in fig. 4, the electromagnetic assembly 9 includes a lower core 911, a lower coil 921, an upper core 912, an upper coil 922, a pin support plate 93, and a pin holder 94. The lower coil 921 is wound around the lower core 911, the lower core 911 is provided on the lower wall 72 which is the bottom surface of the cavity 7, the upper coil 922 is wound around the upper core 912, and the upper core 912 is mounted on the bottom of the pin support plate 93 so as to face the lower core 911. By simultaneously energizing the upper coil 922 and the lower coil 921 corresponding to the plurality of lift pins 8, the plurality of lift pins 8 can be lifted simultaneously, the balance of the entire lift mechanism can be improved, and the influence on the product quality due to the difference in the heights of the plurality of lift pins 8 can be avoided.
In the normal state shown in fig. 4, that is, in a state where no power is applied to the electromagnetic assembly 9, the pin support plate 93 is positioned at a position where the upper core 912 and the upper coil 922 are bonded to the lower core 911 and the lower coil 921 shown in fig. 4 due to the difference between the forces of the upper elastic body 933 and the lower elastic body 934 due to the action of gravity. Thus, the lift pins 8 are stored in the mounting table 3 and do not protrude from the mounting surface 31. Then, the wafer W is placed on the placement surface 31 and electrostatically attracted. In this case, various processes can be performed on the wafer W. In the state where the electromagnetic components 9 are energized via the control cable 5 by the command of the controller 6 shown in fig. 5, the upper core 912 and the upper coil 922 and the lower core 911 and the lower coil 921 are designed to generate repulsive force due to the magnetic field. The pin support plate 93 is then moved in a direction away from the lower core 911 and the lower coil 921 (upward in the drawing) against the gravity thereof and the force of the upper elastic body 933. At this time, the lift pins 8 move upward and protrude from the mounting surface 31. In this state, the wafer W can be placed and taken out. After the lifting pin 8 is lifted, the pressed upper elastic body 933 is accommodated in the upper concave portion 935. The pin holder 94 is fitted in the fitting recess 943, and the pin support plate 93 can be easily and stably positioned.
In the present embodiment, the electromagnetic assembly 9 can be lifted and lowered by the lifting pin 8 by the interaction of the lower core 911 and the lower coil 921 with the upper core 912 and the upper coil 922. Thus, unlike embodiment 1, the material for forming the pin support plate 93 does not need to be a permanent magnet, so that the degree of freedom in designing the pin support plate 93 is improved, and manufacturing can be easily performed.
Example 3
Next, embodiment 3 of the present invention will be described with reference to fig. 6A, 6B and 7. Fig. 6A schematically shows a longitudinal sectional view of the electromagnetic assembly 9 of embodiment 3 of the present invention when not energized. Fig. 6B is an enlarged view of the structure of the pin holder 94 in the present embodiment, schematically showing a longitudinal sectional view of the structure of the pin holder 94 holding the lifting pin 8. Fig. 7 schematically shows a longitudinal sectional view of the electromagnetic assembly 9 according to embodiment 3 of the present invention when energized. The basic structure of example 3 is the same as that of fig. 1, and the shower head 3 and the process container 1 are omitted. The same reference numerals are given to the same constituent parts as those of embodiment 1, and detailed description thereof is omitted, and the portions different from embodiment 1 will be mainly described with reference to fig. 6A, 6B and 7. The main difference between embodiment 3 of fig. 6A, 6B and 7 and embodiment 1 of fig. 1 is that the pin support plate 93 common to the plurality of lift pins 8 is not provided, and the plate-shaped pin support magnet 95 is provided for each lift pin 8.
As shown in fig. 6A, the electromagnetic assembly 9 includes a magnetic core 91, a coil 92, a pin holder 94, and a pin supporting elastic body 98. The pin holder 94 in embodiment 3 is different from the pin holder 94 in embodiment 1 in that it further includes a pin supporting magnet 95 provided for each lift pin 8 at the bottom thereof. The pin supporting magnet 95 is disposed opposite the core 91 and the coil 92.
In addition, as shown in fig. 6A, in the present embodiment, the through hole 32 for inserting the lift pin 8 includes a small diameter hole 321 for guiding the lift pin 8 and a large diameter hole 322 for accommodating the pin holder 94, which has a larger diameter than the small diameter hole 321. The pin supporting elastic body 98 is provided between the top of the large-diameter hole 322 (i.e., the flange portion where the large-diameter hole 322 and the small-diameter hole 321 are connected) and the pin holder 94, and can buffer the movement of the pin supporting magnet 95. While the pin supporting elastic body 98 is shown as a spring in fig. 6A, the present invention is not limited to this, and other elastic bodies such as rubber bushings may be used.
As shown in fig. 6B, the pin holder 94 in embodiment 3 has an insertion hole 941 for inserting the lift pin 8. A pin fitting magnet 96 is provided in the insertion hole 941, and since the pin fitting magnet 96 and the pin supporting magnet 95 have opposite polarities, one end (lower end in the drawing) thereof is bonded to the pin supporting magnet 95. The other end (upper end in the drawing) of the pin fitting magnet 96 is fitted into (a fitting hole of) the lift pin 8. This allows the lifter pin 8 to be stably attached to the pin holder 94, and also allows the lifter pin 8 to be easily inserted and removed, thereby facilitating maintenance and replacement of the lifter pin 8. Fig. 6B shows an example in which the pin fitting magnet 96 is formed in a stepped shape, that is, a portion fitted to the lift pin 8 has a small diameter and a portion attracted to the pin supporting magnet 95 has a large diameter, so that the attraction strength between the pin fitting magnet 96 and the pin supporting magnet 95 can be increased to enhance the mounting stability of the lift pin 8. However, the pin fitting magnet 96 is not limited to this, and may be formed in a straight tubular shape.
The plate-shaped pin support magnets 95 provided for the lift pins 8 of the present embodiment are permanent magnets in the same manner as the pin support plates 93 of embodiment 1, and as a material for forming the same, alloys, ferrites, intermetallic compounds, or the like can be used.
In the normal state shown in fig. 6A, that is, in a state where the electromagnetic assembly 9 is not energized, the pin support magnet 95 is positioned to be in contact with the core 91 and the coil 92 by the action of gravity and the force of the pin support elastic body 98. Thus, the lift pins 8 are stored in the mounting table 3 and do not protrude from the mounting surface 31. Then, the wafer W is placed on the placement surface 31 and electrostatically attracted. In this case, various processes can be performed on the wafer W. In contrast, in the state in which the electromagnetic assembly 9 is energized via the control cable 5 by the command of the controller 6 shown in fig. 7, a magnetic field is generated, and the magnetism of the pin support magnet 95 is designed such that a repulsive force acts on the pin support magnet 95 when the coil 92 is energized, so that the pin support magnet 95 moves in a direction away from the core 91 and the coil 92 (upward in the drawing) against the gravity thereof and the biasing force of the pin support elastic body 98. At this time, the lift pins 8 move upward and protrude from the mounting surface 31. In this state, the wafer W can be placed and taken out.
In this embodiment, by adopting a structure in which the pin support magnet 95 provided individually for each lift pin 8 is provided in the through hole 32 for inserting the lift pin 8 in the mounting table 3, the size of the electromagnetic assembly 9 can be significantly reduced as compared with embodiments 1 and 2, and the size of the cavity 7 for providing the electromagnetic assembly 9 can be reduced, so that the mounting table 3 as a whole can be made more compact and miniaturized. And since the size of the pin supporting magnet 95 becomes small, production materials can be saved and costs can be reduced accordingly.
It is to be understood that although the present invention has been described with respect to particular embodiments, one skilled in the art, upon reading the specification, may make modifications to one or more of the features thereof without departing from the spirit and scope of the invention. Accordingly, the description is not intended to limit the invention. Rather, the scope of the invention is to be defined only in accordance with the following claims and their equivalents.
Industrial applicability
According to the present invention, it is possible to provide a substrate mounting mechanism and a substrate processing apparatus using the same, which are easy to maintain and can improve product quality, production efficiency, and yield.

Claims (10)

1. A substrate mounting mechanism for mounting a substrate in a processing container of a substrate processing apparatus for processing a substrate, the substrate mounting mechanism comprising:
a mounting table for mounting the substrate on a mounting surface, the mounting table having a cavity formed therein and having a plurality of through holes penetrating from the mounting surface to the cavity;
a plurality of lift pins respectively inserted into the through holes; and
a lifting mechanism including an electromagnetic assembly for lifting the lifting pin so that the lifting pin can protrude from or retract into the mounting table,
the lifting mechanism is arranged in the carrying table.
2. The substrate mounting mechanism according to claim 1, wherein:
the electromagnetic assembly includes a magnetic core, a coil wound around the magnetic core, a plurality of pin holders for respectively mounting the lift pins, and a pin support plate for fixing the plurality of pin holders,
the magnetic core is arranged on the bottom surface of the cavity,
the pin support plate is a permanent magnet disposed opposite to the magnetic core around which the coil is wound,
the pin support plate is configured to move away from the magnetic core when the coil is energized, so that the lift pin protrudes from the mounting surface.
3. The substrate mounting mechanism according to claim 1, wherein:
the electromagnetic assembly includes a lower core, a lower coil wound around the lower core, an upper coil wound around the upper core, a plurality of pin holders for respectively mounting the lift pins, and a pin support plate for fixing the plurality of pin holders,
the lower magnetic core is arranged at the bottom surface of the cavity, the upper magnetic core is arranged at the bottom of the pin supporting plate, the upper magnetic core wound with the upper coil is arranged opposite to the lower magnetic core wound with the lower coil,
the pin support plate is configured to move away from the lower core when the upper coil and the lower coil are energized, so that the lift pin protrudes from the mounting surface.
4. A substrate mounting mechanism according to claim 2 or 3, wherein:
the lifting pin is detachably inserted into the pin holder.
5. A substrate mounting mechanism according to claim 2 or 3, wherein:
the pin support plate is provided with a plurality of guide holes, in each of which a guide rod for guiding the lifting movement of the pin support plate is inserted,
an upper elastic body and a lower elastic body are respectively provided around the guide rod on the upper and lower sides of the pin support plate.
6. The substrate mounting mechanism according to claim 1, wherein:
the electromagnetic assembly comprises a magnetic core, a coil wound around the magnetic core, a plurality of pin holders for respectively mounting the lifting pins,
each of the pin holders has a pin support magnet at a bottom thereof, the pin support magnets being disposed opposite to the magnetic core around which the coil is wound,
the pin support magnet is configured to move in a direction away from the magnetic core when the coil is energized, so that the lift pin protrudes from the mounting surface.
7. The substrate mounting mechanism according to claim 6, wherein:
the through hole in the mounting table for inserting the lift pin includes: a small diameter hole for guiding the lifting pin; and a large diameter hole having a larger diameter than the small diameter hole for accommodating the pin holder,
a pin supporting elastic body is provided between the pin holder and a flange portion of the large diameter hole connected to the small diameter hole.
8. The substrate mounting mechanism according to claim 6 or 7, wherein:
the lifting pin is detachably inserted into the pin holder.
9. The substrate mounting mechanism according to claim 8, wherein:
the pin holder has an insertion hole for inserting the lifting pin, a pin fitting magnet is provided in the insertion hole,
the pin engaging magnet and the pin supporting magnet have opposite polarities, and a lower end of the pin engaging magnet is attracted to the pin supporting magnet and an upper end of the pin engaging magnet is engaged with the lifting pin.
10. A substrate processing apparatus, characterized in that:
a substrate mounting mechanism according to any one of claims 1 to 9.
CN202210568053.8A 2022-05-24 2022-05-24 Substrate mounting mechanism and substrate processing apparatus using the same Pending CN117153763A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210568053.8A CN117153763A (en) 2022-05-24 2022-05-24 Substrate mounting mechanism and substrate processing apparatus using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210568053.8A CN117153763A (en) 2022-05-24 2022-05-24 Substrate mounting mechanism and substrate processing apparatus using the same

Publications (1)

Publication Number Publication Date
CN117153763A true CN117153763A (en) 2023-12-01

Family

ID=88910661

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210568053.8A Pending CN117153763A (en) 2022-05-24 2022-05-24 Substrate mounting mechanism and substrate processing apparatus using the same

Country Status (1)

Country Link
CN (1) CN117153763A (en)

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