CN117148618A - Lamp panel, manufacturing method thereof, backlight module and display panel - Google Patents

Lamp panel, manufacturing method thereof, backlight module and display panel Download PDF

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Publication number
CN117148618A
CN117148618A CN202210577946.9A CN202210577946A CN117148618A CN 117148618 A CN117148618 A CN 117148618A CN 202210577946 A CN202210577946 A CN 202210577946A CN 117148618 A CN117148618 A CN 117148618A
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CN
China
Prior art keywords
copper foil
positive
negative
circuit board
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210577946.9A
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Chinese (zh)
Inventor
黄少军
孙雄
赖富超
黄雪荣
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Shenzhen TCL Digital Technology Co Ltd
Original Assignee
Shenzhen TCL Digital Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen TCL Digital Technology Co Ltd filed Critical Shenzhen TCL Digital Technology Co Ltd
Priority to CN202210577946.9A priority Critical patent/CN117148618A/en
Publication of CN117148618A publication Critical patent/CN117148618A/en
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133612—Electrical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

The application provides a lamp panel and a preparation method thereof, a backlight module and a display panel. According to the application, the anode copper foil and the cathode copper foil are arranged in the circuit board, so that the surfaces of the reflecting layers corresponding to the anode copper foil and the cathode copper foil are smooth, the bonding force between the glue and the surface of the reflecting layer can be ensured, and the phenomenon that the packaging glue falls off due to insufficient bonding force between the packaging glue and the surface of the reflecting layer is avoided.

Description

Lamp panel, manufacturing method thereof, backlight module and display panel
Technical Field
The application relates to the technical field of display, in particular to a lamp panel, a manufacturing method thereof, a backlight module and a display panel.
Background
The backlight module is one of key components of the liquid crystal display panel, and has a main function of providing a light source with uniform brightness for the liquid crystal display module so as to normally display images. The backlight module is internally provided with a lamp panel, the lamp panel comprises a circuit board and light emitting diodes, and a plurality of uniformly distributed light emitting diodes are arranged on the circuit board to realize uniform backlight light sources.
At present, a reflecting layer needs to be formed on the surface of a circuit board before the LED is subjected to die bonding, and the light emitted by the LED to the lamp panel is reflected so as to improve the utilization rate of a light source; after the LED is fixed, the LED is required to be encapsulated by dispensing, so that the light mixing range can be enlarged by spherical encapsulation adhesive while the LED is ensured. However, as the copper wires around the die bonding position of the light emitting diode are more, the reflective layer on the surface of the circuit board has multiple height differences, so that a flat dispensing surface cannot be formed, the surface binding force of the glue and the reflective layer is affected, and the packaging glue is easy to separate.
Disclosure of Invention
The application provides a lamp panel, a preparation method thereof, a backlight module and a display panel, and aims to solve the technical problem that packaging glue is separated due to insufficient surface binding force between the packaging glue and a reflecting layer at present.
In a first aspect, the present application provides a lamp panel, comprising:
the circuit board is internally provided with a positive copper foil and a negative copper foil which are arranged at intervals, and the surface of the circuit board is provided with a positive bonding pad penetrating to the positive copper foil and a negative bonding pad penetrating to the negative copper foil;
the LED is arranged on the circuit board and is provided with an anode conducting part and a cathode conducting part, the anode conducting part is connected with the anode bonding pad, and the cathode conducting part is connected with the cathode bonding pad;
the circuit board is provided with a reflecting layer on one surface of the light emitting diode, the light emitting diode is wrapped with packaging glue, the packaging glue is adhered to the surface of the reflecting layer, the orthographic projection of the positive copper foil and the negative copper foil on the surface of the reflecting layer comprises a leveling area, and the area of the packaging glue comprises a leveling area.
In some embodiments, the orthographic projections of the positive copper foil and the positive pad on the surface of the reflective layer form a first shape;
the positive projection of the negative copper foil and the negative bonding pad on the surface of the reflecting layer forms a second shape;
the first shape and the second shape are arc-shaped, and the corresponding radiuses of the arc-shaped arcs of the first shape and the second shape are equal.
In some embodiments, the first shape has an equal central angle to the arcuate arc of the second shape, and the central angle to the arcuate arc of the first shape and the second shape is less than or equal to 180 °.
In some embodiments, the sum of central angles of the first shape corresponding to the arcuate arcs of the second shape is less than or equal to 360 °.
In some embodiments, a spacer is provided between the positive and negative copper foils;
the positive electrode copper foil, the negative electrode copper foil, the spacing region, the positive electrode bonding pad and the positive projection of the negative electrode bonding pad on the surface of the reflecting layer are round.
In some embodiments, the orthographic projection of the encapsulation compound on the surface of the reflective layer coincides with the orthographic projection of the corresponding positive copper foil, negative copper foil, spacer, positive pad, and negative pad on the surface of the reflective layer.
In some embodiments, the positive and negative copper foils are symmetrically disposed with respect to the spacer.
In some embodiments, the positive electrode pad and the negative electrode pad are adjacent to the spacer.
In some embodiments, the orthographic projection of the positive and negative copper foils on the plane of the circuit board is located within the orthographic projection of the reflective layer on the plane of the circuit board.
In some embodiments, the circuit board has a positive trace inside that connects the positive copper foil and a negative trace inside that connects the negative copper foil;
the positive electrode wiring is connected to one side of the positive electrode copper foil, which is away from the negative electrode copper foil, and the negative electrode wiring is connected to one side of the negative electrode copper foil, which is away from the positive electrode copper foil.
In some embodiments, the circuit board surface is provided with positive test pads penetrating to the positive traces and negative test pads penetrating to the negative traces.
In a second aspect, the present application provides a method for manufacturing a lamp panel, including:
providing a circuit board, wherein the circuit board is internally provided with an anode copper foil and a cathode copper foil which are arranged at intervals, and the surface of the circuit board is provided with an anode bonding pad penetrating to the anode copper foil and a cathode bonding pad penetrating to the cathode copper foil;
forming a reflecting layer on one surface of the circuit board, on which the light emitting diode is mounted;
the LED is arranged on the circuit board and is provided with an anode conducting part and a cathode conducting part, the anode conducting part is connected with the anode bonding pad, and the cathode conducting part is connected with the cathode bonding pad;
and dispensing the light-emitting diode to form packaging glue for wrapping the light-emitting diode, wherein the packaging glue is adhered to the surface of the reflecting layer, the orthographic projection of the positive copper foil and the negative copper foil on the surface of the reflecting layer comprises a leveling area, and the area of the packaging glue comprises the leveling area.
In a third aspect, the present application provides a backlight module, including a lamp panel as described in the first aspect.
In a fourth aspect, the present application provides a display panel, including a backlight module according to the third aspect.
According to the application, the anode copper foil and the cathode copper foil are arranged in the circuit board, so that the surfaces of the reflecting layers corresponding to the anode copper foil and the cathode copper foil are smooth, and the packaging adhesive can be at least partially adhered in the smooth surface area of the reflecting layer, thereby being beneficial to improving the bonding force between the adhesive and the surface of the reflecting layer, and further avoiding the phenomenon that the packaging adhesive falls off due to insufficient bonding force between the packaging adhesive and the surface of the reflecting layer.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a lamp panel according to an embodiment of the present application;
FIG. 2 is a schematic illustration of the orthographic projection of the positive and negative copper foils on the surface of the reflective layer provided in the embodiment of the present application;
FIG. 3 is a schematic diagram of a circuit board according to an embodiment of the present application;
FIG. 4 is a schematic diagram of another structure of a circuit board according to an embodiment of the present application;
FIG. 5 is a schematic diagram of another structure of a circuit board according to an embodiment of the present application;
FIG. 6 is a schematic diagram of another structure of a circuit board according to an embodiment of the present application;
fig. 7 is a schematic flow chart of a method for manufacturing a lamp panel according to an embodiment of the application.
The packaging structure comprises a circuit board 10, a flat area 100, a positive electrode copper foil 11, a negative electrode copper foil 12, a spacing area 13, a positive electrode bonding pad 14, a negative electrode bonding pad 15, a positive electrode wiring 16, a negative electrode wiring 17, a positive electrode testing bonding pad 18, a negative electrode testing bonding pad 19, a light emitting diode 20, a positive electrode conducting part 21, a negative electrode conducting part 22, a reflecting layer 30 and packaging glue 40.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to fall within the scope of the application.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present application, the term "exemplary" is used to mean "serving as an example, instance, or illustration. Any embodiment described as "exemplary" in this disclosure is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is presented to enable any person skilled in the art to make and use the application. In the following description, details are set forth for purposes of explanation. It will be apparent to one of ordinary skill in the art that the present application may be practiced without these specific details. In other instances, well-known structures and processes have not been described in detail so as not to obscure the description of the application with unnecessary detail. Thus, the present application is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles and features disclosed herein.
The embodiment of the application provides a lamp panel, a preparation method thereof, a backlight module and a display panel, and the lamp panel, the backlight module and the display panel are respectively described in detail below.
First, referring to fig. 1, fig. 2, and fig. 3, fig. 1 shows a schematic structural diagram of a lamp panel according to an embodiment of the present application, fig. 2 shows a schematic structural diagram of an orthographic projection of a positive copper foil and a negative copper foil on a surface of a reflective layer according to an embodiment of the present application, and fig. 3 shows a schematic structural diagram of a circuit board 10 according to an embodiment of the present application, wherein the lamp panel includes:
the circuit board 10, the inside of the circuit board 10 has positive copper foil 11 and negative copper foil 12 that set up at intervals, the surface of the circuit board 10 has positive electrode pad 14 penetrating to the positive copper foil 11, and negative electrode pad 15 penetrating to the negative copper foil 12;
the light emitting diode 20, the light emitting diode 20 is mounted on the circuit board 10, the light emitting diode 20 has positive electrode conduction part 21 and negative electrode conduction part 22, the positive electrode conduction part 21 is connected to the positive electrode bonding pad 14, the negative electrode conduction part 22 is connected to the negative electrode bonding pad 15;
wherein, the surface of the circuit board 10, on which the light emitting diode 20 is mounted, is provided with a reflective layer 30, the light emitting diode 20 is wrapped with a packaging adhesive 40, the packaging adhesive 40 is adhered to the surface of the reflective layer 30, the orthographic projection of the positive copper foil 11 and the negative copper foil 12 on the surface of the reflective layer 30 comprises a flat area 100, and the area adhered by the packaging adhesive 40 comprises the flat area 100.
Specifically, the circuit board 10 is used for providing a mounting base for the light emitting diode 20 and a driving circuit for making the light emitting diode emit light, the positive copper foil 11 and the negative copper foil 12 are used as components of the driving circuit inside the circuit board 10, and the positive copper foil 11 and the negative copper foil 12 are formed after the copper foil of the circuit board 10 is etched. The surface of the circuit board 10 is provided with a positive electrode pad 14 penetrating to the positive electrode copper foil 11 and a negative electrode pad 15 penetrating to the negative electrode copper foil 12, so that the light emitting diode 20 can be electrically connected with the positive electrode copper foil 11 and the negative electrode copper foil 12 through the positive electrode pad 14 and the negative electrode pad 15 respectively.
The leds 20 are connected to a power supply through a driving circuit of the circuit board 10 and emit light, and generally, a plurality of leds 20 are arranged on the lamp panel in an array manner to improve the uniformity of light emitted from the lamp panel. Specifically, the light emitting diode 20 has a positive electrode conductive portion 21 and a negative electrode conductive portion 22, the positive electrode conductive portion 21 and the negative electrode conductive portion 22 are pads of the light emitting diode 20, the light emitting diode 20 connects the positive electrode conductive portion 21 to the positive electrode pad 14 and connects the negative electrode conductive portion 22 to the negative electrode pad 15 by soldering. The light emitting diode 20 may be, for example, a Mini-LED or a Micro-LED.
In the embodiment of the application, the reflective layer 30 is disposed on one surface of the circuit board 10 on which the light emitting diode 20 is mounted, and the reflective layer 30 can reflect the light emitted from the light emitting diode 20 to the lamp panel to improve the light source utilization rate, and the reflective layer 30 may be a reflective sheet attached to the surface of the circuit board 10 or the reflective layer 30 is formed by solidifying white oil applied to the surface of the circuit board 10. Meanwhile, each light emitting diode 20 is wrapped with a spherical encapsulation adhesive 40, and the encapsulation adhesive 40 is adhered to the surface of the reflecting layer 30, so that the light emitting diodes 20 are protected, the light mixing range of the single light emitting diode 20 is enlarged, and the light emitting of the whole light panel is more uniform.
It should be noted that, in the present application, by arranging the positive copper foil 11 and the negative copper foil 12 inside the circuit board 10, the surfaces of the reflective layers 30 corresponding to the positive copper foil 11 and the negative copper foil 12 are flat, and since the orthographic projections of the positive copper foil 11 and the negative copper foil 12 on the surfaces of the reflective layers 30 include the flat areas 100, the bonding areas of the encapsulation glue 40 include the flat areas 100, the bonding force between the glue and the surfaces of the reflective layers 30 is improved, and the phenomenon that the encapsulation glue 40 falls off due to insufficient bonding force between the encapsulation glue 40 and the surfaces of the reflective layers is avoided.
In some embodiments of the present application, for example, for the embodiment in which the shape of the encapsulation glue 40 is spherical, referring to fig. 2 and 3, a spacer 13 is disposed between the positive copper foil 11 and the negative copper foil 12, the spacer 13 is filled with an insulating material of the circuit board 10, insulation of the positive copper foil 11 and the negative copper foil 12 is guaranteed, the shape formed by orthographic projection of the positive copper foil 11, the negative copper foil 12, the spacer 13, the positive bonding pad 14 and the negative bonding pad 15 on the surface of the reflective layer 30 is circular, a pattern corresponding to the circular shape is disposed on the surface of the circuit board 10, after the light emitting diode 20 is dispensed to form the spherical encapsulation glue 40, whether the dispensing diameter exceeds the standard can be rapidly identified through the circular area, and the light emitting diode 20 is soldered on the lamp board, especially for the Mini-LED case, so that the quality qualification detection speed of the product can be obviously improved.
It should be noted that, in the present application, the spacer 13 is located in the area between the positive copper foil 11 and the negative copper foil 12, and may be formed by connecting two adjacent edges of the positive copper foil 11 and the negative copper foil 12 in a straight line or an arc line, for example, taking fig. 3 as an example, where the positive copper foil 11 and the negative copper foil 12 have opposite arc edges and adjacent straight edges, the spacer 13 is formed by connecting two adjacent straight edges of the positive copper foil 11 and the negative copper foil 12 in a straight line and two arcs, and the radius of the arc line is equal to the radius of the arc edges of the positive copper foil 11 and the negative copper foil 12, so that four arc edges where the positive copper foil 11, the negative copper foil 12 and the spacer 13 are connected may be formed into a circle.
In some embodiments of the present application, for example, in the embodiment in which the shape formed by the orthographic projections of the positive copper foil 11, the negative copper foil 12, the spacer 13, the positive bonding pad 14 and the negative bonding pad 15 on the surface of the reflective layer 30 is circular, the orthographic projection of the encapsulation compound 40 on the surface of the reflective layer 30 coincides with the orthographic projection of the corresponding positive copper foil 11, negative copper foil 12, spacer 13, positive bonding pad 14 and negative bonding pad 15 on the surface of the reflective layer 30, and the projection coincides with the corresponding circular area, so that it can be quickly determined whether the size of the encapsulation compound 40 is the same as the corresponding circular area, and it can be quickly determined whether the diameter of the encapsulation compound 40 is too large or not.
In some embodiments of the present application, referring to fig. 2 and fig. 3, the orthographic projections of the positive copper foil 11 and the positive bonding pad 14 on the surface of the reflective layer 30 form a first shape, the orthographic projections of the negative copper foil 12 and the negative bonding pad 15 on the surface of the reflective layer 30 form a second shape, wherein the first shape and the second shape are arcuate, the arcuate arcs of the first shape and the second shape correspond to equal radius, the arcuate arcs of the first shape and the second shape can form a part of the edge corresponding to the radius circle, the rest part is formed by the arcuate edge of the spacer 13, and the shape formed by the orthographic projections of the positive copper foil 11, the negative copper foil 12, the spacer 13, the positive bonding pad 14 and the negative bonding pad 15 on the surface of the reflective layer 30 is more convenient to be circular.
It should be noted that, the arch is a sector minus a triangle or a sector plus a triangle corresponding shape, and the two waists of the triangle are the radii of the sectors; when the central angles corresponding to the arc-shaped arcs of the first shape and the second shape are smaller than 180 degrees, the first shape and the second shape are inferior arc-shaped arcs; when the central angles corresponding to the arc-shaped arcs of the first shape and the second shape are equal to 180 degrees, the first shape and the second shape are semicircular; when the central angle corresponding to the arc of the first shape and the second shape is larger than 180 degrees, the first shape and the second shape are the major arc arcs.
It should be understood that the first shape and the second shape may be other shapes, for example, referring to fig. 4, fig. 4 shows another schematic structural diagram of the circuit board 10 in the embodiment of the application, where the first shape and the second shape are rectangular, and the corresponding shape of the spacer 13 is rectangular, so that the shape of the orthographic projection of the positive copper foil 11, the negative copper foil 12, the spacer 13, the positive bonding pad 14 and the negative bonding pad 15 on the surface of the reflective layer 30 is rectangular.
Further, in some embodiments of the present application, the central angles of the first shape and the second shape corresponding to the arc are equal, the central angles of the first shape and the second shape corresponding to the arc are less than or equal to 180 °, and when the central angles are less than 180 °, the first shape and the second shape are approximately semicircular, and form a circle with the spacer 13; when the central angle is equal to 180 °, the spacing area 13 is rectangular, the length of the rectangle is equal to twice the radius corresponding to the arcuate arc of the first shape, and the width is smaller, the orthographic projections of the positive copper foil 11, the negative copper foil 12, the spacing area 13, the positive bonding pad 14 and the negative bonding pad 15 on the surface of the reflecting layer 30 can form a combined image which is approximately circular, and the purpose of identifying the size of the dispensing diameter can be achieved rapidly.
Preferably, the central angle corresponding to the arc of the first shape and the second shape is smaller than or equal to 180 degrees and larger than or equal to 170 degrees, so that the area occupation ratio of the first shape and the second shape relative to the circular shape with the same diameter is relatively larger as much as possible, a larger bonding pad can be arranged on the positive copper foil 11, the light-emitting diode 20 is conveniently mounted on the circuit board 10, and when the lamp panel is manufactured and used, the positive copper foil 11 and the negative copper foil 12 with larger areas are utilized for heat dissipation, so that the overall heat dissipation performance of the lamp panel is improved.
It will be appreciated that the sum of the central angles of the arcuate arcs of the first shape and the second shape may be less than or equal to 360 °, but the central angles of the arcuate arcs of the first shape and the second shape are not equal, for example, referring to fig. 5, fig. 5 shows another schematic structural diagram of the circuit board 10 in an embodiment of the present application, where the central angle of the arcuate arc of the first shape is less than 180 °, the central angle of the arcuate arc of the second shape is greater than 180 °, and the sum of the central angles is less than 360 ° may also form a circle with the corresponding spacer 13.
In some embodiments of the present application, for example, for the embodiment in which the central angles corresponding to the arcuate arcs of the first shape and the second shape are equal, with continued reference to fig. 3, the positive copper foil 11 and the negative copper foil 12 are symmetrically disposed with respect to the spacer 13, so that the spacer 13 separates the positive copper foil 11 and the negative copper foil 12 in a straight line shape between them, which is beneficial to reducing the difficulty in manufacturing the positive copper foil 11 and the negative copper foil 12 of the circuit board 10.
Further, with continued reference to fig. 3, the positive electrode pad 14 and the negative electrode pad 15 are disposed adjacent to the spacer 13, and the size of the light emitting diode 20 only spans the spacer 13, so that the light emitting diode 20 (e.g., mini-LED) with a smaller size can be mounted when the spacer 13 is narrower, which is beneficial to increasing the number of light emitting diodes 20 that can be mounted on the lamp panel.
In some embodiments of the present application, the orthographic projection of the positive copper foil 11 and the negative copper foil 12 on the plane of the circuit board 10 is located in the orthographic projection of the reflective layer 30 on the plane of the circuit board 10, that is, the reflective layer 30 covers the area around the bonding pad, so that the orthographic projections of the positive copper foil 11 and the negative copper foil 12 all fall in the orthographic projection of the reflective layer 30, and compared with the phenomenon that the silver paste printing tolerance and the reflective layer 30 (white oil) printing tolerance need to be reserved around the bonding pad in the prior art, the black leakage phenomenon of the substrate at the edge of the bonding pad can be avoided.
It should be noted that, because the present application adopts the manner that the size of the positive electrode copper foil 11 and the negative electrode copper foil 12 is equivalent to the size of the encapsulation glue 40, only the window sizes of the positive electrode pad 14 and the negative electrode pad 15 corresponding to the positive electrode copper foil 11 and the negative electrode copper foil 12 respectively are increased, the silver paste printing tolerance and the reflective layer 30 (white oil) printing tolerance can be ignored, so that the reflective layer 30 covers the area around the positive electrode pad 14 and the negative electrode pad 15 and the purpose of avoiding the black leakage phenomenon of the pad edge substrate is achieved.
With continued reference to fig. 3, the circuit board 10 has a positive electrode trace 16 connected to the positive electrode copper foil 11 and a negative electrode trace 17 connected to the negative electrode copper foil 12, the positive electrode trace 16 is connected to a side of the positive electrode copper foil 11 facing away from the negative electrode copper foil 12, the negative electrode trace 17 is connected to a side of the negative electrode copper foil 12 facing away from the positive electrode copper foil 11, the positive electrode trace 16 and the negative electrode trace 17 are formed on the same piece of copper foil when the circuit board 10 is manufactured with the positive electrode copper foil 11 and the negative electrode copper foil 12, and finally a driving circuit structure including the positive electrode copper foil 11, the negative electrode copper foil 12, the positive electrode trace 16 and the negative electrode trace 17 is formed on the circuit board 10.
Further, in some embodiments of the present application, referring to fig. 3, the surface of the circuit board 10 is provided with a positive electrode test pad 18 penetrating to the positive electrode trace 16 and a negative electrode test pad 19 penetrating to the negative electrode trace 17, and because the positive electrode test pad 18 and the negative electrode test pad 19 are separately provided, after the circuit board 10 is manufactured, the difficulty of short-circuit test of the circuit board 10 can be reduced, and meanwhile, in the subsequent lamp panel manufacturing process, the positioning recognition base of tin spraying and dispensing processes can also be used, so that the phenomenon of inaccurate tin spraying procedure and dispensing positioning during positioning recognition of the whole board due to board expansion and PCB manufacturing procedure equipment tolerance is avoided.
It should be noted that the foregoing description of the lamp panel is intended to clearly illustrate the implementation verification process of the present application, and those skilled in the art may also make equivalent modification designs under the guidance of the present application, for example, the positive copper foil 11, the negative copper foil 12, the spacer 13, the positive bonding pad 14 and the negative bonding pad 15 may have a regular hexagonal shape formed by orthographic projection on the surface of the reflective layer 30; for another example, referring to fig. 6, fig. 6 shows another schematic structure of a lamp panel according to an embodiment of the present application, where the circuit board 10 is provided with two positive electrode pads 14 and two negative electrode pads 15 for the same positive electrode copper foil 11 and negative electrode copper foil 12, and can simultaneously perform dispensing on two light emitting diodes 20 to form a packaging adhesive 40.
Further, in order to better implement the lamp panel of the present application, the present application further provides a lamp panel preparation method based on the lamp panel, and with continued reference to fig. 7, fig. 7 shows a schematic flow diagram of the lamp panel preparation method in the embodiment of the present application, where the lamp panel preparation method includes:
step S601, providing a circuit board 10, wherein the circuit board 10 is internally provided with a positive copper foil 11 and a negative copper foil 12 which are arranged at intervals, and the surface of the circuit board 10 is provided with a positive bonding pad 14 penetrating to the positive copper foil 11 and a negative bonding pad 15 penetrating to the negative copper foil 12;
step S602, forming a reflective layer 30 on the surface of the circuit board 10 on which the light emitting diode 20 is mounted;
step S603, mounting the light emitting diode 20 on the circuit board 10, wherein the light emitting diode 20 has a positive electrode conductive portion 21 and a negative electrode conductive portion 22, the positive electrode conductive portion 21 is connected to the positive electrode pad 14, and the negative electrode conductive portion 22 is connected to the negative electrode pad 15;
in step S603, the light emitting diode 20 is dispensed to form a packaging adhesive 40 for wrapping the light emitting diode 20, the packaging adhesive 40 is adhered to the surface of the reflective layer 30, the orthographic projection of the positive copper foil 11 and the negative copper foil 12 on the surface of the reflective layer 30 includes a flat area 100, and the area where the packaging adhesive 40 is adhered includes the flat area 100.
According to the application, the anode copper foil 11 and the cathode copper foil 12 are arranged in the circuit board 10, so that the surfaces of the reflecting layers 30 corresponding to the anode copper foil 11 and the cathode copper foil 12 are flat, and as the orthographic projection of the anode copper foil 11 and the cathode copper foil 12 on the surfaces of the reflecting layers 30 comprises the flat area 100, the area where the packaging glue 40 is adhered comprises the flat area 100, the bonding force between the glue and the surfaces of the reflecting layers 30 is improved, and the phenomenon that the packaging glue 40 falls off due to insufficient bonding force between the packaging glue 40 and the surfaces of the reflecting layers is avoided.
Furthermore, in order to better implement the lamp panel, the application further provides a backlight module based on the lamp panel, and the backlight module comprises the lamp panel of any embodiment. The backlight module comprises the lamp panel of any one of the embodiments, so that the backlight module has the beneficial effects related to the lamp panel, and the description is omitted herein.
Furthermore, in order to better implement the lamp panel, the application further provides a display panel based on the lamp panel, wherein the display panel comprises the backlight module of the embodiment. The display panel includes the lamp panel of any one of the embodiments, so that the display panel has the beneficial effects related to the lamp panel, and the description is omitted herein.
In the foregoing embodiments, the descriptions of the embodiments are focused on, and the portions of one embodiment that are not described in detail in the foregoing embodiments may be referred to in the foregoing detailed description of other embodiments, which are not described herein again.
While the basic concepts have been described above, it will be apparent to those skilled in the art that the foregoing detailed disclosure is by way of example only and is not intended to be limiting. Although not explicitly described herein, various modifications, improvements and adaptations of the application may occur to one skilled in the art. Such modifications, improvements, and modifications are intended to be suggested within the present disclosure, and therefore, such modifications, improvements, and adaptations are intended to be within the spirit and scope of the exemplary embodiments of the present disclosure.
Meanwhile, the present application uses specific words to describe embodiments of the present application. Reference to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic is associated with at least one embodiment of the application. Thus, it should be emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various positions in this specification are not necessarily referring to the same embodiment. Furthermore, certain features, structures, or characteristics of one or more embodiments of the application may be combined as suitable.
Similarly, it should be noted that in order to simplify the description of the present disclosure and thereby aid in understanding one or more inventive embodiments, various features are sometimes grouped together in a single embodiment, figure, or description thereof. This method of disclosure, however, is not intended to imply that more features than are required by the subject application. Indeed, less than all of the features of a single embodiment disclosed above.
The lamp panel, the preparation method thereof, the backlight module and the display panel provided by the embodiment of the application are described in detail, and specific examples are applied to the description of the principle and the implementation mode of the application, and the description of the above embodiments is only used for helping to understand the method and the core idea of the application; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, the present description should not be construed as limiting the present application.

Claims (14)

1. A lamp panel, comprising:
the circuit board is internally provided with positive copper foil and negative copper foil which are arranged at intervals, and the surface of the circuit board is provided with a positive electrode bonding pad penetrating to the positive copper foil and a negative electrode bonding pad penetrating to the negative copper foil;
the light-emitting diode is arranged on the circuit board and is provided with a positive electrode conducting part and a negative electrode conducting part, the positive electrode conducting part is connected to the positive electrode bonding pad, and the negative electrode conducting part is connected to the negative electrode bonding pad;
the LED is characterized in that a reflecting layer is arranged on one surface of the circuit board, on which the LED is mounted, packaging glue is wrapped on the LED, the packaging glue is adhered to the surface of the reflecting layer, the orthographic projection of the positive copper foil and the negative copper foil on the surface of the reflecting layer comprises a leveling area, and the area of the packaging glue comprises the leveling area.
2. The lamp panel of claim 1, wherein the positive copper foil and the positive bonding pad form a first shape in orthographic projection on the surface of the reflective layer;
orthographic projection of the negative copper foil and the negative bonding pad on the surface of the reflecting layer forms a second shape;
the first shape and the second shape are arc-shaped, and the radii corresponding to the arc-shaped arcs of the first shape and the second shape are equal.
3. The lamp panel of claim 2, wherein the first shape has an equal central angle to the arcuate arc of the second shape, and the first shape and the arcuate arc of the second shape have a central angle of less than or equal to 180 °.
4. The lamp panel of claim 2, wherein a sum of central angles of the first shape and the arcuate arc of the second shape is less than or equal to 360 °.
5. The lamp panel of claim 1, wherein a spacer is provided between the positive and negative copper foils;
the positive electrode copper foil, the negative electrode copper foil, the spacing region, the positive electrode bonding pad and the positive projection of the negative electrode bonding pad on the surface of the reflecting layer form a round shape.
6. The lamp panel of claim 5, wherein the orthographic projection of the encapsulation compound on the surface of the reflective layer coincides with the orthographic projection of the corresponding positive copper foil, negative copper foil, spacer, positive bonding pad and negative bonding pad on the surface of the reflective layer.
7. The lamp panel of claim 5, wherein the positive copper foil and the negative copper foil are symmetrically disposed with respect to the spacer.
8. The lamp panel of claim 7, wherein the positive electrode pad and the negative electrode pad are adjacent to the spacer.
9. The lamp panel of claim 1, wherein the orthographic projection of the positive copper foil and the negative copper foil on the plane of the circuit board is located in the orthographic projection of the reflective layer on the plane of the circuit board.
10. The lamp panel of claim 1, wherein the circuit board has a positive trace inside that connects the positive copper foil and a negative trace inside that connects the negative copper foil;
the positive electrode wiring is connected to one side of the positive electrode copper foil, which is away from the negative electrode copper foil, and the negative electrode wiring is connected to one side of the negative electrode copper foil, which is away from the positive electrode copper foil.
11. The lamp panel of claim 10, wherein the circuit board surface is provided with a positive test pad extending through to the positive trace and a negative test pad extending through to the negative trace.
12. The preparation method of the lamp panel is characterized by comprising the following steps:
providing a circuit board, wherein an anode copper foil and a cathode copper foil which are arranged at intervals are arranged in the circuit board, and the surface of the circuit board is provided with an anode bonding pad penetrating to the anode copper foil and a cathode bonding pad penetrating to the cathode copper foil;
forming a reflecting layer on one surface of the circuit board, on which the light emitting diode is mounted;
the LED is arranged on the circuit board and is provided with a positive electrode conducting part and a negative electrode conducting part, the positive electrode conducting part is connected to the positive electrode bonding pad, and the negative electrode conducting part is connected to the negative electrode bonding pad;
and dispensing the light-emitting diode to form packaging glue for wrapping the light-emitting diode, wherein the packaging glue is adhered to the surface of the reflecting layer, the orthographic projection of the positive copper foil and the negative copper foil on the surface of the reflecting layer comprises a leveling area, and the area of the packaging glue comprises the leveling area.
13. A backlight module comprising a lamp panel according to any one of claims 1 to 11.
14. A display panel comprising the backlight module of claim 13.
CN202210577946.9A 2022-05-25 2022-05-25 Lamp panel, manufacturing method thereof, backlight module and display panel Pending CN117148618A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210577946.9A CN117148618A (en) 2022-05-25 2022-05-25 Lamp panel, manufacturing method thereof, backlight module and display panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210577946.9A CN117148618A (en) 2022-05-25 2022-05-25 Lamp panel, manufacturing method thereof, backlight module and display panel

Publications (1)

Publication Number Publication Date
CN117148618A true CN117148618A (en) 2023-12-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210577946.9A Pending CN117148618A (en) 2022-05-25 2022-05-25 Lamp panel, manufacturing method thereof, backlight module and display panel

Country Status (1)

Country Link
CN (1) CN117148618A (en)

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