CN117148118A - One-key chip hand tester and testing method thereof - Google Patents

One-key chip hand tester and testing method thereof Download PDF

Info

Publication number
CN117148118A
CN117148118A CN202311414240.1A CN202311414240A CN117148118A CN 117148118 A CN117148118 A CN 117148118A CN 202311414240 A CN202311414240 A CN 202311414240A CN 117148118 A CN117148118 A CN 117148118A
Authority
CN
China
Prior art keywords
piece
chip
base
switching
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202311414240.1A
Other languages
Chinese (zh)
Other versions
CN117148118B (en
Inventor
常文龙
杨宏波
李贝贝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Langzhirui Electronic Technology Co ltd
Original Assignee
Suzhou Langzhirui Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Langzhirui Electronic Technology Co ltd filed Critical Suzhou Langzhirui Electronic Technology Co ltd
Priority to CN202311414240.1A priority Critical patent/CN117148118B/en
Publication of CN117148118A publication Critical patent/CN117148118A/en
Application granted granted Critical
Publication of CN117148118B publication Critical patent/CN117148118B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The application relates to the field of chip testing, and provides a one-key chip hand tester which comprises a turnover piece, a base, a testing piece and a pushing mechanism, wherein the turnover piece is arranged on the base; the turnover piece is movably connected with the base, and an abutting part is arranged on the turnover piece; the test piece for placing the chip is connected with the center of the base; the pushing mechanism is provided with two groups which are respectively and oppositely arranged at two sides of the base, and the pushing mechanism is provided with a sliding conducting end; when the turnover piece presses down the pushing mechanism along the base, the abutting part abuts against the surface of the chip, and the turnover piece synchronously pushes the conducting end to move towards the testing piece, so that the chip is conducted and tested. The application has the effect of stabilizing the chip in the test process. In addition, a method for testing the chip is also provided.

Description

One-key chip hand tester and testing method thereof
Technical Field
The application relates to the field of chip testing, in particular to a one-key chip hand tester and a testing method thereof.
Background
Chips are an integrated method for miniaturizing circuits, often manufactured on the surface of a semiconductor wafer, and with the development of technology, the chips are widely used with high integration and stable performance, such as lasers, photodetectors, modulators, and the like.
In the process of chip manufacture, the accurate test of the chip is used as an important reference for chip preparation, equivalent circuit model establishment and package design, and when the chip is produced in mass production, the chip is tested at different temperatures before shipment is finally completed, so that the electronic chip with defects or incapable of meeting the use conditions is screened.
However, because the chip is small in size, under the condition that expensive instruments are not used in consideration of cost during testing, the related technology adopts a method that the chip is manually placed on a conductive metal carrier, and then the chip is manually tested at different temperatures through a test piece, but the detection mode needs to be connected with various conducting circuits, so that the operation is complex, the detection efficiency is low, and meanwhile, the chip position is easily deviated, so that the chip is damaged in the testing process.
Disclosure of Invention
In order to improve the above problems, the present application provides a one-touch chip hand tester and a testing method thereof.
The application provides a one-key chip hand tester and a testing method thereof, which adopts the following technical scheme:
a one-key chip hand tester comprises a turnover piece, a base, a test piece and a pushing mechanism; the turnover piece is movably connected with the base, and an abutting part is arranged on the turnover piece; the test piece for placing the chip is connected with the center of the base; the pushing mechanism is provided with two groups which are respectively and oppositely arranged at two sides of the base, and the pushing mechanism is provided with a sliding conducting end; when the turnover piece presses down the pushing mechanism along the base, the abutting part abuts against the surface of the chip, and the turnover piece synchronously pushes the conducting end to move towards the testing piece, so that the chip is conducted and tested.
Through adopting above-mentioned technical scheme, when the upset piece is followed the base upset and is pushed down two sets of pushing mechanism, butt portion supports tightly in the chip surface, and the cooperation test piece supports the chip another side to with the chip position firm, reduce the chip and take place the skew in the position when the test, lead to the test result to appear the deviation, when the upset piece pushes down pushing mechanism, promote the leading end in step and remove to the test piece, make chip electric power switch on, in order to carry out the performance test.
Optionally, the pushing mechanism comprises a pushing piece, a resetting piece, a first guide piece, a second guide piece and a conducting piece; the pushing pieces are inserted into the first guide pieces; the side surface, close to the test piece, of the pushing piece is a first inclined surface; the second guide piece penetrates through the test piece, and the conducting piece is spliced with the second guide piece; the side surface, close to the pushing part, of the conducting part is a second inclined surface, and the first inclined surface and the second inclined surface are in contact with each other; the resetting piece is sleeved on the second guide piece, one end of the resetting piece is connected with the conducting piece, and the other end of the resetting piece is connected with the testing piece.
Through adopting above-mentioned technical scheme, when the upset piece overturns along the base to the upset piece pushes down the pusher, and the pusher moves to the base along first guide, pushes down the second inclined plane through first inclined plane in the removal process, makes the conducting element follow the second guide and moves to the test seat, makes the conducting element insert in the chip in the removal process, thereby makes the chip be in the conducting state, by the guide effect of first guide and second guide, guarantees that the chip can stably get into performance test.
Optionally, the pushing mechanism further comprises a limiting piece; the limiting piece is provided with a limiting opening, the caliber of the limiting opening is matched with the height of the conducting piece, and the conducting piece slides along the limiting opening in the sliding process.
Through adopting above-mentioned technical scheme, the conducting piece is located spacing mouthful, can't break away from spacing mouthful, can only cooperate the second guide piece to remove along spacing mouthful, further avoids appearing the conducting piece and removes in-process and take place the position deflection, can't dock with the chip accuracy's the condition.
Optionally, the conducting piece comprises a plurality of test parts and a sliding part; the test parts are uniformly laid at one end of the sliding part, which is close to the test piece; the second inclined surface is a side surface of the sliding part, which is far away from the test piece.
Through adopting above-mentioned technical scheme, a plurality of test portions connect gradually in the portion of sliding near test piece one end, when making the portion of sliding remove to the test piece, usable a plurality of test portions and chip contact are in order to realize switching on.
Optionally, the pushing element is further provided with a plurality of elastic parts.
Through adopting above-mentioned technical scheme, utilize the elastic part can provide the resilience and the reset effect of pusher shoe, make the pusher shoe lose the pushing down effect of pusher shoe and receive the resilience force influence of elastic part after lifting, upwards promote along first guide to reset, cooperate the reset piece together to provide the reset of pusher shoe, alleviate the required thrust of reset piece, guarantee the reset stability of pusher shoe.
Optionally, a switching mechanism is further arranged on the turnover piece; the turnover part is provided with a switching port, the switching mechanism is positioned in the switching port, and the switching mechanism is movably connected with the turnover part; the test piece comprises a fixing part and a mounting part; the fixing part is arranged at the center of the base; the chip is connected with the mounting part, and the mounting part is detachably connected with the fixing part; the two mounting parts are respectively connected with two ends of the switching mechanism in a sliding mode.
Through adopting above-mentioned technical scheme, two chips are connected with two installation department respectively, utilize switching mechanism to change the position of two installation department and chip, after a chip test, utilize switching mechanism to switch another chip to be close to base one end for change chip speed, improve efficiency of software testing.
Optionally, the switching mechanism includes a switching portion and a rotating portion; the rotating part is positioned in the switching port and is movably connected with the wall surface of the switching port; the switching part is arranged on the rotating part, and a limiting groove is formed in the surface of the switching part; the mounting part is spliced with the switching part through the limiting groove.
Through adopting above-mentioned technical scheme, the switching part is rotatory along the switching mouth through the rotation portion to reach the effect of changing switching part position, installation department rethread spacing groove is pegged graft with the switching part, in order to reach convenient dismantlement and take out the effect of installation department.
Optionally, a pushing part is further arranged on the rotating part.
Through adopting above-mentioned technical scheme, through setting up the pivoted fulcrum that promotes the portion and provide, the position of the installation department and chip of being convenient for more switches.
Optionally, a locking part is further arranged on the turnover part; the locking part is in sliding connection with the overturning piece, and in the sliding process, the locking part moves to the switching opening and is abutted to the switching part.
Through adopting above-mentioned technical scheme, can restrict the rotation route of switching part through locking part, can prevent that switching part from taking place the skew in chip test in-process, lead to the test result inaccurate, influence the normal use of follow-up chip.
A chip testing method is applied to the one-key chip hand tester, and comprises the following steps:
core mounting: the chip is loaded at the test piece;
and (3) cover mounting: the turnover piece turns over along the base and covers the base;
and (3) pressing: the overturning piece presses downwards towards the base, pushes the pushing mechanism and presses the chip by the abutting part:
conducting: the pushing mechanism pushes the conducting end to the chip under the action of pushing down, and the chip is contacted with the conducting end to conduct the chip;
and (3) testing: after the chip is conducted, testing the performance of the chip;
flip: the overturning piece is lifted after the test is completed;
and (3) collecting: and taking out the chip from the test piece for replacement.
Through adopting above-mentioned technical scheme, utilize above-mentioned method through a key formula hand survey ware can carry out swift performance detection to the chip to compress tightly the chip through the butt portion, in order to avoid the chip testing in-process skew, guarantee the stability of chip testing in-process position.
In summary, the present application includes at least one of the following beneficial technical effects:
1. when the turnover piece turns over along the base and presses down the pushing mechanism, the abutting part abuts against the surface of the chip, the test piece is matched with the other surface of the chip to stabilize the position of the chip, deviation of the position of the chip during testing is reduced, the deviation of a test result is caused, and when the turnover piece presses down the pushing mechanism, the conducting end is synchronously pushed to move towards the test piece, so that the power of the chip is conducted, and the performance test is performed;
2. when the turnover piece turns over along the base, the turnover piece presses the pushing piece up and down, the pushing piece moves towards the base along the first guide piece, the second inclined face is pressed down through the first inclined face in the moving process, the conducting piece moves towards the test seat along the second guide piece, the conducting piece is inserted into the chip in the moving process, and therefore the chip is in a conducting state, and the chip can stably enter the performance test under the guide action of the first guide piece and the second guide piece;
3. the two chips are respectively connected with the two mounting parts, the two mounting parts are switched with the chips by the switching mechanism, and after one chip is tested, the other chip is switched to be close to one end of the base by the switching mechanism, so that the testing efficiency is improved;
4. the switching part rotates along the switching opening through the rotating part, so that the effect of changing the position of the switching part is achieved, and the mounting part is spliced with the switching part through the limiting groove, so that the effect of conveniently disassembling and taking out the mounting part is achieved.
Drawings
FIG. 1 is a schematic perspective view of a hand-held instrument according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a first front view of a hand-held instrument in accordance with some embodiments of the application;
FIG. 3 is a schematic perspective view showing a separated state of the hand detector and the pusher shoe according to some embodiments of the present application;
FIG. 4 is a schematic diagram of a second front view of a hand-held instrument according to some embodiments of the application;
FIG. 5 is a schematic perspective view of a flip member according to some embodiments of the present application;
FIG. 6 is a schematic perspective view of a test piece according to some embodiments of the present application;
FIG. 7 is a schematic diagram of a first front view of a test piece according to some embodiments of the present application;
FIG. 8 is a schematic side view of a test piece according to some embodiments of the present application;
FIG. 9 is a schematic diagram of a second front view of a test piece according to some embodiments of the present application;
FIG. 10 is a schematic perspective view of another view of a flip in accordance with some embodiments of the present application;
FIG. 11 is a step diagram of a method of testing a chip in some embodiments of the application.
The marks in the drawings are: 1. the device comprises a turnover part, 11, an abutting part, 12, a switching port, 13, a locking groove, 2, a base, 3, a test part, 31, a fixing part, 32, a mounting part, 321, a mounting groove, 322, a clamping port, 33, a clamping frame, 4, a pushing mechanism, 41, a pushing part, 411, a first inclined surface, 412, an elastic part, 42, a reset part, 43, a first guide part, 44, a second guide part, 45, a conducting part, 451, a second inclined surface, 452, a test part, 453, a sliding part, 46, a limiting part, 5, a switching mechanism, 51, a switching part, 511, a limiting groove, 52, a rotating part, 53, a pushing part, 54 and a locking part.
Detailed Description
Other advantages and effects of the present application will be readily apparent to those skilled in the art from the following detailed description of the embodiments of the application. The application may be practiced or carried out in other embodiments and with various details, and various modifications and alterations may be made to the details of the application from various points of view and applications without departing from the spirit of the application. It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other.
The embodiments of the present application will be described in detail below with reference to the attached drawings so that those skilled in the art to which the present application pertains can easily implement the present application. This application may be embodied in many different forms and is not limited to the embodiments described herein.
In the context of the present description, reference to the terms "one embodiment," "some embodiments," "examples," "particular examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples, as well as features of various embodiments or examples, presented herein may be combined and combined by those skilled in the art without conflict.
Furthermore, the terms "first," "second," and the like, are used merely for purposes of referring to objects, and are not intended to indicate or imply relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the context of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
Throughout the specification, when a device is said to be "connected" to another device, this includes not only the case of "direct connection" but also the case of "indirect connection" with other elements interposed therebetween. In addition, when a certain component is said to be "included" in a certain device, unless otherwise stated, other components are not excluded, but it means that other components may be included.
The present application will be described in further detail with reference to fig. 1 to 11.
The embodiment of the application discloses a one-key chip hand tester and a testing method thereof.
Referring to fig. 1, a one-key chip hand tester is shown, and is used for manually operating a test chip, and after current conduction, heat can be generated to test the chip under different temperature conditions.
The hand tester comprises a turnover piece 1, a base 2, a test piece 3 and a pushing mechanism 4; the turnover piece 1 is movably connected with the base 2, the turnover piece 1 is provided with the abutting part 11, the turnover piece 1 can adopt a turnover cover, the movable connection mode between the turnover cover and the base 2 can be hinged, if a hinge shaft is arranged to penetrate through the turnover piece 1 and the base 2, the turnover piece 1 can be turned over through the hinge shaft to close the base 2 or open the base 2, the turnover cover can be concave, and convex blocks are arranged on two sides of the turnover piece for providing a pushing action for the pushing mechanism 4.
The abutting portion 11 can adopt rubber bolts, the abutting portion 11 can be provided with a plurality of screw holes, the number of the screw holes is two, the corresponding screw holes are formed in the turnover cover, the number of the screw holes is inconsistent with that of the rubber bolts, if the number of the screw holes is three, the number of the rubber bolts is only two, and therefore the number of the rubber bolts can be set according to requirements.
The rubber bolt runs through the screw hole and extends to being close to the base 2 direction, and after the flip cover covers in base 2, rubber bolt and chip contact and support the top surface of tight chip, wherein, rubber bolt can be according to the elasticity of screw in length control and chip butt, adaptable different thickness's chip.
The test piece 3 for placing the chip is connected with the center of the base 2, the test piece 3 can adopt a test seat, the chip is placed on the test seat, the chip is provided with chip feet, a plurality of metal connecting sheets are arranged on the chip feet, and the chip can be clamped on the test seat through the metal connecting sheets.
When the turnover cover is covered on the base 2, the rubber bolt is in contact with the chip and abuts against the top surface of the chip, and the bottom surface of the chip is in contact with the top surface of the test seat, so that the chip is firmly clamped between the test seat and the rubber bolt, and the chip is prevented from being deviated in position when being tested, and the test result is deviated.
The pushing mechanism 4 is provided with two groups, which are respectively and oppositely arranged at two sides of the base 2, and the pushing mechanism 4 is provided with a slidable conduction end, the pushing mechanism 4 is used for pushing the conduction end and conducting current, after conducting, the amount of heat generated by the current is adjusted according to the amount of the current, the temperature around the chip is improved, and the chip performance test under different temperatures is carried out under the conduction.
Specifically, when the turnover piece 1 turns over along the base 2 and presses down the pushing mechanism 4, the abutting part 11 abuts against the surface of the chip, and the chip is abutted against the other surface of the chip in cooperation with the test seat, so that the chip is stable in position, the deviation of the chip in the test process is reduced, the deviation of the test result is caused, and when the turnover piece 1 presses down the pushing mechanism 4, the conducting end is synchronously pushed to move towards the test piece 3, so that the chip is electrically conducted, and the performance test is performed.
Wherein, base 2 can set up the hasp, and upset piece 1 can set up the fixture block, when upset piece 1 down overturn the back with base 2 be close to, available hasp and fixture block are fixed the continuous with both.
The turnover piece 1 can be further provided with a display lamp, and the chip test result can be judged according to the lighted color of the display lamp, if the red color is unqualified for the chip test, the green color is qualified for the chip test, and the display lamp can be electrically connected with sensing equipment relevant to the test such as a temperature sensor.
Further, referring to fig. 2 and 3, the pushing mechanism 4 includes a pushing member 41, a reset member 42, a first guide member 43, a second guide member 44, and a conducting member 45; a plurality of first guide members 43 are installed on the base 2, the pushing members 41 are inserted into the first guide members 43, the first guide members 43 can adopt first guide columns, the number of the first guide columns can be determined according to requirements, and four first guide columns are arranged in the embodiment.
The pushing element 41 may be a pushing element, and the pushing element is provided with first guide holes matched with the outer diameter of the first guide columns, the matched fingers are identical in size and shape, the number of the first guide holes is identical to that of the first guide columns, in this embodiment, the number of the first guide holes is four, and the positions of the first guide holes are corresponding to those of the first guide columns, so that the pushing element can be inserted into the first guide columns through the first guide holes, and after the pushing element is inserted into the first guide holes through the four first guide columns, the pushing element can only move along the first guide columns through the first guide holes, thereby reducing the position offset.
Wherein, the pushing block is close to a side of the test piece 3 and is a first inclined plane 411, the second guide piece 44 is worn to locate the test piece 3, and the conducting piece 45 is inserted with the second guide piece 44, the second guide piece 44 can adopt the second guiding post, the conducting piece 45 is used for conducting with the chip, so as to perform performance test, the conducting piece 45 can be provided with the second guiding hole, both the second guiding hole and the second guiding post are respectively provided with two, both ends of the conducting piece 45 are respectively located, and the second guiding hole is matched with the second guiding post, namely the size and the shape of the second guiding hole are consistent with those of the second guiding post, so that the pushing block can slide along the second guiding post through the second guiding hole, and the sliding position can not deviate when the pushing block slides transversely, so as to ensure the stability of conducting with the chip.
The side surface of the conducting member 45, which is close to the pushing member 41, is a second inclined surface 451, the first inclined surface 411 and the second inclined surface 451 are in contact with each other, and the inclination directions of the first inclined surface 411 and the second inclined surface 451 are different, when the first inclined surface 411 presses down the second inclined surface 451, the second inclined surface 451 is pressed, so that the conducting member 45 moves along the second guide post toward the test seat.
The reset piece 42 is sleeved on the second guide post, one end of the reset piece is connected with the conducting piece 45, the other end of the reset piece is connected with the test seat, the reset piece 42 can adopt a reset spring, when the conducting piece 45 moves along the second guide post through the second guide hole, the reset spring can be extruded, after the chip test is finished, the turnover cover is lifted, and the reverse elastic force generated by the reset spring can push the conducting piece 45 back to the original position along the second guide post, so that the conducting piece 45 is separated from the chip.
Meanwhile, the conducting piece 45 is pushed by the reset spring, so that the second inclined surface 451 moves along the first inclined surface 411, and pushes the pushing block to lift up along the first guide post, and therefore the reset spring can reset the conducting piece 45 and the pushing block at the same time.
Specifically, when the turnover cover is turned over along the base 2, and the protruding block on the turnover cover presses down the pushing block, the pushing block moves along the first guiding column toward the base 2, and presses down the second inclined surface 451 through the first inclined surface 411 during the movement, so that the conducting member 45 moves along the second guiding column toward the test seat, and the conducting member 45 is inserted into the chip during the movement, so that the chip is in a conducting state for performance testing.
After the test is completed, the turnover cover is lifted along the base 2, and after the pushing block loses the extrusion of the turnover cover, the return spring pushes the conducting piece 45 along the second guide post and separates the conducting piece 45 from the chip, and the second inclined surface 451 pushes the first inclined surface 411 to enable the pushing block to move upwards along the first guide post, so that the chip can be taken out from the test seat to prepare for the test of the next chip.
As shown in fig. 4, the conducting member 45 includes a plurality of test portions 452 and a sliding portion 453; the plurality of test parts 452 are uniformly laid at one end of the sliding part 453, which is close to the test piece 3; the second inclined surface 451 is a side surface of the sliding part 453 away from the test piece 3, the test part 452 can be a metal conducting piece, the sliding part 453 can be a sliding block, and a plurality of metal conducting pieces are sequentially connected to one end of the sliding block close to the test seat, so that when the sliding block moves towards the test seat, the metal conducting piece can be contacted with and conducted with the chip.
The second guiding holes are arranged on two sides of the sliding block, and the sliding block moves along the second guiding column to drive the metal conducting piece to slide so as to ensure stable conducting state with the chip.
In some embodiments, referring to fig. 3, the pusher mechanism 4 further includes a stop 46; the limiting piece 46 is provided with a limiting opening, the caliber of the limiting opening is matched with the height of the conducting piece 45, in the sliding process of the conducting piece 45, the conducting piece slides along the inner wall of the limiting opening, the limiting piece 46 can adopt an L-shaped limiting frame, the limiting frame is inversely fixed on the base 2, a gap between the limiting frame and the base 2 is separated by the limiting opening for the sliding block to move, the two limiting frames are arranged and are respectively positioned at two ends of the sliding block, and the sliding block is positioned in the two sliding openings.
The sliding block can not be separated from the two limiting openings and can only be matched with the second guide column to move along the limiting openings, so that the situation that the metal conducting piece cannot be accurately docked with a chip due to position deflection in the moving process of the sliding block is further avoided.
In some embodiments, referring to fig. 3, the pusher shoe 41 is further provided with a plurality of elastic parts 412, the elastic parts 412 may use an elastic compression spring, and the elastic compression spring has a plurality of setting positions, for example, is sleeved on the first guide post, and provides an upward rebound effect of the pusher shoe 41 by using the elastic compression spring, or the pusher shoe 41 is provided with a mounting groove 321, and the elastic compression spring is located in the mounting groove 321, so as to provide a rebound effect.
The elastic part 412 can provide rebound and reset actions of the pusher shoe 41, so that after the turnover piece 1 is lifted, the pusher shoe 41 loses the downward pressing action of the turnover piece 1 and is influenced by the rebound force of the elastic part 412, and is pushed upwards along the first guide piece 43 to reset, and the pusher shoe 41 is matched with the reset piece 42 to reset together, so that the thrust required by the reset piece 42 is reduced, and the reset stability of the pusher shoe 41 is ensured.
In some embodiments, referring to fig. 5, the turnover member 1 is further provided with a switching mechanism 5; the switching opening 12 is formed in the turnover piece 1, the switching mechanism 5 is located in the switching opening 12, the switching mechanism 5 is movably connected with the turnover piece 1, the switching mechanism 5 is used for switching chips, so that the chips can be tested in a next group of chips when the chips are tested, the next group of chips are mounted on the switching mechanism 5, after the chips are tested, the turnover piece 1 is lifted, the tested chips are turned to the side, far away from the base 2, of the turnover piece 1 by the aid of the switching mechanism 5, and the untested chips are turned to the side, close to the base 2, so that the chips of another group are tested.
In the testing process of the other group of chips, a worker or a user can detach the tested chips outside the turnover piece 1 and replace other untested chips, so that the whole process of replacing the tested chips is shortened, and the chip testing efficiency is improved.
Referring to fig. 6, the test piece 3 includes a fixing portion 31 and a mounting portion 32; the fixing part 31 is installed at the center of the base 2; the installation department 32 can dismantle with fixed part 31 and peg graft with shifter 5, fixed part 31 can adopt the fixing base, installation department 32 can adopt the mount pad, and detachable connected mode can be magnetic connection between mount pad and the fixing base, like electromagnetic connection, all set up the electro-magnet on the fixing base, the electro-magnet can inlay in the fixing base is inside, the mount pad can adopt magnetic material, like ferrous metal, when switch-on piece 45 removes to the chip, and switch on with the chip, the electro-magnet synchronous switch-on and switch on, the electro-magnet that switches on produces the magnetic force of mutual absorption with the mount pad, adsorb fixing base and mount pad each other together, in order to reach the effect of fixing each other with both, wherein, the magnetic strength of electro-magnet is adjustable, flip 1 can struggle the magnetic force and separate mount pad and fixing base when lifting.
When the conducting piece 45 is separated from the chip, the chip loses the conducting state, the electromagnet on the fixing seat and the electromagnet on the mounting seat synchronously breaks away from the conducting state, and the electromagnet losing the power supply loses magnetism.
Under the condition of setting up the electro-magnet, can need not to set up fixture block and hasp, because the mount pad is connected with upset piece 1, consequently utilize magnetism can fasten upset piece 1 in the fixing base, it is fixed with upset piece 1 and base 2 indirectly.
After the installation seat is separated from the fixing seat, the other end of the installation seat is spliced with the switching mechanism 5, specifically, a sliding groove is formed in the switching mechanism 5, one end, far away from the base 2, of the installation seat is matched with the sliding groove, and one end, far away from the base 2, of the installation seat can be inserted into the sliding groove, so that the installation seat is fixed on the switching mechanism 5.
Wherein, referring to fig. 7, two mounting seats can be provided, the front and rear ends of the switching mechanism 5 are respectively provided with a sliding groove, the two mounting seats can be respectively inserted into the sliding grooves at the front and rear ends of the switching mechanism 5, the two mounting seats can be simultaneously connected with two chips, the positions of the two mounting seats are switched through the switching mechanism 5, so that the mounting seat close to one end of the fixing seat and the chips connected with the mounting seat can be subjected to chip performance test when the turnover piece 1 is covered on the base 2, and the mounting seat at the other end of the turnover piece 1 can be taken out from the sliding grooves and replaced with the chips which are not tested, so that after the chip test is completed, the chips can be replaced stably only by switching the positions of the two mounting seats through the switching mechanism 5.
In the testing process of the untested chip, the tested chip can be detached and replaced by the switching mechanism 5, so that the testing flow is shortened, and the testing efficiency is improved.
Wherein, the corner of switching board is provided with the inclined plane, makes things convenient for the mount pad to pull or insert from sliding groove.
Wherein, referring to fig. 8, the mounting seat is provided with a mounting groove 321 for chip embedding, two ends of the notch of the mounting groove 321 are respectively provided with a clamping frame 33, the clamping frames 33 are L-shaped frames, the clamping frames 33 slide with the notch of the mounting groove 321, namely, a clamping interface 322 is further provided on the mounting seat, the clamping frames 33 can be positioned in the clamping interface 322 and can move along the clamping interface 322, and when the two clamping frames 33 can limit the chip in the mounting groove 321, so as to ensure the stability of the mounting position of the chip and avoid the chip from separating from the mounting groove 321.
In some embodiments, referring to fig. 5, the switching mechanism 5 includes a switching portion 51 and a rotating portion 52; the rotating part 52 is located in the switching port 12 and is movably connected with the wall surface at the switching port 12, the rotating part 52 can adopt a rotating shaft, both ends of the rotating shaft are located in the switching port 12 and can rotate along the switching port 12, specifically, two movable connecting holes can be formed in the wall surface in the switching port 12, both ends of the rotating shaft are inserted into the movable connecting holes, and the rotating shaft can rotate along the movable connecting holes and cannot be separated from the movable connecting holes.
The switching part 51 is installed in the rotating part 52, and the limiting groove 511 is formed in the surface of the switching part 51, the mounting part 32 is spliced with the switching part 51 through the limiting groove 511, the switching part 51 can adopt a switching plate, the switching plate is matched with the switching port 12 in size and dimension, the switching plate can rotate in the switching port 12 through a rotating shaft, two faces of the switching plate are switched, the limiting groove 511 formed in the switching plate can be used for inserting mounting seats, fixing mounting seats are formed in the limiting groove 511, two mounting seats are spliced, when the two mounting seats are connected with a chip, the switching plate is rotated, and the switching plate is used for switching the positions of the two mounting seats and the chip through the rotating shaft.
Referring to fig. 7, the abutting portion 11 is connected with the switching portion 51 and is located in the limiting groove 511, and the thickness of the plugging end of the mounting seat is smaller than the grooving depth of the limiting groove 511, so that the mounting seat can move back and forth along the limiting groove 511 after being inserted into the limiting groove 511, and meanwhile, the mounting seat can be pressed against the notch direction of the limiting groove 511 by the abutting portion 11, so that the mounting seat can be buffered and pressed by the abutting portion 11, when the mounting seat is pressed by the turnover piece 1, the stress of the chip when contacting the fixing seat is reduced, and the abutting portion 11 can adopt semicircular rubber particles.
Referring to fig. 9, the rotating portion 52 is further provided with a pushing portion 53, the pushing portion 53 may be a fixed ring with a plurality of anti-skidding patterns on the surface, the fixed ring is fixedly connected to the rotating shaft, and when the mounting seat on the switching plate needs to be replaced, the fixed ring can be rotated, so that the rotating shaft can be rotated without rotating the switching plate.
The fixing ring is arranged to be convenient for switching the positions of the mounting seat and the chip.
Referring to fig. 10, the turnover member 1 is further provided with a locking portion 54, the locking portion 54 is slidably connected with the turnover member 1, and when the locking portion 54 slides along the turnover member 1, the locking portion 54 moves to the switching port 12 and abuts against the switching portion 51, and the locking portion 54 may be a locking frame.
Specifically, the locking grooves 13 are formed in two sides of the switching port 12 on one side, far away from the base 2, of the turnover piece 1, the pushing frame is located in the locking grooves 13 and can move along the locking grooves 13, and the grooving length of the locking grooves 13 is longer than the length of the switching port 12, so that when the locking frame is located outside the switching port 12, the switching plate is not affected and can be switched through rotation of the rotating shaft, and when the locking frame moves to the surface of the switching port 12 along the locking grooves 13, the locking frame abuts against the switching plate and blocks the rotating path of the switching plate, and therefore the switching plate is located in the switching port 12.
The rotating path of the switching plate can be limited through the locking frame, the switching plate can be prevented from being deviated in the chip testing process, such as when the chip on the other mounting seat is dismounted, the testing result is inaccurate, and even the normal use of the subsequent chip is influenced, so that the switching plate can be locked by the locking frame when the chip is tested or replaced, and the test is more stable.
The application also provides a testing method of the chip, referring to fig. 11, which is applied to the one-key chip hand tester and comprises the following steps:
s100, core filling: the chip is loaded at the test piece 3.
The chip can be clamped on the test piece 3 by means of chip pins.
S200, cover mounting: the turnover piece 1 turns over along the base 2 and covers the base 2;
in the process of overturning the overturning piece 1 along the base 2, the abutting part 11 is driven to overturn to the surface of the chip together.
S300, pressing down: the turnover piece 1 is pressed downwards towards the base 2 and pushes the pushing mechanism 4, and meanwhile the abutting part 11 presses the chip.
After the turnover piece 1 is contacted with the surface of the chip, when the turnover piece is continuously pressed downwards towards the direction of the base 2, the pushing mechanism 4 is pushed, the conducting end of the pushing mechanism 4 moves towards the chip, and meanwhile, the abutting part 11 gradually applies pressure to the chip, so that the chip is pressed on the test piece 3.
S400, conducting: the pushing mechanism 4 pushes the conducting end to the chip under the action of pushing down, and the chip is contacted with the conducting end to conduct the chip.
When the conducting end is contacted with the chip, the chip is in a conducting state.
S500, testing: and after the chip is conducted, testing the performance of the chip.
S600, flip: after the test, the turnover part 1 is lifted,
When the turnover piece 1 is lifted along the base 2, the abutting end is separated from the chip, so that the chip loses the pressure.
S700, collecting: the chip is removed from the test piece 3 and replaced.
After the chip loses pressure, a new chip can be taken out from the test piece 3 or replaced.
When the switching mechanism 5 is provided in the flip 1, the core loading step is changed in S100.
S110, core filling: two sets of chips are mounted on the two mounting portions 32, and the mounting portions 32 are mounted on the flip 1.
Until S700, the collection step, the process is changed to S710, the switching step.
S710, switching: the mounting portion 32 is rotated and switched by the switching mechanism 5, the untested chip is rotated to the direction approaching the base 2, and steps S100 to S710 are repeated.
And when repeating the step S500 and the step of testing, adding the step S510 and the step of replacing the core.
S510, replacing the core: in the test process, the tested chip at one end of the switching mechanism 5 is taken out together with the mounting portion 32, and is loaded into another set of the mounting portion 32 and the untested chip.
The embodiments of the present application are all preferred embodiments of the present application, and are not intended to limit the scope of the present application, wherein like reference numerals are used to refer to like elements throughout. Therefore: all equivalent changes in structure, shape and principle of the application should be covered in the scope of protection of the application.

Claims (10)

1. The one-key chip hand tester is characterized by comprising a turnover piece (1), a base (2), a test piece (3) and a pushing mechanism (4); the turnover piece (1) is movably connected with the base (2), and an abutting part (11) is arranged on the turnover piece (1); the test piece (3) for placing chips is connected with the center of the base (2); the pushing mechanism (4) is provided with two groups which are respectively and oppositely arranged at two sides of the base (2), and the pushing mechanism (4) is provided with a sliding conducting end; when the turnover piece (1) presses down the pushing mechanism (4) along the base (2), the abutting part (11) abuts against the surface of the chip, and the turnover piece (1) synchronously pushes the conducting end to move towards the test piece (3) so that the chip is conducted and tested.
2. The one-touch chip hand tester according to claim 1, wherein the pushing mechanism (4) comprises a pushing member (41), a resetting member (42), a first guide member (43), a second guide member (44) and a conducting member (45); the plurality of first guide pieces (43) are arranged on the base (2), and the pushing pieces (41) are spliced with the first guide pieces (43); a side surface of the pushing part (41) close to the test part (3) is a first inclined surface (411); the second guide piece (44) penetrates through the test piece (3), and the conducting piece (45) is spliced with the second guide piece (44); a second inclined surface (451) is arranged on one side surface of the conducting piece (45) close to the pushing piece (41), and the first inclined surface (411) and the second inclined surface (451) are in contact with each other; the resetting piece (42) is sleeved on the second guide piece (44), one end of the resetting piece is connected with the conducting piece (45), and the other end of the resetting piece is connected with the testing piece (3).
3. A one-touch chip hand tester as claimed in claim 2, wherein said pushing mechanism (4) further comprises a stopper (46); and a limiting opening is formed in the limiting piece (46), and the caliber of the limiting opening is matched with the height of the conducting piece (45), so that the conducting piece (45) slides along the limiting opening in the sliding process.
4. The one-touch chip hand tester as recited in claim 2, wherein the conductive member (45) includes a plurality of test portions (452) and a slip portion (453); the plurality of test parts (452) are uniformly laid at one end, close to the test piece (3), of the sliding part (453); the second inclined surface (451) is a side surface of the sliding portion (453) away from the test piece (3).
5. A one-touch chip hand tester as claimed in claim 2, wherein the pusher shoe (41) is further provided with a plurality of resilient portions (412).
6. The one-key chip hand-measuring device according to claim 1, wherein the turning piece (1) is further provided with a switching mechanism (5); a switching port (12) is formed in the turnover piece (1), the switching mechanism (5) is positioned in the switching port (12), and the switching mechanism (5) is movably connected with the turnover piece (1); the test piece (3) comprises a fixing part (31) and a mounting part (32); the fixing part (31) is arranged at the center of the base (2); the chip is connected with the mounting part (32), and the mounting part (32) is detachably connected with the fixing part (31); the two mounting parts (32) are arranged, and the two mounting parts (32) are respectively connected with two ends of the switching mechanism (5) in a sliding mode.
7. The one-touch chip hand-held instrument according to claim 6, wherein the switching mechanism (5) comprises a switching portion (51) and a rotating portion (52); the rotating part (52) is positioned in the switching port (12) and is movably connected with the wall surface of the switching port (12); the switching part (51) is arranged on the rotating part (52), and a limiting groove (511) is formed in the surface of the switching part (51); the mounting part (32) is inserted into the switching part (51) through the limit groove (511).
8. The one-touch chip hand tester as recited in claim 7, wherein the rotating portion (52) is further provided with a pushing portion (53).
9. The one-touch chip hand tester according to any one of claims 7-8, wherein the flip-flop (1) is further provided with a locking portion (54); the locking part (54) is in sliding connection with the turnover piece (1), and in the sliding process, the locking part (54) moves to the switching port (12) and is abutted with the switching part (51).
10. A method for testing a chip, which is applied to the one-key chip hand tester of claim 1, comprising the following steps:
core mounting: the chip is loaded at the test piece (3);
and (3) cover mounting: the turnover piece (1) turns over along the base (2) and covers the base (2);
and (3) pressing: the turnover piece (1) is pressed downwards towards the base (2) and pushes the pushing mechanism (4), and meanwhile the abutting part (11) presses the chip tightly:
conducting: the pushing mechanism (4) pushes the conducting end to the chip under the action of pushing down, and the chip is contacted with the conducting end to conduct the chip;
and (3) testing: after the chip is conducted, testing the performance of the chip;
flip: the turnover piece (1) is lifted after the test is completed;
and (3) collecting: and taking out the chip from the test piece (3) for replacement.
CN202311414240.1A 2023-10-30 2023-10-30 One-key chip hand tester and testing method thereof Active CN117148118B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311414240.1A CN117148118B (en) 2023-10-30 2023-10-30 One-key chip hand tester and testing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311414240.1A CN117148118B (en) 2023-10-30 2023-10-30 One-key chip hand tester and testing method thereof

Publications (2)

Publication Number Publication Date
CN117148118A true CN117148118A (en) 2023-12-01
CN117148118B CN117148118B (en) 2024-02-02

Family

ID=88901098

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311414240.1A Active CN117148118B (en) 2023-10-30 2023-10-30 One-key chip hand tester and testing method thereof

Country Status (1)

Country Link
CN (1) CN117148118B (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101164089B1 (en) * 2011-06-22 2012-07-12 (주)기가레인 Socket for testing semiconductor chip
CN114624570A (en) * 2022-03-09 2022-06-14 深圳市天威达电子有限公司 High-efficient IC chip testing arrangement
CN217034162U (en) * 2022-02-15 2022-07-22 东莞利扬芯片测试有限公司 Anti-sticking test cover and test base for chip low-temperature test
CN115598504A (en) * 2022-10-27 2023-01-13 深圳国芯人工智能有限公司(Cn) Automatic change memory chip testing arrangement
CN218727528U (en) * 2022-11-24 2023-03-24 苏州京工机械科技有限公司 Semi-open chip aging test socket
CN218956645U (en) * 2022-12-07 2023-05-02 北臻(浙江)电子科技有限公司 Flip type chip test seat convenient to open
CN218974515U (en) * 2022-12-09 2023-05-05 苏州朗之睿电子科技有限公司 Flip type hand detector for chip test
CN219737695U (en) * 2023-04-13 2023-09-22 深圳市时创意电子有限公司 Test device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101164089B1 (en) * 2011-06-22 2012-07-12 (주)기가레인 Socket for testing semiconductor chip
CN217034162U (en) * 2022-02-15 2022-07-22 东莞利扬芯片测试有限公司 Anti-sticking test cover and test base for chip low-temperature test
CN114624570A (en) * 2022-03-09 2022-06-14 深圳市天威达电子有限公司 High-efficient IC chip testing arrangement
CN115598504A (en) * 2022-10-27 2023-01-13 深圳国芯人工智能有限公司(Cn) Automatic change memory chip testing arrangement
CN218727528U (en) * 2022-11-24 2023-03-24 苏州京工机械科技有限公司 Semi-open chip aging test socket
CN218956645U (en) * 2022-12-07 2023-05-02 北臻(浙江)电子科技有限公司 Flip type chip test seat convenient to open
CN218974515U (en) * 2022-12-09 2023-05-05 苏州朗之睿电子科技有限公司 Flip type hand detector for chip test
CN219737695U (en) * 2023-04-13 2023-09-22 深圳市时创意电子有限公司 Test device

Also Published As

Publication number Publication date
CN117148118B (en) 2024-02-02

Similar Documents

Publication Publication Date Title
KR100962702B1 (en) Integrated circuit test socket
KR102146731B1 (en) Carrier for test and carrier assembling apparatus
US6066957A (en) Floating spring probe wireless test fixture
JP2019527841A (en) Inspection device
CN116380388B (en) Bare chip vibration testing device
CN117148118B (en) One-key chip hand tester and testing method thereof
TWI613452B (en) Electronic component conveying device and electronic component inspection device
JP3001553B2 (en) Module IC loading / unloading device to / from module IC handler socket
TWM514004U (en) Integrated circuit inspection device and inspection equipment
CN108051731B (en) High-precision contact type auxiliary test fixture and working method thereof
JP2006080435A (en) Inspection device for circuit board
KR100257584B1 (en) Apparatus and method for setting height of z axis in wafer test system
CN109725180B (en) Jig platform
JPWO2006006248A1 (en) Electrical connection device
JP2004228042A (en) Socket for electric component
TWI344546B (en)
JPH0814611B2 (en) Inspection method and inspection device
CN215910751U (en) Display screen lighting jig
TWM546007U (en) Electrometric apparatus and probe circuit structure
CN221485535U (en) Top end limiting pressing mechanism
CN215953685U (en) Circuit board positioning and supporting jig and circuit board processing device
JPH0720622Y2 (en) Printed circuit board inspection jig
JP6685526B1 (en) Prober device and measuring jig
JP6415247B2 (en) Positioning jig and measuring jig
TW201814313A (en) Electrometric apparatus, electrometric method and probe circuit structure

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant