CN117141071A - Electromagnetic shielding film and production process thereof - Google Patents
Electromagnetic shielding film and production process thereof Download PDFInfo
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- CN117141071A CN117141071A CN202310886736.2A CN202310886736A CN117141071A CN 117141071 A CN117141071 A CN 117141071A CN 202310886736 A CN202310886736 A CN 202310886736A CN 117141071 A CN117141071 A CN 117141071A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- 239000010410 layer Substances 0.000 claims abstract description 112
- 229920001721 polyimide Polymers 0.000 claims abstract description 62
- 229910052751 metal Inorganic materials 0.000 claims abstract description 61
- 239000002184 metal Substances 0.000 claims abstract description 61
- 239000012790 adhesive layer Substances 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims abstract description 21
- 230000008569 process Effects 0.000 claims abstract description 16
- 239000011241 protective layer Substances 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 238000000576 coating method Methods 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 14
- 230000001681 protective effect Effects 0.000 claims description 11
- 238000009713 electroplating Methods 0.000 claims description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 8
- 238000003851 corona treatment Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 5
- 238000007788 roughening Methods 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 claims description 4
- 230000007797 corrosion Effects 0.000 claims description 4
- 150000001412 amines Chemical class 0.000 claims description 3
- 238000003486 chemical etching Methods 0.000 claims description 3
- 239000012286 potassium permanganate Substances 0.000 claims description 3
- 239000011247 coating layer Substances 0.000 claims 1
- 238000011161 development Methods 0.000 abstract description 3
- 238000004806 packaging method and process Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 239000008213 purified water Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 208000032365 Electromagnetic interference Diseases 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Thermal Sciences (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Abstract
The application relates to an electromagnetic shielding film and a production process thereof. The electromagnetic shielding film includes: the substrate insulating layer, the metal layer, the conductive adhesive layer and the protective layer are contacted in sequence; the substrate insulating layer comprises a coarsened polyimide film. According to the scheme provided by the application, the polyimide film is adopted to replace the traditional carrier layer and the traditional insulating layer, so that the production process can be simplified, the time is saved, the production efficiency is improved, and the automatic development process is improved; meanwhile, the problem that the metal layer is difficult to adhere to the polyimide film when the metal layer is directly electroplated on the polyimide film can be effectively solved by coarsening the polyimide film.
Description
Technical Field
The application relates to the technical field of electromagnetic shielding films, in particular to an electromagnetic shielding film and a production process thereof.
Background
Electromagnetic waves are the main way of electromagnetic energy propagation, and when the high-frequency circuit works, electromagnetic waves are radiated outwards, so that interference is generated to other adjacent devices. On the other hand, various electromagnetic waves in the space are also induced into the circuit, and cause interference to the circuit.
With the dramatic increase in the number of various wireless communication systems and high frequency electronic devices, electric appliances and electronic devices radiate a large amount of electromagnetic waves during use, and electromagnetic shielding is currently generally used to prevent electromagnetic interference (ElectromagneticInterference, EMI). The electromagnetic shielding is a shielding for reducing the penetration of an alternating electromagnetic field to a designated area by using a conductive material, and is generally formed by plating an electromagnetic shielding film on the outer layer of a shading film of electric appliances and electronic equipment, so that the electronic equipment is not interfered with other equipment and is not influenced by the other equipment. The electromagnetic shielding film is a light-transmitting shielding device capable of preventing electromagnetic radiation and electromagnetic interference, and relates to the fields of optics, electricity, metal materials, chemical raw materials, glass, machinery and the like, and is widely applied to precise flexible circuit boards of mobile phones, tablet computers, high-definition cameras and the like.
In the conventional production process, as shown in fig. 1, the original film (carrier layer) needs to be sequentially subjected to the steps of coating a release layer, coating an insulating layer, baking and curing, electroplating the metal layer, coating the conductive adhesive layer, attaching a protective film, cutting and packaging, warehousing and the like, wherein the carrier layer needs to be subjected to two coating processes, the insulating layer needs to be subjected to one coating process and then baked and cured, and the curing time needs to be different from 24 to 96 hours. The carrier layer and the insulating layer are very complex in manufacturing process, so that the production time required by the production of the electromagnetic shielding film by adopting the existing process is long, and the production efficiency is low.
Therefore, there is an urgent need to design an electromagnetic shielding film and a production process thereof, which can simplify the production process, save time, improve production efficiency, and further facilitate improvement of an automated development process when the electromagnetic shielding film is produced.
Disclosure of Invention
In order to overcome the problems in the related art, the application provides the electromagnetic shielding film and the production process thereof, which can simplify the production process, save time, improve the production efficiency and further be beneficial to improving the automatic development process.
The first aspect of the application provides an electromagnetic shielding film, comprising a substrate insulating layer, a metal layer, a conductive adhesive layer and a protective layer which are contacted in sequence;
the substrate insulating layer comprises a coarsened polyimide film.
In one embodiment, the polyimide film has a film thickness of 8 to 100um.
The second aspect of the present application provides a production process of an electromagnetic shielding film, which is used for producing the electromagnetic shielding film, and specifically comprises the following steps:
coarsening the polyimide film;
plating a metal layer on the surface of the roughened polyimide film;
coating a conductive adhesive layer on the surface of the metal layer;
and pasting a protective film on the surface of the conductive adhesive layer.
In one embodiment, the roughening treatment of the polyimide film comprises:
and carrying out corona treatment or chemical corrosion treatment on the polyimide film.
In one embodiment, the corona output of the corona treatment is in the range of 0.1 to 10KW.
In one embodiment, the chemical etching treatment comprises: the polyimide film is soaked in the treatment liquid, and the film-moving speed is set to be 0.5-20m/min.
In one embodiment, the treatment fluid comprises any one of sodium hydroxide, potassium permanganate, and an organic amine solution.
In one embodiment, the surface metallization of the roughened polyimide film comprises:
electroplating a first metal layer on the surface of the polyimide film, and then electroplating a second metal layer on the surface of the first metal layer;
the thickness of the first metal layer is smaller than the thickness of the second metal layer.
In one embodiment, the first metal layer has a thickness of 0.1um and the second metal layer has a thickness of 0.5-3um.
In one embodiment, the thickness of the conductive adhesive layer is 2-50um.
Compared with the prior art, the technical scheme provided by the application can have the following beneficial effects:
(1) When the electromagnetic shielding film is produced, the polyimide film is adopted to replace the traditional carrier layer and insulating layer, and has good mechanical property and stability, the strength is enough to support the metal layer, the conductive adhesive layer and the protective layer, the polyimide film has good insulating property, the metal layer can be protected from short circuit caused by exposure, meanwhile, the heat-resistant temperature of the polyimide film can reach 400 ℃, the requirement of 280-300 ℃ on the heat-resistant temperature of the insulating layer is effectively met, in an actual use scene, the polyimide film is adopted to replace the traditional carrier layer and insulating layer, and after the electromagnetic shielding film is attached to a flexible circuit board and pressed by a hot press, the carrier layer stripping process is not needed, so that the process and time are effectively saved, and the efficiency is improved.
(2) Through coarsening the polyimide film, the problem that the metal layer is difficult to be adhered to the polyimide film when the metal layer is directly electroplated on the polyimide film can be effectively solved, and other auxiliary layers are not required to be additionally added so that the metal layer can be electroplated on the polyimide film.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application as claimed.
Drawings
The foregoing and other objects, features and advantages of the application will be apparent from the following more particular descriptions of exemplary embodiments of the application as illustrated in the accompanying drawings wherein like reference numbers generally represent like parts throughout the exemplary embodiments of the application.
Fig. 1 is a flow chart of a conventional electromagnetic shielding film production process;
fig. 2 is a schematic structural view of an electromagnetic shielding film according to an embodiment of the present application;
FIG. 3 is a schematic flow chart of a process for producing an electromagnetic shielding film according to an embodiment of the present application;
fig. 4 is a flow chart of a production process of an electromagnetic shielding film shown in an embodiment of the present application.
And (5) appendage marking:
1. a base insulating layer; 2. a metal layer; 3. a conductive adhesive layer; 4. and (3) a protective layer.
Detailed Description
Preferred embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.
It should be understood that although the terms "first," "second," "third," etc. may be used herein to describe various information, these information should not be limited by these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the application. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the conventional production process, as shown in fig. 1, the original film (carrier layer) needs to be sequentially subjected to the steps of coating a release layer, coating an insulating layer, baking and curing, electroplating the metal layer, coating the conductive adhesive layer, attaching a protective film, cutting and packaging, warehousing and the like, wherein the carrier layer needs to be subjected to two coating processes, the insulating layer needs to be subjected to one coating process and then baked and cured, and the curing time needs to be different from 24 to 96 hours. The carrier layer and the insulating layer are very complex in manufacturing process, so that the production time required by the production of the electromagnetic shielding film by adopting the existing process is long, and the production efficiency is low.
In view of the above problems, the embodiment of the application provides an electromagnetic shielding film, which can replace the traditional carrier layer and insulating layer by adopting a polyimide film, and can simplify the production process, save time and improve the production efficiency under the condition of meeting the performance requirements of a substrate layer and the insulating layer.
The following describes the technical scheme of the embodiment of the present application in detail with reference to the accompanying drawings.
Example 1
Referring to fig. 2, fig. 2 is a schematic structural diagram of an electromagnetic shielding film according to an embodiment of the application.
The electromagnetic shielding film comprises a substrate insulating layer, a metal layer, a conductive adhesive layer and a protective layer which are contacted in sequence; the substrate insulating layer comprises a coarsened polyimide film, the heat-resistant temperature of polyimide is more than or equal to 400 ℃, the type of polyimide resin is sp-f1, and the type of polyimide resin is preferably provided by DuPont company in U.S.
The metal layer is arranged on the base insulating layer, the metal layer comprises copper, the thickness of the copper layer is 0.6-3.1um, the metal layer is arranged on the base insulating layer in a film plating mode, and the film plating mode is preferably magnetron sputtering.
A conductive adhesive layer is arranged on the metal layer, and the conductive adhesive layer comprises resin and conductive materials; the resin comprises one or more of acrylic resin, epoxy resin and polyurethane, and the conductive material comprises one or more of metal and/or conductive high polymer material; the thickness of the conductive adhesive layer is 2-50um.
The protective layer (namely, the protective film) is arranged on the conductive adhesive layer, the protective layer is a PET release film layer, and the PET release film layer is a single-sided silicone oil release film layer.
In order to avoid that the polyimide film has a too small thickness, insufficient strength to support the metal layer, the conductive adhesive layer and the protective layer, or a too large thickness, affecting the optical characteristics of the electromagnetic shielding film, the polyimide film preferably has a thickness of 8-100um.
In the first embodiment, the polyimide film is adopted to replace the traditional carrier layer and insulating layer when the electromagnetic shielding film is produced, and the polyimide film has good mechanical property and stability, so that the strength is enough to support the metal layer, the conductive adhesive layer and the protective layer, the polyimide film has good insulating property, the metal layer can be protected from the short circuit phenomenon caused by exposure, meanwhile, the heat-resistant temperature of the polyimide film can reach 400 ℃, the requirement on the insulating layer for 280-300 ℃ is effectively met, in an actual use scene, the traditional carrier layer and insulating layer are replaced by the polyimide film, and after the electromagnetic shielding film is attached to the flexible circuit board through the hot press, the carrier layer stripping procedure is not needed, so that the procedure and time are effectively saved, and the efficiency is improved. Furthermore, by using the roughened polyimide film, the problem that the metal layer is difficult to adhere to the polyimide film when the metal layer is directly electroplated on the polyimide film can be effectively solved, and other auxiliary layers are not required to be additionally added so that the metal layer can be electroplated on the polyimide film.
Example two
Correspondingly, on the basis of the structure of the first embodiment, the application also provides a production process of the electromagnetic shielding film, which is used for producing the electromagnetic shielding film, and referring to fig. 3-4, the production process specifically comprises the following steps:
s1, coarsening the polyimide film.
In S1, carrying out surface roughening treatment on a polyimide film, wherein the film thickness of the polyimide film is 8-100um, the roughening treatment comprises corona treatment or chemical corrosion treatment, and specifically, the corona treatment comprises: and placing the polyimide film on a corona machine, and setting the corona output power of the corona machine to be 0.1-10KW, wherein the specific corona output power can be determined according to the film thickness and the surface tension of the polyimide film. The chemical etching treatment includes: immersing the polyimide film in a treatment liquid, wherein the treatment liquid comprises any one of sodium hydroxide, potassium permanganate and organic amine solution; the film feeding speed of the polyimide film is set to be 0.5-20m/min, and the specific film feeding speed can be determined according to the film thickness of the polyimide film and the length of the treatment tank. After the chemical corrosion treatment is finished, the polyimide film is cleaned by purified water and dried.
S2, plating a metal layer on the surface of the roughened polyimide film.
In S2, a metal layer is plated on the surface of the roughened polyimide film, where the metal layer includes metallic copper, and preferably, a magnetron sputtering method is used to perform film plating, and the method includes: electroplating a first metal layer on the surface of the polyimide film, and then electroplating a second metal layer on the surface of the first metal layer; the thickness of the first metal layer is smaller than that of the second metal layer, specifically, the thickness of the first metal layer is 0.1um, the thickness of the second metal layer is 0.5-3um, it is required to be noted that the thickness of the metal layer can be determined according to the required shielding and conducting performance requirements, and after the second metal layer is plated by water, the polyimide film is cleaned by purified water and dried.
S3, coating a conductive adhesive layer on the surface of the metal layer;
in S3, after the metal plating layer is completed on the polyimide film, a conductive adhesive layer is coated on the metal layer, where the thickness of the conductive adhesive layer is 2-50um, and the thickness of the specific conductive adhesive layer may be determined according to the conduction performance and the glue filling performance.
S4, laminating a protective film on the surface of the conductive adhesive layer.
In S4, after the coating of the conductive adhesive layer is completed, a protective film is attached to the conductive adhesive layer to protect the adhesive surface, the protective film is a PET release film, and after the attachment of the protective film, the product is cut and packaged, and is stored in a warehouse.
In the embodiment of the application, compared with the traditional production process, the steps of coating a release layer, coating an insulating layer, baking and curing, electroplating a metal layer, coating a conductive adhesive layer, attaching a protective film, slitting and packaging, warehousing and the like are sequentially carried out on an original film (carrier layer), and according to the scheme of the application, as shown in fig. 4, the production of the electromagnetic shielding film can be completed only by sequentially carrying out the steps of roughening treatment, electroplating the metal layer, coating the conductive adhesive layer, attaching the protective film, slitting and packaging, warehousing and the like on the polyimide film, so that the production process is greatly simplified, the efficiency is improved, and the automation process is accelerated.
The aspects of the present application have been described in detail hereinabove with reference to the accompanying drawings. In the foregoing embodiments, the descriptions of the embodiments are focused on, and for those portions of one embodiment that are not described in detail, reference may be made to the related descriptions of other embodiments. Those skilled in the art will also appreciate that the acts and modules referred to in the specification are not necessarily required for the present application. In addition, it can be understood that the steps in the method of the embodiment of the application can be sequentially adjusted, combined and deleted according to actual needs.
The functions noted in the flowcharts and block diagrams in the figures may also occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved.
The foregoing description of embodiments of the application has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the various embodiments described. The terminology used herein was chosen in order to best explain the principles of the embodiments, the practical application, or the improvement of technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
Claims (10)
1. An electromagnetic shielding film, characterized in that: comprises a basal body insulating layer, a metal layer, a conductive adhesive layer and a protective layer which are contacted in sequence;
the substrate insulating layer comprises a coarsened polyimide film.
2. The electromagnetic shielding film according to claim 1, wherein:
the thickness of the polyimide film is 8-100um.
3. The production process of the electromagnetic shielding film is characterized by comprising the following steps of: electromagnetic shielding film according to any of claims 1-2, in particular comprising the steps of:
coarsening the polyimide film;
plating a metal layer on the surface of the roughened polyimide film;
coating a conductive adhesive layer on the surface of the metal layer;
and pasting a protective film on the surface of the conductive adhesive layer.
4. A process for producing an electromagnetic shielding film according to claim 3, wherein:
the roughening treatment of the polyimide film comprises the following steps:
and carrying out corona treatment or chemical corrosion treatment on the polyimide film.
5. The process for producing an electromagnetic shielding film according to claim 4, wherein:
the corona output power of the corona treatment is 0.1-10KW.
6. The process for producing an electromagnetic shielding film according to claim 4, wherein:
the chemical etching treatment includes: the polyimide film is soaked in the treatment liquid, and the film-moving speed is set to be 0.5-20m/min.
7. The process for producing an electromagnetic shielding film according to claim 6, wherein:
the treatment liquid comprises any one of sodium hydroxide, potassium permanganate and organic amine solution.
8. A process for producing an electromagnetic shielding film according to claim 3, wherein:
the surface metal coating layer of the coarsened polyimide film comprises:
electroplating a first metal layer on the surface of the polyimide film, and then electroplating a second metal layer on the surface of the first metal layer;
the thickness of the first metal layer is smaller than the thickness of the second metal layer.
9. The process for producing an electromagnetic shielding film according to claim 8, wherein:
the thickness of the first metal layer is 0.1um, and the thickness of the second metal layer is 0.5-3um.
10. A process for producing an electromagnetic shielding film according to claim 3, wherein:
the thickness of the conductive adhesive layer is 2-50um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202310886736.2A CN117141071A (en) | 2023-07-19 | 2023-07-19 | Electromagnetic shielding film and production process thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310886736.2A CN117141071A (en) | 2023-07-19 | 2023-07-19 | Electromagnetic shielding film and production process thereof |
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| CN202310886736.2A Pending CN117141071A (en) | 2023-07-19 | 2023-07-19 | Electromagnetic shielding film and production process thereof |
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