CN117127238A - Intelligent electroplating material supply device and method for diamond wire bus production - Google Patents
Intelligent electroplating material supply device and method for diamond wire bus production Download PDFInfo
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- CN117127238A CN117127238A CN202311109049.6A CN202311109049A CN117127238A CN 117127238 A CN117127238 A CN 117127238A CN 202311109049 A CN202311109049 A CN 202311109049A CN 117127238 A CN117127238 A CN 117127238A
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- 238000009713 electroplating Methods 0.000 title claims abstract description 132
- 239000000463 material Substances 0.000 title claims abstract description 111
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 26
- 239000010432 diamond Substances 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000007788 liquid Substances 0.000 claims abstract description 178
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 139
- 229910001431 copper ion Inorganic materials 0.000 claims abstract description 116
- 239000003792 electrolyte Substances 0.000 claims abstract description 80
- 238000010438 heat treatment Methods 0.000 claims abstract description 29
- 238000002955 isolation Methods 0.000 claims abstract description 8
- 229910000831 Steel Inorganic materials 0.000 claims description 41
- 239000010959 steel Substances 0.000 claims description 41
- 238000007599 discharging Methods 0.000 claims description 39
- 238000003756 stirring Methods 0.000 claims description 18
- 239000000243 solution Substances 0.000 claims description 16
- 238000007747 plating Methods 0.000 claims description 13
- 230000008569 process Effects 0.000 claims description 13
- 238000012544 monitoring process Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000012811 non-conductive material Substances 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- 230000001376 precipitating effect Effects 0.000 claims description 4
- 238000004804 winding Methods 0.000 claims description 4
- 210000001503 joint Anatomy 0.000 claims 1
- 239000011259 mixed solution Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 238000005086 pumping Methods 0.000 abstract description 3
- 229910021645 metal ion Inorganic materials 0.000 description 11
- 230000001502 supplementing effect Effects 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 6
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000013589 supplement Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910001566 austenite Inorganic materials 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to an intelligent electroplating material replenishing device and method for diamond wire bus production; the inner wall of the top of the electroplating tank is provided with a first electronic liquid level meter, the inner wall of the electroplating tank below the first electronic liquid level meter is fixedly provided with a copper ion concentration measuring instrument, the outer side of the electroplating tank is provided with a control cabinet, a controller is arranged in the control cabinet, the first electronic liquid level meter is connected with the controller through a liquid level meter connector, the first copper ion concentration measuring instrument is connected with the controller through a concentration measuring instrument connector, the bottom of the control cabinet is provided with a heating isolation cavity, an electric heater connected with the controller is arranged in the heating isolation cavity, and the outer side of the control cabinet is provided with a material intelligent supply device matched with the electric heater, the liquid level meter connector and the concentration measuring instrument connector; the liquid high-concentration copper ion electrolyte in the material replenishing tank is subjected to material replenishing operation under the accurate control of the electronic liquid flowmeter in a pumping mode, so that the intelligent degree is high, and the automation degree is high.
Description
Technical Field
The invention relates to the field of diamond wire bus machining, in particular to an intelligent electroplating material supply device and method for diamond wire bus production.
Background
Diamond wire is an abbreviation for diamond cut line, also known as diamond cut line or diamond wire. The diamond wire is produced through a plurality of steps of a bus, first, the bus is required to be subjected to one-stage or multi-stage drawing operation, then, the surface recovery operation is carried out through a series of quenching and pickling processes, the effective formation of austenite is ensured, after the pickling operation is carried out, the electroplating operation is required to be carried out on the steel wire, and at present, copper particles or anode plates are adopted to carry out the electroplating operation on the steel wire in an electroplating tank filled with electrolytic liquid. Electroplating is implemented by utilizing the cathode action of a cathode rod and a steel wire and matching copper particles or anode plates through the connection of a rectifier. In this process, the plating efficiency is determined by bath temperature, concentration, metal ion concentration, current density, anode surface quality, cathode efficiency, flow rate, etc. During the electroplating process, the soluble anode or insoluble anode is worn, and part of copper ions and electrolyte are carried away by the steel wire in and out of the electroplating solution, so that the electrolyte is continuously worn.
Electrolyte and reduced copper ions are required to be continuously supplemented in the electroplating process, the traditional method is to implement the adding operation of electrolyte and metal ions with specific concentrations in a liquid level observation mode, the concentration in the whole electrolyte cannot be monitored in the adding process, the concentration of the added metal ions is changed after being mixed with the original ions in an electrolytic tank, when the concentration of the metal ions is different from a preset concentration value, the electroplating operation on the surface of a steel wire is affected, the concentration change in the electroplating tank in the traditional electroplating process is not effectively monitored, meanwhile, the concentration change after the metal ions are added or after the electrolyte is not easily monitored, a scientific and effective supplementing device and method for the supplementing operation of the electrolyte and the metal ions are lacked, and the metal ions and the electrolyte in the electroplating tank can not be guaranteed to be always kept at high-efficiency preset values in the electroplating process, so that the electroplating efficiency is reduced.
Therefore, the intelligent electroplating material replenishing device and method for producing the diamond wire bus, which are simple in structure, convenient to operate, high in automation degree, scientific and effective in adding mode, high in intelligent degree, capable of monitoring the liquid level of the electrolyte and the concentration of the metal ions effectively in real time, and capable of always keeping the concentration of the electrolyte and the concentration of the metal ions in the electroplating tank within preset values by adopting effective adding control operation, have wide market prospects.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the intelligent electroplating material replenishing device and method for producing the diamond wire bus, which have the advantages of simple structure, convenient operation, high automation degree, scientific and effective adding mode, high intelligent degree, effective electrolyte liquid level and metal ion concentration monitoring in real time, effective adding control operation, capability of always keeping the electrolyte and metal ion concentration in an electroplating tank within preset values, simple and efficient method, and is used for overcoming the defects in the prior art.
The technical scheme of the invention is realized as follows: the utility model provides an intelligent electroplating material feeding device of buddha's warrior attendant line generating line production, includes electroplating bath, feeding rubber roll, ejection of compact rubber roll, sets up the plating solution in the electroplating bath, and the steel wire of flooding in the plating solution, with steel wire contact support's feeding cathode roll and ejection of compact cathode roll, set up the copper ion group in the plating solution, seal the rectifier that sets up in electroplating bath bottom of the pool, the top inner wall of electroplating bath install first electron level gauge, electroplating bath inner wall fixed mounting in first electron level gauge below has copper ion concentration measuring apparatu, is provided with the switch board in the electroplating bath outside, is provided with the controller in the switch board, first electron level gauge is connected with the controller through the level gauge connector, is provided with the heating isolation chamber in the bottom of switch board, installs the electric heater that is connected with the controller in the heating isolation chamber, is provided with the intelligent material feeding device that cooperatees with electric heater, level gauge connector and concentration gauge connector in the outside of switch board.
The intelligent material replenishing device comprises a material replenishing tank fixedly arranged on the outer side of a control cabinet, a heating cavity is formed in the bottom of the material replenishing tank, a heating coil pipe connected with an electric heater is arranged in the heating cavity, a liquid high-concentration copper ion electrolyte is filled in the material replenishing tank on the upper portion of the heating cavity, a second electronic liquid level meter matched with a liquid level meter connector is arranged on the upper portion of an inner cavity of the material replenishing tank, a second copper ion concentration measuring instrument matched with the concentration measuring instrument connector is arranged on the inner wall of the material replenishing tank below the second electronic liquid level meter, a stirring shaft is arranged on one side of the second copper ion concentration measuring instrument, a suction pipe is arranged in the liquid high-concentration copper ion electrolyte arranged on the outer side of the material replenishing tank, the upper portion of the suction pipe is communicated with a suction pump arranged on the top of the material replenishing tank, the suction pump is communicated with the top of the electroplating tank through a replenishing pipe, an electronic liquid flow meter, the suction pump and the electronic liquid flow meter and the suction pump and the reduction motor are connected with a controller through wires.
The electroplating tank is of a rectangular cavity structure, the control cabinet is of a rectangular cavity structure, the height of the electroplating tank is not lower than that of the control cabinet, an electroplating tank transparent observation window is arranged on the side wall of the electroplating tank, the bottom of the electroplating tank transparent observation window is arranged at the lower position of the feeding cathode roller and the discharging cathode roller, a steel wire extends from the top of the feeding rubber roller to the bottom of the feeding cathode roller and extends from the bottom of the feeding cathode roller to the bottom of the discharging cathode roller, the setting heights of the feeding cathode roller and the discharging cathode roller are the same, the other end of the steel wire extends from the bottom of the discharging cathode roller to the top of the discharging rubber roller, and the feeding rubber roller and the discharging rubber roller are made of non-conductive materials.
The copper ion group is a soluble anode copper particle or an insoluble anode plate, the feeding cathode roller and the discharging cathode roller are arranged in the electroplating pool through conductive brackets, the conductive brackets are electrically connected with a rectifier, and the rectifier is electrically connected with a controller.
The upper portion of first electron level gauge be provided with first bracket connection spare, the bottom of first bracket connection spare is connected with the level gauge connector, is provided with the touch-control display that is connected with the controller in the outside of switch board.
The bottom of the first electronic liquid level meter is positioned above the feeding cathode roller and the discharging cathode roller, and the setting position of the first copper ion concentration measuring instrument is positioned below the feeding cathode roller and the discharging cathode roller.
The material supply tank is of a cuboid cavity structure, the height of the material supply tank is equal to that of the control cabinet, a material supply observation window is arranged on the outer wall of the material supply tank, and the bottom of the material supply observation window is flush with the bottom of the suction pipe.
The top of the material replenishing tank is provided with a liquid injection port and an alarm connected with the controller, the liquid high-concentration copper ion electrolyte is mixed liquid prepared by mixing the electrolyte and the high-concentration copper ion electrolyte, the second electronic liquid level meter is connected with the liquid level meter connector through a second bracket connecting piece, the bottom of the second electronic liquid level meter is level with the bottom of the suction pipe, and the setting position of the second copper ion concentration measuring instrument is located at the upper position of the middle part of the inner cavity of the material replenishing tank.
The stirring shaft is transversely arranged in the liquid high-concentration copper ion electrolyte on the inner wall of the material supplying pool.
The intelligent material replenishing method of the intelligent electroplating material replenishing device for the diamond wire bus production comprises the following steps:
s1, winding wires from the top of a feeding rubber roll to the bottoms of a feeding cathode roll and a discharging cathode roll, then leading out wires from the top of the discharging rubber roll, immersing the wires wound to the bottoms of the feeding cathode roll and the discharging cathode roll into electroplating liquid, and carrying out electroplating operation of copper ion groups on the surfaces of the wires through control of a rectifier;
s2, in the process of electroplating the steel wire, a first electronic liquid level meter and a first copper ion concentration measuring instrument continuously monitor the liquid level of the electroplating liquid and the concentration of a copper ion group in the electroplating tank, when the liquid level of the electroplating liquid or the concentration of the copper ion group is lower than a set value, a controller starts a suction pump, the suction pump conveys the liquid high-concentration copper ion electrolyte in the material replenishing tank to the electroplating tank through a replenishing pipe, an electronic liquid flowmeter measures the conveyed liquid amount and transmits measurement information to the controller, and when the first electronic liquid level meter and the first copper ion concentration measuring instrument monitor that the liquid level of the electroplating liquid in the electroplating tank and the concentration of the copper ion group reach preset values, the suction pump is closed;
s3, a second electronic liquid level meter and a second copper ion concentration measuring instrument which are arranged in the material replenishing tank continuously monitor the liquid level and concentration of the liquid high-concentration copper ion electrolyte in the replenishing tank, meanwhile, the controller intermittently starts the electric heater to heat the heating coil, heat is transmitted to the liquid high-concentration copper ion electrolyte through the heating cavity and is used for keeping the preset temperature of the liquid high-concentration copper ion electrolyte, and when the suction pump operates in each suction operation, the controller simultaneously starts the speed reducing motor to drive the stirring shaft to stir the liquid high-concentration copper ion electrolyte so as to prevent copper ions from precipitating;
s4, when the liquid high-concentration copper ion electrolyte replenishing operation is carried out on the electroplating pool, the second copper ion concentration measuring instrument measures the concentration of the liquid high-concentration copper ion electrolyte in real time, operation is carried out according to the concentration of copper ions in the electrolyte detected by the first copper ion concentration measuring instrument, and finally replenishing operation of the preset electrolyte concentration is carried out through the controller and the electronic liquid flowmeter, when the liquid amount of the liquid high-concentration copper ion electrolyte in the material replenishing pool is lower than the early warning position of the second electronic liquid level meter, the controller starts the alarm, and then the external liquid high-concentration copper ion electrolyte carries out material replenishing on the material replenishing pool through the liquid injection port.
The invention has the following positive effects:
firstly, the electroplating operation of the steel wire is implemented through the electroplating tank, and in order to supplement the electroplating solution carried out by the steel wire and the continuously consumed copper ions during the electroplating operation, the intelligent material supplementing device is adopted to supplement the electroplating solution, so that the monitoring of the electroplating concentration and the liquid level in the electroplating tank is realized, the supplementing operation can be carried out according to the concentration of the preset electroplating solution, and the replenishing operation of the material is implemented by pumping the liquid high-concentration copper ion electrolyte in the material supplementing tank under the accurate control of the electronic liquid flowmeter.
Secondly, concentration and liquid level implementation of the liquid high-concentration copper ion electrolyte in the material replenishment tank are monitored, early warning information is sent out, the replenishment operation is reminded to be carried out on the liquid high-concentration copper ion electrolyte, sufficient of the liquid high-concentration copper ion electrolyte is guaranteed, meanwhile, uneven feeding caused by precipitation can not occur in the liquid high-concentration copper ion electrolyte during each pumping and replenishment process through starting of a heating coil and a stirring shaft, and optimal electroplating requirements are guaranteed when the steel wire electroplating operation is carried out in cooperation with a first copper ion concentration measuring instrument and a first electronic liquid level meter.
And thirdly, the intelligent monitoring and supplying operation is implemented without manual observation, the intelligent electroplating operation in the diamond wire preparation process can be realized, the optimal copper ion supplying operation and the optimal electroplating liquid supplying operation are implemented through calculation by utilizing the bidirectional liquid level and concentration monitoring, the intelligent degree of the operation method is high, excessive manual intervention is not needed, the sufficient supplying materials are only required to be ensured, and the whole operation efficiency is high and convenient.
Drawings
Fig. 1 is a schematic diagram of a front view structure of the present invention.
Fig. 2 is a schematic diagram of the internal structure of fig. 1 according to the present invention.
Fig. 3 is a schematic diagram of the left-view internal structure of the present invention.
Fig. 4 is a right-side view of a partial internal structure of the present invention.
Fig. 5 is a right-side view of the internal structure of the present invention.
Detailed Description
As shown in fig. 1, 2, 3, 4 and 5, the intelligent electroplating material supplementing device for producing the diamond wire bus comprises an electroplating tank 1, a feeding rubber roller 4 and a discharging rubber roller 5, an electroplating liquid 33 arranged in the electroplating tank 1, a steel wire 9 immersed in the electroplating liquid 33, a feeding cathode roller 7 and a discharging cathode roller 8 which are supported in contact with the steel wire 9, a copper ion group 26 arranged in the electroplating liquid 33, a rectifier 27 arranged at the bottom of the electroplating tank 1 in a sealing manner, a first electronic liquid level meter 24 arranged on the inner wall of the top of the electroplating tank 1, a copper ion concentration measuring instrument 25 fixedly arranged on the inner wall of the electroplating tank 1 below the first electronic liquid level meter 24, a control cabinet 2 arranged outside the electroplating tank 1, a controller 23 arranged in the control cabinet 2, the first electronic liquid level meter 24 connected with the controller 23 through a liquid level meter connector 34, a heating isolation cavity 36 arranged at the bottom of the control cabinet 2, an electric heater 22 connected with the controller 22 arranged in the heating isolation cavity 36, and an intelligent material supplementing device connected with the electric heater 22 arranged outside the controller 22 and the electric heater 34. The intelligent material replenishing device comprises a material replenishing tank 3 fixedly arranged on the outer side of a control cabinet 2, a heating cavity 31 is arranged at the bottom of the material replenishing tank 3, a heating coil 21 connected with an electric heater 22 is arranged in the heating cavity 31, a liquid high-concentration copper ion electrolyte 32 is filled in the material replenishing tank 3 at the upper part of the heating cavity 31, a second electronic liquid level meter 19 matched with a liquid level meter connector 34 is arranged at the upper part of an inner cavity of the material replenishing tank 3, a second copper ion concentration measuring instrument 28 matched with a concentration measuring instrument connector 35 is arranged on the inner wall of the material replenishing tank 3 below the second electronic liquid level meter 19, a stirring shaft 20 is arranged on one side of the second copper ion concentration measuring instrument 28, the stirring shaft 20 is connected with a speed reducing motor 18 arranged on the outer side of the material replenishing tank 3, a suction pipe 13 is arranged in the liquid high-concentration copper ion electrolyte 32 between the stirring shaft 20 and the second copper ion concentration measuring instrument 28, the upper part of the suction pipe 13 is communicated with a suction pump 12 arranged at the top of the material replenishing tank 3, the suction pump 12 is communicated with the top of the tank 1 through a replenishing pipe 10, the suction pipe 10 is arranged on the top of the material replenishing tank 1, and the suction pipe is connected with a liquid flowmeter 11 through a liquid flowmeter 11 and a liquid flowmeter 11.
The electroplating tank 1 is of a rectangular cavity structure, the control cabinet 2 is of a rectangular cavity structure, the height of the electroplating tank 1 is not lower than that of the control cabinet 2, an electroplating tank transparent observation window 6 is arranged on the side wall of the electroplating tank 1, the bottom of the electroplating tank transparent observation window 6 is arranged at the lower positions of a feeding cathode roller 7 and a discharging cathode roller 8, a steel wire 9 extends from the top of the feeding cathode roller 4 to the bottom of the feeding cathode roller 7 and from the bottom of the feeding cathode roller 7 to the bottom of the discharging cathode roller 8, the setting heights of the feeding cathode roller 7 and the discharging cathode roller 8 are the same, the other end of the steel wire 9 extends from the bottom of the discharging cathode roller 8 to the top of the discharging rubber roller 5, and the feeding rubber roller 4 and the discharging rubber roller 5 are made of non-conductive materials. The copper ion group 26 is a soluble anode copper particle or an insoluble anode plate, the feeding cathode roller 7 and the discharging cathode roller 8 are arranged in the electroplating pool 1 through conductive brackets, the conductive brackets are electrically connected with the rectifier 27, the rectifier 27 is electrically connected with the controller 23, a first bracket connecting piece 29 is arranged on the upper part of the first electronic liquid level meter 24, the bottom of the first bracket connecting piece 29 is connected with a liquid level meter connector 34, and a touch display 14 connected with the controller 23 is arranged on the outer side of the control cabinet 2. The bottom of the first electronic liquid level meter 24 is located above the feeding cathode roller 7 and the discharging cathode roller 8, and the setting position of the first copper ion concentration measuring instrument 25 is located below the feeding cathode roller 7 and the discharging cathode roller 8.
The material supply tank 3 is of a cuboid cavity structure, the height of the material supply tank 3 is equal to that of the control cabinet 2, a material supply observation window 15 is arranged on the outer wall of the material supply tank 3, and the bottom of the material supply observation window 15 is flush with the bottom of the suction pipe 13. The top of the material supplying pool 3 is provided with a liquid injection port 16 and an alarm 17 connected with a controller 23, a liquid high-concentration copper ion electrolyte 32 is a mixed liquid prepared by mixing the electrolyte and the high-concentration copper ion electrolyte, a second electronic liquid level meter 19 is connected with a liquid level meter connector 34 through a second bracket connecting piece 30, the bottom of the second electronic liquid level meter 19 is level with the bottom of the suction pipe 13, and the setting position of a second copper ion concentration measuring instrument 28 is located at the upper position of the middle part of the inner cavity of the material supplying pool 3. The stirring shaft 20 is transversely arranged in the liquid high-concentration copper ion electrolyte 32 on the inner wall of the material replenishing tank 3.
Example 1: an intelligent material replenishing method for an intelligent electroplating material replenishing device for diamond wire bus production comprises the following steps: the steel wire 9 is wound from the top of the feeding rubber roll 4 to the bottoms of the feeding cathode roll 7 and the discharging cathode roll 8, and then is led out from the top of the discharging rubber roll 5, the steel wire wound to the bottoms of the feeding cathode roll 7 and the discharging cathode roll 8 is immersed into the electroplating solution 33, and the electroplating operation of the copper ion group 26 on the surface of the steel wire 9 is implemented through the control of the rectifier 27.
The invention relates to a copper ion group-supplementing device, which is characterized in that paying-off and winding devices are arranged at two ends of a steel wire 9 in a matched manner, a feeding rubber roller 4 and a discharging rubber roller 5 are both made of non-conductive materials, an acid cleaning device is arranged at the outer side of a feeding end of the feeding rubber roller 4, residual acid cleaning liquid on the surface of the steel wire 9 is taken out along with the cleaning device and clamping smearing, and a feeding cathode roller 7 and a discharging cathode roller 8 are used as cathode conductive ends together with the steel wire 9. The copper ion group is the anode conductive terminal, thereby performing the electroplating operation on the surface of the steel wire 9.
During the electroplating process of the steel wire 9, the first electronic level meter 24 and the first copper ion concentration measuring instrument 25 continuously monitor the liquid level of the electroplating liquid 33 and the concentration of the copper ion group 26 in the electroplating tank 1, when the liquid level of the electroplating liquid 33 or the concentration of the copper ion group 26 is lower than a set value, the controller 23 starts the suction pump 12, the suction pump 12 conveys the liquid high-concentration copper ion electrolyte 32 in the material replenishing tank 3 to the electroplating tank 1 through the suction pipe 13, the electronic liquid flowmeter 11 measures the conveyed liquid amount, and the metering information is transmitted to the controller 23, and when the first electronic level meter 24 and the first copper ion concentration measuring instrument 25 monitor that the liquid level of the electroplating liquid 33 and the concentration of the copper ion group 26 in the electroplating tank 1 reach the preset value, the suction pump 12 is closed.
The controller 23 is connected with an external computer, the controller is controlled by control software in the external computer, meanwhile, various data of the product are collected by a host computer through an information collecting unit, and then the control operation of the material replenishment quantity in the electroplating tank 1 is implemented through calculation, the information collecting unit collects the information of the liquid concentration and the liquid level in the electroplating tank 1 and the material replenishment tank 3, and meanwhile, the external equipment such as the gear motor 18, the suction pump 12 and the electronic liquid flowmeter 11 is controlled, so that the accurate operation of the suction operation and the material replenishment operation is ensured.
The second electronic liquid level meter 19 and the second copper ion concentration measuring instrument 28 which are arranged in the material replenishing tank 3 continuously monitor the liquid level and concentration of the liquid high-concentration copper ion electrolyte 32 in the replenishing tank 3, meanwhile, the controller 23 intermittently starts the electric heater 22 to heat the heating coil 21, heat is transmitted to the liquid high-concentration copper ion electrolyte 32 through the heating cavity 31 and is used for keeping the preset temperature of the liquid high-concentration copper ion electrolyte 32, and when the suction pump 12 is operated in each suction operation, the controller 23 simultaneously starts the reducing motor 18 to drive the stirring shaft 20 to stir the liquid high-concentration copper ion electrolyte 32, so that copper ions are prevented from precipitating.
When the plating tank 1 is subjected to the liquid high-concentration copper ion electrolyte 32 replenishing operation, the second copper ion concentration measuring instrument 28 measures the concentration of the liquid high-concentration copper ion electrolyte 32 in real time, and carries out operation according to the concentration of copper ions in the electrolyte 32 detected by the first copper ion concentration measuring instrument 25, and finally, the controller 23 and the electronic liquid flowmeter 11 are used for carrying out the preset electrolyte 32 replenishing operation, when the liquid high-concentration copper ion electrolyte 32 in the material replenishing tank 3 is lower than the early warning position of the second electronic liquid level meter 19, the controller 23 starts the alarm 17, and then the external liquid high-concentration copper ion electrolyte 32 carries out material replenishing on the material replenishing tank 3 through the liquid injection port 16.
Example 2: an intelligent material replenishing method for an intelligent electroplating material replenishing device for diamond wire bus production comprises the following steps: the steel wire 9 is wound from the top of the feeding rubber roll 4 to the bottoms of the feeding cathode roll 7 and the discharging cathode roll 8, and then is led out from the top of the discharging rubber roll 5, the steel wire wound to the bottoms of the feeding cathode roll 7 and the discharging cathode roll 8 is immersed into the electroplating solution 33, and the electroplating operation of the copper ion group 26 on the surface of the steel wire 9 is implemented through the control of the rectifier 27.
The two ends of the steel wire 9 are matched with paying-off and winding devices, the feeding rubber roller 4 and the discharging rubber roller 5 are made of non-conductive materials, the outer side of the feeding end of the feeding rubber roller 4 is provided with an acid cleaning device, the acid cleaning residual liquid on the surface of the steel wire 9 is taken out along with the cleaning device and clamping and smearing, the feeding cathode roller 7 and the discharging cathode roller 8 are used as cathode conducting ends together with the steel wires 9, and copper ions are in an insoluble anode plate when the invention is operated, and the copper ions in the insoluble anode plate need to be replenished in real time along with the consumption of the copper ions. The copper ion group is the anode conductive terminal, thereby performing the electroplating operation on the surface of the steel wire 9.
During the electroplating process of the steel wire 9, the first electronic level meter 24 and the first copper ion concentration measuring instrument 25 continuously monitor the liquid level of the electroplating liquid 33 and the concentration of the copper ion group 26 in the electroplating tank 1, when the liquid level of the electroplating liquid 33 or the concentration of the copper ion group 26 is lower than a set value, the controller 23 starts the suction pump 12, the suction pump 12 conveys the liquid high-concentration copper ion electrolyte 32 in the material replenishing tank 3 to the electroplating tank 1 through the suction pipe 13, the electronic liquid flowmeter 11 measures the conveyed liquid amount, and the metering information is transmitted to the controller 23, and when the first electronic level meter 24 and the first copper ion concentration measuring instrument 25 monitor that the liquid level of the electroplating liquid 33 and the concentration of the copper ion group 26 in the electroplating tank 1 reach the preset value, the suction pump 12 is closed.
The controller 23 is connected with an external computer, the controller is controlled by control software in the external computer, meanwhile, various data of the product are collected by a host computer through an information collecting unit, and then the control operation of the material replenishment quantity in the electroplating tank 1 is implemented through calculation, the information collecting unit collects the information of the liquid concentration and the liquid level in the electroplating tank 1 and the material replenishment tank 3, and meanwhile, the external equipment such as the gear motor 18, the suction pump 12 and the electronic liquid flowmeter 11 is controlled, so that the accurate operation of the suction operation and the material replenishment operation is ensured.
The second electronic liquid level meter 19 and the second copper ion concentration measuring instrument 28 which are arranged in the material replenishing tank 3 continuously monitor the liquid level and concentration of the liquid high-concentration copper ion electrolyte 32 in the replenishing tank 3, meanwhile, the controller 23 intermittently starts the electric heater 22 to heat the heating coil 21, heat is transmitted to the liquid high-concentration copper ion electrolyte 32 through the heating cavity 31 and is used for keeping the preset temperature of the liquid high-concentration copper ion electrolyte 32, and when the suction pump 12 is operated in each suction operation, the controller 23 simultaneously starts the reducing motor 18 to drive the stirring shaft 20 to stir the liquid high-concentration copper ion electrolyte 32, so that copper ions are prevented from precipitating.
When the plating tank 1 is subjected to the liquid high-concentration copper ion electrolyte 32 replenishing operation, the second copper ion concentration measuring instrument 28 measures the concentration of the liquid high-concentration copper ion electrolyte 32 in real time, and carries out operation according to the concentration of copper ions in the electrolyte 32 detected by the first copper ion concentration measuring instrument 25, and finally, the controller 23 and the electronic liquid flowmeter 11 are used for carrying out the preset electrolyte 32 replenishing operation, when the liquid high-concentration copper ion electrolyte 32 in the material replenishing tank 3 is lower than the early warning position of the second electronic liquid level meter 19, the controller 23 starts the alarm 17, and then the external liquid high-concentration copper ion electrolyte 32 carries out material replenishing on the material replenishing tank 3 through the liquid injection port 16.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides an intelligent electroplating material feeding device of buddha's warrior attendant line generating line production, including electroplating bath (1), feeding rubber roll (4), ejection of compact rubber roll (5), electroplating solution (33) of setting in electroplating bath (1), steel wire (9) of flooding in electroplating solution (33), with feeding cathode roll (7) and ejection of compact cathode roll (8) that steel wire (9) contact supported, copper ion crowd (26) of setting in electroplating solution (33), rectifier (27) of sealed setting at the bottom of the pool of electroplating bath (1), its characterized in that: the electroplating device is characterized in that a first electronic liquid level meter (24) is arranged on the inner wall of the top of the electroplating tank (1), a copper ion concentration measuring instrument (25) is fixedly arranged on the inner wall of the electroplating tank (1) below the first electronic liquid level meter (24), a control cabinet (2) is arranged on the outer side of the electroplating tank (1), a controller (23) is arranged in the control cabinet (2), the first electronic liquid level meter (24) is connected with the controller (23) through a liquid level meter connector (34), the first copper ion concentration measuring instrument (25) is connected with the controller (23) through a concentration measuring instrument connector (35), a heating isolation cavity (36) is arranged at the bottom of the control cabinet (2), an electric heater (22) connected with the controller (23) is arranged in the heating isolation cavity (36), and a material intelligent replenishing device matched with the electric heater (22), the liquid level meter connector (34) and the concentration measuring instrument connector (35) is arranged on the outer side of the control cabinet (2).
2. The intelligent electroplating material supply apparatus for diamond wire bus production of claim 1, wherein: the intelligent material replenishing device comprises a material replenishing tank (3) fixedly arranged at the outer side of a control cabinet (2), a heating cavity (31) is arranged at the bottom of the material replenishing tank (3), a heating coil (21) connected with an electric heater (22) is arranged in the heating cavity (31), a liquid high-concentration copper ion electrolyte (32) is filled in the material replenishing tank (3) at the upper part of the heating cavity (31), a second electronic liquid level meter (19) matched with a liquid level meter connector (34) is arranged at the upper part of an inner cavity of the material replenishing tank (3), a second copper ion concentration meter (28) matched with a concentration meter connector (35) is arranged on the inner wall of the material replenishing tank (3) below the second electronic liquid level meter (19), a stirring shaft (20) is arranged at one side of the second copper ion concentration meter (28), a speed reducing motor (18) arranged at the outer side of the material replenishing tank (3), a liquid high-concentration copper ion electrolyte suction pipe (32) arranged between the stirring shaft (20) and the second copper ion meter (28) is arranged in the liquid high-concentration copper ion electrolyte suction pipe (32), a suction pipe (13) is arranged at the upper part of the top of the suction pipe (12) and is communicated with a suction pump (12) arranged at the top of the suction pipe (1) of the material replenishing tank (1), an electronic liquid flowmeter (11) is arranged on the supply pipe (10), and the electronic liquid flowmeter (11), the suction pump (12) and the gear motor (18) are connected with a controller (23) through wires.
3. The intelligent electroplating material supply apparatus for diamond wire bus production of claim 1, wherein: the electroplating tank (1) be rectangle cavity structure, switch board (2) is rectangle cavity structure, the height of electroplating tank (1) is not less than the height of switch board (2), be provided with electroplating tank transparent observation window (6) at the lateral wall of electroplating tank (1), the bottom of electroplating tank transparent observation window (6) sets up in the lower part position of feeding cathode roller (7) and ejection of compact cathode roller (8), steel wire (9) extend to the bottom of feeding cathode roller (7) from the top of feeding rubber roller (4) to extend to the bottom of ejection of compact cathode roller (8) from the bottom of feeding cathode roller (7), the setting height of feeding cathode roller (7) and ejection of compact cathode roller (8) is the same, the other end of steel wire (9) extends to the top of ejection of compact rubber roller (5) from the bottom of ejection of compact cathode roller (8), feeding rubber roller (4) and ejection of compact rubber roller (5) adopt the non-conductive material to make.
4. The intelligent electroplating material supply apparatus for diamond wire bus production of claim 1, wherein: the copper ion group (26) is a soluble anode copper particle or an insoluble anode plate, the feeding cathode roller (7) and the discharging cathode roller (8) are arranged in the electroplating pool (1) through conductive brackets, the conductive brackets are electrically connected with the rectifier (27), and the rectifier (27) is electrically connected with the controller (23).
5. The intelligent electroplating material supply apparatus for diamond wire bus production of claim 1, wherein: the upper portion of first electron level gauge (24) be provided with first bracket connection spare (29), the bottom of first bracket connection spare (29) is connected with level gauge connector (34), is provided with touch-control display (14) that are connected with controller (23) in the outside of switch board (2).
6. The intelligent electroplating material supply apparatus for diamond wire bus production of claim 1, wherein: the bottom of the first electronic liquid level meter (24) is positioned above the feeding cathode roller (7) and the discharging cathode roller (8), and the setting position of the first copper ion concentration measuring instrument (25) is positioned below the feeding cathode roller (7) and the discharging cathode roller (8).
7. The intelligent electroplating material supply apparatus for diamond wire bus production of claim 2, wherein: the material supply tank (3) is of a cuboid cavity structure, the height of the material supply tank (3) is equal to that of the control cabinet (2), the material supply observation window (15) is arranged on the outer wall of the material supply tank (3), and the bottom of the material supply observation window (15) is flush with the bottom of the suction pipe (13).
8. The intelligent electroplating material supply apparatus for diamond wire bus production of claim 2, wherein: the top of material supply pond (3) be provided with annotate liquid mouth (16) and alarm (17) that are connected with controller (23), liquid high concentration copper ion electrolyte (32) are the mixed solution of being made by electrolyte and high concentration copper ion liquid mixture, second electron level gauge (19) are connected with level gauge connector (34) through second leg joint spare (30), the bottom of second electron level gauge (19) is parallel and level with the bottom of suction tube (13), the setting position of second copper ion concentration measuring apparatu (28) is located the inner chamber middle part of material supply pond (3) and leans on the upper position.
9. The intelligent electroplating material supply apparatus for diamond wire bus production of claim 2, wherein: the stirring shaft (20) is transversely arranged in the liquid high-concentration copper ion electrolyte (32) on the inner wall of the material replenishing tank (3).
10. An intelligent material supplying method for an intelligent electroplating material supplying device for producing diamond wire bus according to any one of claims 1-9, which is characterized in that:
s1, winding a steel wire (9) from the top of a feeding rubber roll (4) to the bottoms of a feeding cathode roll (7) and a discharging cathode roll (8), then leading out wires from the top of a discharging rubber roll (5), immersing the steel wire wound to the bottoms of the feeding cathode roll (7) and the discharging cathode roll (8) into an electroplating solution (33), and carrying out electroplating operation of copper ion groups (26) on the surface of the steel wire (9) through control of a rectifier (27);
s2, continuously monitoring the liquid level of the plating solution (33) and the concentration of the copper ion group (26) in the plating tank (1) by the first electronic liquid level meter (24) and the first copper ion concentration measuring instrument (25) in the process of plating the steel wire (9), starting a suction pump (12) by the controller (23) when the liquid level of the plating solution (33) or the concentration of the copper ion group (26) is lower than a set value, conveying the high-concentration copper ion electrolyte (32) in the material replenishment tank (3) into the plating tank (1) through the suction pipe (13) by the suction pump (12), metering the conveyed liquid amount by the electronic liquid flow meter (11) during the process, and conveying metering information to the controller (23), and closing the suction pump (12) when the liquid level of the plating solution (33) and the concentration of the copper ion group (26) in the plating tank (1) are monitored by the first electronic liquid level meter (24) and the first copper ion concentration measuring instrument (25) to reach a preset value;
s3, a second electronic liquid level meter (19) and a second copper ion concentration measuring instrument (28) which are arranged in the material replenishing tank (3) continuously monitor the liquid level and the concentration of the liquid high-concentration copper ion electrolyte (32) in the replenishing tank (3), meanwhile, the controller (23) intermittently starts the electric heater (22) to heat the heating coil (21), heat is transmitted to the liquid high-concentration copper ion electrolyte (32) through the heating cavity (31) and is used for keeping the preset temperature of the liquid high-concentration copper ion electrolyte (32), and when the suction pump (12) operates in each suction operation, the controller (23) simultaneously starts the speed reducing motor (18) to drive the stirring shaft (20) to stir the liquid high-concentration copper ion electrolyte (32) so as to prevent copper ions from precipitating;
s4, when the electroplating tank (1) is subjected to liquid high-concentration copper ion electrolyte (32) replenishing operation, the second copper ion concentration measuring instrument (28) measures the concentration of the liquid high-concentration copper ion electrolyte (32) in real time, operation is carried out according to the concentration of copper ions in the electrolyte (32) detected by the first copper ion concentration measuring instrument (25), and finally replenishment operation for presetting the concentration of the electrolyte (32) is carried out through the controller (23) and the electronic liquid flowmeter (11), when the amount of the liquid high-concentration copper ion electrolyte (32) in the material replenishing tank (3) is lower than the early warning position of the second electronic liquid level meter (19), the controller (23) starts the alarm (17), and then the external liquid high-concentration copper ion electrolyte (32) is subjected to material replenishing in the material replenishing tank (3) through the liquid filling port (16).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311109049.6A CN117127238A (en) | 2023-08-31 | 2023-08-31 | Intelligent electroplating material supply device and method for diamond wire bus production |
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| CN202311109049.6A CN117127238A (en) | 2023-08-31 | 2023-08-31 | Intelligent electroplating material supply device and method for diamond wire bus production |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117305958A (en) * | 2023-10-18 | 2023-12-29 | 河南恒创能科金属制品有限公司 | Device for processing diamond wire bus and processing method thereof |
| CN117852843A (en) * | 2024-03-07 | 2024-04-09 | 成都建工第三建筑工程有限公司 | Material management system and method for aerial building machine for high-rise building |
-
2023
- 2023-08-31 CN CN202311109049.6A patent/CN117127238A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117305958A (en) * | 2023-10-18 | 2023-12-29 | 河南恒创能科金属制品有限公司 | Device for processing diamond wire bus and processing method thereof |
| CN117305958B (en) * | 2023-10-18 | 2024-05-14 | 河南恒创能科金属制品有限公司 | Device for processing diamond wire bus and processing method thereof |
| CN117852843A (en) * | 2024-03-07 | 2024-04-09 | 成都建工第三建筑工程有限公司 | Material management system and method for aerial building machine for high-rise building |
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