CN117103750A - Pressing device, pressing working method and pressing equipment for chip processing - Google Patents
Pressing device, pressing working method and pressing equipment for chip processing Download PDFInfo
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- CN117103750A CN117103750A CN202311389442.5A CN202311389442A CN117103750A CN 117103750 A CN117103750 A CN 117103750A CN 202311389442 A CN202311389442 A CN 202311389442A CN 117103750 A CN117103750 A CN 117103750A
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- 238000003825 pressing Methods 0.000 title claims abstract description 104
- 238000000034 method Methods 0.000 title claims abstract description 14
- 230000000149 penetrating effect Effects 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims description 49
- 238000002788 crimping Methods 0.000 claims description 22
- 230000005540 biological transmission Effects 0.000 claims description 21
- 230000007246 mechanism Effects 0.000 claims description 20
- 230000033001 locomotion Effects 0.000 claims description 15
- 230000007547 defect Effects 0.000 abstract description 2
- 230000006835 compression Effects 0.000 description 8
- 238000007906 compression Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
- B30B15/065—Press rams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/34—Heating or cooling presses or parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B9/00—Presses specially adapted for particular purposes
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
The invention relates to the technical field of chip processing, and provides a pressing device, a pressing working method and pressing equipment for chip processing. The pressing device for chip processing comprises a first base, a second base and a pressing head assembly, wherein the pressing head assembly comprises a pressing head body and a driving device, the pressing head is arranged on the first base in a penetrating mode, and the driving device is used for driving and adjusting the pressing head body to extend out of a preset length relative to the first base; the second base is provided with a press joint position for bearing the component to be press-jointed, and the press head body corresponds to the press joint position; the preset length is the length of the pressure head body extending to the side where the second base is located. The pressing device for chip processing provided by the invention is used for solving the defect of low chip processing efficiency of inconsistent thickness in the prior art, and the pressing device for chip processing can realize the press-connection processing of a plurality of chips with different thicknesses at one time, thereby providing processing efficiency.
Description
Technical Field
The invention relates to the technical field of chip processing, in particular to a pressing device, a pressing working method and pressing equipment for chip processing.
Background
During the chip sintering process, crimping by a pressing device is required. The single press-connection can only press-connect a single chip or a plurality of chips with the same thickness (the plurality of chips can be arranged on a single substrate or a plurality of substrates), the parallelism requirement on the press-connection plane of the upper press head and the lower press head is extremely high, and the consistency of the chip molding is poor when the plurality of chips are press-connected.
The same pressing device can only press-joint workpieces to be pressed at the same height at a time, the requirements on the height consistency among different chips on the workpieces to be pressed are extremely high, the matched workpieces to be pressed are single, and the production efficiency is required to be improved.
Disclosure of Invention
The invention provides a pressing device for chip processing, which is used for solving the defect of low chip processing efficiency caused by inconsistent thickness in the prior art, and the pressing device for chip processing can realize the press-connection processing of a plurality of chips with different thicknesses at one time by action, thereby providing the processing efficiency.
The invention provides a pressing device for chip processing, which comprises:
a first base, a second base, a third base and a fourth base,
the pressure head assembly comprises a pressure head body and a driving device, the pressure head is arranged on the first base in a penetrating mode, and the driving device is used for driving and adjusting the pressure head body to extend out of a preset length relative to the first base;
the second base is provided with a press joint position for bearing the component to be press-jointed, and the press head body corresponds to the press joint position;
the preset length is the length of the pressure head body extending to the side where the second base is located.
According to the pressing device for chip processing, the driving device comprises a linear driver, or alternatively, the driving device comprises a rotary driver and a transmission mechanism for converting rotary power into linear motion, one end of the transmission mechanism is connected with the output end of the rotary driver, and the other end of the transmission mechanism is provided with the pressing head body.
According to the pressing device for chip processing, the transmission mechanism comprises the gear and the rack which are meshed and transmitted, the gear is connected to the output end of the rotation driver, and the pressing head body is arranged at the end part of the rack.
According to the pressing device for chip processing, provided by the invention, the pressure applied by the pressing head body to the component to be pressed is regulated by controlling the torque of the rotary driver.
According to the pressing device for chip processing, the first base is connected with the guide seat, and the guide seat is provided with the guide hole for penetrating the pressing head body.
According to the pressing device for chip processing, the guide sleeve is arranged in the guide hole, and the guide sleeve is in guide fit with the pressing head body.
According to the pressing device for chip processing, the first base is provided with the mounting hole, and the pressing head body penetrates through the mounting hole and is in clearance fit with the mounting hole.
According to the pressing device for chip processing, provided by the invention, the first heating unit is arranged in the first base, and the first heating unit heats the pressure head body through heat conduction;
and/or a second heating unit for heating the press joint position is arranged in the second base.
According to the pressing device for chip processing, the first base is connected with the first moving driver, and the first moving driver is used for driving the first base to be close to or far from the second base;
and/or, the second base is connected with a second moving driver, and the second moving driver is used for driving the second base to be close to or far away from the first base.
The invention also provides a pressing working method, which is applied to the pressing device for chip processing, and comprises the following steps:
placing a component to be crimped on a crimping position of the second base, starting heating of the first base and the second base, wherein heat can be transferred to the pressure head body when the first base is heated, and heat of heating of the second base can be transferred to the component to be crimped through the crimping position;
the driving device is controlled to drive the pressure head body to move so that the pressure head body moves along with the pressure head body and contacts with the component to be crimped to provide pressure for the component to be crimped, and the pressure head body contacts with the component to be crimped and conducts heat so that two sides of the component to be crimped are heated simultaneously to complete heating and pressurizing of the component to be crimped.
The invention also provides a pressure device comprising a pressing apparatus for chip processing as claimed in any one of the preceding claims.
The pressing device for chip processing provided by the invention comprises the first base, the second base and the pressing head assembly, wherein the pressing head assembly comprises the driving device and a plurality of pressing head bodies, the preset length of at least one pressing head body extending out of the first base can be adjusted through the driving device, the thickness of the component to be pressed corresponding to the pressing head body can be adjusted based on the preset length of the pressing head body, the pressing head body can be suitable for pressing and processing components to be pressed with different thicknesses, the components to be pressed with various thicknesses can be processed at one time, and the processing efficiency is improved.
Drawings
In order to more clearly illustrate the invention or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a pressing device for chip processing according to the present invention;
FIG. 2 is a schematic longitudinal cross-sectional view of a first base and ram assembly of a die attach pressing apparatus provided by the present invention;
reference numerals:
1. a first base; 2. a ram body; 3. a guide seat; 4. a second base; 5. the assembly to be crimped; 6. a rack; 7. a gear; 8. a rotary driver; 9. a guide sleeve; a. the length is preset.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Furthermore, in the description of the present invention, unless otherwise indicated, the meaning of "a plurality", "a plurality of groups" is two or more.
In a pressure sintering furnace, a pressing device for chip processing is used for chip heating and pressing combined pressing, and the method is mainly integrated pressing, wherein a pressing head base is arranged on each of the upper pressing head base and the lower pressing head base, a component to be pressed is arranged on the lower pressing head base, and one pressing head base moves upwards or downwards, so that the chip positioned between the two pressing head bases is pressed.
The pressing device for chip processing executes a pressing action, and can be used for pressing a plurality of to-be-pressed components 5, wherein the to-be-pressed components 5 can be chips with the same function and different specifications, and can also be chips with different functions and different thicknesses, namely, in the to-be-pressed components 5, at least two to-be-pressed components have different thicknesses, and then the same pressing head body 2 is difficult to meet the pressing requirements of the to-be-pressed components 5 with different thicknesses. Accordingly, a pressing device for chip processing described below is provided.
The pressing device for chip processing of the present invention is described below with reference to fig. 1 and 2, including: the device comprises a first base 1, a second base 4 and a pressure head assembly, wherein the pressure head assembly comprises a pressure head body 2 and a driving device, the pressure head body 2 is arranged on the first base 1 in a penetrating mode, and the driving device is used for driving and adjusting the pressure head body 2 to extend out of a preset length relative to the first base 1; the second base 4 is provided with a press joint for accommodating the component 5 to be press-jointed, and the press head body 2 corresponds to the press joint; the preset length is the length of the ram body 2 extending to the side of the second base 4.
As shown in fig. 2, the preset length a is the length of the ram body 2 extending toward the side of the second base 4.
The first base 1 is arranged opposite to the second base 4, the first base 1 is connected with a pressure head assembly, the pressure head assembly comprises a pressure head body 2 and a driving device used for driving the pressure head body 2 to move, the pressure head body 2 extends out of the first base 1 to preset the length, the driving device can be used for adjusting the preset length of the pressure head body 2, the second base 4 is provided with pressure welding positions used for accommodating the pressure to-be-welded assembly 5, the pressure welding positions correspond to the pressure head body 2 one by one, and it can be understood that each pressure welding position is provided with the pressure head body 2. When the first base 1 and the second base 4 are close to each other for crimping, the preset lengths of the at least two pressure head bodies 2 extending relative to the first base 1 are different, and the preset lengths are corresponding to the preset lengths and can be used for crimping to-be-crimped assemblies 5 with different thicknesses in crimping positions. When the driving device is used for adjusting the preset length, the pressure head body 2 can be used for crimping the components 5 to be crimped with different thicknesses, so that the application range of the pressure applying device for chip processing is wider, and the flexibility is stronger.
Of course, when the component 5 to be crimped is not placed at the crimping position, the corresponding ram body 2 may not be provided, for example, the ram body 2 at the corresponding position is disassembled, or the ram body 2 is driven to move by the driving device, so that the pressure of the ram body 2 to the crimping position is relieved. The bottom of the component 5 to be crimped can be a substrate, the component 5 to be crimped can be integrally crimped together by applying a certain pressure to the component 5 to be crimped at a high temperature, the component 5 to be crimped can be placed in a jig, and simultaneous crimping of multiple components 5 to be crimped is realized. Each component 5 to be crimped corresponds to one ram body 2.
It should be noted that, when the second base 4 is provided with a plurality of compression bonding positions, the plurality of compression bonding assemblies 5 accommodated in the plurality of compression bonding positions may be independent, and the plurality of compression bonding assemblies 5 may be disposed on a plurality of substrates, or may be a plurality of compression bonding assemblies 5 mounted on the same substrate. When a plurality of chips are arranged on the same substrate, the functions of the chips can be different, such as a chip for temperature control, a chip for motor control, a chip for humidity control and the like are arranged on one substrate, the thicknesses of the chips with different functions are different, at the moment, the pressure head body 2 can be adjusted to extend out of the preset length of the first base 1, so that the simultaneous compression joint of all the chips of the substrate is realized, the processing procedures can be reduced, the processing efficiency can be improved, and the processing cost can be reduced.
In some embodiments, the driving means includes a linear driver, such as a cylinder, a hydraulic cylinder, a linear motor, etc., and the ram body 2 is located at an output end of the linear driver, and the linear driver provides a driving force for the linear motion of the ram body 2, so that a preset length of the ram body 2 can be adjusted as needed. The linear driver has simple structure and convenient regulation and control.
The output end of the ram body 2 and the linear driver can be fixedly connected or can be detached. When the output end of the pressure head body 2 and the output end of the linear driver are detachable, the output end of the linear driver moves to the target position, and the output end of the linear driver contacts with the pressure head body 2 and drives the pressure head body 2 to adjust the position, so that the preset length of the pressure head body 2 is adjusted, and at the moment, the independence of the linear driver is stronger, and the linear driver is applicable to the first base 1 with various specifications.
Or, the driving device comprises a rotary driver 8 and a transmission mechanism for converting rotary power into linear motion, one end of the transmission mechanism is connected with the output end of the rotary driver 8, and the other end of the transmission mechanism is provided with the pressure head body 2. The rotation driver 8 provides rotation power, and the transmission mechanism converts the rotation power into linear motion power to drive the pressure head body 2 to linearly move, so that the preset length of the pressure head body 2 extending out of the first base 1 is regulated and controlled.
Similarly, the other end of the transmission mechanism is fixedly connected with the pressure head body 2 or can be detached. When the pressing head body 2 is detachable from the other end of the transmission mechanism, the other end of the transmission mechanism moves to the target position, and the other end of the transmission mechanism contacts with the pressing head body 2 and drives the pressing head body 2 to adjust the position, so that the preset length of the pressing head body 2 is adjusted, the structural independence of the rotary driver 8 and the transmission mechanism is stronger, and the novel pressing head is applicable to the first base 1 with various specifications.
In some embodiments, the transmission mechanism includes a gear 7 and a rack 6 that are meshed and driven, the gear 7 is connected to an output end of the rotation driver 8, a pressure head body 2 is disposed at an end of the rack 6, and in a rotation process of the rotation driver 8, rotation power is transmitted to the rack 6 by the gear 7, so that the rack 6 can drive the pressure head body 2 to move linearly, and a preset length of the pressure head body 2 is adjusted.
Wherein, rack 6 is located pressure head body 2 top, and every rack 6 corresponds a pressure head body 2, and rack 6 slidable mounting is on a guide holder 3, can follow the vertical direction and move under the drive of gear 7.
The transmission mechanism can also comprise a screw rod and a screw nut, the screw rod is connected to the output end of the rotation driver 8, the screw nut can move along the screw rod in the process of screw rod rotation, and the pressure head body 2 can be adjusted along with the movement of the screw nut.
The pressing head body 2 and the rack 6, and the pressing head body 2 and the screw nut can be mutually fixed or detachable, and can be specifically selected according to the needs.
It should be noted that the specific structure of the transmission mechanism is not limited to the foregoing two forms, and different structural forms may be selected according to the need.
In some embodiments, the pressure applied by the ram body 2 to the component 5 to be crimped is regulated by controlling the torque of the rotary drive 8.
The torque of the rotary driver 8 is used for representing the pressure applied by the pressure head body 2 to the component 5 to be crimped, and the detection of the stress condition of the component 5 to be crimped is simple and the structure is simple. Accurate pressure control can be achieved by programmable torque control of the rotary drive 8.
Wherein the pressure applied by the pressing device for chip processing on the component 5 (such as a chip) to be pressed can be adjusted between 0.5 Mpa and 80 Mpa. Each chip corresponds to one pressure head body 2, the pressure intensity output by each pressure head body 2 can be independently adjusted, and the pressure applying device for chip processing can be suitable for simultaneous heating, pressurizing and combining of a plurality of different chips.
The rotary actuator 8 may be a motor, or may be a rotary cylinder or other power device.
The driving device is fixedly arranged on the equipment, when the driving device comprises a rotation driver 8, the rotation driver 8 is connected with a gear 7 and can drive the gear 7 to do rotary motion, the gear 7 drives the rack 6 to move up and down when rotating, one or more than one rotation driver 8 is arranged on a chip processing pressing device, each rotation driver 8 corresponds to one gear 7, and each rotation driver 8 is provided with an independent control system which can independently control output torque.
In some embodiments, the first base 1 is connected with a guide seat 3, and the guide seat 3 is provided with a guide hole for penetrating the ram body 2. The setting of guide holder 3 is convenient to install pressure head body 2, still plays the effect of strengthening first base 1. The profile shape of the guide holder 3 is matched with that of the first base 1, the guide holder 3 is positioned on one side of the first base 1, which is opposite to the second base 4, and the guide holder 3 does not influence the cooperation between the first base 1 and the second base 4, so that the crimping accuracy is ensured. The guide seat 3 is provided with a plurality of guide holes, so that each pressure head body 2 is penetrated through the corresponding guide hole, and the movement of each pressure head body 2 can be guided and limited.
In some embodiments, a guide sleeve 9 is arranged in the guide hole, and the guide sleeve 9 is in guide fit with the ram body 2. The guide sleeve 9 is arranged on the guide seat 3, the pressure head body 2 and the guide sleeve 9 are in clearance fit, the guide sleeve 9 limits the movement direction of the pressure head body 2 in the vertical direction under the action of a constraint on the pressure head body 2, one or more guide sleeves 9 are arranged on a pressure applying device for chip processing, and each guide sleeve 9 corresponds to one pressure head body 2.
In some embodiments, the first base 1 is provided with a mounting hole, the pressure head body 2 is arranged through the mounting hole in a penetrating way and in clearance fit with the mounting hole, the preset length of the pressure head body 2 is convenient to adjust, and the adjusting resistance is reduced.
The pressing head body 2 is arranged on the first base 1 and is in clearance fit with the first base 1, the pressing head body 2 can move up and down relative to the first base 1, one or more pressing head bodies 2 are arranged on a pressing device for chip processing, and each pressing head body 2 corresponds to one chip (to-be-pressed-bonded assembly 5).
The whole material of the first base 1 can be high-strength alloy, a heating device is arranged in the first base, and a temperature control device is attached to the heating device.
In some embodiments, a first heating unit is arranged in the first base 1, the first heating unit heats the pressure head body 2 through thermal conduction, and the pressure head body 2 heats the component 5 to be crimped, so that the heating efficiency is high, and the component 5 to be crimped can be accurately heated;
and/or, a second heating unit for heating the compression joint is arranged in the second base 4, and the second heating unit can heat the component 5 to be compressed through the compression joint.
At least one of the first heating unit and the second heating unit comprises a heating wire, a heating pipe and the like which are coiled in the corresponding base.
At least one of the first heating unit and the second heating unit is provided with a temperature control module, and the temperature control module is electrically connected with the corresponding heating unit and is used for controlling the heating temperature of the heating module.
Optionally, the temperature control module includes a controller and a temperature sensor, taking the first heating unit as an example, where the temperature sensor is disposed in the first base 1 and is used to collect the temperature of the first heating unit, the controller is electrically connected with the temperature sensor and the first heating unit respectively, and the controller is used to control the first heating unit to operate according to the temperature signal collected by the temperature sensor and control the temperature of the first heating unit in a preset range.
When the pressing device for chip processing comprises a first heating unit and a second heating unit, the upper surface and the lower surface of the component to be pressed 5 can be heated respectively, and the pressing device for chip processing is provided with two independent temperature control devices, so that the problems that in the prior art, the pressing device for chip processing does not have a heating function or only has a fixed side base to have a heating function, the sintering effect is poor, and the yield is low are solved.
In some embodiments, the first base 1 is connected to a first movement driver for driving the first base 1 towards or away from the second base 4, the first movement driver being operable to drive the first base 1 towards the second base 4, the second base 4 being fixable to provide a crimping force to the component 5 to be crimped through the ram body 2, the first base 1 being remote from the second base 4, the crimping force being releasable.
And/or, the second base 4 is connected with a second moving driver, the second moving driver is used for driving the second base 4 to be close to or far away from the first base 1, the second moving driver can be used for driving the second base 4 to be close to the first base 1, and the first base 1 can be kept fixed so as to enable the to-be-crimped component 5 to generate crimping acting force with the pressure head body 2 through the movement of the to-be-crimped component 5, so that crimping is realized.
When first base 1 is connected with first removal driver, and second base 4 is connected with the second removal driver, but first base 1 and second base 4 all movable adjustment, the crimping operation is more nimble.
The first and second movement drivers may be, but are not limited to, air cylinders, hydraulic cylinders, and may be selected as desired.
The embodiment of the invention also provides a pressing working method, which is applied to the pressing device for chip processing according to any one of the above steps, and comprises the following steps:
the to-be-crimped component 5 is placed on the crimping position of the second base 4, the first base 1 and the second base 4 start heating, heat can be transferred to the pressure head body 2 when the first base 1 is heated, and heat of the second base 4 heating can be transferred to the to-be-crimped component 5 through the crimping position.
The driving device is controlled to drive the pressure head body 2 to move so that the pressure head body 2 moves along with and contacts with the component 5 to be crimped, pressure is provided for the component 5 to be crimped, the pressure head body 2 contacts with the component 5 to be crimped and conducts heat, and therefore two sides of the component 5 to be crimped are heated simultaneously, and heating and pressurizing of the component 5 to be crimped are completed.
The working process of the pressing working method is described as follows:
the to-be-crimped component 5 is placed on the crimping position of the second base 4, the first heating unit of the first base 1 and the second heating unit of the second base 4 are both started to heat, heat can be transferred to the pressure head body 2 when the first base 1 is heated, and heat heated by the second base 4 can be transferred to the to-be-crimped component 5 through the crimping position.
The driving device drives the gear 7 to do rotary motion, the gear 7 rotates to drive the rack 6 to move downwards, the rack 6 presses the pressure head body 2 downwards, the pressure head body 2 moves downwards along with the rack and contacts with the component 5 to be crimped, certain pressure is given to the component 5 to be crimped, and meanwhile, heat is transferred to the component 5 to be crimped when the pressure head body 2 contacts with the component 5 to be crimped, so that the upper surface and the lower surface of the component 5 to be crimped are heated simultaneously, and the heating and pressurizing combination of the component 5 to be crimped is completed.
The arrangement and replacement of the pressure head body 2 are carried out, the pressure head body 2 can be arranged into various forms according to actual needs, when the arrangement mode needs to be replaced, only the parts such as the first base 1, the guide seat 3, the second base 4 and the like need to be replaced, the other parts do not need to be replaced with the specification, and the pressure applying device for whole chip processing has certain universality.
An embodiment of the second aspect of the present invention provides a pressing apparatus including a pressing device for chip processing as defined in any one of the above.
Optionally, the pressure equipment is provided with the support frame and sets up the pneumatic cylinder in the support frame top, and first base 1 is fixed to be set up in the upside of support frame, and second base 4 is fixed to be set up in the piston rod of pneumatic cylinder. The pressure device may be a pressure sintering furnace.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A die attach pressure applicator comprising:
a first base (1),
the pressure head assembly comprises a pressure head body (2) and a driving device, wherein the pressure head body (2) is arranged on the first base (1) in a penetrating mode, and the driving device is used for driving and adjusting the pressure head body (2) to extend out of a preset length relative to the first base (1);
the second base (4) is provided with a press joint for bearing an assembly (5) to be press-jointed, and the press head body (2) corresponds to the press joint;
the preset length is the length of the pressure head body (2) extending to the side where the second base (4) is located.
2. Pressing device for chip processing according to claim 1, characterized in that the driving means comprise a linear drive, or the driving means comprise a rotary drive (8) and a transmission mechanism for converting rotary power into linear motion, one end of the transmission mechanism being connected to the output end of the rotary drive (8), the other end of the transmission mechanism being provided with the ram body (2).
3. A pressing device for chip processing according to claim 2, characterized in that the transmission mechanism comprises a gear (7) and a rack (6) which are engaged in transmission, the gear (7) being connected to the output end of the rotary drive (8), the end of the rack (6) being provided with the ram body (2).
4. The pressing device for chip processing according to claim 2, characterized in that the pressure applied by the ram body (2) to the component (5) to be crimped is adjusted by controlling the torque of the rotary drive (8).
5. The pressing device for chip processing according to claim 1, wherein the first base (1) is connected with a guide seat (3), the guide seat (3) is provided with a guide hole for penetrating the pressing head body (2),
a guide sleeve (9) is arranged in the guide hole, and the guide sleeve (9) is in guide fit with the pressure head body (2).
6. The pressing device for chip processing according to any one of claims 1 to 5, wherein the first base (1) is provided with a mounting hole, and the pressing head body (2) is penetrated through the mounting hole and is in clearance fit with the mounting hole.
7. The pressing device for chip processing according to any one of claims 1 to 5, wherein a first heating unit is provided in the first base (1), the first heating unit heating the ram body (2) by thermal conduction;
and/or a second heating unit for heating the press joint position is arranged in the second base (4).
8. The pressing device for chip processing according to any one of claims 1 to 5, wherein the first base (1) is connected with a first movement driver for driving the first base (1) to approach or depart from the second base (4);
and/or, the second base (4) is connected with a second moving driver, and the second moving driver is used for driving the second base (4) to be close to or far away from the first base (1).
9. A pressing working method, characterized in that a pressing device applied to the chip processing of any one of claims 1 to 8, comprises:
placing a component (5) to be crimped on a crimping position of the second base (4), starting heating of the first base (1) and the second base (4), wherein heat can be transferred to the pressure head body (2) when the first base (1) is heated, and heat of heating of the second base (4) can be transferred to the component (5) to be crimped through the crimping position;
the driving device is controlled to drive the pressure head body (2) to move, so that the pressure head body (2) moves along with the pressure head body and contacts with the component (5) to be crimped, pressure is provided for the component (5) to be crimped, the pressure head body (2) contacts with the component (5) to be crimped and conducts heat, and two sides of the component (5) to be crimped are heated simultaneously, so that heating and pressurizing of the component (5) to be crimped are completed.
10. A press apparatus comprising a pressing device for chip processing according to any one of claims 1 to 8.
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| CN202311389442.5A CN117103750A (en) | 2023-10-25 | 2023-10-25 | Pressing device, pressing working method and pressing equipment for chip processing |
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| CN202311389442.5A CN117103750A (en) | 2023-10-25 | 2023-10-25 | Pressing device, pressing working method and pressing equipment for chip processing |
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