CN117098376A - Liquid cooling heat abstractor and electronic equipment - Google Patents

Abstract

The disclosure relates to a liquid cooling heat dissipation device and electronic equipment, and relates to the technical field of heat dissipation of electronic equipment. The liquid cooling heat dissipation device comprises at least one liquid cooling plate and is used for electronic equipment with a vibration component; the liquid cooling plate comprises a liquid cooling plate body and a flow channel structure arranged on the liquid cooling plate body; the flow channel structure is filled with cooling liquid; the flow channel structure has a first flexible wall connected to the vibrating surface of the vibrating assembly; the first flexible wall is capable of compressing the cooling liquid in the flow channel structure along with vibration of the vibration assembly to push the cooling liquid to flow. The liquid cooling heat dissipation device provided by the disclosure utilizes the vibration component of the electronic equipment to provide the flowing power of the cooling liquid, so that a liquid cooling system is simplified, and the influence of noise is reduced.

Description

Liquid cooling heat abstractor and electronic equipment

Technical Field

The disclosure relates to the technical field of heat dissipation of electronic equipment, in particular to a liquid cooling heat dissipation device and electronic equipment.

Background

For better user experience, most of smart speakers on the market are provided with display screens, and usage scenes and functions are gradually diversified, for example: listening to music, watching video, and video calls, etc. This increases the amount of heat generated by the system and also increases the heat dissipation problem. In the prior art, three heat dissipation methods are mostly adopted: 1. the natural heat dissipation has the defect of limited heat dissipation capacity and can not support the use of heavy-duty scenes. 2. Forced convection heat exchange (air cooling heat dissipation) has obviously improved heat dissipation capacity compared with natural convection heat exchange, but noise can be generated during use, and problems such as internal ash accumulation can also exist after long-term use. 3. The water pump liquid cooling heat dissipation, heat dispersion is stronger, but the system is complicated, and the reliability is lower.

It should be noted that the information disclosed in the above background section is only for enhancing understanding of the background of the present disclosure and thus may include information that does not constitute prior art known to those of ordinary skill in the art.

Disclosure of Invention

The purpose of the present disclosure is to overcome the shortcomings of the prior art, and provide a liquid cooling heat dissipation device and an electronic device, which provide power for the flow of a cooling liquid through a vibration component of the device, thereby realizing heat dissipation.

According to one aspect of the present disclosure, a liquid-cooled heat sink for an electronic device having a vibration assembly; the liquid cooling heat dissipation device comprises at least one liquid cooling plate;

the liquid cooling plate comprises a liquid cooling plate body and a flow channel structure arranged on the liquid cooling plate body;

the flow channel structure is filled with cooling liquid; the flow channel structure has a first flexible wall connected to a vibrating surface of the vibrating assembly; the first flexible wall is capable of compressing the cooling liquid in the flow channel structure along with vibration of the vibration assembly to push the cooling liquid to flow.

In an exemplary embodiment of the present disclosure, the first flexible wall protrudes from a surface of the liquid cooling plate body.

In one exemplary embodiment of the present disclosure, at least two one-way valves are disposed within the flow channel structure.

In one exemplary embodiment of the present disclosure, the one-way valve is a tesla valve.

In one exemplary embodiment of the present disclosure, the flow channel structure further has a second flexible wall disposed opposite the first flexible wall;

the liquid cooling heat dissipation device comprises a plurality of laminated liquid cooling plates;

the first flexible wall of a first one of the liquid cooling plates is connected with the vibration surface of the vibration assembly; and in the two adjacent liquid cooling plates, the second flexible wall of the former liquid cooling plate is connected with the first flexible wall of the latter liquid cooling plate.

In one exemplary embodiment of the present disclosure, the heat generating component of the electronic device is at least partially located between two of the liquid cooling plates.

In an exemplary embodiment of the present disclosure, the flow channel structure further has a protruding wall protruding from a surface of the liquid cooling plate body; the heating component of the electronic device is connected with the convex wall.

In an exemplary embodiment of the present disclosure, the liquid cooling plate body is made of a rigid material; the liquid cooling plate body is fixed to the electronic equipment, so that the vibrating surface of the vibrating assembly and the liquid cooling plate body can move relatively.

In one exemplary embodiment of the present disclosure, the liquid cooling plate has a stopper member; the limiting component is used for limiting the liquid cooling plate body, so that the liquid cooling plate body and the non-vibrating part of the vibrating assembly are kept relatively static.

In an exemplary embodiment of the present disclosure, the liquid cooling plate may be bendable, or the liquid cooling plate may be a bent plate.

In an exemplary embodiment of the disclosure, the flow channel structure includes a hollow flow channel provided on the liquid cooling plate body, and a flow channel wall covering the hollow flow channel; at least a partial region of the flow channel wall is the first flexible wall.

In one exemplary embodiment of the present disclosure, a vibration amplifier is disposed between the first flexible wall and the vibration surface of the vibration assembly, the vibration amplifier for enhancing the vibration amplitude of the first flexible wall.

In one exemplary embodiment of the present disclosure, the liquid-cooled heat sink further comprises a heat sink;

the radiating fins comprise a base plate and a plurality of radiating fins which are arranged on one side of the base plate at intervals in the front-back direction, extend along the left-right direction and are flat;

at least one connecting hole is formed in the lower side face of the substrate;

the liquid cooling plate is provided with a heat dissipation area, and the connecting hole is used for being connected with the liquid cooling plate body of the heat dissipation area.

In an exemplary embodiment of the disclosure, the liquid-cooled heat sink further comprises an air-cooled assembly;

the air cooling assembly is arranged on the left side and/or the right side of the radiating fins and used for rapidly discharging heat.

According to another aspect of the present disclosure, an electronic device includes a vibration assembly and at least one liquid-cooled heat sink as described above.

In an exemplary embodiment of the disclosure, the electronic device is a sound box.

The liquid cooling heat abstractor that this disclosure provided, through the vibration effect of the vibration subassembly that electronic equipment self possessed, the first flexible wall of extrusion flows in order to promote the coolant liquid, realizes the liquid cooling effect. The device does not need an additional air cooling device to perform convection heat dissipation, has no noise pollution, and reduces dust accumulation. And the complex power devices such as a water pump and the like are not needed to provide a power source of the liquid cooling system, so that the volume of the liquid cooling heat dissipation device is reduced, the structure is simplified, and the reliability of liquid cooling heat dissipation is improved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure. It will be apparent to those of ordinary skill in the art that the drawings in the following description are merely examples of the disclosure and that other drawings may be derived from them without undue effort.

Fig. 1 is a schematic structural diagram of an intelligent sound box with a heat dissipation function in the related art.

Fig. 2 is a schematic structural diagram of a liquid-cooled heat sink according to some embodiments of the present disclosure.

Fig. 3 is a schematic cross-sectional view of a liquid-cooled heat dissipating apparatus at A1-A1 according to an embodiment of the present disclosure.

Fig. 4 is a schematic cross-sectional view of a liquid-cooled heat dissipating apparatus at A1-A1 according to an embodiment of the present disclosure.

Fig. 5 is a schematic cross-sectional view of a liquid-cooled heat dissipating apparatus at A1-A1 according to an embodiment of the present disclosure.

Fig. 6 is a schematic cross-sectional view of a liquid-cooled heat dissipating apparatus at A1-A1 according to an embodiment of the present disclosure.

Fig. 7 is a schematic diagram of a check valve of a liquid-cooled heat sink according to an embodiment of the disclosure.

Fig. 8 is a schematic diagram of a tesla valve of a liquid-cooled heat sink in an embodiment of the present disclosure.

Fig. 9 is a schematic cross-sectional view of a liquid-cooled heat sink at A1-A1 according to an embodiment of the disclosure.

Fig. 10 is a schematic structural diagram of a bendable liquid cooling plate of a liquid cooling heat sink according to an embodiment of the present disclosure.

Fig. 11 is a schematic view illustrating a flow channel structure of a bendable liquid cooling plate of a liquid cooling heat sink according to an embodiment of the present disclosure.

Fig. 12 is a schematic structural diagram of a liquid-cooled heat sink according to an embodiment of the present disclosure.

Fig. 13 is a schematic structural diagram of a liquid-cooled heat sink according to an embodiment of the present disclosure.

Fig. 14 is a schematic diagram of a vibration amplifier of a liquid-cooled heat sink according to an embodiment of the present disclosure.

Fig. 15 is a schematic perspective view of a liquid-cooled heat sink according to an embodiment of the disclosure.

Fig. 16 is a schematic diagram illustrating a fin structure of a liquid-cooled heat sink according to an embodiment of the present disclosure.

The reference numerals are as follows:

05. the water pump, 06, the motor, 07, flabellum;

100. the liquid cooling plate comprises a liquid cooling plate body, a flow channel structure, a one-way valve, a vibration component, a heating component, a limiting component, a circuit board, a radiating fin, a base plate, a radiating fin, a mounting protrusion, a wind cooling component, a vibration amplifier and a vibration amplifier.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments can be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus detailed descriptions thereof will be omitted. Furthermore, the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale.

Although relative terms such as "upper," "lower," "left," "right," "front," "back" are used in this specification to describe the relative relationship of one component of an icon to another component, these terms are used in this specification merely for convenience, e.g., in terms of the orientation of the examples depicted in the drawings. It will be appreciated that if the device of the icon is flipped upside down, the recited "up" component will become the "down" component. When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure through another structure.

The terms "a," "an," "the," "said" and "at least one" are used to indicate the presence of one or more elements/components/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. in addition to the listed elements/components/etc.; the terms "first," "second," and the like are used merely as labels, and are not intended to limit the number of their objects.

In the related art, as shown in fig. 1, a liquid cooling heat dissipation system of a sound box needs to provide flowing power of cooling liquid through a water pump 05, and a motor 06 drives fan blades 07 to perform air cooling heat dissipation. The integral cooling device of the heat radiation system has the advantages of complex structure, large heat radiation noise and low reliability.

To solve the above-described problems, the embodiments of the present disclosure provide a liquid-cooling heat sink for an electronic apparatus having a vibration assembly 4. As shown in fig. 2, the liquid-cooled heat sink includes at least one liquid-cooled plate 100; the liquid cooling plate 100 comprises a liquid cooling plate body 1 and a flow channel structure 2 arranged on the liquid cooling plate body 1. The flow channel structure 2 is filled with a cooling liquid, and the flow channel structure 2 has a first flexible wall connected to the vibrating surface of the vibrating assembly 4. The connection between the first flexible wall and the vibration surface refers to that the first flexible wall is abutted against the vibration surface of the vibration component 4 in the non-working state of the electronic device, and the vibration amplitude generated by the vibration of the vibration component 4 in the working state of the electronic device can enable the vibration surface to squeeze the first flexible wall. In this way, when the electronic equipment works, the first flexible wall can squeeze the cooling liquid in the flow channel structure 2 along with the vibration of the vibration component 4 so as to push the cooling liquid to flow, and take away the heat generated by the heating component 5 of the electronic equipment, so that the heat dissipation effect is achieved.

According to the liquid cooling heat dissipation device provided by the embodiment of the disclosure, through the vibration action of the vibration component 4 of the electronic equipment, the first flexible wall is extruded to push the cooling liquid to flow, so that the liquid cooling effect is ensured, and meanwhile, the device does not need an additional air cooling device, such as a fan for convection heat dissipation, noise pollution is avoided, and dust accumulation is reduced. And the complex power devices such as a water pump and the like are not needed to provide a power source of the liquid cooling system, so that the volume of the liquid cooling heat dissipation device is reduced, the structure is simplified, and the reliability of liquid cooling heat dissipation is improved. On the basis of guaranteeing connection with the vibration component 4, the liquid cooling plate 100 of the liquid cooling heat dissipation device can be adaptively arranged according to the internal space of the device, and the space flexibility is high.

The structure and principle of the liquid cooling heat dissipation device are further described in detail below with reference to the accompanying drawings.

In one embodiment of the disclosure, the flow channel structure 2 includes a hollow flow channel disposed on the liquid cooling plate body 1, and a flow channel wall covering the hollow flow channel; at least a partial region of the flow channel wall is the first flexible wall. That is, the liquid cooling plate body 1 with the hollow flow channel can be formed first, and then the hollow flow channel is covered with a layer of flexible sheet made of flexible material to form the flow channel wall. The flexible sheet may cover only the hollow flow channel, or may cover the surface of the liquid cooling plate body 1 entirely. The material of the flexible sheet may be selected from flexible metal, plastic, rubber, but is not limited to the above materials.

To enable the flow of the cooling liquid in the flow channel structure 2, it is necessary to ensure as full a contact connection as possible of the first flexible wall with the vibration assembly 4. In an embodiment of the disclosure, the first flexible wall protrudes from the surface of the liquid cooling plate body 1, and the local area corresponding to the first flexible wall may protrude from the surface of the liquid cooling plate body 1, or the whole area of the flow channel wall may protrude from the surface of the liquid cooling plate body 1.

For example, as shown in fig. 3, in an example, in order to facilitate better contact between the first flexible wall and the vibration assembly 4, an area corresponding to the first flexible wall may be provided to protrude from the surface of the liquid cooling plate body 1. The protruding area of the first flexible wall is in abutting connection with the vibration surface of the vibration component 4, the vibration component 4 extrudes the protruding area of the first flexible wall during vibration, the flow of cooling liquid is pushed, and the liquid cooling effect is achieved. Thus, the first flexible wall is connected with the vibration surface of the vibration component 4, and the space occupied by the liquid cooling plate 100 is saved, so that the structure of the liquid cooling heat dissipation device is more compact. It will be appreciated that, as shown in fig. 4, the surface of the first flexible wall is connected with the surface of the runner structure 2 through the runner structure 2 for transition with gradually changed size, so that stress concentration can be reduced, and the problem of accelerated loss of the runner structure 2 caused by stress concentration is further reduced. In another example, the area corresponding to the first flexible wall protrudes from the surface of the liquid cooling plate body 1, and meanwhile, the channel wall of the channel structure 2 is further provided with a protruding wall protruding from the surface of the liquid cooling plate body 1, and the protruding wall is connected with the heating component 5 of the electronic device. Thus, two local areas protrude from the surface of the liquid cooling plate body 1, and are areas corresponding to the protruding wall and the first flexible wall respectively. Therefore, the flow channel structure 2 can be simultaneously contacted and connected with the vibration component 4 and the heating component 5, heat conduction is facilitated, the heat dissipation effect is enhanced, and the space occupied by the liquid cooling heat dissipation device in electronic equipment is saved.

As shown in fig. 5, in an example, the flow channel wall of the entire flow channel structure 2 may protrude from the surface of the liquid cooling plate body 1, and the first flexible wall is connected to the vibration surface of the vibration assembly 4, so that the cooling liquid flows under the vibration action. So, both made things convenient for runner structure 2 to be connected with vibration subassembly 4 for the coolant liquid extrudees under vibration subassembly 4 vibration effect and flows, simultaneously, whole runner wall all stands out in the surface of liquid cooling plate body 1, also makes things convenient for runner structure 2 to be connected with electronic equipment's heating element 5, conveniently realizes thermal transfer fast. The liquid cooling heat dissipation device is convenient to prepare in the arrangement mode, the flow channel wall of the flow channel structure 2 can be prepared uniformly corresponding to the embodiment, the local area is not required to be arranged in a protruding mode, and the preparation process is simplified.

It will be appreciated that extrusion will cause the coolant in the flow channel structure 2 to flow in both directions, and that in order to ensure that the coolant in the flow channel structure 2 flows in one direction, uniform heat dissipation is achieved, in one embodiment of the present disclosure, restriction of the coolant flow direction may be achieved by providing at least two one-way valves 3 within the flow channel structure 2. The vibration surface of the vibration component 4 is connected with the first flexible wall to form a vibration conduction area, two ends, close to the vibration conduction area, of the flow channel structure 2 are provided with one-way valves 3, and the direction limited by the two one-way valves 3 is the preset flow direction of cooling liquid in the flow channel structure 2. So, when vibration subassembly 4 vibration extrusion first flexible wall, the coolant liquid can only flow to a direction, avoids the coolant liquid to two directions flows, causes the offset loss of kinetic energy, influences the flow velocity of coolant liquid in runner structure 2, and then reduces the liquid cooling effect.

In one example, a check valve 3 as shown in fig. 7 is employed, and the check valve 3 includes a fixed portion fixed to an inner wall of the flow path structure 2, and a movable portion connected to an inside of the flow path structure 2 and movable. The fixed part is provided with a hollowed-out hole, and the movable part is matched with the hollowed-out hole. When the cooling liquid flows along the conduction direction of the one-way valve 3, the movable part moves away under the liquid impact pressure of the cooling liquid, the hollow hole is conducted, and the cooling liquid can pass through. When the cooling liquid flows along the non-conducting direction of the one-way valve 3, the movable part is tightly matched with the hollowed-out hole under the liquid impact pressure of the cooling liquid, and the cooling liquid does not circulate. In this way, the non-return valve 3 ensures that the cooling liquid inside the flow channel structure 2 is directionally circulated. According to q=sv (Q: flow, S: sectional area, v: flow velocity), the flow in the flow channel is constant, and the sectional area of the hollowed-out hole of the one-way valve 3 through which the cooling liquid passes is smaller than the sectional area of the flow channel structure 2, so that the speed of the cooling liquid is increased when the cooling liquid passes through the one-way valve 3, and the cooling liquid circulation is increased, thereby achieving the effect of enhancing heat dissipation.

In one example, the one-way valve 3 may be a tesla valve. As shown in fig. 8, the tesla valve has no moving parts, and unidirectional conduction of liquid can be achieved without inputting energy. The internal partial shape of the flow channel structure 2 can be designed as a tesla valve, the forward flow and the reverse flow of which are greatly different, and referring to the orientation of fig. 8, when the fluid is from right to left, the fluid is divided into a main flow and a sub-flow from the fluid mechanics perspective, and most of the fluid flows along with the main flow, and experiences little resistance and is almost straight-line flow; when the fluid flows from left to right, the direction of the branch flow can generate 180 DEG turning, vortex flow is generated, and capacity loss is caused. Therefore, the Tesla valve can accelerate liquid through a physical structure, so that energy loss of the liquid in transportation is reduced, the cooling liquid speed through the Tesla valve is increased, and the heat dissipation effect is also improved.

In one embodiment of the present disclosure, the liquid cooling plate 100 has a limiting member 6, and the limiting member 6 is used to limit the liquid cooling plate body 1, so that the liquid cooling plate body 1 and the non-vibrating portion of the vibration assembly 4 remain relatively stationary. As shown in fig. 9, the limiting member 6 is disposed on the side of the flow path structure 2 away from the vibration assembly 4, for preventing the flow path structure 2 from shifting toward the side away from the vibration assembly 4. Of course, a fixed connection hole may be formed in the liquid cooling plate body 1, and the non-vibrating portion of the vibration assembly 4 may be fixedly connected with the liquid cooling plate body 1 through the fixed connection hole, so as to achieve the anti-movement effect. Or, on setting up limit structure's basis, be connected through fixed connection hole with the non-vibrating part of vibrating subassembly 4 and liquid cooling board body 1 simultaneously, avoid vibrating subassembly 4 non-vibrating part and liquid cooling board body 1 to be connected not hard up, the vibrating subassembly 4 that causes and the unable contact connection of first flexible wall portion, and then lead to the liquid cooling system to lose the power supply and unable normal operating.

In one embodiment of the present disclosure, the liquid cooling plate body 1 may be made of a rigid material. Such as, but not limited to, metal, ceramic, polycarbonate (PC). The specific material of the liquid cooling plate body 1 can be flexibly selected according to the product requirement and the thermal power of the whole electronic equipment, so that the strength of the liquid cooling plate body 1 is ensured, a good heat dissipation effect is realized, and the liquid cooling plate can be matched with the runner structure 2 to rapidly dissipate heat. The liquid cooling plate body 1 is fixed on the electronic equipment, so that the vibrating surface of the vibrating assembly 4 and the liquid cooling plate body 1 can move relatively. Further, the liquid cooling plate 100 may be configured as a plane as shown in fig. 2 according to the structure of the electronic device, such as the arrangement and distance of the vibration component 4 and the heating component 5, the size of the space inside the device, and the like, so that the cooling liquid of the whole flow channel structure 2 flows unidirectionally in one plane to realize heat dissipation. The cooling liquid cooling device can also be provided as an L-shaped bending plate as shown in fig. 10, and the flow of the cooling liquid is not on the same plane, so that the arrangement of the liquid cooling device is convenient, and the heat dissipation effect is improved. It should be noted that, after the liquid cooling plate 100 is bent in fig. 10, a part of the cooling liquid in the flow channel structure 2 needs to overcome gravity to flow, and the number of the check valves 3 can be increased at the section of the flow channel structure 2 needing to overcome gravity, so as to ensure the unidirectional fluidity of the cooling liquid.

In another embodiment of the present disclosure, the liquid cooling plate body 1 may be made of a flexible material. Aiming at the condition that the internal system of part of the electronic equipment is complex and the relative positions of the heating component 5 and the vibration component 4 are far, the liquid cooling plate 100 can be designed more flexibly, so that the runner structure 2 is in contact with the vibration module of the electronic equipment and the heating component 5 respectively, the heat dissipation effect is achieved, and the environmental applicability of the liquid cooling heat dissipation device is improved. The liquid cooling plate 100 shown in fig. 11 is locally bent to accommodate a heat source, and is more flexible in layout.

In one embodiment of the present disclosure, as shown in fig. 13, a vibration amplifier 10 is disposed between the first flexible wall and the vibration surface of the vibration assembly 4, and the vibration amplifier 10 is used to enhance the vibration amplitude of the first flexible wall. In one example, as shown in fig. 14, the vibration amplifier 10 is a spring vibration amplifier, two ends of the spring are respectively in contact connection with the first flexible wall and the vibration surface of the vibration component 4, and the elastic potential energy of the spring is utilized to enhance the vibration amplitude, so that the vibration amplitude is increased on the basis of original vibration, the first flexible wall is extruded with higher strength, and the purposes of increasing the flow rate of cooling liquid and enhancing heat dissipation are achieved.

In one embodiment of the present disclosure, as shown in fig. 15, the liquid-cooled heat dissipating device further includes a heat sink 8; the heat sink 8 includes a base plate 801 and a plurality of heat dissipating fins 802 arranged on one side of the base plate 801 at a front-rear pitch, and the heat dissipating fins 802 extend in a left-right direction and are flat. In one example, as shown in fig. 16, one side surface or two side surfaces of the heat dissipation fin 802 are provided with raised strips, so that the side surfaces of the heat dissipation fin 802 form a wavy curved surface structure, the contact area with air is increased, and the heat dissipation efficiency is further improved.

In one example, the underside of the substrate 801 extends with a mounting protrusion 803, and the bottom of the mounting protrusion 803 is provided with a connection hole; the liquid cooling plate 100 has a heat dissipation area, and the connection hole at the bottom of the mounting protrusion 803 is used for connecting with the liquid cooling plate body 1 of the heat dissipation area; a heat dissipation gap is formed between the lower surface of the substrate 801 and the liquid-cooled plate body 1 due to the presence of the mounting projections 803. Thus, the heat of the liquid cooling plate body 1 is favorably and rapidly transferred to the cooling fin 8. In one example, two mounting protrusions 803 may be provided, and the mounting protrusions 803 are disposed at positions adapted to the positions of the liquid cooling plate body 1, so that the connection between the heat sink 8 and the liquid cooling plate body 1 is convenient and firm.

In one embodiment of the disclosure, the liquid cooling heat dissipation device further comprises an air cooling component 9; the air cooling assembly 9 is disposed at the left and/or right sides of the heat radiating fins 802 for rapidly discharging heat. The air cooling module 9 may be a device such as a fan that can generate air convection. Through fin 8 and air-cooled subassembly 9, can take away the heat of liquid cooling board 100 heat dissipation area fast, to high-power electronic equipment, this combination mode can more effective realization heat dissipation.

In one embodiment of the present disclosure, as shown in fig. 12, the flow channel structure 2 may further have a second flexible wall disposed opposite the first flexible wall; the liquid-cooled heat sink may include a plurality of stacked liquid-cooled plates 100; the first flexible wall of the first liquid cooling plate is connected with the vibration surface of the vibration assembly 4; in the adjacent two liquid cooling plates 100, the second flexible wall of the former liquid cooling plate is connected with the first flexible wall of the latter liquid cooling plate. In this way, the extrusion action generated by the vibration of the vibration component 4 is conducted to the next liquid cooling plate, so that the cooling liquid in the flow channel structure 2 of the next liquid cooling plate is driven to flow, and the cooling effect is enhanced.

In one embodiment of the present disclosure, as shown in fig. 6, the areas corresponding to the first flexible wall and the second flexible wall are protruded from the surface of the liquid cooling plate body 1. In this way, the loss in the vibration conduction process is reduced, so that the cooling liquid in the flow channel structure 2 of the plurality of laminated liquid cooling plates 100 can be extruded to flow, and further a better liquid cooling effect is exerted.

In one example, the heat generating component 5 of the electronic device is at least partially located between two liquid cooling plates 100. As shown in fig. 12, the circuit board 7 of the electronic device is partially sandwiched between two liquid cooling plates 100, and the heating component 5 on the circuit board 7 is connected with one of the liquid cooling plates, so that heat dissipation can be better realized, and the working temperature of the circuit board 7 is reduced. Further, a plurality of liquid cooling plates 100 are stacked, and a stopper member 6 may be provided on the liquid cooling plate 100 farthest from the vibration module 4 so as to play a stopper role on the plurality of liquid cooling plates 100.

The disclosed embodiments also provide an electronic device that may include the vibration assembly 4 and at least one liquid-cooled heat sink as described above. The electronic equipment comprises the liquid cooling heat radiating device, and also has the effect of the liquid cooling heat radiating device, and the details are not repeated here.

Further, the runner structure 2 of at least one liquid cooling heat sink is disposed corresponding to the heat generating component 5 of the electronic device. The corresponding arrangement can be that the runner structure 2 is in abutting contact with the heating component 5, or that the runner structure 2 is arranged opposite to the heating component 5, namely that the runner structure 2 passes through the side surface of the heating component 5, so that heat generated by the heating component 5 can be conveniently taken away.

In one embodiment of the present disclosure, the electronic device may be a sound box. Of course, the electronic device may be other devices having a vibration assembly, and the flow of the cooling liquid in the flow channel structure can be realized by the vibration of the vibration assembly.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any adaptations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

Claims (16)

1. The liquid cooling heat dissipation device is characterized by being used for electronic equipment, wherein the electronic equipment is provided with a vibration component; the liquid cooling heat dissipation device comprises at least one liquid cooling plate;

the liquid cooling plate comprises a liquid cooling plate body and a flow channel structure arranged on the liquid cooling plate body;

the flow channel structure is filled with cooling liquid; the flow channel structure has a first flexible wall connected to a vibrating surface of the vibrating assembly; the first flexible wall is capable of compressing the cooling liquid in the flow channel structure along with vibration of the vibration assembly to push the cooling liquid to flow.

2. The liquid-cooled heat sink of claim 1, wherein the first flexible wall protrudes from a surface of the liquid-cooled plate body.

3. The liquid-cooled heat sink of claim 1 wherein at least two check valves are disposed within the flow path structure.

4. A liquid cooled heat sink according to claim 3 wherein the one-way valve is a tesla valve.

5. The liquid cooled heat sink of claim 1 wherein the flow channel structure further has a second flexible wall disposed opposite the first flexible wall;

the liquid cooling heat dissipation device comprises a plurality of laminated liquid cooling plates;

the first flexible wall of a first one of the liquid cooling plates is connected with the vibration surface of the vibration assembly; and in the two adjacent liquid cooling plates, the second flexible wall of the former liquid cooling plate is connected with the first flexible wall of the latter liquid cooling plate.

6. The liquid cooled heat sink of claim 5 wherein the heat generating components of the electronic device are at least partially located between two of the liquid cooled plates.

7. The liquid-cooled heat sink according to any one of claims 1 to 6, wherein the flow path structure further has a protruding wall protruding from a surface of the liquid-cooled plate body; the heating component of the electronic device is connected with the convex wall.

8. The liquid cooling heat sink according to any one of claims 1 to 6, wherein the liquid cooling plate body is made of a rigid material; the liquid cooling plate body is fixed to the electronic equipment, so that the vibrating surface of the vibrating assembly and the liquid cooling plate body can move relatively.

9. The liquid-cooled heat sink according to any one of claims 1 to 6, wherein the liquid-cooled plate has a stopper member; the limiting component is used for limiting the liquid cooling plate body, so that the liquid cooling plate body and the non-vibrating part of the vibrating assembly are kept relatively static.

10. The liquid cooling heat sink according to any one of claims 1 to 6, wherein the liquid cooling plate is bendable or is a bent plate.

11. The liquid cooling heat dissipating device according to any one of claims 1 to 6, wherein the flow channel structure comprises a hollowed-out flow channel provided in the liquid cooling plate body, and a flow channel wall covering the hollowed-out flow channel; at least a partial region of the flow channel wall is the first flexible wall.

12. The liquid-cooled heat sink of any one of claims 1-6, wherein a vibration amplifier is disposed between the first flexible wall and the vibration surface of the vibration assembly, the vibration amplifier configured to enhance the vibration amplitude of the first flexible wall.

13. The liquid-cooled heat sink according to any one of claims 1 to 6, further comprising a heat sink;

the radiating fins comprise a base plate and a plurality of radiating fins which are arranged on one side of the base plate at intervals in the front-back direction, extend along the left-right direction and are flat;

at least one connecting hole is formed in the lower side face of the substrate;

the liquid cooling plate is provided with a heat dissipation area, and the connecting hole is used for being connected with the liquid cooling plate body of the heat dissipation area.

14. The liquid cooled heat sink of claim 13, wherein the liquid cooled heat sink further comprises an air cooling assembly;

the air cooling assembly is arranged on the left side and/or the right side of the radiating fins and used for rapidly discharging heat.

15. An electronic device comprising a vibration assembly and at least one liquid-cooled heat sink according to any one of claims 1-14.

16. The electronic device of claim 15, wherein the electronic device is a sound box.