CN117075449B - Exposure debugging device, system and method - Google Patents
Exposure debugging device, system and method Download PDFInfo
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- CN117075449B CN117075449B CN202311334645.4A CN202311334645A CN117075449B CN 117075449 B CN117075449 B CN 117075449B CN 202311334645 A CN202311334645 A CN 202311334645A CN 117075449 B CN117075449 B CN 117075449B
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention relates to the technical field of exposure processing, and particularly discloses an exposure debugging device, an exposure debugging system and an exposure debugging method, wherein the exposure debugging device comprises a light source assembly, a debugging blocking assembly, a lens assembly, a photomask assembly, a projection assembly and a bearing assembly for placing a wafer, which are sequentially arranged; the debugging and blocking assembly comprises a blocking box, a first driving mechanism and a fixing mechanism; the separation box is provided with a plurality of horizontal inserting slots which are vertically communicated, each horizontal inserting slot is slidably provided with optical filters with different filtering wave bands, one side of each optical filter is detachably fixed on the movable end of the first driving mechanism through the fixing mechanism, and the first driving mechanism is used for driving the optical filter fixedly connected with the first driving mechanism to slide in the horizontal inserting slot; the exposure debugging device can generate exposure light rays meeting different debugging requirements according to the debugging requirements so as to perform exposure adjustment test on different exposure conditions.
Description
Technical Field
The present disclosure relates to the field of exposure processing technologies, and in particular, to an exposure debugging device, system, and method.
Background
Integrated circuits are typically made by a lithographic process, including an exposure process, that uses a reticle (or photomask) and an associated light source to transfer a circuit image onto a surface of a semiconductor wafer.
The photolithography process requires coating a photoresist layer on a wafer, exposing the photoresist layer, and then developing the exposed photoresist layer.
Before mass exposure is carried out on photoresists and photomasks with different components, the exposure light needs to be debugged to obtain proper exposure conditions to realize exposure, operators are required to carry out exposure treatment on a plurality of wafers by adopting different equipment in the debugging process, the treatment process is complicated, and different exposure light cannot be generated on a single equipment according to the debugging requirement to carry out the exposure treatment.
In view of the above problems, no effective technical solution is currently available.
Disclosure of Invention
The present application is directed to an exposure and debugging device, system and method for generating exposure light rays meeting different debugging requirements to perform exposure processing on a wafer.
In a first aspect, the present application provides an exposure and debug apparatus, where the exposure and debug apparatus includes a light source assembly, a debug blocking assembly, a lens assembly, a photomask assembly, a projection assembly, and a carrier assembly for placing a wafer, which are sequentially disposed;
the debugging and blocking assembly comprises a blocking box, a first driving mechanism and a fixing mechanism;
the separation box is provided with a plurality of vertical through horizontal inserting sheet grooves, each horizontal inserting sheet groove is slidably provided with optical filters with different filtering wave bands, one side of each optical filter is detachably fixed on the movable end of the first driving mechanism through the fixing mechanism, and the first driving mechanism is used for driving the optical filter fixedly connected with the first driving mechanism to slide in the horizontal inserting sheet groove.
The exposure debugging device can change the type of the optical filter inserted into the blocking box based on the first driving mechanism and the fixing mechanism according to the debugging requirement, so that the exposure debugging device can generate exposure light rays meeting different debugging requirements and can perform exposure adjustment test on different exposure conditions by blocking and filtering light rays generated by the light source assembly based on one or more optical filters.
The exposure debugging device comprises a first driving mechanism, wherein the movable end of the first driving mechanism is connected with a driving baffle plate arranged on one side of the optical filter, and the fixing mechanism comprises a plurality of adsorption assemblies arranged on the driving baffle plate.
In this example, an adsorption component is disposed on the surface of the driving baffle plate corresponding to each optical filter, so that the movable end of the first driving mechanism can be fixedly connected with any optical filter through the driving baffle plate and the fixing mechanism.
The exposure debugging device is characterized in that an elastic mechanism for driving the optical filter to reset and slide is arranged in the horizontal inserting sheet groove.
In a second aspect, the application further provides an exposure and debugging system, the exposure and debugging system comprises an exposure and debugging device, the exposure and debugging device comprises a light source assembly, a debugging blocking assembly, a lens assembly, a photomask assembly, a projection assembly and a bearing assembly for placing a wafer, which are sequentially arranged, and the exposure and debugging device further comprises a controller;
the debugging and blocking assembly comprises a blocking box, a first driving mechanism and a fixing mechanism;
the separation box is provided with a plurality of horizontal inserting sheet grooves which are vertically communicated, each horizontal inserting sheet groove is slidably provided with optical filters with different filtering wave bands, one side of each optical filter is detachably fixed on the movable end of the first driving mechanism through the fixing mechanism, and the first driving mechanism is used for driving the optical filter fixedly connected with the optical filter to slide in the horizontal inserting sheet groove;
the controller is used for controlling the fixing mechanism to select the optical filter to be fixed on the movable end of the first driving mechanism according to exposure conditions;
the controller is also used for controlling the first driving mechanism to drive the optical filter fixedly connected with the first driving mechanism to slide to the inner side of the horizontal inserting sheet groove so as to generate corresponding exposure light to expose the wafer.
According to the exposure debugging system, the types of the optical filters inserted into the blocking box can be changed based on the first driving mechanism and the fixing mechanism according to debugging requirements, so that light generated by the light source assembly is blocked and filtered based on one or more optical filters, and therefore the exposure debugging device can generate exposure light meeting different debugging requirements, and exposure adjustment tests can be conducted according to different exposure conditions; the exposure debugging system can automatically debug exposure according to the pre-input or automatically generated exposure conditions to obtain the photoetching films generated by exposure under various exposure conditions, and the optimal exposure conditions of different photoetching materials can be conveniently determined by developing and image analysis of the wafers after exposure treatment, so that the efficient debugging of the exposure conditions is realized.
The exposure debugging device further comprises a deflection assembly, wherein the deflection assembly is used for driving the bearing assembly to deflect;
the controller is also used for controlling the deflection assembly to drive the bearing assembly to deflect according to exposure position information matched with exposure conditions so as to change the projection position of the exposure light.
The exposure debugging system is provided with the deflection assembly so as to change the exposure surface of the wafer by using the deflection assembly, so that batch exposure processing is realized on different positions of a single wafer, the exposure processing results under different exposure conditions are comprehensively reflected on the surface of the single wafer, and when the exposure processing effects are verified by using an AOI (automated optical inspection) or other inspection modes, images of different areas on the surface of the wafer can be subjected to cross-reference analysis to determine the optimal exposure conditions.
The exposure debugging system is characterized in that the surface of the wafer is divided into a plurality of exposure areas matched with the exposure position information.
The exposure debugging system further comprises a shielding plate and a second driving mechanism, wherein the shielding plate is arranged below the debugging blocking component and is driven by the second driving mechanism to horizontally slide;
the controller is also used for controlling the second driving mechanism to drive the shielding plate to slide so as to shield exposure light projected on the wafer when exposure processing is not needed.
The exposure debugging system is characterized in that the shielding plate is obliquely arranged, the top surface of the shielding plate is provided with a reflecting surface, and the exposure debugging device further comprises a light ray inspection assembly;
the light inspection component is arranged on one side of the debugging blocking component and is used for receiving the reflected light generated by the reflecting surface and detecting wavelength information of the reflected light;
the controller is also used for analyzing whether the exposure light is matched with the exposure condition according to the wavelength information;
the controller is also used for controlling the second driving mechanism to drive the shielding plate to reset when the exposure light is matched with the exposure condition and exposure treatment is needed.
The exposure debugging system comprises exposure conditions including wavelength range information, exposure illuminance information and exposure duration information.
In a third aspect, the present application further provides an exposure debugging method, which is applied in an exposure debugging device, where the exposure debugging device includes a light source assembly, a debugging blocking assembly, a lens assembly, a photomask assembly, a projection assembly, and a carrier assembly for placing a wafer, which are sequentially disposed;
the debugging and blocking assembly comprises a blocking box, a first driving mechanism and a fixing mechanism;
the separation box is provided with a plurality of horizontal inserting sheet grooves which are vertically communicated, each horizontal inserting sheet groove is slidably provided with optical filters with different filtering wave bands, one side of each optical filter is detachably fixed on the movable end of the first driving mechanism through the fixing mechanism, and the first driving mechanism is used for driving the optical filter fixedly connected with the optical filter to slide in the horizontal inserting sheet groove;
the exposure debugging method comprises the following steps:
controlling the fixing mechanism to select the optical filter to be fixed on the movable end of the first driving mechanism according to the exposure condition;
and controlling the first driving mechanism to drive the optical filter fixedly connected with the first driving mechanism to slide to the inner side of the horizontal inserting sheet groove so as to generate corresponding exposure light to expose the wafer.
According to the exposure debugging method, automatic debugging exposure can be performed according to the pre-input or automatically generated exposure conditions, so that the photoetching films generated by exposure under various exposure conditions can be obtained, and the optimal exposure conditions of different photoetching materials can be conveniently determined by developing and image analysis of the wafers subjected to exposure treatment, so that efficient debugging of the exposure conditions is realized.
As can be seen from the foregoing, the present application provides an exposure adjustment device, a system and a method, wherein the exposure adjustment device can change the type of the optical filter inserted in the blocking box based on the first driving mechanism and the fixing mechanism according to the adjustment requirement, so as to block and filter the light generated by the light source assembly based on one or more optical filters, thereby enabling the exposure adjustment device to generate exposure light meeting different adjustment requirements, and performing exposure adjustment test according to different exposure conditions.
Drawings
Fig. 1 is a schematic structural diagram of an exposure adjustment device according to an embodiment of the present application.
Fig. 2 is a schematic structural view of the debug barrier assembly.
Fig. 3 is a schematic cross-sectional structural view of a debug barrier assembly.
Fig. 4 is a schematic diagram of an electrical control structure of an exposure debugging system according to an embodiment of the present application.
Fig. 5 is a flowchart of an exposure debugging method provided in an embodiment of the present application.
Reference numerals: 1. a light source assembly; 2. debugging the barrier component; 3. a lens assembly; 4. a mask assembly; 5. a projection assembly; 6. a carrier assembly; 7. a wafer; 8. a shielding plate; 9. a second driving mechanism; 10. a controller; 11. a light inspection assembly; 12. a deflection assembly; 21. a barrier box; 22. a light filter; 23. a first driving mechanism; 24. a fixing mechanism; 211. a horizontal insert slot; 212. an elastic mechanism; 231. the baffle is driven.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present invention and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.
Referring to fig. 1-3, some embodiments of the present application provide an exposure and debug apparatus, which includes a light source assembly 1, a debug blocking assembly 2, a lens assembly 3, a photomask assembly 4, a projection assembly 5, and a carrier assembly 6 for placing a wafer 7, which are sequentially disposed;
the debugging blocking assembly 2 comprises a blocking box 21, a first driving mechanism 23 and a fixing mechanism 24;
the blocking box 21 is provided with a plurality of horizontal inserting slots 211 which are vertically penetrated, each horizontal inserting slot 211 is slidably provided with a light filter 22 with different filtering wave bands, one side of the light filter 22 is detachably fixed on the movable end of a first driving mechanism 23 through a fixing mechanism 24, and the first driving mechanism 23 is used for driving the light filter 22 fixedly connected with the first driving mechanism to slide in the horizontal inserting slot 211.
Specifically, the debugging blocking component 2, the lens component 3, the photomask component 4, the projection component 5 and the bearing component 6 are sequentially arranged along the emitting direction of the light source component 1, and the light source component 1, the debugging blocking component 2, the lens component 3, the photomask component 4, the projection component 5 and the bearing component 6 are preferably sequentially arranged from top to bottom, wherein the light generated by the light source component 1 forms exposure light after passing through the debugging blocking component 2, the lens component 3, the photomask component 4 and the projection component 5 and irradiates the wafer 7 on the bearing component 6 so as to expose the wafer 7.
More specifically, the mask assembly 4 includes an exposure slit member, a mask plate, and a mask stage for mounting the mask plate, which are disposed in this order from top to bottom, wherein the mask plate has a metal layer for defining the distribution of exposure light to expose the surface of the wafer 7 to form a circuit pattern.
More specifically, the lens assembly 3 includes a cylindrical lens, a zoom lens group, an optical homogenizer, and a coupling light group, which are disposed in this order from the bottom; the projection assembly 5 comprises an objective lens group.
More specifically, the debugging blocking component 2 is used for debugging and limiting the wavelength range of the light generated by the light source component 1, wherein the light source of the light source component 1 is opposite to the through part of the horizontal insert slot 211 of the blocking box 21, and when the optical filter 22 is inserted into the horizontal insert slot 211, the light generated by the light source component 1 can be subjected to filtering treatment so as to filter out the light of the corresponding wavelength range, therefore, the combination of the light source component 1 and the optical filter 22 can simulate the light sources generating different light wave spectrums, and thus, the debugging of exposure light is realized, so that the exposure light meets different exposure conditions.
More specifically, the first driving mechanism 23 and the fixing mechanism 24 are used for driving one or more optical filters 22 to be inserted into the blocking box 21 to perform filtering treatment with different characteristics on the light source, and the fixing mechanism 24 can fix one or more optical filters 22 on the first driving mechanism 23 according to the use requirement, so that the first driving mechanism 23 can simultaneously drive the corresponding optical filters 22 to slide, thereby changing the positions of the optical filters 22 in the blocking box 21.
More specifically, in the embodiment of the present application, the debug blocking component 2 includes a plurality of filters 22 that filter light above different wavelengths and/or a plurality of filters 22 that filter light below different wavelengths and/or a plurality of filters 22 that filter different local bands, so that the wavelength of the light generated by the light source component 1 based on the debug blocking component 2 may be below a specific wavelength or above a specific wavelength or between specific wavelength sections to satisfy different exposure conditions.
More specifically, the filter 22 with high light transmittance is thinner, in order to avoid light refraction caused by deformation when the filter 22 is fixed, the edge of the filter 22 in the embodiment of the present application has a fixing frame for ensuring the flatness of the filter 22, that is, the filter 22 can be fixed on the first driving mechanism 23 through the matching connection of the fixing frame and the fixing mechanism 24, and the filter 22 is slidably connected with the horizontal inserting slot 211 through the fixing frame.
The exposure debugging device of the embodiment of the application can change the type of the optical filter 22 inserted into the blocking box 21 based on the first driving mechanism 23 and the fixing mechanism 24 according to the debugging requirement so as to block and filter the light generated by the light source component 1 based on one or more optical filters 22, thereby enabling the exposure debugging device to generate exposure light meeting different debugging requirements so as to perform exposure adjustment tests aiming at different exposure conditions.
In some preferred embodiments, the first driving mechanism 23 is a linear driving mechanism, such as a cylinder, a hydraulic cylinder, an electric linear module, etc., and in this embodiment, an electric linear module is preferred.
In some preferred embodiments, the movable end of the first driving mechanism 23 is connected to a driving baffle 231 disposed on one side of the optical filter 22, and the fixing mechanism 24 includes a plurality of adsorption assemblies disposed on the driving baffle 231, and each horizontal insert slot corresponds to at least one position of the adsorption assembly.
Specifically, the plate surface of the driving baffle 231 is provided with an adsorption component corresponding to each optical filter 22, so that the movable end of the first driving mechanism 23 can be fixedly connected with any optical filter 22 through the driving baffle 231 and the fixing mechanism 24.
More specifically, the adsorption component is an electrically controlled adsorption device, such as an electrostatic chuck, an air chuck, an electromagnet, and the like, and is used for adsorbing the fixed frame of the optical filter 22 to fix the optical filter 22 on the driving baffle 231, in this embodiment, the adsorption component is preferably an electromagnet, and an iron sheet capable of being magnetically connected with the electromagnet is disposed on the fixed frame of the optical filter 22.
More specifically, a plurality of iron sheets are disposed on the fixing frame of each optical filter 22, and electromagnets matched with the number and the positions of the iron sheets are disposed on the driving baffle 231, so that the optical filters 22 can stably perform linear displacement in the horizontal inserting slots 211 by matching the plurality of iron sheets with the electromagnets.
In some preferred embodiments, an elastic mechanism 212 for driving the optical filter 22 to slide in a reset manner is provided in the horizontal insert slot 211.
Specifically, the first driving mechanism 23 adsorbs and fixes the optical filter 22 on the movable end thereof by the fixing mechanism 24, then drives the optical filter 22 to slide towards the inner side of the horizontal insertion slot 211 (the side of the horizontal insertion slot 211, which is right below the light source assembly 1, is the inner side, and the side, which is far away from the right below the light source assembly 1, is the outer side) to filter the light generated by the light source assembly 1, the optical filter 22 compresses the elastic mechanism 212 when sliding towards the inner side of the horizontal insertion slot 211, when the exposure is finished or the exposure condition is changed (the inserted optical filter 22 needs to be replaced), the fixing mechanism 24 releases the optical filter 22, and the optical filter 22 in the inner side of the horizontal insertion slot 211 resets and slides under the elastic force of the elastic mechanism 212 to return to the outer side of the horizontal insertion slot 211; in some other embodiments, the fixing mechanism 24 can release the optical filters 22 piece by piece to reset the optical filters 22 step by using the elastic mechanism 212, i.e. release one optical filter 22 at a time, so as to gradually expand the band range of the exposure light, thereby meeting the continuously variable band adjustment requirement and improving the adjustment efficiency under the adjustment requirement.
In some preferred embodiments, the elastic mechanism 212 includes a slider slidably mounted in the horizontal insert slot 211 and an elastic member, preferably a spring, having both ends connected to the slider and the slot bottom of the horizontal insert slot 211, respectively.
1-4, some embodiments of the present application further provide an exposure and debug system, where the exposure and debug system includes an exposure and debug device, the exposure and debug device includes a light source component 1, a debug blocking component 2, a lens component 3, a photomask component 4, a projection component 5, and a carrier component 6 for placing a wafer 7, and the exposure and debug device further includes a controller 10;
the debugging blocking assembly 2 comprises a blocking box 21, a first driving mechanism 23 and a fixing mechanism 24;
the blocking box 21 is provided with a plurality of horizontal inserting slots 211 which are vertically penetrated, each horizontal inserting slot 211 is slidably provided with a light filter 22 with different filtering wave bands, one side of the light filter 22 is detachably fixed on the movable end of a first driving mechanism 23 through a fixing mechanism 24, and the first driving mechanism 23 is used for driving the light filter 22 fixedly connected with the first driving mechanism to slide in the horizontal inserting slot 211;
the controller 10 is used for controlling the fixing mechanism 24 to select the optical filter 22 to be fixed on the movable end of the first driving mechanism 23 according to the exposure condition;
the controller 10 is further configured to control the first driving mechanism 23 to drive the optical filter 22 fixedly connected thereto to slide to the inner side of the horizontal insert slot 211 to generate corresponding exposure light for performing an exposure process on the wafer 7.
The exposure debugging system of the embodiment of the application can change the type of the optical filter 22 inserted in the blocking box 21 based on the first driving mechanism 23 and the fixing mechanism 24 according to the debugging requirement so as to block and filter the light generated by the light source component 1 based on one or more optical filters 22, thereby enabling the exposure debugging device to generate exposure light meeting different debugging requirements so as to perform exposure adjustment test for different exposure conditions; the exposure condition is pre-input or automatically generated exposure parameter information to be debugged, and in this embodiment of the present application, the exposure condition may be wavelength range information of exposure light, serial number information related to the optical filter 22, or filtering data information related to the optical filter 22, so that the controller 10 can determine the optical filter 22 to be used according to the filtering condition, and further, in combination with controlling the first driving mechanism 23 and the fixing mechanism 24, move the corresponding optical filter 22 onto a light path that blocks the light generated by the light source assembly 1.
More specifically, the exposure debugging system according to the embodiment of the present application can implement automatic adjustment of exposure light according to exposure conditions, so as to generate exposure light with a wavelength conforming to the exposure conditions to perform exposure processing on the wafer 7.
More specifically, for different lithography materials, the exposure debugging system of the embodiment of the application can automatically debug exposure according to the exposure conditions input in advance or automatically generated so as to obtain the lithography films generated by exposure under various exposure conditions, and the optimal exposure conditions of the different lithography materials can be conveniently determined by developing and image analysis of the wafer 7 after exposure treatment, so that the efficient debugging of the exposure conditions is realized.
More specifically, in the embodiment of the present application, the exposure condition preferably includes at least wavelength range information of the exposure light, and may further include exposure illuminance information and/or exposure duration information.
In some preferred embodiments, the exposure conditions include wavelength range information, exposure illuminance information, and exposure duration information.
Specifically, different exposure illuminance information and different exposure duration information can generate different exposure energies, wherein the controller 10 can generate exposure light corresponding to the exposure illuminance information by changing the operation power of the light source assembly 1, and meanwhile, the exposure energy can be debugged by controlling the exposure light to perform exposure treatment on the wafer 7 in combination with the exposure duration information, so that the exposure debugging system of the embodiment of the application is suitable for more forms of exposure debugging to obtain suitable exposure conditions suitable for corresponding photoresist materials.
In some preferred embodiments, the exposure-debugging device further comprises a deflection assembly 12, wherein the deflection assembly 12 is used for driving the bearing assembly 6 to deflect;
the controller 10 is further configured to control the deflection assembly 12 to drive the bearing assembly 6 to deflect to change the projection position of the exposure light according to exposure position information matched with the exposure condition.
Specifically, the exposure debugging system of the embodiment of the present application is configured to generate corresponding exposure light according to different exposure conditions to perform exposure processing on a wafer 7 to debug and obtain exposure conditions adapted to corresponding lithography materials, and in order to save debugging materials, the exposure debugging system of the embodiment of the present application is configured to set a deflection assembly 12 to change an exposure surface of the wafer 7 by using the deflection assembly 12, so as to implement batch exposure processing on different positions of a single wafer 7, so as to comprehensively reflect exposure processing results under different exposure conditions on a surface of the single wafer 7, and then when the exposure processing results are verified by using AOI inspection or other inspection methods, images of different areas on the surface of the wafer 7 can be analyzed by cross reference to determine optimal exposure conditions.
More specifically, the placement center of the wafer 7 is preferably disposed eccentrically with respect to the center line of the light source generated by the light source module 1, and the deflection module 12 is preferably a servo motor for driving the wafer 7 to rotate to change its position facing the light source module 1.
More specifically, in this embodiment, a plurality of exposure conditions are preset in the controller 10, and after the exposure process of one exposure condition is controlled, the deflection component 12 is controlled to drive the carrying component 6 to deflect and generate corresponding exposure light according to the next exposure condition adjustment to perform the exposure process of the next stage on the wafer 7, until all the exposure condition adjustment is completed or each area of the wafer 7 has completed the exposure process, so as to implement the exposure process of continuous multiple exposure conditions on a single wafer 7.
In some other embodiments, the deflection unit 12 may be replaced by a horizontal movement unit, and the controller 10 controls the horizontal movement unit to drive the carrying unit 6 to move to change the projection position of the exposure light according to the exposure position information matched with the exposure condition.
In some preferred embodiments, the surface of the wafer 7 is divided into a plurality of exposure areas matching the exposure position information.
Specifically, in the embodiment, the exposure debugging system only performs exposure processing on one exposure area in each round, so that the mutual interference of exposure results of different exposure areas is effectively avoided, and the identification of the subsequent exposure processing effect is facilitated.
More specifically, each exposure area has an area mark for distinguishing matching exposure conditions.
More specifically, in some embodiments, a replaceable height-adjustable field stop (not shown) is provided between the mask assembly 4 and the projection assembly 5; the field stop can limit the coverage of the light beam transmitted to the projection assembly 5 through the photomask assembly 4, further limit the size of the projection area of the exposure light projected on the wafer 7, and make the boundary of the projection area of the exposure light on the wafer 7 clearer, so that the mutual influence of the results of different exposure areas is avoided, and in addition, the size of the projection area can be changed by adjusting the height of the field stop.
More specifically, the field stop is one of a rectangular stop, a sector stop, and a triangular stop, and in the embodiment in which the carrier assembly 6 drives deflection based on the deflection assembly 12, the field stop is preferably a sector stop.
In some preferred embodiments, the exposure debugging device further comprises a shielding plate 8 and a second driving mechanism 9, wherein the shielding plate 8 is arranged below the debugging blocking assembly 2, and the second driving mechanism 9 drives the horizontal sliding;
the controller 10 is also used for controlling the second driving mechanism 9 to drive the shielding plate 8 to slide to shield exposure light projected on the wafer 7 when the exposure process is not required.
In particular, the shielding plate 8 is preferably arranged between the commissioning barrier assembly 2 and the lens assembly 3.
More specifically, the second driving mechanism 9 is a linear driving mechanism such as a cylinder, a hydraulic cylinder, an electric linear module, and the like, and in the embodiment of the present application, an electric linear module is preferable.
More specifically, the period in which the exposure process is not required may be one or more of a period in which the filter 22 is required to be replaced according to the exposure condition, a period in which the wafer 7 is driven to deflect, a period after the end of the exposure process, and before the start of the exposure process.
More specifically, the exposure debugging system of the embodiment of the application sets the shielding plate 8 to shield the light, so that the influence on the service life of the light source assembly 1 caused by frequent switching in the continuous exposure process can be avoided, and meanwhile, the light can be shielded timely, the situation that the surface of the wafer 7 is subjected to unexpected overexposure process or the surface of the wafer 7 is subjected to exposure process by unexpected exposure light in the process of switching the optical filter 22 is avoided, so that the exposure process generated by the surface debugging of the wafer 7 is more accurate.
In some preferred embodiments, the shielding plate 8 is arranged obliquely, the top surface is provided with a reflecting surface, and the exposure and debugging device further comprises a light ray inspection assembly 11;
the light checking component 11 is arranged at one side of the debugging blocking component 2 and is used for receiving the reflected light generated by the reflecting surface and detecting the wavelength information of the reflected light;
the controller 10 is further configured to analyze whether the exposure light matches the exposure condition according to the wavelength information;
the controller 10 is also used for controlling the second driving mechanism 9 to drive the shielding plate 8 to reset when the exposure light is matched with the exposure condition and the exposure treatment is required.
Specifically, the light inspection assembly 11 is a photometer or spectrometer that accurately measures the wavelength of reflected light.
More specifically, the exposure debugging system according to the embodiment of the present application further includes a sealed frame (not shown) for preventing the external light from affecting the exposure processing effect and preventing the external light from affecting the detection accuracy of the light inspection assembly 11.
More specifically, the exposure debugging system of the embodiment of the present application uses the light inspection component 11 to verify whether the wavelength of the light point after the filtering process meets the exposure condition, and controls the shielding plate 8 to end the shielding effect to perform the exposure process on the wafer 7 only when the wavelength meets the exposure condition, thereby ensuring that the exposure process effect is more accurate.
When the exposure light does not match the exposure condition, the controller 10 may perform an alarm to stop the exposure process, may record the exposure condition in the unmatched state, and may perform the debugging and exposure process according to the next exposure condition, and in the present embodiment, the latter is preferable.
In a more preferred embodiment, the mismatch between the exposure light and the exposure conditions may be caused by a problem with one or more filters 22, and when the exposure light does not match the exposure conditions, the controller 10 records the exposure conditions in the mismatch state, removes the exposure conditions having a relationship with the exposure conditions in the mismatch state that have a common filter 22, and then performs debugging and exposure processing according to the next exposure condition; this embodiment enables skipping exposure conditions that may involve corresponding filtering problems to avoid performing an ineffective exposure process.
Specifically, the controller 10 is internally provided with serial number information of different optical filters 22 and wavelength information of light passing through, which can analyze the collocation combination of the optical filters 22 according to the wavelength range information of the exposure condition, determine the serial number information of the optical filters 22 to be moved according to the collocation combination, and then control the fixing mechanism 24 to fix the optical filters 22 corresponding to the serial number information on the first driving mechanism 23 according to the serial number information.
More specifically, the light source assembly 1, the first driving mechanism 23, the fixing mechanism 24, the second driving mechanism 9, the light inspection assembly 11 and the deflection assembly 12 are electrically connected to the controller 10.
In a third aspect, referring to fig. 5, some embodiments of the present application further provide an exposure and debug method, which is applied in an exposure and debug apparatus, where the exposure and debug apparatus includes a light source assembly 1, a debug blocking assembly 2, a lens assembly 3, a photomask assembly 4, a projection assembly 5, and a carrier assembly 6 for placing a wafer 7, which are sequentially disposed;
the debugging blocking assembly 2 comprises a blocking box 21, a first driving mechanism 23 and a fixing mechanism 24;
the blocking box 21 is provided with a plurality of horizontal inserting slots 211 which are vertically penetrated, each horizontal inserting slot 211 is slidably provided with a light filter 22 with different filtering wave bands, one side of the light filter 22 is detachably fixed on the movable end of a first driving mechanism 23 through a fixing mechanism 24, and the first driving mechanism 23 is used for driving the light filter 22 fixedly connected with the first driving mechanism to slide in the horizontal inserting slot 211;
the exposure debugging method comprises the following steps:
s1, controlling a fixing mechanism 24 to select an optical filter 22 to be fixed on the movable end of a first driving mechanism 23 according to exposure conditions;
s2, controlling the first driving mechanism 23 to drive the optical filter 22 fixedly connected with the first driving mechanism to slide to the inner side of the horizontal inserting slot 211 so as to generate corresponding exposure light for carrying out exposure treatment on the wafer 7.
According to the exposure debugging method, the type of the optical filter 22 inserted into the blocking box 21 can be changed based on the first driving mechanism 23 and the fixing mechanism 24 according to the debugging requirements, so that the light generated by the light source assembly 1 can be blocked and filtered based on one or more optical filters 22, and the exposure debugging device can generate exposure light meeting different debugging requirements, so that exposure adjustment tests can be carried out according to different exposure conditions; the exposure condition is pre-input or automatically generated exposure parameter information to be debugged, and in this embodiment of the present application, the exposure condition may be wavelength range information of exposure light, serial number information related to the optical filter 22, or filtering data information related to the optical filter 22, so that the controller 10 can determine the optical filter 22 to be used according to the filtering condition, and further, in combination with controlling the first driving mechanism 23 and the fixing mechanism 24, move the corresponding optical filter 22 onto a light path that blocks the light generated by the light source assembly 1.
More specifically, the exposure debugging method according to the embodiment of the present application can implement automatic adjustment of exposure light according to exposure conditions, so as to generate exposure light with a wavelength conforming to the exposure conditions to perform exposure processing on the wafer 7.
More specifically, for different lithography materials, the optimal exposure conditions of the different lithography materials need to be verified, and the exposure debugging method of the embodiment of the application can automatically debug exposure according to the pre-input or automatically generated exposure conditions to obtain lithography films generated by exposure under various exposure conditions, and the optimal exposure conditions of the different lithography materials can be conveniently determined by developing and image analysis of the wafer 7 after exposure treatment, so that efficient debugging of the exposure conditions is realized.
In the description of the present specification, reference to the terms "one embodiment," "certain embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
What has been described above is merely some embodiments of the present invention. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit of the invention.
Claims (5)
1. The exposure debugging system is characterized by comprising an exposure debugging device, wherein the exposure debugging device comprises a light source component, a debugging blocking component, a lens component, a photomask component, a projection component and a bearing component for placing a wafer, which are sequentially arranged, and the exposure debugging device further comprises a controller;
the debugging and blocking assembly comprises a blocking box, a first driving mechanism and a fixing mechanism;
the separation box is provided with a plurality of horizontal inserting sheet grooves which are vertically communicated, each horizontal inserting sheet groove is slidably provided with optical filters with different filtering wave bands, one side of each optical filter is detachably fixed on the movable end of the first driving mechanism through the fixing mechanism, and the first driving mechanism is used for driving the optical filter fixedly connected with the optical filter to slide in the horizontal inserting sheet groove;
the controller is used for controlling the fixing mechanism to select the optical filter to be fixed on the movable end of the first driving mechanism according to exposure conditions;
the controller is also used for controlling the first driving mechanism to drive the optical filter fixedly connected with the first driving mechanism to slide to the inner side of the horizontal inserting sheet groove so as to generate corresponding exposure light to expose the wafer;
the exposure debugging device further comprises a deflection assembly, wherein the deflection assembly is used for driving the bearing assembly to deflect, and the placement center of the wafer and the central line of the light source generated by the light source assembly are eccentrically arranged;
the controller is also used for controlling the deflection assembly to drive the bearing assembly to deflect according to exposure position information matched with exposure conditions so as to change the projection position of the exposure light;
a replaceable height-adjustable view field diaphragm is arranged between the photomask assembly and the projection assembly;
the exposure debugging device further comprises a shielding plate and a second driving mechanism, wherein the shielding plate is arranged below the debugging blocking component and is driven by the second driving mechanism to horizontally slide;
the controller is further used for controlling the second driving mechanism to drive the shielding plate to slide so as to shield exposure light projected on the wafer when exposure processing is not required;
the shielding plate is obliquely arranged, the top surface of the shielding plate is provided with a reflecting surface, and the exposure debugging device further comprises a light ray inspection assembly;
the light inspection component is arranged on one side of the debugging blocking component and is used for receiving the reflected light generated by the reflecting surface and detecting wavelength information of the reflected light;
the controller is also used for analyzing whether the exposure light is matched with the exposure condition according to the wavelength information;
the controller is also used for controlling the second driving mechanism to drive the shielding plate to reset when the exposure light is matched with the exposure condition and exposure treatment is needed.
2. The exposure debug system of claim 1, wherein the wafer surface is divided into a plurality of exposure areas that match exposure position information.
3. The exposure adjustment system according to claim 1, wherein the movable end of the first driving mechanism is connected to a driving baffle plate provided on one side of the optical filter, and the fixing mechanism includes a plurality of adsorption members provided on the driving baffle plate.
4. The exposure and debugging system according to claim 3, wherein an elastic mechanism for driving the optical filter to reset and slide is arranged in the horizontal inserting slot.
5. The exposure debugging system according to any one of claims 1-4, wherein the exposure conditions include wavelength range information, exposure illuminance information, and exposure duration information.
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