CN117059530B - Silicon wafer cleaning tank and cleaning equipment with same - Google Patents
Silicon wafer cleaning tank and cleaning equipment with same Download PDFInfo
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- CN117059530B CN117059530B CN202311309824.2A CN202311309824A CN117059530B CN 117059530 B CN117059530 B CN 117059530B CN 202311309824 A CN202311309824 A CN 202311309824A CN 117059530 B CN117059530 B CN 117059530B
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- driving
- silicon wafer
- roller
- sliding rail
- clamps
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 107
- 239000010703 silicon Substances 0.000 title claims abstract description 107
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 105
- 238000004140 cleaning Methods 0.000 title claims abstract description 78
- 235000012431 wafers Nutrition 0.000 claims abstract description 115
- 238000005507 spraying Methods 0.000 claims abstract description 43
- 230000007246 mechanism Effects 0.000 claims abstract description 22
- 230000000712 assembly Effects 0.000 claims abstract description 18
- 238000000429 assembly Methods 0.000 claims abstract description 18
- 230000005540 biological transmission Effects 0.000 claims description 23
- 238000006243 chemical reaction Methods 0.000 claims description 16
- 238000010008 shearing Methods 0.000 claims description 13
- 230000001360 synchronised effect Effects 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 3
- 230000009471 action Effects 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 239000007921 spray Substances 0.000 description 19
- 230000000694 effects Effects 0.000 description 9
- 238000009434 installation Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 230000033001 locomotion Effects 0.000 description 5
- 210000005056 cell body Anatomy 0.000 description 3
- 150000003376 silicon Chemical class 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
- B08B11/02—Devices for holding articles during cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/102—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention relates to the technical field of semiconductor cleaning equipment, in particular to a silicon wafer cleaning tank and cleaning equipment with the same, wherein the cleaning tank comprises a tank body, a sliding rail, a scissor frame, a driving assembly, a steering mechanism, two spraying assemblies, two swinging assemblies and a plurality of clamps are arranged in the tank body, the driving assembly comprises a fixed end and a movable end, the movable end is driven by the driving assembly to slide, the scissor frame connected with the driving assembly is driven by the movable end, the clamps can be unfolded on the sliding rail at equal intervals and simultaneously rotate under the action of the steering mechanism until the axis direction of a silicon wafer on the clamps is parallel to the extending direction of the sliding rail, and the two spraying assemblies are driven by the two swinging assemblies to swing reciprocally, so that the spraying assemblies can synchronously clean a plurality of silicon wafers at the same time and clean both sides of the silicon wafer, thereby improving the cleaning efficiency of the silicon wafer and reducing the cleaning time of the silicon wafer.
Description
Technical Field
The invention relates to the technical field of semiconductor cleaning equipment, in particular to a silicon wafer cleaning tank and cleaning equipment with the same.
Background
In the wafer production process, the wafer is required to be cleaned, a common cleaning method is to fix the wafer in a cleaning tank, the cleaning liquid is sprayed to the wafer, a spraying device of the cleaning liquid continuously moves to comprehensively clean the wafer, and the device can clean the wafer, but the wafer cannot rotate and can not ensure uniform cleaning; meanwhile, the spray water is directly sprayed to the wafer, and the wafer is easily damaged due to excessive water pressure.
CN103151291B discloses a wafer clamping and rotating device, which comprises a lower substrate for fixing a wafer, wherein the lower substrate is rotatably arranged; the clamping clamp is provided with the hook body extending towards the center of the substrate, the hook body is positioned below the lower substrate, the clamping clamp is driven to move towards the lower substrate and move away from the lower substrate, the clamping clamp can rotate the wafer while clamping the wafer, the cleaning effect of the wafer is improved, the wafer is complicated when the wafer is disassembled and assembled, the burden of a worker is increased, only one wafer can be cleaned at a time, and the efficiency is low;
CN102513302B discloses a spray cleaning tank, which comprises a tank body, wherein a containing cavity, a first bracket, a clamp and a spray pipe are arranged in the tank body, the first bracket is movably arranged in the containing cavity, the clamp is rotatably arranged on the first bracket, and the spray pipe is provided with a spray nozzle facing to a workpiece to be cleaned; the patent can also realize clamping and rotation of the wafer, and the cleaning efficiency is still lower although the clamping and rotation can drive two wafers to be cleaned; the above two patents also have the problem that only one side of the wafer can be cleaned when the wafer is sprayed, and the other side of the wafer can be cleaned after the cleaning of one side of the wafer is completed, so that the cleaning efficiency of the wafer is lower.
Disclosure of Invention
According to the silicon wafer cleaning tank and the cleaning equipment with the same, the movable end of the silicon wafer cleaning tank is driven to slide through the driving component, the movable end drives the scissor frame, the scissor frame drives the clamp to be unfolded on the sliding rail at equal intervals, meanwhile, the clamp rotates under the action of the steering mechanism, the axis direction of the silicon wafer and the extending direction of the sliding rail are in a mutually parallel state, and the swinging component drives the spraying component to swing in a reciprocating manner, so that the spraying component can synchronously clean a plurality of silicon wafers at the same time, and the cleaning efficiency of the silicon wafers is improved; through the transmission assembly on the clamp and the two groups of spraying assemblies in mirror symmetry states, the two sides of the silicon wafer can be cleaned simultaneously while rotating, the efficiency of cleaning the silicon wafer is further improved, and the time of cleaning the silicon wafer is reduced.
In order to solve the problems in the prior art, the silicon wafer cleaning tank comprises a tank body, wherein a sliding rail, a fork shearing frame, a driving assembly, a steering mechanism, two spraying assemblies and a plurality of clamps are arranged in the tank body;
the sliding rail stretches across the center of the groove body, and extends along the length direction of the groove body, and the shearing fork frame is arranged on the sliding rail;
the driving assembly is positioned below the sliding rail, a fixed end fixedly connected with the sliding rail and a movable end capable of sliding along the sliding rail are arranged on the driving assembly, one end of the shearing fork frame is hinged with the fixed end, and the other end of the shearing fork frame is hinged with the movable end;
the clamps are arranged on the shearing fork frame at equal intervals, and all the clamps are provided with transmission assemblies for driving the silicon wafers to rotate;
the steering mechanism is positioned above the sliding rail and is used for synchronously driving all clamps to rotate in the process of moving along with the shearing fork frame;
the two spraying components are in mirror image states and are respectively positioned on two sides of the sliding rail, and swinging components for driving the spraying components to swing in a reciprocating mode are arranged below the two spraying components.
Preferably, the fixture is composed of two semicircular arc-shaped mounting bars, a gap matched with the silicon wafer is reserved between the two mounting bars, a plurality of rotatable roll shafts are arranged between the two mounting bars, the roll shafts are equidistantly distributed along the arc shape of the mounting bars, limiting plates are arranged at the tops of the two mounting bars, and the two limiting plates are arranged in a central symmetry mode.
Preferably, all drive assemblies all include drive roller, driving roller and conversion roller, and drive roller and driving roller are the horizontality respectively and are located two limiting plates of anchor clamps, and the conversion roller is the horizontality and is located the bottom central authorities of anchor clamps, and drive roller, driving roller and conversion roller's axis direction are all parallel to each other with the axis direction of silicon chip, are provided with first hold-in range between drive roller and the conversion roller, are provided with the second hold-in range between driving roller and the conversion roller.
Preferably, the side of drive roller is provided with rather than axis direction mutually perpendicular's power roller, drive roller and power roller all are provided with first bevel gear, and two first bevel gears meshing are connected, are provided with the second bevel gear on the driving roller, and when limiting plate butt on two adjacent anchor clamps, the second bevel gear is connected with the first bevel gear meshing on the power roller, is provided with the first rotatory driving motor that can drive its driving roller pivoted on the anchor clamps that is close to driving assembly one side among all anchor clamps.
Preferably, the steering mechanism comprises a rack and a plurality of first gears, the number of the first gears is the same as that of the clamps and corresponds to that of the clamps one by one, the plurality of first gears are respectively sleeved below the clamps, the rack is positioned on the sliding rail in a horizontal state, and all the first gears are meshed with the rack.
Preferably, the driving assembly comprises a second rotary driving motor, a screw rod and a mounting plate, wherein the mounting plate is fixedly connected to the lower part of the sliding rail, the screw rod is rotatably arranged between the mounting plate and the inner wall of the groove body, the axis of the screw rod is parallel to the extending direction of the sliding rail, the second rotary driving motor is fixedly connected to the outer wall of the groove body, the screw rod is in transmission connection with the output shaft of the second rotary driving motor, and the movable end is sleeved on the screw rod and is in threaded fit with the screw rod.
Preferably, the swing mechanism comprises a swing frame, the two ends of the swing frame are provided with supporting shafts, the swing frame is rotatably arranged in the tank body, a plurality of installation heads are arranged on the swing frame, the spray assembly is provided with pipelines connected with an outer pipe water source and spray pipes corresponding to the installation heads in number one to one, the pipelines are positioned in the tank body in a horizontal state, one ends of the spray pipes are communicated with the pipelines, the other ends of the spray pipes are connected with the installation heads, and all the spray pipes are of telescopic structures.
Preferably, the lower part of the end part of the swing frame is provided with a track, the lower part of the supporting shaft of the swing frame is provided with a driving shaft parallel to the axis of the supporting shaft, the driving shaft is provided with a driving rod, one end of the driving rod far away from the driving shaft is provided with a pulley, and the pulley is in sliding fit with the track.
Preferably, the two rails are respectively positioned at two ends of the swing frame, the two driving shafts are respectively positioned below the two supporting shafts of the swing frame, the two driving shafts are respectively provided with transmission rods, and a connecting shaft is further arranged between pulleys on the two transmission rods.
The invention also provides silicon wafer cleaning equipment, which comprises the silicon wafer cleaning tank.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the movable end of the silicon wafer is driven to slide through the driving component, the movable end drives the scissor frame, the scissor frame drives the clamp to be unfolded on the sliding rail at equal intervals, and simultaneously the clamp rotates under the action of the steering mechanism, so that the axis direction of the silicon wafer and the extending direction of the sliding rail are in a state of being parallel to each other, and the spraying component is driven to swing back and forth through the swinging component, so that the spraying component can clean the silicon wafer better; through the arrangement of the clamp, the shearing fork frame, the driving assembly and the sliding rail, a plurality of silicon wafers can be synchronously cleaned in the cleaning tank, and the cleaning efficiency of the silicon wafers is improved; through the transmission assembly on the clamp and the two groups of spraying assemblies in mirror symmetry states, the two sides of the silicon wafer can be cleaned simultaneously while rotating, the efficiency of cleaning the silicon wafer is further improved, and the time of cleaning the silicon wafer is reduced.
2. According to the invention, the two pulleys are synchronously driven by the connecting shaft, the two connecting rods are driven by the pulleys, and the transmission rod drives the swing frame and simultaneously stirs the cleaning liquid in the tank body, so that when the silicon wafer is soaked, the rapid mixing of the cleaning liquid in the tank body can be improved, and the cleaning effect on the silicon wafer is improved.
Drawings
Fig. 1 is a schematic perspective view of a silicon wafer cleaning tank.
Fig. 2 is a top view of a silicon wafer cleaning tank.
Fig. 3 is a schematic perspective view of the interior of a silicon wafer cleaning tank.
Fig. 4 is a schematic perspective view showing a structure of a silicon wafer cleaning tank when a plurality of jigs are unfolded.
Fig. 5 is a schematic perspective view showing a structure of a silicon wafer cleaning tank when a plurality of jigs are contracted.
Fig. 6 is a schematic view showing a partial perspective structure of a jig and a fork in a silicon wafer cleaning tank.
Fig. 7 is a schematic perspective view of a jig in a silicon wafer cleaning tank.
Fig. 8 is a partial top view of a clamp and fork in a silicon wafer cleaning tank.
Fig. 9 is an enlarged view at a in fig. 4.
Fig. 10 is an enlarged view at B in fig. 8.
Fig. 11 is a schematic perspective view of a spray assembly in a silicon wafer cleaning tank.
Fig. 12 is an enlarged view at C in fig. 11.
The reference numerals in the figures are:
1-a groove body; 11-a slide rail; 12-steering mechanism; 121-a first gear; 122-rack; 13-a scissors fork; 131-a fork lever; 1311-a slider; 14-a drive assembly; 141-a fixed end; 142—a movable end; 143-a second rotary drive motor; 144-screw rod; 1441-mounting plate; 2-clamping; 21-mounting bars; 211-roll shafts; 212-limiting plates; 2121-plug; 2122-jack; 22-a transmission assembly; 221-a drive roller; 2211-a first synchronization belt; 2212—a first bevel gear; 222-driving roller; 2221-second timing belt; 2222-second bevel gear; 2223—a first rotary drive motor; 223-converting roller; 224-power roller; 3-a spray assembly; 31-piping; 311-spraying pipes; 32-a swing assembly; 321-swinging frames; 3211-supporting a shaft; 3212-track; 3213-mounting head; 322-drive shaft; 3221-a drive rod; 3222-pulleys; 3223-a connecting shaft; 323-third rotary drive motor.
Detailed Description
The invention will be further described in detail with reference to the drawings and the detailed description below, in order to further understand the features and technical means of the invention and the specific objects and functions achieved.
As shown in fig. 1 to 5 and 9: a silicon wafer cleaning tank comprises a tank body 1, wherein a sliding rail 11, a scissor frame 13, a driving component 14, a steering mechanism 12, two spraying components 3 and a plurality of clamps 2 are arranged in the tank body 1;
the sliding rail 11 spans the center of the groove body 1, the sliding rail 11 extends along the length direction of the groove body 1, and the scissor frame 13 is arranged on the sliding rail 11;
the driving assembly 14 is positioned below the sliding rail 11, a fixed end 141 fixedly connected with the sliding rail 11 and a movable end 142 capable of sliding along the sliding rail 11 are arranged on the driving assembly 14, one end of the scissor frame 13 is hinged with the fixed end 141, and the other end of the scissor frame 13 is hinged with the movable end 142;
the clamps 2 are arranged on the shearing fork frame 13 at equal intervals, and all the clamps 2 are provided with transmission assemblies 22 for driving the silicon wafers to rotate;
the steering mechanism 12 is positioned above the sliding rail 11, and the steering mechanism 12 is used for synchronously driving all clamps 2 to rotate in the process of moving along with the scissor frame 13;
the two spraying components 3 are respectively positioned at two sides of the sliding rail 11 in a mirror image state, and swinging components 32 for driving the spraying components 3 to swing reciprocally are arranged below the two spraying components 3.
The movable end 142 of the driving assembly 14 is positioned beside the fixed end 141 of the driving assembly in an initial state, so that the scissor frame 13 is in a folded state and positioned on the slide rail 11, the scissor frame 13 can drive the clamps 2 connected with the scissor frame to be close to each other, at the moment, silicon wafers are inserted into the clamps 2, the axial direction of the silicon wafers is in a state of being mutually perpendicular to the extending direction of the slide rail 11, and the silicon wafers are easily placed on the clamps 2 in a concentrated mode through the folded state of the scissor frame 13, so that the silicon wafers can be cleaned conveniently; when the silicon wafer needs to be cleaned, the movable end 142 of the silicon wafer is driven to slide along the length direction of the sliding rail 11 through the driving component 14, the movable end 142 drives the scissor frame 13 connected with the movable end 142 to move, the scissor frame 13 is unfolded on the sliding rail 11, the clamp 2 mounted on the scissor frame 13 is driven to be adjusted at equal intervals, the clamp 2 rotates under the action of the steering mechanism 12 along with the movement of the clamp 2, the rotation of the clamp 2 can drive the rotation of the silicon wafer, the axis direction of the silicon wafer and the extending direction of the sliding rail 11 are in a mutually parallel state, at the moment, the two spraying components 3 are started to clean the silicon wafer, and in order to improve the cleaning effect of the spraying components 3 on the silicon wafer, the swinging component 32 drives the spraying components 3 to swing reciprocally, so that the spraying components 3 can clean the silicon wafer better. In order to further improve the cleaning effect of the silicon wafer, the transmission assembly 22 on the clamp 2 is started, the silicon wafer is driven to rotate on the clamp 2 through the transmission assembly 22, and the silicon wafer can be cleaned more comprehensively by matching with the swing of the spraying assembly 3. Through the arrangement of the clamp 2, the shearing fork frame 13, the driving assembly 14 and the sliding rail 11, a plurality of silicon wafers can be synchronously cleaned in the cleaning tank, and the cleaning efficiency of the silicon wafers is improved; through the transmission assembly 22 on the clamp 2 and the two groups of spraying assemblies 3 in mirror symmetry states, the two sides of the silicon wafer can be cleaned simultaneously while rotating, the efficiency of cleaning the silicon wafer is further improved, and the time for cleaning the silicon wafer is reduced.
As shown in fig. 3 to 8: the fixture 2 is composed of two semicircular arc-shaped mounting strips 21, a gap matched with a silicon wafer is reserved between the two mounting strips 21, a plurality of rotatable roll shafts 211 are arranged between the two mounting strips 21, the roll shafts 211 are equidistantly distributed along the arc shape of the mounting strips 21, limiting plates 212 are arranged at the tops of the two mounting strips 21, and the two limiting plates 212 are arranged in a central symmetry mode.
Through the setting of the installation strip 21 and the roller 211 of two semicircle for the bottom of anchor clamps 2 is hollow out construction, makes spray the subassembly 3 spray the cleaning solution after on the silicon chip, and the cleaning solution that leaves on the silicon chip is difficult to accumulate on anchor clamps 2, makes the cleaning solution on follow-up anchor clamps 2 evacuation more easily, is convenient for later stage to the stoving of silicon chip. Through the setting of roller 211 for drive assembly 22 when driving the silicon chip rotation, the roller 211 can reduce its frictional force with anchor clamps 2 between, makes the silicon chip rotate between two installation bars 21 more easily, is convenient for improve the cleaning performance to the silicon chip, makes spray assembly 3 can more comprehensive clean the silicon chip. Through setting up of limiting plate 212 for after anchor clamps 2 are driven by fork 13 and steering mechanism 12 and expand, the rotation of anchor clamps 2 can drive the removal of limiting plate 212, when the axis of silicon chip is parallel with the extending direction of slide rail 11, limiting plate 212 on two adjacent anchor clamps 2 can be in the same place each other the butt, can inject the position of two adjacent anchor clamps 2 through limiting plate 212 this moment, prevent anchor clamps 2 rotation position skew, guarantee the cleaning performance of spray assembly 3 to the silicon chip on anchor clamps 2, in order to further improve the position after two anchor clamps 2 limiting plate 212 butt, can set up conical plug 2121 and conical jack 2122 respectively on the both ends of anchor clamps 2, make two limiting plate 212 in the butt, plug 2121 can insert in jack 2122, through so further inject the position and the stability of connection between two anchor clamps 2.
As shown in fig. 3 to 10: all drive components 22 all include drive roller 221, driving roller 222 and conversion roller 223, and drive roller 221 and driving roller 222 are the horizontality respectively and are located two limiting plates 212 of anchor clamps 2, and conversion roller 223 is the horizontality and is located the bottom central authorities of anchor clamps 2, and drive roller 221, driving roller 222 and conversion roller 223's axis direction all are parallel to each other with the axis direction of silicon chip, are provided with first hold-in range 2211 between drive roller 221 and the conversion roller 223, are provided with second hold-in range 2221 between driving roller 222 and the conversion roller 223.
When the silicon wafer needs to be driven to rotate, the driving roller 221 is started to drive the first synchronous belt 2211, the driving roller 222 connected with the driving roller 221 is driven by the first synchronous belt 2211, power is transmitted to the driving roller 222 through the second synchronous belt 2221 at the other end of the driving roller 222, the converting roller 223 and the driving roller 221 can drive the silicon wafer located on the clamp 2 through rotation, and anti-slip grooves are formed in the driving roller 221, the driving roller 222 and the converting roller 223 and used for improving friction force between the anti-slip grooves and the silicon wafer and improving transmission effect on the silicon wafer.
As shown in fig. 3 to 10: the driving roller 221 is provided with the power roller 224 mutually perpendicular with its axis direction by the side, driving roller 221 and power roller 224 all are provided with first bevel gear 2212, and two first bevel gears 2212 meshing are connected, be provided with second bevel gear 2222 on the driving roller 222, when limiting plate 212 butt on two adjacent anchor clamps 2, second bevel gear 2222 is connected with the first bevel gear 2212 meshing on the power roller 224, be provided with the first rotary driving motor 2223 that can drive its driving roller 222 rotation on the anchor clamps 2 that are close to the drive assembly 14 one side among all anchor clamps 2.
By starting the first rotary driving motor 2223 on the clamp 2 close to one side of the driving assembly 14, the output shaft of the first rotary driving motor 2223 drives the driving roller 222 to rotate, the driving roller 222 drives the second bevel gear 2222 to rotate, after the axis of the silicon wafer is parallel to the extending direction of the sliding rail 11, the driving roller 222 of the clamp 2 close to one side of the driving assembly 14 can move to the side of the power roller 224 of the clamp 2 adjacent to the driving assembly, because the first bevel gear 2212 is in meshed connection with the second bevel gear 2222, the two first bevel gears 2212 are in meshed connection, the second bevel gear 2222 of the driving roller 222 can transfer power to the first bevel gear 2212 in meshed connection, the driving roller 224 is driven to rotate through the first bevel gear 2212, the power is transferred to the other first bevel gear 2212 through the first bevel gear 2212, the rotation of the driving roller 221 is driven through the first bevel gear 2212, and at the moment, the conversion roller 223 and the driving roller 222 on the adjacent clamp 2 can be driven, the driving assembly 22 on all the clamps 2 can be sequentially driven through the steps, and the cost of driving assembly 22 can be reduced, and all driving devices can be driven by the single driving device 22.
As shown in fig. 2 to 4 and 9: the steering mechanism 12 comprises racks 122 and a plurality of first gears 121, the number of the first gears 121 is the same as that of the clamps 2 and corresponds to that of the clamps 2 one by one, the plurality of first gears 121 are respectively sleeved below the clamps 2, the racks 122 are horizontally positioned on the slide rails 11, and all the first gears 121 are meshed and connected with the racks 122.
The movable end 142 of the driving assembly 14 can drive the scissor frame 13 hinged with the same along the sliding rail 11, the scissor frame 13 drives the clamps 2 connected with the same, the clamps 2 are unfolded at equal intervals along the direction of the sliding rail 11, the movement of the clamps 2 can drive the first gears 121 connected with the clamps, and as the first gears 121 are meshed with the racks 122, all the clamps 2 are simultaneously rotated on the scissor frame 13 when the clamps 2 are unfolded until the axis of a silicon wafer on the clamps 2 is parallel to the extending direction of the sliding rail 11, so that the spraying assembly 3 can conveniently and simultaneously clean two sides of the silicon wafer, and the cleaning efficiency of the silicon wafer is improved.
As shown in fig. 2 to 6 and 9: the driving assembly 14 comprises a second rotary driving motor 143, a screw rod 144 and a mounting plate 1441, wherein the mounting plate 1441 is fixedly connected to the lower portion of the sliding rail 11, the screw rod 144 is rotatably arranged between the mounting plate 1441 and the inner wall of the groove body 1, the axis of the screw rod 144 is parallel to the extending direction of the sliding rail 11, the second rotary driving motor 143 is fixedly connected to the outer wall of the groove body 1, the screw rod 144 is in transmission connection with the output shaft of the second rotary driving motor 143, and the movable end 142 is sleeved on the screw rod 144 and is in threaded fit with the screw rod 144.
The scissors frame 13 is composed of a plurality of fork rods 131, the end parts of two adjacent fork rods 131 are hinged with each other, a sliding block 1311 capable of sliding on the sliding rail 11 is arranged in the center of each fork rod 131, and the clamp 2 is rotatably sleeved on the sliding block 1311. Through starting second rotary driving motor 143, the output shaft of second rotary driving motor 143 can drive the rotation of the lead screw 144 rather than the transmission connection, can drive the removal rather than screw-thread fit's expansion end 142 through the rotation of lead screw 144, drive rather than articulated fork frame 13 through expansion end 142, the clamp 2 that fork frame 13 drove its connection for clamp 2 can be on slide rail 11 equidistant expansion, and the rotation under the effect of steering mechanism 12, make spray assembly 3 can be better clean the silicon chip.
As shown in fig. 1 to 3, 11 and 12: the swing mechanism comprises a swing frame 321, support shafts 3211 are arranged at two ends of the swing frame 321, the swing frame 321 is rotatably arranged in the tank body 1, a plurality of mounting heads 3213 are arranged on the swing frame 321, pipelines 31 connected with an outer pipe water source and spraying pipes 311 corresponding to the mounting heads 3213 in number one to one are arranged on the spraying assembly 3, the pipelines 31 are horizontally positioned in the tank body 1, one ends of the spraying pipes 311 are communicated with the pipelines 31, the other ends of the spraying pipes 311 are connected with the mounting heads 3213, and all the spraying pipes 311 are telescopic structures.
The installation head 3213 connected with the swing frame 321 is driven by the rotation of the swing frame 321, the movement of the installation head 3213 drives the spray pipe 311 connected with the installation head, and the silicon wafer in the tank body 1 is washed through the spray pipe 311. Through the swing of swing frame 321 for shower 311 can be comprehensive clean to the silicon chip, and the setting of pipeline 31 makes it can supply liquid for all shower 311, and the telescopic structure of shower 311 makes the motion of shower 311 can better match swing frame 321, prolongs the life of shower 311, improves the stability of equipment operation.
As shown in fig. 1 to 3, 11 and 12: the lower part of the end of the swinging frame 321 is provided with a track 3212, the lower part of a supporting shaft 3211 of the swinging frame 321 is provided with a driving shaft 322 which is mutually parallel to the axis of the supporting shaft, the driving shaft 322 is provided with a driving rod 3221, one end of the driving rod 3221 far away from the driving shaft 322 is provided with a pulley 3222, and the pulley 3222 is in sliding fit with the track 3212.
The driving shaft 322 drives the driving rod 3221 connected with the driving shaft, the driving rod 3221 rotates by taking the connection point of the driving rod and the driving shaft 322 as the circle center, the driving rod 3221 drives the pulley 3222 connected with the driving rod, the pulley 3222 moves and drives the rail 3212 in sliding fit with the pulley 3222, the rail 3212 drives the swinging frame 321 to swing reciprocally by taking the axis of the driving shaft 322 as the circle center, and therefore the spraying pipe 311 on the swinging frame 321 is driven to swing reciprocally, so that the spraying pipe 311 can clean silicon wafers comprehensively, and the cleaning effect on the silicon wafers is improved.
As shown in fig. 1 to 3, 11 and 12: the two rails 3212 are provided, the two rails 3212 are respectively positioned at two ends of the swinging frame 321, the two driving shafts 322 are also provided, the two driving shafts 322 are respectively positioned below the two supporting shafts 3211 of the swinging frame 321, the two driving shafts 322 are provided with driving rods 3221, and a connecting shaft 3223 is further arranged between pulleys 3222 on the two driving rods 3221.
Be provided with on the outer wall of cell body 1 and drive shaft 322 pivoted third rotary driving motor 323, through the setting of connecting axle 3223 for two transfer lines 3221 can synchronous emergence rotate, make drive shaft 322 more steady to the transmission of swing frame 321, make the stability of the motion of swing frame 321 obtain improving, connecting axle 3223 can stir the cleaning solution in cell body 1 simultaneously, make when the silicon chip soaks, can improve the quick mixing of cleaning solution in the cell body 1, improve the cleaning effect to the silicon chip. A synchronous belt can be arranged between the driving shafts 322 of the two swinging assemblies 32, so that the third rotary driving motor 323 can synchronously drive the driving shafts 322 of the two swinging assemblies 32, and the inclination effect of the spraying assemblies 3 on the two sides of the silicon wafer on the silicon wafer is ensured to be consistent.
The invention also provides silicon wafer cleaning equipment, which comprises the silicon wafer cleaning tank.
The foregoing examples merely illustrate one or more embodiments of the invention, which are described in greater detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (10)
1. The silicon wafer cleaning tank comprises a tank body (1) and is characterized in that a sliding rail (11), a shearing fork frame (13), a driving assembly (14), a steering mechanism (12), two spraying assemblies (3) and a plurality of clamps (2) are arranged in the tank body (1);
the sliding rail (11) spans the center of the groove body (1), the sliding rail (11) extends along the length direction of the groove body (1), and the scissor frame (13) is arranged on the sliding rail (11);
the driving assembly (14) is positioned below the sliding rail (11), a fixed end (141) fixedly connected with the sliding rail (11) and a movable end (142) capable of sliding along the sliding rail (11) are arranged on the driving assembly (14), one end of the shearing fork frame (13) is hinged with the fixed end (141), and the other end of the shearing fork frame (13) is hinged with the movable end (142);
the clamps (2) are arranged on the shearing fork frame (13) at equal intervals, and all the clamps (2) are provided with transmission assemblies (22) for driving the silicon wafers to rotate;
the steering mechanism (12) is positioned above the sliding rail (11), and the steering mechanism (12) is used for synchronously driving all clamps (2) to rotate in the process of moving along with the scissor frame (13);
the two spraying components (3) are in mirror image states and are respectively positioned at two sides of the sliding rail (11), and swinging components (32) for driving the spraying components (3) to swing in a reciprocating manner are arranged below the two spraying components (3).
2. The silicon wafer cleaning tank according to claim 1, wherein the clamp (2) is composed of two semicircular arc-shaped mounting bars (21), a gap matched with the silicon wafer is reserved between the two mounting bars (21), a plurality of rotatable roll shafts (211) are arranged between the two mounting bars (21), the roll shafts (211) are equidistantly distributed along the arc shape of the mounting bars (21), limiting plates (212) are arranged at the tops of the two mounting bars (21), and the two limiting plates (212) are arranged in a central symmetry mode.
3. The silicon wafer cleaning tank according to claim 2, wherein all transmission assemblies (22) comprise a driving roller (221), a transmission roller (222) and a conversion roller (223), the driving roller (221) and the transmission roller (222) are respectively positioned on two limiting plates (212) of the clamp (2) in a horizontal state, the conversion roller (223) is positioned at the bottom center of the clamp (2) in a horizontal state, the axial directions of the driving roller (221), the transmission roller (222) and the conversion roller (223) are parallel to the axial direction of the silicon wafer, a first synchronous belt (2211) is arranged between the driving roller (221) and the conversion roller (223), and a second synchronous belt (2221) is arranged between the transmission roller (222) and the conversion roller (223).
4. A silicon wafer cleaning tank according to claim 3, characterized in that a power roller (224) perpendicular to the axial direction of the driving roller (221) is arranged beside the driving roller (221), the driving roller (221) and the power roller (224) are both provided with first bevel gears (2212), the two first bevel gears (2212) are connected in a meshed manner, a second bevel gear (2222) is arranged on the driving roller (222), when limiting plates (212) on two adjacent clamps (2) are abutted, the second bevel gear (2222) is connected with the first bevel gear (2212) on the power roller (224) in a meshed manner, and a first rotary driving motor (2223) capable of driving the driving roller (222) of the first bevel gear is arranged on a clamp (2) on one side, close to the driving assembly (14), of all the clamps (2).
5. The silicon wafer cleaning tank according to claim 1, wherein the steering mechanism (12) comprises racks (122) and a plurality of first gears (121), the number of the first gears (121) is the same as that of the clamps (2) and corresponds to that of the clamps (2) one by one, the plurality of first gears (121) are respectively sleeved below the clamps (2), the racks (122) are horizontally arranged on the sliding rail (11), and all the first gears (121) are meshed with the racks (122).
6. The silicon wafer cleaning tank according to claim 1, wherein the driving assembly (14) comprises a second rotary driving motor (143), a screw rod (144) and a mounting plate (1441), the mounting plate (1441) is fixedly connected to the lower portion of the sliding rail (11), the screw rod (144) is rotatably arranged between the mounting plate (1441) and the inner wall of the tank body (1), the axis of the screw rod (144) is parallel to the extending direction of the sliding rail (11), the second rotary driving motor (143) is fixedly connected to the outer wall of the tank body (1), the screw rod (144) is in transmission connection with the output shaft of the second rotary driving motor (143), and the movable end (142) is sleeved on the screw rod (144) and is in threaded fit with the screw rod.
7. The silicon wafer cleaning tank according to claim 1, wherein the swinging mechanism comprises a swinging frame (321), supporting shafts (3211) are respectively arranged at two ends of the swinging frame (321), the swinging frame (321) can be rotatably arranged in the tank body (1), a plurality of mounting heads (3213) are arranged on the swinging frame (321), pipelines (31) connected with an outer pipe water source and spraying pipes (311) which are the same in number and in one-to-one correspondence with the mounting heads (3213) are arranged on the spraying assembly (3), the pipelines (31) are horizontally arranged in the tank body (1), one ends of the spraying pipes (311) are communicated with the pipelines (31), the other ends of the spraying pipes (311) are connected with the mounting heads (3213), and all the spraying pipes (311) are of a telescopic structure.
8. The silicon wafer cleaning tank according to claim 7, wherein rails (3212) are arranged below the end portions of the swinging frames (321), driving shafts (322) parallel to the axes of the supporting shafts (3211) of the swinging frames (321) are arranged below the supporting shafts, driving rods (3221) are arranged on the driving shafts (322), pulleys (3222) are arranged at one ends, far away from the driving shafts (322), of the driving shafts (3221), and the pulleys (3222) are in sliding fit with the rails (3212).
9. The silicon wafer cleaning tank according to claim 8, wherein the rails (3212) are two, the two rails (3212) are respectively located at two ends of the swinging frame (321), the driving shafts (322) are also two, the two driving shafts (322) are respectively located below the two supporting shafts (3211) of the swinging frame (321), the driving shafts (322) are both provided with driving rods (3221), and a connecting shaft (3223) is further arranged between the pulleys (3222) on the two driving rods (3221).
10. A silicon wafer cleaning apparatus comprising a silicon wafer cleaning tank as claimed in any one of claims 1 to 9.
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| CN202311309824.2A CN117059530B (en) | 2023-10-11 | 2023-10-11 | Silicon wafer cleaning tank and cleaning equipment with same |
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| CN202311309824.2A CN117059530B (en) | 2023-10-11 | 2023-10-11 | Silicon wafer cleaning tank and cleaning equipment with same |
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| CN117059530B true CN117059530B (en) | 2023-12-08 |
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| CN117293066B (en) * | 2023-11-24 | 2024-01-30 | 西安寰微电子科技有限公司 | Cleaning device for semiconductor silicon wafer |
| CN117936434B (en) * | 2024-03-22 | 2024-05-31 | 芯朋半导体科技(如东)有限公司 | Semiconductor cleaning equipment capable of being flushed bidirectionally |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN214976106U (en) * | 2021-03-25 | 2021-12-03 | 西安奕斯伟硅片技术有限公司 | Pre-cleaning equipment for silicon wafer |
| CN115148639A (en) * | 2022-07-12 | 2022-10-04 | 安徽森米诺智能装备有限公司 | Cross-contamination-free wafer tank type cleaning machine |
| CN116544137A (en) * | 2023-02-24 | 2023-08-04 | 成都尚明工业有限公司 | Wafer cleaning system |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6491046B2 (en) * | 2001-02-23 | 2002-12-10 | Macronix International Co., Ltd. | Vertical batch type wafer cleaning apparatus |
| JP6275155B2 (en) * | 2012-11-28 | 2018-02-07 | エーシーエム リサーチ （シャンハイ） インコーポレーテッド | Semiconductor wafer cleaning method and semiconductor wafer cleaning apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN214976106U (en) * | 2021-03-25 | 2021-12-03 | 西安奕斯伟硅片技术有限公司 | Pre-cleaning equipment for silicon wafer |
| CN115148639A (en) * | 2022-07-12 | 2022-10-04 | 安徽森米诺智能装备有限公司 | Cross-contamination-free wafer tank type cleaning machine |
| CN116544137A (en) * | 2023-02-24 | 2023-08-04 | 成都尚明工业有限公司 | Wafer cleaning system |
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