CN117055717B - Heat dissipation system of expansion card - Google Patents
Heat dissipation system of expansion card Download PDFInfo
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- CN117055717B CN117055717B CN202311317695.1A CN202311317695A CN117055717B CN 117055717 B CN117055717 B CN 117055717B CN 202311317695 A CN202311317695 A CN 202311317695A CN 117055717 B CN117055717 B CN 117055717B
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 31
- 239000007788 liquid Substances 0.000 claims abstract description 165
- 239000012530 fluid Substances 0.000 claims description 21
- 239000002826 coolant Substances 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 5
- 238000001816 cooling Methods 0.000 description 14
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003245 coal Substances 0.000 description 2
- 239000000110 cooling liquid Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the technical field of expansion card heat dissipation, in particular to a heat dissipation system of an expansion card. The system comprises a radiator, a liquid inlet main pipe and a liquid outlet main pipe, wherein the liquid inlet main pipe and the liquid outlet main pipe are respectively provided with connecting pieces which are distributed at intervals, the liquid inlet main pipe and the liquid outlet main pipe are positioned below a main board, the radiator is in contact with a heat source in an expansion card, the liquid inlet and outlet pipe of the radiator is provided with corresponding connecting pieces, the positions of the connecting pieces of the liquid inlet and outlet pipe and the expansion card interface are equal to the relative positions of the connecting pieces of the liquid inlet and outlet main pipe and the expansion card interface, when the expansion card is inserted into the interface, the liquid inlet and outlet pipe of the radiator and the liquid inlet and outlet main pipe of the radiator are simultaneously connected, the effect of one-key pulling and inserting is achieved, and the complex steps that the radiator inlet and outlet pipe is respectively connected after the expansion card is inserted in the prior art are solved.
Description
Technical Field
The invention relates to the technical field of expansion card heat dissipation, in particular to a heat dissipation system of an expansion card.
Background
The expansion card comprises a display card, a network card, a sound card and the like, and a chip is integrated in the expansion card, so that the chip needs to be cooled in order to ensure the normal work of the chip.
At present, a cold plate type liquid cooling radiator is generally selected for heat dissipation of the expansion card, and comprises a cold plate, a liquid inlet pipe communicated with an inlet of the cold plate and a liquid outlet pipe communicated with an outlet of the cold plate, wherein the liquid inlet pipe and the liquid outlet pipe are directly communicated with a cooling device for heat dissipation. The cooling plate is attached to the chip on the expansion card, the cooling plate is connected with the cooling device through a liquid inlet and outlet pipeline, and the cooling device is not in direct contact with the chip. After all expansion cards are inserted into the interfaces, the liquid inlet pipe and the liquid outlet pipe are needed between the cooling device and each cold plate, the layout of the pipelines is disordered, and after the expansion cards are inserted into the interfaces, the cooling device is also needed to be respectively communicated with the liquid inlet pipe and the liquid outlet pipe of the cold plate, so that the radiator is complex in installation steps and difficult to install.
Disclosure of Invention
Aiming at the technical problems, the invention adopts the following technical scheme:
a heat dissipation system of an expansion card, wherein an interface of the expansion card is positioned on a main board, and the heat dissipation system comprises N heat sinks { R 1 ,R 2 ,…,R i ,…,R N One liquid inlet main pipeAnd a main liquid outlet pipe, wherein R i For the i-th expansion card P i P of the radiator i With expansion card interface H i The value range of i is 1 to N, and N is the number of the heat sinks.
R i Comprising a cold plate for containing a cooling medium, a liquid inlet pipe connected with an inlet of the cold plate, and a liquid outlet pipe connected with an outlet of the cold plate, wherein the cold plate is connected with P i A first connector QL having a first fluid connector at the end of the inlet tube i Second connection element QR with second fluid connector at end of liquid outlet pipe i 。
The liquid inlet main pipe and the liquid outlet main pipe are both positioned below the main board, and M third connecting pieces { QF) are arranged at intervals in the extending direction of the liquid inlet main pipe 1 ,QF 2 ,…,QF j ,…,QF M }，QF j For j and QL i The value range of the third connecting piece is 1 to M, and M is more than or equal to N; m fourth connecting pieces { QB) which are distributed at intervals are arranged in the extending direction of the main liquid outlet pipe 1 ,QB 2 ,…,QB j ,…,QB M }，QB j For j and QR i And an adapted fourth connection.
Wherein QL i And H is i Is equal to QF j Interface S with kth expansion card k And QR i And H is i Is equal to QB j And S is equal to k Is used for the relative position of the two parts.
When H is i Insert S k When QL i Simultaneously penetrate through the main board and QF j Connection and QR i Through the main board and QB j Is connected to make the cooling coal pass through the main liquid inlet pipe and R i Is flowed into the cold plate and passes through R i Is flowed out from the liquid outlet pipe and the liquid outlet main pipe.
Compared with the prior art, the heat dissipation system of the expansion card has obvious beneficial effects, by means of the technical scheme, the heat dissipation system of the expansion card can achieve quite technical progress and practicality, has wide industrial utilization value, and has at least the following beneficial effects:
the invention provides a heat dissipation system of an expansion card, which comprises a radiator, a liquid inlet main pipe and a liquid outlet main pipe, wherein the liquid inlet main pipe and the liquid outlet main pipe are respectively provided with connecting pieces which are distributed at intervals, the liquid inlet main pipe and the liquid outlet main pipe are positioned below a main board, when the expansion card is inserted into an interface, the liquid inlet pipe and the liquid outlet main pipe of the radiator are simultaneously connected, the effect of one-key plug-in is achieved, and the complex step that the liquid inlet pipe and the liquid outlet pipe of the radiator are respectively connected after the expansion card is inserted in the prior art is solved. And because the liquid inlet and outlet main pipe is positioned under the main board, and the liquid inlet and outlet pipe and the liquid inlet and outlet main pipe of the radiator respectively penetrate through the main board to be connected, the layout of the pipeline can be tidier.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a heat dissipation system and a motherboard of an expansion card according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a motherboard according to another embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
Example 1
Referring to fig. 1, a heat dissipation system of an expansion card is shown, an interface of the expansion card is located on a motherboard 100, and the heat dissipation system includes N heat sinks { R 1 ,R 2 ,…,R i ,…,R N A main liquid inlet pipe 330 and a main liquid outlet pipe 340, wherein R i For the i-th expansion card P i P of the radiator i Such as expansion card 200, p in fig. 1 i With expansion card interface H i ，H i Such as expansion card interface 210 in fig. 1. Wherein the value range of i is 1 to N, and N is the number of the heat sinks.
Optionally, the expansion card is a PCIE expansion card, a PCI expansion card, an OAM expansion card, or the like. Preferably, the expansion card is a PCIE expansion card. Optionally, the PCIE expansion card is a graphics card, a network card, or a sound card. Preferably, the PCIE expansion card is a graphics card.
Optionally, the interface 110 of the expansion card is a PCIE interface. Optionally, the PCIE interface has a specification of PCIE X1, PCIE X4, PCIE X16, PCIE X32, or the like. It should be noted that, the PCIE interface is a PCIE slot on the motherboard 100, and the PCIE expansion card is inserted into the slot connection motherboard.
It should be noted that the expansion card interface is an expansion card P i Is provided. When the expansion card is a PCIE expansion card, the expansion card interface is a golden finger of the PCIE expansion card. When the expansion card is an OAM expansion card, the expansion card interface is a connector of the OAM expansion card.
Preferably, the radiator is a cold plate type liquid cooling radiator. The radiator is attached to the expansion card, one expansion card is provided with one radiator, and the number of the expansion cards determines the number of the radiators, namely, the maximum value of the number N of the radiators in the system is the total number of PCIE interfaces on the main board.
Further, R i Comprising a cold plate 300 for containing a cooling medium, a liquid inlet pipe 310 connected to an inlet of the cold plate, and a liquid outlet pipe 320 connected to an outlet of the cold plate, wherein the cold plate 300 is connected to P i A first connector QL having a first fluid connector at the end of the inlet tube 310 i Second connection QR with second fluid connector for outlet pipe 320 i ，QL i Such as first connector 311, qr in fig. 1 i And a second connector 321.
Optionally, the cooling medium is one or more of deionized water, pure water and propylene glycol.
Optionally, the liquid inlet pipe 310 and the liquid outlet pipe 320 are connected with a cooling device to form a circulating heat dissipation system. When the heat dissipation system is a heat dissipation system in the server, the liquid inlet main pipe and the liquid outlet main pipe are connected with the cooling tower through the cooling liquid distribution device (Coolant Distribution Units, CDU) to form a circulating heat dissipation system. When the radiator is a heat radiation system in a common computer, the liquid inlet main pipe and the liquid outlet main pipe are connected with the cold row to form a circulating heat radiation system. Preferably, the heat dissipation system is applied to a server, and the liquid inlet main pipe and the liquid outlet main pipe are connected with the cooling tower through a cooling liquid distribution device.
It should be noted that, the cold plate 300 is the most concentrated position of heat source, the cold plate has heat conduction property, the cold plate contacts with the heat source, the liquid in the cold plate absorbs the heat conducted by the heat source, along with the flow of the liquid, the liquid absorbing the heat flows out of the cold plate from the liquid outlet pipe, and the new low-temperature liquid entering the cold plate from the liquid inlet pipe continuously absorbs the heat, so that the circulating cooling medium is formed to take away the heat conducted by the heat source, and the purpose of heat dissipation is achieved.
Optionally, the heat source is a GPU chip, a network card chip, a DSP chip, or the like. Preferably, the heat source is a GPU chip.
Alternatively, the fluid connector is a locking type fluid connector or a blind-mate type fluid connector.
Preferably, the first fluid connector and the second fluid connector are of the same type.
Preferably, the fluid connector is a blind-mate fluid connector, wherein the blind-mate fluid connector comprises a plug and a socket. Wherein the first connecting piece QL of the first fluid connector i The plug can also be a socket. Second connection element QR of a second fluid connector i The plug can also be a socket. The blind-mate fluid connector is also referred to as a leak-free blind-mate quick connector, which is capable of maintaining a seal and being leak-free when mated and unmated.
Optionally, the liquid inlet pipe 310 and the liquid outlet pipe 320 are located at the expansion card interface H i Or the inlet 310 and outlet 320 are on different sides of the expansion card interface. Preferably, the liquid inlet pipe 310 and the liquid outlet pipe320 is located at expansion card interface H i Is the same side of (a).
Further, the main liquid inlet pipe 330 and the main liquid outlet pipe 340 are both disposed below the main board 100, and M third connecting pieces { QF) are disposed at intervals in the extending direction of the main liquid inlet pipe 330 1 ,QF 2 ,…,QF j ,…,QF M }，QF j For j and QL i An adapted third connector (not shown in the figure), j has a value ranging from 1 to M, M being greater than or equal to N; m fourth connectors { QB) are arranged at intervals in the extending direction of the main liquid outlet pipe 340 1 ,QB 2 ,…,QB j ,…,QB M }，QB j For j and QR i A fourth mating connector (not shown).
Alternatively, QF j Through a liquid inlet branch pipe BR j Communicating with a main liquid pipe, BR j Is QF (quad flat No. f) j A liquid inlet branch 331 of (a); QR (quick response) i Through the liquid outlet branch pipe BH j A main liquid outlet pipe BH is communicated j For QR i Is provided with a liquid outlet branch 341.
Wherein the first connector 331 and the third connector constitute a first fluid connector, and the second connector 321 and the fourth connector constitute a second fluid connector. Specifically, when the first connecting piece is a plug, the third connecting piece is a socket matched with the first connecting piece; when the first connecting piece is a socket, the third connecting piece is a plug matched with the first connecting piece. Similarly, when the second connecting piece is a plug, the fourth connecting piece is a socket matched with the second connecting piece; when the second connecting piece is a socket, the fourth connecting piece is a plug matched with the second connecting piece.
The first connecting piece and the second connecting piece of the liquid inlet and outlet pipe of the radiator can be ensured to be respectively inserted into and disconnected from the corresponding third connecting piece and fourth connecting piece on the liquid inlet and outlet main pipe by adopting the fluid connector, so that sealing is ensured to be free from leakage. Meanwhile, when the number of the radiators is smaller than that of the third connecting pieces and the fourth connecting pieces, the third connecting pieces and the fourth connecting pieces which are not connected with the other connecting pieces can be kept sealed and are not leaked, and users can be ensured to freely access expansion cards with corresponding numbers according to requirements.
As a onePreferred embodiment QF j And a j+1th third connecting member QF j+1 First distance d1 between j Equal to S k Interface S with the (k+1) th expansion card k+1 Width D between k . I.e. spacing width d1 j For the width D between two adjacent expansion card interfaces k The interval standard of the third connecting piece is matched with the interval standard of the expansion card interface, and the structure distribution is more regular.
As a preferred embodiment, QB j And j+1th fourth connecting member QB j+1 Second distance d2 between j Equal to d1 j 。
As a preferred embodiment, the first distance d1 j To extend the minimum standard distance between the card interfaces. Optionally, the minimum standard distance is an interface width of the expansion card. The distance between the third connecting pieces is the minimum standard distance, or the distance between the fourth connecting pieces is the minimum distance, so that the third connecting pieces can be matched with all mainboards adopting standard expansion card interfaces, and because the distance between the adjacent expansion card interfaces on the mainboards is X times of the minimum standard distance, the value of X is a positive integer, when the distance between the adjacent expansion card interfaces on the mainboards is greater than the minimum standard distance, a user can communicate the corresponding connecting pieces on the liquid inlet and outlet main pipe according to the actual distance.
It can be understood that the plurality of expansion cards share the same liquid inlet main pipe and liquid outlet main pipe, so that the layout of the heat dissipation system is simplified, the layout of the heat dissipation system is tidier, and the hardware resource consumption of the system is further reduced.
Further, QL i And H is i Is equal to QF j Interface S with kth expansion card k And QR i And H is i Is equal to QB j And S is equal to k Is used for the relative position of the two parts.
As a preferred embodiment, the relative position is the direction and distance relative to the reference point. Alternatively, the reference point is when H i Insert S k Time H i And S is k Is a coincident position point of any one of the above. The relative positions are equal in opposite directions and distances, respectively. Relative to each otherEqual positions can be ensured at H i Alignment S k When QL i Alignment QF j And QR i Alignment QB j 。
Further, when H i Interface S for aligning kth expansion card k When QL i Projection point and QF on main board j The projection points on the main board are coincident, and QR i Projection point and QB on main board j The projection points on the main board coincide.
It should be noted that, when the expansion card is inserted into the interface of the expansion card, the liquid inlet pipe and the liquid outlet pipe of the radiator on the expansion card need to be simultaneously communicated with the liquid inlet main pipe and the liquid outlet main pipe below the main board respectively. Therefore, when the expansion card is aligned to the expansion card interface, the first connecting piece is simultaneously aligned to the third connecting piece of the liquid inlet main pipe, and the second connecting piece is simultaneously aligned to the fourth connecting piece of the liquid outlet main pipe. That is, the projection points of the first connecting piece and the third connecting piece coincide and the projection points of the second connecting piece and the fourth connecting piece coincide.
As a preferred embodiment, a first through hole and a second through hole are arranged on the main board, the first through hole is used for enabling a liquid inlet pipe or BR of the radiator j Through the first through hole is positioned at the point of H i Alignment S k QL of time liquid inlet pipe i The position of the projection point on the main board; the second through hole is used for enabling the liquid outlet pipe or BH of the radiator j Through the second through hole is positioned at the point of H i Alignment S k QR of time-out liquid pipe i The location of the projected point on the motherboard.
It should be noted that, a gap is provided between the main board and the chassis housing, and the liquid inlet and outlet main pipe is arranged in the gap under the main board, so that the gap can be fully utilized, and the layout of the heat dissipation system in the chassis can be further tidy.
Alternatively, when H i Alignment S k When the liquid inlet main pipe and the liquid outlet main pipe are positioned at S k Or the main liquid inlet pipe and the main liquid outlet pipe are positioned at S k Is provided. It can be understood that the liquid inlet main pipe is communicated with the liquid inlet pipe of the radiator, and the liquid outlet main pipe is communicated with the liquid outlet pipe of the radiatorTherefore, the relative positions of the liquid inlet main pipe and the liquid outlet main pipe are matched with the positions of the liquid inlet pipe and the liquid outlet pipe of the radiator.
Further, when H i Insert S k When QL i Through QL on motherboard i Position of projection point and QF j Connection and QR i Passing through QR on motherboard i Position of projection point and QB j Is connected to make the cooling coal pass through the main liquid inlet pipe and R i Is flowed into the cold plate and passes through R i Is flowed out from the liquid outlet pipe and the liquid outlet main pipe.
It will be appreciated that when H i Insert S k At the same time as QL i And QF (quad Flat No lead) j Connection and QR i With QB j The connection makes the liquid inlet and outlet pipe and main pipe of the radiator connected while inserting the expansion card into the interface, and achieves the effect of one-key plug.
As a preferred embodiment, the length of the main liquid inlet pipe is as follows: is greater than (M-1) x d1 j And is smaller than the width U of the main board, which is perpendicular to the extending direction of the expansion card interface. Similarly, the length of the liquid outlet main pipe meets the following conditions: greater than (M-1) x d2 j And is smaller than the width U of the motherboard.
Optionally, the lengths of the liquid inlet main pipe and the liquid outlet main pipe may be the same, and the lengths of the liquid inlet main pipe and the liquid outlet main pipe may be different. Preferably, the lengths of the liquid inlet main pipe and the liquid outlet main pipe are the same.
As a preferred embodiment, the liquid inlet main pipe and the liquid outlet main pipe comprise fixed pipe sections and adjustable pipe sections, wherein the length L1 of the fixed pipe sections meets the following conditions: l1 is more than or equal to (M-1) x d1 j And L1 is less than U, and the adjustable pipe section is a pipeline with adjustable length.
As a preferred embodiment, the adjustable pipe section is a flexible pipe. Optionally, the flexible tube is a corrugated tube or a flexible rubber hose.
It should be noted that, for the fixed pipe section of the liquid inlet main pipe, the extending direction of the fixed pipe section of the liquid inlet main pipe is perpendicular to the extending direction of the interface of the expansion card, when each expansion card is aligned with the interface, the first connecting piece of the radiator is simultaneously aligned with the third connecting piece of the liquid inlet main pipe, and the second connecting piece of the radiator is simultaneously aligned with the fourth connecting piece of the liquid outlet main pipe; when a user needs to insert an expansion card, the expansion card can be inserted into an interface of any expansion card on the main board, and a liquid inlet pipe of the radiator can be communicated with a liquid inlet main pipe and a liquid outlet pipe of the radiator can be simultaneously communicated with a liquid outlet main pipe.
The heat radiation system of the expansion card comprises a radiator and a liquid inlet and outlet main pipe, wherein the liquid inlet and outlet main pipe is provided with connecting pieces which are distributed at intervals, the liquid inlet and outlet main pipe is positioned under a main board, the radiator is in contact with a heat source in the expansion card, the liquid inlet and outlet pipe of the radiator is provided with corresponding connecting pieces, the position of a connecting piece of the liquid inlet and outlet pipe and an interface of the expansion card is equal to the relative position of the connecting piece of the liquid inlet and outlet main pipe and the interface of the expansion card, and therefore when the expansion card is inserted into the interface, the liquid inlet and outlet pipe of the radiator and the liquid inlet and outlet main pipe of the radiator are also connected at the same time, the effect of one-key plug is achieved, and the complex step that the liquid inlet and outlet pipe of the radiator is respectively connected after the expansion card is inserted in the prior art is solved. And because the liquid inlet and outlet main pipe is positioned under the main board, and the liquid inlet and outlet pipe and the liquid inlet and outlet main pipe of the radiator respectively penetrate through the main board to be connected, the layout of the pipeline can be tidier.
Based on the same inventive concept as the first embodiment, the second embodiment of the present invention also provides a motherboard.
Example two
A motherboard includes R interfaces { T } of expansion cards 1 ,T 2 ,…,T r ,…,T R }, T therein r The value range of R is 1 to R, and R is the number of interfaces of the expansion card; t (T) r Projection area SH comprising expansion card on main board r And SH r Excluding expansion card interface T r Is a region of (a) in the above-mentioned region(s).
Referring to fig. 1 and 2, the motherboard 100 includes an interface 110 of an expansion card, a projection area 220 of the expansion card on the motherboard, and a first through hole 120 and a second through hole 130 in the projection area 220. T is the same as r Is an identifier of the interface 110. SH r Is an identifier of the projection area 220. H1H 1 d H2 is an identifier of the first via 120 f Is an identifier of the second via 130.
As a preferred embodiment, the area SH is projected r Is the length of the expansion card minus the length of the expansion card interface. The length of the expansion card depends on the specification of the expansion card. The alternatives and preferred embodiments of the expansion card are the same as those of the first embodiment, and refer to the related description in the first embodiment. Preferably, when the expansion card is a PCIE expansion card, the interface of the expansion card is a PCIE display card interface, and the expansion card is a PCIE display card. Wherein, for example, the length of the pci ex4 interface is 39mm, the length of the pci ex8 interface is 56mm, and the length of the pci ex16 interface is 89mm. The specification of PCIE display cards comprises full-length cards and half-length cards; wherein, the maximum length of the full-length card is 312.00mm, and the maximum length of the half-length card is 167.65mm.
As a preferred embodiment, the area SH is projected r Is the maximum length of the expansion card minus the length of the expansion card interface. Wherein the maximum length of the expansion card is the standard length of the maximum specification of the expansion card. For example, the maximum length of the full-length card of the PCIE graphics card is 312.00mm.
As a preferred embodiment, the area SH is projected r The width of which is equal to the interface width of the expansion card.
Specifically, the projection area SH r Comprises a first projection area SH1 r And a second projection area SH2 r . It should be noted that, the size of the expansion card is larger than the size of the expansion card interface, and the expansion card interface of the expansion card is not located at the end of the expansion card, so that after the expansion card is inserted through the expansion card interface and aligned with the expansion card interface, the projection area of the expansion card on the motherboard is divided into a first projection area SH1 by the expansion card interface r And a second projection area SH2 r 。
Further, the motherboard further comprises D first through holes { H1 } 1 ,H1 2 ,…,H1 d ,…,H1 D And F second through holes { H2 }, respectively 1 ,H2 2 ,…,H2 f ,…,H2 F }, wherein H1 is d D is the D first through holes, the D is the number of the first through holes and is in the range of 1 to D, and H2 f For the F second through holes, the value range of F is 1 to F, and F is the number of the second through holesAn amount of; where f=d.
Optionally, a first through hole H1 d And a second through hole H2 f The pore diameters of (2) may be the same or different. Preferably, the first through hole H1 d And a second through hole H2 f The pore diameters of the first through holes H1 are the same d And a second through hole H2 f The bore diameter of the third or fourth mating connector is equal to the maximum outer diameter of the fourth connector.
As a preferred embodiment, a third connecting piece is disposed in the first through hole, and a fourth connecting piece is disposed in the fourth through hole, wherein the third connecting piece and the fourth connecting piece are plugs or sockets of the fluid connector, and the third connecting piece and the fourth connecting piece may be the same or different. Optionally, the first through hole is welded with the third connecting piece, and the fourth through hole is welded with the fourth connecting piece. The third connecting piece and the fourth connecting piece are described in detail in the first embodiment, and are not described in detail.
As a preferred embodiment, please refer to fig. 2, the projection area SH r Comprises a first projection area SH1 r And a second projection area SH2 r First through hole H1 d And a second through hole H2 f Respectively in different projection areas. Preferably, the first through hole H1 d Is located in the first projection area SH1 r Second through hole H2 f Located in the second projection area SH2 r 。
As a preferred embodiment, the first through hole H1 d And a second through hole H2 f While being located in the same projection area. Optionally, a first through hole H1 d And a second through hole H2 f Located at SH1 r Or SH2 r 。
Further, H1 d And H2 f Located at SH r And the p-th first through hole H1 p And the q-th second through hole H2 q Not located at SH r Wherein p has a value ranging from 1 to D and d.noteq.p, q has a value ranging from 1 to F and f.noteq. In SH r Comprises a first through hole and a second through hole, wherein the first through hole is used for providing a communication passage for a liquid inlet pipe and a liquid inlet main pipe of a radiator of an expansion card, and the second through hole is used for providing a communication passage for a liquid inlet pipe and a liquid inlet main pipe of the radiator of the expansion cardThe holes are used for providing communication passages for the liquid outlet pipe and the liquid outlet main pipe of the radiator of the expansion card, so that the radiating system and the expansion card realize the effect of one-key plug and pull and the distribution of pipelines in the radiating system is tidier.
Further, H1 d 、H1 p And the e-th first through hole H1 e Is positioned on the same straight line, wherein the value range of e is 1 to D, and e is not equal to p not equal to D; h2 f 、H2 q And a w second through hole H2 w In the same straight line, wherein the value range of w is 1 to F, and w is not equal to q not equal to F. All the first through holes are positioned on the same straight line, and all the second through holes are positioned on the same straight line, so that the layout of the pipeline is more reasonable and concise.
In summary, the embodiment of the invention provides a motherboard, which includes a plurality of interfaces of expansion cards, wherein a projection area of each expansion card on the motherboard includes a first through hole and a second through hole, the first through holes in different expansion cards are positioned on the same straight line, and the second through holes are positioned on the same straight line.
While certain specific embodiments of the invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the invention. Those skilled in the art will also appreciate that many modifications may be made to the embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (10)
1. A heat dissipation system of an expansion card is characterized in that an interface of the expansion card is positioned on a main board, and the heat dissipation system comprises N heat sinks { R 1 ,R 2 ,…,R i ,…,R N A main liquid inlet pipe and a main liquid outlet pipe, wherein R i For the i-th expansion card P i P of the radiator i With expansion card interface H i The value range of i is 1 to N, and N is the number of the radiators;
R i comprising a cold plate for containing a cooling medium, a liquid inlet pipe connected with an inlet of the cold plate, and a liquid outlet pipe connected with an outlet of the cold plate, wherein the cold plate is connected with P i A first connector QL having a first fluid connector at the end of the inlet tube i Second connection element QR with second fluid connector at end of liquid outlet pipe i ；
The liquid inlet main pipe and the liquid outlet main pipe are both positioned below the main board, and M third connecting pieces { QF) are arranged at intervals in the extending direction of the liquid inlet main pipe 1 ,QF 2 ,…,QF j ,…,QF M }，QF j For j and QL i The value range of the third connecting piece is 1 to M, and M is more than or equal to N; m fourth connecting pieces { QB) which are distributed at intervals are arranged in the extending direction of the main liquid outlet pipe 1 ,QB 2 ,…,QB j ,…,QB M }，QB j For j and QR i An adapted fourth connection;
wherein QL i And H is i Is equal to QF j Interface S with kth expansion card k And QR i And H is i Is equal to QB j And S is equal to k Is a relative position of (2);
when H is i Insert S k When QL i Simultaneously penetrate through the main board and QF j Connection and QR i Through the main board and QB j Is connected to make the cooling medium pass through the main liquid inlet pipe and R i Is flowed into the cold plate and passes through R i Is flowed out from the liquid outlet pipe and the liquid outlet main pipe.
2. The heat dissipating system of claim 1, wherein said QF j And a j+1th third connecting member QF j+1 First distance d1 between j Equal to S k Interface S with the (k+1) th expansion card k+1 Width D between k 。
3.The heat dissipation system of claim 2, wherein the QB j And j+1th fourth connecting member QB j+1 Second distance d2 between j Equal to d1 j 。
4. The heat dissipation system of claim 2, wherein the first distance d1 j To extend the minimum standard distance between the card interfaces.
5. The heat dissipation system of claim 2, wherein the length of the liquid inlet main tube satisfies: is greater than (M-1) x d1 j And is smaller than the width U of the main board, which is perpendicular to the extending direction of the expansion card interface.
6. The heat dissipation system of claim 5, wherein the liquid inlet main pipe and the liquid outlet main pipe each comprise a fixed pipe section and an adjustable pipe section, wherein a length L1 of the fixed pipe section satisfies: l1 is more than or equal to (M-1) x d1 j And L1 is less than U, and the adjustable pipe section is a pipeline with adjustable length.
7. The heat dissipating system of claim 6, wherein said adjustable tube segment is a flexible tube.
8. The heat dissipating system of claim 1, wherein said QF j Through a liquid inlet branch pipe BR j And is communicated with the liquid inlet main pipe.
9. The heat dissipating system of claim 1, wherein the liquid inlet and outlet pipes are located at the expansion card interface H i Is positioned at the same side of S k Is the same side of (a).
10. The heat dissipating system of claim 1, wherein the relative position is a direction and distance relative to a reference point, wherein the reference point is when H i Insert S k Time H i And S is k Is a coincident position point of any one of the above.
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