CN117042340A - Manufacturing method of ceramic copper-clad plate - Google Patents
Manufacturing method of ceramic copper-clad plate Download PDFInfo
- Publication number
- CN117042340A CN117042340A CN202311178140.3A CN202311178140A CN117042340A CN 117042340 A CN117042340 A CN 117042340A CN 202311178140 A CN202311178140 A CN 202311178140A CN 117042340 A CN117042340 A CN 117042340A
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- Prior art keywords
- layer
- copper
- ceramic
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- processing
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Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 64
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 72
- 229910052802 copper Inorganic materials 0.000 claims abstract description 72
- 239000010949 copper Substances 0.000 claims abstract description 72
- 238000005219 brazing Methods 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 21
- 238000003486 chemical etching Methods 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 10
- 238000005530 etching Methods 0.000 claims abstract description 8
- 239000000126 substance Substances 0.000 claims abstract description 4
- 238000003466 welding Methods 0.000 claims description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 238000003754 machining Methods 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 99
- 239000002002 slurry Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Abstract
The invention relates to the field of multilayer ceramic copper clad laminate, in particular to a pattern engraving treatment method of a ceramic copper clad laminate, thereby obtaining a ceramic copper clad laminate manufacturing method with better quality, which comprises the following steps: a. preparing materials: the ceramic layer and the copper layer are welded into a whole through a brazing layer; b. and (3) pattern engraving: a reserved copper layer is arranged between the bottom of the processing groove and the closest brazing layer below the processing groove, and the bottom of the reserved copper layer is a reserved brazing layer; c. chemical etching protection treatment: firstly, applying and protecting the copper layer on the outermost layer by using a photosensitive dry film; d. and (3) treating a reserved copper layer: processing and disposing the reserved copper layer by using a chemical copper etching method, obtaining a bare reserved braze layer, and removing the protected photosensitive dry film after processing is completed; e. and (3) processing a reserved brazing layer: and etching the exposed reserved braze layer by using a chemical etching method, and finally obtaining the exposed ceramic layer.
Description
Technical Field
The invention relates to the field of multilayer ceramic copper-clad plates, in particular to a method for manufacturing a ceramic copper-clad plate.
Background
Multilayer circuit boards are very common in the field of PCBs, typically 10-layer or even 20-layer circuit boards, and are a well-established product. The ceramic copper-clad plate product is mainly applied to the field needing to bear high voltage and large current, such as power conversion devices and the like, and is usually a single-layer ceramic double-sided circuit product. In the actual production and manufacturing process, the ceramic is not subjected to CNC precision machining treatment generally, so that the product quality of the final ceramic copper-clad plate is difficult to ensure.
Disclosure of Invention
The invention aims to solve the technical problem of providing a pattern engraving treatment method for a ceramic copper-clad plate, so as to obtain a manufacturing method for the ceramic copper-clad plate with better quality.
The technical scheme adopted for solving the technical problems is as follows: the manufacturing method of the ceramic copper-clad plate comprises the following steps:
a. preparing materials: the material comprises at least two ceramic layers and at least three copper layers, wherein the ceramic layers and the copper layers are arranged in a staggered and laminated mode, and the ceramic layers and the copper layers are welded into a whole through brazing layers;
b. and (3) pattern engraving: downwards engraving and processing a processing groove from the copper layer at the outermost layer, wherein the processing groove penetrates through at least one copper layer and at least one ceramic layer, the bottom of the processing groove is arranged in one copper layer, a reserved copper layer is arranged between the bottom of the processing groove and the brazing layer closest to the bottom of the processing groove, and the bottom of the reserved copper layer is a reserved brazing layer;
c. chemical etching protection treatment: firstly, applying and protecting the copper layer on the outermost layer by using a photosensitive dry film;
d. and (3) treating a reserved copper layer: processing and disposing the reserved copper layer by using a chemical copper etching method, obtaining a bare reserved braze layer, and removing the protected photosensitive dry film after processing is completed;
e. and (3) processing a reserved brazing layer: and etching the exposed reserved braze layer by using a chemical etching method, and finally obtaining the exposed ceramic layer.
Further, in the step a, the welding method that the ceramic layer and the copper layer are welded into a whole through the brazing layer is as follows: the ceramic layer and the copper layer are cleaned through surface pretreatment, active metal brazing slurry is printed or sprayed on two sides of the ceramic layer and dried, and a cleaned copper layer is arranged on two sides of each ceramic layer with the brazing slurry until the layers are laminated to the required layers, and then the ceramic layers are integrally placed in a brazing furnace for high-temperature welding.
Further, in the step a, the material of the ceramic layer includes at least one of alumina, toughened alumina, aluminum nitride, silicon nitride or silicon carbide.
Further, in the step b, the thickness range of the reserved copper layer is below 50 micrometers.
In the step b, the pattern carving treatment mode is a computer digital control precision machining mode, and the adopted cutter is a flat-bottom diamond cutter.
The beneficial effects of the invention are as follows: during actual manufacturing, a processing groove is processed firstly to serve as a space foundation for subsequent treatment, then a reserved copper layer and a reserved brazing layer below the processing groove are sequentially processed, and finally the ceramic layer is exposed at the bottom of the processing groove. The method not only well protects the final exposed ceramic layer, but also can well realize the treatment of the multilayer ceramic copper-clad plate. The invention is especially suitable for the manufacturing process of the ceramic copper-clad plate.
Drawings
Fig. 1 is a schematic cross-sectional view of a multilayer ceramic copper clad laminate of the present invention.
Fig. 2 is a schematic view of the processing groove engraved on the basis of fig. 1.
Fig. 3 is a schematic view of the outermost copper layer applied with a photosensitive dry film for protection on the basis of fig. 2.
Fig. 4 is a schematic view of the processing of the pre-formed copper layer on the basis of fig. 3.
Fig. 5 is a schematic view of the pre-braze layer being disposed of on the basis of fig. 4.
Marked in the figure as: ceramic layer 1, copper layer 2, processing groove 20, reserved copper layer 21, reserved braze layer 22, exposed ceramic layer 23, braze layer 3, photosensitive dry film 4.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
The manufacturing method of the ceramic copper-clad plate shown in fig. 1 to 5 comprises the following steps:
a. preparing materials: the material comprises at least two ceramic layers 1 and at least three copper layers 2, wherein the ceramic layers 1 and the copper layers 2 are arranged in a staggered and laminated mode, and the ceramic layers 1 and the copper layers 2 are welded into a whole through a brazing layer 3; b. and (3) pattern engraving: downwards engraving and processing a processing groove 20 from the copper layer 2 at the outermost layer, wherein the processing groove 20 penetrates through at least one copper layer 2 and at least one ceramic layer 1, the bottom of the processing groove 20 is arranged in one copper layer 2, a reserved copper layer 21 is arranged between the bottom of the processing groove 20 and the brazing layer 3 closest to the bottom of the processing groove 20, and a reserved brazing layer 22 is arranged at the bottom of the reserved copper layer 21; c. chemical etching protection treatment: firstly, the copper layer 2 on the outermost layer is applied and protected by using a photosensitive dry film 4; d. and (3) treating a reserved copper layer: processing and disposing the reserved copper layer 21 by using a chemical copper etching method to obtain a bare reserved braze layer 22, and removing the protected photosensitive dry film 4 after the processing is completed; e. and (3) processing a reserved brazing layer: the bare pre-braze layer 22 is etched away by chemical etching and finally the bare ceramic layer 23 is obtained. In general, the material of the ceramic layer 1 may preferably include at least one of alumina, toughened alumina, aluminum nitride, silicon nitride, or silicon carbide.
In addition, in the step b, the pattern engraving processing mode is a computer digital control precision machining mode, namely a high-precision CNC machining mode, and the adopted cutter is a flat-bottom diamond cutter. The exposed ceramic layer 23 is effectively protected by adopting a method of combining high-precision CNC processing and chemical etching to process, so that better processing quality is obtained, and meanwhile, the processing efficiency is improved. When the reserved copper layer 21 is processed by CNC, the reserved copper layer 21 is removed by adopting a method of pasting a photosensitive dry film, exposing, developing, chemically etching and film stripping, and the exposure master plate is subjected to positive compensation relative to a circuit pattern, namely, the area covered by the photosensitive dry film 4 after development is slightly wider than the circuit, the width of the area is between 5 and 100 micrometers, and the chemical etching can be used for etching the reserved copper layer and cannot influence the existing circuit. The area covered by the photosensitive dry film 4 is slightly wider than the circuit, which means that: as shown in fig. 3, the side edge of the photosensitive dry film 4 is not flush with the side edge of the processing groove 20, and specifically, the side edge of the photosensitive dry film 4 has an excessive protruding portion compared with the side edge of the processing groove 20, and the excessive protruding portion can effectively prevent side erosion during subsequent processing, that is, prevent the side edge of the processing groove 20 from being corroded during subsequent processing.
In step a, the following may be selected as a preferable method of welding the ceramic layer 1 and the copper layer 2 together by the brazing layer 3: in the step a, the welding method for welding the ceramic layer 1 and the copper layer 2 into a whole through the brazing layer 3 comprises the following steps: the ceramic layer 1 and the copper layer 2 are cleaned through surface pretreatment, active metal brazing paste is printed or sprayed on two sides of the ceramic layer 1 and dried, and one cleaned copper layer 2 is arranged on two sides of each ceramic layer 1 with the brazing paste until the layers are laminated to the required layers, and then the ceramic layers are integrally placed in a brazing furnace for high-temperature welding.
In addition, in order to achieve both the protection effect of the reserved copper layer 21 on the reserved brazing layer 22 at the bottom thereof and the convenience of removing the reserved copper layer 21, the thickness range of the reserved copper layer 21 may be selected to be 50 μm or less.
Claims (5)
1. The manufacturing method of the ceramic copper-clad plate is characterized by comprising the following steps of:
a. preparing materials: the material comprises at least two ceramic layers (1) and at least three copper layers (2), wherein the ceramic layers (1) and the copper layers (2) are arranged in a staggered and laminated mode, and the ceramic layers (1) and the copper layers (2) are welded into a whole through a brazing layer (3);
b. and (3) pattern engraving: downwards engraving and processing a processing groove (20) from the copper layer (2) at the outermost layer, wherein the processing groove (20) penetrates through at least one copper layer (2) and at least one ceramic layer (1), the bottom of the processing groove (20) is arranged in one copper layer (2), a reserved copper layer (21) is arranged between the bottom of the processing groove (20) and the brazing layer (3) closest to the bottom of the processing groove (20), and the bottom of the reserved copper layer (21) is a reserved brazing layer (22);
c. chemical etching protection treatment: firstly, a photosensitive dry film (4) is used for applying and protecting the copper layer (2) on the outermost layer;
d. and (3) treating a reserved copper layer: processing and disposing the reserved copper layer (21) by using a chemical copper etching method to obtain a bare reserved braze layer (22), and removing the protected photosensitive dry film (4) after the processing is completed;
e. and (3) processing a reserved brazing layer: the exposed pre-braze layer (22) is etched away by chemical etching, and finally the exposed ceramic layer (23) is obtained.
2. The method for manufacturing the ceramic copper-clad plate according to claim 1, wherein in the step a, the ceramic layer (1) and the copper layer (2) are welded into a whole through a brazing layer (3) by the following welding method: the ceramic layers (1) and the copper layers (2) are cleaned through surface pretreatment, active metal brazing paste is printed or sprayed on two sides of each ceramic layer (1) and dried, one cleaned copper layer (2) is arranged on two sides of each ceramic layer (1) with the brazing paste respectively until the layers are laminated to the required layers, and then the ceramic layers are integrally placed in a brazing furnace for high-temperature welding.
3. The method for manufacturing the ceramic copper-clad plate according to claim 1, wherein: in step a, the material of the ceramic layer (1) comprises at least one of alumina, toughened alumina, aluminum nitride, silicon nitride or silicon carbide.
4. A method of producing a ceramic copper clad laminate according to any one of claims 1 to 3, wherein: in step b, the thickness range of the reserved copper layer (21) is below 50 micrometers.
5. A method of producing a ceramic copper clad laminate according to any one of claims 1 to 3, wherein: in the step b, the pattern engraving processing mode is a computer digital control precision machining mode, and the adopted cutter is a flat-bottom diamond cutter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311178140.3A CN117042340A (en) | 2023-09-13 | 2023-09-13 | Manufacturing method of ceramic copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311178140.3A CN117042340A (en) | 2023-09-13 | 2023-09-13 | Manufacturing method of ceramic copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117042340A true CN117042340A (en) | 2023-11-10 |
Family
ID=88624702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311178140.3A Pending CN117042340A (en) | 2023-09-13 | 2023-09-13 | Manufacturing method of ceramic copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117042340A (en) |
-
2023
- 2023-09-13 CN CN202311178140.3A patent/CN117042340A/en active Pending
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