CN117038368A - Preparation method of tungsten-copper composite contact - Google Patents
Preparation method of tungsten-copper composite contact Download PDFInfo
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- CN117038368A CN117038368A CN202311047903.0A CN202311047903A CN117038368A CN 117038368 A CN117038368 A CN 117038368A CN 202311047903 A CN202311047903 A CN 202311047903A CN 117038368 A CN117038368 A CN 117038368A
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- amorphous solder
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- 239000002131 composite material Substances 0.000 title claims abstract description 35
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 title claims abstract description 17
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000010949 copper Substances 0.000 claims abstract description 78
- 229910000679 solder Inorganic materials 0.000 claims abstract description 56
- 229910052802 copper Inorganic materials 0.000 claims abstract description 46
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 44
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 41
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 40
- 239000010937 tungsten Substances 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims abstract description 32
- 238000005219 brazing Methods 0.000 claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 16
- 238000003466 welding Methods 0.000 claims abstract description 12
- 239000012298 atmosphere Substances 0.000 claims abstract description 9
- 239000000945 filler Substances 0.000 claims abstract description 9
- 230000001681 protective effect Effects 0.000 claims abstract description 6
- 239000000126 substance Substances 0.000 claims abstract description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical group CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 10
- 239000002253 acid Substances 0.000 claims description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 6
- 238000004321 preservation Methods 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 5
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 4
- 238000005238 degreasing Methods 0.000 claims description 4
- 229910017604 nitric acid Inorganic materials 0.000 claims description 4
- 238000005406 washing Methods 0.000 claims description 4
- 238000005554 pickling Methods 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 9
- 229910000510 noble metal Inorganic materials 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 8
- 238000010587 phase diagram Methods 0.000 abstract description 5
- 229910000905 alloy phase Inorganic materials 0.000 abstract description 4
- 238000004140 cleaning Methods 0.000 abstract description 3
- 238000013461 design Methods 0.000 abstract description 2
- 239000000306 component Substances 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 239000000243 solution Substances 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 230000008901 benefit Effects 0.000 description 5
- 230000004907 flux Effects 0.000 description 5
- 238000004663 powder metallurgy Methods 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 239000011135 tin Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 238000003723 Smelting Methods 0.000 description 3
- 239000010953 base metal Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005242 forging Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000012300 argon atmosphere Substances 0.000 description 2
- 238000009694 cold isostatic pressing Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000007602 hot air drying Methods 0.000 description 2
- 238000001513 hot isostatic pressing Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000002074 melt spinning Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000010079 rubber tapping Methods 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 1
- WUUOCBIGXXXJFO-UHFFFAOYSA-N [P].[Ni].[Cu].[Sn] Chemical compound [P].[Ni].[Cu].[Sn] WUUOCBIGXXXJFO-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen(.) Chemical compound [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000007712 rapid solidification Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
- H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Manufacture Of Switches (AREA)
Abstract
The invention discloses a preparation method of a tungsten-copper composite contact. Specifically, the copper rivet is formed by connecting a copper rivet and a tungsten sheet through furnace brazing under vacuum or protective atmosphere by using amorphous brazing filler metal. The amorphous solder is Cu-based amorphous solder, and the chemical components (mass fraction) of the amorphous solder are P4.5-8.5%, sn 4-10%, ni 2-15% and Cu the rest. The method can save noble metal resources, reduce material cost, has simple preparation process and does not need cleaning after welding; meanwhile, the contact performance is excellent based on the process design of the alloy phase diagram, and compared with the contact prepared by adopting the noble metal brazing filler metal under the same condition, the W-Cu composite contact interface shear strength prepared by the invention is higher.
Description
Technical Field
The invention relates to the technical field of manufacturing of electrical contacts, in particular to a preparation method of a tungsten-copper composite contact.
Background
The contact is an element for electric contact in an electric system, plays roles in switching on, carrying and breaking current, and is applied to various electronic components such as alternating current and direct current contactors, circuit breakers and relays in national defense and civil industries. As a core component in an electrical contact system, the performance of the contacts directly determines the accuracy, stability and service life of the electrical transmission and electrical equipment. Tungsten is the highest melting metal, its coefficient of thermal expansion is low, and the rate of evaporation at high temperatures is slow. Tungsten has excellent arc burn resistance and mechanical wear resistance as an electrical contact material. Copper has excellent electric conductivity, thermal conductivity and high plasticity, and is widely applied to various electrical equipment. The W-Cu composite contact is a rivet-type contact which is made by connecting a tungsten working layer on a copper conducting end, and can have the advantages of W, cu materials to a great extent, such as surge current resistance, arc burning resistance, easiness in riveting and forming and the like. However, tungsten and copper have large differences in their physicochemical properties, and neither in the liquid phase nor in the solid phase interact with each other. Therefore, it is difficult to form an effective metallurgical bond between tungsten and copper. As a connecting process commonly used in industrial production, the brazing has the advantages of relatively low welding temperature, simple process, no special requirements on the shape and the size of a welded part and the like, and is particularly suitable for connecting dissimilar materials. Under the influence of difficult welding between W and Cu, a brazing filler metal with good wettability to refractory metals is generally used by people, but Au and Ag belong to rare noble metals, the production cost is high, and the resource reserve is very limited. Therefore, how to obtain the W-Cu composite contact product with reliable performance after greatly reducing the content of noble metals in the solder becomes a problem with wide social benefit and economic benefit.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides an application of amorphous solder in preparing tungsten-copper composite contacts, which is characterized in that the amorphous solder is prepared by connecting copper rivets and tungsten sheets through furnace brazing under vacuum or protective atmosphere.
Further, the amorphous solder is a Cu-based amorphous solder.
Further, the amorphous solder is a CuPSnNi amorphous solder.
Further, the amorphous solder comprises the following chemical components of 4.5-8.5% of P, 4-10% of Sn, 2-15% of Ni and the balance of Cu in percentage by mass.
The invention also provides a method for preparing the tungsten-copper composite contact based on the amorphous solder, which is characterized in that the tungsten-copper composite contact is obtained by connecting copper rivets and tungsten pieces through furnace brazing in vacuum or protective atmosphere by using the amorphous solder.
Further, the amorphous solder is a Cu-based amorphous solder.
Further, the amorphous solder is a CuPSnNi amorphous solder.
Further, the amorphous solder comprises the following chemical components of 4.5-8.5% of P, 4-10% of Sn, 2-15% of Ni and the balance of Cu in percentage by mass.
Further, the method comprises the following steps:
s1, degreasing and pickling copper rivets and tungsten sheets;
s2, assembling the copper rivet and the tungsten piece, and placing the amorphous solder between the copper rivet and the tungsten piece;
s3, welding the assembled copper rivets, the amorphous solder and the tungsten pieces by adopting a vacuum furnace or an atmosphere protection furnace; the brazing temperature is 700-900 ℃, the heat preservation time is 2-15min, and then the tungsten copper composite contact is manufactured by cooling to below 80 ℃ at the speed of 5-20 ℃/min.
Further, the deoiling agent is acetone or alcohol, the acid washing is a dilute acid solution, and the volume fraction of the dilute acid solution is 1-8% of sulfuric acid, nitric acid or hydrochloric acid.
The degreasing is to remove grease such as greasy dirt on the metal surface by a physical method, and the degreasing is based on a similar compatibility principle by adopting acetone or alcohol. The acid washing is used for further removing oxide films on the metal surface.
The brazing temperature is mainly determined by the melting point of the brazing filler metal, the heat preservation time is to ensure that the liquid brazing filler metal can be spread smoothly and joint filled, and the cooling rate and the tapping temperature are controlled to avoid deformation and tapping oxidization of a weldment caused by too fast cooling speed.
Compared with the prior art, the invention has the beneficial effects that:
(1) Saving noble metal resources and reducing material cost
The invention adopts the CuPSnNi amorphous solder to prepare the W-Cu composite contact, the solder does not contain rare noble metals such as Au, ag and the like, all components of the solder are low-price metal or nonmetal elements, precious metal resources are obviously saved, and meanwhile, the material cost is reduced, so that the invention has good economic and social benefits.
(2) Simple preparation process, no need of cleaning after welding
In order to obtain good joint filling capability of the liquid brazing filler metal, a brazing flux is required to be used for further removing pollutants or oxide films on the surface of a base metal in many brazing processes. However, the brazing flux is easy to remain on the surface of the welded base metal, and the brazing flux must be cleaned through special procedures, otherwise the appearance of the product is affected. The P element in the CuPSnNi amorphous solder adopted by the invention has self-fluxing property, and soldering flux is not needed during soldering. Therefore, the working procedures of adding soldering flux before welding and cleaning after welding are omitted, and the manufacturing complexity is obviously reduced.
( 3) Based on the process design of the alloy phase diagram, the contact performance is excellent (remark: "alloy phase diagram" is also called alloy phase equilibrium diagram, and is a diagram showing the relationship between alloy components, temperature and structure state under equilibrium conditions. The alloy with different components, the phase structure state at different temperatures and the possible transition in the temperature change can be known according to the phase diagram, and the performance of the alloy can be estimated according to the structure state, so that the method is a main basis for preparing hot working processes such as casting, forging, welding, heat treatment and the like. " )
W does not interact with many metals including Cu (neither compounds are formed nor solid solubility is present) and thus it is generally difficult to obtain satisfactory joint strength between W and Cu. It can be seen from the metal alloy phase diagram that Ni and W are able to dissolve into each other to form a Ni-based (or W-based) solid solution or mesophase, and that P, sn both react with Cu, in particular Cu and Ni are infinitely miscible. Therefore, the CuPSnNi amorphous solder has good wettability to both W and Cu. Research shows that compared with crystalline materials, amorphous alloys have no element segregation and have more uniform components. Under the same welding process, the interaction between the amorphous brazing filler metal and the base metal is stronger than that of the crystalline brazing filler metal, so that the element diffusion can be promoted, and coarse brittle compounds are prevented from being formed in an interface area and a brazing seam center, thereby ensuring good joint mechanical properties. In the invention, the interface shear strength of the W-Cu composite contact prepared based on the CuPSnNi amorphous solder is even higher than that of a contact prepared by adopting noble metal solder under the same condition.
Drawings
FIG. 1 is a schematic diagram of copper rivets, tungsten flakes and braze assembly prior to brazing.
FIG. 2 is a metallographic photograph of a cross section of a W-Cu composite contact prepared in example 1.
Fig. 3 is a metallographic photograph of a cross section of a W-Cu composite contact prepared using the prior art.
FIG. 4 is a graph comparing the results of interfacial shear strength for W-Cu composite contacts prepared in example 1 and in the prior art.
FIG. 5 is a metallographic photograph of a cross section of a W-Cu composite contact prepared in example 2.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention. The specific techniques or conditions are not identified in the examples and are performed according to techniques or conditions described in the literature in this field or according to the product specifications.
A method for preparing a W-Cu composite contact based on amorphous solder comprises the following steps:
(1) Copper rivet preparation
The copper rivet is prepared by adopting a mechanical or pressure processing method, the diameter of the head of the rivet is 2-12mm, the thickness of the head is 0.15-2mm, the diameter of the foot is 1-5mm, and the length of the foot is 0.5-6mm. The copper rivet material is pure copper with the mass fraction of copper not less than 99.9%.
(2) Preparation of tungsten flakes
The tungsten sheet is prepared by adopting a powder metallurgy method, and then the tungsten sheet is ground and polished to remove burrs, and meanwhile, the surface smoothness of the tungsten sheet is improved. The tungsten sheet has a thickness of 0.2-2mm, a diameter of 2-12mm, and a mass fraction of W of not less than 99.95%.
(remark: the conventional powder metallurgy method, abbreviated as PM method, i.e. uniaxial rigid die press forming method, is a method commonly used in the powder metallurgy industry at present, and belongs to a metal powder forming method in the powder metallurgy industry, and other methods include a metal injection molding method (MIM), a powder forging method (P/F), a hot isostatic pressing method (HIP), a cold isostatic pressing method (CIP), and the like.
(3) Preparation of solder
The method comprises the steps of adopting copper, tin, nickel and copper-phosphorus intermediate alloy as raw materials, proportioning and smelting according to the mass ratio of elements of CuPSnNi (copper-phosphorus-tin-nickel) amorphous solder, adopting a rapid solidification technology to prepare an amorphous strip with the thickness of 0.03-0.12mm in a protective atmosphere, and blanking the strip into a wafer with the diameter of 2-12 mm. The chemical components of the CuPSnNi amorphous solder comprise 4.5-8.5% of P, 4-10% of Sn, 2-15% of Ni and the balance of Cu (mass fraction).
(4) Surface treatment
The copper rivet and the tungsten piece are cleaned by acetone and alcohol, and then are pickled by dilute acid solution. The dilute acid solution is sulfuric acid, nitric acid or hydrochloric acid with volume fraction of 1-8%.
(5) Weldment assembly
Copper rivets and tungsten chips were assembled according to the positions of the materials in fig. 1, and CuPSnNi amorphous solder wafers were placed between the copper rivets and tungsten chips.
(6) Furnace brazing
And welding the assembled copper rivet, the assembled CuPSnNi amorphous solder and the assembled tungsten piece by adopting a vacuum furnace or an atmosphere protection furnace. The brazing temperature is 700-900 ℃, the heat preservation time is 2-15min, and then the temperature is cooled to below 80 ℃ at the speed of 5-20 ℃/min, so that the W-Cu composite contact is manufactured.
Example 1
1) The oxygen-free copper is adopted to prepare the copper rivet through forging and pressing, the diameter and the thickness of the head part are respectively 4.5mm and 0.8mm, and the diameter and the length of the foot part are respectively 2.3mm and 0.9mm.
2) The pure tungsten powder is adopted to prepare tungsten tablets through pressing and sintering, and the diameter and the thickness of the tungsten tablets are respectively 4.5mm and 0.8mm.
3) And (3) burdening and smelting according to the Cu-7P-4Sn-10Ni component, preparing an amorphous strip with the width of 15mm and the thickness of 0.05mm by using a single-roller melt-spinning machine under the argon atmosphere, and then punching on a punching machine to obtain an amorphous solder wafer with the diameter of 4.5 mm.
4) Ultrasonic cleaning is carried out on copper rivets and tungsten sheets in alcohol, then acid washing is carried out by dilute sulfuric acid solution with the concentration of 3%, and then hot air drying is carried out.
5) Copper rivets and tungsten flakes were assembled according to the positions of the materials in fig. 1, and a sheet-shaped Cu-7P-4Sn-10Ni amorphous solder having a diameter of 4.5mm and a thickness of 0.05mm was interposed between the copper rivets and the tungsten flakes.
6) And (3) placing the assembled weldment into a muffle furnace continuously filled with nitrogen and hydrogen gas, wherein the brazing temperature is 850 ℃, the heat preservation time is 5min, and then cooling to 60 ℃ at the speed of 10 ℃/min, so that the tungsten sheet and the copper conducting end are welded together, and a W-Cu composite contact is formed.
Fig. 2 is a metallographic photograph of a section of a W-Cu composite contact prepared in this embodiment, and it can be seen that the tungsten sheet and the copper rivet have good bonding, and no obvious defects such as holes.
To further illustrate the effect of the present invention, comparative example 1 is set up: using the prior art (Ag) 45 Cu 30 Zn 25 Noble metal solder) is shown in fig. 3. For comparison, the preparation process remained the same as in this example except for the solder difference. It can be seen that Ag is used 45 Cu 30 Zn 25 The solder prepared contact is slightly thick in solder joint, and the rest (such as welding condition, interface defect degree and the like) has no obvious difference with Cu-7P-4Sn-10 Ni.
FIG. 4 shows the results of the interfacial bonding force (using the braze joint strength test method well known in the art) test for the W-Cu composite contacts prepared according to this example and the prior art (comparative example 1), wherein the interfacial shear strength of the W-Cu composite contact prepared according to this example is 237MPa, which is significantly higher than that of comparative example 1 (206 MPa). For the convenience of observation and comparison, ag is used as 45 Cu 30 Zn 25 The shear process curve of the solder corresponding to the contact is shifted to the right.
Example 2
1) The T1 red copper is adopted to prepare copper rivets, the diameter and the thickness of the head are respectively 2.6mm and 0.25mm, and the diameter and the length of the foot are respectively 1.5mm and 0.9mm.
2) The W1 pure tungsten powder is adopted to prepare tungsten sheets, and the diameter and the thickness of the tungsten sheets are respectively 2.6mm and 0.3mm.
3) And (3) burdening and smelting according to the Cu-6P-10Sn-7Ni component, preparing an amorphous strip with the thickness of 0.08mm by utilizing a single-roller melt-spinning machine under the argon atmosphere, and then punching on a punching machine to obtain an amorphous solder wafer with the diameter of 2.2 mm.
4) Ultrasonic cleaning is carried out on copper rivets and tungsten sheets in acetone, then 2% dilute nitric acid solution is used for pickling, and then hot air drying is carried out.
5) Copper rivets, tungsten flakes and Cu-6P-10Sn-7Ni solder (Φ2.2X0.08 mm) were assembled as shown in FIG. 1.
6) And then brazing is carried out in a vacuum furnace, the brazing temperature is 780 ℃, the heat preservation time is 10min, and then cooling is carried out at a speed of 5 ℃/min, so that the W-Cu composite contact with the other specification is manufactured.
The interfacial bonding force of the W-Cu composite contact prepared in example 2 was measured by the same method as in example 1, and its shear strength was 222MPa. Fig. 5 is a metallographic photograph of a section of a W-Cu composite contact corresponding to example 2, which also shows good interfacial bonding.
Although embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives, and variations may be made in the above embodiments by those skilled in the art without departing from the spirit and principles of the invention.
Claims (10)
1. The application of the amorphous solder in preparing the tungsten-copper composite contact is characterized in that the amorphous solder is prepared by connecting copper rivets and tungsten pieces through furnace brazing under vacuum or protective atmosphere.
2. Use according to claim 1, characterized in that the amorphous solder is a Cu-based amorphous solder.
3. Use according to claim 2, characterized in that the amorphous solder is CuPSnNi amorphous solder.
4. The use according to claim 3, wherein the amorphous solder comprises the chemical components of 4.5-8.5% of P, 4-10% of Sn, 2-15% of Ni and the balance of Cu in percentage by mass.
5. A preparation method of a tungsten-copper composite contact is characterized in that the tungsten-copper composite contact is obtained by connecting copper rivets and tungsten pieces through furnace brazing under vacuum or protective atmosphere by using amorphous brazing filler metal.
6. The method of manufacturing a tungsten copper composite contact according to claim 5, wherein the amorphous solder is a Cu-based amorphous solder.
7. The method of manufacturing a tungsten copper composite contact according to claim 6, wherein the amorphous solder is CuPSnNi amorphous solder.
8. The method for manufacturing a tungsten copper composite contact according to claim 7, wherein the amorphous solder comprises, by mass, 4.5-8.5% of P, 4-10% of Sn, 2-15% of Ni and the balance of Cu.
9. The method for manufacturing a tungsten copper composite contact according to claim 5, comprising the steps of:
s1, degreasing and pickling copper rivets and tungsten sheets;
s2, assembling the copper rivet and the tungsten piece, and placing the amorphous solder between the copper rivet and the tungsten piece;
s3, welding the assembled copper rivets, the amorphous solder and the tungsten pieces by adopting a vacuum furnace or an atmosphere protection furnace; the brazing temperature is 700-900 ℃, the heat preservation time is 2-15min, and then the tungsten copper composite contact is manufactured by cooling to below 80 ℃ at the speed of 5-20 ℃/min.
10. The method for manufacturing a tungsten copper composite contact according to claim 9, wherein the deoiling agent is acetone or alcohol, and the acid washing is a dilute acid solution, wherein the volume fraction of the dilute acid solution is 1-8% of sulfuric acid, nitric acid or hydrochloric acid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311047903.0A CN117038368A (en) | 2023-08-18 | 2023-08-18 | Preparation method of tungsten-copper composite contact |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311047903.0A CN117038368A (en) | 2023-08-18 | 2023-08-18 | Preparation method of tungsten-copper composite contact |
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| Publication Number | Publication Date |
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| CN117038368A true CN117038368A (en) | 2023-11-10 |
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|---|---|---|---|
| CN202311047903.0A Pending CN117038368A (en) | 2023-08-18 | 2023-08-18 | Preparation method of tungsten-copper composite contact |
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| Country | Link |
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| CN (1) | CN117038368A (en) |
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2023
- 2023-08-18 CN CN202311047903.0A patent/CN117038368A/en active Pending
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