CN117034993A - Chip mounting technology of single narrow RFID antenna substrate - Google Patents
Chip mounting technology of single narrow RFID antenna substrate Download PDFInfo
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- CN117034993A CN117034993A CN202310875671.1A CN202310875671A CN117034993A CN 117034993 A CN117034993 A CN 117034993A CN 202310875671 A CN202310875671 A CN 202310875671A CN 117034993 A CN117034993 A CN 117034993A
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- 239000000758 substrate Substances 0.000 title claims abstract description 26
- 238000005516 engineering process Methods 0.000 title description 6
- 239000000463 material Substances 0.000 claims abstract description 196
- 238000000034 method Methods 0.000 claims abstract description 42
- 238000003825 pressing Methods 0.000 claims abstract description 22
- 238000004806 packaging method and process Methods 0.000 claims abstract description 11
- 238000005096 rolling process Methods 0.000 claims abstract description 10
- 238000001514 detection method Methods 0.000 claims description 27
- 238000001179 sorption measurement Methods 0.000 claims description 22
- 230000001681 protective effect Effects 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000003292 glue Substances 0.000 description 10
- 238000007667 floating Methods 0.000 description 7
- 230000001360 synchronised effect Effects 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 238000005056 compaction Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application relates to a chip mounting process of a single narrow RFID antenna substrate, which relates to the technical field of RFID label packaging and comprises the following steps: s1: feeding a material belt; s2: dispensing the material belt; s21: accurately positioning for the first time; s22: dispensing; s3: mounting a chip; s31: accurately positioning for the second time; s32: mounting; s4: pre-pressing and packaging; s41: positioning; s42: preheating; s43: prepressing; s5: detecting; s6: and (5) rolling. In the process, in the step of dispensing the material belt, the material belt is driven to move to a dispensing station, corresponding dispensing heads are fixed differently, and the dispensing heads are positioned through the material belt; in the chip mounting step, the material belt is driven to move to the mounting station, the corresponding mounting head is fixed in position, and the mounting head is positioned by fine adjustment of the material belt. The material belt adopts the modes of dispensing and mounting, and the dispensing head and the mounting head are fixed, so that the mounting time and the movement time required by dispensing can be greatly reduced, and the production efficiency can be greatly improved.
Description
Technical Field
The application relates to the technical field of RFID label packaging, in particular to a chip mounting process of a single narrow RFID antenna substrate.
Background
RFID tags, i.e., electronic tags, are a non-contact automatic identification technique by which a target object is identified and related data is acquired. The RFID tag may be divided into two parts, namely a chip and an antenna of the RFID tag. The antenna is used for transmitting electromagnetic waves to the space through the handheld reader-writer and transmitting energy emitted by the chip in the form of electromagnetic waves; the function of the chip is to adjust and decode the signal received by the RFID tag and to encode and modulate the signal that the RFID tag needs to return.
The packaging of the RFID tag mainly comprises the main links of chip assembly, antenna manufacturing and the like. With the development of new packaging technology, new processing technologies such as flip chip bump generation (Bunping), antenna printing and the like are sequentially presented in the label packaging technology. Compared with common wire connection or carrier tape connection, the flip chip technology has the advantages of higher packaging density, good electric and heat conduction performance, high reliability and low cost.
Currently, the breadth of RFID antenna substrates (material strips) in the industry has two specifications: 320mm and 50-160mm width. The substrate (antenna) width standard 320mm wide antenna and the layout of multiple rows of antennas can effectively save substrate materials. Can be mass-produced by etching process. The chip mounting of the wide antenna substrate adopts a working mode of double-turnover chip picking devices, double-dispenser motion alternate dispensing and double-motion mounting heads for chip picking and mounting, and after the chips are picked, the chips are sequentially and alternately mounted on the antenna positions.
Aiming at the related technology, the process needs the mounting head to pick up the chip from the chip picking position and then move the chip to the mounting position, the movement is frequent and time-consuming, and the mounting efficiency is low. By adopting the process for mounting the chip of the narrow antenna substrate, the processing difficulty is higher, and the mounting efficiency is lower.
Disclosure of Invention
The application provides a chip mounting process of a single narrow-width RFID antenna substrate, which aims to reduce the chip mounting difficulty of the narrow-width RFID antenna substrate and accelerate the chip mounting efficiency.
The chip mounting process of the single narrow RFID antenna substrate provided by the application adopts the following technical scheme:
a chip mounting process of a single narrow RFID antenna substrate comprises the following steps:
s1: feeding a material belt;
s2: dispensing a material belt: conveying the material belt to a dispensing station, and dispensing the material belt through a dispensing head;
s21: accurate positioning for the first time: conveying the material belt to a dispensing station, and finely adjusting the position of the material belt to ensure that the material belt is positioned accurately;
s22: dispensing: the driving dispensing head dispenses the positioned material belt;
s3: and (3) chip mounting: mounting chips on the surface of the material belt after dispensing;
s31: and (3) accurately positioning for the second time: conveying the material belt after dispensing to a mounting station, and finely adjusting the material belt to ensure that the material belt is positioned accurately;
s32: and (3) sticking: attaching the chips taken down from the wafer to a material belt after dispensing;
s4: and (5) pre-pressing and packaging: prepressing the chips attached on the material belt to fix and package the chips;
s41: positioning: feeding the material belt into a pre-pressing station;
s42: preheating: heating the prepressing head;
s43: prepressing: the chip is pressed down by a pre-pressing head;
s5: and (3) detection: detecting the pre-pressed and packaged material belt, and detecting the position of a chip on the material belt;
s6: and (3) rolling: and rolling the detected material belt.
Through adopting above-mentioned technical scheme, this technology sets up to put a roll station, point and glue station, paste dress station, pre-compaction station, detection station and rolling station, realizes that the material area is from unreeling beginning, and the chip of passing through in proper order and glue, paste dress, pre-compaction, detection and rolling realize RFID antenna substrate pastes the whole process of dress.
In the process, in the step of dispensing the material belt, the material belt is driven to move to a dispensing station, corresponding dispensing heads are fixed differently, and the dispensing heads are positioned through the material belt; in the chip mounting step, the material belt is driven to move to the mounting station, the corresponding mounting head is fixed in position, and the mounting head is positioned by fine adjustment of the material belt. The material belt adopts the modes of dispensing and mounting, and the dispensing head and the mounting head are fixed, so that the mounting time and the movement time required by dispensing can be greatly reduced, and the production efficiency can be greatly improved.
Optionally, the step S21 further includes the steps of: detecting the position of a material belt: CCD vision system carries out camera detection on position of material belt on dispensing station
Through adopting above-mentioned technical scheme, the setting of material area position detection step can take a photograph the detection through CCD vision system to the material area to confirm the required fine setting parameter of material area, realize the control to material area positioning accuracy.
Optionally, step S21 includes the steps of:
low-precision large-distance conveying of material belts: the material belt is conveyed in a conveying direction by a conveying roller set in a low-precision large-distance manner and conveyed to a dispensing station;
fixing a material belt: the dispensing station fixes the material belt;
the material belt carries out fine adjustment and positioning with high precision and small distance: and (3) carrying out fine adjustment on the fixed material belt by a high-precision small distance, and improving the positioning precision of the material belt on the dispensing station.
By adopting the technical scheme, firstly, the quick feeding of the material belt can be realized and the feeding time of the material belt is reduced through the arrangement of the low-precision large-distance conveying step of the material belt; then, the material belt fixing step is arranged, so that the material belt can be locked, and the material belt is prevented from moving or shifting in the process of dispensing; and finally, the material belt is subjected to fine adjustment positioning with high precision and small distance, and the material belt fixed on the dispensing station is subjected to fine adjustment with high precision and small distance, so that the material belt is aligned with the corresponding dispensing head, and the dispensing precision is improved.
Optionally, the following steps are included in step 32:
picking a chip: the ejector pins below the wafer jack up the chips, and the suction heads above the wafer suck the chips;
chip feeding: rotating the suction head to change the chip from vertical downward to vertical downward;
chip grabbing: the mounting head vertically faces downwards to grasp the chip on the suction head;
and (3) chip mounting: and (3) moving the mounting after grabbing the chips to a mounting station, and mounting the chips on a material belt.
Through adopting above-mentioned technical scheme, through the setting of chip picking, chip pay-off, chip snatch and chip mounting step, realized the chip from getting the whole process of getting to paste and mounting to the material area, realized the subsides of chip.
Optionally, the chip picking step is performed in synchronization with the chip feeding step: at least two suction heads are arranged, one suction head always picks up chips, and the other suction head feeds the chips.
Through adopting above-mentioned technical scheme, through the setting of a double suction pick-up head that can rotate for chip picking and chip pay-off go on in step, thereby can accelerate the speed of chip material loading on the mounting head.
Optionally, the method further comprises the following steps between the steps of chip grabbing and chip mounting: posture positioning: and shooting the chip on the mounting head through the gesture correcting vision system, analyzing and positioning the gesture of the chip at the moment.
By adopting the technical scheme, after the chip is grabbed by the mounting head, the chip posture of the mounting head is positioned by the posture correction vision system.
Optionally, the chip grabbing step, the gesture positioning step and the chip mounting step are performed synchronously: at least three mounting heads are arranged, one mounting head always performs chip grabbing, one mounting head performs gesture positioning, and one mounting head performs chip mounting.
Through adopting above-mentioned technical scheme, through the setting of at least three mounting head for there is a mounting head to snatch the chip simultaneously, there is a mounting head to carry out gesture location and there is a mounting head to carry out the chip mounting, thereby makes each mounting head through removing or rotatory all can pass through these three steps. Therefore, the chip grabbing step, the gesture positioning step and the chip mounting step can be synchronously performed, so that the consistency and the processing efficiency of the whole production process from chip grabbing to gesture positioning to chip mounting in the chip mounting process can be increased.
Optionally, the following steps are further provided after the chip mounting: the material belt after being pasted is reserved, and chips on the material belt are protected: and feeding the material belt after chip mounting into a vacuum adsorption cylinder to solidify the chip.
Through adopting above-mentioned technical scheme, protect the material area, because the chip after the subsides on the material area needs to pass through a period of time and just solidify completely, consequently, before the chip is solidification, the circumstances that appears moving or shifting in the transportation easily, consequently need protect the material area and store.
Optionally, the wafer is mounted below the mounting station, the ejector pins eject the chips from below the wafer, and the pick-up head picks up the chips from above the wafer.
Through adopting above-mentioned technical scheme, the wafer is installed to the mounting station below, consequently is convenient for the jack-up to the chip of top, also is convenient for the installation and the support of wafer simultaneously.
Optionally, in step S6: before the material belt is wound, a protective film is coated on one side of the material belt, on which the chip is attached.
Through adopting above-mentioned technical scheme, when the rolling, cover the protection film on the material area and can protect the chip.
In summary, the present application includes at least one of the following beneficial technical effects:
1. in the process, the single-row material belt is adopted for mounting, the positions of the dispensing station and the mounting station are fixed, the dispensing head and the mounting head are required to move, the movement time required by mounting and dispensing is greatly reduced, and the production efficiency is greatly improved.
2. In the process, in the dispensing station, the large-distance conveying belt is conveyed to the dispensing station, and then the small-distance micro-seasoning belt is positioned, so that the positioning speed of the material belt can be improved, and the efficiency is improved.
3. The mounting adopts fixed-point mounting, adopts the mode of rotating a plurality of mounting heads, grabs the chip at a fixed position, and performs gesture correction positioning on the chip and chip mounting, so that the plurality of mounting heads can move in parallel, work in a plurality of stations can be parallel, movement time consumption can be reduced, and efficiency is remarkably improved.
4. The chip is taken out and is pasted at fixed points, the mode of overturning the double sucking heads is adopted, chip picking and chip feeding are carried out at fixed positions, so that the two sucking heads can move in parallel, the chip picking and the chip feeding can be parallel, the chip taking time can be shortened, and the efficiency is remarkably improved.
Drawings
Fig. 1 is a flow chart of the steps of the chip mounting process according to the present application.
FIG. 2 is a flowchart showing the steps of the first accurate positioning according to the present application.
Fig. 3 is a flowchart showing the steps of mounting in the present application.
FIG. 4 is a flow chart of the steps of pre-pressing the package in the present application.
Detailed Description
The present application will be described in further detail with reference to fig. 1 to 4.
A chip mounting process of a single narrow-width RFID antenna substrate, referring to fig. 1, includes the steps of:
s1: and (5) feeding a material belt. The material belt is fed into the dispensing station with weak tension through the cooperation of the discharging roller, the auxiliary roller, the material receiving platform, the vacuum adsorption cylinder and the conveying roller set.
The material belt is discharged through the discharging rollers, and is conveyed through the auxiliary rollers and the material receiving and receiving platform in sequence, so that stable conveying of the material belt under constant tension is realized.
The material belt is sent into the vacuum adsorption cylinder, and the material belt is tightly attached to the inner wall of the vacuum adsorption cylinder under the negative pressure environment in the vacuum adsorption cylinder, so that the material belt can not slide or shift, the precision in the conveying process is ensured, the material belt can be stored at the same time, and the tension of the material belt can be adjusted through the vacuum degree of the vacuum adsorption cylinder.
And a conveying roller set is arranged at the outlet of the vacuum adsorption cylinder, so that the material belt is conveyed into the dispensing station under weak tension.
S2: dispensing the material belt. And dispensing the material belt positioned on the dispensing station through the dispensing head.
S21: the first accurate positioning is performed, the material belt is positioned after the material belt is conveyed, and the material belt is accurately positioned to the dispensing station.
Referring to fig. 2, specifically, the method includes the following steps:
s211: low-precision large-distance conveying of material belts: through the cooperation of the conveying roller sets around the dispensing station, the material belt is conveyed in a large distance in the conveying direction, and the material belt is conveyed to the dispensing station.
S212: fixing a material belt: then the vacuum adsorption plate on the dispensing station adsorbs the material belt, so that the material belt is fixed on the vacuum adsorption plate, and the material belt is positioned on the dispensing station at the moment.
S213: detecting the position of a material belt: and the dispensing head photographs the position of the material belt on the dispensing station along two CCD vision systems arranged in the conveying direction of the material belt, and analyzes and detects the photographing result.
S214: fine adjustment positioning of high-precision small distance of material belt: and feeding back the detection result of the CCD vision system on the position of the material belt to the X/Y moving platform, and performing fine adjustment on the position of the material belt through driving of a servo motor, so that the positioning accuracy of the material belt is improved.
S215: and (3) feedback detection: after the material belt is subjected to fine adjustment and positioning, the material belt is subjected to re-shooting detection through a CCD vision system, and when the detection is qualified, dispensing is started; when the detection is unsuitable, fine adjustment positioning and feedback detection are carried out on the material belt again until the detection is qualified.
S22: dispensing: and the driving dispensing head dispenses the material belt positioned on the dispensing station.
After dispensing is completed, the material belt is reserved and the glue on the material belt in the curing process is protected.
Specifically, after the dispensing is completed, the material belt is sent into the vacuum adsorption cylinder, the material belt is reserved in the vacuum adsorption cylinder, on one hand, the tension of the surface of the material belt can be controlled through the vacuum pair of the vacuum adsorption cylinder, and on the other hand, in the curing period of the glue on the material belt, the vacuum adsorption cylinder can temporarily keep the state of the glue before leaving a dispensing station, so that the glue is prevented from being cured or spoiled prematurely or flowing out in the conveying process.
S23: feeding for the first time: and conveying the material belt in the vacuum adsorption cylinder to a mounting station through a conveying roller set.
S3: and (5) chip mounting. The chip is attached to the corresponding position of the tape.
S31: and (3) accurately positioning for the second time: after conveying the material belt, positioning the material belt, and accurately positioning the material belt to a mounting station.
S311: low-precision large-distance conveying of material belts: through the cooperation of the conveying roller sets around the mounting station, the large-distance conveying of the material belt in the conveying direction is realized, and the material belt is conveyed to the mounting station.
S312: fixing a material belt: then the vacuum adsorption plate on the mounting station adsorbs the material belt, so that the material belt is fixed on the vacuum adsorption plate, and the material belt is positioned on the mounting station at the moment.
S312: detecting the position of a material belt: and the CCD vision system photographs the position of the material belt on the mounting station, and analyzes and detects the photographing result.
S313: the material belt carries out fine adjustment and positioning with high precision and small distance: and the detection result of the CCD vision system on the material belt position is fed back to the X/Y moving platform, and the material belt is subjected to fine adjustment with high precision and small distance by driving of a servo motor, so that the positioning precision of the material belt is improved.
S314: and (3) feedback detection: after the material belt is subjected to fine adjustment and positioning, the material belt is subjected to re-shooting detection through a CCD vision system, and when the detection is qualified, the mounting is started; when the detection is unsuitable, fine adjustment positioning and feedback detection are carried out on the material belt again until the detection is qualified.
S32: and (3) sticking: and attaching the chip removed from the wafer to the antenna after dispensing.
Referring to fig. 3, specifically, the mounting process includes the following steps:
s321: and (3) wafer installation: and mounting the wafer device on a corresponding wafer motion module below the mounting station.
S322: wafer positioning: the wafer is driven to move through the wafer movement module, and the wafer is positioned, so that the corresponding chip on the wafer is positioned between the ejector pin and the suction head along the vertical direction.
S323: picking a chip: after the wafer is positioned, a thimble below the wafer is jacked upwards, and the corresponding chip is jacked out and separated from the blue film; simultaneously, the suction head above the wafer is vertically downward and is positioned at a chip picking station, and the suction head adsorbs the jacked chips in a vacuum adsorption mode.
S324: chip feeding: and rotating the suction head to rotate the chip on the suction head to a chip feeding station, and converting the chip arranged downwards on the suction head into an upwards arrangement.
The chip picking station and the chip feeding station work simultaneously, so that synchronous operation of chip picking and feeding is realized.
Specifically, set up two and absorb the head relatively along vertical direction for every absorbs the head and can constantly switch in chip picking station and chip pay-off station through rotatory, simultaneously, always there is one to absorb the head and is in the chip picking station and take the chip picking, and another absorbs the head and is in the chip pay-off station and carry out the chip pay-off. Thereby increasing the continuity of chip picking and feeding.
S325: chip grabbing: the mounting head moves to a chip grabbing station, the chip grabbing station is located right above the suction head, and at the moment, the mounting head is vertically arranged downwards in a late mode, and chips in the chip feeding station are grabbed.
S326: posture positioning: and (3) rotating the mounting head to a gesture positioning station, photographing a chip on the mounting head through a gesture correcting vision system, and analyzing and positioning the gesture of the chip at the moment.
S327: and (3) chip mounting: and moving the mounting head after grabbing the chip from the gesture positioning station to the mounting station, and mounting the chip on a material belt in the mounting station.
The chip grabbing station, the gesture positioning station and the mounting station work simultaneously, so that synchronous operation of chip grabbing, chip gesture positioning and chip mounting is realized.
Specifically, at least three mounting heads are arranged, one mounting head is positioned at a chip grabbing station for chip grabbing, one mounting head is positioned at a chip posture positioning station for posture positioning of chips on the mounting head, and the last mounting head is positioned at a mounting station for chip mounting. Each mounting head can sequentially pass through the chip grabbing station, the gesture positioning station and the mounting station in a rotating or moving mode. There is always one mounting head moving from the mounting station to the chip grabbing station, at which time one mounting head and thus the chip grabbing station moves to the attitude positioning station, at which time there is one mounting head moving from the attitude positioning station to the mounting station.
The number of the mounting heads can be set to 3 or more than 3, and the number of the mounting heads is preferably set to 4 in the application, namely, the chip mounting heads are accommodated by a blank station matched with the chip grabbing station, the chip posture positioning station and the chip mounting station besides the chip grabbing station and the chip posture positioning station. Therefore, under the synchronous operation of chip grabbing and chip mounting, the consistency and the rapidity of chip mounting can be realized.
After the chip mounting is completed, the material belt is reserved and the chips on the material belt are protected.
Specific: the material belt after the chip is attached is fed into the vacuum adsorption cylinder, the material belt can be clung to the inner wall of the vacuum adsorption cylinder due to vacuum, the tension of the material belt can be ensured in the curing period of the chip attachment, and meanwhile, the material belt is tensioned in a non-contact mode, so that the position of the chip cannot be influenced, the chip can be protected, and the chip position is prevented from being shifted or moved in the conveying process of the material belt.
S33: and (3) feeding for the second time: and feeding the material belt in the vacuum adsorption cylinder into a pre-pressing station.
Specifically, the material belt is output from the vacuum adsorption cylinder through the conveying roller set and is sent into the floating roller set formed by a plurality of floating rollers, and the material belt in the floating roller set is sent into the pre-pressing station through the other conveying roller set.
When the material belt passes through the floating roller set, the position of the floating roller set is adjusted, the tensioning degree of the material belt is changed, the material belt is in a proper tension range, and meanwhile, the stored material belt between the chip mounting station and the pre-pressing station is conveyed in a large distance.
S4: and (5) pre-pressing and packaging: and pre-pressing the chip, increasing the stability of chip fixation, and solidifying and packaging the chip.
Referring to fig. 4, specifically, the method includes the following steps:
s41: positioning: and feeding the material belt into a pre-pressing station, and arranging the material belt opposite to the corresponding pre-pressing head.
S42: preheating: and heating the pre-pressing head to the corresponding station temperature.
S43: prepressing: setting the pressing pressure of the pre-pressing head, and then pressing the pre-pressing head onto the corresponding chip.
S44: retraction: after the prepressing is finished, the chip on the material belt is solidified and packaged, and the prepressing head is retracted at the moment.
S45: and (3) feeding for the third time: and feeding the material strip after the chip is solidified and packaged into a detection station.
The material belt after curing and packaging is sent into the floating roller set, the material belt after curing and packaging is stored, and then the material belt in the floating roller set is sent into the detection station through the conveying roller set.
S5: and (3) detection: and detecting the position degree of the chip on the surface of the material belt.
Specifically, the detector is arranged on one side of the material belt, which is solidified with the chip, and during the conveying process of the material belt, the position of the chip is detected by the detector and the chip with problems is marked.
S6: and (3) rolling: and rolling and blanking the detected material belt.
Specifically, the material belt is wound through even the wind-up roller and the auxiliary rollers, meanwhile, in the winding process, the protective film is unwound through the other unwinding roller, then the protective film is conveyed to the surface of the material belt, and a layer of protective film is covered on the surface of the material belt through the pressed roller.
The implementation principle of the embodiment of the application is as follows: the process is provided with a coil placing station, a glue dispensing station, a mounting station, a pre-pressing station, a detection station and a winding station, so that the whole process of chip mounting of the RFID antenna substrate is realized by sequentially carrying out glue dispensing, mounting, pre-pressing, detection and winding on a material belt from the beginning of coil placing.
In the process, the single-row material belt is adopted for mounting, the glue dispenser and the mounting machine are fixed, the movement time required by mounting is greatly reduced, and the production efficiency is greatly improved. The dispensing station adopts a dispensing head to dispense the glue, the positioning accuracy is monitored through a CCD visual system, and the positioning supplement is realized through fine adjustment of an X/Y moving platform, so that the dispensing is completed. Meanwhile, the number of the dispensing heads can be reduced according to actual demands, and the dispensing work can be completed by a single dispensing head. The chip is taken and the chip feeding adopts the arrangement of double suction heads, so that the work of chip taking and chip feeding can be completed in parallel. The mounting adopts fixed-point mounting, adopts a rotary 4-station mode, grabs the chip at a fixed position, and performs gesture correction positioning on the chip and chip mounting, so that a plurality of mounting heads can move in parallel, work in a plurality of stations can be performed in parallel, movement time consumption can be reduced, and efficiency is remarkably improved.
The embodiments of the present application are all preferred embodiments of the present application, and are not intended to limit the scope of the present application, wherein like reference numerals are used to refer to like elements throughout. Therefore: all equivalent changes in structure, shape and principle of the application should be covered in the scope of protection of the application.
Claims (9)
1. The chip mounting process of the single narrow RFID antenna substrate is characterized by comprising the following steps of: s1: feeding a material belt;
s2: dispensing a material belt: conveying the material belt to a dispensing station, and dispensing the material belt through a dispensing head;
s21: accurate positioning for the first time: conveying the material belt to a dispensing station, and finely adjusting the position of the material belt to ensure that the material belt is positioned accurately;
s22: dispensing: the driving dispensing head dispenses the positioned material belt;
s3: and (3) chip mounting: mounting chips on the surface of the material belt after dispensing;
s31: and (3) accurately positioning for the second time: conveying the material belt after dispensing to a mounting station, and finely adjusting the material belt to ensure that the material belt is positioned accurately;
s32: and (3) sticking: attaching the chips taken down from the wafer to a material belt after dispensing;
s4: and (5) pre-pressing and packaging: prepressing the chips attached on the material belt to fix and package the chips;
s41: positioning: feeding the material belt into a pre-pressing station;
s42: preheating: heating the prepressing head;
s43: prepressing: the chip is pressed down by a pre-pressing head;
s5: and (3) detection: detecting the pre-pressed and packaged material belt, and detecting the position of a chip on the material belt;
s6: and (3) rolling: and rolling the detected material belt.
2. The chip mounting process of a single narrow RFID antenna substrate of claim 1, further comprising the steps of: detecting the position of a material belt: CCD vision system carries out camera detection on position of material belt on dispensing station
The chip mounting process of a single narrow RFID antenna substrate according to claim 1, wherein step S21 includes the steps of: low-precision large-distance conveying of material belts: the material belt is conveyed in a conveying direction by a conveying roller set in a low-precision large-distance manner and conveyed to a dispensing station;
fixing a material belt: the dispensing station fixes the material belt;
the material belt carries out fine adjustment and positioning with high precision and small distance: and (3) carrying out fine adjustment on the fixed material belt by a high-precision small distance, and improving the positioning precision of the material belt on the dispensing station.
3. The chip mounting process of a single narrow RFID antenna substrate according to claim 1, comprising the steps of: picking a chip: the ejector pins below the wafer jack up the chips, and the suction heads above the wafer suck the chips;
chip feeding: rotating the suction head to change the chip from vertical downward to vertical downward;
chip grabbing: the mounting head vertically faces downwards to grasp the chip on the suction head;
and (3) chip mounting: and (3) moving the mounting after grabbing the chips to a mounting station, and mounting the chips on a material belt.
4. The chip mounting process of a single narrow RFID antenna substrate of claim 4, wherein the chip pick-up step is performed in synchronization with the chip feeding step: at least two suction heads are arranged, one suction head always picks up chips, and the other suction head feeds the chips.
5. The chip mounting process of a single narrow RFID antenna substrate of claim 4, further comprising the steps of, between the chip gripping and chip mounting steps: posture positioning: and shooting the chip on the mounting head through the gesture correcting vision system, analyzing and positioning the gesture of the chip at the moment.
6. The chip mounting process of a single narrow RFID antenna substrate of claim 6, wherein the chip grasping step, the attitude positioning step, and the chip mounting step are performed simultaneously: at least three mounting heads are arranged, one mounting head always performs chip grabbing, one mounting head performs gesture positioning, and one mounting head performs chip mounting.
7. The chip mounting process of a single narrow RFID antenna substrate of claim 4, further comprising the steps of, after chip mounting: the material belt after being pasted is reserved, and chips on the material belt are protected: and feeding the material belt after chip mounting into a vacuum adsorption cylinder to solidify the chip.
8. The chip mounting process of a single narrow RFID antenna substrate of claim 4, wherein the wafer is mounted below the mounting station, the ejector pins eject the chips from below the wafer, and the pick-up head picks up the chips from above the wafer.
9. The chip mounting process of a single narrow RFID antenna substrate according to claim 1, wherein in step S6: before the material belt is wound, a protective film is coated on one side of the material belt, on which the chip is attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310875671.1A CN117034993A (en) | 2023-07-17 | 2023-07-17 | Chip mounting technology of single narrow RFID antenna substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310875671.1A CN117034993A (en) | 2023-07-17 | 2023-07-17 | Chip mounting technology of single narrow RFID antenna substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117034993A true CN117034993A (en) | 2023-11-10 |
Family
ID=88642007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310875671.1A Pending CN117034993A (en) | 2023-07-17 | 2023-07-17 | Chip mounting technology of single narrow RFID antenna substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117034993A (en) |
-
2023
- 2023-07-17 CN CN202310875671.1A patent/CN117034993A/en active Pending
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