CN116825674A - Chip mounting equipment - Google Patents

Abstract

The application relates to chip mounting equipment, which relates to the technical field of RFID label production equipment, and comprises a feeding device, a dispensing device, a mounting device, a hot pressing device, a detection device and a receiving device; the adhesive dispensing device comprises an adhesive dispensing machine, the mounting device comprises a mounting machine, and active positioning platforms are arranged on the lower sides of the adhesive dispensing machine and the mounting machine along the vertical direction at intervals; the active positioning platform comprises an active positioning plate, the two sides of the active positioning plate along the length direction of the active positioning plate are respectively provided with a transmission roller group for conveying the material belt, and the active positioning plate is provided with a positioning driving assembly capable of driving the active positioning plate to move in a horizontal plane. According to the application, through the position fixation of the adhesive dispenser and the sticking machine, the active positioning platform adopts the transmission roller set to realize the forward or backward long-distance conveying of the material belt along the conveying direction of the material belt, so that the material belt can be quickly positioned; the small-distance high-precision fine adjustment correction of the material belt is realized by matching with the positioning driving assembly. Therefore, the mounting efficiency of chips on the material belt can be accelerated.

Description

Chip mounting equipment

Technical Field

The application relates to the technical field of RFID label production equipment, in particular to chip mounting equipment.

Background

RFID, radio frequency identification technology, is commonly known as electronic tags. RFID radio frequency identification is a non-contact automatic identification technology, which automatically identifies a target object through radio frequency signals and acquires related data, and the identification work does not need manual intervention and can work in various severe environments.

The RFID system consists of three parts, namely a tag, a reader and an antenna, and a complete system is also required to be provided with a data transmission and processing system.

With the development of new packaging technology, new processing technologies such as flip chip, bump generation, antenna printing and the like are successively presented in the label packaging technology. Compared with common wire connection or carrier tape connection, the flip chip technology has the advantages of higher packaging density, good electric and thermal properties, good reliability and low cost. The width of the substrate (antenna) used by the reverse packaging technology is 320mm. In the packaging process of the RFID antenna substrate, the following steps are generally included: feeding, dispensing, mounting, hot pressing, detecting and discharging.

Currently, in the chip mounting process of a 320mm wide RFID antenna substrate, a double-turnover chip picking device and a double-motion mounting head are generally adopted for picking and mounting; in the dispensing process, a double dispenser is generally used for moving and alternately dispensing.

Aiming at the related technology, in the dispensing process, the alignment of the dispensing head and the corresponding antenna substrate and the dispensing work are realized through the movement of the dispensing head; in the mounting process, after the chip is grasped by the mounting head, the mounting head moves to position the antenna substrate. The repeated positioning of the corresponding antenna substrate is realized through the movement of the dispensing head and the mounting head, so that after the basic conveying of the antenna is finished, the corresponding dispensing head or the mounting head is required to be waited for to be positioned, the required time is long, and the production efficiency is low. By adopting the device to mount the chips of the single-row narrow-width RFID antenna substrate, the processing difficulty is higher, and the mounting efficiency is lower.

Disclosure of Invention

The application provides a chip mounting device, which aims to improve the chip mounting efficiency of a single-row narrow RFID antenna substrate.

The chip mounting equipment provided by the application adopts the following technical scheme:

the chip mounting equipment comprises a feeding device, a dispensing device, a mounting device, a hot pressing device, a detecting device and a receiving device; the adhesive dispensing device comprises an adhesive dispensing machine, the mounting device comprises a mounting machine, and active positioning platforms are arranged on the adhesive dispensing machine and the mounting machine at intervals along the lower side of the vertical direction; the active positioning platform comprises an active positioning plate, the two sides of the active positioning plate along the length direction of the active positioning plate are respectively provided with a transmission roller group used for conveying a material belt, and the active positioning plate is provided with a positioning driving assembly capable of driving the active positioning plate to move in a horizontal plane.

Through adopting above-mentioned technical scheme, through loading attachment, point gum device, mounting device, hot press unit, detection device and receiving device's setting for the material area can be through material loading, point gum, mounting, hot pressing, detection and receiving in proper order, thereby realizes that the chip pastes all processes that the dress is required to corresponding RFID antenna substrate.

An active positioning platform is arranged on the lower sides of the dispensing machine and the mounting machine, two transmission roller sets are arranged on two sides of the active positioning plate in the length direction, and through the arrangement of the two transmission roller sets, the material belt can be conveyed to the lower sides of the corresponding dispensing machine and the mounting machine, and meanwhile, the material belt can be conveyed forwards or backwards in the conveying direction of the material belt at a large distance but at a low precision. And a positioning driving assembly is arranged at the lower side of the active positioning plate, and the active positioning plate is driven to move in the horizontal plane through the positioning driving assembly, so that the material belt on the active positioning plate can be positioned and finely adjusted at a small distance but high precision. Therefore, through the setting of initiative location platform, can realize the automatic positioning in material area to the point gum machine and sticking machine homoenergetic are motionless, consequently can improve the precision of processing, simultaneously because the quick transport of big distance and the fine setting of small distance combine each other, can realize the quick location in material area, thereby can improve the chip mounting efficiency of single row of RFID antenna substrate by a narrow margin through brushing above-mentioned cooperation.

Optionally, the transmission roller group includes gluey compression roller and conveying roller, gluey compression roller with conveying roller parallel arrangement just sets up along vertical direction interval each other, gluey compression roller with conveying roller axial is followed initiative locating plate width direction sets up, conveying roller coaxial coupling has the driving motor who is used for driving conveying roller pivoted.

Through adopting above-mentioned technical scheme, driving motor drive roll rotates in the transmission roller group, can provide power for the transport of material area, and glue the compression roller and can compress tightly material area and conveying roller each other, through glue the compression roller with conveying roller can realize the long-distance transport of material area.

Optionally, the positioning driving assembly includes a first driving member and a second driving member, where the first driving member and the second driving member are both connected to the active positioning plate, and the driving direction of the first driving member and the driving direction of the second driving member are mutually perpendicular.

Through adopting above-mentioned technical scheme, in the location drive assembly, through the setting of the drive direction mutually perpendicular of first driving piece and second driving piece for can realize initiative locating plate and carry out position control in arbitrary direction in the horizontal plane, the location of the material area on the initiative locating plate of being convenient for in the horizontal direction.

Optionally, the point gum machine is along both sides of initiative locating plate length direction all are provided with CCD vision detection system, CCD vision detection system's detection portion is along vertical direction orientation corresponding initiative locating plate sets up.

Through adopting above-mentioned technical scheme, CCD visual detection system's setting, when the material area on the initiative locating plate passes by, can take a photograph the analysis to the material area through CCD visual detection system to feed back to the location drive assembly according to the analysis result and fix a position the material area.

Optionally, the mounting device further comprises a chip feeding assembly, the chip feeding assembly comprises a thimble system, a wafer motion module and a transfer assembly for conveying chips to the mounting machine, the thimble system and the transfer assembly are respectively arranged on two sides of the wafer motion module along the vertical direction, and the thimble system and the transfer assembly are just opposite to each other along the vertical direction.

Through adopting above-mentioned technical scheme, the setting of wafer motion module is arranged in the chip material loading subassembly and is used for installing the wafer and realizes the location of wafer simultaneously, and the thimble system sets up in wafer motion module downside along vertical direction, consequently can be ejecting with the chip on the wafer through the thimble in the thimble system, and transport the subassembly along vertical direction setting in wafer motion module top and just set up with the thimble system, consequently ejecting the chip at the thimble system, transport the system and can snatch the chip, realize snatching of chip and carry in the subsides machine. Therefore, through the arrangement of the thimble system, the wafer movement module and the transfer assembly, the chip can be taken out from the wafer, and the chip feeding function of the mounter is realized.

Optionally, the transportation subassembly includes the head of absorbing, the head of absorbing sets up along vertical direction, the head of absorbing is offered along vertical direction one end and is used for absorbing the mouth of absorbing of chip, absorb overhead being connected with and be used for the drive absorb the head and overturn the driving piece at vertical direction upset.

Through adopting above-mentioned technical scheme, in the transportation subassembly, absorb the first vertical setting, and absorb the first lower extreme of taking and offer and absorb the mouth to absorb the first connection upset driving piece, thereby absorb the setting of mouth and can carry out the negative pressure to the chip and absorb when ejector pin system ejects the chip from the wafer, thereby snatch the chip; the setting of upset driving piece, can overturn and absorb the head after the mouth of absorbing the head lower extreme snatchs the chip, will absorb mouthful upset to vertical up, the vertical orientation setting of chip and with the acquisition of sticking machine this moment.

Optionally, the suction opening has all been seted up at suction head along vertical direction both ends, the upset driving piece with suction head is along vertical direction's middle part interconnect.

Through adopting above-mentioned technical scheme, the suction opening is all offered at the both ends of suction head, therefore the suction opening of suction head lower extreme absorbs the chip and the suction opening of suction head upper end for the chip can go on in step to the installation carries the chip to can accelerate the speed of carrying out the chip material loading for the installation.

Optionally, the mounter includes a plurality of mounting heads and a station switching driving piece, the plurality of mounting heads are uniformly arranged around the station switching driving piece along the circumferential direction of the station switching driving piece, and the station switching driving piece is used for driving the mounting heads to rotate with the central axis of the station switching driving piece; when the station switching driving piece rotates, one mounting head and the corresponding active positioning platform are oppositely arranged along the vertical direction, and the other mounting head and the transfer assembly are oppositely arranged along the vertical direction.

By adopting the technical scheme, the mounting head in the mounter is used for sucking the chip and mounting the chip on the material belt; the plurality of mounting heads are uniformly arranged around the station switching driving piece along the circumferential direction of the station switching driving piece, so that when the station switching driving piece rotates, the mounting heads rotate with the central axis of the station switching driving piece.

Therefore, the position of the mounting head can be switched by arranging the station switching driving piece. When the station switching driving piece rotates, one mounting head and the corresponding active positioning platform are oppositely arranged along the vertical direction, and at the moment, the mounting head can mount chips; meanwhile, the other mounting head and the transfer assembly are oppositely arranged along the vertical direction, and at the moment, the chip can be grabbed by the mounting head. Therefore, the station switching driving piece can realize that each mounting head is switched between chip grabbing and chip mounting, so that the speed of mounting chips on a material belt can be increased by matching of a plurality of mounting heads, and the processing efficiency is further improved.

Optionally, the mounting machine further comprises a visual gesture corrector, and the visual gesture corrector is arranged opposite to the mounting head along the horizontal direction.

Through adopting above-mentioned technical scheme, the chip that snatchs on the mounting head can be photographed in the setting of vision correction appearance ware, realizes the analysis and the location of the gesture of chip this moment.

Optionally, the vision is corrected appearance ware and is provided with a plurality of, and a plurality of the vision is corrected appearance ware is respectively followed the clockwise circumference setting of station switching drive spare is in transport subassembly and corresponding between the initiative location platform and along the anticlockwise circumference setting of station switching drive spare is in transport subassembly and corresponding between the initiative location platform.

Through adopting above-mentioned technical scheme, set up a plurality of vision and correct appearance ware, there is the vision of two parts and correct appearance ware, and the clockwise axial setting of partly vision along station switching drive spare is between transport subassembly and corresponding location platform, and the anticlockwise axial setting of partly vision is along station switching drive spare is between transport subassembly and corresponding location platform to the appearance ware. Therefore, when the station switching driving piece rotates clockwise and anticlockwise, each mounting head can be switched between the chip grabbing station and the chip mounting station, and each mounting head can pass through the corresponding visual gesture corrector in the process of switching the chip grabbing station and the chip mounting station, so that the gesture of the chip grabbed on the mounting head can be positioned.

In summary, the present application includes at least one of the following beneficial technical effects:

1. according to the application, the positions of the glue dispenser and the mounting machine are fixed, and the conveying of the material belt is realized through the active positioning platform, so that the time for the glue dispenser and the mounting machine to find the material belt is reduced, and the mounting efficiency of chips on the material belt is improved.

2. The active positioning platform adopts a transmission roller group to realize the forward or backward long-distance conveying of the material belt along the conveying direction of the material belt, so as to realize the quick positioning of the material belt; the small-distance high-precision fine adjustment correction of the material belt is realized by matching with the positioning driving assembly. Realize the quick high accuracy location of material area.

3. The mounting machine adopts the setting of rotatory many mounting heads, realizes chip snatchs, chip gesture location and chip mounting in fixed position, and consequently a plurality of mounting heads can parallel work, can reduce the time consuming of mounting head in the motion in-process, improves the mounting speed of chip on the material area.

4. The material of chip is realized through fortune material subassembly, and fortune material subassembly adopts the upset of two suction openings to absorb the setting of head, carries out the chip and gets material and chip pay-off at fixed position for two suction openings can parallel motion, make the chip get material and chip pay-off go on in step, reduce the material time of getting of chip, can improve the mounting speed of chip on the material area.

Drawings

Fig. 1 is a schematic view of the overall structure of the tape transport in the die attach apparatus of the present application.

Fig. 2 is a schematic diagram of the overall structure of the belt conveyance in the feeding device of the present application.

Fig. 3 is a schematic view of the overall structure of the tape feeding in the tape dispensing apparatus and the mounting apparatus of the present application.

Fig. 4 is a schematic view of the overall structure of the adhesive dispensing device and the mounting device of the present application.

FIG. 5 is a schematic diagram of the overall structure of the active positioning platform according to the present application.

Fig. 6 is a schematic diagram of the internal structure of the glue dispensing machine according to the application.

Fig. 7 is a schematic view of the whole structure of the mounting device in the present application.

Fig. 8 is a partially enlarged schematic view of the portion a in fig. 7.

Fig. 9 is a schematic diagram of a mounter in which four mounting heads are mounted in the present application.

FIG. 10 is a schematic view showing the overall structure of the belt conveyance in the hot press device, the detection device and the winding device according to the present application.

In the figure, 1, a feeding device; 11. an unreeling roller; 12. a material receiving platform; 13. a first vacuum adsorption cylinder; 14. a feeding auxiliary roller;

2. a dispensing device; 21. a dispensing machine; 211. dispensing heads; 212. a vertical drive assembly; 213. a horizontal drive assembly; 2131. a synchronous driving motor; 2132. a driving wheel; 2133. driven wheel; 2134. a driving rod; 22. a CCD visual detection system;

3. a mounting device; 31. mounting machine; 311. a mounting head; 312. a station switching driving member; 313. a visual gesture corrector; 32. a chip feeding assembly; 321. the thimble system; 322. a wafer motion module; 3221. a wafer mounting platform; 3222. a wafer driving member; 323. a transfer assembly; 3231. a suction head; 3232. a suction port; 3233. a flip drive;

4. a hot press device; 41. a first thermal head; 42. a second thermal head;

5. a detection device;

6. a material receiving device; 61. a wind-up roll; 62. a second auxiliary roller; 63. a protective film feeding roller; 64. a third auxiliary roller;

7. an active positioning platform; 71. an active positioning plate; 711. vacuum adsorption holes; 712. a vacuum air pipe; 72. a transport roller group; 721. a glue press roller; 722. a conveying roller; 73. positioning a driving assembly; 731. a first driving member; 732. a second driving member;

8. dispensing and storing device; 81. a second vacuum adsorption cylinder;

9. a paste storage device; 91. a third vacuum adsorption cylinder; 92. a floating roller set;

10. a hot-pressing storage device;

100. a transport traction assembly; 200. and (5) a material belt.

Detailed Description

The present application will be described in further detail with reference to fig. 1 to 10.

Referring to fig. 1, the chip mounting device comprises a feeding device 1, a glue dispensing device 2, a mounting device 3, a hot pressing device 4, a detecting device 5 and a receiving device 6. The material belt 200 is unreeled through the feeding device 1 and sequentially passes through the glue dispensing device 2, the mounting device 3, the hot pressing device 4 and the detecting device 5, and finally the material belt 200 is wound up through the material collecting device 6, and in the process, the material belt 200 sequentially passes through the unreeling, glue dispensing, mounting, hot pressing, detecting and winding processes, so that the full automation of chip mounting on the material belt 200 is realized.

And a conveying traction assembly 100 is arranged in the feeding device 1, the glue dispensing device 2, the mounting device 3, the hot pressing device 4, the detecting device 5 and the receiving device 6 and between two adjacent devices along the conveying direction of the material belt 200, and the conveying traction assembly 100 is composed of a power roller driven by a motor and a driven roller for pressing the material belt 200 and is used for assisting in conveying the material belt 200.

Referring to fig. 2, the feeding device 1 includes an unreeling roller 11, a receiving platform 12, a first vacuum adsorption cylinder 13, and a plurality of feeding auxiliary rollers 14. Unreeling roller 11 and material loading auxiliary roller 14 are all parallel to each other, unreel roller 11, connect material platform 12 and first vacuum section of thick bamboo along the direction of delivery of material area 200 interval setting in proper order, a plurality of material loading auxiliary roller 14 set up unreel roller 11 and connect between the material platform 12 and a plurality of material loading auxiliary roller 14 distribute in material area 200 both sides, material area 200 is unreeled by unreel roller 11 and is realized the material loading, and through the setting of material platform 12 and first vacuum absorption section of thick bamboo 13, can realize that material area 200 realizes the directional pay-off of fixed speed with weak tension.

Referring to fig. 3 and 4, the dispensing device 2 includes a dispenser 21, an active positioning platform 7 is disposed vertically below the dispenser 21, and a material tape 200 passes over the upper side of the active positioning platform 7.

Referring to fig. 5, the active positioning platform 7 includes a conveying roller set 72, the conveying roller set 72 includes a glue pressing roller 721 and a conveying roller 722, the conveying roller 722 is coaxially connected with a driving motor, the glue pressing roller 721 and the conveying roller 722 are axially parallel to each other and are all arranged along the width direction of the material belt 200, the conveying roller 722 is arranged at the lower side of the glue pressing roller 721 along the vertical direction, the conveying roller 722 and the glue pressing roller 721 are arranged at intervals along the vertical direction, and the material belt 200 passes through a gap between the conveying roller 722 and the glue pressing roller 721. Therefore, the conveying roller group 72 can realize conveyance of the material tape 200 by the driving of the driving motor. Two conveying roller sets 72 are provided at intervals along the conveying direction of the material tape 200, and the material tape 200 can be conveyed forward or retracted backward by the cooperation of the two conveying roller sets 72.

Referring to fig. 5, an active positioning plate 71 is provided between two transfer roller groups 72, and the two transfer roller groups 72 are provided on both sides of the active positioning plate 71 along the length direction of the active positioning plate 71. The conveying direction of the material belt 200 is along the length direction of the active positioning plate 71, a plurality of vacuum adsorption holes 711 are formed in the active positioning plate 71, one side of the active positioning plate 71 is communicated with a vacuum air pipe 712, and the vacuum air pipe 712 and the vacuum adsorption holes 711 are mutually communicated. Therefore, the material belt 200 passing through the active positioning plate 71 can be adsorbed and fixed by the vacuum air pipe 712, so that the dispensing operation is facilitated.

Referring to fig. 5, a positioning driving assembly 73 is disposed at the lower side of the active positioning plate 71, the positioning driving assembly 73 includes a first driving member 731 and a second driving member 732, the first driving member 731 and the second driving member 732 are all connected with the active positioning plate 71, the driving direction of the first driving member 731 to the active positioning plate 71 is set along the width direction of the active positioning plate 71, the driving direction of the second driving member 732 to the active positioning plate 71 is set along the length direction of the active positioning plate 71, so that the driving directions of the first driving member 731 and the second driving member 732 to the active positioning plate 71 are mutually perpendicular in a horizontal plane, and the first driving member 731 and the second driving member 732 are all ball screw pairs driven by a servo motor, thereby realizing high-precision conveying of the active positioning plate 71.

Referring to fig. 4 and 5, by the arrangement of the active positioning plate 71, the conveying roller group 72, and the positioning driving assembly 73, the large-distance rapid conveying and the high-precision fine-tuning positioning of the material belt 200 can be realized. Therefore, the position of the glue dispenser 21 can be fixed, and the glue dispenser 21 and the material belt 200 can be positioned in a manner of positioning the material belt 200.

Referring to fig. 3 and 4, the dispenser 21 is provided with CCD vision detecting systems 22 along both sides of its own horizontal direction, the two CCD vision detecting systems 22 are disposed at intervals along the length direction of the active positioning platform 7, and the detecting portion Shi Shuzhi of the CCD vision detecting system 22 faces downward and is opposite to the active positioning platform 7 on the lower side of the dispenser 21. Therefore, the photographing analysis of the material belt 200 conveyed on the active positioning platform 7 at the lower side of the dispensing machine 21 of the material belt 200 is performed by the two CCD visual detection systems 22, and the analysis result is fed back to the positioning driving assembly 73, so that the accurate positioning of the material belt 200 is realized.

Referring to fig. 4 and 6, the dispenser 21 includes a dispensing head 211 disposed along a vertical direction, a working end of the dispensing head 211 is disposed vertically downward, a vertical driving assembly 212 is disposed at one side of the dispensing head 211, and the vertical driving assembly 212 employs a ball screw pair driven by a servo motor and disposed along the vertical direction. The dispensing head 211 is further provided with a horizontal driving assembly 213 along one side of the width direction of the material belt 200, the horizontal driving assembly 213 comprises a synchronous driving motor 2131, a driving wheel 2132, a driven wheel 2133 and a driving rod 2134, the synchronous driving motor 2131 is coaxially connected with the driving wheel 2132, the driving wheel 2132 is mutually connected with the driven wheel 2133 through a synchronous belt, one end of the driving rod 2134 is rotationally connected with the driving wheel 2132, and the other end of the driving rod 2134 is rotationally connected with the dispensing head 211, so that the reciprocating motion of the dispensing head 211 along the width direction of the material belt 200 can be realized through the arrangement of the horizontal driving assembly 213. The dispensing operation of the dispensing head 211 on the tape 200 can be realized through the cooperation of the vertical driving assembly 212 and the horizontal driving assembly 213.

Referring to fig. 3 and 4, a dispensing storage device 8 is disposed between the dispensing device 2 and the mounting device 3, the dispensing storage device 8 includes a second vacuum adsorption cylinder 81, and the tape 200 is fed into the mounting device 3 from the dispensing device 2 after passing through the second vacuum adsorption cylinder 81. Through the setting of second vacuum adsorption cylinder 81, on the one hand can control the tension on material area 200 surface through empty control second vacuum adsorption cylinder 81's vacuum degree, on the other hand in the solidification period of glue on the material area 200, second vacuum adsorption cylinder 81 can temporarily keep the state before leaving the point and glue station, prevents that glue from prematurely solidifying or rotting or flowing out in the transportation process.

Referring to fig. 4 and 7, the mounter 3 includes a mounter 31, and an active positioning stage 7, which is identical to the underside of the dispenser 21, is provided at the underside of the mounter 31. Thus, automatic conveyance and automatic positioning of the tape 200 during mounting can be achieved.

Referring to fig. 3 and 7, the mounting apparatus 3 further includes a chip feeding assembly 32, the chip feeding assembly 32 includes a wafer movement module 322, the wafer movement module 322 is disposed on the lower side of the active positioning platform 7 of the lower side of the mounter 31 along the vertical direction, and the wafer movement module 322 includes a wafer mounting platform 3221, and a wafer driving member 3222 is disposed on the lower side of the wafer mounting platform 3221, so that the wafer can be automatically positioned after the wafer is mounted in the wafer mounting platform 3221 through the arrangement of the wafer driving member 3222.

Referring to fig. 3 and 7, the wafer motion module 322 is vertically provided with a thimble system 321 on the lower side, the thimble system 321 is vertically disposed, and the thimble extending end of the thimble system 321 is vertically disposed opposite to the wafer in the wafer motion module 322, so that the ejection of the chip from the wafer can be realized through the thimble system 321.

Referring to fig. 7 and 8, a transfer assembly 323 is disposed on the vertical upper side of the wafer movement module 322, the transfer assembly 323 includes a suction head 3231, the suction head 3231 is disposed along the vertical direction, a suction port 3232 is disposed at the lower end of the suction head 3231, and the suction port 3232 is disposed along the vertical direction opposite to the ejector pin system 321, so that when the ejector pin system 321 ejects chips on a wafer, the suction port 3232 can suck the ejected chips in a negative pressure suction manner, and a chip taking function is realized.

The suction port 3232 is also opened at the upper end of the suction head 3231, and the suction head 3231 is provided with a turnover driving member 3233 on one side in the horizontal direction, the turnover driving member 3233 is connected with the middle part of the suction head 3231 in the vertical direction, therefore, on the lower side of the driving of the turnover driving member 3233, the suction head 3231 is turned 180 degrees in the vertical direction each time, the suction port 3232 at the lower end of the suction head 3231 sucks the chip, and the suction port 3232 sucked by the suction head 3231 can be turned to the vertical upward direction through the turnover driving member 3233, so that the chip is fed to the mounter 31 conveniently. At the same time, the suction port 3232 at the upper end of the suction head 3231 is turned upside down to be disposed vertically downward, and at this time, the suction port 3232 can take out the chips. Therefore, through the arrangement of the suction head 3231 of the double suction ports 3232 and the cooperation of the overturning driving piece 3233, the synchronous performance of the material taking work and the feeding work of the chips is realized, so that the material taking speed and the material taking consistency of the chips can be accelerated.

Referring to fig. 7 and 9, the mounter 31 includes a plurality of mounting heads 311 and a station switching driving member 312, the station switching driving member 312 employs a DD motor, the plurality of mounting heads 311 are all disposed at the lower side of the station switching driving member 312, and the plurality of mounting heads 311 are disposed at regular intervals around the station switching driving member 312 along the circumferential direction of the station switching driving member 312. When the station switching driving member 312 rotates, there is one mounting head 311 vertically opposite to the suction port 3232 at the upper end of the suction head 3231, and at the same time, there is one mounting head 311 vertically above the corresponding active positioning platform 7 and opposite to the material belt 200 on the active positioning platform 7. Therefore, the station switching driving piece 312 drives the plurality of mounting heads 311 to synchronously rotate, so that the switching from the material taking station of the chip to the mounting station of the chip of each mounting head 311 can be realized, and the consistency and the rapidity of the mounting process can be ensured.

Referring to fig. 3 and 7, the mounter 31 further includes a vision posture corrector 313, the vision posture corrector 313 adopts a CCD vision system, the vision posture corrector 313 is disposed along a horizontal direction, and a detecting portion of the vision posture corrector 313 is disposed opposite to a lower end of the mounting head 311 along the horizontal direction. The chip absorbed by the mounting head 311 can be photographed through the arrangement of the visual gesture corrector 313, gesture positioning is performed, and positioning accuracy of chip mounting is improved.

The visual gesture correcting device 313 can be provided in a plurality, the visual gesture correcting device 313 is divided into two parts, one part of the visual gesture correcting device 313 is arranged between the transferring assembly 323 and the corresponding active positioning platform 7 along the clockwise circumference of the station switching driving piece 312, and the other part of the visual gesture correcting device 313 is arranged between the transferring assembly 323 and the corresponding active positioning platform 7 along the anticlockwise circumference of the station switching driving piece 312. Therefore, regardless of whether the work position switching driving member 312 is rotated forward or backward, the chip is gripped by the mounting head 311 and then passed through the corresponding visual gesture corrector 313, so that the chip of the mounting head 311 can be positioned in a gesture before the chip is mounted.

Referring to fig. 7 and 9, in the present application, the number of mounting heads 311 is not less than 3, preferably 4. When three mounting heads 311 are used, one mounting head 311 is positioned at a chip taking station at the same time, namely, the mounting head 311 is positioned at the right upper end of the suction head 3231 at the moment, and the mounting head 311 performs chip taking work; a mounting head 311 is positioned at the chip mounting station, namely, the mounting head 311 is positioned at the right upper end of the corresponding positioning platform, and the mounting head 311 performs chip mounting work; there is a mounting head 311 at a chip posture positioning station, that is, the mounting head 311 is disposed opposite to the visual posture corrector 313 along the horizontal direction, and the visual posture corrector 313 performs posture positioning on the chip sucked by the mounting head 311. Through the rotation of the station switching driving member 312 once, the corresponding mounting heads 311 can be sequentially switched according to the chip taking station, the chip gesture positioning and the chip mounting station, so that the smoothness and rapidity of each work in the chip mounting process are realized.

When four mounting heads 311 are used, two vision gesture correcting devices 313 and two vision gesture correcting stations are correspondingly arranged, and the two vision gesture correcting devices 313 are arranged right opposite to each other along the horizontal direction, so that the driving piece 312 is switched along the clockwise or anticlockwise circumference direction, and one vision gesture correcting station is always arranged between the chip mounting station and the chip taking station. Thus, each mounting head 311 can sequentially pass through the chip taking station, the chip posture positioning and the chip mounting station to realize chip mounting no matter when the station switching driving member 312 rotates clockwise or counterclockwise.

Referring to fig. 1 and 10, a mounting storage device 9 is disposed between the mounting device 3 and the hot press device 4, the mounting storage device 9 includes a third vacuum adsorption cylinder 91 and a floating roller set 92, the third vacuum adsorption cylinder 91 is disposed between the floating roller set 92 along the conveying direction of the material belt 200, the material belt 200 is fed from the inside of the mounting device 3 to the inside of the third vacuum adsorption cylinder 91, the third vacuum adsorption cylinder 91 is discharged to the inside of the floating roller set 92, the floating roller set 92 includes a plurality of floating rollers, and one end of each floating roller is connected with a driving cylinder or a driving motor along the vertical direction or the horizontal direction. The setting of third vacuum adsorption section of thick bamboo 91 can hug closely third vacuum adsorption section of thick bamboo 91 inner wall with the material area 200 because the vacuum reason can guarantee material area 200 tension in the solidification period of chip dress, adopts the mode tensioning with the material area 200 of non-contact simultaneously, can not cause the influence to the position of chip, so can protect the chip, prevent that the chip position from appearing the chip shift or move in the transportation process of material area 200. The floating roller set 92 can store the long material belt 200 and simultaneously can rapidly convey the long material belt 200 into the hot pressing station.

Referring to fig. 10, the hot press device 4 includes a plurality of first hot press heads 41 and a plurality of second hot press heads 42, the first hot press heads 41 and the second hot press heads 42 are arranged along a vertical direction in a one-to-one correspondence manner, the plurality of first hot press heads 41 are uniformly arranged at intervals along a conveying direction of the material belt 200, and the material belt 200 passes through a gap between the first hot press heads 41 and the corresponding second hot press heads 42 along the vertical direction, so when the material belt 200 is positioned in the hot press device 4, the first hot press heads 41 heat and then vertically press down the corresponding second hot press heads 42 to heat and then move upwards, thereby being capable of reinforcing corresponding chips on the material belt 200 to attach to the material belt 200, and realizing solidified packaging of the chips.

Referring to fig. 10, a hot-pressing storage device 10 is arranged between the hot-pressing device 4 and the material receiving device 6, the hot-pressing storage device 10 adopts a plurality of floating rollers, so that a longer material belt 200 can be discharged, and meanwhile, buffering between different winding speed switching of the material receiving device 6 is facilitated.

Referring to fig. 10, the detecting device 5 is located between the hot-pressed storing device 10 and the receiving device 6, and the detecting device 5 adopts a position detector and faces the side of the material belt 200 on which the chip is mounted, so as to detect the position of the chip mounting.

Referring to fig. 10, the material collecting device 6 includes a wind-up roller 61 and a plurality of second auxiliary rollers 62, the wind-up roller 61 is coaxially connected with a wind-up motor, and the material strip 200 is connected with the wind-up roller 61 after passing through the plurality of second auxiliary rollers 62, so as to realize winding of the material strip 200.

Referring to fig. 10, the material receiving device 6 further includes a protective film feeding roller 63 and a third auxiliary roller 64, the protective film feeding roller 63 feeds the protective film onto the glue pressing roller 721, the material belt 200 passes through the third auxiliary roller 64, the protective film is pressed against the side of the material belt 200 on which the chip is mounted by the arrangement of the third auxiliary roller 64, and a layer of protective film is covered on the material belt 200, so as to realize the protection of the material belt 200.

The implementation principle of the embodiment of the application is as follows: the feeding device 1 unwinds the tape 200 into the dispensing device 2.

The dispensing device 2 accurately positions the material belt 200 through the matching of the corresponding active positioning platform 7 and the CCD visual gesture corrector 313; after the positioning is completed, dispensing is performed with the material belt 200 through the dispensing head 211. After dispensing, the material is conveyed into the dispensing storage device 8, and the material belt 200 is reserved.

The material belt 200 passing through the dispensing storage device 8 is sent into the mounting device 3, and after the material belt 200 is positioned by the corresponding active positioning platform 7, the whole process from feeding to mounting of the chip is realized through the cooperation of the chip feeding component 32 and the mounting machine 31 in the mounting device 3. After the mounting is completed, the tape 200 is fed into the mounting and storing device 9, and the tape 200 is stored.

The material belt 200 passing through the mounting and storing device 9 enters the hot pressing device 4, and the chips on the material belt 200 are packaged in a hot pressing mode. The material strip 200 after hot pressing and packaging is sent into the hot pressing storage device 10, and the material strip 200 is reserved.

The material belt 200 passing through the hot pressing storage device 10 is sent into the material receiving device 6, and the material belt 200 is wound. Before winding, the side of the material belt 200, on which the chip is attached, is detected by a position detector in the detection device 5, so that the detection of the position of the chip is realized, and the chip with inaccurate position is marked. After the detection is completed, a protective film is covered on one side of the chip of the tape 200 mounting head 311 by the cooperation of the protective film feeding roller 63 and the third auxiliary roller 64.

The embodiments of the present application are all preferred embodiments of the present application, and are not intended to limit the scope of the present application, wherein like reference numerals are used to refer to like elements throughout. Therefore: all equivalent changes in structure, shape and principle of the application should be covered in the scope of protection of the application.

Claims (10)

1. The chip mounting equipment is characterized by comprising a feeding device (1), a glue dispensing device (2), a mounting device (3), a hot pressing device (4), a detecting device (5) and a receiving device (6);

the adhesive dispensing device (2) comprises an adhesive dispensing machine (21), the mounting device (3) comprises a mounting machine (31), and active positioning platforms (7) are arranged on the adhesive dispensing machine (21) and the mounting machine (31) at intervals along the lower side of the vertical direction;

the active positioning platform (7) comprises an active positioning plate (71), the two sides of the active positioning plate (71) along the length direction of the active positioning plate are provided with a conveying roller group (72) for conveying the material belt (200), and the active positioning plate (71) is provided with a positioning driving assembly (73) capable of driving the active positioning plate (71) to move in a horizontal plane.

2. The die mounting apparatus according to claim 1, wherein the transport roller group (72) includes a glue pressing roller (721) and a conveying roller (722), the glue pressing roller (721) and the conveying roller (722) are disposed parallel to each other and are disposed at intervals in a vertical direction, the glue pressing roller (721) and the conveying roller (722) are disposed axially along a width direction of the active positioning plate (71), and the conveying roller (722) is coaxially connected with a driving motor for driving the conveying roller (722) to rotate.

3. The die mounting apparatus according to claim 1, wherein the positioning driving assembly (73) includes a first driving member (731) and a second driving member (732), the first driving member (731) and the second driving member (732) are each connected to the active positioning plate (71), and a driving direction of the first driving member (731) and a driving direction of the second driving member (732) are disposed perpendicular to each other.

4. The chip mounting apparatus according to claim 1, wherein the dispenser (21) is provided with CCD vision detection systems (22) along both sides of the length direction of the active positioning plate (71), and detection portions of the CCD vision detection systems (22) are disposed along the vertical direction toward the corresponding active positioning plate (71).

5. The chip mounting apparatus according to claim 1, wherein the mounting device (3) further comprises a chip feeding assembly (32), the chip feeding assembly (32) comprises a thimble system (321), a wafer movement module (322) and a transferring assembly (323) for conveying chips to the mounter (31), the thimble system (321) and the transferring assembly (323) are respectively arranged on two sides of the wafer movement module (322) along a vertical direction, and the thimble system (321) and the transferring assembly (323) are arranged opposite to each other along the vertical direction.

6. The chip mounting apparatus according to claim 5, wherein the transfer assembly (323) includes a suction head (3231), the suction head (3231) is disposed along a vertical direction, a suction port (3232) for sucking a chip is provided at one end of the suction head (3231) along the vertical direction, and a turnover driving member (3233) for driving the suction head (3231) to turn over in the vertical direction is connected to the suction head (3231).

7. The chip mounting apparatus according to claim 6, wherein the suction head (3231) is provided with the suction port (3232) at both ends in the vertical direction, and the flip driver (3233) is connected to the suction head (3231) at the middle in the vertical direction.

8. The chip mounting apparatus according to claim 5, wherein the mounting machine (31) includes a plurality of mounting heads (311) and a station switching driving member (312), the plurality of mounting heads (311) are circumferentially and uniformly arranged around the station switching driving member (312) along the station switching driving member (312), and the station switching driving member (312) is configured to drive the mounting heads (311) to rotate about a central axis of the station switching driving member (312);

when the station switching driving piece (312) rotates, one mounting head (311) and the corresponding active positioning platform (7) are oppositely arranged along the vertical direction, and the other mounting head (311) and the transfer assembly (323) are oppositely arranged along the vertical direction.

9. The die mounting apparatus according to claim 8, wherein the mounter (31) further includes a visual posture corrector (313), the visual posture corrector (313) being disposed in a horizontal direction opposite to the mounting head (311).

10. The chip mounting apparatus according to claim 9, wherein the vision correcting device (313) is provided in a plurality, and the vision correcting device (313) is provided between the transferring assembly (323) and the corresponding active positioning stage (7) in a clockwise circumferential direction of the station switching driving member (312) and between the transferring assembly (323) and the corresponding active positioning stage (7) in a counterclockwise circumferential direction of the station switching driving member (312), respectively.