CN103781341B - Element fixing apparatus and component mounting method - Google Patents

Abstract

It is an object of the invention to provide a kind of element fixing apparatus and component mounting method, substrate and large-sized substrate for small size can enter units installation, and the production line of the substrate of two kinds of sizes of size can be made to unitize.In substrate acceptance division（21）By two substrate receiving platforms（21s）Interval be set as the first interval and receive the substrate of two small sizes（2）In the case of, left substrate transfer portion（82a）By the substrate acceptance division（21）The substrate of two small sizes received（2）It is transferred to element mounting portion simultaneously（22）, in substrate acceptance division（21）By two substrate receiving platforms（21s）Interval be set as second interval bigger than the first interval and receive two large-sized substrates（2）In the case of, left substrate transfer portion（82a）By the substrate acceptance division（21）The two large-sized substrates received（2）It is transferred to element mounting portion respectively one by one（22）.

Description

Element fixing apparatus and component mounting method

Technical field

The present invention relates to element mounting is being carried out into base plate of liquid crystal panel in the element is crimped on into substrate after substrate The element fixing apparatus and component mounting method of manufacture.

Background technology

In the past, it is known that element mounting is manufactured in substrate come the base plate of liquid crystal panel for the manufacture for carrying out base plate of liquid crystal panel and used Element fixing apparatus（For example, referring to patent document 1）.The element fixing apparatus of such base plate of liquid crystal panel manufacture except Outside the element mounting portion for entering units installation relative to substrate, it is also equipped with：Substrate acceptance division, is connect using two substrate receiving platforms Receive from upstream process side and convey two substrates of coming；And substrate transfer portion, the substrate that substrate acceptance division is received is transferred to Element mounting portion, substrate transfer portion utilizes two of the interval configuration of the two substrate receiving platforms possessed according to substrate acceptance division to pick up Component is taken, while picking up two substrates and being transferred to element mounting portion.

In such element fixing apparatus, exist with first size（Small size）Substrate for object enter units peace The element fixing apparatus of dress and with size second size bigger than the substrate of first size（Large scale）Substrate be object carry out The element fixing apparatus that element is installed.Here, entering the element fixing apparatus of units installation by object of the substrate of small size By two large-sized substrate-placings in the case of two substrate receiving platforms, two substrates are interfered, therefore with large scale Substrate be object enter units installation element fixing apparatus need be with enter by object of the substrate of small size units peace The different device of the element fixing apparatus of dress, in the substrate production line for entering units installation to the substrate of two kinds of sizes of size, Need two kinds of element fixing apparatus corresponding with two kinds of substrates of size being assembled into substrate production line respectively.

Patent document 1：Japanese Unexamined Patent Publication 6-75199 publications

However, two kinds of element fixing apparatus corresponding with two kinds of substrates of size are assembled into substrate production respectively as described above If line, the production line of substrate is changed into a plurality of, exists unfavorable in terms of cost the problem of.

The content of the invention

Therefore, it is an object of the invention to provide a kind of element fixing apparatus and component mounting method, for small size Substrate and large-sized substrate can enter units installation, and the production line of the substrate of two kinds of sizes of size can be made to unitize.

The element fixing apparatus that technical scheme 1 is related to is the element for the element mounting portion for possessing to enter substrate units installation Erecting device, wherein, the element fixing apparatus possesses：Substrate acceptance division, is set as by the interval of two substrate receiving platforms One interval and receive the substrate that two first sizes come are conveyed from upstream process side, or by described two substrate receiving platforms Interval is set as second interval bigger than the described first interval and receives from the upstream process side and convey two size ratios of coming The substrate of the second big size of the substrate of the first size；And substrate transfer portion, the substrate acceptance division is received The first size or the substrate of second size are transferred to the substrate installation portion, and two are received in the substrate acceptance division In the case of the substrate of the sizes of Zhang Suoshu second, the substrate transfer portion is by the substrate of two second sizes received It is transferred to element mounting portion respectively one by one.

Element fixing apparatus described in technical scheme 2 is, in the element fixing apparatus described in technical scheme 1, described In the case that substrate acceptance division receives the substrate of two first sizes, the substrate transfer portion receive this two The substrate of the first size is transferred to the element mounting portion simultaneously.

Element fixing apparatus described in technical scheme 3 is, described in the element fixing apparatus described in technical scheme 1 or 2 Element mounting portion possesses：Board holder, to by the substrate transfer portion first size that transfer two comes simultaneously Substrate or the substrate of second size shifted respectively one by one by the substrate transfer portion are kept；It is viscous Relay part sticking operation portion, adhering part is pasted the substrate kept by board holder；Element mounting homework department, by element It is carried to the substrate that adhering part has been pasted by the adhering part sticking operation portion；And element crimping operation portion, it will utilize The element that the element mounting homework department carries is crimped on the substrate that element is equipped with the element mounting homework department, the base Plate maintaining part can be installed optionally while keeping first substrate holding station or the guarantor of the substrate of two first sizes Hold the second substrate holding station of the substrate of second size.

Element fixing apparatus described in technical scheme 4 is that the element described in any one in technical scheme 1 to 3 is installed In device, the substrate transfer portion has two pick-up members, and described two pick-up members are configured to while picking up institute State described in two that substrate acceptance division is received in the state of described two substrate receiving platforms to be adjusted to first interval Described two substrate receiving platforms are being adjusted to first interval by the interval of the substrate of first size in the substrate acceptance division In the state of receive the substrates of two first sizes in the case of, the substrate transfer portion utilizes described two pickup structures Part picks up the substrate of two first sizes and is transferred to the board holder simultaneously.

Element fixing apparatus described in technical scheme 5 is, in the element fixing apparatus described in technical scheme 4, described Substrate acceptance division receives two described second in the state of described two substrate receiving platforms to be adjusted to second interval In the case of the substrate of size, the substrate transfer portion utilizes a pick-up member in described two pick-up members to pick up one The substrate of second size is simultaneously transferred to the board holder, then connects described two substrates in the substrate acceptance division Receive platform to be adjusted to behind first interval, the substrate transfer portion utilizes another pick-up member in described two pick-up members Pick up the substrate of remaining one second size and be transferred to the board holder.

The component mounting method that technical scheme 6 is related to is to enter the element mounting portion that units are installed to substrate by possessing The component mounting method that element fixing apparatus is realized, wherein, the component mounting method includes：Substrate receives process, by two The interval of substrate receiving platform is set as the first interval and receives substrate that two first sizes come are conveyed from upstream process side, or The interval of described two substrate receiving platforms is set as second interval bigger than the described first interval and received from the upstream by person The substrate of two next sizes of process side conveying, second size bigger than the substrate of the first size；And substrate transfer work Sequence, the base is transferred to by the substrate that the first size received in process or second size are received in the substrate Plate installation portion, in the case where receiving the substrate of two second sizes during the substrate receives process, in the substrate The substrate of two second sizes received is transferred to element mounting portion respectively one by one in transfering process.

Component mounting method described in technical scheme 7 is, in the component mounting method described in technical scheme 6, described In the case that substrate receives the substrate that two first sizes are received in process, this is connect in the substrate transfering process The substrate of two first sizes received is while be transferred to the element mounting portion.

In the present invention, the interval of two substrate receiving platforms is set as the first interval and receives and conveyed from upstream process side Two first sizes come（Small size）Substrate, or the interval of two substrate receiving platforms is set as bigger than the first interval Second is spaced and receives two sizes for conveying to come from upstream process side, second size bigger than the substrate of first size（Big chi It is very little）Substrate.Also, in the case where receiving the substrate of two the second sizes, by two second sizes received Substrate is transferred to element mounting portion respectively one by one, can be to appointing in the substrate of first size and the substrate of the second size A kind of substrate of anticipating enters units installation, therefore, it is possible to make the production line of substrate of two kinds of sizes of size unitize.

Brief description of the drawings

Fig. 1 is the top view of the element fixing apparatus of an embodiment of the invention.

Fig. 2 is the progress of the component mounting work to substrate for the element fixing apparatus for showing one embodiment of the present invention The figure of step.

Fig. 3 is the block diagram of the control system for the element fixing apparatus for showing one embodiment of the present invention.

Fig. 4（a）（b）It is the knot for showing the substrate acceptance division that the element fixing apparatus of one embodiment of the present invention possesses The figure of structure.

Fig. 5（a）（b）It is ACF sticking operations portion and a left side that the element fixing apparatus of one embodiment of the present invention possesses The stereogram of square substrate transport portion.

Fig. 6（a）（b）It is ACF sticking operations portion and a left side that the element fixing apparatus of one embodiment of the present invention possesses The stereogram of square substrate transport portion.

Fig. 7（a）（b）（c）It is the ACF for showing to carry out using the ACF sticking operations portion in an embodiment of the invention The figure of the execution step of the sticking operation of band.

Fig. 8（a）（b）Be one embodiment of the present invention the element mounting homework department that possesses of element fixing apparatus and in Entreat substrate transport portion（Right substrate transport portion）Stereogram.

Fig. 9（a）（b）Be one embodiment of the present invention the element mounting homework department that possesses of element fixing apparatus and in Entreat substrate transport portion（Right substrate transport portion）Stereogram.

Figure 10 is the element mounting operation for showing the element mounting homework department progress using one embodiment of the present invention Perform the flow chart of step.

Figure 11（a）（b）（c）It is that the element for showing the element mounting homework department progress using one embodiment of the present invention is taken Carry the figure of the execution step of operation.

Figure 12（a）（b）（c）It is that the element for showing the element mounting homework department progress using one embodiment of the present invention is taken Carry the figure of the execution step of operation.

Figure 13（a）（b）It is the first element crimping operation that the element fixing apparatus of one embodiment of the present invention possesses Portion（Second element crimping operation portion）With left substrate transport portion（Right substrate transport portion）Stereogram.

Figure 14（a）（b）It is the first element crimping operation that the element fixing apparatus of one embodiment of the present invention possesses Portion（Second element crimping operation portion）With left substrate transport portion（Right substrate transport portion）Stereogram.

Figure 15（a）（b）（c）It is the first element crimping operation portion for showing one embodiment of the present invention（Second element pressure Meet homework department）Element crimping operation execution step figure.

The step of Figure 16 is the element crimping operation for the element fixing apparatus execution for showing one embodiment of the present invention Flow chart.

Figure 17（a）~（f）It is that the first element crimping operation portion using one embodiment of the present invention is shown（Second element Crimping operation portion）The figure of the execution step of the element crimping operation of progress.

Figure 18（a）（b）It is that the substrate delivery/reception portion that the element fixing apparatus of one embodiment of the present invention possesses is shown The figure of structure.

Figure 19 is the stereogram of the substrate transfer portion of an embodiment of the invention.

Figure 20 is the partial top view of the element fixing apparatus of an embodiment of the invention.

Figure 21（a）（b）（c）It is that the element for showing the element fixing apparatus progress using one embodiment of the present invention is installed The figure of the execution step of operation.

Figure 22（a）（b）（c）It is that the element for showing the element fixing apparatus progress using one embodiment of the present invention is installed The figure of the execution step of operation.

Figure 23（a）（b）（c）It is that the element for showing the element fixing apparatus progress using one embodiment of the present invention is installed The figure of the execution step of operation.

Figure 24（a）（b）（c）It is that the element for showing the element fixing apparatus progress using one embodiment of the present invention is installed The figure of the execution step of operation.

Figure 25（a）（b）（c）It is that the element for showing the element fixing apparatus progress using one embodiment of the present invention is installed The figure of the execution step of operation.

Figure 26（a）（b）It is to show to install using the element of the element fixing apparatus progress of one embodiment of the present invention to make The figure of the execution step of industry.

Figure 27（a）（b）（c）It is that the element for showing the element fixing apparatus progress using one embodiment of the present invention is installed The figure of the execution step of operation.

Figure 28（a）（b）（c）It is that the element for showing the element fixing apparatus progress using one embodiment of the present invention is installed The figure of the execution step of operation.

Figure 29（a）（b）（c）It is that the element for showing the element fixing apparatus progress using one embodiment of the present invention is installed The figure of the execution step of operation.

Figure 30（a）（b）（c）It is that the element for showing the element fixing apparatus progress using one embodiment of the present invention is installed The figure of the execution step of operation.

Figure 31（a）（b）It is to show to install using the element of the element fixing apparatus progress of one embodiment of the present invention to make The figure of the execution step of industry.

Label declaration

1：Element fixing apparatus；

2：Substrate；

3：ACF bands（Adhering part）；

4：Element；

21：Substrate acceptance division；

21s：Substrate receiving platform；

22：Element mounting portion；

22a：ACF sticking operations portion（Adhering part sticking operation portion）；

22b：Element mounting homework department；

22c：First element crimping operation portion（Element crimping operation portion）；

22d：Second element crimping operation portion（Element crimping operation portion）；

33L：Left substrate transport portion（Board holder）；

36：Substrate holder（First substrate holding station）；

36T：Substrate holder（Second substrate holding station）；

82a：Left substrate transfer portion（Substrate transfer portion）；

94：Arm（Pick-up member）.

Embodiment

Below, embodiments of the present invention are described with reference to.The element peace of base plate of liquid crystal panel manufacture shown in Fig. 1 Assembling device 1 performs following component mounting work：Pasted using the ACF bands 3 as adhering part in the rectangle shown in Fig. 2 Panel shape substrate 2 four sides in one side end set electrode portion 2a after, element 4 is carried（Interim crimping）In this The ACF bands 3 pasted, then utilize crimping（Formal crimping）Element 4 is assemblied in substrate 2.The element 4 used herein is, for example, Drive circuit element, it has film-like portion 4a.

In Fig. 1, the base station 11 of element fixing apparatus 1 is from the left and right directions observed from operator OP（Paper in Fig. 1 Left and right directions, is set to X-direction）Left play in order configuration left base station 11a, center base station 11b and right base station successively 11c, in left, base station 11a possesses substrate acceptance division 21, possesses element mounting portion 22 in central base station 11b, in right base station 11c Possesses substrate delivery/reception portion 23.Aforesaid substrate acceptance division 21, element mounting portion 22 and substrate delivery/reception portion 23 are respectively by being used as control structure The control device 24 of part（Fig. 3）Control it to act.Substrate 2 along X-direction from left side to the right, i.e., according to substrate acceptance division 21, Element mounting portion 22, the sequential flowing in substrate delivery/reception portion 23 are simultaneously carried out operation successively.

In Fig. 1, substrate acceptance division 21 has left side（Upstream process side）And right side（Lower procedure side）Two substrates Receiving platform 21s.Described two substrate receiving platform 21s are configured to relative to left base station 11a liftings freely, connect in two substrates Receive platform 21s and be placed with two substrates 2 come from the upstream process side conveying of element fixing apparatus 1.

As shown in figure 4, the substrate receiving platform 21s on right side is fixed relative to left base station 11a, the substrate receiving platform in left side 21s can be moved on the base station 11a of left along X-direction.The element fixing apparatus 1 can be relative to size of different sizes Substrate 2 carries out component mounting work, for example, carrying out to first size（Hereinafter referred to as small size）Substrate 2 element install In the case of operation, two substrate receiving platform 21s interval is set as uninterruptedly receiving two small sizes each other The interval of substrate 2（Referred to as first interval）（Fig. 4（a））, and carrying out second size bigger than the substrate 2 of small size to size （Hereinafter referred to as large scale）Substrate 2 component mounting work in the case of, two substrate receiving platform 21s interval is set For it is bigger than the first interval, can uninterruptedly receive the interval of two large-sized substrates 2 each other（Referred to as second interval）（Figure 4（b））.

Element mounting portion 22 has：The ACF for entering the operation for being about to paste substrate 2 as the ACF bands 3 of adhering part pastes Homework department 22a（Adhering part sticking operation portion）, enter units 4 to substrate 2 carrying operation element mounting homework department 22b, The carrying that element 4 was carried out in element mounting homework department 22b will be crimped on using the element mounting homework department 22b elements 4 carried Two element crimping operation portions of the substrate 2 of operation（First element crimping operation portion 22c and the second element crimping operation portion 22d）.

ACF sticking operations portion 22a is located at central base station 11b left region, and element mounting homework department 22b is located at central base Platform 11b middle section.ACF sticking operations portion 22a and member that first element crimping operation portion 22c is located on central base station 11b Part carries the region between homework department 22b, and the element mounting that the second element crimping operation portion 22d is located on central base station 11b is made The region on industry portion 22b right side.That is, in the element fixing apparatus 1 of present embodiment, the first element crimping operation portion 22c and Second element crimping operation portion 22d is arranged at the position that element mounting homework department 22b is clipped from left and right sides side.

The front region of ACF sticking operations portion 22a on central base station 11b（Before and after being observed from operator OP Direction is set to Y direction）Provided with first base portion 31, element mounting homework department 22b, the first element on central base station 11b Crimping operation portion 22c and the second element crimping operation portion 22d front region are extended along X-direction second base portion 32。

In Fig. 1 and Fig. 5（a）、（b）In, it is provided with left substrate transport portion 33L in first base portion 31.The left substrate fortune Portion 33L is sent to be extended in first base portion 31 along Y direction, it has moves in first base portion 31 along X-direction The Y-axis workbench 34 that sets freely, the mobile station 35 movably set along Y direction on Y-axis workbench 34 and Two substrate holders 36 being set up in parallel in the upper surface of mobile station 35 along X-direction.From two bases of substrate acceptance division 21 Two substrates 2 are shifted and are maintained on two substrate holders 36 by plate receiving platform 21s.

Such as Fig. 6（a）Shown, left substrate transport portion 33L two substrate holders 36 can exchange into a substrate guarantor Platform 36T is held, in this case, from a substrate receiving platform 21s in two substrate receiving platform 21s of substrate acceptance division 21 by one Substrate 2 is opened to shift and be maintained on substrate holder 36T.

In addition, it is in order to which the described two substrates of utilization are protected to install two substrate holders 36 in left substrate transport portion 33L The situation that platform 36 keeps the substrate 2 of two small sizes is held, and one substrate holder 36T is installed in left substrate transport portion 33L It is the situation in order to utilize a substrate holder 36T to keep a large-sized substrate 2.I.e., in the present embodiment, it is left Square substrate transport portion 33L can be installed optionally while keeping two substrate holders 36 of the substrate 2 of two small sizes（The One substrate holder）Or keep a substrate holder 36T of a large-sized substrate 2（Second substrate holding station）.

Two substrate holders 36（Or a substrate holder 36T）It is respectively relative to mobile station 35 to lift freely, control Device 24 processed makes mobile station 35 carry out the transport of substrate 2 in Y direction movement relative to Y-axis workbench 34, makes two substrates Holding station 36 or a substrate holder 36T lifting, make to load on two substrate holders 36 or a substrate holder 36T Substrate 2 move up and down.

In Fig. 5（a）、（b）And Fig. 6（a）、（b）In, ACF sticking operations portion 22a has in central base station 11b top along X Two application heads 41 and glued in the lower section of each application head 41 along two ACF that X-direction is extended that direction of principal axis is set up in parallel Paste the secondary station 42 of operation.

Two application heads 41 possess respectively：Band supply unit 41a, it is extracted out and supplies ACF bands 3, by the ACF bands of the extraction 3 are cut off with predetermined length and it are maintained at into predetermined position with flat-hand position；And paste tool 41b, it will be supplied by band The ACF bands 3 that portion 41a is maintained at flat-hand position are pressurized from above by the side of secondary station 42 to ACF sticking operations.

Control device 24 makes left substrate transport portion 33L mobile station 35 in the front being set on Y-axis workbench 34 " substrate transfer position "（Fig. 5（a）And Fig. 6（a））With " job position " for being set in rear（Fig. 5（b）And Fig. 6（b））Between move It is dynamic." substrate transfer position " is being capable of relative to two substrate holders 36（Or a substrate holder 36T）Carry out substrate 2 Handing-over position, " job position " is the respective electrode portion of two substrates 2 that can make to be placed in two substrate holders 36 2a is located at the position of the top of the secondary station 42 of two ACF sticking operations（Or can make to be placed in a substrate holder The electrode portion 2a of a 36T substrate 2 is located at the top of a secondary station 42 in the secondary station 42 of two ACF sticking operations Position）.

Reference picture 7 illustrates the sticking operation that ACF bands 3 are pasted to substrate 2 by application head 41.First, such as Fig. 7（a）It is shown, Control device 24 makes the ACF bands 3 that the state cut off by predetermined length is acted and made with supply unit 41a be located at substrate 2（Electrode portion 2a）Top.Then, such as Fig. 7（b）It is shown, decline paste tool 41b, ACF bands 3 are pressed into ACF for each substrate 2 The secondary station 42 of sticking operation.Finally, such as Fig. 7（c）It is shown, paste tool 41b is increased relative to substrate 2.As a result, will be pre- The ACF bands 3 of measured length are pasted relative to substrate 2.

In Fig. 1, it is provided with central substrate transport portion 33C and right substrate transport portion 33R in second base portion 32.Central base Plate transport portion 33C and right substrate transport portion 33R is same type, and central substrate transport portion 33C is located at right substrate transport portion 33R Left.Such as Fig. 8（a）、（b）It is shown, central substrate transport portion 33C（Right substrate transport portion 33R is similarly）With second The Y-axis workbench 51 that is movably set along X-direction in base portion 32, on Y-axis workbench 51 along Y direction move from The mobile station 52 such as set and two substrate holders 53 being set up in parallel in the upper surface of mobile station 52 along X-direction. Mobile station 52 is built-in with the elevating mechanism for making two substrate holders 53 be lifted respectively to Z-direction.Two substrate holders 53 By Y-axis workbench 51 relative to second base portion 32 in the movement of X-direction and mobile station 52 relative to Y-axis workbench 51 Move and to horizontal direction movement freely, shift two substrates 2 from left substrate transport portion 33L two substrate holders 36 And be maintained on two substrate holders 53.

Central substrate transport portion 33C two substrate holders 53 and right substrate transport portion 33R two substrates are kept Platform 53 is able to such as Fig. 9（a）It is shown to exchange into a substrate holder 53T, in this case, from left substrate transport portion One substrate 2 is shifted and is maintained on substrate holder 53T by a 33L substrate holder 36T.

In addition, central substrate transport portion 33C and right substrate transport portion 33R install two substrate holders 53 be in order to The situation of the substrate 2 of two small sizes is kept using described two substrate holders 53, and on central substrate transport portion 33C and the right side It is that one substrate holder 53T keeps one big chi for utilization that square substrate transport portion 33R, which installs a substrate holder 53T, The situation of very little substrate 2.I.e., in the present embodiment, central substrate transport portion 33C and right substrate transport portion 33R can be selected Install to selecting property while keeping two substrate holders 53 of the substrate of two small sizes（First substrate holding station）Or keep One substrate holder 53T of one large-sized substrate 2（Second substrate holding station）.

Two substrate holders 53（Or a substrate holder 53T）Each via Y-axis workbench 51 relative to second Base portion 32 is moved freely in the horizontal direction in the movement of X-direction and mobile station 52 relative to the movement of Y-axis workbench 51, And it is configured to lift respectively freely by the driving in the above-mentioned elevating mechanism built in mobile station 52.Control device 24 leads to Cross progress Y-axis workbench 51 relative to second base portion 32 in the movement of X-direction and mobile station 52 relative to Y-axis workbench 51 Moving and make two substrate holders 53 to Y direction（Or a substrate holder 53T）Direction is moved in the horizontal plane, To carry out the transport of substrate 2, make two substrate holders 53（Or a substrate holder 53T）Decline/rising, makes to be placed in Two substrates 2 of two substrate holders 53（Or it is placed in a substrate holder 53T substrate 2）Relative to auxiliary Land/leave in the upper surface of platform 64.

In Fig. 1, Fig. 8（a）、（b）And Fig. 9（a）、（b）In, element mounting homework department 22b possesses：Component feeding portion 61, its The supply that units 4 of going forward side by side are set rearward is stretched out from central base station 11b rear portion；Boarded head 63, it is by central base station The carrying head moving mechanism 62 that 11b central rear is set in the horizontal plane it is mobile freely, and from top absorptive element supply unit The element 4 of 61 supplies；And the secondary station 64 of element mounting operation, its central portion rear area edge in second base portion 32 Y direction is extended.The supply of the element 4 of the control element supply unit 61 of control device 24 is acted, by carrying head moving mechanism The absorption of shift action, boarded head 63 to element 4 in the horizontal plane for the boarded head 63 that 62 action is realized is acted.Thus, enter Go from absorption of the boarded head 63 to element 4（Pickup）A series of operation untill carrying of from the element 4 to substrate 2.

In Fig. 8（a）And Fig. 9（a）In, along X-direction it is set side by side with shooting in the secondary station 64 of element mounting operation The two positions identification video camera 65 of visual field upward.Described two positions identification video cameras 65 controlled by control device 24 and Shooting action is carried out, the transparent material portion 64a such as quartz glass set by the top of the secondary station 64 in element mounting（Figure 8（a）And Fig. 9（a））, the object for being pointed to the top of the secondary station 64 of element mounting imaged.

The element mounting job control unit SR1 of control device 24（Fig. 3）Central substrate transport portion 33C mobile station 52 is set to exist " substrate transfer position " in the front being set on Y-axis workbench 51（Fig. 8（a）And Fig. 9（a））With " the operation for being set in rear Position "（Fig. 8（b）And Fig. 9（b））Between move." substrate transfer position " is being capable of relative to two substrate holders 53（Or One substrate holder 53T）Carry out the position of the handing-over of substrate 2." job position " is can to make be placed in two substrate guarantors Hold platform 53（Or a substrate holder 53T）Substrate 2 electrode portion 2a paste ACF bands 3 be located at element mounting operation use Secondary station 64 top（It is furtherly in the top of the secondary station 72 of element crimping operation described later）Position.

In the case where element 4 is equipped on the element mounting operation of substrate 2 by execution, control device 24（Element mounting is made Industry control unit SR1）First by making mobile station 52 be moved to " job position " so that the electrode portion 2a of substrate 2 be positioned at it is auxiliary Help the top position of platform 64（Carry job position）（Step ST1 shown in Figure 10 flow chart）.Then, two position identifications are made Two position recognition mark m that the substrate 2 that video camera 65 is pointed to the top of the secondary station 64 of element mounting has（Fig. 2） Imaged, recognized（Figure 11（a））, the positional information based on two position recognition mark m calculates（Obtain）With the position of substrate 2 Related information（Positional information of the substrate 2 relative to substrate holder 53 or substrate holder 53T）, its result storage is arrived The storage part 24a of control device 24（Fig. 3）（Step ST2）.

Specifically, in the case where two substrates 2 are positioned in into two substrate holders 53, it will be transported in central substrate The data of the position correction amount relative to substrate holder 53 of the substrate 2 kept on the substrate holder 53 in portion 33C left side It is used as the first correction data storage region KR1 of the information storage related to the position of substrate 2 to storage part 24a.Similarly, will The data storage of the position correction amount of the substrate 2 kept on the substrate holder 53 on central substrate transport portion 33C right side exists Second correction data storage region KR2.Moreover, will be kept on the substrate holder 53 in right substrate transport portion 33R left side Substrate 2 the position correction amount relative to substrate holder 53 data storage in the 3rd correction data storage region KR3, will The position correction data of the substrate 2 kept on the substrate holder 53 on right side is stored in the 4th correction data storage region KR4.

On the other hand, in the case where a substrate 2 is positioned in into a substrate holder 53T, it will be transported in central substrate The data of the position correction amount relative to substrate holder 53T of the substrate 2 kept on portion 33C substrate holder 53T are sent to make For the first correction data storage region KR1 of the information storage related to the position of substrate 2 to storage part 24a.Similarly, will be The position correction relative to substrate holder 53T of the substrate 2 kept on right substrate transport portion 33R substrate holder 53T The data storage of amount is in the 3rd correction data storage region KR3.

Control device 24（Element mounting job control unit SR1）After the completion of above-mentioned steps ST2, make mobile station 52 temporarily to Move and make the electrode portion 2a of substrate 2 from the top position of secondary station 64 in front（Carry job position）Keep out of the way（Figure 11（b）.Step Rapid ST3）, then decline boarded head 63, make element 4 to close to secondary station 64（Position identification video camera 65 side）Direction （Carry job position）It is mobile（Step ST4）.Then, now recognize that video camera 65 has not to element 4 using two positions The position recognition mark of diagram is imaged, recognized（Figure 11（c））, calculate（Obtain）The information related to the position of element 4（Member Positional information of the part 4 relative to boarded head 63）, the position correction amount of element 4 is then tried to achieve, its result is stored in above-mentioned storage Portion 24a（Step ST5）.

Control device 24（Element mounting job control unit SR1）As described above by the positional information of substrate 2 and element 4 Positional information be stored in after storage part 24a, boarded head 63 is increased（Figure 12（a）, then make mobile station 52 be again positioned at " making Industry position ".Then, based on the information related to the position of substrate 2 stored in storage part 24a（The position correction amount of substrate 2） The information related to the position of element 4（The position correction amount of element 4）, so that the electrode portion of the side of element 4（It is not shown）With base The mode of the electrode portion 2a consistencies from top to bottom of the side of plate 2 carries out central substrate transport portion 33C action control, carry out substrate 2 relative to Element mounting homework department 22b（For directly, relative to element 4）Positioning（Figure 12（b）.Step ST6）.

Control device 24（Element mounting job control unit SR1）Substrate 2 is so being carried out relative to element mounting homework department After 22b positioning, decline boarded head 63, the element 4 adsorbed by boarded head 63 is pressed into ACF bands 3 on a substrate 2 and carried In substrate 2（Figure 12（c）.Step ST7）.In addition, the pressing force of boarded head 63 now is held by the secondary station 64 of element mounting By.Control device 24 rises boarded head 63 after element 4 is equipped on into substrate 2（Step ST8）.

As shown in Fig. 8, Fig. 9, Figure 11 and Figure 12, in central substrate transport portion 33C（Right substrate transport portion 33R is similarly） Two substrate holders 53 possessed are distinguished（Or a substrate holder 53T）Provided with the thin of the frame-shaped with horizontal part 54a Membranaceous part support 54, the horizontal part 54a is in the substrate holder 53（Or substrate holder 53T）Rear along X-axis Direction extends.As shown in Fig. 2 etc., the shape of substrate 2 is being equipped on by the element mounting homework department 22b elements 4 for being equipped on substrate 2 Film-like portion 4a is reached outside substrate 2 under state.However, by the way that above-mentioned film-like portion support 54 is arranged at into each substrate Holding station 53（Or substrate holder 53T）, element is supported on from below using the horizontal part 54a of film-like portion support 54 4 are equipped on the film-like portion 4a that the element 4 outside substrate 2 is reached in the state of substrate 2.Thus, it is therefore prevented that be equipped on base The film-like portion 4a of the element 4 of the state of plate 2 turns into the state hung down downwards.

Such as Figure 13（a）、（b）And Figure 14（a）、（b）It is shown, the first element crimping operation portion 22c（Second element crimping operation Portion 22b is similarly）With two crimp heads 71 being set up in parallel along X-direction and in the lower section of each crimp head 71 along Y direction The secondary station 72 of two extended element crimping operations.The element crimping operation control unit SR2 of control device 24（Fig. 3） The crimp head 71 that the element crimping operation portion 22d of crimp head 71 and second for controlling the first element crimping operation portion 22c to possess possesses Respective lifting action（Fig. 3）.

Two substrates 2 loaded on two substrate holders 53 possessed on central substrate transport portion 33C（Or The substrate 2 loaded on one substrate holder 53T）, control device 24（Element crimping operation control unit SR2）In boarded head After the completion of the carrying operation of 63 pairs of elements 4, make Y-axis workbench 51 keep unchangeably along second base portion 32 to the left（I.e. along water Square to the side to the first element crimping operation portion 22c）It is mobile, make two substrates loaded on two substrate holders 53 2（Or the substrate 2 loaded on a substrate holder 53T）The part pasted of each ACF bands 3 be located at two elements The top of the secondary station 72 of crimping operation（The lower section of two crimp heads 71）.Now, based on storage part 24a store and base The related information in the position of plate 2 makes substrate holder 53（Or substrate holder 53T）It is mobile, by substrate 2 relative to first yuan Part crimping operation portion 22c is positioned（Figure 13（a）Or Figure 14（a））.

Specifically, in the case where two substrates 2 are placed in into two substrate holders 53, for the substrate in left side The substrate 2 kept in holding station 53 is carried out using the data from the first correction data storage region KR1 position correction amounts read Positioning, uses what is read from the second correction data storage region KR2 for the substrate 2 kept on the substrate holder 53 on right side The data of position correction amount are positioned.Also, make two crimp heads 71 that the first element crimping operation portion 22c possesses successively Decline, will be crimped on by the element mounting homework department 22b elements 4 carried on two substrates 2（Figure 15（a）→ Figure 15（b）→ Figure 15 （c））.On the other hand, in the case where a substrate holder 53T loads a substrate 2, to being kept by substrate holder 53T Substrate 2 positioned using from the first correction data storage region KR1 data of position correction amount read.Also, make Two crimp heads 71 that one element crimping operation portion 22c possesses decline successively, the member that will be carried by element mounting homework department 22b Part 4 is crimped on two substrates 2（Figure 15（a）→ Figure 15（b）→ Figure 15（c））.

Similarly, two substrates 2 loaded on two substrate holders 53 possessed on right substrate transport portion 33R （Or the substrate 2 loaded on a substrate holder 53T）, control device 24（Element crimping operation control unit SR2） After the completion of carrying operation of the boarded head 63 to element 4, make Y-axis workbench 51 keep unchangeably along second base portion 32 to the right （I.e. to the second element crimping operation portion 22d side）It is mobile, make two substrates 2 loaded on two substrate holders 53 （Or the substrate 2 loaded on a substrate holder 53T）The part carried of element 4 be located at element respectively and crimp The top of the secondary station 72 of operation（The lower section of crimp head 71）.Then, based on the step ST2 obtain with substrate 2 The related information in position moves substrate holder 53, and substrate 2 is positioned relative to the second element crimping operation portion 22d（Figure 13 （a）Or Figure 14（a））.

Specifically, in the case where two substrates 2 are placed in into two substrate holders 53, for the substrate in left side The substrate 2 kept in holding station 53 is carried out using the data from the 3rd correction data storage region KR3 position correction amounts read Positioning, uses what is read from the 4th correction data storage region KR4 for the substrate 2 kept on the substrate holder 53 on right side The data of position correction amount are positioned.Also, make two crimp heads 71 that the second element crimping operation portion 22d possesses successively Decline, will be crimped on by the element mounting homework department 22b elements 4 carried on two substrates 2（Figure 15（a）→ Figure 15（b）→ Figure 15 （c））.On the other hand, in the case where a substrate holder 53T loads a substrate 2, to being kept by substrate holder 53T Substrate 2 positioned using from the 3rd correction data storage region KR3 data of position correction amount read.Also, make Two crimp heads 71 that two element crimping operation portion 22d possesses decline successively, the member that will be carried by element mounting homework department 22b Part 4 is crimped on two substrates 2（Figure 15（a）→ Figure 15（b）→ Figure 15（c））.

Two crimp heads each possessed in the first element crimping operation portion 22c and the second element crimping operation portion 22d It is described in the case where installing two substrate holders 53 and handling two substrates 2 simultaneously in the crimping operation of 71 pairs of elements 4 Two substrate holders 53 are arranged on a mobile station 52, thus positioning of each substrate 2 relative to corresponding crimp head 71 and this Element crimping operation afterwards staggers opportunity and carried out successively.The action is described in detail according to Figure 16 and Figure 17.

Control device 24（Element crimping operation control unit SR2）Two will loaded first on two substrate holders 53 The respective part for being equipped with element 4 of substrate 2 navigates to the top position of secondary station 72（Crimping operation position）（Figure 16 flow Step ST11 shown in figure）.Now, based on being garnered and stored in the first of storage part 24a in above-mentioned element mounting operation Correction data storage region KR1（Or the 3rd correction data storage region KR3）In the information related to the position of substrate 2 （The position correction amount data of the substrate 2 kept on the substrate holder 53 in left side）Move mobile station 52.Thus, by left side Substrate 2 positioned relative to corresponding crimp head 71（Figure 17（a）.Step ST12）.

Next control device 24 declines the crimp head 71 in left side, substrate 2 is existed after the substrate 2 in left side is positioned Clamped between secondary station 72 and crimp head 71, the substrate 2 by element 4 relative to left side is crimped（Figure 17（b）.Step ST13）.Connect , in the state of the clamped condition is kept, the substrate holder 53 in left side is declined slightly, release substrate holder 53 to base The holding of plate 2（Figure 17（c）.Step ST14）.

Thereby, it is possible to make mobile station 52 move independently of the ground of substrate 2 in left side, it is then based on equally taking in above-mentioned element Carry the second correction data storage region KR2 that storage part 24a is garnered and stored in operation（Or the 4th correction data memory block Domain KR4）In the information related to the position of substrate 2（The position correction of the substrate 2 kept on the substrate holder 53 on right side The data of amount）Mobile station 52 is moved, the substrate 2 on right side is positioned relative to corresponding crimp head 71（Step ST15）.

Next control device 24 declines the crimp head 71 on right side, substrate 2 is existed after the substrate 2 on right side is positioned Clamped between secondary station 72 and crimp head 71, the substrate 2 by element 4 relative to right side is crimped（Figure 17（d）.Step ST16）.System Make device 24（Element crimping operation control unit SR2）After element 4 is crimped relative to the substrate 2 on right side, make the substrate in left side Holding station 53 rises and keeps substrate 2, the crimp head 71 in left side is increased（Figure 17（e）.Step ST17）, then make right side Crimp head 71 rise（Figure 17（f）.Step ST18）.Thus, crimping operation of the element 4 relative to two substrates 2 is completed.

Control device 24（Element crimping operation control unit SR2）Units 4 are being entered relative to two by above-mentioned step After the crimping operation that substrate 2 is crimped, mobile station 52 is moved forwards along Y-axis workbench 51, mobile station 52 is reset into " substrate Delivery position ".

In addition, 71 pairs of positioning of the crimp head 71 relative to the substrate 2 loaded on two substrate holders 53 and crimp head The crimping of element 4 can not also be as described above relative to left and right substrate 2 carry out respectively, but carry out simultaneously.In the situation Under, calculate the substrate 2 in the left side obtained in element mounting operation relative to the position skew of the substrate holder 53 in left side and The substrate 2 on right side keeps the substrate on left side and right side relative to the average value that the position of the substrate holder 53 on right side is offset Platform 53 is positioned relative to each self-corresponding crimp head 71 simultaneously.Then, element 4 is crimped on substrate 2 simultaneously using crimp head 71. In this case, compared with situation about positioning respectively, positioning precision is reduced slightly, but can shorten pitch time.

In Fig. 1, substrate delivery/reception portion 23 has left side（Upstream process side）And right side（Lower procedure side）Two substrates Transfer station 23s.The two substrate delivery/reception platform 23s in the left and right are set as relative to right base station 11c liftings freely, in two substrates Transfer station 23s is placed with the pressure that element 4 is completed in the first element crimping operation portion 22c or the second element crimping operation portion 22d Connect two substrates 2 of operation.Being placed in two substrate delivery/reception platform 23s two substrates 2, to take out of component by substrate (not shown) defeated Deliver to other devices set on the downside of the lower procedure of element fixing apparatus 1.

As shown in figure 18, the substrate delivery/reception platform 23s in left side is fixed relative to right base station 11c, the substrate delivery/reception platform on right side 23s can be moved on the base station 11c of right along X-direction.In the situation for carrying out the component mounting work to the substrate 2 of small size Under, two substrate delivery/reception platform 23s interval is set so as to receive with will not interfere with the institute of the substrate 2 of two small sizes each other State the first interval（Figure 18（a））, or be set as that described the second of two large-sized substrates 2 can be received with will not interfere with each other Interval（Figure 18（b））.

In fig. 11, it is provided with the front region of base station 11 in left base station 11a, center base station 11b and right base station 11c The mobile base 81 that extends along X-direction of scope.Left substrate transfer is sequentially provided with from left in the mobile base 81 Portion 82a, central substrate transfer portion 82b and right substrate transfer portion 82c.

As shown in figure 19, left substrate transfer portion 82a, central substrate transfer portion 82b and right substrate transfer portion 82c difference With the base portion 91 movably set along X-direction relative to mobile base 81 and the two arm lists set on substrate 91 Member 92.Each arm unit 92 possesses the arm base 93 fixed in base portion 91 and two be extended from arm base 93 to horizontal rear Arm 94.The multiple absorption layers 95 of adsorption plane downward are provided with each arm 94.Each arm unit 92 can be by setting in two arms 94 The substrate 2 of four absorption layers 95 pair that amounts to put enters vacuum adsorbed.

In the substrate 2 loaded using left substrate transfer portion 82a pickups on the substrate receiving platform 21s of substrate acceptance division 21 In the case of, control device 24 is located at two substrates in the absorption layer 95 of the arm 94 on left substrate transfer portion 82a right side and received Being fixed in the state of the substrate receiving platform 21s top on left base station 11a right side in platform 21s, makes substrate receiving platform 21s Lifting.Here, left substrate transfer portion 82a, central substrate transfer portion 82b and right substrate transfer portion 82c be each provided with two The interval of the X-direction of individual arm 94 is set to above-mentioned first interval, therefore, and two substrate receiving platform 21s are being set as into the In the case of one interval, the substrate receiving platform 21s on right side is located at the lower section of the absorption layer 95 of the arm 94 on right side, and the base on right side Plate receiving platform 21s is located at the lower section of the absorption layer 95 of the arm 94 in left side, and two substrate receiving platform 21s are placed in two substrates 2 In the case of, two substrates 2 can be picked up simultaneously using two arms 94.

The substrate holder 36 in left substrate transport portion 33L is picked up by arm 94（Or substrate holder 36T）Upload The substrate 2 put, or the substrate 2 picked up by arm 94 is placed in substrate holder 36（Or substrate holder 36T）In the case of, Control device 24 is in two substrate holders 36 for making the absorption layer 95 of two arms 94 possess positioned at left substrate transport portion 33L Top in the state of（Or the absorption layer 95 of an arm 94 in two arms 94 is located at the upper of substrate holder 36T In the state of side）Make two substrate holders 36（Or a substrate holder 36T）Lifting.

Moreover, picking up the substrate holder in central substrate transport portion 33C or right substrate transport portion 33R by arm 94 53（Or substrate holder 53T）The substrate 2 of upper holding, or the substrate 2 picked up by arm 94 is placed in substrate holder 53 （Or substrate holder 53T）In the case of, control device 24 makes the centrally located substrate transport portion of absorption layer 95 of two arms 94 In the state of the top for two substrate holders 53 that 33C or right substrate transport portion 33R possess or make in two arms 94 The absorption layer 95 of an arm 94 be located in the state of substrate holder 53T top（Or make one in two arms 94 The absorption layer 95 of individual arm 94 is located in the state of substrate holder 53T top）Make two substrate holders 53（Or one Individual substrate holder 53T）Lifting.

The control of control device 24 left substrate transfer portion 82a, central substrate transfer portion 82b, right substrate transfer portion 82c are each The absorption of substrate 2 is acted via absorption layer 95 from the shift action along mobile base 81 to X-direction, each arm unit 92（Figure 3）.Specifically, control device 24 makes left substrate transfer portion 82a actions that substrate 2 is transported into a left side from substrate acceptance division 21 Square substrate transport portion 33L, makes central substrate transfer portion 82b actions that substrate 2 is transported into center from left substrate transport portion 33L Substrate transport portion 33C or right substrate transport portion 33R.That is, the base of ACF bands 3 will be pasted with by ACF sticking operations portion 22a Plate 2 is separately placed on two substrate holders 53 that central substrate transport portion 33C possesses（Or a substrate holder 53T） And two substrate holders 53 that right substrate transport portion 33R possesses（Or a substrate holder 53T）.Moreover, control Device 24 processed acts right substrate transfer portion 82c, by substrate 2 from central substrate transport portion 33C or right substrate transport portion 33R is transported to substrate delivery/reception portion 23.

Then, the action of each several part is illustrated when carrying out the component mounting work to substrate 2 to element fixing apparatus 1. As shown in figure 20, control device 24 is by left substrate transfer portion 82a, central substrate transfer portion 82b and right substrate transfer portion 82c Respective possible position is set as：The anterior position of substrate acceptance division 21（First position P1）, before ACF sticking operations portion 22a Put in orientation（Second place P2）, the first element crimping operation portion 22c anterior position（3rd position P3）, element mounting homework department 22b anterior position（4th position P4）, the second element crimping operation portion 22d anterior position（5th position P5）And substrate The anterior position of junction 23（6th position P6）.

In the element fixing apparatus 1, as described above, can enter units to the substrate 2 of two kinds of sizes of size installs work Industry, in the following description for convenience, is referred to as the first mould by the work pattern that the substrate 2 to small size enters units installation Formula, the work pattern referred to as second mode of units installation will be entered to large-sized substrate 2.In element fixing apparatus 1 with first Pattern implement component mounting work still in a second mode implement component mounting work selection be by operator OP operation with The connected mode selection switch 90 of control device 24（Fig. 3）Come carry out.

In the case where being set as first mode, two substrate receiving platform 21s are being set as first by substrate acceptance division 21 The substrate 2 that two small sizes come are conveyed from upstream process side is received in the state of interval simultaneously.On the other hand, it is being set as In the case of two modes, substrate acceptance division 21 is set as in the state of the second interval while connecing by two substrate receiving platform 21s Receive from upstream process side and convey two large-sized substrates 2 of coming.

Similarly, in the case where being set as first mode, substrate delivery/reception portion 23 is set by two substrate delivery/reception platform 23s To receive two substrates 2 simultaneously from central substrate transport portion 33C or right substrate transport portion 33R in the state of the first interval and handing over Lower procedure side is connected to, in the case where being set as second mode, substrate delivery/reception portion 23 is set by two substrate delivery/reception platform 23s To receive a substrate respectively from central substrate transport portion 33C or right substrate transport portion 33R in the state of the second interval and handing over It is connected to lower procedure side.

Two substrate holders 36 first, are installed to left substrate by operator OP in the case where selecting first mode In transport portion 33L mobile station 35, and two substrate holders 53 are installed to central substrate transport portion 33C and right substrate In the respective mobile stations 52 of transport portion 33R.Then, the operation of mode selection switch 90 is carried out, first mode is selected.

After first mode is selected by mode selection switch 90, control device 24 makes left substrate transfer portion 82a be located at the One position P1, make central substrate transfer portion 82b be located at second place P2, make right substrate transfer portion 82c be located at the 4th position P4, And the anterior position for making central substrate transport portion 33C be located at element mounting homework department 22b, make right substrate transport portion 33R In the second element crimping operation portion 22d anterior position.Then, by between two substrate receiving platform 21s of substrate acceptance division 21 It is set as the first interval every the interval of two substrate delivery/reception platform 23s with substrate delivery/reception portion 23（Do not change later）, by base Two substrate receiving platform 21s of plate acceptance division 21 receive the substrate 2 for two small sizes come from the device conveying of upstream process side Afterwards（Substrate receives process）, two substrates 2 of the reception are picked up by left substrate transfer portion 82a two arms 94（Figure 21 （a））.

Control device 24 is received in two arms 94 by left substrate transfer portion 82a from two substrates of substrate acceptance division 21 Platform 21s is picked up after two substrates 2, by making left substrate transfer portion 82a be located at second place P2, making central substrate transfer portion 82b is located at the 4th position P4, right substrate transfer portion 82c is located at the 6th position P6, so that left substrate transfer portion 82a be picked up Two substrates 2 taken load and are maintained at left substrate transport portion 33L two substrate holders 36（Figure 21（b）.Substrate is shifted Process）.Then, left substrate transport portion 33L mobile station 35 is moved to " job position ", perform ACF sticking operations portion 22a To the ACF sticking operations of two substrates 2（Figure 21（c））.In addition, during this period, being received in two substrates of substrate acceptance division 21 Two new substrates 2 are loaded on platform 21s.

Control device 24 makes ACF left after ACF sticking operations of the ACF sticking operations portion 22a to two substrates 2 is performed Square substrate transport portion 33L mobile station 35 is moved to " substrate transfer position ", left substrate transfer portion 82a is located at first Position P1, make central substrate transfer portion 82b be located at second place P2, make right substrate transfer portion 82c be located at the 4th position P4.Connect , two on two substrate receiving platform 21s of substrate acceptance division 21 are picked up using left substrate transfer portion 82a two arms 94 Substrate 2, two substrates 2 on the substrate transport portion 33L of left are picked up using central substrate transfer portion 82b two arms 94（Figure 22 （a））.

Control device 24 is received using left substrate transfer portion 82a two arms 94 from two substrates of substrate acceptance division 21 Platform 21s picks up two substrates 2, and two of left substrate transport portion 33L are picked up using central substrate transfer portion 82b two arms 94 Two substrates 2 on substrate holder 36, then make left substrate transfer portion 82a be located at second place P2, turn central substrate Shifting portion 82b is located at the 4th position P4, right substrate transfer portion 82c is located at the 6th position P6, thus, will be turned using left substrate Two substrates 2 of shifting portion 82a two arms 94 pickup load and are maintained at left substrate transport portion 33L two substrate holders 36, two substrates 2 picked up by central substrate transfer portion 82b two arms 94 are loaded and central substrate transport portion is maintained at 33C two substrate holders 53（Figure 22（b））.

Next control device 24 makes left substrate transport portion 33L mobile station 35 be located at " job position " and perform ACF On the other hand sticking operation portion 22a, makes central substrate transport portion 33C mobile station 52 to the ACF sticking operations of two substrates 2 " job position " is moved to, the substrate 2 of the left in two substrates 2 on two substrate holders 53 is made positioned at element mounting The top of the secondary station 64 of industry, so that executive component carries element mounting operations of the homework department 22b to the substrate 2 of left（Figure 22（c）.Element mounting process）.

Control device 24 is after element mounting operations of the said elements carrying homework department 22b to the substrate 2 of left is performed Central substrate transport portion 33C is moved to the left, make what is loaded on central substrate transport portion 33C two substrate holders 53 The substrate 2 of right in two substrates 2 is located at the top of the secondary station 64 of element mounting operation, makees so that executive component is carried Element mounting operations of the industry portion 22b to the substrate 2 of right（Figure 23（a）.Element mounting process）.In addition, during this period, in substrate Two new substrates 2 are loaded on two substrate receiving platform 21s of acceptance division 21.

Control device 24 makes central base after the element mounting operation that homework department 22b is carried based on said elements is performed Plate transport portion 33C is kept unchangeably to the left（First element crimping operation portion 22c side）It is mobile, it will be kept in two substrates The substrate 2 loaded on platform 53 is transported to the first element crimping operation portion 22c, makes two loaded on two substrate holders 53 Substrate 2 is located at the top of the secondary station 72 of two element crimping operations, so as to perform the first element crimping operation portion 22c to two Open the element crimping operation of substrate 2（Figure 23（b）.Element crimping process）.Moreover, at the same time, making left substrate transfer portion 82a Positioned at first position P1, two substrates picked up using left substrate transfer portion 82a two arms 94 in substrate acceptance division 21 are connect Two substrates 2 loaded on platform 21s are received, on the other hand, left substrate transport portion 33L mobile station 35 is located at " substrate delivery/reception Position " simultaneously ordinatedly makes central substrate transfer portion 82b be located at second place P2 with this, utilizes the two of central substrate transfer portion 82b Two substrates 2 on the individual pickup of arm 94 left substrate transport portion 33L two substrate holders 36.Moreover, making right substrate fortune Send portion 33R to be located at element mounting homework department 22b anterior position, and right substrate transfer portion 82c is located at the 4th position P4.

Control device 24 makes right substrate transfer portion 82c be located at the 6th position P6, in then making after the completion of above-mentioned operation Substrate transfer portion 82b is entreated to be located at the 4th position P4, by what is picked up from left substrate transport portion 33L two substrate holders 36 Two substrates 2 load and are maintained at right substrate transport portion 33R two substrate holders 53, and by turning left substrate Shifting portion 82a is located at second place P2, will be loaded from two substrates 2 of the two of substrate acceptance division 21 substrate receiving platform 21s pickups And it is maintained at left substrate transport portion 33L two substrate holders 36（Figure 23（c））.

Substrate 2 is being placed in right substrate transport portion 33R two substrate holders 36 and left base by control device 24 After plate transport portion 33L two substrate holders 53, left substrate transport portion 33L mobile station 35 is set to be located at " job position " simultaneously ACF sticking operations of the ACF sticking operations portion 22a to two substrates 2 is performed, on the other hand, makes right substrate transport portion 33R shifting Dynamic platform 52 is moved to " job position ", makes the substrate 2 of the right in two substrates 2 being loaded on two substrate holders 53 In the top of the secondary station 64 of element mounting operation, so that executive component carries elements of the homework department 22b to the substrate 2 of right Carry operation（Figure 24（a）.Element mounting process）.

Control device 24 is performing ACF sticking operations based on above-mentioned ACF sticking operations portion 22a and based on element mounting After homework department 22a element mounting operation, right substrate transport portion 33R is moved to the right, make in right substrate transport portion 33R Two substrate holders 53 on the substrate 2 of left in two substrates 2 loading be located at the secondary station of element mounting operation 64 top, so that executive component carries element mounting operations of the homework department 22b to the substrate 2 of left（Figure 24（b）.Element is taken Carry process）.In addition, during this period, being loaded on two substrate receiving platform 21s of substrate acceptance division 21（Move into）Two new bases Plate 2.

Control device 24 makes right base after the element mounting operation that homework department 22b is carried based on said elements is performed Plate transport portion 33R is kept unchangeably to the right（Second element crimping operation portion 22d side）It is mobile, it will be kept in two substrates Two substrates 2 loaded on platform 53 are transported to the second element crimping operation portion 22d, make what is loaded on two substrate holders 53 Two substrates 2 are located at the top of the secondary station 72 of two element crimping operations, so as to perform the second element crimping operation portion 22d To the element crimping operation of two substrates 2（Figure 24（c）.Element crimping process）.Moreover, at the same time, making left substrate transfer Portion 82a is located at first position P1, and two bases in substrate acceptance division 21 are picked up using left substrate transfer portion 82a two arms 94 Two substrates 2 loaded on plate receiving platform 21s, on the other hand, make left substrate transport portion 33L mobile station 35 be located at " substrate Delivery position " simultaneously ordinatedly makes central substrate transfer portion 82b be located at second place P2 with this, utilizes central substrate transfer portion 82b Two arms 94 pickup left substrate transport portion 33L two substrate holders 36 on two substrates 2.Moreover, making central base Plate transport portion 33C mobile station 52 is moved to " substrate transfer position " and central substrate transport portion 33C is made positioned at element mounting Industry portion 22b anterior position, utilizes two arms of the right substrate transfer portion 82c positioned at element mounting homework department 22b front Two substrates 2 on 94 pickup central substrate transport portion 33C two substrate holders 36（Figure 24（c））.

Control device 24 makes right substrate transfer portion 82c be located at the 6th position P6 and by two after the completion of above-mentioned operation Substrate 2 is positioned in two substrate delivery/reception platform 23s in substrate delivery/reception portion 23, on the other hand, central substrate transfer portion 82b is located at the Four position P4, two substrates 2 picked up from left substrate transport portion 33L two substrate holders 36 are loaded and are maintained at Central substrate transport portion 33C two substrate holders 53, and by making left substrate transfer portion 82a be located at the second place P2, will load from two substrates 2 of the two of substrate acceptance division 21 substrate receiving platform 21s pickups and is maintained at left substrate transport Portion 33L two substrate holders 36（Figure 25（a））.

Substrate 2 is being loaded and is being maintained at central substrate transport portion 33C two Hes of substrate holder 36 by control device 24 After left substrate transport portion 33L two substrate holders 36, left substrate transport portion 33L mobile station 35 is set to be located at " operation Position " simultaneously performs ACF sticking operations of the ACF sticking operations portion 22a to two substrates 2, on the other hand, makes central substrate transport portion 33C mobile station 52 is located at " job position ", the substrate 2 of the left in two substrates 2 is located at the auxiliary of element mounting operation The top of platform 64 is helped, so that executive component carries element mounting operations of the homework department 22b to the substrate 2 of left（Figure 25（b）.Member Part carries process）.

Control device 24 is performing ACF sticking operations based on above-mentioned ACF sticking operations portion 22a and based on element mounting After homework department 22a element mounting operation, central substrate transport portion 33C is moved to the left, make in central substrate transport portion 33C Two substrate holders 53 on the substrate 2 of right in two substrates 2 loading be located at the secondary station of element mounting operation 64 top, so that executive component carries element mounting operations of the homework department 22b to the substrate 2 of right（Figure 25（c）.Element is taken Carry process）.In addition, during this period, two new substrates 2 are loaded on two substrate receiving platform 21s of substrate acceptance division 21.

Control device 24 makes central base after the element mounting operation that homework department 22b is carried based on said elements is performed Plate transport portion 33C is kept unchangeably to the left（First element crimping operation portion 22c side）It is mobile, it will be kept in two substrates Two substrates 2 loaded on platform 53 are transported to the first element crimping operation portion 22c, make what is loaded on two substrate holders 53 Two substrates 2 are located at the top of the secondary station 72 of two element crimping operations, so as to perform the first element crimping operation portion 22c To the element crimping operation of two substrates 2（Figure 26（a）.Element crimping process）.Moreover, at the same time, making left substrate transfer Portion 82a is located at first position P1, and two bases in substrate acceptance division 21 are picked up using left substrate transfer portion 82a two arms 94 Two substrates 2 loaded on plate receiving platform 21s, on the other hand, make left substrate transport portion 33L mobile station 35 be located at " substrate Delivery position " simultaneously ordinatedly makes central substrate transfer portion 82b be located at second place P2 with this, utilizes central substrate transfer portion 82b Two arms 94 pickup left substrate transport portion 33L two substrate holders 36 on two substrates 2.Moreover, making right base Plate transport portion 33R mobile station 52 is moved to " substrate transfer position " and right substrate transport portion 33R is made positioned at element mounting Industry portion 22b front, utilizes the right substrate transfer portion 82c in the front for having been positioned at element mounting homework department 22b two arms Two substrates 2 on 94 pickup right substrate transport portion 33R（Figure 26（a））.

Control device 24 makes right substrate transfer portion 82c be located at the 6th position P6 and by two after the completion of above-mentioned operation Substrate 2 is positioned in two substrate delivery/reception platform 23s in substrate delivery/reception portion 23, also, central substrate transfer portion 82b is located at the 4th P4 is put, two substrates 2 picked up from left substrate transport portion 33L substrate holder 36 are loaded and right substrate fortune is maintained at Portion 33R two substrate holders 53 are sent, left substrate transfer portion 82a is located at second place P2, so as to will be received from substrate Two substrates 2 of two substrate receiving platform 21s pickups in portion 21 load and are maintained at left substrate transport portion 33L two substrates Holding station 36（Figure 26（b））.

The Figure 26（b）State and Figure 23（c）State it is identical, therefore after, pass through repeat Figure 23（c）~Figure 26 （a）Process, can repeat to receive from substrate acceptance division 21 and pass through assembling of the element 4 to substrate 2 from outside substrate 2 Until substrate delivery/reception portion 23 is to a series of action untill outside handing-over substrate 2, so as to carry out continuous substrate production.

On the other hand, operator OP is in the case where selecting second mode, first, and a substrate holder 36T is installed Central substrate transport portion is also mounted to onto left substrate transport portion 33L mobile station 35, and by a substrate holder 53T On 33C and the respective mobile stations 52 of right substrate transport portion 33R.Then, the operation of mode selection switch 90, selection second are carried out Pattern.

After second mode is selected by mode selection switch 90, control device 24 makes left substrate transfer portion 82a be located at the One position P1, make central substrate transfer portion 82b be located at second place P2, make right substrate transfer portion 82c be located at the 4th position P4, And the anterior position for making central substrate transport portion 33C be located at element mounting homework department 22b, make right substrate transport portion 33R In the second element crimping operation portion 22d anterior position.Then, by between two substrate receiving platform 21s of substrate acceptance division 21 It is defeated in the device received by two substrate receiving platform 21s of substrate acceptance division 21 from upstream process side every being set as the second interval After the two large-sized substrates 2 sent（Substrate receives process）, institute is picked up by the arm 94 on left substrate transfer portion 82a right side State the substrate 2 of the right in two substrates 2 of reception（Figure 27（a））.

Control device 24 the right side by left substrate transfer portion 82a arm 94 from the substrate on the right side of substrate acceptance division 21 After receiving platform 21s pickup substrates 2, left substrate transfer portion 82a is set to be located at second place P2, make central substrate transfer portion 82b In the 4th position P4, right substrate transfer portion 82c is set to be located at the 6th position P6, so that left substrate transfer portion 82a is picked up Substrate 2 loads and is maintained at left substrate transport portion 33L substrate holder 36T（Figure 27（b）.Substrate transfering process）.Herein Period, the substrate receiving platform 21s in the left side of the state for being placed with substrate 2 of substrate acceptance division 21 is set to move to the right, by two Substrate receiving platform 21s interval is set as the first interval（Figure 27（b））.Then, left substrate transport portion 33L mobile station 35 is made It is moved to " job position ", performs ACF sticking operations of the ACF sticking operations portion 22a to substrate 2（Figure 27（c））.

Control device 24 makes ACF lefts base after ACF sticking operations of the ACF sticking operations portion 22a to substrate 2 is performed Plate transport portion 33L mobile station 35 is moved to " substrate transfer position ", left substrate transfer portion 82a is located at first position P1, make central substrate transfer portion 82b be located at second place P2, make right substrate transfer portion 82c be located at the 4th position P4.Then, Utilize the base on the substrate receiving platform 21s in the left side of the pickup substrate of arm 94 acceptance division 21 in left substrate transfer portion 82a left side Plate 2, the substrate 2 on the substrate transport portion 33L of left is picked up using the arm 94 on central substrate transfer portion 82b right side（Figure 28（a））.

Substrate receiving platform of the control device 24 in the left side that substrate acceptance division 21 is picked up using left substrate transfer portion 82a Substrate 2 on 21s, the base on left substrate transport portion 33L substrate holder 36T is picked up using central substrate transfer portion 82b After plate 2, left substrate transfer portion 82a is set to be located at second place P2, central substrate transfer portion 82b is located at the 4th position P4, made Right substrate transfer portion 82c is located at the 6th position P6, thus, will be loaded and is protected by the left substrate transfer portion 82a substrates 2 picked up The substrate holder 36T in left substrate transport portion 33L is held, will be loaded and protected by the central substrate transfer portion 82b substrates 2 picked up Hold the substrate holder 53T in central substrate transport portion 33C（Figure 28（b））.Also, during this period, make substrate acceptance division 21 The substrate receiving platform 21s in left side is moved to the left, and two substrate receiving platform 21s interval is set as into the second interval.

Next control device 24 makes left substrate transport portion 33L mobile station 35 be located at " job position " and perform ACF On the other hand sticking operation portion 22a, moves central substrate transport portion 33C mobile station 52 the ACF sticking operations of substrate 2 To " job position ", substrate 2 is set to be located at the top of the secondary station 64 of element mounting operation, so that executive component carries homework department Element mounting operations of the 22b to substrate 2（Figure 28（c）.Element mounting process）.In addition, during this period, being carried in substrate acceptance division 21 Put the large-sized substrate 2 of new two.

Control device 24 makes center after element mounting operations of the said elements carrying homework department 22b to substrate 2 is performed Substrate transport portion 33C is kept unchangeably to the left（First element crimping operation portion 22c side）It is mobile, will be in substrate holder The substrate 2 kept on 53T is transported to the first element crimping operation portion 22c, makes the substrate 2 kept on substrate holder 53T In a side of the secondary station 72 of two element crimping operations（It is left herein）Secondary station 72 top, so as to perform first Element crimping operations of the element crimping operation portion 22c to substrate 2（Figure 29（a）.Element crimping process）.Moreover, at the same time, making Left substrate transfer portion 82a is located at first position P1, is picked up and is connect in substrate using the arm 94 on left substrate transfer portion 82a right side The substrate 2 loaded on the substrate receiving platform 21s on the right side in receipts portion 21, on the other hand, makes left substrate transport portion 33L mobile station 35 are located at " substrate transfer position " and central substrate transfer portion 82b is located at second place P2 with this, utilize central base Substrate 2 on the pickup of the arm 94 left substrate transport portion 33L in plate transfer portion 82b left side.Moreover, making right side substrate transfer portion 82c is located at the 4th position P4（Figure 29（a））.

Control device 24 makes right substrate transfer portion 82c be located at the 6th position P6, and make the right side after the completion of above-mentioned operation Side base plate transport portion 33R is located at element mounting homework department 22b anterior position, central substrate transfer portion 82b is located at the Four position P4, so as to will be loaded from the left substrate transport portion 33L substrates 2 picked up and be maintained at right substrate transport portion 33R's Substrate holder 53T, and left substrate transfer portion 82a is located at second place P2, so as to will be picked up from substrate acceptance division 21 Substrate 2 load and be maintained at left substrate transport portion 33L substrate holder 36T（Figure 29（b））.

Substrate 2 is being respectively retained right substrate transport portion 33R substrate holder 53T and left base by control device 24 After plate transport portion 33L substrate holder 36T, left substrate transport portion 33L mobile station 35 is set to be located at " job position " and hold On the other hand row ACF sticking operations portion 22a, makes right substrate transport portion 33R mobile station 52 to the ACF sticking operations of substrate 2 " job position " is moved to, the substrate 2 loaded on substrate holder 53T is located at the secondary station 64 of element mounting operation Top, so that executive component carries element mounting operations of the homework department 22b to substrate 2（Figure 29（c）.Element mounting process）.

Control device 24 is performing ACF sticking operations based on above-mentioned ACF sticking operations portion 22a and based on element mounting After homework department 22a element mounting operation, right substrate transport portion 33R is set to keep unchangeably to the right（The crimping of second element is made Industry portion 22d side）It is mobile, the substrate 2 kept on substrate holder 53T is transported to the second element crimping operation portion 22d, The substrate 2 loaded on substrate holder 53T is set to be located at a side（It is left herein）Element crimping operation secondary station 72 Top, so as to perform element crimping operations of the second element crimping operation portion 22d to substrate 2（Figure 30（a）.Element crimps work Sequence）.Moreover, at the same time, making left substrate transfer portion 82a be located at first position P1, utilizing a left substrate transfer portion 82a left side The arm 94 of side picks up the substrate 2 loaded on the substrate receiving platform 21s in the left side of substrate acceptance division 21, on the other hand, makes left Substrate transport portion 33L mobile station 35 is located at " substrate transfer position " and with this is located at ordinatedly central substrate transfer portion 82b Second place P2, left substrate transport portion 33L substrate holder is picked up using the arm 94 on central substrate transfer portion 82b right side Substrate 2 on 36T.Moreover, making central substrate transport portion 33C mobile station 52 be moved to " substrate transfer position " and make central base Plate transport portion 33C is located at element mounting homework department 22b anterior position, using positioned at element mounting homework department 22b front Substrate 2 on the pickup central substrate transport portion of arm 94 33C on right substrate transfer portion 82c right side substrate holder 53T（Figure 30（a））.

Control device 24 makes right substrate transfer portion 82c be located at the 6th position P6 and will be by the right side after the completion of above-mentioned operation The substrate 2 that the arm 94 of side is picked up is positioned in the substrate delivery/reception platform 23s on the right side in the substrate delivery/reception portion 23 for being set to the second interval, separately On the one hand, central substrate transfer portion 82b is made to be located at the 4th position P4, by from left substrate transport portion 33L substrate holder 36T The substrate 2 of upper pickup loads and is maintained at central substrate transport portion 33C substrate holder 53T, and makes left substrate transfer portion 82a is located at second place P2, so that the substrate 2 of the substrate receiving platform 21s pickups from the left side of substrate acceptance division 21 be loaded simultaneously It is maintained at left substrate transport portion 33L substrate holder 36T（Figure 30（b））.

Substrate 2 is being placed in central substrate transport portion 33C substrate holder 53T and left base by control device 24 respectively After plate transport portion 33L substrate holder 36T, left substrate transport portion 33L mobile station 35 is set to be located at " job position " and hold On the other hand row ACF sticking operations portion 22a, makes central substrate transport portion 33C mobile station 52 to the ACF sticking operations of substrate 2 " job position " is moved to, the substrate 2 on substrate holder 53T is located at the top of the secondary station 64 of element mounting operation, So as to which executive component carries element mounting operations of the homework department 22b to substrate 2（Figure 30（c）.Element mounting process）.Also, During this, the substrate delivery/reception platform 23s on the right side in substrate delivery/reception portion 23 is set to move to the right, by between two substrate delivery/reception platform 23s Every being set as the second interval（Figure 30（c））.

Control device 24 is performing ACF sticking operations based on above-mentioned ACF sticking operations portion 22a and based on element mounting After homework department 22b element mounting operation, central substrate transport portion 33C is set to keep unchangeably to the left（The crimping of first element is made Industry portion 22c side）It is mobile, the substrate 2 kept on substrate holder 53T is transported to the first element crimping operation portion 22c, The substrate 2 loaded on substrate holder 53T is set to be located at a side（It is right side herein）Element crimping operation secondary station 72 Top, so as to perform element crimping operations of the first element crimping operation portion 22c to substrate 2（Figure 31（a）.Element crimps work Sequence）.Moreover, at the same time, making left substrate transfer portion 82a be located at first position P1, utilizing the left substrate transfer portion 82a right side The arm 94 of side picks up the substrate 2 loaded on the substrate receiving platform 21s on the right side of substrate acceptance division 21, on the other hand, makes left Substrate transport portion 33L mobile station 35 is located at " substrate transfer position " and with this is located at ordinatedly central substrate transfer portion 82b Second place P2, left substrate transport portion 33L substrate holder is picked up using the arm 94 in central substrate transfer portion 82b left side Substrate 2 on 36T（Figure 31（a））.

Control device 24 makes right substrate transfer portion 82c be located at the 6th position P6 and will be by a left side after the completion of above-mentioned operation The substrate 2 that the arm 94 of side is picked up is positioned in the substrate delivery/reception platform 23s in the left side in substrate delivery/reception portion 23, also, turns central substrate Shifting portion 82b is located at the 4th position P4, and the substrate 2 of the substrate holder 36T pickups from left substrate transport portion 33L is positioned in into the right side Square substrate transport portion 33R substrate holder 53T, makes left substrate transfer portion 82a be located at second place P2, so that will be from substrate The substrate 2 of the substrate receiving platform 21s pickups on the right side of acceptance division 21 is positioned in left substrate transport portion 33L substrate holder 36T（Figure 31（b））.

The Figure 31（b）State and Figure 29（b）State it is identical, therefore after, pass through repeat Figure 29（b）~Figure 31 （a）Process, can repeat to substrate acceptance division 21 move into substrate 2 by assembling from element 4 to substrate 2 until to base Plate junction 23 take out of untill a series of action, so as to carry out continuous substrate production.

As described above, the element fixing apparatus 1 of present embodiment is except entering the element that units are installed to substrate 2 Outside installation portion 22, it is also equipped with：Substrate acceptance division 21, its two substrate receiving platform 21s interval is set as the first interval and The substrate 2 that two small sizes come are conveyed from upstream process side is received, or two substrate receiving platform 21s interval is set as Second interval bigger than the first interval and receive from upstream process side and convey big bigger than the substrate 2 of small size of two sizes come The substrate 2 of size；And left substrate transfer portion 82a, its small size for receiving substrate acceptance division 21 or large-sized base Plate 2 is transferred to element mounting portion 22, and left substrate transfer portion 82a receives the substrate 2 of two small sizes in substrate acceptance division 21 In the case of, the substrates 2 of two small sizes that the substrate acceptance division 21 is received while be transferred to element mounting portion 22, and In the case that substrate acceptance division 21 receives two large-sized substrates 2, the two big chi that the substrate acceptance division 21 is received Very little substrate 2 is transferred to element mounting portion 22 respectively one by one.

Also, element mounting portion 22 possesses：As the left substrate transport portion 33L of board holder, it is kept by left Substrate transfer portion 82a shift simultaneously two substrates 2 of small size come or by left substrate transfer portion 82a one by one The large-sized substrate 2 shifted respectively；ACF sticking operations portion 22a（Adhering part sticking operation portion）, it will be used as bonding The ACF bands 3 of part are pasted on the substrate 2 kept on the substrate transport portion 33L of left；Element mounting homework department 22b, it is by element 4 are carried to the substrate 2 that ACF bands 3 have been pasted by ACF sticking operations portion 22a；And element crimping operation portion（First element is crimped Homework department 22c and the second element crimping operation portion 22d）, it will be crimped onto using the element mounting homework department 22b elements 4 carried The substrate 2 of element 4 is equipped with element mounting homework department 22b, left substrate transport portion 33L can be installed optionally to be protected simultaneously Hold the first substrate holding station of the substrate 2 of two small sizes（Two substrate holders 36）Or keep a large-sized substrate 2 second substrate holding station（One substrate holder 36T）.

Also, and then, left substrate transfer portion 82a has two arms 94（Pick-up member）, described two arms 94 are configured Into can pick up simultaneously two substrate receiving platform 21s are adjusted to receive in the state of the first interval in substrate acceptance division 21 two The interval of the substrate 2 of small size is opened, two substrate receiving platform 21s are adjusted in the state of the first interval in substrate acceptance division 21 In the case of the substrate 2 for receiving two small sizes, left substrate transfer portion 82a picks up two small chis simultaneously using two arms 94 Very little substrate 2 is simultaneously transferred to left substrate transport portion 33L, on the other hand, in substrate acceptance division 21 by two substrate receiving platform 21s It is adjusted in the case of receiving two large-sized substrates 2 in the state of the second interval, left substrate transfer portion 82a utilizes two An arm 94 in individual arm 94 picks up a large-sized substrate 2 and is transferred to left substrate transport portion 33L, is then connect in substrate Two substrate receiving platform 21s are adjusted to behind the first interval by receipts portion 21, and remainder is picked up using another arm 94 in two arms 94 A large-sized substrate 2 and be transferred to left substrate transport portion 33L.

Moreover, the component mounting method of present embodiment includes：Substrate receives process, by two substrate receiving platform 21s' Interval is set as the first interval and receives substrate 2 that two small sizes come are conveyed from upstream process side, or by two substrates Receiving platform 21s interval is set as second interval bigger than the first interval and receives from upstream process side and convey the size come than small Two big large-sized substrates 2 of the substrate of size；And substrate transfering process, what is received in receiving process in substrate is small Size or large-sized substrate 2 are transferred to element mounting portion 22, and substrate transfering process is to be received in substrate receives process In the case of the substrate 2 of two small sizes, the substrate 2 that the substrate is received into two small sizes received in process is shifted simultaneously To element mounting portion 22, in the case where receiving two large-sized substrates 2 during substrate receives process, the substrate is received into work The two large-sized substrates 2 received in sequence are transferred to element mounting portion respectively one by one.

In the element fixing apparatus 1 and component mounting method of present embodiment, by two substrate receiving platform 21s interval It is set as the first interval and receives the substrate 2 that two small sizes come are conveyed from upstream process side, or two substrates is received Platform 21s interval is set as second interval bigger than the first interval and receives from upstream process side and convey two sizes come than small The big large-sized substrate 2 of the substrate 2 of size.Also, in the case where receiving two large-sized substrates 2, this is received To two large-sized substrates 2 be transferred to element mounting portion 22 respectively one by one, so as to the substrate 2 to small size Enter units with any one in large-sized substrate 2 to install, therefore, it is possible to the production line for the substrate 2 for making two kinds of sizes of size It is unitized.

Industrial utilizability

A kind of element fixing apparatus and component mounting method are provided, substrate and the equal energy of large-sized substrate for small size Enough enter units installation, the production line of the substrate of two kinds of sizes of size can be made to unitize.

Claims (5)

1. a kind of element fixing apparatus, to possess the element fixing apparatus for the element mounting portion for entering units installation to substrate, its It is characterised by,

The element fixing apparatus possesses：

Substrate acceptance division, is set as the first interval by the interval of two substrate receiving platforms and receives from upstream process side and convey what is come The substrate of two first sizes, or the interval of described two substrate receiving platforms is set as second bigger than the described first interval It is spaced and receives two sizes for conveying to come from the upstream process side, second size bigger than the substrate of the first size Substrate；And

The substrate of substrate transfer portion, the first size that the substrate acceptance division is received or second size is transferred to The substrate installation portion,

In the case where the substrate acceptance division receives the substrate of two second sizes, the substrate transfer portion connects this The substrate of two second sizes received is transferred to element mounting portion respectively one by one,

In the case where the substrate acceptance division receives the substrate of two first sizes, the substrate transfer portion connects this The substrate of two first sizes received is while be transferred to the element mounting portion.

2. element fixing apparatus according to claim 1, it is characterised in that

The element mounting portion possesses：

Board holder, to shifting two substrates of the first size come simultaneously by the substrate transfer portion or by institute The substrate for stating second size that substrate transfer portion is shifted respectively one by one is kept；

Adhering part sticking operation portion, adhering part is pasted the substrate kept by board holder；

Element mounting homework department, by element mounting to the substrate that adhering part has been pasted by the adhering part sticking operation portion； And

Element crimping operation portion, the element carried using the element mounting homework department is crimped in the element mounting operation Portion is equipped with the substrate of element,

The board holder can be installed optionally while keeping the first substrate of the substrate of two first sizes to protect Hold platform or keep the second substrate holding station of the substrate of second size.

3. element fixing apparatus according to claim 1 or 2, it is characterised in that

The substrate transfer portion has two pick-up members, and described two pick-up members are configured to while picking up the base Plate acceptance division is receive two described first in the state of described two substrate receiving platforms to be adjusted to first interval Described two substrate receiving platforms, the shape at first interval is being adjusted in the substrate acceptance division by the interval of the substrate of size In the case of the substrate that two first sizes are received under state, the substrate transfer portion is same using described two pick-up members When pickup two first sizes substrate and be transferred to the board holder.

4. element fixing apparatus according to claim 3, it is characterised in that

In the substrate acceptance division two are received in the state of described two substrate receiving platforms to be adjusted to second interval In the case of the substrate of the sizes of Zhang Suoshu second, the substrate transfer portion utilizes a pickup structure in described two pick-up members Part picks up the substrate of second size and is transferred to the board holder, then will be described in the substrate acceptance division Two substrate receiving platforms are adjusted to behind first interval, and the substrate transfer portion utilizes another in described two pick-up members Individual pick-up member picks up the substrate of remaining second size and is transferred to the board holder.

5. a kind of component mounting method, for by possessing the element fixing apparatus for entering the element mounting portion that units are installed to substrate The component mounting method of realization, it is characterised in that

The component mounting method includes：

Substrate receives process, and the interval of two substrate receiving platforms is set as into the first interval and receives and conveys to come from upstream process side Two first sizes substrate, or the interval of described two substrate receiving platforms is set as bigger than the described first interval by the Two are spaced and receive two sizes for conveying to come from the upstream process side, second size bigger than the substrate of the first size Substrate；And

Substrate transfering process, will receive the first size received in process or the base of second size in the substrate Plate is transferred to the substrate installation portion,

In the case where receiving the substrate of two second sizes during the substrate receives process, work is shifted in the substrate The substrate of two second sizes received is transferred to element mounting portion respectively one by one in sequence,

In the case where receiving the substrate of two first sizes during the substrate receives process, work is shifted in the substrate By the substrate of two first sizes received while being transferred to the element mounting portion in sequence.