CN117012873A - Display panel and manufacturing method thereof - Google Patents
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- CN117012873A CN117012873A CN202210476311.XA CN202210476311A CN117012873A CN 117012873 A CN117012873 A CN 117012873A CN 202210476311 A CN202210476311 A CN 202210476311A CN 117012873 A CN117012873 A CN 117012873A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 104
- 239000000463 material Substances 0.000 claims abstract description 40
- 238000004806 packaging method and process Methods 0.000 claims abstract description 29
- 230000002209 hydrophobic effect Effects 0.000 claims description 62
- 238000005538 encapsulation Methods 0.000 claims description 61
- 239000011159 matrix material Substances 0.000 claims description 15
- 239000002086 nanomaterial Substances 0.000 claims description 8
- 238000005507 spraying Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 4
- 238000007649 pad printing Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 10
- 238000000151 deposition Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 16
- 239000010408 film Substances 0.000 description 16
- 240000002853 Nelumbo nucifera Species 0.000 description 3
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 3
- 235000006510 Nelumbo pentapetala Nutrition 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000005871 repellent Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000005543 nano-size silicon particle Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0025—Processes relating to coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Composite Materials (AREA)
- Theoretical Computer Science (AREA)
- Electroluminescent Light Sources (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application provides a display panel and a manufacturing method thereof, wherein the display panel comprises a substrate; a light emitting unit disposed on the substrate; the first packaging layer is at least partially positioned at the side part of the light-emitting unit, and the surface tension structure is a light-transmitting structure and is arranged on the surface of the light-emitting unit far away from the substrate. According to the application, the surface tension structure is arranged on the surface of the light-emitting unit far away from the substrate, namely the surface tension structure is arranged on the light-emitting surface of the light-emitting unit, and the surface tension structure is used for preventing the material forming the first packaging layer from depositing on the surface of the surface tension structure far away from the light-emitting unit, so that the light-emitting effect of the light-emitting unit is improved.
Description
Technical Field
The present application relates to the field of display technologies, and in particular, to a display panel and a manufacturing method thereof.
Background
A light emitting diode (Light Emitting Diode, LED) is a solid state semiconductor device capable of converting electrical energy into visible light, which can directly convert electrical energy into light energy. Light emitting diodes are widely used as a new illumination source material.
In order to improve the light emitting effect of the light emitting diode, improve the display image quality and pursue better display effect, black organic materials are packaged on the surface of the display screen of the light emitting diode, but in the packaging process, the black materials are easy to cover the light emitting surface of the light emitting diode, so that the light emitting efficiency of the light emitting diode is reduced, the brightness of a product is influenced, and even color deviation and other anomalies of the display image surface are caused.
Disclosure of Invention
The application mainly solves the technical problems of color shift of a display picture and difficult control of a packaging process caused by the influence of black materials on the light-emitting surface of a light-emitting unit and the influence of the light-emitting efficiency of the light-emitting unit.
In order to solve the technical problems, the application provides the following technical scheme:
a first aspect of the present application provides a display panel including:
a substrate;
a light emitting unit disposed on the substrate;
a first encapsulation layer at least partially located at a side of the light emitting unit;
the surface tension structure is a light-transmitting structure and is arranged on the surface, far away from the substrate, of the light-emitting unit.
Further, the first encapsulation layer includes a black material, preferably, the first encapsulation layer covers at least part of a side surface of the light emitting unit, and the first encapsulation layer is a black matrix layer.
Further, the surface tension structure comprises a nanomaterial; preferably, the surface tension structure is a hydrophobic oleophobic structure comprising a nanoceramic material and/or a nanosilica material.
Further, the bottom surface of the surface tension structure, which is close to the light-emitting unit, at least covers the surface of the light-emitting unit, which is far away from the substrate; preferably, the bottom surface of the surface tension structure, which is close to the light emitting unit, coincides with the surface of the light emitting unit, which is far away from the substrate.
Further, the surface of the surface tension structure far away from the light-emitting unit is a plane, and the side surface of the surface tension structure is flush with the side surface of the light-emitting unit.
Further, the surface of the surface tension structure away from the light-emitting unit is a cambered surface protruding towards the direction away from the light-emitting unit.
Further, the first packaging layer covers the boundary position of the light-emitting unit and the surface tension structure, and the highest point of the surface of the first packaging layer, which is far away from the substrate, does not exceed the lowest point of the surface tension structure, which is far away from the light-emitting unit;
preferably, the display panel further includes an insulating layer, and the insulating layer is disposed on a side of the first encapsulation layer, which is close to the substrate.
Further, the display panel includes a plurality of light emitting units, the plurality of light emitting units are disposed on the substrate, a gap is formed between adjacent light emitting units, the first encapsulation layer includes a plurality of first encapsulation portions, and at least a portion of the first encapsulation portions are disposed in the gap.
A second aspect of the present application provides a method of manufacturing a display panel, comprising:
providing a substrate;
providing a light emitting unit, wherein the light emitting unit is arranged on the substrate;
forming a surface tension structure on a surface of the light emitting unit away from the substrate, wherein the bottom surface of the surface tension structure, which is close to the light emitting unit, at least covers the surface of the light emitting unit away from the substrate;
and forming a first packaging layer after the surface tension structure is formed, wherein the first packaging layer is at least partially positioned at the side part of the light-emitting unit, and the surface tension structure is used for preventing the material forming the first packaging layer from being attached to the surface of the surface tension structure far away from the light-emitting unit in the process of forming the first packaging layer.
Further, the forming a surface tension structure on a surface of the light emitting unit away from the substrate includes: forming the surface tension structure by a pad printing mode or a spraying mode; preferably, the surface tension structure comprises a nanomaterial.
The application has the beneficial effects that: according to the application, the surface tension structure is arranged on the surface of the light-emitting unit far away from the substrate, namely the surface tension structure is arranged on the light-emitting surface of the light-emitting unit, and the surface tension structure is used for preventing the material forming the first packaging layer from depositing on the surface of the surface tension structure far away from the light-emitting unit, so that the light-emitting effect of the light-emitting unit is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without any inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a first embodiment of a display panel according to the present application;
fig. 2 is a schematic structural diagram of a second embodiment of a display panel according to the present application;
FIG. 3 is a schematic structural diagram of a display panel according to a third embodiment of the present application;
FIG. 4 is a schematic flow chart of a method for manufacturing a display panel according to the present application;
FIG. 5 is a schematic diagram of the structure corresponding to step S2 in FIG. 4;
FIG. 6 is a schematic structural diagram corresponding to the step S3 in FIG. 4;
fig. 7 is a schematic structural diagram corresponding to step S4 in fig. 4;
fig. 8 is a schematic structural diagram corresponding to step S5 in fig. 4;
fig. 9 is a schematic structural diagram corresponding to step S6 in fig. 4.
Reference numerals illustrate:
the light-emitting device comprises a substrate-41, a light-emitting unit-42, a first packaging layer-43, a first packaging part-431, a base part-432, an annular protrusion-433, a hydrophobic and oleophobic structure-44, an insulating layer-45, an anisotropic conductive adhesive film layer-46, a second packaging layer-47 and a display panel-100.
Detailed Description
The following describes embodiments of the present application in detail with reference to the drawings.
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The embodiment of the application provides a display panel and a manufacturing method thereof.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a display panel according to a first embodiment of the present application.
The first embodiment of the present application provides a display panel 100, where the display panel 100 includes a substrate 41 and a plurality of light emitting units 42 disposed on the substrate 41, and a gap is formed between adjacent light emitting units 42. The display panel 100 further includes an anisotropic conductive film layer 46, an insulating layer 45, a first encapsulation layer 43 and a second encapsulation layer 47 sequentially disposed on the substrate 41. The first encapsulation layer 43 is at least partially located at a side of the light emitting unit 42, and preferably, the first encapsulation layer 43 is a black matrix layer, and the first encapsulation layer 43 covers at least a portion of the side of the light emitting unit 42. The second encapsulation layer 47 is disposed on a side of the first encapsulation layer 43 away from the substrate 41, and the second encapsulation layer 47 is a light-transmitting layer. The insulating layer 45 is disposed on a side of the first packaging layer 43 close to the substrate 41, and the anisotropic conductive film layer 46 is disposed on a side of the insulating layer 45 close to the substrate 41, i.e. the insulating layer 45 is disposed between the first packaging layer 43 and the anisotropic conductive film layer 46. The first encapsulation layer (black matrix layer) 43 is made of a black material by one or more of inkjet printing, spraying, and printing. The black material can be epoxy resin, carbon powder and other materials.
In the embodiment of the present application, the light emitting unit 42 is a light emitting diode, and the substrate 41 is a driving substrate. The light emitting unit 42 is electrically connected to the substrate 41. In other embodiments, the light emitting unit may be other light emitting elements, which is not limited in the present application. Hereinafter, a detailed description will be given of an embodiment in which the substrate 41 is mainly used as a driving substrate and the light emitting unit 42 is used as a light emitting diode.
The display panel 100 further includes a surface tension structure 44, where the surface tension structure 44 is a light-transmitting structure, and in the embodiment of the present application, the surface tension structure 44 is a hydrophobic and oleophobic structure 44, and in other embodiments, the surface tension structure 44 may be another structure having a lotus effect, that is, the surface tension structure 44 can prevent the material forming the first encapsulation layer 43 from depositing on the surface of the surface tension structure 44, which is not limited in the present application. The following description will be made mainly with respect to the surface tension structure 44 as a water-repellent and oil-repellent structure.
The hydrophobic and oleophobic structures 44 are disposed on a surface of the plurality of light emitting units 42 remote from the substrate 41. The bottom surface of the hydrophobic and oleophobic structure 44 close to the light emitting unit 42 coincides with the surface of the light emitting unit 42 away from the substrate 41, i.e. the bottom surface of the hydrophobic and oleophobic structure 44 close to the light emitting unit 42 just covers the surface of the light emitting unit 42 away from the substrate 41. The surface of the hydrophobic and oleophobic structure 44 remote from the light emitting unit 42 is planar, and the side of the hydrophobic and oleophobic structure 44 is flush with the side of the light emitting unit 42. That is, the hydrophobic and oleophobic structures 44 are only disposed on a surface of the plurality of light emitting units 42 away from the substrate 41, and the orthographic projection of the hydrophobic and oleophobic structures 44 on the substrate 41 coincides with the orthographic projection of the plurality of light emitting units 42 on the substrate 41, that is, the hydrophobic and oleophobic structures 44 are only disposed on the entire light emitting surface of the light emitting units 42. The hydrophobic and oleophobic structure 44 has a lotus leaf effect, and the hydrophobic and oleophobic structure 44 is used for preventing the material forming the first encapsulation layer (black matrix layer) 43 from being deposited on the surface of the hydrophobic and oleophobic structure 44 away from the light-emitting unit 42, specifically, the material forming the first encapsulation layer (black matrix layer) 43 is deposited around the light-emitting unit 42 by micro vibration or gravity sliding, forming a stacked structure and solidifying. The hydrophobic and oleophobic structure 44 is a structure formed of a nanomaterial, which may be one or more of a nano ceramic material and a nano silicon dioxide material, and the hydrophobic and oleophobic structure 44 may also be a material including other hydrophobic and oleophobic properties. In this embodiment, the thickness of the hydrophobic and oleophobic structure 44 is 1-3 μm. The hydrophobic oleophobic structure 44 can be formed by one or more of pad printing and spraying, and is not so limited, as the particular design will depend on the actual application.
In this embodiment, the first encapsulation layer 43 covers the boundary between the light emitting unit 42 and the hydrophobic and oleophobic structure 44, and the highest point of the surface of the first encapsulation layer 43 away from the substrate 41 does not exceed the lowest point of the surface of the hydrophobic and oleophobic structure 44 away from the light emitting unit 42. Specifically, the first encapsulation layer 43 is formed by interconnecting a plurality of first encapsulation portions 431, and at least part of the first encapsulation portions 431 are disposed in the gaps between the adjacent light emitting units 42; that is, the first encapsulation portion 431 fills the gap between the light emitting units 42 and the light emitting units 42, and also fills the side surface of the light emitting units 42 in the edge region of the substrate 41. Preferably, the gap between the adjacent light emitting units 42 may be completely filled by the first encapsulation portion 431, the first encapsulation portion 431 covers the interface position of the light emitting unit 42 and the hydrophobic and oleophobic structure 44, and the highest point of the surface of the first encapsulation portion 431 away from the substrate 41 does not exceed the lowest point of the surface of the hydrophobic and oleophobic structure 44 away from the light emitting unit 42. By the design, the side face, close to the light emitting surface, of the light emitting unit 42 can be completely wrapped by the first packaging layer 43, so that the side face of the light emitting unit 42 is prevented from emitting light, the bonding reliability of the light emitting unit 42 is improved, the packaging effect is improved, and the display quality is further improved.
In this embodiment, the surface of the first package portion 431 away from the substrate 41 is a cambered surface recessed toward the substrate 41. Specifically, the first encapsulation layer 43 includes a base 432 and an annular protrusion 433 extending upward from the base 432, and the annular protrusion 433 is disposed around a side surface of the light emitting unit 42 to form a crater structure. In other embodiments, the surface of the first encapsulation portion 431 away from the substrate 41 may be flush with the surface of the hydrophobic and oleophobic structure 44 away from the light emitting unit 42.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a display panel according to a second embodiment of the application.
As in the first embodiment described above, the display panel 100 includes the surface tension structure 44 disposed on the surface of the plurality of light emitting units 42 remote from the substrate 41, the surface tension structure 44 being a hydrophobic and oleophobic structure 44. In this embodiment, the hydrophobic and oleophobic structure 44 is a structure with an arc surface, that is, the surface of the hydrophobic and oleophobic structure 44 away from the light emitting unit 42 is an arc surface protruding toward the direction away from the light emitting unit 42, so that the material forming the first encapsulation layer (black matrix layer) 43 is less likely to adhere to the surface of the hydrophobic and oleophobic structure 44 away from the light emitting unit 42, and meanwhile, the hydrophobic and oleophobic structure 44 with an arc surface also has a light condensation function.
In this embodiment, the surface of the first encapsulation portion 431 away from the substrate 41 is a cambered surface recessed toward the substrate 41, and the boundary position between the light emitting unit 42 and the hydrophobic and oleophobic structure 44 coincides with the edge (the highest point corresponding to the cambered surface) of the cambered surface of the first encapsulation portion 431.
Other structures of this embodiment are the same as those of the first embodiment, and will not be described here again.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a display panel according to a third embodiment of the application.
As in the first embodiment described above, the display panel 100 includes the surface tension structure 44 disposed on the surface of the plurality of light emitting units 42 remote from the substrate 41, the surface tension structure 44 being a hydrophobic and oleophobic structure 44. In the present embodiment, the hydrophobic and oleophobic structure 44 completely covers the surface of the light emitting unit 42 away from the substrate 41, and the hydrophobic and oleophobic structure 44 covers a portion of the side surface of the light emitting unit 42, the portion of the side surface of the light emitting unit 42 covered by the hydrophobic and oleophobic structure 44 is close to the surface of the light emitting unit 42 away from the substrate 41 and is connected to the surface of the light emitting unit 42 away from the substrate 41; that is, the hydrophobic and oleophobic structure 44 is disposed on the entire light-emitting surface of the light-emitting unit 42, and the hydrophobic and oleophobic structure 44 covers a portion of the side surface of the light-emitting unit 42, which is close to and connected to the light-emitting surface. That is, the orthographic projection of the hydrophobic and oleophobic structure 44 on the substrate 41 covers the orthographic projection of the light emitting unit 42 on the substrate 41, and the edge of the orthographic projection of the hydrophobic and oleophobic structure 44 on the substrate 41 exceeds the edge of the orthographic projection of the light emitting unit 42 on the substrate 41. The surface of the hydrophobic and oleophobic structure 44 remote from the light emitting unit 42 is planar.
Other structures of this embodiment are the same as those of the first embodiment, and will not be described here again.
The surface tension structure (hydrophobic and oleophobic structure) 44 is arranged on the surface of the light-emitting unit 42 away from the substrate 41, namely, the surface tension structure 44 is arranged on the light-emitting surface of the light-emitting unit 42, and the surface tension structure 44 is used for preventing the material forming the first packaging layer (black matrix layer) 43 from depositing on the surface of the surface tension structure 44 away from the light-emitting unit 42, so that the light-emitting effect of the light-emitting unit 42 is improved.
Referring to fig. 4, fig. 4 is a flow chart of a manufacturing method of a display panel according to the present application.
The application provides a manufacturing method of a display panel 100, which comprises the following steps of:
s1: providing a substrate; wherein the substrate is a driving substrate.
Specifically, the substrate 41 is a driving substrate, and the substrate 41 may be a hard substrate or a flexible substrate. When the substrate 41 is made of a hard film material, it may be glass or the like; when the substrate 41 is made of a flexible film material, it may be PI glue material or the like. The substrate 41 includes a base substrate (not shown), and a driving circuit (not shown) including a plurality of scan lines, a plurality of data lines, and a plurality of thin film transistors, which is provided on the base substrate. The substrate 41 may further include a driving chip (not shown) bonded to the driving circuit.
S2: an anisotropic conductive film layer is disposed on the substrate.
Referring to fig. 5, fig. 5 is a schematic structural diagram corresponding to step S2 in fig. 4. Specifically, an anisotropic conductive film layer 46 is provided on one side of the substrate 41, the anisotropic conductive film layer 46 including a resin adhesive and conductive particles, the resin adhesive including one or more of epoxy and polyimide. Alternatively, the resin adhesive may be other epoxy materials, which are not limited herein, and are designed according to practical requirements.
S3: providing a plurality of light-emitting units, wherein the light-emitting units are pre-fixed on a substrate through an anisotropic conductive adhesive film layer, and gaps are reserved between the adjacent light-emitting units.
Referring to fig. 6, fig. 6 is a schematic structural diagram corresponding to step S3 in fig. 4. Specifically, the light emitting unit 42 is transferred from a growth substrate (not shown) to the substrate 41 and pre-fixed by the anisotropic conductive film layer 46, so that two pins of the light emitting unit 42 are buried in the anisotropic conductive film layer 46, that is, the surface of the anisotropic conductive film layer 46 on the side away from the substrate 41 is higher than the surface of the two pins of the light emitting unit 42 on the side away from the substrate 41, respectively. In other embodiments, the anisotropic conductive film layer 46 may not be provided, and the light emitting unit 42 may be electrically connected to the substrate 41 by soldering or the like. The anisotropic conductive film 46 electrically connects the light emitting unit 42 and the substrate 41 by using conductive particles. The light emitting unit 42 may be a light emitting diode. Preferably, the size of the light emitting diode is 200 μm or less. The light emitting unit 42 may be a Micro light emitting diode (Micro-LED) or a small light emitting diode (Mini-LED), wherein the size of the Mini-LED is 50 to 200 μm and the size of the Micro-LED is less than 50 μm. The light emitting diode may be further classified into a general monochromatic light emitting diode, a high-brightness light emitting diode, an ultra-high-brightness light emitting diode, a color-changing light emitting diode, a flash light emitting diode, a voltage-controlled light emitting diode, an infrared light emitting diode, a negative resistance light emitting diode, etc., which are not limited herein.
S4: and forming a surface tension structure on the surface of the light-emitting unit far away from the substrate, wherein the surface tension structure is a hydrophobic and oleophobic structure.
Referring to fig. 7, fig. 7 is a schematic structural diagram corresponding to step S4 in fig. 4. Specifically, the nanomaterial is formed on the surface of the plurality of light emitting units 42 remote from the substrate 41 by one or more of pad printing and spray coating to form the hydrophobic and oleophobic structures 44. Wherein, the bottom surface of the hydrophobic and oleophobic structure 44 close to the light emitting unit 42 at least covers the surface of the light emitting unit 42 far from the substrate 41. Preferably, the bottom surface of the hydrophobic and oleophobic structure 44, which is close to the light emitting unit 42, coincides with the surface of the light emitting unit 42, which is far from the substrate 41; that is, the hydrophobic and oleophobic structure 44 exists only on the entire surface of the plurality of light emitting units 42 on the side away from the substrate 41, and the hydrophobic and oleophobic structure 44 is not provided between the side surfaces of the light emitting units 42 and the adjacent light emitting units 42, so as to avoid that the subsequent first encapsulation layer (black matrix layer) 43 is difficult to be disposed on one side of the light emitting units 42 in the horizontal direction, and in particular, to avoid that the first encapsulation layer (black matrix layer) 43 is difficult to be disposed in the gap between the adjacent light emitting units 42. The hydrophobic and oleophobic structure 44 has a lotus leaf effect, and the hydrophobic and oleophobic structure 44 is used for preventing materials for forming the first encapsulation layer (black matrix layer) 43 on the surface of the hydrophobic and oleophobic structure 44 away from the light-emitting unit 42, specifically, the materials for forming the first encapsulation layer (black matrix layer) 43 can be deposited around the light-emitting unit 42 by micro-vibration or gravity sliding, forming a stacked structure and solidifying. Wherein the thickness of the hydrophobic and oleophobic structure 44 is 1-3 μm.
The nanomaterial may be one or more of a nanoceramic material and a nanosilica material, alternatively the nanomaterial may be other materials having hydrophobic and oleophobic properties.
S5: an insulating layer is arranged on one side of the anisotropic conductive film layer, which is far away from the substrate, wherein the insulating layer surrounds the light-emitting unit.
Referring to fig. 8, fig. 8 is a schematic structural diagram corresponding to step S5 in fig. 4. One or more of SiO, siON, siN are formed with an insulating layer 45 on the side of the anisotropic conductive film layer 46 away from the substrate 41 by vapor deposition. Wherein the insulating layer 45 is disposed around the side of the light emitting unit 42, and the surface of the insulating layer 45 on the side away from the substrate 41 is lower than the surface of the light emitting unit 42 on the side away from the substrate 41. Alternatively, the insulating layer 45 may be made of other materials having a certain heat dissipation property and a high temperature resistance.
It is understood that the order of the steps S4 and S5 is not limited, and the insulating layer 45 may be disposed on the side of the anisotropic conductive film layer 46 away from the substrate 41, and then the hydrophobic and oleophobic structure 44 may be formed on the surface of the light emitting unit 42 away from the substrate 41.
S6: forming a first packaging layer after forming a surface tension structure, wherein the first packaging layer is at least partially positioned at the side part of the light-emitting unit, the first packaging layer is a black matrix layer and comprises a plurality of first packaging parts, and at least part of the first packaging parts are arranged in gaps between adjacent light-emitting units; the surface tension structure is used for preventing the material forming the first packaging layer from adhering to the surface of the surface tension structure away from the light emitting unit in the process of forming the first packaging layer.
Referring to fig. 9, fig. 9 is a schematic structural diagram corresponding to step S6 in fig. 4. Specifically, the material for forming the first encapsulation layer 43 is disposed between the plurality of light emitting units 42 provided with the hydrophobic and oleophobic structures 44 by one or more of inkjet printing, spraying, and printing, and the material for forming the first encapsulation layer 43 is cured to form the first encapsulation layer (black matrix layer) 43, preferably, the first encapsulation layer 43 covers at least part of the side surfaces of the light emitting units 42. The highest point of the surface of the first encapsulation layer 43 remote from the substrate 41 does not exceed the lowest point of the surface of the hydrophobic and oleophobic structure 44 remote from the light emitting unit 42.
In forming the first encapsulation layer 43, a small amount of material for forming the first encapsulation layer 43 on the surface of the hydrophobic and oleophobic structure 44 remote from the light emitting unit 42 can be made to slide down and be deposited around the side of the hydrophobic and oleophobic structure 44 to form the annular protrusion 433 of the first encapsulation layer 43 by micro-vibration, and the side of the light emitting unit 42 can be further prevented from emitting light. Alternatively, in forming the first encapsulation layer 43, the substrate 41 may be slightly inclined such that the material for forming the first encapsulation layer 43 on the surface of the hydrophobic and oleophobic structure 44 remote from the light emitting unit 42 slides down and is deposited around the side of the hydrophobic and oleophobic structure 44 to form the annular protrusion 433 of the first encapsulation layer 43. Preferably, the slightly inclined substrate 41 is rotated such that the material for forming the first encapsulation layer 43 on the surface of the hydrophobic and oleophobic structure 44 remote from the light emitting unit 42 slides down and is deposited around the side of the hydrophobic and oleophobic structure 44 to form the annular protrusion 433 of the first encapsulation layer 43.
The surface tension structure (hydrophobic and oleophobic structure) 44 is arranged on the surface of the light-emitting unit 42 away from the substrate 41, namely, the surface tension structure 44 is arranged on the light-emitting surface of the light-emitting unit 42, and the surface tension structure 44 is used for preventing the material forming the first packaging layer (black matrix layer) 43 from depositing on the surface of the surface tension structure 44 away from the light-emitting unit 42, so that the light-emitting effect of the light-emitting unit 42 is improved.
The foregoing is only the embodiments of the present application, and therefore, the patent protection scope of the present application is not limited thereto, and all equivalent structures or equivalent flow changes made by the content of the present specification and the accompanying drawings, or direct or indirect application in other related technical fields, are included in the patent protection scope of the present application.
Claims (10)
1. A display panel, comprising:
a substrate;
a light emitting unit disposed on the substrate;
a first encapsulation layer at least partially located at a side of the light emitting unit;
the surface tension structure is a light-transmitting structure and is arranged on the surface, far away from the substrate, of the light-emitting unit.
2. The display panel according to claim 1, wherein the first encapsulation layer comprises a black material, preferably the first encapsulation layer covers at least part of the sides of the light emitting cells, the first encapsulation layer being a black matrix layer.
3. The display panel of claim 1, wherein the surface tension structure comprises a nanomaterial; preferably, the surface tension structure is a hydrophobic oleophobic structure comprising a nanoceramic material and/or a nanosilica material.
4. The display panel of claim 1, wherein a bottom surface of the surface tension structure adjacent to the light emitting unit covers at least a surface of the light emitting unit remote from the substrate; preferably, the bottom surface of the surface tension structure, which is close to the light emitting unit, coincides with the surface of the light emitting unit, which is far away from the substrate.
5. The display panel of claim 4, wherein a surface of the surface tension structure remote from the light emitting unit is planar, and a side of the surface tension structure is flush with a side of the light emitting unit.
6. The display panel according to claim 4, wherein a surface of the surface tension structure away from the light emitting unit is a curved surface protruding in a direction away from the light emitting unit.
7. The display panel of claim 1, wherein the first encapsulation layer covers an interface of the light emitting unit and the surface tension structure, and a highest point of a surface of the first encapsulation layer away from the substrate does not exceed a lowest point of a surface of the surface tension structure away from the light emitting unit;
preferably, the display panel further includes an insulating layer, and the insulating layer is disposed on a side of the first encapsulation layer, which is close to the substrate.
8. The display panel of claim 1, wherein the display panel comprises a plurality of the light emitting units, the plurality of light emitting units are disposed on the substrate, a gap is provided between adjacent light emitting units, the first encapsulation layer comprises a plurality of first encapsulation portions, and at least a portion of the first encapsulation portions are disposed in the gap.
9. A method of manufacturing a display panel, comprising:
providing a substrate;
providing a light emitting unit, wherein the light emitting unit is arranged on the substrate;
forming a surface tension structure on a surface of the light emitting unit away from the substrate, wherein the bottom surface of the surface tension structure, which is close to the light emitting unit, at least covers the surface of the light emitting unit away from the substrate;
and forming a first packaging layer after the surface tension structure is formed, wherein the first packaging layer is at least partially positioned at the side part of the light-emitting unit, and the surface tension structure is used for preventing the material forming the first packaging layer from being attached to the surface of the surface tension structure far away from the light-emitting unit in the process of forming the first packaging layer.
10. The method of manufacturing a display panel according to claim 9, wherein the forming a surface tension structure on a surface of the light emitting unit remote from the substrate comprises: forming the surface tension structure by a pad printing mode or a spraying mode; preferably, the surface tension structure comprises a nanomaterial.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210476311.XA CN117012873A (en) | 2022-04-29 | 2022-04-29 | Display panel and manufacturing method thereof |
| PCT/CN2023/091780 WO2023208222A1 (en) | 2022-04-29 | 2023-04-28 | Display panel and fabrication method therefor |
| TW112116350A TW202343777A (en) | 2022-04-29 | 2023-04-28 | Display panel and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210476311.XA CN117012873A (en) | 2022-04-29 | 2022-04-29 | Display panel and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117012873A true CN117012873A (en) | 2023-11-07 |
Family
ID=88517939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210476311.XA Pending CN117012873A (en) | 2022-04-29 | 2022-04-29 | Display panel and manufacturing method thereof |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN117012873A (en) |
| TW (1) | TW202343777A (en) |
| WO (1) | WO2023208222A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200047943A (en) * | 2018-10-26 | 2020-05-08 | 삼성디스플레이 주식회사 | Optical filter substrate and display device including the same |
| CN210692541U (en) * | 2019-09-24 | 2020-06-05 | 恒煦电子材料股份有限公司 | Micro light-emitting diode display panel with black matrix anti-scattering layer |
| CN112993093A (en) * | 2020-08-11 | 2021-06-18 | 重庆康佳光电技术研究院有限公司 | Display panel, preparation method of display panel and electronic equipment |
| CN112786742B (en) * | 2021-01-05 | 2022-02-22 | 深圳市华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
| CN114038871A (en) * | 2021-05-28 | 2022-02-11 | 重庆康佳光电技术研究院有限公司 | Packaging method and packaging structure of display panel |
-
2022
- 2022-04-29 CN CN202210476311.XA patent/CN117012873A/en active Pending
-
2023
- 2023-04-28 TW TW112116350A patent/TW202343777A/en unknown
- 2023-04-28 WO PCT/CN2023/091780 patent/WO2023208222A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202343777A (en) | 2023-11-01 |
| WO2023208222A1 (en) | 2023-11-02 |
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