CN117001180A - Chip substrate laser drilling detection equipment - Google Patents

Chip substrate laser drilling detection equipment Download PDF

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Publication number
CN117001180A
CN117001180A CN202310750710.5A CN202310750710A CN117001180A CN 117001180 A CN117001180 A CN 117001180A CN 202310750710 A CN202310750710 A CN 202310750710A CN 117001180 A CN117001180 A CN 117001180A
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CN
China
Prior art keywords
chip substrate
laser drilling
negative pressure
frame
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310750710.5A
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Chinese (zh)
Inventor
冯志成
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Foshan Linkage Technology Co ltd
Original Assignee
Foshan Linkage Technology Co ltd
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Publication date
Application filed by Foshan Linkage Technology Co ltd filed Critical Foshan Linkage Technology Co ltd
Priority to CN202310750710.5A priority Critical patent/CN117001180A/en
Publication of CN117001180A publication Critical patent/CN117001180A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34—Sorting according to other particular properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34—Sorting according to other particular properties
    • B07C5/3412—Sorting according to other particular properties according to a code applied to the object which indicates a property of the object, e.g. quality class, contents or incorrect indication
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36—Sorting apparatus characterised by the means used for distribution
    • B07C5/361—Processing or control devices therefor, e.g. escort memory
    • B07C5/362—Separating or distributor mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention discloses chip substrate laser drilling detection equipment, and relates to the technical field of semiconductor manufacturing. The chip substrate laser drilling detection equipment comprises a frame, a material taking mechanism, a positioning moving platform, a laser drilling and coding assembly, a visual detection assembly and an industrial personal computer; the material taking mechanism is arranged on the frame and used for taking and placing the chip substrate; the positioning moving platform is used for moving the chip substrate to the punching position; the laser drilling and coding component is positioned above the positioning mobile platform and is used for punching a reference hole and coding on the chip substrate; the visual detection component is used for detecting the image information of the reference hole and the code on the processed chip substrate; the industrial personal computer is arranged on the frame and used for determining whether the processed chip substrate is qualified or not according to the image information. The invention provides a chip substrate laser drilling detection device, which provides the same process manufacturing reference and corresponding traceability reference for various subsequent processes such as surface mounting, bonding wires, packaging and the like, and improves the production efficiency.

Description

Chip substrate laser drilling detection equipment
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to chip substrate laser drilling detection equipment.
Background
Among the types of semiconductor device packages, such as QFN (Quad Flat No-leads Package), which is one of the newer surface mount packages, there is a large area bare pad at the bottom center of the Package for conducting heat, and electrode contacts are disposed on the four sides, unlike the conventional SOIC (Small Outline Integrated Circuit Package ) and TSOP (Thin Small Outline Package, thin small outline Package) which have gull-wing leads, the conductive paths between the inner leads and the pads are short, the self inductance and the wiring resistance in the Package are low, so that the Package has excellent heat dissipation performance and excellent electrical performance, and has the advantages of small volume and light weight, and the like, and its application is rapidly growing in recent years. In order to improve the production efficiency and save the cost, part of chip manufacturers increase the original 248X 80mm device bearing substrate to 320X 310mm, so that the number of the substrate bearing devices on the same area is increased, the waste of carriers is reduced, and the manufacturing period is shortened to a certain extent. In the prior art, a 248×80mm specification chip substrate is generally adopted, and during production, a punching machine is used for punching a reference hole, and then a coding machine is used for coding codes. However, punching and coding are completed by two devices in sequence, the two processes are carried out separately, and the manufacturing efficiency of the chip is low.
The existing mature process is basically a standard Lead Frame (Lead Frame) produced by a previous device, the conventional Lead Frame is also synthesized by various materials, the size of the conventional Lead Frame is generally not more than 250×100mm, the reference hole on the Lead Frame is also formed by a previous device through a die stamping or chemical etching method, and then codes are printed on the Frame through another device.
Disclosure of Invention
The invention mainly aims to provide a chip substrate laser drilling detection device, which aims to improve the manufacturing efficiency of chips and provide the same process manufacturing reference and corresponding traceability basis for various subsequent processes such as surface mounting, bonding wires, packaging and the like.
In order to achieve the above object, the present invention provides a laser drilling inspection apparatus for chip substrate, comprising:
a frame;
the material taking mechanism is arranged on the rack and used for taking and placing the chip substrates;
the positioning moving platform is arranged on the rack and used for moving the chip substrate to a punching position;
the laser drilling and coding assembly is arranged on the rack and positioned above the positioning moving platform and is used for drilling a reference hole and coding on the chip substrate;
the visual detection assembly is arranged on the rack and used for detecting the processed image information of the reference hole and the code on the chip substrate; and
the industrial personal computer is arranged on the frame and is respectively connected with the material taking mechanism, the positioning moving platform, the laser drilling and coding assembly and the visual detection assembly in a signal mode, and the industrial personal computer is used for determining whether the processed chip substrate is qualified or not and controlling the material taking mechanism, the positioning moving platform, the laser drilling and coding assembly and the visual detection assembly to work according to the image information.
Optionally, the material taking mechanism is a manipulator, the manipulator comprises a mounting frame, a drag chain, a first driving piece, a sucker fixing block and a vacuum sucker, the mounting frame is fixed on the frame, the drag chain is arranged on the mounting frame and is in driving connection with the first driving piece, and the vacuum sucker is arranged on the drag chain through the sucker fixing block; the vacuum chuck is provided with a first material identification sensor for detecting the material type of the chip substrate.
Optionally, the device for detecting laser drilling of a chip substrate further comprises a placing table arranged on the frame, wherein at least two trays are arranged on the placing table, one tray is used for placing the chip substrate to be processed, and the other tray is used for placing the processed chip substrate; the tray is provided with a position sensor, a second material identification sensor and a distributor, wherein the position sensor is used for detecting whether the chip substrate is placed or not, the second material identification sensor is used for detecting the material type of the chip substrate, and the distributor is used for separating the sticky chip substrate.
Optionally, the location moving platform includes precision movement module, initiative stock stop, passive stock stop, cleans the subassembly, negative pressure receiver and smoke and dust collection subassembly, the precision movement module is located in the frame be used for the drive the chip base plate removes to the position of punching, the initiative stock stop is located precision movement module's one side and is used for the backstop chip base plate's a side, passive stock stop is located precision movement module's one end and is used for the backstop chip base plate's another side, it is used for the cleanness to clean the subassembly to locate precision movement module's top, the negative pressure receiver is located precision movement module's below and be used for collecting the waste material that produces in the punching process, the smoke and dust collection subassembly is located the top of punching position and be used for sucking the smoke and dust that the in-process produced.
Optionally, a negative pressure workbench is arranged on the precise movement module, a plurality of groups of negative pressure holes for adsorbing the chip substrate are formed in the negative pressure workbench, and the plurality of groups of negative pressure holes are communicated with a vacuum generator.
Optionally, the initiative stock stop includes second driving piece, eccentric wheelset, keeps off material pole and cross roller guide group, the second driving piece pass through eccentric wheelset with keep off the material pole and be connected, be equipped with the slider on the cross roller guide group, keep off the material pole through extension spring install in on the slider.
Optionally, an ion fan is arranged on one side of the negative pressure workbench, so as to remove static electricity on the surface of the chip substrate.
Optionally, the negative pressure workbench is made of carbon steel, hard chromium is plated on the surface after hardening and tempering, and mirror polishing is performed on the surface, wherein the surface hardness of the negative pressure workbench is more than 65HRC; and/or the material blocking rod is made of hard alloy material and is polished on the surface.
Optionally, the laser drilling and coding component comprises a mounting seat, and a first laser marking machine and a second laser marking machine which are respectively arranged on the mounting seat in a lifting manner, wherein the first laser marking machine is used for marking part of the reference holes on the chip substrate, and the second laser marking machine is used for marking the other part of the reference holes on the chip substrate and coding.
Optionally, the vision detection assembly includes fixing base and two at least groups of image acquisition parts, the fixing base is fixed in the frame, image acquisition part along first direction and second direction movably set up in on the fixing base, first direction with the second direction is perpendicular, one of them group image acquisition part is used for detecting the shape and the position of the benchmark hole of chip base plate, another group image acquisition part is used for detecting the digital plain code and the two-dimensional code of chip base plate.
In the technical scheme of the invention, the chip substrate laser drilling detection equipment comprises a frame, a material taking mechanism, a positioning moving platform, a laser drilling and coding assembly, a visual detection assembly and an industrial personal computer; the material taking mechanism is arranged on the frame and used for taking and placing the chip substrate; the positioning moving platform is arranged on the frame and used for moving the chip substrate to a punching position; the laser drilling and coding component is arranged on the frame and positioned above the positioning moving platform for drilling a reference hole and coding on the chip substrate; the visual detection component is arranged on the frame and used for detecting the image information of the reference hole and the code on the processed chip substrate; the industrial personal computer is arranged on the frame and is respectively in signal connection with the material taking mechanism, the positioning moving platform, the laser drilling and coding assembly and the visual detection assembly, so as to determine whether the processed chip substrate is qualified or not and control the material taking mechanism, the positioning moving platform, the laser drilling and coding assembly and the visual detection assembly to work according to the image information. Therefore, the laser drilling and coding processes are integrated on the same equipment, so that the manufacturing efficiency of the chip is greatly improved, and the same process manufacturing reference and corresponding traceability reference are provided for various subsequent processes such as surface mounting, bonding wires and packaging. In addition, through setting up the image information of reference hole and sign indicating number on the chip base plate after the vision detection subassembly detects processing, the industrial computer confirms whether the chip base plate after processing is qualified according to image information to select the defective products, improved the yield of chip processing by a wide margin.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of chip substrate processing;
FIG. 2 is a schematic diagram illustrating an internal structure of an embodiment of a laser drilling inspection apparatus for chip substrates according to the present invention;
FIG. 3 is a schematic diagram of a positioning platform in an embodiment of a laser drilling inspection apparatus for chip substrates according to the present invention;
FIG. 4 is a schematic diagram of a loading and unloading table in an embodiment of a laser drilling inspection apparatus for chip substrates according to the present invention;
FIG. 5 is a schematic diagram of a positioning platform in an embodiment of a laser drilling inspection apparatus for chip substrates according to the present invention;
FIG. 6 is a schematic diagram of a laser drilling and coding assembly in an embodiment of a laser drilling and testing apparatus for chip substrates according to the present invention;
fig. 7 is a schematic structural diagram of a visual inspection assembly in an embodiment of the apparatus for inspecting a chip substrate by laser drilling according to the present invention.
Reference numerals illustrate:
10. a frame; 20. a material taking mechanism; 30. positioning a mobile platform; 40. a laser drilling and coding assembly; 50. a visual detection component; 60. an industrial personal computer; 21. a mounting frame; 22. a drag chain; 23. a sucker fixing block; 24. a vacuum chuck; 25. a first material identification sensor; 71. a storage table; 72. a tray; 73. a position sensor; 74. a second material identification sensor; 75. a distributor; 31. a precision moving module; 32. an active material blocking mechanism; 33. a passive material blocking mechanism; 34. a cleaning assembly; 35. a negative pressure receiver; 36. a smoke collection assembly; 37. a negative pressure workbench; 38. an ion fan; 39. a protective mask; 371. a vacuum generator; 41. a mounting base; 42. a first laser marking machine; 43. a second laser marking machine; 51. a fixing seat; 52. an image acquisition section; 100. a chip substrate; 101. a reference hole; 102. a plain code; 103. two-dimensional codes.
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without any inventive effort, are intended to be within the scope of the invention.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
Furthermore, the description of "first," "second," etc. in this disclosure is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" as it appears throughout is meant to include three side-by-side schemes, for example, "A and/or B", including the A scheme, or the B scheme, or the scheme where A and B meet at the same time. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
The invention provides a chip substrate laser drilling detection device.
Referring to fig. 1 and 2, in an embodiment of the present invention, the chip substrate laser drilling inspection apparatus includes a frame 10, a material taking mechanism 20, a positioning moving platform 30, a laser drilling and coding assembly 40, a visual inspection assembly 50, and an industrial personal computer 60; the material taking mechanism 20 is arranged on the frame 10 and is used for taking and placing the chip substrate 100; the positioning moving platform 30 is disposed on the frame 10, and is used for moving the chip substrate 100 to a punching position; the laser drilling and coding assembly 40 is mounted on the frame 10 and located above the positioning moving platform 30 for drilling reference holes 101 and coding on the chip substrate 100; the vision inspection assembly 50 is provided on the frame 10 for inspecting image information of the reference hole 101 and the code on the processed chip substrate 100; the industrial personal computer 60 is arranged on the frame 10 and is respectively in signal connection with the material taking mechanism 20, the positioning moving platform 30, the laser drilling and coding assembly 40 and the visual detection assembly 50, so as to determine whether the processed chip substrate 100 is qualified or not and control the material taking mechanism 20, the positioning moving platform 30, the laser drilling and coding assembly 40 and the visual detection assembly 50 to work according to image information.
In this embodiment, the material taking mechanism 20 may adopt a multi-axis manipulator, etc., which can take up the chip substrate 100 by a suction cup or clamp the chip substrate 100 by a clamping assembly, etc., and is not limited herein.
The positioning and moving platform 30 may adopt a precise moving module, etc., and may fix the chip substrate 100 at the punching position by sucking the chip substrate 100 by negative pressure or clamping the chip substrate 100 by a clamping block, etc., which is not limited herein.
The laser drilling and coding assembly 40 may be a laser marking machine with two different light sources, or may be composed of other drilling devices and coding machines, but is not limited thereto.
The visual detection assembly 50 may employ a structured light camera, an infrared camera, a CCD or CMOS camera, etc., without limitation.
It can be understood that the invention integrates the laser drilling and coding procedures on the same equipment, greatly improves the manufacturing efficiency of the chip, and provides the same process manufacturing reference and corresponding traceability basis for various subsequent processes such as surface mounting, bonding wire, packaging and the like. In addition, the visual detection assembly 50 is arranged to detect the image information of the reference hole 101, the digital code 102 and the two-dimensional code 103 on the processed chip substrate 100, and the industrial personal computer 60 determines whether the processed chip substrate 100 is qualified or not according to the image information, so that defective products are screened out, and the chip processing yield is greatly improved.
In order to further improve the production efficiency and avoid colliding with the chip substrate 100 and further improve the chip processing yield, referring mainly to fig. 3, in an embodiment, the material taking mechanism 20 is a manipulator, and the manipulator may include a mounting frame 21, a drag chain 22, a first driving member, a suction cup fixing block 23 and a vacuum suction cup 24, where the mounting frame 21 is fixed on the frame 10, the drag chain 22 is disposed on the mounting frame 21 and is in driving connection with the first driving member, and the vacuum suction cup 24 is disposed on the drag chain 22 through the suction cup fixing block 23; the vacuum chuck 24 is provided with a first material recognition sensor 25 for detecting the material type of the chip substrate 100, so that the system can adjust the suction force of the vacuum chuck 24 and/or the blowing pressure of a dispenser 75 according to the actual material type.
The vacuum chuck 24 may be made of flexible material such as silica gel, the first driving member may be a servo motor, and the first material recognition sensor 25 may be a background suppression type sensor, which is not limited herein.
Further, in order to improve the convenience of production and manufacture, referring mainly to fig. 4, the apparatus for detecting laser drilling of chip substrates may further include a placement table 71 disposed on the frame 10, where at least two trays 72 are disposed on the placement table 71, one tray 72 is used for placing the chip substrate 100 to be processed, and the other tray 72 is used for placing the processed chip substrate 100; the tray 72 is provided with a position sensor 73, a second material identification sensor 74 and a dispenser 75, wherein the position sensor 73 is used for detecting whether the chip substrate 100 is placed or not, the second material identification sensor 74 is used for detecting the material type of the chip substrate 100, and the dispenser 75 is used for separating the sticky chip substrate 100.
In the production process, the system can stop the machine to give an alarm when detecting that the chip substrate 100 is unqualified, and then the serial number of the chip substrate 100 is manually input on the equipment and confirmed before the next step can be performed. Each tray 72 may be provided with a second material identification sensor 74, and the bottom notch of the tray 72 is used for upward non-contact detection, and since the chip substrate 100 has various material specifications, and is made of copper alloy and fiber composite material, part of the materials are special, and common optical fibers or photoelectric sensors cannot detect the materials, and the background inhibition type sensor is preferred. The distributor 75 can be a high-pressure distributor to prevent the chip substrates 100 of some fiber composite materials from adhering together under the electrostatic action, and a group of electrostatic high-pressure blowing groups are respectively arranged on two sides of the chip substrates 100 to effectively prevent the problem of electrostatic adhesion of the two chip substrates 100.
It should be noted that the main function of the manipulator is to carry the chip substrate 100 from the tray 72 to the positioning and moving platform 30, and apply a certain pressure through the moment mode of the servo motor, and flatten the slightly deformed chip substrate 100 by using the silicone chuck, so that the chip substrate is flatly adsorbed on the positioning and moving platform 30. In addition, the robot can also carry good products to the blanking tray 72 after visual inspection.
Referring to fig. 2 and 5, in an embodiment, the positioning moving platform 30 may include a precision moving module 31, an active material blocking mechanism 32, a passive material blocking mechanism 33, a cleaning component 34, a negative pressure material collector 35 and a smoke dust collecting component 36, where the precision moving module 31 is disposed on the frame 10 and is used for driving the chip substrate 100 to move to a punching position, the active material blocking mechanism 32 is disposed on one side of the precision moving module 31 and is used for blocking one side of the chip substrate 100, the passive material blocking mechanism 33 is disposed on one end of the precision moving module 31 and is used for blocking the other side of the chip substrate 100, the cleaning component 34 is disposed above the precision moving module 31 and is used for cleaning the precision moving module 31, the negative pressure material collector 35 is disposed below the precision moving module 31 and is used for collecting waste materials generated in the punching process, and the smoke dust collecting component 36 is disposed above the punching position and is used for sucking smoke dust generated in the punching process.
In this embodiment, the precise moving module 31 may be provided with a negative pressure working table 37, and the negative pressure working table 37 is provided with a plurality of groups of negative pressure holes for adsorbing the chip substrate 100, and the plurality of groups of negative pressure holes are communicated with the vacuum generator 371.
The precise moving module 31 can be a closed-loop type high-precision moving module formed by a linear motor and a grating system, wherein the grating system can precisely feed back the moving speed and the position of the load in real time. In order to further improve the yield of the chip substrate 100, the positioning and repeating precision of the precise moving module 31 is required to be less than 2 micrometers, the carried negative pressure workbench 37 can be made of high-quality carbon steel, and the surface of the processed negative pressure workbench can be plated with hard chromium after hardening and tempering treatment and then subjected to mirror polishing treatment, so that the surface hardness of the processed negative pressure workbench is more than 65HRC; the surface of the negative pressure workbench 37 is provided with a plurality of uniformly distributed negative pressure holes, negative pressure can be generated by the vacuum generator 371 to suck and level the chip substrate 100, so that the chip substrate 100 with warpage is tightly attached to the surface of the negative pressure workbench 37, the flatness after absorption can be less than 0.1mm, and the processing quality of the chip substrate 100 is further improved.
Further, referring mainly to fig. 5, the active dam mechanism 32 may include a second driving member, an eccentric wheel set, a dam bar, and a cross roller guide set, where the second driving member is connected to the dam bar through the eccentric wheel set, the cross roller guide set is provided with a slider, and the dam bar is mounted on the slider through a tension spring. In this way, the deviation of the chip substrate 100 from the processing position, which may result in the deviation of the reference hole 101 and the two-dimensional code 103, can be avoided.
Specifically, the active material blocking mechanism 32 may be composed of a stepping motor, an eccentric wheel set, a cross roller guide rail set, etc., two sets of material blocking rods pulled by extension springs may be installed on the sliding blocks of the guide rail set, the material blocking rods may be made of cemented carbide material and polished on the surface, and the material blocking rods are driven to move by rotating the eccentric wheel and the chip substrate 100 is horizontally adjusted by using the flexible tension of the extension springs.
In the present embodiment, the passive stop mechanism 33 is similar to the active stop mechanism 32 described above, except that the passive stop mechanism 33 can adjust another direction of the chip substrate 100 by using the movement of the precision moving module 31 as a driving force.
Referring to fig. 5, in the present embodiment, the cleaning component 34 may span over the negative pressure table 37, and one end thereof may be blown out by compressed air, and the other end may be sucked in by negative pressure, so as to keep the negative pressure table 37 clean.
In this embodiment, the negative pressure receiver 35 may be disposed below the negative pressure workbench 37, and may include two independent horns to receive the waste cut by the laser during the punching process of the substrate, where the chute receives the negative pressure to ensure that the waste is sucked into the receiver.
In this embodiment, the fume collection assembly 36 may be a dust extraction hood or the like. When the laser performs punching processing on the chip substrate 100, different substrate materials generate different degrees of smoke dust, a dust extraction cover is arranged right above a substrate processing position, and the smoke dust generated during processing can be extracted through negative pressure.
Referring to fig. 5, in an embodiment, an ion fan 38 may be disposed at one side of the negative pressure stage 37 for removing static electricity on the surface of the chip substrate 100.
Before each chip substrate 100 is perforated, the static electricity on the surface of the chip substrate 100 needs to be removed by using an ion fan 38, so as to prevent the sintering smoke dust generated in the laser perforation process from being attached to the chip substrate 100 under the action of the static electricity and being difficult to remove, thereby affecting the subsequent detection process.
In addition, referring to fig. 5, a special shielding plate 39 may be added to prevent damage to the bare eye by the laser light emitted during laser processing.
In order to improve the efficiency of punching and coding, referring mainly to fig. 1, 2 and 6, in an embodiment, the laser punching and coding assembly 40 may include a mounting base 41, and a first laser marking machine 42 and a second laser marking machine 43 respectively disposed on the mounting base 41 in a liftable manner, where the first laser marking machine 42 is used to punch a part of the reference hole 101 on the chip substrate 100, and the second laser marking machine 43 is used to punch another part of the reference hole 101 on the chip substrate 100 and code.
In this embodiment, the laser drilling and coding assembly 40 is a dual laser assembly, which is mainly composed of a gantry base and two laser printers with different light sources, wherein the two laser printers can be correspondingly provided with independent crossed roller guide rail groups to realize adjustment of the focal length of the laser printers. The gantry type base and the machine table are high in installation verticality, so that small differences are generated on laser processing due to focal length adjustment changes during processing of different materials.
In order to improve the detection efficiency, referring to fig. 1, 2 and 7, in an embodiment, the visual detection assembly 50 may include a fixing base 51 and at least two sets of image capturing components 52, the fixing base 51 is fixed on the frame 10, the image capturing components 52 are movably disposed on the fixing base 51 along a first direction and a second direction, the first direction is perpendicular to the second direction, one set of image capturing components 52 is used for detecting the shape and the position of the reference hole 101 of the chip substrate 100, and the other set of image capturing components 52 is used for detecting the digital cleartext 102 and the two-dimensional code 103 of the chip substrate 100.
The first direction may be a Y-axis direction of the machine, and the second direction may be a Z-axis direction of the machine, which is not limited herein.
In this embodiment, the main function of the image acquisition component 52 is to read the laser printed digital clear code 102 and two-dimensional code 103 and measure the shape and distance of the four groups of reference holes 101; the Y-axis direction of the fixing seat 51 can be provided with a cross roller guide rail to bear four groups of high-pixel cameras and enable the whole camera to be Y-direction adjustable, wherein two groups of cameras are used for detecting the shape and the position of the reference hole 101, and the other two groups of cameras can respectively detect the digital plain code 102 and the two-dimensional code 103; in addition, each group of cameras can be respectively provided with a guide rail capable of being adjusted in the Z direction so as to adjust the focal length of the cameras.
In summary, the working flow of the chip substrate laser drilling detection device of the invention is approximately as follows: the method comprises the steps of tray 72 feeding, sucking disc material taking, blowing and distributing, back code reading, platform material receiving, passive edge leaning, active edge leaning, substrate flattening, negative pressure material sucking, surface cleaning, static cleaning, negative pressure material cleaning, first group of reference holes 101 punching, digital clear codes 102 punching, two-dimensional codes 103 punching, second group of reference holes 101 punching, smoke dust cleaning, surface cleaning, code reading detection, first group of reference holes 101 detection, second group of reference holes 101 detection, hole spacing detection, material sucking and discharging, sucking disc material taking and tray 72 discharging.
The foregoing description is only of the optional embodiments of the present invention, and is not intended to limit the scope of the invention, and all the equivalent structural changes made by the description of the present invention and the accompanying drawings or the direct/indirect application in other related technical fields are included in the scope of the invention.

Claims (10)

1. A chip substrate laser drilling inspection apparatus, comprising:
a frame;
the material taking mechanism is arranged on the rack and used for taking and placing the chip substrates;
the positioning moving platform is arranged on the rack and used for moving the chip substrate to a punching position;
the laser drilling and coding assembly is arranged on the rack and positioned above the positioning moving platform and is used for drilling a reference hole and coding on the chip substrate;
the visual detection assembly is arranged on the rack and used for detecting the processed image information of the reference hole and the code on the chip substrate; and
the industrial personal computer is arranged on the frame and is respectively connected with the material taking mechanism, the positioning moving platform, the laser drilling and coding assembly and the visual detection assembly in a signal mode, and the industrial personal computer is used for determining whether the processed chip substrate is qualified or not and controlling the material taking mechanism, the positioning moving platform, the laser drilling and coding assembly and the visual detection assembly to work according to the image information.
2. The chip substrate laser drilling detection device according to claim 1, wherein the material taking mechanism is a manipulator, the manipulator comprises a mounting frame, a drag chain, a first driving piece, a sucker fixing block and a vacuum sucker, the mounting frame is fixed on the frame, the drag chain is arranged on the mounting frame and is in driving connection with the first driving piece, and the vacuum sucker is arranged on the drag chain through the sucker fixing block; the vacuum chuck is provided with a first material identification sensor for detecting the material type of the chip substrate.
3. The chip substrate laser drilling detection device according to claim 1, further comprising a placement table arranged on the frame, wherein at least two trays are arranged on the placement table, one tray is used for placing the chip substrate to be processed, and the other tray is used for placing the processed chip substrate; the tray is provided with a position sensor, a second material identification sensor and a distributor, wherein the position sensor is used for detecting whether the chip substrate is placed or not, the second material identification sensor is used for detecting the material type of the chip substrate, and the distributor is used for separating the sticky chip substrate.
4. The laser drilling detection device for the chip substrate according to claim 1, wherein the positioning moving platform comprises a precise moving module, an active material blocking mechanism, a passive material blocking mechanism, a cleaning assembly, a negative pressure material collector and a smoke dust collecting assembly, the precise moving module is arranged on the frame and used for driving the chip substrate to move to the drilling position, the active material blocking mechanism is arranged on one side of the precise moving module and used for blocking one side of the chip substrate, the passive material blocking mechanism is arranged on one end of the precise moving module and used for blocking the other side of the chip substrate, the cleaning assembly is arranged above the precise moving module and used for cleaning the precise moving module, the negative pressure material collector is arranged below the precise moving module and used for collecting waste materials generated in the drilling process, and the smoke dust collecting assembly is arranged above the drilling position and used for sucking smoke dust generated in the drilling process.
5. The laser drilling detection device for the chip substrate according to claim 4, wherein the precise movement module is provided with a negative pressure workbench, a plurality of groups of negative pressure holes for adsorbing the chip substrate are formed in the negative pressure workbench, and the plurality of groups of negative pressure holes are communicated with a vacuum generator.
6. The apparatus of claim 5, wherein the active stop mechanism comprises a second driving member, an eccentric wheel set, a stop rod and a cross roller guide rail set, the second driving member is connected with the stop rod through the eccentric wheel set, a sliding block is arranged on the cross roller guide rail set, and the stop rod is installed on the sliding block through a tension spring.
7. The apparatus of claim 5, wherein an ion fan is provided at one side of the negative pressure stage for removing static electricity from the surface of the chip substrate.
8. The apparatus for laser drilling and inspecting a chip substrate according to claim 6, wherein the negative pressure working table is made of carbon steel, hard chrome is plated on the surface of the negative pressure working table after hardening and tempering, and mirror polishing is performed, and the surface hardness of the negative pressure working table is greater than 65HRC; and/or the material blocking rod is made of hard alloy material and is polished on the surface.
9. The apparatus of claim 1, wherein the laser drilling and marking module comprises a mounting base, and a first laser marking machine and a second laser marking machine respectively arranged on the mounting base in a lifting manner, wherein the first laser marking machine is used for marking part of the reference holes on the chip substrate, and the second laser marking machine is used for marking another part of the reference holes on the chip substrate and marking codes.
10. The apparatus of claim 1, wherein the vision inspection assembly comprises a fixing base and at least two sets of image acquisition components, the fixing base is fixed on the frame, the image acquisition components are movably arranged on the fixing base along a first direction and a second direction, the first direction is perpendicular to the second direction, one set of image acquisition components is used for detecting the shape and the position of a reference hole of the chip substrate, and the other set of image acquisition components is used for detecting digital codes and two-dimensional codes of the chip substrate.
CN202310750710.5A 2023-06-21 2023-06-21 Chip substrate laser drilling detection equipment Pending CN117001180A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310750710.5A CN117001180A (en) 2023-06-21 2023-06-21 Chip substrate laser drilling detection equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310750710.5A CN117001180A (en) 2023-06-21 2023-06-21 Chip substrate laser drilling detection equipment

Publications (1)

Publication Number Publication Date
CN117001180A true CN117001180A (en) 2023-11-07

Family

ID=88562722

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310750710.5A Pending CN117001180A (en) 2023-06-21 2023-06-21 Chip substrate laser drilling detection equipment

Country Status (1)

Country Link
CN (1) CN117001180A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118143472A (en) * 2024-05-11 2024-06-07 常州孟腾智能装备有限公司 Laser removing device and method for insulating protective paint of lithium battery cell

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118143472A (en) * 2024-05-11 2024-06-07 常州孟腾智能装备有限公司 Laser removing device and method for insulating protective paint of lithium battery cell

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