CN116974158B - Proximity lithography system, light source control optimization method, apparatus, and storage medium - Google Patents
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Abstract
The application discloses a proximity lithography system, a light source control optimization method, a device and a storage medium, which are applied to the technical field of artificial intelligence, wherein the proximity lithography system comprises: a light source, a control device, an image output section, and an image transfer section; the light source comprises at least one light emitting unit, and the control device is used for controlling each light emitting unit according to the illumination parameters. The technical problem that the image quality of the photoetching image is poor is solved.
Description
Technical Field
The present application relates to the field of artificial intelligence technologies, and in particular, to a proximity lithography system, a light source control optimization method, a light source control optimization device, and a readable storage medium.
Background
With the development of technology, the development of photolithography technology is more and more mature, and at present, if a contact photolithography technology is adopted, that is, the surface of an image transfer component is contacted with the surface of an image output component, so that a pattern on the image transfer component is directly projected on the image output component under illumination, and image transfer is completed. Although the contact lithography technology makes the resolution of the output image higher due to the contact between the surface of the image transfer member and the surface of the image output member, the pressure at the contact causes contamination of the surface of the image transfer member and the surface of the image output member, and even causes abrasion of the image transfer member potentially, which requires frequent cleaning of the image transfer member and the image output member, or replacement of the image transfer member, which results in low efficiency and high cost of the image lithography.
To avoid the above-mentioned drawbacks, proximity lithography, i.e. a distance between the surface of the image transfer member and the surface of the image output member, is used, which may result in a lower resolution of the lithographic image, resulting in a poor image quality of the lithographic image.
Disclosure of Invention
The main purpose of the present application is to provide a proximity lithography system, a light source control optimization method, a device and a readable storage medium, which aim to solve the technical problem of poor image quality of lithography images in the prior art.
In order to achieve the above object, the present application provides a light source control optimization method, a light source, a control device, an image output component and an image transfer component, wherein the image output component and the image transfer component are sequentially arranged along the light emitting direction of the light source, and the control device is respectively connected with the light source and the image output component; the light source comprises at least one light emitting unit, and the control device is used for controlling each light emitting unit according to the image output component.
Optionally, if the size relationship between the light source surface size of the light source and the size of the image output component does not conform to the preset size relationship, an optical transmission component is disposed between the light source and the image output component.
Optionally, the proximity lithography system further comprises an optical transmission component disposed between the light source and the image output component, and the optical transmission component is at least one mirror, and parameters and/or positions of each mirror are determined by a relative size between a light source face size of the light source and an image output component size.
In order to achieve the above object, the present application further provides a light source control optimization method, which is applied to a control device in a proximity lithography system, where the proximity lithography system includes a light source, a control device, an image output component and an image transfer component that are sequentially disposed along a light emitting direction of the light source, the control device is respectively connected with the light source and the image output component, the light source includes at least one light emitting unit,
the light source control optimization method comprises the following steps:
acquiring an image to be subjected to lithography and relative position information between each light emitting unit and the image output part;
generating a first illumination parameter of the light source according to the relative position information and the image to be subjected to photoetching;
and determining a second illumination parameter of the light source according to the output image of the image output part under the control of the first illumination parameter, the first illumination parameter and a preset control model, and controlling the light source according to the second illumination parameter.
Optionally, the step of generating the first illumination parameter of the light source according to the relative position information and the image to be lithographically displayed includes:
acquiring component material information of the image transfer component;
generating an adjusting illumination parameter of the light source according to the material information of the component, the relative position information and the image to be subjected to photoetching;
and acquiring a second transfer image of the image transfer part under the control of the light source by the adjustment illumination parameters, and optimizing the adjustment illumination parameters according to the second transfer image to obtain the first illumination parameters.
Optionally, the step of generating the illumination parameter adjustment of the light source according to the component material information, the relative position information and the image to be lithographically generated includes:
acquiring pattern information of the image to be subjected to photoetching;
and generating the adjustment illumination parameters of the light source according to the pattern information, the component material information and the relative position information through a Fourier lamination principle.
Optionally, the step of optimizing the adjustment lighting parameter according to the second transfer image to obtain the first lighting parameter includes:
Identifying at least one overlapping exposure area on the image transfer component, in which a plurality of light emitting units are subjected to overlapping exposure, based on the second transfer image;
generating target exposure parameters corresponding to each region in the image transfer component according to each overlapped exposure region in the second transfer image;
and optimizing the adjustment illumination parameters according to the target exposure parameters corresponding to the areas to obtain the first illumination parameters.
Optionally, the second illumination parameter comprises at least one sub-illumination parameter,
the step of determining a second illumination parameter of the light source according to the output image of the image output section under the control of the first illumination parameter, and a preset control model, and controlling the light source according to the second illumination parameter includes:
performing feature decomposition on the output image to obtain at least one image feature;
and for any target feature in the image features, determining the sub-illumination parameters corresponding to the target feature according to the first illumination parameters, the target feature and the preset control model.
To achieve the above object, the present application further provides a control device in a proximity lithography system, the control device in the proximity lithography system including:
An acquisition module for acquiring an image to be subjected to lithography and relative position information between each of the light emitting units and the image output section;
the generation module is used for generating a first illumination parameter of the light source according to the relative position information and the image to be subjected to photoetching;
and the determining module is used for determining a second illumination parameter of the light source according to the output image of the image output part under the control of the first illumination parameter, the first illumination parameter and a preset control model, and controlling the light source according to the second illumination parameter.
The application also provides an electronic device comprising: the light source control optimizing method comprises a memory, a processor and a program of the light source control optimizing method, wherein the program of the light source control optimizing method is stored in the memory and can be run on the processor, and the steps of the light source control optimizing method can be realized when the program of the light source control optimizing method is executed by the processor.
The present application also provides a computer-readable storage medium having stored thereon a program for implementing a light source control optimization method, which when executed by a processor implements the steps of the light source control optimization method as described above.
The present application also provides a computer program product comprising a computer program which, when executed by a processor, implements the steps of a light source control optimization method as described above.
The present application provides a proximity lithography system comprising: a light source, a control device, an image output section, and an image transfer section; the light source comprises at least one light emitting unit, the control device is used for controlling the light emission of each light emitting unit, and the light control of the pixel points of the light source can be realized by controlling the light emission of each light emitting unit, so that the resolution of a photoetching image is improved, and the image quality of the photoetching image is further improved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the description of the embodiments or the prior art will be briefly described below, and it will be obvious to those skilled in the art that other drawings can be obtained from these drawings without inventive effort.
FIG. 1 is a schematic flow chart of a first embodiment of a light source control optimization method of the present application;
FIG. 2 is a schematic view of a scenario illustrating feature decomposition involved in a light source control optimization method according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a structure of a proximity lithography system according to an embodiment of the present application, where the proximity lithography system includes no optical transmission component;
FIG. 4 is a schematic diagram of another structure of a proximity lithography system according to an embodiment of the present application when the proximity lithography system includes an optical transmission component;
FIG. 5 is a schematic diagram of a position setting of an optical transmission component when a light source surface size is larger than an image output component size according to a light source control optimization method in an embodiment of the present application;
FIG. 6 is a schematic diagram of a position setting of an optical transmission component when the light source surface size is smaller than the image output component size according to the light source control optimization method in the embodiment of the present application;
fig. 7 is a schematic view of a light emitting unit in a light source under a control scene according to the light source control optimization method in the embodiment of the present application;
fig. 8 is a schematic view of a lighting effect of an image output portion under a control scene of a lighting unit in a light source according to a light source control optimization method in an embodiment of the present application;
FIG. 9 is a schematic view of another scenario of feature decomposition related to a light source control optimization method in an embodiment of the present application;
FIG. 10 is a schematic overall flow chart of a light source control optimization method according to an embodiment of the present application;
fig. 11 is a schematic device structure diagram of a hardware operating environment related to a light source control optimization method in an embodiment of the present application.
The implementation, functional features and advantages of the present application will be further described with reference to the accompanying drawings in conjunction with the embodiments.
Detailed Description
In order to make the above objects, features and advantages of the present application more comprehensible, the following description will make the technical solutions of the embodiments of the present application clear and complete with reference to the accompanying drawings of the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, based on the embodiments herein, which are within the scope of the protection of the present application, will be within the purview of one of ordinary skill in the art without the exercise of inventive faculty.
Example 1
The embodiment of the application provides a light source control optimization method, which is applied to a control device in a proximity lithography system, wherein the proximity lithography system comprises a light source, a control device, an image output component and an image transfer component, wherein the image output component and the image transfer component are sequentially arranged along the light emitting direction of the light source, the control device is respectively connected with the light source and the image output component, the light source comprises at least one light emitting unit, and in a first embodiment of the light source control optimization method, referring to fig. 1, the light source control optimization method comprises the following steps:
Step S10, acquiring an image to be subjected to photoetching and relative position information between each light emitting unit and the image output part;
in this embodiment, it should be noted that the light emitting units may be arranged in an array, where at least one light emitting subunit is included in the light emitting units, where the light emitting subunits include, but are not limited to, LEDs (Light emitting diodes ), OLEDs (Organic light emitting diodes, organic light emitting diodes), QLEDs (Quantum dot light emitting diodes ) and Micro LEDs (Micro Light emitting diodes, micro light emitting diodes), where the exposure wavelength of each light emitting subunit is a wavelength with a relatively high photosensitive response, and the light emitted by each light emitting subunit includes, but is not limited to, violet light with a center wavelength of 400 nm and ultraviolet light with a center wavelength of 10 nm to 380 nm.
In this embodiment, it should be noted that the image to be lithographically printed is an image waiting for lithography. The image output component is configured to output an image to be etched, where the image output component includes a component carrying image information, a bearing component carrying the image information to be etched, and a control component, where the image information may be information of the image to be etched, or may be optimization information obtained by optimizing the image to be etched in a preset optimization manner, where the preset optimization information includes, but is not limited to, OPC (Optical Proximity Correction ), PSM (Phase Shift Mask), and SRAF (Sub-Resolution Assistant Feature, sub-resolution auxiliary pattern), and the component carrying the image information to be etched may be a Mask.
In this embodiment, the image transferring unit includes a unit that carries the transferred image information, a carrier unit that carries the transferred image information, and a control unit, where the unit that carries the transferred image information may be a substrate, the substrate may be a photosensitive material, the photosensitive material may be a photoresist, and the substrate may be a wafer silicon wafer coated with the photoresist.
Illustratively, relative positional information between respective ones of the light emitting units and the image output section is acquired.
In a possible embodiment, the relative position information includes a relative distance and/or a relative angle, and the relative distance and/or the relative angle between the center point of each light emitting subunit and the center point of the image output portion are obtained.
In another possible embodiment, the relative distance and/or the relative angle between each point in each of the light emitting sub-units and each point of the image output section is obtained.
In a further possible embodiment, a relative distance and/or a relative angle between any point in each of the light emitting sub-units and any point in the image output section is obtained.
Step S20, generating a first illumination parameter of the light source according to the relative position information and the image to be subjected to photoetching;
in this embodiment, it should be noted that the first lighting parameter includes a first control parameter corresponding to each of the light emitting units, where the first control parameter includes at least one of a mode of turning on the light emitting units, the number of the light emitting units to be turned on, a position of the light emitting units to be turned on, a light emitting control sequence of the light emitting units to be turned on, illuminance of the light emitting units to be turned on, and a polarization state of the light emitting units to be turned on.
In a possible embodiment, referring to fig. 2, the image to be lithographically processed is subjected to feature decomposition to obtain feature information, and the first illumination parameter of the light source is generated based on the relative position information and the feature information.
Step S30, determining a second illumination parameter of the light source according to the output image of the image output part under the control of the first illumination parameter, the first illumination parameter and a preset control model, and controlling the light source according to the second illumination parameter.
In this embodiment, it should be noted that, under the control of the first illumination parameter, the output image of the image output portion may be a truly output image or an analog image, which is not limited herein. The second lighting parameters comprise second control parameters corresponding to the light emitting units, and the second control parameters comprise at least one of a starting mode of starting the light emitting units, the number of the light emitting units, the positions of the light emitting units, a light emitting control sequence of the light emitting units, illuminance of the light emitting units and polarization state of the light emitting units. The parameter type included in the second control parameter may or may not be identical to the parameter type included in the first control parameter.
In a possible embodiment, the light source is controlled according to the first illumination parameter, and an output image of the image output portion is acquired.
In another possible embodiment, a lithography process of the proximity lithography system is simulated according to the first illumination parameter, resulting in a simulated image of the image output portion as the output image.
In a possible embodiment, measurement data is obtained based on the output image measurement, and the second illumination parameter of the light source is determined according to the measurement data, the first illumination parameter and a preset control model.
Optionally, the proximity lithography system further comprises an optical transmission component, the position of which is determined by the light source and the image output component.
In this embodiment, the optical transmission member is located between the light source and the image output member.
Optionally, if the size relationship between the light source surface size of the light source and the size of the image output component does not conform to the preset size relationship, an optical transmission component is disposed between the light source and the image output component.
In this embodiment, the optical transmission component is configured to modulate light of the light source, where the modulation includes at least one of focusing, beam expanding, and phase retardation.
In this embodiment, it should be noted that, the preset size relationship may be that a light source surface size of the light source is equal to an image output component size, or that a size deviation between the light source surface size and the image output component size is smaller than a preset deviation threshold.
Illustratively, the proximity lithography system does not include the optical transmission component if the size relationship conforms to the preset size relationship. And if the size relation does not accord with the preset size relation, an optical transmission component is arranged between the light source and the image output component.
Optionally, referring to fig. 3 and fig. 4, fig. 3 is a schematic structural diagram of a proximity lithography system according to an embodiment of the present application, where the proximity lithography system includes no optical transmission component, and fig. 3 includes: a light source a, an image output section B, and an image transfer section C. Fig. 4 is another schematic structural diagram of the proximity lithography system related to the optimization method of light source control in the embodiment of the present application when the proximity lithography system includes an optical transmission component, and fig. 4 includes a light source a, an optical transmission component D, an image output portion B, and an image transfer portion C.
Optionally, the proximity lithography system further comprises an optical transmission component disposed between the light source and the image output component, and the optical transmission component is at least one mirror, and parameters and/or positions of each mirror are determined by a relative size between a light source face size of the light source and an image output component size.
In this embodiment, the mirror may be a refractive lens or a reflective lens.
Alternatively, referring to fig. 5 and 6, fig. 5 is a schematic diagram of a position setting of an optical transmission member when a light source surface size is larger than an image output member size, and fig. 5 includes a light source a, an optical transmission member D, and an image output portion B, where the light source a has a light source surface size larger than the image output portion B, and a first distance between the optical transmission member D and the light source a is smaller than a second distance between the optical transmission member D and the image output portion B. Fig. 6 is a schematic diagram of a position setting of an optical transmission member when a light source surface size is smaller than an image output member size, and fig. 6 includes a light source a, an optical transmission member D, and an image output portion B, where the light source surface size of the light source a is smaller than the image output portion B, and a first distance between the optical transmission member D and the light source a is larger than a second distance between the optical transmission member D and the image output portion B.
Illustratively, if the light source face size is detected to be greater than the image output component size, controlling the mirror to approach the image output component; and if the light source surface size is smaller than the image output component size, controlling the mirror to be close to the light source.
In this embodiment, it should be noted that the lens group may further include a phase delay device. The mirror parameters include at least one of focal length, radius of curvature, clear aperture, and numerical aperture.
In a possible embodiment, setting each mirror with a preset mirror parameter and a preset position, and obtaining the light source surface size and the imaging size of the image output component of each mirror under the current mirror parameter and the current position; and if the light source surface size is not equal to the imaging size, adjusting the mirror parameters and/or positions of the mirror group, and returning to the step of acquiring the light source surface size and the image output component size of each mirror under the current mirror parameters and the current positions until the light source surface size is equal to the imaging size.
The embodiment of the application provides a light source control optimization method, which comprises the steps of obtaining an image to be subjected to photoetching and relative position information between each light emitting unit and an image output part; generating a first illumination parameter of the light source according to the relative position information and the image to be subjected to photoetching; according to the output image of the image output part, the first illumination parameters and a preset control model under the control of the first illumination parameters, the second illumination parameters of the light source are determined, and the light source is controlled according to the second illumination parameters, so that preliminary setting of the illumination parameters of the light source and optimization of the preliminary setting are realized, the illumination parameters obtained through optimization are matched with a proximity lithography system and an image to be subjected to lithography, the high resolution of the lithography image is ensured, and the image quality of the lithography image is improved.
Example two
Further, in another embodiment of the present application, the same or similar content as the first embodiment may be referred to the above description, and will not be repeated. On this basis, referring to fig. 4, in step S20, the step of generating a first illumination parameter of the light source according to the relative position information and the image to be lithographically displayed includes:
step S21, obtaining the component material information of the image transfer component;
in this embodiment, the component material information includes at least one of a size, a performance index, a solubility, an exposure threshold, an edge line smoothness, and an exposure dose, where the performance index includes at least one of a resolution, a contrast, a sensitivity, a viscosity, and a corrosion resistance.
Step S22, generating an adjusting illumination parameter of the light source according to the material information of the component, the relative position information and the image to be photoetched;
in this embodiment, it should be noted that the adjusting the illumination parameter includes a third control parameter corresponding to each of the light emitting units, where the third control parameter includes at least one of an on mode of turning on the light emitting units, the number of the light emitting units turned on, a position of the light emitting units turned on, a light emitting control sequence of the light emitting units turned on, illuminance of the light emitting units turned on, and a polarization state of the light emitting units turned on. The parameter type contained in the third control parameter may or may not be identical to the parameter type contained in the second control parameter, and the parameter type contained in the third control parameter is identical to the parameter type contained in the first control parameter; the opening mode of the light emitting units comprises single opening (for example, a preset number of light emitting units are opened at one time) and/or multiple opening, wherein the multiple opening comprises sequential opening (for example, one light emitting unit is opened at one time and the preset number of times of opening is shared) and/or multiple composite opening (for example, the preset number of light emitting units are opened at one time and the preset number of times of opening is shared).
Optionally, by the arrangement, when the emergent light of the light source irradiates the image transfer part through the image output part, different angular spectrum information and spectrum migration can be carried, and the spectrum range of illumination is expanded, so that the resolution of the photoetching image is improved.
In a possible embodiment, the feature decomposition is performed on the image to be subjected to lithography to obtain feature information, and the illumination parameter adjustment of the light source is generated according to the material information of the component, the relative position information and the feature information by using a fourier lamination principle.
Optionally, at least one light emitting unit in the light source is caused to illuminate the pattern features in the image to be lithographically depicted by fourier stack-up principles.
In step S22, the step of generating the illumination parameter of the light source according to the component material information, the relative position information, and the image to be lithographically displayed includes:
step B10, obtaining pattern information of the image to be subjected to photoetching;
in this embodiment, the pattern information includes at least one of a pattern shape, a pattern size, and a position of the pattern with respect to the image.
And step B20, generating the adjustment illumination parameters of the light source through a Fourier lamination principle according to the pattern information, the component material information and the relative position information.
In a possible embodiment, the feature information is generated based on the pattern information.
In a possible embodiment, if the adjusted illumination parameter includes a first parameter and a second parameter, the first parameter includes a number of turned-on light emitting units and/or a position of the turned-on light emitting units, the second parameter includes at least one of a turned-on mode of the turned-on light emitting units, a light emission control sequence of the turned-on light emitting units, illuminance of the turned-on light emitting units, and a polarization state of the turned-on light emitting units, the first parameter is generated by a fourier stack principle based on the feature information; the second parameter is generated based on the component material information and the relative position information.
Alternatively, referring to fig. 7 and 8, fig. 7 includes a light source a and a light emitting unit a on the light source a fig. 8 includes an image output portion B and a light emitting area B of the light source a for the image output portion B. The light emitting unit a shown in fig. 7 is controlled to emit light, so that the light emitting effect of fig. 8 can be achieved, and the zonal light emission of the pattern of the image to be photoetched can be realized, thereby improving the resolution of the photoetched image.
Step S23, optimizing the adjusted illumination parameters according to the target exposure parameters corresponding to the regions, to obtain the first illumination parameters.
In step S23, the step of optimizing the adjustment lighting parameter according to the second transfer image to obtain the first lighting parameter includes:
step A10, identifying at least one overlapping exposure area where a plurality of light emitting units are subjected to overlapping exposure on the image transfer component based on the second transfer image;
it will be appreciated that when controlling the light emission of all the light emitting units in the light source, there may be multiple light emitting areas overlapping to expose the same area, such that light causes additional exposure of the area to aberrations and distortions, thus requiring rational control of the light emitting units of the light source.
Step A20, generating target exposure parameters corresponding to each region in the image transfer component according to each overlapped exposure region in the second transfer image;
in this embodiment, it should be noted that the target exposure parameter is an exposure parameter required for each of the regions, and the exposure parameter includes, but is not limited to, an exposure dose and an exposure duration.
And step A30, optimizing the adjustment illumination parameters according to the target exposure parameters corresponding to the areas to obtain the first illumination parameters.
Wherein, in step S30, the second illumination parameter comprises at least one sub-illumination parameter,
the step of determining a second illumination parameter of the light source according to the output image of the image output section under the control of the first illumination parameter, and a preset control model, and controlling the light source according to the second illumination parameter includes:
step S31, carrying out feature decomposition on the output image to obtain at least one image feature;
in a possible embodiment, referring to fig. 9, the output image is subjected to feature decomposition to obtain at least one image feature.
Step S32, for any target feature of the image features, determining the sub-illumination parameters corresponding to the target feature according to the first illumination parameter, the target feature and the preset control model.
In a possible embodiment, one image feature corresponds to one sub-illumination parameter, and the light sources are controlled respectively according to the sub-illumination parameters corresponding to each image feature.
In another possible embodiment, one image feature corresponds to a plurality of sub-illumination parameters, and then the light sources are controlled respectively according to the respective sub-illumination parameters corresponding to the image features.
In yet another possible embodiment, the plurality of image features correspond to one sub-illumination parameter, and the light sources are controlled according to the sub-illumination parameter corresponding to each image feature.
Optionally, referring to fig. 10, performing feature decomposition on the image to be transferred to obtain feature information, and determining a first illumination parameter based on the feature information and relative position information between the lamp beads and the mask; generating an adjustment illumination parameter based on the characteristic information, the relative position information and the partial material information through a Fourier lamination principle, and optimizing and updating a first illumination parameter through the Fourier lamination principle based on the adjustment illumination parameter and a second transfer image; outputting a first transfer image through the first illumination parameter simulation control, and obtaining image characteristics through optimizing characteristic decomposition of the first transfer image; generating a second illumination parameter by a fourier stack principle based on the image characteristics, the first illumination parameter and a preset control model; and performing actual lighting control based on the second lighting parameters and the sub-lighting parameters to obtain a second transfer image.
The embodiment of the application provides a light source control optimization method, which comprises the steps of obtaining component material information of an image transfer component; generating an adjusting illumination parameter of the light source according to the material information of the component, the relative position information and the image to be subjected to photoetching; and acquiring a second transfer image of the image transfer part under the control of the light source by the adjustment illumination parameter, optimizing the adjustment illumination parameter according to the second transfer image to obtain the first illumination parameter, taking the component material information, the relative position information and the image to be photoetched of the image transfer component as the generation decision basis of the first illumination parameter, and considering the influence of the component material information and the relative position information on the resolution of the image to be photoetched, so that the generated illumination parameter is matched with the proximity photoetching system and the image to be photoetched, thereby improving the resolution of the photoetched image.
Example III
The embodiment of the application also provides a control device in the proximity lithography system, which comprises:
an acquisition module for acquiring an image to be subjected to lithography and relative position information between each of the light emitting units and the image output section;
the generation module is used for generating a first illumination parameter of the light source according to the relative position information and the image to be subjected to photoetching;
and the determining module is used for determining a second illumination parameter of the light source according to the output image of the image output part under the control of the first illumination parameter, the first illumination parameter and a preset control model, and controlling the light source according to the second illumination parameter.
Optionally, the generating module is further configured to:
acquiring component material information of the image transfer component;
generating an adjusting illumination parameter of the light source according to the material information of the component, the relative position information and the image to be subjected to photoetching;
and acquiring a second transfer image of the image transfer part under the control of the light source by the adjustment illumination parameters, and optimizing the adjustment illumination parameters according to the second transfer image to obtain the first illumination parameters.
Optionally, the generating module is further configured to:
acquiring pattern information of the image to be subjected to photoetching;
and generating the adjustment illumination parameters of the light source according to the pattern information, the component material information and the relative position information through a Fourier lamination principle.
Optionally, the generating module is further configured to:
identifying at least one overlapping exposure area on the image transfer component, in which a plurality of light emitting units are subjected to overlapping exposure, based on the second transfer image;
generating target exposure parameters corresponding to each region in the image transfer component according to each overlapped exposure region in the second transfer image;
and optimizing the adjustment illumination parameters according to the target exposure parameters corresponding to the areas to obtain the first illumination parameters.
Optionally, the determining module is further configured to:
the step of determining a second illumination parameter of the light source according to the output image of the image output section under the control of the first illumination parameter, and a preset control model, and controlling the light source according to the second illumination parameter includes:
performing feature decomposition on the output image to obtain at least one image feature;
And for any target feature in the image features, determining the sub-illumination parameters corresponding to the target feature according to the first illumination parameters, the target feature and the preset control model.
The control device in the proximity lithography system solves the technical problem of poor image quality of lithography images by adopting the light source control optimization method in the embodiment. Compared with the prior art, the beneficial effects of the control device in the proximity lithography system provided by the embodiment of the application are the same as those of the light source control optimization method provided by the embodiment, and other technical features in the control device in the proximity lithography system are the same as those disclosed by the method of the embodiment, so that redundant description is omitted.
Example IV
An embodiment of the present application provides an electronic device, including: at least one processor; and a memory communicatively coupled to the at least one processor; wherein the memory stores instructions executable by the at least one processor to enable the at least one processor to perform the light source control optimization method of the above embodiments.
Referring now to fig. 11, a schematic diagram of an electronic device suitable for use in implementing embodiments of the present disclosure is shown. The electronic devices in the embodiments of the present disclosure may include, but are not limited to, mobile terminals such as mobile phones, notebook computers, digital broadcast receivers PDAs (Personal Digital Assistant, personal digital assistants), PADs (tablet computers), PMPs (Portable Media Player, portable multimedia players), in-vehicle terminals (e.g., in-vehicle navigation terminals), and the like, and stationary terminals such as digital TVs, desktop computers, and the like. The electronic device shown in fig. 11 is merely an example, and should not impose any limitations on the functionality and scope of use of embodiments of the present disclosure.
As shown in fig. 11, the electronic apparatus may include a processing device (e.g., a central processing unit, an image processor, etc.) that may perform various appropriate actions and processes according to a program stored in a ROM (Read-Only Memory) or a program loaded from a storage device into a RAM (Random Access Memory ). In the RAM, various programs and data required for the operation of the electronic device are also stored. The processing device, ROM and RAM are connected to each other via a bus. Input/output (I/O) ports are also connected to the bus.
In general, the following systems may be connected to I/O ports: input devices including, for example, touch screens, touch pads, keyboards, mice, image sensors, microphones, accelerometers, gyroscopes, etc.; output devices including, for example, liquid Crystal Displays (LCDs), speakers, vibrators, etc.; storage devices including, for example, magnetic tape, hard disk, etc.; a communication device. The communication means may allow the electronic device to communicate with other devices wirelessly or by wire to exchange data. While electronic devices having various systems are shown in the figures, it should be understood that not all of the illustrated systems are required to be implemented or provided. More or fewer systems may alternatively be implemented or provided.
In particular, according to embodiments of the present disclosure, the processes described above with reference to flowcharts may be implemented as computer software programs. For example, embodiments of the present disclosure include a computer program product comprising a computer program embodied on a computer readable medium, the computer program comprising program code for performing the method shown in the flowcharts. In such an embodiment, the computer program may be downloaded and installed from a network via a communication device, or installed from a storage device, or installed from ROM. The above-described functions defined in the methods of the embodiments of the present disclosure are performed when the computer program is executed by a processing device.
The electronic equipment provided by the application adopts the light source control optimization method in the embodiment, so that the technical problem of poor image quality of the photoetching image is solved. Compared with the prior art, the beneficial effects of the electronic device provided by the embodiment of the present application are the same as those of the light source control optimization method provided by the above embodiment, and other technical features of the electronic device are the same as those disclosed by the method of the above embodiment, which are not described in detail herein.
It should be understood that portions of the present disclosure may be implemented in hardware, software, firmware, or a combination thereof. In the description of the above embodiments, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes and substitutions are intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Example five
The present embodiment provides a computer-readable storage medium having computer-readable program instructions stored thereon for performing the method of the light source control optimizing method in the above-described embodiment.
The computer readable storage medium provided by the embodiments of the present application may be, for example, a usb disk, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, or device, or a combination of any of the foregoing. More specific examples of the computer-readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer diskette, a hard disk, RAM, ROM, EPROM (Erasable Programmable Read Only Memory, erasable programmable read-only memory) or flash memory, an optical fiber, a CD-ROM (compact disc read-only memory), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In this embodiment, a computer-readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, or device. Program code embodied on a computer readable storage medium may be transmitted using any appropriate medium, including but not limited to: electrical wires, fiber optic cables, RF (Radio Frequency), and the like, or any suitable combination thereof.
The above-described computer-readable storage medium may be contained in an electronic device; or may exist alone without being assembled into an electronic device.
The computer-readable storage medium carries one or more programs that, when executed by an electronic device, cause the electronic device to: acquiring an image to be subjected to lithography and relative position information between each light emitting unit and the image output part; generating a first illumination parameter of the light source according to the relative position information and the image to be subjected to photoetching; and determining a second illumination parameter of the light source according to the output image of the image output part under the control of the first illumination parameter, the first illumination parameter and a preset control model, and controlling the light source according to the second illumination parameter.
Computer program code for carrying out operations of the present disclosure may be written in one or more programming languages, including an object oriented programming language such as Java, smalltalk, C ++ and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any kind of network, including a LAN (Local Area Network ) or WAN (Wide Area Network, wide area network), or it may be connected to an external computer (for example, through the Internet using an Internet service provider).
The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
The modules described in the embodiments of the present disclosure may be implemented in software or hardware. Wherein the name of the module does not constitute a limitation of the unit itself in some cases.
The computer readable storage medium stores computer readable program instructions for executing the light source control optimization method, and solves the technical problem of poor image quality of photoetching images. Compared with the prior art, the beneficial effects of the computer readable storage medium provided by the embodiment of the present application are the same as those of the light source control optimization method provided by the above implementation, and are not described in detail herein.
Example six
The present application also provides a computer program product comprising a computer program which, when executed by a processor, implements the steps of a light source control optimization method as described above.
The computer program product solves the technical problem that the image quality of a photoetching image is poor. Compared with the prior art, the beneficial effects of the computer program product provided by the embodiment of the present application are the same as the beneficial effects of the light source control optimization method provided by the above embodiment, and are not described herein.
The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the scope of the claims, and all equivalent structures or equivalent processes using the descriptions and drawings of the present application, or direct or indirect application in other related technical fields are included in the scope of the claims.
Claims (10)
1. A proximity lithography system, said proximity lithography system comprising: the device comprises a light source, a control device, an image output component and an image transfer component, wherein the image output component and the image transfer component are sequentially arranged along the light emitting direction of the light source; the light source comprises at least one light emitting unit, and the control device is used for controlling each light emitting unit according to the image output component; the step of controlling each of the light emitting units includes:
acquiring an image to be subjected to photoetching and relative position information between each light-emitting unit and the image output part, wherein the relative position information comprises relative distance and/or relative angle;
generating a first illumination parameter of the light source according to the relative position information and the image to be photoetched, wherein the first illumination parameter comprises a first control parameter corresponding to each light-emitting unit, and the first control parameter comprises at least one of a starting mode of starting the light-emitting units, the number of the light-emitting units, the positions of the light-emitting units, a light-emitting control sequence of the light-emitting units, illuminance of the light-emitting units and polarization state of the light-emitting units;
Determining a second lighting parameter of the light source according to a first transfer image of the image transfer component, the first lighting parameter and a preset control model under the control of the first lighting parameter, and controlling the light source according to the second lighting parameter, wherein the second lighting parameter comprises a second control parameter corresponding to each light emitting unit, and the second control parameter comprises at least one of a starting mode of starting the light emitting units, the number of the light emitting units, the positions of the light emitting units, the light emitting control sequence of starting the light emitting units, the illuminance of the light emitting units and the polarization state of the light emitting units.
2. A proximity lithography system as recited in claim 1, wherein an optical transmission member is disposed between the light source and the image output member if a size relationship between a light source surface size of the light source and an image output member size does not conform to a preset size relationship.
3. A proximity lithography system as claimed in claim 1, further comprising an optical transmission member disposed between the light source and the image output member, and wherein the optical transmission member is at least one mirror, and wherein the parameters and/or position of each mirror are determined by the relative size between the light source face size of the light source and the image output member size.
4. A light source control optimization method is characterized by being applied to a control device in a proximity type photoetching system, wherein the proximity type photoetching system comprises a light source, the control device, an image output part and an image transfer part which are sequentially arranged along the light emitting direction of the light source, the control device is respectively connected with the light source and the image output part, the light source comprises at least one light emitting unit,
the light source control optimization method comprises the following steps:
acquiring an image to be subjected to photoetching and relative position information between each light-emitting unit and the image output part, wherein the relative position information comprises relative distance and/or relative angle;
generating a first illumination parameter of the light source according to the relative position information and the image to be photoetched, wherein the first illumination parameter comprises a first control parameter corresponding to each light-emitting unit, and the first control parameter comprises at least one of a starting mode of starting the light-emitting units, the number of the light-emitting units, the positions of the light-emitting units, a light-emitting control sequence of the light-emitting units, illuminance of the light-emitting units and polarization state of the light-emitting units;
and determining a second illumination parameter of the light source according to the first transfer image of the image transfer component under the control of the first illumination parameter, the first illumination parameter and a preset control model, and controlling the light source according to the second illumination parameter.
5. The light source control optimization method according to claim 4, wherein the step of generating the first illumination parameter of the light source according to the relative position information and the image to be lithographically displayed comprises:
acquiring component material information of the image transfer component;
generating an adjusting illumination parameter of the light source according to the material information of the component, the relative position information and the image to be subjected to photoetching;
and acquiring a second transfer image of the image transfer component under the control of the light source by the adjustment illumination parameter, and optimizing the adjustment illumination parameter according to the second transfer image to obtain the first illumination parameter.
6. The method of optimizing light source control according to claim 5, wherein the step of generating the adjusted illumination parameters of the light source based on the component material information, the relative position information, and the image to be lithographically displayed comprises:
acquiring pattern information of the image to be subjected to photoetching;
and generating the adjustment illumination parameters of the light source according to the pattern information, the component material information and the relative position information through a Fourier lamination principle.
7. The light source control optimization method according to claim 5, wherein the step of optimizing the adjusted illumination parameter based on the second transfer image to obtain the first illumination parameter comprises:
Identifying at least one overlapping exposure area on the image transfer component, in which a plurality of light emitting units are subjected to overlapping exposure, based on the second transfer image;
generating target exposure parameters corresponding to each region in the image transfer component according to each overlapped exposure region in the second transfer image;
and optimizing the adjustment illumination parameters according to the target exposure parameters corresponding to the areas to obtain the first illumination parameters.
8. A light source control optimization method in accordance with claim 4, wherein said second illumination parameter comprises at least one sub-illumination parameter,
the step of determining a second illumination parameter of the light source according to a first transferred image of the image transfer component under the control of the first illumination parameter, the first illumination parameter and a preset control model, and controlling the light source according to the second illumination parameter comprises:
performing feature decomposition on the first transfer image to obtain at least one image feature;
and for any target feature in the image features, determining the sub-illumination parameters corresponding to the target feature according to the first illumination parameters, the target feature and the preset control model.
9. An electronic device, the electronic device comprising:
at least one processor; the method comprises the steps of,
a memory communicatively coupled to the at least one processor; wherein,
the memory stores instructions executable by the at least one processor to enable the at least one processor to perform the steps of the light source control optimization method of any one of claims 4 to 8.
10. A computer-readable storage medium, characterized in that the computer-readable storage medium has stored thereon a program for realizing a light source control optimizing method, the program for realizing the light source control optimizing method being executed by a processor to realize the steps of the light source control optimizing method according to any one of claims 4 to 8.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006313202A (en) * | 2005-05-06 | 2006-11-16 | Nano System Solutions:Kk | Method for manufacturing mask |
| JP2010256428A (en) * | 2009-04-21 | 2010-11-11 | Hitachi High-Technologies Corp | Exposure device, exposure light-irradiating method, and method for manufacturing panel substrate for display |
| CN102289155A (en) * | 2011-08-12 | 2011-12-21 | 中国科学技术大学 | Photoetching machine based on ultraviolet LED (Light Emitting Diode) light source |
| JP2021043343A (en) * | 2019-09-11 | 2021-03-18 | 株式会社ブイ・テクノロジー | Illumination apparatus for proximity exposure apparatus, proximity exposure apparatus, and exposure method for proximity exposure apparatus |
| CN116755297A (en) * | 2023-08-17 | 2023-09-15 | 鹏城实验室 | Exposure resolution optimization method and device, electronic equipment and storage medium |
-
2023
- 2023-09-25 CN CN202311235788.XA patent/CN116974158B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006313202A (en) * | 2005-05-06 | 2006-11-16 | Nano System Solutions:Kk | Method for manufacturing mask |
| JP2010256428A (en) * | 2009-04-21 | 2010-11-11 | Hitachi High-Technologies Corp | Exposure device, exposure light-irradiating method, and method for manufacturing panel substrate for display |
| CN102289155A (en) * | 2011-08-12 | 2011-12-21 | 中国科学技术大学 | Photoetching machine based on ultraviolet LED (Light Emitting Diode) light source |
| JP2021043343A (en) * | 2019-09-11 | 2021-03-18 | 株式会社ブイ・テクノロジー | Illumination apparatus for proximity exposure apparatus, proximity exposure apparatus, and exposure method for proximity exposure apparatus |
| CN116755297A (en) * | 2023-08-17 | 2023-09-15 | 鹏城实验室 | Exposure resolution optimization method and device, electronic equipment and storage medium |
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