CN116974147A - Stage device, transfer device, and article manufacturing method - Google Patents

Stage device, transfer device, and article manufacturing method Download PDF

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Publication number
CN116974147A
CN116974147A CN202310459709.7A CN202310459709A CN116974147A CN 116974147 A CN116974147 A CN 116974147A CN 202310459709 A CN202310459709 A CN 202310459709A CN 116974147 A CN116974147 A CN 116974147A
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CN
China
Prior art keywords
core
stage
micro
fixed
coil
Prior art date
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Pending
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CN202310459709.7A
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Chinese (zh)
Inventor
佐藤健
神谷重雄
是永伸茂
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Canon Inc
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Canon Inc
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Publication of CN116974147A publication Critical patent/CN116974147A/en
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
    • H02K41/02—Linear motors; Sectional motors
    • H02K41/03—Synchronous motors; Motors moving step by step; Reluctance motors
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
    • H02P25/00—Arrangements or methods for the control of AC motors characterised by the kind of AC motor or by structural details
    • H02P25/02—Arrangements or methods for the control of AC motors characterised by the kind of AC motor or by structural details characterised by the kind of motor
    • H02P25/06—Linear motors
    • H02P25/064—Linear motors of the synchronous type

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Electromagnetism (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Linear Motors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The invention provides a stage device, a transfer device and an article manufacturing method. The stage device for holding a substrate includes: a coarse movement carrier; a coarse actuator for driving the coarse movement stage along a predetermined plane; a micro-motion stage for holding the substrate; a jog actuator for adjusting the position and posture of the jog stage relative to the jog stage; and an electromagnetic actuator for transmitting the thrust force supplied from the coarse actuator to the coarse motion stage to the fine motion stage in a noncontact manner. The electromagnetic actuator includes: a movable iron core fixed on the micro-motion carrier; a fixed iron core fixed on the coarse moving carrier; and a coil wound around the fixed core. The shortest distance between the substrate and the coil held by the micro-motion stage is greater than the shortest distance between the substrate and the fixed core.

Description

Stage device, transfer device, and article manufacturing method
Technical Field
The invention relates to a stage device, a transfer device and a method for manufacturing an article.
Background
The transfer device for transferring the original pattern to the substrate may include: a coarse motion stage driven by a coarse motion actuator; and a micro stage disposed on the rough stage and holding the substrate. A jog actuator for adjusting the position and posture of the jog stage with respect to the jog stage may be disposed between the jog stage and the jog stage. Further, an electromagnetic actuator for transmitting the thrust force supplied from the coarse actuator to the fine motion stage in a noncontact manner may be disposed between the coarse motion stage and the fine motion stage.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open publication No. 2005-109522
Patent document 2: japanese patent laid-open No. 8-130179
Disclosure of Invention
Problems to be solved by the invention
When the micro-motion stage is accelerated, a moment acts on the micro-motion stage. When the micro-actuator is operated to cancel out such moment, heat generation from the micro-actuator increases. This heat generation causes deformation of the micro-motion stage, which causes a decrease in alignment accuracy.
The present invention aims to provide a technique which is advantageous in reducing moment acting on a jog carrier.
Means for solving the problems
A 1 st aspect of the present invention relates to a stage device for holding a substrate, the stage device including: a coarse movement carrier; a coarse actuator for driving the coarse movement stage along a predetermined plane; a micro-motion stage for holding the substrate; a jog actuator for adjusting the position and posture of the jog stage relative to the jog stage; and an electromagnetic actuator for transmitting the thrust force supplied from the coarse actuator to the coarse motion stage to the fine motion stage in a noncontact manner, the electromagnetic actuator including: a movable iron core fixed on the micro-motion carrier; a fixed iron core fixed on the coarse moving carrier; and a coil wound around the fixed core, wherein a shortest distance between the substrate and the coil held by the micro-motion stage is greater than a shortest distance between the substrate and the fixed core.
The 2 nd aspect of the present invention relates to a transfer device for transferring a master pattern to a substrate, the transfer device having the stage device according to the 1 st aspect.
A 3 rd aspect of the present invention relates to a method for manufacturing an article, the method comprising: a transfer step of transferring the original pattern to the substrate by the transfer device according to claim 2; and a step of obtaining an article from the substrate on which the transfer step is performed.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, a technique advantageous in reducing moment acting on the jog dial can be provided.
Drawings
Fig. 1 is a diagram schematically showing the configuration of an exposure apparatus according to one embodiment.
Fig. 2 is a diagram schematically showing a configuration of a wafer stage device according to an embodiment.
Fig. 3 is a diagram schematically showing a configuration of a wafer stage device according to an embodiment.
Fig. 4 is a diagram schematically showing the configuration of a micro stage device according to one embodiment.
Fig. 5 is a diagram schematically showing the structure of the coarse movement stage device according to one embodiment.
Fig. 6 is a diagram schematically showing the structure of a thick linear motor according to one embodiment.
Fig. 7 is a diagram exemplarily showing a layout diagram of an exposure unit.
Fig. 8 is a diagram schematically showing a configuration of a micro-electromagnet incorporated in an exposure apparatus or a wafer stage apparatus according to embodiment 1.
Fig. 9 is a diagram schematically showing a configuration of a micro-electromagnet incorporated in an exposure apparatus or a wafer stage apparatus according to embodiment 1.
Fig. 10 is a diagram schematically showing a configuration of a micro stage device incorporated in an exposure apparatus or a wafer stage device according to embodiment 1.
Fig. 11 is a diagram schematically showing a configuration of a modified example of the micro-electromagnet incorporated in the exposure apparatus or the wafer stage apparatus according to embodiment 1.
Fig. 12 is a diagram schematically showing a configuration of another modified example of the micro-electromagnet incorporated in the exposure apparatus or the wafer stage apparatus according to embodiment 1.
Fig. 13 is a diagram schematically showing a configuration of a micro-electromagnet incorporated in an exposure apparatus or a wafer stage apparatus according to embodiment 2.
Fig. 14 is a diagram schematically showing a configuration of a micro-electromagnet incorporated in an exposure apparatus or a wafer stage apparatus according to embodiment 2.
Fig. 15 is a diagram schematically showing a configuration of a micro stage device incorporated in an exposure apparatus or a wafer stage device according to embodiment 2.
Fig. 16 is a diagram schematically showing a configuration of a micro-electromagnet incorporated in an exposure apparatus or a wafer stage apparatus according to embodiment 3.
Fig. 17 is a diagram schematically showing a configuration of a micro-electromagnet incorporated in an exposure apparatus or a wafer stage apparatus according to embodiment 3.
Fig. 18 is a diagram schematically showing a configuration of a micro stage device incorporated in an exposure apparatus or a wafer stage device according to embodiment 3.
Fig. 19 is a diagram schematically showing a configuration of a modified example of the micro-electromagnet incorporated in the exposure apparatus or the wafer stage apparatus according to embodiment 3.
Fig. 20 is a diagram schematically showing a configuration of a modified example of a micro-electromagnet incorporated in an exposure apparatus or a wafer stage apparatus according to embodiment 3.
Fig. 21 is a diagram schematically showing a configuration of another modified example of the micro-electromagnet incorporated in the exposure apparatus or the wafer stage apparatus according to embodiment 3.
Fig. 22 is a diagram schematically showing a configuration of a micro-electromagnet incorporated in an exposure apparatus or a wafer stage apparatus according to embodiment 4.
Fig. 23 is a diagram schematically showing a configuration of a modified example of a micro-electromagnet incorporated in an exposure apparatus or a wafer stage apparatus according to embodiment 4.
Fig. 24 is a diagram schematically showing the structure of a support member of a movable iron core in a modification of the micro-electromagnet according to embodiment 4.
Fig. 25 is a diagram schematically showing a configuration of a control system of the wafer stage device according to one embodiment.
Fig. 26 is a diagram exemplarily showing a position profile and an acceleration profile.
Fig. 27 is a diagram for explaining an assembly method or a manufacturing method of a modified example of the micro-electromagnet according to embodiment 3.
Fig. 28 is a diagram for explaining an assembly method or a manufacturing method of a modified example of the micro-electromagnet according to embodiment 3.
Fig. 29 is a diagram for explaining an assembly method or a manufacturing method of a modified example of the micro-electromagnet according to embodiment 3.
Fig. 30 is a diagram for explaining an assembly method or a manufacturing method of a modified example of the micro-electromagnet according to embodiment 3.
Fig. 31 is a diagram for explaining an assembly method or a manufacturing method of a modified example of the micro-electromagnet according to embodiment 3.
Fig. 32 is a view for exemplarily explaining a wound core.
Fig. 33 is a diagram for illustrating a method of manufacturing the wound core.
Fig. 34 is a diagram for explaining eddy currents generated in an iron core having a complex three-dimensional shape.
Fig. 35 is a diagram exemplarily showing a moment acting on the micro motion stage when accelerating the micro motion stage.
Detailed Description
Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. The following embodiments do not limit the invention according to the claims, and not all combinations of the features described in the embodiments are essential to the invention. Two or more of the features described in the embodiments may be combined arbitrarily. The same or similar components are denoted by the same reference numerals, and redundant description thereof is omitted.
In the following description, directions are described based on an XYZ coordinate system. The XY plane defined by the X axis and the Y axis is typically a horizontal plane, and the Z axis is typically parallel to the vertical direction. The XY direction is a direction parallel to the XY plane. The X-axis direction is a direction parallel to the X-axis, the Y-axis direction is a direction parallel to the Y-axis, and the Z-axis direction is a direction parallel to the Z-axis.
Fig. 1 schematically shows the configuration of an exposure apparatus according to an embodiment. The exposure apparatus can be understood as an example of a positioning apparatus for relatively positioning the 1 st object (for example, a substrate) and the 2 nd object (for example, a master), or a transfer apparatus for transferring a pattern of the master (reticle) to the substrate (wafer). The stage plate 692 may be disposed above the floor 691 with a carrier therebetween, upon which the wafer stage apparatus 500 is disposed. Further, a barrel plate 696 may be disposed above the floor 691 via a bracket 698. Projection optics 687 and reticle stage 694 may be supported by a barrel stage 696. A reticle stage apparatus 695 may be disposed above reticle stage 694. An illumination optics system 699 may be disposed above the reticle stage 694. The illumination optical system 699 can project an image of a reticle placed on a reticle stage of the reticle stage device 695 onto a wafer placed on a wafer stage of the wafer stage device 500, thereby transferring a pattern of the reticle onto the wafer. The exposure apparatus may be configured as a scanning exposure apparatus.
The wafer stage device 500 can be understood as a 1 st positioning mechanism that positions a substrate serving as a 1 st object, or as a stage device that holds a substrate. Reticle stage apparatus 695 may be understood as a 2 nd positioning mechanism for positioning a reticle used as a 2 nd object. At least one of the 1 st positioning mechanism and the 2 nd positioning mechanism may include an electromagnetic device or an electromagnetic actuator described below.
The exposure apparatus or the transfer apparatus described above can be used in an article manufacturing method for manufacturing an article such as a semiconductor device. The article manufacturing method may include: a transfer step of transferring the original pattern to the substrate by the exposure device or the transfer device; and a step of processing the substrate subjected to the transfer step to obtain an article. The processing of the substrate may include, for example, etching, film formation, dicing, and the like.
Fig. 2 schematically shows the entire configuration of the wafer stage apparatus 500. The XY slider 104 is slidably disposed on the stage base 105 in the XY direction. The XY slider 104 can transmit force in the X axis direction through the X slider 102 and force in the Y axis direction through the Y slider 103. The micro-motion stage device 101 can be mounted on the XY slider 104. Coarse linear motors 106 for driving the X slider 102 and the Y slider 103 in the X axis direction and the Y axis direction, respectively, may be provided on both sides of each.
Fig. 3 schematically illustrates a wafer stage device 500 in which a micro stage (micro top plate) 101-1 of a micro stage device 101 is moved upward for convenience. The micro-motion stage 101-1 holds a wafer. The micro-motion stage 101-1 can also be understood as a structure having a chuck for holding a wafer. The micro-motion base 101-2 may be fixed above the XY slider 104. On the jog base 101-2, 4 jog ZLM (1 st jog actuator) 101-6 for performing precise positioning of Z tilting may be provided. In addition, above the jog base 101-2, 2 jog XLM (2 nd jog actuator) 101-4 for performing precise positioning of the X axis and around the Z axis may be provided. Additionally, above the jog base 101-2, there may be provided a Y-axis and precisely positioned 2 jog YLMs (3 rd jog actuators) 101-5 about the Z-axis. In the center of the micro base 101-2, a micro electromagnet 101-3 that functions to transmit acceleration forces in the X-axis and Y-axis directions supplied to the XY slider 104 to the micro base 101-2 may be provided.
Here, the jog base 101-2 can be understood as a jog stage. Alternatively, the XY slider 104 and the jog mount 101-2 may be understood as a jog mount. The coarse linear motor 106 can be understood as a coarse actuator that drives the jog mount 101-2 serving as a coarse motion stage along the XY plane, i.e., a predetermined plane. In addition, the jog ZLM101-6, jog XLM101-4, and Y jog YLM101-5 can be understood as jog actuators for adjusting the position and posture of jog stage 101-1 with respect to jog base 101-2 serving as a jog stage. In addition, the micro-motion electromagnet 101-3 can be understood as an electromagnetic actuator for transmitting, in a noncontact manner, the thrust force provided to the micro-motion stage 101-1 serving as a coarse motion stage by the coarse linear motor 106 serving as a coarse motion actuator, to the micro-motion stage 101-1.
Fig. 4 shows a configuration of the micro stage device 101, in particular, detailed configuration examples of the micro YLM101-5 and the micro ZLM 101-6. Fig. 4 shows a state in which a part of the yoke is removed. The inching YLM101-5 may be comprised of a linear motor. The micro-moving YLM101-5 may include a micro-moving YLM coil base 101-52, a micro-moving YLM coil 101-51, a micro-moving YLM magnet 101-53, a micro-moving YLM yoke 101-54, a micro-moving LM shim 101-70. A jog arm coil base 101-52 may be secured over jog base 101-2, upon which jog arm coil 101-51 is secured. The micro-movement YLM coil 101-51 may be an oblong coil having a straight line portion extending in the vertical direction, and 4 micro-movement YLM magnets 101-53 may be disposed so as to face the straight line portion with a gap therebetween. The 2 YLM yokes 101 to 54 for passing magnetic flux may be arranged so as to sandwich the magnets. The magnetization direction of the magnets may be in the X-axis direction, the magnets adjacent to each other in the Y-axis direction may be opposite in polarity, and the magnets aligned in the X-axis direction may be the same in polarity. Micro LM shims 101-70 may be used to maintain their position against the attractive forces acting on a pair of magnets and yokes. Magnets, yokes, shims may be fixed to the micro base 101-2. By flowing a current in the YLM coil 101-51, a force proportional to the current can be generated in a direction orthogonal to the straight line portion, that is, in the Y-axis direction. In addition, a moment about the Z-axis can be generated by flowing currents in opposite directions to each other to the 2 jog YLMs 101-5.
The micro ZLM101-6 may be constituted by a linear motor. The micro ZLM101-6 may include a micro ZLM coil base 101-62, a micro ZLM coil 101-61, a micro ZLM magnet 101-63, a micro ZLM yoke 101-64, and a micro LM shim 101-70. A micro ZLM coil base 101-62 may be fixed on the micro base 101-2, on which micro ZLM coils 101-61 are fixed. The micro ZLM coil 101-61 may be an oblong coil having a straight line portion extending in the horizontal direction, and 4 micro ZLM magnets 101-63 may be disposed so as to face the straight line portion with a gap therebetween. The 2 ZLM yokes 101 to 64 for passing magnetic flux may be arranged so as to sandwich the magnets. The magnetization direction of the magnets may be in the X-axis direction, the magnets adjacent to each other in the Z-axis direction may be opposite in polarity, and the magnets aligned in the X-axis direction may be the same in polarity. Micro LM shims 101-70 may be used to maintain their position against the attractive forces acting on a pair of magnets and yokes. Magnets, yokes, shims may be fixed to the micro top plate 101. By flowing an electric current in the ZLM coil 101-61, a force proportional to the electric current can be generated in a direction orthogonal to the straight line portion, that is, in the Z-axis direction. In addition, by combining the directions of the currents flowing in the 4 micro ZLMs 101-6, a moment around the X axis and a moment around the Y axis can be generated.
Micro XLM101-4 is of the same construction as micro YLM101-5 and has a configuration in which micro YLM101-5 is rotated 90 degrees. Thereby, a force in the X-axis direction and a moment around the Z-axis can be generated.
In addition, 4 pin units 101-39 may be provided, and they may function as temporary places when the wafer is recovered from above the micro stage 101 and when the wafer is placed on the micro stage 101-1. The number of pin units 101 to 39 is preferably 3 or more for stable temporary placement of wafers, but if it is 1 at the minimum, handover can be achieved. The pin units 101 to 39 have a lifting mechanism for lifting pins for temporarily placing or mounting wafers. The pin units 101-39 may have the following functions: driving the pins so as to form a 1 st state in which the upper ends of the pins protrude from the upper surface of the micro stage 101-1; and driving the pins so as to form a 2 nd state in which the upper ends of the pins are retracted downward from the upper surface of the micro stage 101-1. In the operation of mounting the wafer on the micro stage 101-1, the pin unit 101-39 receives the wafer from a not-shown conveyance mechanism in the 1 st state, and then delivers the wafer on the pin to the micro stage 101-1 in the transition to the 2 nd state. In an operation of transferring the wafer placed on the micro stage 101-1 to a not-shown conveyance mechanism, the pin unit 101-39 shifts the pins from the 2 nd state to the 1 st state. The pin units 101-39 receive the wafer placed on the micro stage 101-1 by pins during this process, and deliver the wafer to a not-shown conveyance mechanism in the 1 st state.
The micro-motion stage device 101 may not be provided with the pin units 101-39, and in this case, the micro-motion ZLM101-6 may drive the micro-motion stage 101-1 upward to transfer the wafer to and from a not-shown conveyance mechanism.
Fig. 5 schematically shows the detailed configuration of the coarse movement stage device, in particular, the X slider 102, the Y slider 103, and the XY slider 104. The XY slider 104 may include an XY slider lower member 104-3, an XY slider middle member 104-2, and an XY slider upper member 104-1. The XY slider lower member 104-3 is supported slidably in the XY direction on the stage base 105, on which the XY slider middle member 104-2 is arranged, and on which the XY slider upper member 104-1 is arranged.
The X slider 102 may include an X beam 102-1, 2X feet 102-2, 2X yaw guides 102-3. The 2X yaw guides 102-3 may be fixed to 2 sides of the stage base 105. The 2X legs 102-2 may be joined by an X beam 102-1. The one X leg 102-2 is supported slidably in the X axis direction so as to face the side surface of the one X yaw guide 102-3 and the upper surface of the stage base 105 with a gap therebetween. The other X leg 102-2 is supported slidably in the X axis direction so as to face the side surface of the other X yaw guide 102-3 and the upper surface of the stage base 105 with a gap therebetween. Thus, the X-beam 102-1 and the 2X-legs 102-2 are slidably disposed in the X-axis direction. The two side surfaces of the X beam 102-1 slidably face the inner side surface of the XY slider intermediate member 104-2 with a minute gap therebetween, and the XY slider 104 can be slidably held in the XY direction.
The Y slider 103 may include a Y-beam 103-1, a Y-foot 103-2, and a Y-yaw guide 103-3. 2Y yaw guides 103-3 are fixed to 2 sides of the stage base 105, and 2Y legs 103-2 may be connected by Y beams 103-1. The one Y leg 103-2 is supported slidably in the Y axis direction so as to face the side surface of the one Y yaw guide 103-3 and the upper surface of the stage base 105 with a gap therebetween. The other Y leg 103-2 is supported slidably in the Y axis direction so as to face the side surface of the other Y yaw guide 103-3 and the upper surface of the stage base 105 with a gap therebetween. Thus, the integrated body of the Y beam 103-1 and the 2Y legs 103-2 is slidably disposed in the X-axis direction. The two side surfaces of the Y beam 103-1 slidably face the inner side surface of the XY slider upper member 104-1 with a minute gap therebetween, and the XY slider 104 can be slidably held in the XY direction.
A detailed construction of the thick linear motor 106 is exemplarily shown in fig. 6. The coarse linear motor 106 may include a plurality of linear motor coils 106-1, a coil support plate 106-2, a strut 106-3, a coil base 106-4, 2 linear motor magnets 106-5, a yoke 106-6, 2 shims 106-7, and an arm 106-8.
The plurality of linear motor coils 106-1 may be 2-phase coil units in which phases of adjacent linear motor coils 106-1 are different from each other by 90 degrees. A plurality of linear motor coils 106-1 may be secured to the coil support plate 106-2 via struts 106-3 to the coil base 106-4. The coil base 106-4 may be fixed to the stage plate 692, or may be slidably supported by the stage plate 692 in the coil arrangement direction. In the structure in which the coil base 106-4 is slidably supported, reaction (reaction) of acceleration can be absorbed. The 2 linear motor magnets 106-5 may be 4-pole magnet units, respectively, which may be arranged to sandwich the linear motor coil 106-1 from above and below via a gap.
A yoke 106-6 may be disposed on the back surface of each linear motor magnet 106-5. Shims 106-7 may be used to maintain the gap of 2 linear motor magnets 106-5 against the attractive force. The structure composed of the linear motor magnet 106-5, yoke 106-6, and spacer 106-7 can be fixed to the X leg 102-2 or the Y leg 103-2 via the arm 106-8. The structure can provide thrust in the X-axis direction and the Y-axis direction for an integrated body of the X beam and 2X legs and an integrated body of the Y beam and 2Y legs. In this configuration, a sinusoidal current corresponding to the position is applied to the coil facing the magnet among the coils of 2 phases, whereby a force can be continuously generated.
An arrangement of a plurality of exposure unit areas, i.e., an exposure unit layout, on a wafer 700 is illustratively shown in fig. 7. The exposure unit regions 701 having dimensions in the X-axis direction and dimensions in the Y-axis direction of Sx and Sy, respectively, may be disposed on the wafer 700. The plurality of exposure unit areas 701 are subjected to scanning exposure along a step/scan trajectory, for example. The micro-motion stage 101-1 can perform scanning drive of the scanning amount of the reticle stage at 1/projection magnification of the scanning amount of the reticle stage in the Y-axis direction in synchronization with the reticle stage at the time of scanning exposure. When the scanning exposure is completed, the jog stage 101-1 can perform a U-turn in the Y-axis direction and step in the X-axis direction, and then perform scanning exposure of the next exposure unit area. An electromagnet is used for acceleration of the micro-motion stage 101-1, and a linear motor is used for position control, whereby high-precision position control and low heat generation can be achieved at the same time.
When the micro motion stage 101-1 is accelerated, a moment can be applied to the micro motion stage 101-1. When the micro ZLM101-6 is operated to cancel out such moment, heat generation from the micro ZLM101-6 is increased. This heat generation causes deformation of the micro-motion stage 101-1, which causes a decrease in overlay accuracy.
In order to suppress heat generation from the micro-motion ZLM101-6, it is effective to reduce the moment acting on the micro-motion stage 101-1 when accelerating the micro-motion stage 101-1. In order to reduce the moment acting on the jog stage 101-1 when accelerating the jog stage 101-1, it is effective to reduce the distances of the centers of gravity of the jog XLM101-4, jog YLM101-5, jog ZLM101-6 and jog stage 101-1. For this reason, it is advantageous to reduce the height of the micro-electromagnet 101-3 on the micro-motion base 101-2.
Fig. 8, 9, and 10 exemplarily show the configuration of the micro-electromagnet 101-3 incorporated in the exposure apparatus or the wafer stage apparatus 500 according to embodiment 1. The micro-electromagnet 101-3 of embodiment 1 has a structure that is advantageous in reducing moment acting on the micro-motion stage 101-1 when accelerating the micro-motion stage 101-1. The micro-electromagnet 101-3 may include a fixed iron core (1 st member) SC, a supporting member 101-30 supporting the fixed iron core SC, a movable iron core (2 nd member) MC, a supporting member 101-31 supporting the movable iron core MC, and a coil 101-36. The support member 101-30 fixes the fixed core SC to the jog base 101-2 as a jog carrier, and the support member 101-31 fixes the movable core MC to the jog carrier 101-1. The coils 101-36 are wound on the fixed core SC. The center axis of the coil 101-36 may be parallel to the XY plane (the plane in which the jog base 101-2 as a jog stage moves). The fixed core SC has a 1 st end surface opposite to the movable core MC, and the distance between the wafer 700 held by the micro stage 101-1 and the center axis of the coil 101-36 may be greater than the distance between the wafer 700 held by the micro stage 101-1 and the center of the 1 st end surface.
In the example of fig. 8, 9, and 10, 4 support members 101-30 may be fixed to the micro base 101-2, fixed cores SC may be disposed thereon, and the coils 101-36 may be wound around the fixed cores SC. The fixed core SC and the movable core MC face each other with a minute gap. Here, the shortest distance Hcw between the wafer (substrate) 700 held by the micro stage 101-1 and the coil 101-36 is larger than the shortest distance Hew between the wafer (substrate) 700 held by the micro stage 101-1 and the fixed core SC. Such a configuration can be realized, for example, by giving the fixed core SC a crank shape in a cross section perpendicular to the XY plane and parallel to the central axis of the coils 101 to 36. By setting Hcw > Hew, the fixed core SC can be lowered vertically as compared with the configuration shown in fig. 4 and 35. This reduces the height of the micro-electromagnet 101-3 on the micro-motion base 101-2.
Here, in the configuration shown in fig. 8, 9, and 10, when the micro stage 101-1 of the mass M is accelerated by the acceleration a, the moment M acting on the micro stage 101-1 is m=m·a· (hg+hu+he). On the other hand, in the configuration shown in fig. 4 and 35, when the micro stage 101-1 of the mass M is accelerated by the acceleration a, the moment M acting on the micro stage 101-1 is m=m·a· (hg+hu+he+hc). Therefore, the moment M acting on the jog carrier 101-1 when accelerating the jog carrier 101-1 of the mass M with the acceleration a is reduced by m·a·hc in the configuration shown in fig. 8, 9, and 10, as compared with the configuration shown in fig. 4 and 35. Thus, the micro ZLM101-6 is operated to cancel the moment, and the heat generated by the micro ZLM101-6 can be reduced. This is advantageous in suppressing deformation of the micro-motion stage 101-1, and further suppressing degradation of overlay accuracy. hg is the Z-axis distance between the center of gravity G of the structure formed by the micro stage 101-1 and the components (movable core MC, support member 101-31, etc.) that move with the micro stage 101-1 and the lower surface (surface on the micro base 101-2 side) of the micro stage 101-1. hu is a Z-axis direction distance between the lower surface of the micro-motion stage 101-1 and the upper end of the micro-motion electromagnet 101-3 (the end on the micro-motion stage 101-1 side). he is the Z-axis direction distance between the upper end of the stationary core SC and the point of action of the micro electromagnet 101-3. hc is the Z-axis direction distance between the upper end of the coil 101-36 (the end on the micro stage 101-1 side) and the upper end of the fixed core SC.
Fig. 34 shows an example of the structure of the fixed core SC. In the example of fig. 34, the fixed core SC is formed of a laminate of a plurality of electromagnetic steel plates, and the lamination direction is the Z-axis direction. Each electromagnetic steel sheet is covered with an insulating film. In fig. 34, the direction of the magnetic flux in the magnetic circuit is indicated by black arrows, and the magnetic flux flows through a three-dimensional path. The magnetic flux flowing in the Z-axis direction is indicated by thick black arrows. Since the direction of the thick black arrow is parallel to the normal direction of the electromagnetic steel sheet, an eddy current generated by a change in current flows along the surface of the electromagnetic steel sheet, and the eddy current is not suppressed. Therefore, as with the thick white-bottom arrow, a large eddy current is generated. As a result, the fixed core SC generates heat, and the heat is transmitted to the micro stage 101-1, so that the micro stage 101-1 deforms, and the alignment accuracy is lowered. Further, since the magnetic flux in the Z-axis direction indicated by the thick black arrow has a direction parallel to the normal direction of the electromagnetic steel sheet, there are disadvantages in that the magnetic resistance is large, the value of the magnetic flux is reduced, and the attractive force is reduced.
Next, a modified example of the micro-electromagnet 101-3 incorporated in the exposure apparatus or the wafer stage apparatus 500 according to embodiment 1 will be described.
Fig. 11 schematically shows a configuration of a modified example of the micro-electromagnet 101-3 according to embodiment 1. The micro-electromagnet 101-3 may include a fixed iron core (1 st member) SC, a supporting member 101-30 supporting the fixed iron core SC, a movable iron core (2 nd member) MC, a supporting member 101-31 supporting the movable iron core MC, and a coil 101-36. The fixed core (1 st component) SC may include 1 st element 101-32, 2 nd element 101-33, 3 rd element 101-34, and 4 th element 101-35. The movable iron core (2 nd component) MC may include the elements 101 to 38, but may include 1 or more other elements in addition to the elements 101 to 38. The fixed core (1 st member) SC may have a 1 st end face E1, and the movable core (2 nd member) MC may have a 2 nd end face E2 facing the 1 st end face E1 with a gap therebetween. In this example, the 1 st end face E1 is provided at each of the 2 nd elements 101 to 33, the 3 rd elements 101 to 34, and the 4 th elements 101 to 35, and the 2 nd end face E2 is provided at the elements 101 to 38.
The fixed core (1 st member) SC may be constituted by a laminate of a plurality of electromagnetic steel plates. The plurality of electromagnetic steel plates may be respectively covered with an insulating film. From another point of view, the 1 st element 101-32, the 2 nd element 101-33, the 3 rd element 101-34, and the 4 th element 101-35 constituting the fixed core (1 st member) SC may be each constituted by a laminate of a plurality of electromagnetic steel plates. The movable iron core (2 nd member) MC may be constituted by a laminate of a plurality of electromagnetic steel plates. From another point of view, at least 1 element 101 to 38 constituting the movable iron core (2 nd member) MC may be constituted by a laminate of a plurality of electromagnetic steel plates. The plurality of electromagnetic steel plates may be respectively covered with an insulating film.
The magnetic circuit constituted by the fixed core (1 st member) SC, the movable core (2 nd member) MC, and the void (the space between the 1 st end face E1 and the 2 nd end face E2) may include at least 1 changing portion CP in which the lamination direction of the laminated body of the plurality of electromagnetic steel sheets changes at right angles. The variation portion CP may include a contact portion of a 1 st part (e.g., 1 st element 101-32) having a lamination direction of 1 st direction (e.g., Z-axis direction) and a 2 nd part (e.g., 3 rd element 101-34) having a lamination direction of 2 nd direction (e.g., X-axis direction) orthogonal to the 1 st direction. The variation portion CP may include a portion where a 1 st portion (e.g., 1 st elements 101 to 32) having a lamination direction of 1 st direction and a 2 nd portion (e.g., 3 rd elements 101 to 34) having a lamination direction of 2 nd direction orthogonal to the 1 st direction face each other with a solid member interposed therebetween. The solid member may be, for example, an insulating film that covers the plurality of electromagnetic steel plates, respectively.
In the modified example of fig. 11, the changing portion CP is provided in the fixed core (1 st member) SC. In the modified example of fig. 11, the changing portion CP includes a portion where the fixed core (1 st member) SC and the movable core (2 nd member) MC face each other with a gap. The latter constitution can also be understood as the following constitution: the 1 st part and the 2 nd part constituting the variable part CP are provided in the fixed core (1 st member) SC, and the 2 nd part is provided in the movable core (2 nd member) MC. The changing portion CP may be provided in addition to the movable core (the 2 nd member) MC, or may be provided only in the movable core (the 2 nd member) MC.
The fixed core (1 st member) SC and the movable core (2 nd member) MC may be each composed of at least 1 laminated core. Alternatively, at least one of the fixed core (1 st member) SC and the movable core (2 nd member) MC may be constituted by a plurality of laminated cores. The plurality of laminated cores are disposed so as to be adjacent to each other, and are fixed by a fixing member. The laminated iron core may be formed by laminating electromagnetic steel plates having the same shape.
The 1 st element 101-32, the 2 nd element 101-33, the 3 rd element 101-34, and the 4 th element 101-35 may be formed of laminated cores. The 1 st element 101-32, the 2 nd element 101-33, the 3 rd element 101-34, and the 4 th element 101-35 may be integrated by using an adhesive material or by fastening them by using a clamp member. In this example, at least 1 variation CP is provided on the fixed core (1 st member) SC, and the coils 101 to 36 are wound on the fixed core (1 st member) SC. The coils 101 to 36 may be wound around portions different from the portions where the variation CP is arranged, among the fixed core (1 st member) SC. By causing a current to flow in the coils 101 to 36, attractive force is generated between the 1 st end face E1 and the 2 nd end face E2. In the modification of fig. 11, the 1 st element 101-32 has an E-shape, and the coil 101-36 is wound around the tooth in the center of the 1 st element 101-32.
The changing portion CP is provided so that a magnetic flux passing through a magnetic circuit formed by the fixed core (1 st member) SC, the movable core (2 nd member) MC, and the gap does not flow through the plurality of electromagnetic steel plates constituting the fixed core (1 st member) SC and the movable core (2 nd member) MC in the lamination direction of the electromagnetic steel plates. Alternatively, the variable portion CP, the fixed core (1 st member) SC, and the movable core (2 nd member) MC may be provided such that magnetic fluxes passing through the fixed core (1 st member) SC and the movable core (2 nd member) MC flow along the surface direction of each electromagnetic steel plate. Alternatively, the changing portion CP may be provided so that the magnetic resistance of the magnetic circuit formed by the fixed core (1 st member) SC, the movable core (2 nd member) MC, and the gap is smaller than that in the case where the changing portion CP is not provided. Alternatively, the changing portion CP may be provided so that eddy current generated in the magnetic circuit formed by the fixed core (1 st member) SC, the movable core (2 nd member) MC, and the gap is smaller than that in the case where the changing portion CP is not provided.
The magnetic circuit is composed of the iron core including the changing portion CP, which is advantageous in that the degree of freedom in the shape of the magnetic circuit is improved. Further, by configuring the iron core like the fixed iron core (1 st member) SC and the movable iron core (2 nd member) MC from a plurality of elements, it is possible to facilitate manufacturing of the iron core having a complicated shape and to facilitate work for mounting and replacing the coil. In particular, the structure in which a plurality of elements are fastened by the clamp member is advantageous in that the replacement work of the coil is facilitated.
Fig. 12 exemplarily shows a configuration of another modification of the micro-electromagnet 101-3 of embodiment 1. Matters not mentioned here may be constituted according to the modified example shown in fig. 11. The micro-electromagnet 101-3 may include a fixed iron core (1 st member) SC, a supporting member 101b-30 supporting the fixed iron core SC, a movable iron core (2 nd member) MC, a supporting member (not shown) supporting the movable iron core MC, and a coil 101-36. The fixed core (1 st component) SC may include 1 st element 101b-32, 2 nd element 101b-33, 3 rd element 101b-34, and 4 th element 101b-35. The movable iron core (2 nd component) MC may include the elements 101 to 38, but may include 1 or more other elements in addition to the elements 101 to 38. As in the example of fig. 8, the fixed core (1 st member) SC has a 1 st end face, and the movable core (2 nd member) MC may have a 2 nd end face facing the 1 st end face with a gap therebetween. In this example, the 1 st end face is provided at each of the 2 nd elements 101b-33, 3 rd elements 101b-34, and 4 th elements 101b-35, and the 2 nd end face is provided at the elements 101-38. In the modified example of fig. 12, the 2 nd element 101b-33, the 3 rd element 101b-34, and the 4 th element 101b-35 have a crank shape in a cross section perpendicular to the XY plane and parallel to the central axis of the coil 101-36, and the 1 st element 101b-32 has a rectangular parallelepiped shape.
Fig. 13, 14, and 15 exemplarily show the configuration of the micro-electromagnet 101-3 incorporated in the exposure apparatus or the wafer stage apparatus 500 according to embodiment 2. The matters not described in embodiment 2 can be according to embodiment 1. The micro-electromagnet 101-3 of embodiment 2 has a structure that is advantageous in reducing moment acting on the micro-motion stage 101-1 when accelerating the micro-motion stage 101-1. The micro-electromagnet 101-3 may include a fixed iron core (1 st member) SC, a supporting member 101-30 supporting the fixed iron core SC, a movable iron core (2 nd member) MC, a supporting member 101-31 supporting the movable iron core MC, and a coil 101-36. The support member 101-30 fixes the fixed core SC to the jog base 101-2 as a jog carrier, and the support member 101-31 fixes the movable core MC to the jog carrier 101-1. The coils 101-36 are wound on the fixed core SC. The center axis of the coil 101-36 may be disposed at an angle inclined with respect to the XY plane (the plane in which the jog base 101-2 as a jog stage moves). Also, at least the portion of the fixed core SC around which the coils 101-36 are wound may include a portion extending in a direction inclined with respect to the XY plane. The fixed core SC preferably includes a changing portion CP as in the modification of embodiment 1.
Fig. 16, 17, and 18 exemplarily show the configuration of the micro-electromagnet 101-3 incorporated in the exposure apparatus or the wafer stage apparatus 500 according to embodiment 3. Embodiment 1 can be used as an matters not described in embodiment 3. The micro-electromagnet 101-3 of embodiment 3 has a structure that is advantageous in reducing moment acting on the micro-motion stage 101-1 when accelerating the micro-motion stage 101-1. The micro-electromagnet 101-3 may include a fixed iron core (1 st member) SC, a supporting member 101-30 supporting the fixed iron core SC, a movable iron core (2 nd member) MC, a supporting member 101-31 supporting the movable iron core MC, and a coil 101-36. The support member 101-30 fixes the fixed core SC to the jog base 101-2 as a jog carrier, and the support member 101-31 fixes the movable core MC to the jog carrier 101-1. The coils 101-36 are wound on the fixed core SC. The center axis of the coil 101-36 may be disposed at an angle perpendicular to the XY plane (the plane in which the jog base 101-2 as a jog stage moves). In a section perpendicular to the XY plane and parallel to the central axis of the coils 101-36, the fixed core SC may include a portion having an L shape. The micro-motion base 101-2 may also have an opening, and a portion of the micro-motion electromagnet 101-3 may also be disposed in the opening.
Next, a modified example of the micro-electromagnet 101-3 incorporated in the exposure apparatus or the wafer stage apparatus 500 according to embodiment 3 will be described. Matters not described here may be modified according to embodiment 1. Fig. 19 and 20 schematically show a configuration of a modified example of the micro-electromagnet 101-3 according to embodiment 3. Fig. 20 shows an exemplary configuration of the micro-electromagnet 101-3 with the micro-base 101-2 removed.
In this modification, 4 openings 301-21 are provided with respect to the micro-motion base 101-2, and a portion of each micro-motion electromagnet 101-3 may be disposed in the corresponding opening 301-21. A portion of each of the 4 micro-electromagnets 101-3 may also be disposed below the micro-motion base 101-2. Each micro-motion electromagnet 101-3 may be supported by the micro-motion base 101-2 via a support member 301-30. Such a configuration is advantageous in reducing the height of the micro-electromagnet 101-3 above the micro-motion base 101-2 and reducing the size of the micro-electromagnet 101-3 in the XY direction.
The micro-electromagnet 101-3 may include a fixed iron core (1 st member) SC, a supporting member 301-30 supporting the fixed iron core SC, a movable iron core (2 nd member) MC, a supporting member 101-31 supporting the movable iron core MC, and a coil 301-36. The fixed core (1 st component) SC may include 1 st elements 301 to 32, 2 nd elements 301 to 33, 3 rd elements 301 to 34, and 4 th elements 301 to 35. The movable iron core (2 nd component) MC may include the elements 101 to 38, but may include 1 or more other elements in addition to the elements 101 to 38. The fixed core (1 st member) SC may have a 1 st end face E1, and the movable core (2 nd member) MC may have a 2 nd end face E2 facing the 1 st end face E1 with a gap therebetween. In this example, the 1 st end face E1 is provided at each of the 2 nd elements 301 to 33, the 3 rd elements 301 to 34, and the 4 th elements 301 to 35, and the 2 nd end face E2 is provided at the elements 101 to 38.
The fixed core (1 st member) SC may be constituted by a laminate of a plurality of electromagnetic steel plates. The plurality of electromagnetic steel plates may be respectively covered with an insulating film. From another point of view, the 1 st element 301 to 32, the 2 nd element 301 to 33, the 3 rd element 301 to 34, and the 4 th element 301 to 35 constituting the fixed core (1 st member) SC may be each constituted by a laminate of a plurality of electromagnetic steel plates. The movable iron core (2 nd member) MC may be constituted by a laminate of a plurality of electromagnetic steel plates. From another point of view, at least 1 element 101 to 38 constituting the movable iron core (2 nd member) MC may be constituted by a laminate of a plurality of electromagnetic steel plates. The plurality of electromagnetic steel plates may be respectively covered with an insulating film.
The magnetic circuit constituted by the fixed core (1 st member) SC, the movable core (2 nd member) MC, and the void (the space between the 1 st end face E1 and the 2 nd end face E2) may include at least 1 changing portion CP in which the lamination direction of the laminated body of the plurality of electromagnetic steel sheets changes at right angles. The variation portion CP may include a contact portion of a 1 st part (e.g., 1 st elements 301 to 32) having a lamination direction of 1 st direction (e.g., Y-axis direction) and a 2 nd part (e.g., 3 rd elements 301 to 34) having a lamination direction of 2 nd direction (e.g., X-axis direction) orthogonal to the 1 st direction. The variation portion CP may include a portion where a 1 st portion (e.g., 1 st elements 301 to 32) having a lamination direction of 1 st direction and a 2 nd portion (e.g., 3 rd elements 301 to 34) having a lamination direction of 2 nd direction orthogonal to the 1 st direction face each other with a solid member interposed therebetween. The solid member may be, for example, an insulating film that covers the plurality of electromagnetic steel plates, respectively.
In the example of fig. 19 and 20, the variable portion CP is provided in the fixed core (1 st member) SC. In the example of fig. 19 and 20, the changing portion CP includes a portion where the fixed core (1 st member) SC and the movable core (2 nd member) MC face each other with a gap therebetween. The latter composition can also be understood as the following composition: the 1 st part and the 2 nd part constituting the variable part CP are provided in the fixed core (1 st member) SC, and the 2 nd part is provided in the movable core (2 nd member) MC. The changing portion CP may be provided in addition to the movable core (the 2 nd member) MC, or may be provided only in the movable core (the 2 nd member) MC. In the examples of fig. 19 and 20, the 2 nd elements 301 to 33, the 3 rd elements 301 to 34, and the 4 th elements 301 to 3 have L-shaped, and the 1 st elements 301 to 32 have rectangular parallelepiped shapes.
Fig. 21 schematically shows a configuration of another modification of the micro-electromagnet 101-3 according to embodiment 3. The micro-electromagnet 101-3 may include a fixed iron core (1 st member) SC, a supporting member 201a-30 supporting the fixed iron core SC, a movable iron core (2 nd member) MC, a supporting member 101-31 supporting the movable iron core MC, and a coil 201a-36. The fixed core (1 st component) SC may include 1 st elements 201a-32, 2 nd elements 201a-33, 3 rd elements 201a-34, and 4 th elements 201a-35. The movable iron core (2 nd component) MC may include the elements 101 to 38, but may include 1 or more other elements in addition to the elements 101 to 38. The fixed core (1 st member) SC may have a 1 st end face E1, and the movable core (2 nd member) MC may have a 2 nd end face E2 facing the 1 st end face E1 with a gap therebetween. In this example, the 1 st end face E1 is provided at each of the 2 nd elements 201a to 33, the 3 rd elements 201a to 34, and the 4 th elements 201a to 35, and the 2 nd end face E2 is provided at the elements 101 to 38. In the modification of fig. 21, the 1 st element 201a-32 has an E-shape, and the coils 201a-36 are wound around the teeth in the center of the 1 st element 201 a-32. In the modification of fig. 21, the 2 nd elements 201a to 33, the 3 rd elements 201a to 34, and the 4 th elements 201a to 35 have rectangular parallelepiped shapes.
Hereinafter, an assembling method or a manufacturing method of the micro-electromagnet 101-3 of the modification of fig. 21 will be described with reference to fig. 27 to 31. Fig. 27 shows a state in which the micro-electromagnet 101-3 of the modified example of fig. 21 is disassembled. The 1 st element 201a-32 and the support member 201a-30 may be bonded by an adhesive, clamping, fitting, or the like. In addition, the coils 201a to 36 and the coil bases 201a to 42 may be bonded by an adhesive material or the like. The 2 nd element 201b-33, the 3 rd element 201b-34, and the 4 th element 201b-35 may be bonded by an adhesive, a clamp, a fitting, or the like through the end member gaskets 201 a-40.
As illustrated in fig. 28, the 1 st element 201a-32 may be inserted into the opening 201a-21 of the micro base 101-2, and the combination of the 1 st element 201a-32 and the support member 201a-30 may be positioned on the micro base 101-2. Also, the support member 201a-30 may be fixed to the micro base 101-2. The support member 201a-30 may be fixed to the micro base 101-2 by, for example, screw fastening, adhesive, clamping, fitting, or the like.
Next, as illustrated in fig. 29, the combination of the coil 201a-36 and the coil base 201a-42 may be positioned on the jog base 101-2, and the coil base 201a-42 may be fixed on the jog base 101-2. The coil base 201a-42 is fixed to the micro base 101-2 by, for example, screw fastening, adhesive, clamping, fitting, or the like.
Next, as illustrated in fig. 30, the tip member bases 201a to 41 are fixed to the jog base 101 to 2 by, for example, screw fastening, adhesive, clamping, fitting, or the like.
Next, as illustrated in fig. 31, the combination of the 2 nd element 201b-33, the 3 rd element 201b-34, the 4 th element 201b-35, and the 2 nd element 201b-33, the 3 rd element 201b-34, and the 4 th element 201b-35 may be fixed to the end member bases 201a-41. This may be accomplished by securing the end piece shims 201a-40 relative to the end piece bases 201a-41 using screw fasteners, adhesives, clamps, fits, or the like.
The state shown in fig. 28 can be returned to the reverse order of the above, as illustrated in fig. 29, the new coil 201a-36 is fixed to the jog base 101-2, and then the replacement of the coil 201a-36 is performed through the order illustrated in fig. 30 and 31.
When the fixed core SC is formed by combining a plurality of elements, for example, there is a possibility that a slight relative displacement occurs between 2 elements along the boundary surface at the boundary of 2 elements (for example, the boundary between the 2 nd element 201a to 33 and the 1 st element 201a to 32), and particles may be generated. As a countermeasure for this, a coating for preventing particles may be applied to the boundary surface, a recovery disk may be provided near the boundary surface, and a trap magnet may be provided near the boundary surface. When the end member shims 201a to 40 are fixed to the end member bases 201a to 41, thin shims may be interposed therebetween, so that the 1 st element 201a to 32 and the 2 nd elements 201a to 33, the 3 rd elements 201a to 34, and the 4 th elements 201a to 35 are maintained in a non-contact state.
The exposure apparatus and the micro-electromagnet 101-3 according to embodiment 4 will be described below. The matters not mentioned in embodiment 4 can be according to embodiments 1 to 3. Fig. 22 exemplarily shows the configuration of the micro-electromagnet 101-3 according to embodiment 4. The micro-electromagnet 101-3 may include a fixed iron core (1 st member) SC, a support member 301a-30 that supports the fixed iron core SC, a movable iron core (2 nd member) MC, a support member 301a-31 that supports the movable iron core MC, and coils 301a-36. The fixed core (1 st component) SC may include 1 st elements 301a-32, 2 nd elements 301a-37, 3 rd elements 301a-33, 4 th elements 301a-34, 5 th elements 301a-35. The movable iron core (2 nd component) MC may include the elements 301a to 38, but may include 1 or more other elements in addition to the elements 301a to 38. The fixed core (1 st member) SC may have a 1 st end face E1, and the movable core (2 nd member) MC may have a 2 nd end face E2 facing the 1 st end face E1 with a gap therebetween. In this example, the 1 st end face E1 is provided at each of the 3 rd elements 301a to 33, 4 th elements 301a to 34, and 5 th elements 301a to 35, and the 2 nd end face E2 is provided at the elements 301a to 38.
The fixed core (1 st member) SC may be constituted by a laminate of a plurality of electromagnetic steel plates. The plurality of electromagnetic steel plates may be respectively covered with an insulating film. From another point of view, the 3 rd elements 301a to 33, 4 th elements 301a to 34, and 5 th elements 301a to 35 constituting a part of the fixed core (1 st member) SC may be constituted by a laminated core in which a plurality of electromagnetic steel plates are laminated. The 1 st element 301a to 32 and the 2 nd element 301a to 37 constituting the other part of the fixed core (1 st member) SC may be formed of wound cores that can be formed by winding electromagnetic steel plates. In addition, in a state where the wound core is used as a component constituting the fixed core (1 st component) SC, the wound core has one form in which a plurality of electromagnetic steel sheets are laminated. The movable core (2 nd member) MC may be constituted by a laminated core in which a plurality of electromagnetic steel plates are laminated. From another point of view, at least 1 elements 301a to 38 constituting the movable iron core (2 nd member) MC may be constituted by a laminate of a plurality of electromagnetic steel plates. The plurality of electromagnetic steel plates may be respectively covered with an insulating film.
The magnetic circuit constituted by the fixed core (1 st member) SC, the movable core (2 nd member) MC, and the void (the space between the 1 st end face E1 and the 2 nd end face E2) may include the changing portions CP, CP' in which the lamination direction of the laminated body of the plurality of electromagnetic steel sheets changes at right angles. The variation portion CP may include a contact portion of a 1 st part (e.g., 5 th elements 301 a-38) having a lamination direction of 1 st direction (e.g., Z-axis direction) and a 2 nd part (e.g., 2 nd elements 301 a-37) having a lamination direction of 2 nd direction (e.g., X-axis direction) orthogonal to the 1 st direction. The variation portion CP may include a portion where a 1 st portion (e.g., 5 th elements 301a to 38) having a lamination direction of 1 st direction and a 2 nd portion (e.g., 2 nd elements 301a to 37) having a lamination direction of 2 nd direction orthogonal to the 1 st direction face each other with a solid member interposed therebetween. The solid member may be, for example, an insulating film that covers the plurality of electromagnetic steel plates, respectively. The changing portion CP' includes a portion in which the lamination direction gradually changes from the 1 st direction (for example, the X-axis direction) to the 2 nd direction (for example, the Z-axis direction) orthogonal to the 1 st direction. The varying portion CP' including the portion in which the lamination direction is slowly varied may be a portion of the wound core. The fixed core (1 st member) SC includes a 1 st portion P1 whose lamination direction is the 1 st direction (for example, X-axis direction) and a 2 nd portion P2 whose lamination direction is the 2 nd direction (for example, Z-axis direction), and the lamination direction is changed slowly between the 1 st portion P1 and the 2 nd portion P2. The variation CP' is a portion between the 1 st portion P1 and the 2 nd portion P2.
In the example of fig. 22, the changing portions CP and CP' are provided in the fixed core (1 st member) SC. At least 1 of the changing portions CP and CP' may be provided additionally to the movable core (the 2 nd member) MC, or may be provided only to the movable core (the 2 nd member) MC. One of the fixed core (1 st member) SC and the movable core (2 nd member) MC may be formed of at least 1 laminated core, the other of the fixed core (1 st member) SC and the movable core (2 nd member) MC may be formed of a wound core, and the changing portion may be formed of a wound core.
The 1 st element 301a to 32, the 2 nd element 301a to 37, the 3 rd element 301a to 33, the 4 th element 301a to 34, and the 5 th element 301a to 35 may be integrated by using an adhesive material or by fastening by using a clamp member. In this example, the changing portions CP, CP' are provided on the fixed core (1 st member) SC, and the coils 301a to 36 are wound around the fixed core (1 st member) SC. The coils 301a to 36 may be wound around portions different from portions of the configuration change portions CP, CP' among the fixed core (1 st member) SC. By passing a current through the coils 301a to 36, attractive force is generated between the 1 st end face E1 and the 2 nd end face E2. In the example of fig. 22, the 1 st elements 301a to 32 and the 2 nd elements 301a to 37 have U-shaped shapes, and the coils 301a to 36 are wound around 1 tooth of the 1 st elements 301a to 32 and 1 tooth-integrated portions of the 2 nd elements 301a to 37.
The changing portions CP and CP' may be provided so that magnetic fluxes passing through a magnetic circuit formed by the fixed core (1 st member) SC, the movable core (2 nd member) MC, and the air gap do not flow through the plurality of electromagnetic steel plates constituting the fixed core SC and the movable core MC in the lamination direction. Alternatively, the variable portions CP, CP', the fixed core (1 st member) SC, and the movable core (2 nd member) MC are provided so that magnetic fluxes passing through the fixed core SC and the movable core MC flow along the surface direction of each electromagnetic steel sheet. Alternatively, the changing portions CP and CP 'may be provided so that the magnetic resistance of the magnetic circuit formed by the fixed core (1 st member) SC, the movable core (2 nd member) MC, and the gap is smaller than that in the case where the changing portions CP and CP' are not provided. Alternatively, the changing portions CP and CP 'may be provided so that eddy currents generated in the magnetic circuit formed by the fixed core (1 st member) SC, the movable core (2 nd member) MC, and the gap are smaller than those in the case where the changing portions CP and CP' are not provided.
In the example of fig. 22, the stacking direction (Z-axis direction) of the 3 rd elements 301a to 33, 4 th elements 301a to 34, and 5 th elements 301a to 35 having the 1 st end face E1 is the same as the stacking direction (Z-axis direction) of the elements 301a to 38 having the 2 nd end face E2. This will help to reduce the reluctance near the void and increase the magnetic flux.
Instead of the configuration example of fig. 22, the stacking direction of the 3 rd elements 301a to 33, the 4 th elements 301a to 34, and the 5 th elements 301a to 35 may be the X-axis direction. Such a configuration contributes to a reduction in magnetic resistance in the vicinity of the boundary portions between the 3 rd elements 301a to 33, 4 th elements 301a to 34, and 5 th elements 301a to 35 and the 1 st elements 301a to 32 and 2 nd elements 301a to 37, and an increase in magnetic flux.
Fig. 23 schematically shows a configuration of a modification of the micro-electromagnet 101-3 according to embodiment 4. The matters not described as modifications may be configured according to embodiment 4 shown in fig. 22. The micro-electromagnet 101-3 may include a fixed iron core (1 st member) SC, a supporting member 301b-30 supporting the fixed iron core SC, a movable iron core (2 nd member) MC, a supporting member 301b-31 supporting the movable iron core MC, and a coil 301b-36. The fixed core (1 st component) SC may include 1 st elements 301b-32, 2 nd elements 301b-33. The movable iron core (2 nd component) MC may include 3 rd elements 301b-37, 4 th elements 301b-38. The fixed core (1 st member) SC may have a 1 st end face E1, and the movable core (2 nd member) MC may have a 2 nd end face E2 facing the 1 st end face E1 with a gap therebetween. In this example, the 1 st end face E1 is provided at each of the 1 st elements 301b to 32 and the 2 nd elements 301b to 33, and the 2 nd end face E2 is provided at each of the 3 rd elements 301b to 37 and the 4 th elements 301b to 38.
The fixed core (1 st member) SC may be constituted by a laminate of a plurality of electromagnetic steel plates. The plurality of electromagnetic steel plates may be respectively covered with an insulating film. From another point of view, the 1 st element 301b to 32 and the 2 nd element 301b to 33 constituting a part of the fixed core (1 st member) SC may be constituted by a laminate of a plurality of electromagnetic steel plates. In addition, in a state where the wound core is used as a component constituting the fixed core (1 st component) SC, the wound core also has one form in which a plurality of electromagnetic steel sheets are laminated. The movable iron core (2 nd member) MC may be constituted by a laminate of a plurality of electromagnetic steel plates. From another point of view, the 3 rd elements 301b to 37 and the 4 th elements 301b to 38 constituting the movable core (2 nd member) MC may be constituted by a laminate of a plurality of electromagnetic steel plates. The plurality of electromagnetic steel plates may be respectively covered with an insulating film.
The magnetic circuit constituted by the fixed core (1 st member) SC, the movable core (2 nd member) MC, and the void (the space between the 1 st end face E1 and the 2 nd end face E2) may include the changing portions CP', CP "in which the lamination direction of the laminated body of the plurality of electromagnetic steel sheets changes at right angles. In this example, the changing portion CP' is provided in the fixed core (1 st member) SC, and the changing portion cp″ is provided in the movable core (2 nd member) MC.
The changing portion CP' includes a portion in which the lamination direction gradually changes from the 1 st direction (for example, the X-axis direction) to the 2 nd direction (for example, the Z-axis direction) orthogonal to the 1 st direction. The varying portion CP' including the portion in which the lamination direction is slowly varied may be a portion of the wound core. The fixed core (1 st member) SC includes a 1 st portion P1 whose lamination direction is the 1 st direction (for example, X-axis direction) and a 2 nd portion P2 whose lamination direction is the 2 nd direction (for example, Z-axis direction), and the lamination direction is changed slowly between the 1 st portion P1 and the 2 nd portion P2. The variation CP' is a portion between the 1 st portion P1 and the 2 nd portion P2.
The movable core (2 nd member) MC includes a 3 rd portion P3 whose lamination direction is the 1 st direction (for example, X-axis direction) and a 4 th portion P4 whose lamination direction is the 2 nd direction (for example, Y-axis direction), and the lamination direction is changed slowly between the 3 rd portion P3 and the 4 th portion P4. The variation cp″ is a portion between the 3 rd portion P3 and the 4 th portion P4.
By flowing a current through the coils 301b to 36, attractive force is generated between the 1 st end face E1 and the 2 nd end face E2. In the example of fig. 23, the 1 st elements 301b to 32 and the 2 nd elements 301b to 33 have U-shaped shapes, and the coils 301b to 36 are wound around the portions where 1 tooth of the 1 st elements 301a to 32 and 1 tooth of the 2 nd elements 301a to 37 are integrated.
The changing portions CP' and cp″ may be provided so that magnetic fluxes passing through a magnetic circuit formed by the fixed core (1 st member) SC, the movable core (2 nd member) MC, and the air gap do not flow through the plurality of electromagnetic steel plates constituting the fixed core SC and the movable core MC in the lamination direction thereof. Alternatively, the changing portions CP', CP ", the fixed core (1 st member) SC, and the movable core (2 nd member) MC may be provided so that magnetic fluxes passing through the fixed core SC and the movable core MC flow along the surface direction of each electromagnetic steel plate. Alternatively, the changing portions CP 'and cp″ may be provided such that the magnetic resistance of the magnetic circuit formed by the fixed core (1 st member) SC, the movable core (2 nd member) MC, and the gap is smaller than that in the case where the changing portions CP' and cp″ are not provided. Alternatively, the changing portions CP 'and cp″ may be provided so that eddy currents generated in the magnetic circuit formed by the fixed core (1 st member) SC, the movable core (2 nd member) MC, and the gap are smaller than those in the case where the changing portions CP' and cp″ are not provided.
In the example of fig. 23, the stacking direction (X-axis direction) of the 1 st element 301b-32 and the 2 nd element 301b-33 at the 1 st end face E1 is the same as the stacking direction (X-axis direction) of the 3 rd element 301b-37 and the 4 th element 301b-38 at the 2 nd end face E2. This will help to reduce the reluctance near the void and increase the magnetic flux. In the example of fig. 23, in the magnetic circuit including the fixed core (1 st member) SC, the movable core (2 nd member) MC, and the gap, the lamination direction does not change sharply, which is advantageous in that the magnetic resistance is reduced and the magnetic flux is increased.
The structure of the support members 301b-31 supporting the movable iron core MC is exemplarily shown in fig. 24. The support members 301b-31 may have a star wheel shape for supporting the movable iron core MC, which may be constituted by a wound iron core.
Here, the wound core will be described with reference to fig. 32. Fig. 32 (a) illustrates a wound core. Fig. 32 (b) shows a wound core obtained by cutting the wound core illustrated in fig. 32 (a) by wire cutting or the like, and such a wound core is also called a cut core. The wound core may be manufactured by winding a ring material around a core not shown. As illustrated in fig. 33, the ring material can be manufactured by a slitter illustrated in fig. 33. The raw coil is conveyed in the direction of the passing plate, and cut by a slitter provided in the middle and including a circular knife to a desired width to obtain a loop material. The width is determined by the spacing of the circular knives of the slitter.
As illustrated in fig. 32 (a), the wound core is a laminate of a plurality of electromagnetic steel sheets, and 1 wound core has a plurality of lamination directions. In other words, the wound core can be used as a member constituting the aforementioned changing portion. The lamination direction is a direction penetrating the fixation portion in the wound core in a direction perpendicular to the electromagnetic steel sheet. The width direction is a direction determined by the slitter and is also an axial direction. The axial direction is a direction parallel to any portion of the largest surface of each electromagnetic steel sheet.
In one aspect, an electromagnetic device according to the present invention may include a plurality of core members each including a laminated core or a wound core, and a coil for generating magnetic flux in the core members. Here, the lamination direction of a certain laminated core may be orthogonal to the width direction of a certain wound core, or the lamination direction of a certain laminated core may be orthogonal to the lamination direction of another laminated core, or the width direction of a certain wound core may be orthogonal to the width direction of another wound core.
The control system of the wafer stage apparatus 500 will be described below. Fig. 25 schematically shows a configuration of a control system of the wafer stage apparatus 500. The moving object providing unit 5101 provides a moving object. The position map generator 5102 generates a position map indicating a relationship between time and the position of the jog carrier 101-1 at that time, based on the moving target supplied from the moving target supply unit 5101. In addition, the position profile generator 5102 generates a target position from the generated position profile. The acceleration profile generator 5103 generates an acceleration profile indicating a relationship between time and acceleration of the jog stage 101-1 at that time, based on the moving object supplied from the moving object supply unit 5101. In addition, the acceleration profile generator 5103 generates a target acceleration from the generated acceleration profile. Fig. 26 illustrates a position profile generated by the position profile generator 5102 and an acceleration profile generated by the acceleration profile generator 5103.
The jog position sensor 5156 measures the position of the jog stage 101-1. The jog position control system 5121 generates an operation amount by PID calculation or the like in correspondence with a deviation of the target position supplied from the position map generated by the position map generator 5102 and the current position supplied from the jog position sensor 5156. The current amplifier 5122 supplies a current corresponding to the operation amount generated by the jog position control system 5121 to the jog XLM101-4 and the jog YLM 101-5. Thus, the micro stage 101-1 is feedback controlled.
The coarse position sensor 5135 measures the position of the jog base 101-2. The coarse movement position control system 5133 generates an operation amount by PID calculation or the like in accordance with a deviation of the target position provided from the position map generated by the position map generator 5102 and the current position provided by the coarse movement position sensor 5135. The current amplifier 5131 supplies a current corresponding to the operation amount generated by the coarse movement position control system 5133 and the target acceleration supplied from the acceleration profile generator 5103 to the coarse linear motor 106. Thus, the jog base 101-2 is feedback controlled and feedforward controlled.
The target acceleration generated by the acceleration profile generator 5103 is also supplied to the electromagnet current control system 5515, and the electromagnet current control system 5515 controls the micro-electromagnet 101-3 in accordance with the target acceleration. At the time of acceleration of the micro-motion stage 101-1 (micro-motion stage device 101), the micro-motion electromagnet 101-3 mainly provides force to the micro-motion stage 101-1. The jog XLM101-4, jog YLM101-5 may be controlled to generate a thrust force for reducing a minute positional deviation between the target position and the measured current position. Thus, the heat generated by the jog XLM101-4, jog YLM101-5 will be reduced.
The coarse position control system 5133 moves the position of the jog base 101-2 in accordance with the position profile generated by the position profile generator 5102. The micro-electromagnet 101-3 advantageously produces a large attractive force with minimal heat generation. However, it is necessary to maintain a gap between the 1 st end face E1 and the 2 nd end face E2 of the micro-electromagnet 101-3. That is, in order to continuously provide a desired force to the micro-motion stage 101-1 by the micro-motion electromagnet 101-3, it is necessary to learn the movement of the micro-motion stage 101-1 to move the stator (fixed iron core and coil) of the micro-motion electromagnet 101-3 to maintain the gap. In addition, the heat generated by the micro-motion ZLM may be reduced by reducing the height of the micro-motion electromagnet 101-3 on the micro-motion base 101-2. With the above configuration, highly accurate position control of the micro-stage 101-1, reduction of heat generation, and reduction of overlay error can be achieved.
What achieves this is a coarse position control system 5133. The coarse position, i.e., the position of the jog dial 101-2, is measured by the coarse position sensor 5135, which is represented by an encoder, based on its deviation from the target position, the coarse linear motor 106 is driven by the coarse position control system 5133. As a result, the position of the micro stage 101-1 (mover of the micro electromagnet 101-3) and the position of the micro base 101-2 (stator of the micro electromagnet 101-3) are controlled based on the output of the position map generator 5102, and the gap is maintained. The jog position sensor 5156 for measuring the position of the jog mount 101-1 may be replaced with a sensor for measuring the relative position of the jog mount 101-1 and the jog base 101-2.
The present invention is not limited to the above-described embodiments, and various modifications and changes can be made within the scope of the inventive concept.
Description of the reference numerals
SC: fixed iron core (1 st component), MC: movable iron core (2 nd component), 101-1: micro-motion stage, 101-2: micro-motion base, 101-36: a coil.

Claims (26)

1. A stage device for holding a substrate, characterized in that,
the stage device includes: a coarse movement carrier; a coarse actuator for driving the coarse movement stage along a predetermined plane; a micro-motion stage for holding the substrate; a jog actuator for adjusting the position and posture of the jog stage relative to the jog stage; and an electromagnetic actuator for transmitting the thrust force supplied from the coarse actuator to the coarse motion stage to the fine motion stage in a noncontact manner,
the electromagnetic actuator includes: a movable iron core fixed on the micro-motion carrier; a fixed iron core fixed on the coarse moving carrier; and a coil wound around the fixed core, wherein a shortest distance between the substrate and the coil held by the micro-motion stage is greater than a shortest distance between the substrate and the fixed core.
2. The stage apparatus of claim 1, wherein,
The central axis of the coil is parallel to the plane.
3. The stage device according to claim 2, wherein,
the fixed core has a 1 st end surface facing the movable core, and a distance between the substrate held by the micro-motion stage and the center axis of the coil is longer than a distance between the substrate held by the micro-motion stage and the center of the 1 st end surface.
4. The stage apparatus of claim 1, wherein,
in a cross section perpendicular to the plane and parallel to the central axis of the coil, the fixed core includes a portion having a crank shape.
5. The stage apparatus of claim 1, wherein,
the central axis of the coil is disposed at an oblique angle with respect to the plane.
6. The stage apparatus of claim 1, wherein,
in a cross section perpendicular to the plane and parallel to the central axis of the coil, the fixed core includes a portion having an L shape.
7. The stage apparatus of claim 6, wherein,
the central axis of the coil is disposed at an angle perpendicular to the plane.
8. The stage apparatus of claim 7, wherein,
The coarse movement carrier has an opening, and a part of the fixed iron core is disposed in the opening.
9. The stage apparatus of claim 1, wherein,
the central axis of the coil is disposed at an angle perpendicular to the plane.
10. The stage device according to any one of claim 1 to 9, wherein,
the fixed core and the movable core form a magnetic circuit, the magnetic circuit includes a laminated body including a plurality of electromagnetic steel plates, and the laminated body includes a changing portion in which a lamination direction of the plurality of electromagnetic steel plates changes at right angles.
11. The stage apparatus of claim 10, wherein,
the changing portion includes a contact portion between a 1 st portion having the stacking direction of 1 st direction and a 2 nd portion having the stacking direction of 2 nd direction orthogonal to the 1 st direction.
12. The stage apparatus of claim 10, wherein,
the changing portion includes a portion where the 1 st portion having the 1 st stacking direction and a 2 nd portion having the 2 nd direction orthogonal to the 1 st direction face each other with a solid member interposed therebetween.
13. The stage apparatus of claim 10, wherein,
The changing portion is provided on at least one of the fixed core and the movable core.
14. The stage apparatus of claim 10, wherein,
the changing portion includes a portion 1 in which the stacking direction is a 1 st direction and a portion 2 in which the stacking direction is a 2 nd direction orthogonal to the 1 st direction, the portion facing each other with a gap therebetween.
15. The stage apparatus of claim 14, wherein,
the 1 st part is provided on the fixed core, and the 2 nd part is provided on the movable core.
16. The stage apparatus of claim 10, wherein,
the fixed core and the movable core are each composed of at least 1 laminated core.
17. The stage apparatus of claim 10, wherein,
at least one of the fixed iron cores and the movable iron cores is composed of a plurality of laminated iron cores.
18. The stage apparatus of claim 17, wherein,
the plurality of laminated cores are disposed close to each other and fixed by a fixing member.
19. The stage apparatus of claim 10, wherein,
the changing portion includes a portion in which the stacking direction gradually changes from the 1 st direction to a 2 nd direction orthogonal to the 1 st direction.
20. The stage apparatus of claim 11, wherein,
the changing portion is formed by a wound iron core.
21. The stage apparatus of claim 10, wherein,
one of the fixed iron cores and the movable iron core includes at least 1 laminated iron core,
the other one of the fixed iron core and the movable iron core includes a wound iron core,
the changing portion is formed of the wound core.
22. The stage apparatus of claim 10, wherein,
the fixed iron core and the movable iron core are respectively formed by winding iron cores,
the axial direction of the wound core constituting the fixed core and the axial direction of the wound core constituting the movable core are orthogonal to each other,
the changing portions are formed by the wound cores constituting the fixed core and the wound cores constituting the movable core, respectively.
23. The stage apparatus of claim 10, wherein,
the changing portion is provided on the fixed core, and the coil is wound around the fixed core.
24. The stage apparatus of claim 23, wherein,
the coil is wound around a portion of the fixed core different from a portion where the changing portion is disposed.
25. A transfer device for transferring a master pattern to a substrate, characterized in that,
the transfer device includes the stage device according to claim 1.
26. A method for manufacturing an article, characterized in that,
the method for manufacturing the article comprises the following steps:
a transfer step of transferring the original pattern to a substrate by the transfer device according to claim 25; and
and a step of obtaining an article from the substrate subjected to the transfer step.
CN202310459709.7A 2022-04-28 2023-04-25 Stage device, transfer device, and article manufacturing method Pending CN116974147A (en)

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JP3484684B2 (en) 1994-11-01 2004-01-06 株式会社ニコン Stage apparatus and scanning type exposure apparatus
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