CN116974146A - Stage device, transfer device, and article manufacturing method - Google Patents

Stage device, transfer device, and article manufacturing method Download PDF

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Publication number
CN116974146A
CN116974146A CN202310456559.4A CN202310456559A CN116974146A CN 116974146 A CN116974146 A CN 116974146A CN 202310456559 A CN202310456559 A CN 202310456559A CN 116974146 A CN116974146 A CN 116974146A
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CN
China
Prior art keywords
micro
stage
core
fixed
stage device
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Pending
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CN202310456559.4A
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Chinese (zh)
Inventor
佐藤健
神谷重雄
是永伸茂
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Publication of CN116974146A publication Critical patent/CN116974146A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
    • H02K41/02—Linear motors; Sectional motors
    • H02K41/03—Synchronous motors; Motors moving step by step; Reluctance motors
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
    • H02P25/00—Arrangements or methods for the control of AC motors characterised by the kind of AC motor or by structural details
    • H02P25/02—Arrangements or methods for the control of AC motors characterised by the kind of AC motor or by structural details characterised by the kind of motor
    • H02P25/06—Linear motors
    • H02P25/064—Linear motors of the synchronous type

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Electromagnetism (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Linear Motors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention provides a stage device, a transfer device and an article manufacturing method. The stage device for holding a substrate includes: a coarse movement carrier; a coarse movement actuator for driving the coarse movement stage along a predetermined plane; a micro-motion stage for holding a substrate; a micro actuator for adjusting the position and posture of the micro stage relative to the coarse stage; and an electromagnetic actuator for transmitting the thrust force provided by the coarse movement actuator to the coarse movement stage in a noncontact manner, the electromagnetic actuator including: the fixed iron core is fixed on the coarse moving carrier and provided with a first end face; a coil wound around the fixed core; and a movable iron core fixed to the micro carrier and having a second end surface facing the first end surface, wherein a maximum value of a difference obtained by subtracting the second distance from the first distance is larger than a positive predetermined value, the first distance is a distance from the substrate held by the micro carrier to a position farthest from the substrate among the first end surface, and the second distance is a distance from the substrate held by the micro carrier to a position farthest from the substrate among the second end surface.

Description

Stage device, transfer device, and article manufacturing method
Technical Field
The invention relates to a stage device, a transfer device and an article manufacturing method.
Background
The transfer device for transferring the original pattern to the substrate may include: a coarse movement stage driven by a coarse movement actuator; and a micro stage disposed on the rough stage and holding the substrate. A micro actuator for adjusting the position and posture of the micro stage relative to the macro stage may be disposed between the macro stage and the micro stage. Further, an electromagnetic actuator for transmitting the thrust force supplied from the coarse movement actuator to the fine movement stage to the coarse movement stage in a noncontact manner may be disposed between the coarse movement stage and the fine movement stage.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open publication No. 2005-109522
Patent document 2: japanese patent laid-open No. 8-130179
Disclosure of Invention
Problems to be solved by the invention
When the micro-motion stage is accelerated, a moment acts on the micro-motion stage. When the micro actuator is operated to cancel out such moment, heat generation from the micro actuator increases. This heat generation causes deformation of the micro-motion stage, which causes a decrease in alignment accuracy.
The present invention aims to provide a technique which is advantageous in reducing moment acting on a jog carrier.
Means for solving the problems
A first aspect of the present invention relates to a stage apparatus for holding a substrate, the stage apparatus including: a coarse movement carrier; a coarse movement actuator for driving the coarse movement stage along a predetermined plane; a micro-motion stage for holding the substrate; a micro actuator for adjusting the position and posture of the micro stage relative to the coarse stage; and an electromagnetic actuator for transmitting a thrust force provided to the coarse motion stage by the coarse motion actuator to the fine motion stage in a noncontact manner, the electromagnetic actuator comprising: the fixed iron core is fixed on the coarse moving carrier and provided with a first end face; a coil wound around the fixed core; and a movable iron core fixed to the micro stage and having a second end surface facing the first end surface, wherein a maximum value of a difference obtained by subtracting a second distance from a first distance from the substrate held by the micro stage to a position farthest from the substrate among the first end surfaces is larger than a positive predetermined value, and the second distance from the substrate held by the micro stage to a position farthest from the substrate among the second end surfaces.
A second aspect of the present invention relates to a transfer device for transferring a pattern of an original plate to a substrate, the transfer device including the stage device according to the first aspect.
A third aspect of the present invention relates to an article manufacturing method including: a transfer step of transferring the original pattern to the substrate by the transfer device according to the second aspect; and a step of obtaining an article from the substrate on which the transfer step has been performed.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, a technique advantageous for reducing moment acting on a micro motion stage can be provided.
Drawings
Fig. 1 is a diagram schematically showing the structure of an exposure apparatus according to an embodiment.
Fig. 2 is a diagram schematically showing a structure of a wafer stage device according to an embodiment.
Fig. 3 is a diagram schematically showing a structure of a wafer stage device according to an embodiment.
Fig. 4 is a diagram schematically showing the structure of a micro stage device according to an embodiment.
Fig. 5 is a diagram schematically showing the structure of a coarse movement stage device according to an embodiment.
Fig. 6 is a diagram schematically showing the structure of a thick linear motor according to an embodiment.
Fig. 7 is a diagram exemplarily showing a layout of an exposure unit.
Fig. 8 is a diagram schematically showing a configuration of a micro-electromagnet incorporated in an exposure apparatus or a wafer stage apparatus according to the first embodiment.
Fig. 9 is a diagram schematically showing a configuration of a micro-electromagnet incorporated in an exposure apparatus or a wafer stage apparatus according to the first embodiment.
Fig. 10 is a diagram schematically showing a configuration of a micro stage device incorporated in an exposure apparatus or a wafer stage device according to the first embodiment.
Fig. 11 is a diagram for explaining a preferable structure and arrangement of the fixed core and the movable core.
Fig. 12 is a diagram schematically showing a configuration of a micro-electromagnet incorporated in an exposure apparatus or a wafer stage apparatus according to the second embodiment.
Fig. 13 is a diagram schematically showing a configuration of a micro-electromagnet incorporated in an exposure apparatus or a wafer stage apparatus according to the second embodiment.
Fig. 14 is a diagram schematically showing a configuration of a micro stage device incorporated in an exposure device or a wafer stage device according to the second embodiment.
Fig. 15 is a diagram for explaining moment acting on the jog carrier.
Fig. 16 is a diagram schematically showing a configuration of a modified example of the micro-electromagnet incorporated in the exposure apparatus or the wafer stage apparatus according to the second embodiment.
Fig. 17 is a diagram schematically showing a configuration of a modified example of the micro-electromagnet incorporated in the exposure apparatus or the wafer stage apparatus according to the second embodiment.
Fig. 18 is a diagram schematically showing a configuration of another modified example of the micro-electromagnet incorporated in the exposure apparatus or the wafer stage apparatus according to the second embodiment.
Fig. 19 is a diagram schematically showing a configuration of a micro-electromagnet incorporated in an exposure apparatus or a wafer stage apparatus according to a third embodiment.
Fig. 20 is a diagram schematically showing a configuration of a modified example of a micro-electromagnet incorporated in an exposure apparatus or a wafer stage apparatus according to the third embodiment.
Fig. 21 is a diagram schematically showing a structure of a support member of a movable iron core in a modification of the micro-electromagnet according to the third embodiment.
Fig. 22 is a diagram schematically showing a configuration of a control system of the wafer stage device according to the embodiment.
Fig. 23 is a diagram exemplarily showing a position profile and an acceleration profile.
Fig. 24 is a diagram for explaining an assembling method or a manufacturing method of another modified example of the micro-electromagnet of the second embodiment.
Fig. 25 is a diagram for explaining an assembling method or a manufacturing method of another modified example of the micro-electromagnet of the second embodiment.
Fig. 26 is a diagram for explaining an assembling method or a manufacturing method of another modified example of the micro-electromagnet of the second embodiment.
Fig. 27 is a diagram for explaining an assembling method or a manufacturing method of another modified example of the micro-electromagnet of the second embodiment.
Fig. 28 is a diagram for explaining an assembling method or a manufacturing method of another modified example of the micro-electromagnet of the second embodiment.
Fig. 29 is a view for exemplarily explaining a wound core.
Fig. 30 is a diagram for exemplarily explaining a manufacturing method of the wound core.
Fig. 31 is a diagram for explaining eddy currents generated in an iron core having a complex three-dimensional shape.
Description of the reference numerals
SC: fixed iron core (first member), MC: movable iron core (second member), 101-1: micro-motion stage, 101-2: micro-motion base, 101-36: a coil.
Detailed Description
Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. The following embodiments are not limited to the embodiments according to the claims, and not all combinations of the features described in the embodiments are essential to the invention. Two or more of the features described in the embodiments may be combined arbitrarily. The same or similar components are denoted by the same reference numerals, and redundant description thereof is omitted.
In the following description, directions are described based on an XYZ coordinate system. The XY plane defined by the X axis and the Y axis is typically a horizontal plane, and the Z axis is typically parallel to the vertical direction. The XY direction is a direction parallel to the XY plane. The X-axis direction is a direction parallel to the X-axis, the Y-axis direction is a direction parallel to the Y-axis, and the Z-axis direction is a direction parallel to the Z-axis.
Fig. 1 schematically shows a configuration of an exposure apparatus according to an embodiment. The exposure apparatus can be understood as an example of a positioning apparatus that relatively positions a first object (for example, a substrate) and a second object (for example, a master), or a transfer apparatus that transfers a pattern of the master (reticle) to the substrate (wafer). The stage plate 692 may be disposed above the floor 691 with a carrier therebetween, and the wafer stage apparatus 500 may be disposed thereon. Further, a barrel plate 696 may be disposed above the floor 691 via a bracket 698. The projection optical system 687 and the reticle stage 694 may be supported by a barrel stage 696. A reticle stage apparatus 695 may be disposed above reticle stage 694. An illumination optical system 699 may be disposed above the reticle stage 694. The illumination optical system 699 can project an image of a reticle placed on a reticle stage of the reticle stage device 695 onto a wafer placed on a wafer stage of the wafer stage device 500, thereby transferring a pattern of the reticle onto the wafer. The exposure apparatus may be configured as a scanning exposure apparatus.
The wafer stage apparatus 500 can be understood as a first positioning mechanism that positions a substrate serving as a first object, and the reticle stage apparatus 695 can be understood as a second positioning mechanism that positions a reticle serving as a second object. At least one of the first positioning mechanism and the second positioning mechanism may include an electromagnetic device or an electromagnetic actuator described below.
The exposure apparatus or the transfer apparatus described above can be used in an article manufacturing method for manufacturing an article such as a semiconductor device. The article manufacturing method may include: a transfer step of transferring the original pattern to the substrate by the exposure device or the transfer device; and a step of processing the substrate subjected to the transfer step to obtain an article. The processing of the substrate may include, for example, etching, film formation, dicing, and the like.
Fig. 2 schematically shows the overall structure of the wafer stage apparatus 500. The XY slider 104 is slidably disposed on the stage base 105 in the XY direction. The XY slider 104 can transmit force in the X axis direction through the X slider 102 and force in the Y axis direction through the Y slider 103. The micro-motion stage device 101 can be mounted on the XY slider 104. Coarse linear motors 106 for driving the X slider 102 and the Y slider 103 in the X axis direction and the Y axis direction, respectively, may be provided on both sides of each.
Fig. 3 schematically illustrates a wafer stage device 500 in which a micro stage (micro top plate) 101-1 of a micro stage device 101 is moved upward for convenience. The micro-motion stage 101-1 holds a wafer. The micro-motion stage 101-1 can also be understood as a structure having a chuck for holding a wafer. The micro-motion base 101-2 may be fixed above the XY slider 104. Above the jog base 101-2, 4 jog ZLM (first jog actuator) 101-6 performing precise positioning of Z tilt may be provided. In addition, above the jog base 101-2, 2 jog XLM (second jog actuator) 101-4 performing precise positioning of the X axis and around the Z axis may be provided. Additionally, above the jog base 101-2, 2 jog YLMs (third jog actuators) 101-5 can be provided for the Y axis and for precise positioning around the Z axis. In the center of the micro base 101-2, a micro electromagnet 101-3 that functions to transmit acceleration forces in the X-axis and Y-axis directions supplied to the XY slider 104 to the micro base 101-2 may be provided.
Here, the jog base 101-2 can be understood as a jog stage. Alternatively, the XY slider 104 and the jog mount 101-2 may be understood as a jog mount. The coarse linear motor 106 can be understood as a coarse movement actuator that drives the jog mount 101-2 serving as a coarse movement stage along the XY plane, that is, a predetermined plane. In addition, the jog ZLM101-6, jog XLM101-4, and Y jog YLM101-5 can be understood as jog actuators for adjusting the position and posture of jog stage 101-1 with respect to jog base 101-2 serving as a jog stage. In addition, the micro-motion electromagnet 101-3 can be understood as an electromagnetic actuator for transmitting, in a noncontact manner, the thrust force provided to the micro-motion stage 101-1 serving as a coarse motion stage by the coarse linear motor 106 serving as a coarse motion actuator, to the micro-motion stage 101-1.
Fig. 4 shows a structure of the micro-motion stage device 101, in particular, detailed structural examples of the micro-motion YLM101-5 and the micro-motion ZLM 101-6. Fig. 4 shows a state in which a part of the yoke is removed. The inching YLM101-5 may be comprised of a linear motor. The micro-moving YLM101-5 may include a micro-moving YLM coil base 101-52, a micro-moving YLM coil 101-51, a micro-moving YLM magnet 101-53, a micro-moving YLM yoke 101-54, a micro-moving LM shim 101-70. A jog arm coil base 101-52 may be secured over jog base 101-2, upon which jog arm coil 101-51 is secured. The micro-movement YLM coil 101-51 may be an oblong coil having a straight line portion extending in the vertical direction, and 4 micro-movement YLM magnets 101-53 may be disposed so as to face the straight line portion with a gap therebetween. The 2 YLM yokes 101 to 54 for passing magnetic flux may be arranged so as to sandwich the magnets. The magnetization direction of the magnets may be in the X-axis direction, the magnets adjacent to each other in the Y-axis direction may be opposite in polarity, and the magnets aligned in the X-axis direction may be the same in polarity. Micro LM shims 101-70 may be used to maintain their position against the attractive forces acting on a pair of magnets and yokes. Magnets, yokes, shims may be secured to the micro base 101-2. By flowing a current in the YLM coil 101-51, a force proportional to the current can be generated in a direction orthogonal to the straight line portion, that is, in the Y-axis direction. In addition, a moment about the Z-axis can be generated by flowing currents in opposite directions to each other to the 2 jog YLMs 101-5.
The micro ZLM101-6 may be constituted by a linear motor. The micro ZLM101-6 may include a micro ZLM coil base 101-62, a micro ZLM coil 101-61, a micro ZLM magnet 101-63, a micro ZLM yoke 101-64, and a micro LM shim 101-70. A micro ZLM coil base 101-62 may be fixed on the micro base 101-2, on which micro ZLM coils 101-61 are fixed. The micro ZLM coil 101-61 may be an oblong coil having a straight line portion extending in the horizontal direction, and 4 micro ZLM magnets 101-63 may be disposed so as to face the straight line portion with a gap therebetween. The 2 ZLM yokes 101 to 64 for passing magnetic flux may be arranged so as to sandwich the magnets. The magnetization direction of the magnets may be in the X-axis direction, the magnets adjacent to each other in the Z-axis direction may be opposite in polarity, and the magnets aligned in the X-axis direction may be the same in polarity. Micro LM shims 101-70 may be used to maintain their position against the attractive forces acting on a pair of magnets and yokes. Magnets, yokes, shims may be fixed to the micro top plate 101. By flowing a current through the ZLM coil 101-61, a force proportional to the current can be generated in a direction orthogonal to the straight line portion, that is, in the Z-axis direction. In addition, by combining the directions of the currents flowing in the 4 micro ZLMs 101-6, a moment around the X axis and a moment around the Y axis can be generated.
Micro XLM101-4 is the same structure as micro YLM101-5 and has a configuration in which micro YLM101-5 is rotated 90 degrees. Thereby, a force in the X-axis direction and a moment around the Z-axis can be generated.
In addition, 4 pin units 101-39 may be provided, and they may function as temporary places when the wafer is recovered from above the micro stage 101 and when the wafer is placed on the micro stage 101-1. The number of pin units 101 to 39 is preferably 3 or more for stable temporary placement of wafers, but if it is 1 at the minimum, handover can be achieved. The pin units 101 to 39 have a lifting mechanism for lifting pins for temporarily placing or mounting wafers. The pin units 101-39 may have the following functions: driving the pins so as to form a first state in which the upper ends of the pins protrude from the upper surface of the micro-motion stage 101-1; and driving the pins so as to form a second state in which the upper ends of the pins retreat downward from the upper surface of the micro stage 101-1. In an operation of mounting a wafer on the micro stage 101-1, the pin unit 101-39 receives the wafer from a not-shown conveyance mechanism in the first state, and then delivers the wafer on the pins to the micro stage 101-1 in the transition to the second state. In an operation of transferring the wafer placed on the micro stage 101-1 to a not-shown conveyance mechanism, the pin unit 101-39 shifts the pins from the second state to the first state. The pin units 101-39 receive the wafer placed on the micro stage 101-1 by pins during this process, and deliver the wafer to a not-shown conveyance mechanism in a first state.
The micro-motion stage device 101 may not include the pin units 101-39, and in this case, the micro-motion ZLM101-6 may drive the micro-motion stage 101-1 upward to transfer the wafer to and from a not-shown conveyance mechanism.
Fig. 5 exemplarily shows a detailed structure of the coarse movement stage device, particularly, the X slider 102, the Y slider 103, and the XY slider 104. The XY slider 104 may include an XY slider lower member 104-3, an XY slider middle member 104-2, and an XY slider upper member 104-1. The XY slider lower member 104-3 is supported slidably in the XY direction on the stage base 105, on which the XY slider middle member 104-2 is arranged, and on which the XY slider upper member 104-1 is arranged.
The X slider 102 may include an X beam 102-1, 2X feet 102-2, 2X yaw guides 102-3. The 2X yaw guides 102-3 may be fixed to 2 sides of the stage base 105. The 2X legs 102-2 may be joined by an X beam 102-1. The one X leg 102-2 faces the side surface of the one X yaw guide 102-3 and the upper surface of the stage base 105 with a gap therebetween, and is supported slidably in the X axis direction. The other X leg 102-2 faces the side surface of the other X yaw guide 102-3 and the upper surface of the stage base 105 with a gap therebetween, and is supported slidably in the X axis direction. Thus, the X-beam 102-1 and the 2X-legs 102-2 are slidably disposed in the X-axis direction. The two side surfaces of the X beam 102-1 slidably face the inner side surface of the XY slider intermediate member 104-2 with a minute gap therebetween, and the XY slider 104 can be slidably restrained in the XY direction.
The Y slider 103 may include a Y-beam 103-1, a Y-foot 103-2, and a Y-yaw guide 103-3. 2Y yaw guides 103-3 are fixed to 2 sides of the stage base 105, and 2Y legs 103-2 may be connected by Y beams 103-1. The one Y leg 103-2 faces the side surface of the one Y yaw guide 103-3 and the upper surface of the stage base 105 with a gap therebetween, and is supported slidably in the Y axis direction. The other Y leg 103-2 faces the side surface of the other Y yaw guide 103-3 and the upper surface of the stage base 105 with a gap therebetween, and is supported slidably in the Y axis direction. Thus, the integrated body of the Y beam 103-1 and the 2Y legs 103-2 is slidably disposed in the X-axis direction. The two side surfaces of the Y beam 103-1 are slidably faced to the inner side surface of the XY slider upper member 104-1 with a minute gap therebetween, and the XY slider 104 can be slidably restrained in the XY direction.
The detailed structure of the thick linear motor 106 is schematically shown in fig. 6. The coarse linear motor 106 may include a plurality of linear motor coils 106-1, a coil support plate 106-2, a strut 106-3, a coil base 106-4, 2 linear motor magnets 106-5, a yoke 106-6, 2 shims 106-7, and an arm 106-8.
The plurality of linear motor coils 106-1 may be 2-phase coil units in which phases of adjacent linear motor coils 106-1 are different from each other by 90 degrees. A plurality of linear motor coils 106-1 may be secured to the coil support plate 106-2 via struts 106-3 to the coil base 106-4. The coil base 106-4 may be fixed to the stage plate 692, or may be supported slidably by the stage plate 692 in the coil arrangement direction. In the structure in which the coil base 106-4 is slidably supported, the reaction of acceleration can be absorbed. The 2 linear motor magnets 106-5 may be 4-pole magnet units, respectively, which may be arranged to sandwich the linear motor coil 106-1 from above and below via a gap.
A yoke 106-6 may be disposed on the back surface of each linear motor magnet 106-5. Shims 106-7 may be used to maintain the gap of 2 linear motor magnets 106-5 against the attractive force. The structure composed of the linear motor magnet 106-5, yoke 106-6, and spacer 106-7 can be fixed to the X leg 102-2 or the Y leg 103-2 via the arm 106-8. The structure can provide thrust in the X-axis direction and the Y-axis direction for an integrated body of the X beam and 2X legs and an integrated body of the Y beam and 2Y legs. In this configuration, a sinusoidal current corresponding to the position is applied to the coil facing the magnet among the coils of 2 phases, so that a force can be continuously generated.
An arrangement of a plurality of exposure cell areas on a wafer 700, i.e., an exposure cell layout diagram, is illustratively shown in fig. 7. The exposure unit regions 701 having dimensions in the X-axis direction and dimensions in the Y-axis direction of Sx and Sy, respectively, may be disposed on the wafer 700. The plurality of exposure unit areas 701 are subjected to scanning exposure along a step/scan trajectory, for example. The micro-motion stage 101-1 can perform scanning drive of the scanning amount of the reticle stage at 1/projection magnification of the scanning amount of the reticle stage in the Y-axis direction in synchronization with the reticle stage at the time of scanning exposure. When the scanning exposure is completed, the jog stage 101-1 can perform a U-turn in the Y-axis direction and step in the X-axis direction, and then perform scanning exposure of the next exposure unit area. An electromagnet is used for acceleration of the micro-motion stage 101-1, and a linear motor is used for position control, whereby high-precision position control and low heat generation can be achieved at the same time.
When the micro motion stage 101-1 is accelerated, a moment can be applied to the micro motion stage 101-1. When the micro ZLM101-6 is operated to cancel out such moment, heat generation from the micro ZLM101-6 is increased. This heat generation causes deformation of the micro-motion stage 101-1, which causes a decrease in overlay accuracy.
In order to suppress heat generation from the micro-motion ZLM101-6, it is effective to reduce the moment acting on the micro-motion stage 101-1 when accelerating the micro-motion stage 101-1. In order to reduce the moment acting on the jog stage 101-1 when accelerating the jog stage 101-1, it is effective to reduce the distances of the centers of gravity of the jog XLM101-4, jog YLM101-5, jog ZLM101-6 and jog stage 101-1. For this reason, it is advantageous to reduce the length in the Z-axis direction of the movable iron core of the micro-electromagnet 101-3 on the micro-motion base 101-2.
Fig. 8, 9, and 10 exemplarily show the configuration of the micro-electromagnet 101-3 incorporated in the exposure apparatus or the wafer stage apparatus 500 according to the first embodiment. The micro-electromagnet 101-3 of the first embodiment has a configuration advantageous for reducing moment acting on the micro-motion stage 101-1 when accelerating the micro-motion stage 101-1. The micro-electromagnet 101-3 may include a fixed iron core (first member) SC, a supporting member 101-30 supporting the fixed iron core SC, a movable iron core (second member) MC, a supporting member 101-31 supporting the movable iron core MC, and a coil 101-36. The support member 101-30 fixes the fixed core SC to the jog base 101-2 as a jog carrier, and the support member 101-31 fixes the movable core MC to the jog carrier 101-1. The coils 101-36 are wound on the fixed core SC. The center axis of the coil 101-36 may be parallel to the XY plane (the plane in which the jog base 101-2 as a jog stage moves).
In the example of fig. 8, 9, and 10, 4 support members 101-30 may be fixed to the micro base 101-2, fixed cores SC may be disposed thereon, and the coils 101-36 may be wound around the fixed cores SC. The fixed core SC and the movable core MC face each other with a minute gap. The dimension Hi of the movable core MC in the Z-axis direction (direction orthogonal to the XY plane in which the jog base 101-2 as the jog mount moves) is preferably smaller than the dimension He of the fixed core SC in the Z-axis direction. In other words, the length of the movable iron core MC in the Z-axis direction is preferably reduced. This is effective for reducing a moment acting on the micro-motion stage 101-1 when accelerating the micro-motion stage 101-1.
A preferred structure and arrangement of the fixed core SC and the movable core MC will be described with reference to fig. 11. The fixed core SC fixed to the jog base 101-2 as a jog carrier and wound with the coil 101-36 has a first end face E1. The movable core MC fixed to the micro carrier 101-1 has a second end face E2 facing the first end face E1 with a gap therebetween.
In fig. 1, d1 is a first distance from the wafer (substrate) 700 held by the micro stage 101-1 to a position farthest from the wafer (substrate) 700 held by the micro stage 101-1 in the first end face E1. d2 is a second distance from the wafer 700 held by the micro stage 101-1 to a position farthest from the wafer 700 held by the micro stage 101-1 in the second end face E2. In this definition, it is preferable that the maximum value of the difference (d 1-d 2) of subtracting d2 from d1 is larger than the positive prescribed value PV.
The jog ZLM (first jog driver) 101-6 may be configured and controlled to drive the jog stage 101-1 such that the difference (d 1-d 2) is maintained in a range above 0. The prescribed value PV can be understood as the stroke required by the micro ZLM (first micro actuator) 101-6.
In one example, the prescribed value PV is a difference dwu between the maximum thickness of a wafer (substrate) that can be processed and the standard thickness of the substrate. When the clamping surface of the micro stage 101-1 is disposed at the reference height (reference position in the Z-axis direction), the substrate standard thickness is the distance between the clamping surface and the image plane FP of the projection optical system 687. When the chuck holding the wafer is a pin chuck, the chuck surface of the micro stage 101-1 is defined by the ends of a plurality of pins supporting the wafer. The chucking surface of the micro-stage 101-1 may be understood as the lower surface of the wafer or the surface of the micro-stage 101-1 side.
As another example, a calibration mark may be provided on the micro stage 101-1, and a height difference hm may exist between the surface of the substrate having the standard substrate thickness and the surface of the calibration mark. In this case, the prescribed value PV may be the sum of the difference dwu in height hm between the maximum thickness of the substrate that can be processed and the standard substrate thickness.
As another example, the wafer stage apparatus 500 may not include a pin unit for transferring wafers, and the micro stage 101-1 may be lifted and lowered by a micro ZLM (first micro actuator) 101-6 for transferring wafers. In this case, the predetermined value PV may be a sum of a difference dwu between the maximum thickness of the substrate that can be processed and the standard substrate thickness, a height difference hm, and a driving amount hu of the jog stage 101-1 for delivering the substrate.
In order to achieve weight reduction of the movable iron core MC, it is preferable that the dimension (e.g., hi) of the second end face E2 in the direction perpendicular to the XY plane is smaller than the dimension (e.g., he) of the first end face E1 in the direction perpendicular to the XY plane. The movable iron core MC has a light weight function to reduce moment acting on the micro carrier 101-1 when the micro carrier 101-1 accelerates.
Fig. 12, 13, and 14 exemplarily show a configuration of a micro-electromagnet 101-3 incorporated in an exposure apparatus or a wafer stage apparatus 500 according to the second embodiment. The matters not mentioned as the second embodiment may be according to the first embodiment. The micro-electromagnet 101-3 of the second embodiment has a configuration that is further advantageous in reducing a moment acting on the micro-motion stage 101-1 when accelerating the micro-motion stage 101-1. The micro-electromagnet 101-3 may include a fixed iron core (first member) SC, a supporting member 101-30 supporting the fixed iron core SC, a movable iron core (second member) MC, a supporting member 101-31 supporting the movable iron core MC, and a coil 101-36. The support member 101-30 fixes the fixed core SC to the jog base 101-2 as a jog mount, and the support member 101-31 fixes the movable core MC to the jog mount 101-1. The coils 101-36 are wound on the fixed core SC. The center axis of the coil 101-36 may be disposed at an angle perpendicular to the XY plane (the plane in which the jog base 101-2 as a jog stage moves). Such a structure is advantageous for reducing the height of the structure constituted by the fixed core SC and the coils 101-36, which is effective for reducing the size of the movable core MC in the Z-axis direction. In a section perpendicular to the XY plane and parallel to the central axis of the coils 101-36, the fixed core SC may include a portion having an L shape. The micro-motion base 101-2 may also have an opening, and a portion of the micro-motion electromagnet 101-3 may also be disposed in the opening.
Here, moment acting on the jog carrier 101-1 will be described with reference to fig. 15. When the micro stage device 101 is modeled as shown in fig. 15, the moment M acting on the micro stage 101-1 when accelerating the micro stage 101-1 of the mass M at the acceleration a is m=m·a· (hg+hu+he). hg is the Z-axis distance between the center of gravity G of the structure formed by the micro stage 101-1 and the components (movable core MC, supporting member 101-31, etc.) that move together with the micro stage 101-1 and the lower surface (surface on the micro base 101-2 side) of the micro stage 101-1. hu is a Z-axis direction distance between the lower surface of the micro-motion stage 101-1 and the upper end of the micro-motion electromagnet 101-3 (the end on the micro-motion stage 101-1 side). he is the Z-axis direction distance between the upper end of the stationary core SC and the point of action of the micro electromagnet 101-3.
Such moments can be counteracted by micro-motion ZLM-101-6. However, in order to cancel the moment, the micro ZLM101-6 is operated to generate heat, and the micro ZLM101-6 is deformed, and as a result, the alignment accuracy may be lowered. Therefore, as described above, it is important to reduce the moment generated when the micro stage 101-1 is accelerated.
In addition, deformation of the micro-motion stage 101-1 may also be caused by heat generated by the micro-motion electromagnet 101-3. The heat generated by the micro-electromagnet 101-3 may be caused by eddy currents in the magnetic circuit. Fig. 31 schematically shows the structure of a fixed core SC having a three-dimensional configuration. In the example of fig. 31, the fixed core SC is formed of a laminate of a plurality of electromagnetic steel plates, and the lamination method is the Z-axis direction. Each electromagnetic steel plate is covered with an insulating film. In fig. 31, the direction of the magnetic flux in the magnetic circuit is indicated by black arrows, and the magnetic flux flows through a three-dimensional path. The magnetic flux flowing in the Z-axis direction is indicated by thick black arrows. Since the direction of the bold and black arrow is parallel to the normal direction of the electromagnetic steel sheet, an eddy current generated by a change in current flows along the surface of the electromagnetic steel sheet, and is not suppressed. Thus, as indicated by the thick arrow which is open, a large eddy current may be generated. As a result, the fixed core SC generates heat, and the heat is transferred to the micro stage 101-1, and the micro stage 101-1 is deformed, whereby the alignment accuracy may be lowered. Further, the magnetic flux in the Z-axis direction indicated by the thick black arrow has a direction parallel to the normal direction of the electromagnetic steel sheet, and therefore, disadvantages such as large magnetic resistance, reduced magnetic flux value, and reduced attractive force are caused.
Next, a modified example of the micro-electromagnet 101-3 incorporated in the exposure apparatus or the wafer stage apparatus 500 according to the second embodiment will be described. Matters not mentioned here may be according to a modification of the first embodiment. Fig. 16 and 17 schematically show a configuration of a modified example of the micro-electromagnet 101-3 according to the second embodiment. Fig. 17 shows an exemplary configuration of the micro-electromagnet 101-3 with the micro-motion base 101-2 removed.
In this modification, 4 openings 301-21 are provided with respect to the micro-motion base 101-2, and a portion of each micro-motion electromagnet 101-3 may be disposed in the corresponding opening 301-21. A portion of each of the 4 micro-electromagnets 101-3 may also be disposed below the micro-motion base 101-2. Each micro-electromagnet 101-3 may be supported by the micro-motion base 101-2 via a support member 301-30. Such a configuration is advantageous in reducing the height of the micro-electromagnet 101-3 above the micro-motion base 101-2 and reducing the size of the micro-electromagnet 101-3 in the XY direction.
The micro-electromagnet 101-3 may include a fixed iron core (first member) SC, a supporting member 301-30 supporting the fixed iron core SC, a movable iron core (second member) MC, a supporting member 101-31 supporting the movable iron core MC, and coils 301-36. The fixed core (first member) SC may include first elements 301-32, second elements 301-33, third elements 301-34, and fourth elements 301-35. The movable iron core (second member) MC may include the elements 101 to 38, but may include 1 or more other elements in addition to the elements 101 to 38. The fixed core (first member) SC may have a first end face E1, and the movable core (second member) MC may have a second end face E2 facing the first end face E1 with a gap therebetween. In this example, the first end face E1 is provided at each of the second elements 301 to 33, the third elements 301 to 34, and the fourth elements 301 to 35, and the second end face E2 is provided at the elements 101 to 38.
The fixed core (first member) SC may be constituted by a laminate of a plurality of electromagnetic steel plates. The plurality of electromagnetic steel plates may be covered with an insulating film, respectively. From another point of view, the first elements 301 to 32, the second elements 301 to 33, the third elements 301 to 34, and the fourth elements 301 to 35 constituting the fixed core (first member) SC may be each composed of a laminate of a plurality of electromagnetic steel plates. The movable iron core (second member) MC may be constituted by a laminate of a plurality of electromagnetic steel plates. From another point of view, at least 1 element 101 to 38 constituting the movable iron core (second member) MC may be constituted by a laminate of a plurality of electromagnetic steel plates. The plurality of electromagnetic steel plates may be covered with an insulating film, respectively.
The magnetic circuit constituted by the fixed core (first member) SC, the movable core (second member) MC, and the void (space between the first end face E1 and the second end face E2) may include at least 1 variation portion CP in which the lamination direction of the laminated body of the plurality of electromagnetic steel plates varies at right angles. The variation portion CP may include a contact portion of a first portion (e.g., first elements 301-32) having a lamination direction in a first direction (e.g., Y-axis direction) and a second portion (e.g., third elements 301-34) having a lamination direction in a second direction (e.g., X-axis direction) orthogonal to the first direction. The variation CP may include a portion where a first portion (e.g., first elements 301 to 32) having a first stacking direction and a second portion (e.g., third elements 301 to 34) having a second stacking direction orthogonal to the first direction face each other with a solid member interposed therebetween. The solid member may be, for example, an insulating film covering a plurality of electromagnetic steel plates, respectively.
In the examples of fig. 16 and 17, the changing portion CP is provided in the fixed core (first member) SC. In the example of fig. 16 and 17, the changing portion CP includes a portion where the fixed core (first member) SC and the movable core (second member) MC face each other with a gap therebetween. The latter structure can also be understood as the following structure: a first portion of the first and second portions constituting the changing portion CP is provided in the fixed core (first member) SC, and a second portion is provided in the movable core (second member) MC. The changing portion CP may be provided in addition to the movable core (second member) MC, or may be provided only in the movable core (second member) MC. In the examples of fig. 16 and 17, the second element 301-33, the third element 301-34, and the fourth element 301-3 have L-shaped, and the first element 301-32 has a rectangular parallelepiped shape.
Fig. 18 schematically shows a configuration of another modification of the micro-electromagnet 101-3 according to the second embodiment. The micro-electromagnet 101-3 may include a fixed iron core (first member) SC, a supporting member 201a-30 supporting the fixed iron core SC, a movable iron core (second member) MC, a supporting member 101-31 supporting the movable iron core MC, and coils 201a-36. The fixed core (first member) SC may include first elements 201a-32, second elements 201a-33, third elements 201a-34, and fourth elements 201a-35. The movable iron core (second member) MC may include the elements 101 to 38, but may include 1 or more other elements in addition to the elements 101 to 38. The fixed core (first member) SC may have a first end face E1, and the movable core (second member) MC may have a second end face E2 facing the first end face E1 with a gap therebetween. In this example, the first end face E1 is provided at each of the second elements 201a to 33, the third elements 201a to 34, and the fourth elements 201a to 35, and the second end face E2 is provided at the elements 101 to 38. In the modified example of fig. 18, the first elements 201a-32 have an E-shape, and the coils 201a-36 are wound around the teeth in the center of the first elements 201 a-32. In the modified example of fig. 18, the second element 201a to 33, the third element 201a to 34, and the fourth element 201a to 35 have a rectangular parallelepiped shape.
Hereinafter, an assembling method or a manufacturing method of the micro-electromagnet 101-3 of the other modification of fig. 24 will be described with reference to fig. 24 to 28. Fig. 24 shows a state in which the micro-electromagnet 101-3 of the modified example of fig. 18 is disassembled. The first elements 201a-32 and the support members 201a-30 may be joined by adhesives, clamps, fits, or the like. In addition, the coils 201a to 36 and the coil bases 201a to 42 may be bonded by an adhesive material or the like. The second element 201b-33, the third element 201b-34, and the fourth element 201b-35 may be bonded by an adhesive, a clamp, a fitting, or the like through the end member gaskets 201 a-40.
As illustrated in fig. 25, the first element 201a-32 may be inserted into the opening 201a-21 of the micro base 101-2, and the combination of the first element 201a-32 and the support member 201a-30 may be positioned on the micro base 101-2. Also, the support member 201a-30 may be fixed to the micro base 101-2. The support member 201a-30 may be fixed to the micro base 101-2 by, for example, screw fastening, adhesive, clamping, fitting, or the like.
Next, as illustrated in fig. 26, the combination of the coil 201a-36 and the coil base 201a-42 may be positioned on the micro base 101-2, and the coil base 201a-42 may be fixed on the micro base 101-2. The coil base 201a-42 is fixed to the micro base 101-2 by, for example, screw fastening, adhesive, clamping, fitting, or the like.
Next, as illustrated in fig. 27, the tip member bases 201a to 41 are fixed to the jog base 101 to 2 by, for example, screw fastening, adhesive, clamping, fitting, or the like.
Next, as illustrated in fig. 28, the second element 201b-33, the third element 201b-34, the fourth element 201b-35, and the combination of the second element 201b-33, the third element 201b-34, and the fourth element 201b-35 may be fixed to the end member bases 201a-41. This may be accomplished by securing the end piece shims 201a-40 relative to the end piece bases 201a-41 using screw fasteners, adhesives, clamps, fits, or the like.
The state shown in fig. 25 may be returned to the reverse order of the above, as illustrated in fig. 21, the new coil 201a-36 is fixed to the jog base 101-2, and then the replacement of the coil 201a-36 is performed through the order illustrated in fig. 27 and 28.
When the fixed core SC is formed by combining a plurality of elements, for example, there is a possibility that a minute relative displacement occurs between 2 elements along the interface at the interface between 2 elements (for example, the interface between the second elements 201a to 33 and the first elements 201a to 32). As a countermeasure, a coating for preventing particles may be applied to the interface, a recovery disk may be provided near the interface, and a trap magnet may be provided near the interface. When the end member shims 201a to 40 are fixed to the end member bases 201a to 41, thin shims may be interposed therebetween, so that the first elements 201a to 32 and the second elements 201a to 33, the third elements 201a to 34, and the fourth elements 201a to 35 are maintained in a non-contact state.
The exposure apparatus and the micro-electromagnet 101-3 according to the third embodiment will be described below. The matters not mentioned as the third embodiment may be according to the first or second embodiment. Fig. 19 schematically shows the structure of a micro-electromagnet 101-3 according to the third embodiment. The micro-electromagnet 101-3 may include a fixed core (first member) SC, a support member 301a-30 that supports the fixed core SC, a movable core (second member) MC, a support member 301a-31 that supports the movable core MC, and coils 301a-36. The fixed core (first member) SC may include first elements 301a-32, second elements 301a-37, third elements 301a-33, fourth elements 301a-34, and fifth elements 301a-35. The movable iron core (second member) MC may include the elements 301a to 38, but may include 1 or more other elements in addition to the elements 301a to 38. The fixed core (first member) SC may have a first end face E1, and the movable core (second member) MC may have a second end face E2 facing the first end face E1 with a gap therebetween. In this example, the first end face E1 is provided at each of the third elements 301a-33, the fourth elements 301a-34, and the fifth elements 301a-35, and the second end face E2 is provided at the elements 301a-38.
The fixed core (first member) SC may be constituted by a laminate of a plurality of electromagnetic steel plates. The plurality of electromagnetic steel plates may be covered with an insulating film, respectively. From another point of view, the third element 301a to 33, the fourth element 301a to 34, and the fifth element 301a to 35 that constitute a part of the fixed core (first member) SC may be constituted by a laminated core in which a plurality of electromagnetic steel plates are laminated. The first elements 301a to 32 and the second elements 301a to 37 constituting the other part of the fixed core (first member) SC may be constituted by wound cores that may be formed by winding electromagnetic steel plates. In addition, in a state where the wound core is used as a component constituting the fixed core (first member) SC, the wound core has one form of a structure in which a plurality of electromagnetic steel sheets are laminated. The movable core (second member) MC may be constituted by a laminated core formed by laminating a plurality of electromagnetic steel plates. From another point of view, at least 1 elements constituting the movable iron core (second member) MC, namely, elements 301a to 38 may be constituted by a laminate of a plurality of electromagnetic steel plates. The plurality of electromagnetic steel plates may be covered with an insulating film, respectively.
The magnetic circuit constituted by the fixed core (first member) SC, the movable core (second member) MC, and the void (space between the first end face E1 and the second end face E2) may include the changing portions CP, CP' in which the lamination direction of the laminated body of the plurality of electromagnetic steel plates changes at right angles. The variation portion CP may include a contact portion of a first portion (e.g., the fifth elements 301 a-38) having a lamination direction in a first direction (e.g., the Z-axis direction) and a second portion (e.g., the second elements 301 a-37) having a lamination direction in a second direction (e.g., the X-axis direction) orthogonal to the first direction. The variation CP may include a portion where a first portion (e.g., the fifth elements 301 a-38) whose lamination direction is a first direction and a second portion (e.g., the second elements 301 a-37) whose lamination direction is a second direction orthogonal to the first direction face each other with a solid member interposed therebetween. The solid member may be, for example, an insulating film covering a plurality of electromagnetic steel plates, respectively. The changing portion CP' includes a portion in which the lamination direction gradually changes from a first direction (for example, the X-axis direction) to a second direction (for example, the Z-axis direction) orthogonal to the first direction. The variation portion CP' including the portion in which the lamination direction is slowly varied may be a portion of the wound core. The fixed core (first member) SC includes a first portion P1 having a lamination direction (for example, an X-axis direction) and a second portion P2 having a lamination direction (for example, a Z-axis direction) that gradually changes between the first portion P1 and the second portion P2. The variation CP' is a portion between the first portion P1 and the second portion P2.
In the example of fig. 19, the changing portions CP and CP' are provided in the fixed core (first member) SC. At least 1 of the changing portions CP and CP' may be provided additionally to the movable core (second member) MC, or may be provided only to the movable core (second member) MC. One of the fixed core (first member) SC and the movable core (second member) MC may be formed of at least 1 laminated core, the other of the fixed core (first member) SC and the movable core (second member) MC may be formed of a wound core, and the changing portion may be formed of a wound core.
The first elements 301a to 32, the second elements 301a to 37, the third elements 301a to 33, the fourth elements 301a to 34, and the fifth elements 301a to 35 may be integrated by using an adhesive material or by fastening them by using a clamp member. In this example, the changing portions CP, CP' are provided on the fixed core (first member) SC, and the coils 301a to 36 are wound around the fixed core (first member) SC. The coils 301a to 36 may be wound around portions different from portions of the configuration change portions CP, CP' among the fixed core (first member) SC. By passing a current through the coils 301a-36, an attractive force is generated between the first end face E1 and the second end face E2. In the example of fig. 19, the first elements 301a to 32 and the second elements 301a to 37 have U-shaped shapes, and the coils 301a to 36 are wound around the portions where 1 tooth of the first elements 301a to 32 and 1 tooth of the second elements 301a to 37 are integrated.
The changing portions CP, CP' may be provided so that magnetic fluxes passing through a magnetic circuit formed by the fixed core (first member) SC, the movable core (second member) MC, and the air gap do not flow through the plurality of electromagnetic steel plates constituting the fixed core SC and the movable core MC in the lamination direction. Alternatively, the changing portions CP, CP', the fixed core (first member) SC, and the movable core (second member) MC are provided so that magnetic fluxes passing through the fixed core SC and the movable core MC flow along the surface direction of each electromagnetic steel sheet. Alternatively, the changing portions CP and CP 'may be provided so that the magnetic resistance of the magnetic circuit formed by the fixed core (first member) SC, the movable core (second member) MC, and the gap is smaller than that in the case where the changing portions CP and CP' are not provided. Alternatively, the changing portions CP and CP 'may be provided so that eddy currents generated in the magnetic circuit formed by the fixed core (first member) SC, the movable core (second member) MC, and the gap are smaller than those generated without the changing portions CP and CP'.
In the example of fig. 19, the lamination direction (Z-axis direction) of the third elements 301a to 33, the fourth elements 301a to 34, and the fifth elements 301a to 35 having the first end face E1 is the same as the lamination direction (Z-axis direction) of the elements 301a to 38 having the second end face E2. This will help to reduce the reluctance near the void and increase the magnetic flux.
Instead of the configuration example of fig. 19, the stacking direction of the third elements 301a to 33, the fourth elements 301a to 34, and the fifth elements 301a to 35 may be the X-axis direction. Such a configuration may help to reduce magnetic resistance in the vicinity of the junctions of the third elements 301a-33, the fourth elements 301a-34, and the fifth elements 301a-35 with the first elements 301a-32 and the second elements 301a-37, and increase magnetic flux.
Fig. 20 schematically shows a configuration of a modification of the micro-electromagnet 101-3 according to the third embodiment. The structure of the third embodiment shown in fig. 19 can be adopted as an example of the modification. The micro-electromagnet 101-3 may include a fixed iron core (first member) SC, a supporting member 301b-30 supporting the fixed iron core SC, a movable iron core (second member) MC, a supporting member 301b-31 supporting the movable iron core MC, and coils 301b-36. The fixed core (first member) SC may include first elements 301b-32, second elements 301b-33. The movable iron core (second member) MC may include third elements 301b-37, fourth elements 301b-38. The fixed core (first member) SC may have a first end face E1, and the movable core (second member) MC may have a second end face E2 facing the first end face E1 with a gap therebetween. In this example, the first end face E1 is provided at each of the first elements 301b to 32 and the second elements 301b to 33, and the second end face E2 is provided at each of the third elements 301b to 37 and the fourth elements 301b to 38.
The fixed core (first member) SC may be constituted by a laminate of a plurality of electromagnetic steel plates. The plurality of electromagnetic steel plates may be covered with an insulating film, respectively. From another point of view, the first elements 301b to 32 and the second elements 301b to 33 constituting a part of the fixed core (first member) SC may be constituted by a laminate of a plurality of electromagnetic steel plates. In addition, in a state where the wound core is used as a component constituting the fixed core (first member) SC, the wound core also has one form of a structure in which a plurality of electromagnetic steel sheets are laminated. The movable iron core (second member) MC may be constituted by a laminate of a plurality of electromagnetic steel plates. From another point of view, the third elements 301b to 37 and the fourth elements 301b to 38 constituting the movable core (second member) MC may be constituted by a laminate of a plurality of electromagnetic steel plates. The plurality of electromagnetic steel plates may be covered with an insulating film, respectively.
The magnetic circuit constituted by the fixed core (first member) SC, the movable core (second member) MC, and the void (space between the first end face E1 and the second end face E2) may include variation portions CP', CP "in which the lamination direction of the laminated body of the plurality of electromagnetic steel plates varies at right angles. In this example, the changing portion CP' is provided in the fixed core (first member) SC, and the changing portion cp″ is provided in the movable core (second member) MC.
The changing portion CP' includes a portion in which the lamination direction gradually changes from a first direction (for example, the X-axis direction) to a second direction (for example, the Z-axis direction) orthogonal to the first direction. The variation portion CP' including the portion in which the lamination direction is slowly varied may be a portion of the wound core. The fixed core (first member) SC includes a first portion P1 having a lamination direction (for example, an X-axis direction) and a second portion P2 having a lamination direction (for example, a Z-axis direction) that gradually changes between the first portion P1 and the second portion P2. The variation CP' is a portion between the first portion P1 and the second portion P2.
The movable core (second member) MC includes a third portion P3 whose lamination direction is a first direction (for example, X-axis direction) and a fourth portion P4 whose lamination direction is a second direction (for example, Y-axis direction), and the lamination direction is changed slowly between the third portion P3 and the fourth portion P4. The variation cp″ is a portion between the third portion P3 and the fourth portion P4.
By flowing a current in the coils 301b to 36, an attractive force is generated between the first end face E1 and the second end face E2. In the example of fig. 20, the first elements 301b to 32 and the second elements 301b to 33 have U-shaped shapes, and the coils 301b to 36 are wound around the portions where 1 tooth of the first elements 301a to 32 and 1 tooth of the second elements 301a to 37 are integrated.
The changing portions CP' and cp″ may be provided so that magnetic fluxes passing through a magnetic circuit formed by the fixed core (first member) SC, the movable core (second member) MC, and the void do not flow through the plurality of electromagnetic steel plates constituting the fixed core SC and the movable core MC in the lamination direction thereof. Alternatively, the changing portions CP', CP ", the fixed core (first member) SC, and the movable core (second member) MC may be provided such that magnetic fluxes passing through the fixed core SC and the movable core MC flow along the surface direction of each electromagnetic steel sheet. Alternatively, the changing portions CP 'and cp″ may be provided such that the magnetic resistance of the magnetic circuit formed by the fixed core (first member) SC, the movable core (second member) MC, and the gap is smaller than that in the case where the changing portions CP' and cp″ are not provided. Alternatively, the changing portions CP 'and cp″ may be provided such that eddy currents generated in the magnetic circuit formed by the fixed core (first member) SC, the movable core (second member) MC, and the gap are smaller than those generated without the changing portions CP' and cp″.
In the example of fig. 20, the lamination direction (X-axis direction) of the first elements 301b to 32 and the second elements 301b to 33 at the first end face E1 is the same as the lamination direction (X-axis direction) of the third elements 301b to 37 and the fourth elements 301b to 38 at the second end face E2. This will help to reduce the reluctance near the void and increase the magnetic flux. In the example of fig. 23, in the magnetic circuit including the fixed core (first member) SC, the movable core (second member) MC, and the void, the lamination direction does not change sharply, which is advantageous in that the magnetic resistance is reduced and the magnetic flux is increased.
Fig. 21 exemplarily shows a structure of the supporting members 301b to 31 supporting the movable core MC. The support members 301b-31 may have a star wheel shape for supporting the movable iron core MC, which may be constituted by a wound iron core.
Here, the wound core will be described with reference to fig. 29. Fig. 29 (a) illustrates a wound core. Fig. 29 (b) shows a wound core obtained by cutting the wound core illustrated in fig. 29 (a) by wire cutting or the like, and such a wound core is also called a cut core. The wound core may be manufactured by winding a ring material around a core not shown. As illustrated in fig. 30, the ring material may be manufactured by a slitter illustrated in fig. 25. The raw coil is conveyed in the sheet passing direction, and cut to a desired width by a slitter provided in the middle and including a circular knife, thereby obtaining a loop material. The width is determined by the spacing of the circular knives of the slitter.
As illustrated in fig. 29 (a), the wound core is a laminate of a plurality of electromagnetic steel plates, and 1 wound core has a plurality of lamination directions. In other words, the wound core can be used as a member constituting the aforementioned changing portion. The lamination direction is a direction penetrating the viewing portion in the wound core in a direction perpendicular to the electromagnetic steel sheet. The width direction is a direction determined by the slitter and is also an axial direction. The axial direction is a direction parallel to any portion of the largest surface of each electromagnetic steel sheet.
In one aspect, the electromagnetic device of the present invention may include a plurality of core members each including a laminated core or a wound core, and a coil for generating magnetic flux in the core members. Here, the lamination direction of a certain laminated core may be orthogonal to the width direction of a certain wound core, or the lamination direction of a certain laminated core may be orthogonal to the lamination direction of another laminated core, or the width direction of a certain wound core may be orthogonal to the width direction of another wound core.
The control system of the wafer stage apparatus 500 will be described below. Fig. 22 schematically shows a configuration of a control system of the wafer stage apparatus 500. The moving object providing unit 5101 provides a moving object. The position map generator 5102 generates a position map indicating a relationship between time and the position of the jog carrier 101-1 at that time, based on the moving target supplied from the moving target supply unit 5101. In addition, the position profile generator 5102 generates a target position from the generated position profile. The acceleration profile generator 5103 generates an acceleration profile indicating a relationship between time and acceleration of the jog stage 101-1 at that time, based on the moving object supplied from the moving object supply unit 5101. In addition, the acceleration profile generator 5103 generates a target acceleration from the generated acceleration profile. Fig. 23 illustrates a position profile generated by the position profile generator 5102 and an acceleration profile generated by the acceleration profile generator 5103.
The jog position sensor 5156 measures the position of the jog stage 101-1. The jog position control system 5121 generates an operation amount by PID operation or the like in correspondence with a deviation of the target position supplied from the position map generated by the position map generator 5102 and the current position supplied from the jog position sensor 5156. The current amplifier 5122 supplies a current corresponding to the operation amount generated by the jog position control system 5121 to the jog XLM101-4 and the jog YLM 101-5. Thus, the micro stage 101-1 is feedback controlled.
The coarse position sensor 5135 measures the position of the jog base 101-2. The coarse movement position control system 5133 generates an operation amount by PID operation or the like in accordance with a deviation of the target position supplied from the position map generated by the position map generator 5102 and the current position supplied from the coarse movement position sensor 5135. The current amplifier 5131 supplies a current corresponding to the operation amount generated by the coarse movement position control system 5133 and the target acceleration supplied from the acceleration profile generator 5103 to the coarse linear motor 106. Thus, the jog base 101-2 is feedback controlled and feedforward controlled.
The target acceleration generated by the acceleration profile generator 5103 is also supplied to the electromagnet current control system 5515, and the electromagnet current control system 5515 controls the micro-electromagnet 101-3 in accordance with the target acceleration. At the time of acceleration of the micro-motion stage 101-1 (micro-motion stage device 101), the micro-motion electromagnet 101-3 mainly provides force to the micro-motion stage 101-1. The jog XLM101-4, jog YLM101-5 may be controlled to generate a thrust force for reducing a minute positional deviation between the target position and the measured current position. Thus, the heat generated by the jog XLM101-4, jog YLM101-5 will be reduced.
The coarse position control system 5133 moves the position of the jog base 101-2 in accordance with the position profile generated by the position profile generator 5102. The micro-electromagnet 101-3 advantageously produces a large attractive force with minimal heat generation. However, it is necessary to maintain a gap between the first end face E1 and the second end face E2 of the micro-electromagnet 101-3. That is, in order to continuously provide a desired force to the micro-motion stage 101-1 by the micro-motion electromagnet 101-3, it is necessary to learn the movement of the micro-motion stage 101-1 to move the stator (fixed iron core and coil) of the micro-motion electromagnet 101-3 to maintain the gap. In addition, the heat generated by the micro-motion ZLM may be reduced by reducing the height of the micro-motion electromagnet 101-3 on the micro-motion base 101-2. With the above configuration, highly accurate position control of the micro-stage 101-1, reduction of heat generation, and reduction of overlay error can be achieved.
What achieves this is a coarse position control system 5133. The coarse position, i.e., the position of the jog dial 101-2, is measured by the coarse position sensor 5135, which is represented by an encoder, based on its deviation from the target position, the coarse linear motor 106 is driven by the coarse position control system 5133. As a result, the position of the micro stage 101-1 (mover of the micro electromagnet 101-3) and the position of the micro base 101-2 (stator of the micro electromagnet 101-3) are controlled based on the output of the position map generator 5102, and the gap is maintained. The jog position sensor 5156 for measuring the position of the jog mount 101-1 may be replaced with a sensor for measuring the relative position of the jog mount 101-1 and the jog base 101-2.
The present invention is not limited to the above-described embodiments, and various modifications and changes can be made within the scope of the inventive concept.

Claims (26)

1. A stage device for holding a substrate, characterized in that,
the stage device includes: a coarse movement carrier; a coarse movement actuator for driving the coarse movement stage along a predetermined plane; a micro-motion stage for holding the substrate; a micro actuator for adjusting the position and posture of the micro stage relative to the coarse stage; and an electromagnetic actuator for transmitting the thrust provided to the coarse motion stage by the coarse motion actuator to the fine motion stage in a noncontact manner,
the electromagnetic actuator includes: the fixed iron core is fixed on the coarse moving carrier and provided with a first end face; a coil wound around the fixed core; and a movable iron core fixed on the micro-motion carrier and having a second end face opposite to the first end face,
the maximum value of the difference obtained by subtracting a second distance from the substrate held by the micro stage to a position farthest from the substrate in the first end face is larger than a positive predetermined value.
2. The stage device according to claim 1, wherein,
the micro-actuator drives the micro-stage to maintain the difference in a range above 0.
3. The stage device according to claim 1, wherein,
the prescribed value is a difference between the maximum thickness of the substrate that can be processed and the standard substrate thickness.
4. The stage device according to claim 1, wherein,
the micro-motion stage is provided with a calibration mark,
the prescribed value is a sum of a difference between a maximum thickness of a substrate that can be processed and a standard substrate thickness and a difference in height between a surface of a substrate having the standard substrate thickness and a surface of the alignment mark.
5. The stage device according to claim 1, wherein,
the micro-motion stage is provided with a calibration mark,
the predetermined value is a sum of a difference between a maximum thickness of a substrate that can be processed and a standard substrate thickness, a height difference between a surface of the substrate having the standard substrate thickness and a surface of the alignment mark, and a driving amount of the jog stage for transferring the substrate.
6. The stage device according to claim 1, wherein,
the second end face has a smaller dimension in a direction perpendicular to the plane than the first end face.
7. The stage device according to claim 1, wherein,
the central axis of the coil is parallel to the plane.
8. The stage device according to claim 1, wherein,
the central axis of the coil is disposed at an angle perpendicular to the plane.
9. The stage device according to claim 8, wherein,
the coarse movement carrier has an opening, and a portion of the fixed core is disposed in the opening.
10. The stage device according to any one of claims 1 to 9, wherein,
the fixed core and the movable core constitute a magnetic circuit including a laminated body composed of a plurality of electromagnetic steel plates, and the laminated body includes a changing portion in which a lamination direction of the plurality of electromagnetic steel plates changes at right angles.
11. The stage device according to claim 10, wherein,
the changing portion includes a contact portion of a first portion in which the lamination direction is a first direction and a second portion in which the lamination direction is a second direction orthogonal to the first direction.
12. The stage device according to claim 10, wherein,
the changing portion includes a portion where a first portion where the lamination direction is a first direction and a second portion where the lamination direction is a second direction orthogonal to the first direction face each other with a solid member interposed therebetween.
13. The stage device according to claim 10, wherein,
the changing portion is provided on at least one of the fixed core and the movable core.
14. The stage device according to claim 10, wherein,
the changing portion includes a portion where a first portion where the lamination direction is a first direction and a second portion where the lamination direction is a second direction orthogonal to the first direction face each other with a gap therebetween.
15. The stage device according to claim 14, wherein,
the first portion is disposed on the fixed core, and the second portion is disposed on the movable core.
16. The stage device according to claim 10, wherein,
the fixed core and the movable core are each constituted by at least one laminated core.
17. The stage device according to claim 10, wherein,
at least one of the fixed core and the movable core is composed of a plurality of laminated cores.
18. The stage device according to claim 17, wherein,
the plurality of laminated cores are disposed close to each other and fixed by a fixing member.
19. The stage device according to claim 10, wherein,
The changing portion includes a portion in which the stacking direction changes gradually from a first direction to a second direction orthogonal to the first direction.
20. The stage device according to claim 11, wherein,
the changing portion is composed of a wound iron core.
21. The stage device according to claim 10, wherein,
one of the fixed core and the movable core includes at least one laminated core,
the other one of the fixed iron core and the movable iron core includes a wound iron core,
the changing portion is constituted by the wound iron core.
22. The stage device according to claim 10, wherein,
the fixed iron core and the movable iron core are respectively composed of winding iron cores,
the axial direction of the wound core constituting the fixed core and the axial direction of the wound core constituting the movable core are orthogonal to each other,
the changing portion is constituted by the wound core constituting the fixed core and the wound core constituting the movable core, respectively.
23. The stage device according to claim 10, wherein,
the change part is arranged on the fixed iron core, and the coil is wound on the fixed iron core.
24. The stage device according to claim 23, wherein,
the coil is wound around a portion of the fixed core different from a portion where the changing portion is arranged.
25. A transfer device for transferring a pattern of an original plate to a substrate, characterized in that,
the transfer device has the stage device according to claim 1.
26. A method for manufacturing an article, characterized in that,
the method for manufacturing the article comprises the following steps:
a transfer step of transferring the original pattern to a substrate by the transfer device according to claim 25; and
and a step of obtaining an article from the substrate subjected to the transfer step.
CN202310456559.4A 2022-04-28 2023-04-25 Stage device, transfer device, and article manufacturing method Pending CN116974146A (en)

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