CN116963415A - Uncovering method of rigid-flex printed circuit board and rigid-flex printed circuit board - Google Patents
Uncovering method of rigid-flex printed circuit board and rigid-flex printed circuit board Download PDFInfo
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- CN116963415A CN116963415A CN202310816372.0A CN202310816372A CN116963415A CN 116963415 A CN116963415 A CN 116963415A CN 202310816372 A CN202310816372 A CN 202310816372A CN 116963415 A CN116963415 A CN 116963415A
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- 238000000034 method Methods 0.000 title claims abstract description 46
- 238000000608 laser ablation Methods 0.000 claims abstract description 36
- 239000003292 glue Substances 0.000 claims abstract description 31
- 238000005452 bending Methods 0.000 claims abstract description 27
- 238000003825 pressing Methods 0.000 claims abstract description 11
- 238000010030 laminating Methods 0.000 claims abstract description 9
- 238000003701 mechanical milling Methods 0.000 claims description 17
- 230000001681 protective effect Effects 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 12
- 238000001514 detection method Methods 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 5
- 239000000523 sample Substances 0.000 claims description 5
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000009719 polyimide resin Substances 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims 2
- 238000007906 compression Methods 0.000 claims 2
- 239000010410 layer Substances 0.000 description 116
- 239000012790 adhesive layer Substances 0.000 description 14
- 239000010408 film Substances 0.000 description 14
- 239000003365 glass fiber Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000002679 ablation Methods 0.000 description 5
- 239000004744 fabric Substances 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000007689 inspection Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000003801 milling Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000011087 paperboard Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The application relates to the technical field of printed circuit board processing, and provides a cover-removing method of a rigid-flex printed circuit board and the rigid-flex printed circuit board, wherein the cover-removing method of the rigid-flex printed circuit board comprises the following steps: providing a flexible plate, wherein the flexible plate comprises adjacent bending areas and rigid-flexible combination areas; an insulating medium layer is overlapped on at least one side of the flexible plate, and the insulating medium layer comprises a pure glue layer; laminating a rigid plate on the insulating medium layer to form a laminated structure; laminating the laminated structure to form a laminated piece; and uncovering the pressing piece to remove the insulating medium layer and the rigid plate corresponding to the bending area, wherein the insulating medium layer is removed through laser ablation. According to the uncovering method of the rigid-flex printed circuit board, the insulating medium layer is arranged as the pure glue layer, and when the insulating medium layer is removed through laser ablation, the thickness of the flex area after uncovering is uniform due to the fact that the pure glue layer absorbs laser energy uniformly.
Description
Technical Field
The application relates to the technical field of printed circuit boards, in particular to a cover uncovering method of a rigid-flex printed circuit board and the rigid-flex printed circuit board.
Background
The rigid-flex printed circuit board is also called as a rigid-flex printed circuit board, has the strength of the rigid board and the flexibility of the flexible board, can be applied to more and more fields, such as automobiles, unmanned aerial vehicles, industrial control, various consumer electronic products and the like, and has excellent market prospect. In the manufacturing method, the rigid-flex printed circuit board is generally used as a core layer, the rigid printed circuit board is overlapped on at least one side of the flexible printed circuit board, then the rigid printed circuit board corresponding to the flex region is removed, a flex region is formed, and the overlapped part of the flexible printed circuit board and the rigid printed circuit board is used as the rigid-flex printed circuit board. The rigid circuit board corresponding to the bending area can be removed by cutting to remove the designated area and then pressing, or by pressing to remove the designated area, and the conventional method is the latter, and the industry is called as an uncovering method.
At present, the uncovering mode of the rigid-flex printed circuit board is laser ablation, when the uncovering is carried out by adopting the laser ablation, the difference of uncovering depth is large and balanced control is difficult to realize when the laser outputs the same energy to burn on the rigid-flex printed circuit board due to the different absorptivity of different materials to laser energy.
Disclosure of Invention
The application aims to provide a rigid-flex printed circuit board uncovering method and a rigid-flex printed circuit board, which are used for solving the technical problem that when the existing rigid-flex printed circuit board is uncovered by laser lithography, the uncovering depth is unbalanced due to inconsistent laser energy absorptivity caused by different materials in the rigid-flex printed circuit board.
An embodiment of a first aspect of the present application provides a method for uncovering a rigid-flex printed circuit board, where the method for uncovering a rigid-flex printed circuit board includes:
providing a flexible plate, wherein the flexible plate comprises adjacent bending areas and rigid-flexible combination areas;
an insulating medium layer is overlapped on at least one side of the flexible plate, and the insulating medium layer comprises a pure glue layer;
laminating a rigid plate on the insulating medium layer to form a laminated structure;
pressing the laminated structure to form a pressing piece;
uncovering the pressing piece to remove the insulating medium layer and the rigid plate corresponding to the bending area;
wherein, the uncovering mode of the insulating medium layer is laser ablation.
In some embodiments, the insulating medium layer further includes a prepreg layer, the prepreg layer is stacked on at least one side of the flexible board, the pure layer is disposed on the prepreg layer, and the prepreg layer has a windowed area corresponding to the flex region;
before forming the laminated structure, the method further comprises:
and windowing the windowing area, wherein the flexible folding area is positioned in the windowing area.
In some embodiments, the material of the pure glue layer is thermosetting resin.
In some embodiments, the material of the pure glue layer is any one of epoxy resin, acrylic resin and polyimide resin.
In some embodiments, the prepreg layer is a low-flow prepreg or a no-flow prepreg.
In some embodiments, the uncovering the flex region of the flex panel comprises:
the dielectric layer and the rigid plate of the flex zone are removed by laser ablation.
In some embodiments, the uncovering the pressing member includes:
and if the sum of the thickness of the insulating medium layer and the thickness of the rigid plate is greater than 0.2mm, removing the rigid plate in the bending area by mechanical milling, and removing the insulating medium layer by laser ablation.
In some embodiments, the removing the rigid plate of the flex zone with mechanical milling comprises:
detecting the probe points on the surface of the rigid plate, wherein the interval between two connected probe points is 10mm;
and taking the detection point as a reference point of mechanical milling, and removing the rigid plate of the bending area by adopting mechanical milling.
In some embodiments, prior to forming the laminate structure, the method further comprises:
and a protective film is arranged at the flexible bending area of the flexible plate, and the protective film is positioned between the insulating medium layer and the flexible plate.
According to the application, the insulating medium layer of the rigid-flex board is a pure glue layer, and when the insulating medium layer is removed by laser ablation, the thickness of the flex area after uncovering is uniform due to uniform absorption of laser energy by the pure glue layer; because the pure adhesive layer does not contain glass fiber cloth, when the insulating medium layer is removed by laser ablation, the problem that the ablation depth is difficult to control due to inconsistent laser energy absorptivity of glass fibers and resin materials is avoided, and further the flexible board is prevented from being damaged.
The embodiment of the second aspect of the present application further provides a rigid-flex printed circuit board, where the rigid-flex printed circuit board is processed by the method for uncovering the rigid-flex printed circuit board according to any one of the embodiments of the first aspect.
Compared with the prior art, the rigid-flex printed circuit board has the advantages that the cover uncovering method of the rigid-flex printed circuit board is similar to the advantages of the prior art, and the description is omitted here.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic cross-sectional view of a rigid-flex board according to an embodiment of the present application;
fig. 2 is a flowchart of a method for uncovering a flex-rigid board according to an embodiment of the present application;
FIG. 3 is a schematic cross-sectional view of another flex-rigid board according to an embodiment of the present application;
fig. 4 is a schematic cross-sectional view of another flex-rigid board according to an embodiment of the present application.
The meaning of the labels in the figures is:
100. 100a, 100b, rigid-flex boards;
10. a flexible board; 12. a first face; 14. a second face; a. a flex region; b. a rigid-flex joint region;
20. a rigid plate; 30. an insulating dielectric layer; 32. a pure glue layer; 34. a prepreg layer; 40. and a protective film.
Detailed Description
The present application will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present application more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It is to be understood that the terms "length," "width," "upper," "lower," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, and are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In order to describe the technical scheme of the application, the following description is made with reference to specific drawings and embodiments.
Referring to fig. 1, fig. 1 is a schematic cross-sectional view of a flex-rigid board according to an embodiment of the present application, wherein a flex-rigid board 100 includes a flexible board 10, a rigid board 20 and an insulating medium layer 30, the flexible board 10 has a first surface 12 and a second surface 14 opposite to each other, the insulating medium layer 30 is stacked on the first surface 12 and the second surface 14, and the rigid board 20 is stacked on a side of the insulating medium layer 30 opposite to the flexible board 10. The flexible board 10 comprises a flex region a and a flex-rigid bonding region b which are adjacent to each other, and the insulating medium layer 30 and the rigid board 20 corresponding to the flex region a are removed to realize uncovering of the flex-rigid bonding board 100. According to the application, the insulating medium layer 30 is the pure glue layer 32, the flexible board 10 and the rigid board 20 are bonded through the pure glue layer, and when the insulating medium layer 30 is removed through laser ablation, the thickness of the flex region a after uncovering is uniform due to the uniform energy absorption of the pure glue layer 32 to laser; since the pure adhesive layer 32 does not contain glass fiber cloth, when the insulating medium layer 30 of the first face 12 and the second face 14 is removed by laser ablation, the problem that the ablation depth is difficult to control due to inconsistent laser energy absorptivity of glass fiber and resin materials is avoided, and further the flexible board 10 is prevented from being damaged.
Referring to fig. 2, fig. 2 is a flowchart of a method for uncovering a flex-rigid board according to an embodiment of the present application. The uncovering method of the rigid-flex printed circuit board comprises the following steps:
s201, the flexible board 10 is provided.
The flexible board 10 may be a double-sided flexible copper-clad plate as shown in fig. 1, that is, the flexible board 10 includes a flexible substrate and copper foils disposed on two opposite sides of the flexible substrate, and the flexible substrate may be a flexible insulating material such as a polyester film or a polyimide film. It will be appreciated that in other embodiments of the present application, the flexible board 10 may be a single-sided flexible copper clad laminate, or a multi-layer flexible board formed by at least one lamination, which is not limited herein.
S202, an insulating dielectric layer 30 is stacked on at least one side of the flexible board 10, and the insulating dielectric layer 30 includes a photoresist layer 32.
Specifically, the insulating medium layer 30 may be stacked on both the first surface 12 and the second surface 14 of the flexible board 10; an insulating medium layer 30 may be stacked on one surface of the flexible board 10.
Wherein the flexible board 10 can be a double-sided flexible copper-clad plate or a single-sided flexible copper-clad plate.
In some embodiments, the layer of pure glue 32 is a thermosetting resin.
Further, the resist layer 32 may be any one of epoxy resin, acrylic resin, polyimide resin.
S203, stacking the rigid board 20 on the insulating medium layer 30 to form a stacked structure, and laminating the stacked structure to form a laminated member.
Specifically, the rigid board 20, the flexible board 10 and the insulating medium layer 30 are laid out and laminated according to a predetermined laminated structure to form a laminated member.
The insulating medium layer 30 and the rigid board 20 may be stacked on the first surface 12 and the second surface 14 of the flexible board 10, and pressed to form a pressed piece. It will be appreciated that in other embodiments of the present application, the dielectric layer 30 and the rigid board 20 are laminated and bonded to one side of the flexible board 10.
Wherein the bonding of the rigid plate 20 and the flexible plate 10 may be achieved by a layer of pure glue 32.
S204, uncovering the pressing piece to remove the insulating medium layer 30 and the rigid plate 20 corresponding to the bending area.
Wherein, the uncovering mode of the insulating medium layer 30 adopts laser ablation.
Thus, since the insulating medium layer 30 is the pure glue layer 32, when the pure glue layer 32 of the insulating medium layer 30 is removed by laser ablation, the pure glue layer 32 can absorb laser energy uniformly, so that the depth uniformity in uncovering can be ensured; because the pure adhesive layer 32 does not contain glass fiber cloth, when the pure adhesive layer 32 of the insulating medium layer 30 is removed by laser ablation, the problem that the ablation depth is difficult to control due to inconsistent laser energy absorptivity of glass fibers and resin materials is avoided, and the flexible board 10 is further prevented from being damaged.
In some embodiments, referring to fig. 3, fig. 3 is a schematic cross-sectional view of another flex-rigid board provided in the embodiment of the present application, the flex-rigid board 100a shown in fig. 3 is similar to the flex-rigid board 100 shown in fig. 1, the flex-rigid board 100a includes a flexible board 10, a rigid board 20 and an insulating medium layer 30, and the insulating medium layer 30 includes a pure adhesive layer 32, where the insulating medium layer 30 in fig. 3 further includes a prepreg layer 34, the prepreg layer 34 is stacked on the flexible board 10, the pure adhesive layer 32 is stacked on the prepreg layer 34, and the rigidity and the supporting strength of the insulating medium layer 30 are enhanced by matching the pure adhesive layer 32 with the prepreg layer 34.
In fig. 3, an insulating medium layer 30 and a rigid plate 20 are stacked on each of the first surface 12 and the second surface of the flexible board 10, and are laminated to form a laminated member. It will be appreciated that in other embodiments of the present application, the dielectric layer 30 and the rigid board 20 are laminated and bonded to one side of the flexible board 10.
Further, the prepreg layer 34 is a low-flow prepreg or a no-flow prepreg.
In order to facilitate uncovering, before laminating the laminated structure of the rigid board 20, the flexible board 10 and the insulating medium layer 30, the prepreg layer 34 needs to be windowed, the windowed area corresponds to the flex area a, and the size of the windowed area is larger than that of the flex area a so as to reserve a gummosis area, and the specific size can be determined according to gummosis performance of the prepreg. By windowing the prepreg layer 34 corresponding to the bending area a, the rigid plate 20 and the pure adhesive layer 32 of the bending area a are only required to be removed when the press fitting piece is uncovered.
The method for uncovering the rigid-flex printed circuit board before forming the laminated structure further comprises the following steps:
the fenestration area of the prepreg ply 34 is fenestrated and the flex zone a is located within the fenestration area.
Therefore, a windowing area larger than the size of the bending area a is formed through windowing, the pure adhesive layer 32 of the bending area a is positioned in the windowing area, and uneven uncovering depth caused by different absorption rates of different materials on laser energy when the pure adhesive layer 32 of the bending area a is removed by laser ablation is avoided.
In some embodiments, referring to fig. 4, fig. 4 is a schematic cross-sectional view of another flex-rigid board provided in this embodiment of the present application, a flex-rigid board 100b shown in fig. 4 is similar to the flex-rigid board 100a shown in fig. 2, the flex-rigid board 100a includes a flexible board 10, a rigid board 20 and an insulating medium layer 30, and the insulating medium layer 30 includes a pure adhesive layer 32, where the flex-rigid board 100 further includes a protective film 40, and the protective film 40 is stacked on a flex region a of the flexible board 10, that is, the protective film 40 is located between the insulating medium layer 30 and the flexible board 10, and by providing a protective film, the pure adhesive layer 32 is prevented from directly contacting the flexible board 10, thereby playing a role of blocking adhesive, facilitating removal of the rigid board 20 and the insulating medium layer 30 above the flexible board 10, and further preventing the flexible board 10 from being damaged during uncovering.
In fig. 4, the insulating medium layer 30 and the rigid plate 20 are stacked on the first surface 12 and the second surface 14 of the flexible board 10, and are laminated to form a laminated member. It will be appreciated that in other embodiments of the present application, the dielectric layer 30 and the rigid board 20 are laminated and bonded to one side of the flexible board 10.
In fig. 4, the insulating dielectric layer 30 includes a layer of pure glue 32 and a layer of prepreg 34, it being understood that in other embodiments, the insulating dielectric layer 30 includes a layer of pure glue 32 and does not include a layer of prepreg 34.
Further, after the press-fitting is uncovered, the method for uncovering the flex-rigid board 100 further includes:
the protective film 40 of the flex region a is removed.
Specifically, after the uncovering is completed, the protective film 40 of the flex region a is torn off.
In some embodiments, the protective film 40 is a high temperature resistant film, wherein the protective film 40 may be a high temperature resistant protective tape, such as a polyimide tape.
In some embodiments, S204 comprises:
if the sum of the thickness of the rigid plate 20 and the thickness of the insulating medium layer 30 is greater than 0.2mm, mechanical milling is used to remove the rigid plate 20, and laser ablation is used to remove the insulating medium layer 30.
Since the mechanical milling method is adopted to improve the uncovering efficiency, the laser ablation method is adopted to improve the uncovering precision, when the sum of the thickness of the rigid plate 20 and the thickness of the insulating medium layer 30 is large, the combination of mechanical milling and laser ablation ensures the uncovering efficiency and can improve the uncovering precision (for example, ensures the equalization of the depth in the flex region a after uncovering).
Further, when the rigid plate 20 in the bending area a is removed by mechanical milling, in order to ensure uniformity of milling depth, detection of the detection point is required to be performed on the plate surface of the rigid plate 20, and the detection point thickness is used as a reference point thickness of mechanical milling, namely, a reference point of mechanical depth control. Wherein, the interval between two adjacent probe points is 10mm.
In some embodiments, if the sum of the thickness of the rigid plate 20 and the thickness of the insulating medium layer 30 is greater than 0.2mm, the rigid plate 20 and the insulating medium layer 30 may be sequentially removed by laser ablation, and the depth of the rigid plate 20 and the insulating medium layer 30 may be balanced after uncovering. And in the process of sequentially removing the rigid plate 20 and the insulating medium layer 30, the switching removal process is not required.
In some embodiments, S204 comprises:
if the sum of the thickness of the rigid plate 20 and the thickness of the insulating medium layer 30 is less than or equal to 0.2mm, laser ablation is used to remove the rigid plate 20 and the insulating medium layer 30.
When the sum of the thickness of the rigid plate 20 and the thickness of the insulating medium layer 30 is small, the rigid plate 20 and the insulating medium layer 30 are removed by laser ablation to ensure the equalization of the depth in the flex region a after the uncovering.
It may be appreciated that in the above embodiment, after S203, before S204, one or more of the process flows of line making, solder resist, text, surface treatment, forming, etc. are further included.
The following describes a method for uncovering a flex-rigid board in accordance with a specific embodiment, wherein the method for uncovering a flex-rigid board 100 includes manufacturing a flexible board 10, manufacturing a rigid board 20, and manufacturing the flex-rigid board 100.
First, the flexible board 10 is fabricated, including but not limited to one or more of the process flows of blanking, routing, automated optical inspection (Automatic Optical Inspection, AOI), browning, laminating a cover film, curing, punching, and the like.
Next, the rigidizer 20 is fabricated including, but not limited to, one or more of the process flows of blanking, routing, AOI, browning, and the like.
Then, the rigid-flex board 100 is fabricated.
The manufacturing of the rigid-flex board 100 includes: lamination (flexible board 10, rigid board 20, insulating dielectric layer 30) — drilling- > plasma- > copper-clad plate electro- > circuit- > pattern plating- > etching- > AOI- > four-wire test- > solder resist- > surface treatment- > routing- > uncovering- > post-process, specifically:
step one: and (3) laminating, namely typesetting and laminating the rigid plate 20, the flexible plate 10 and the insulating medium layer 30 according to a preset laminated structure to form a lamination piece.
Step two: and milling, namely milling the large-size production plate into a small size and then uncovering the small size to reduce the influence of uneven plate thickness.
Step three: before uncovering, the paperboard on the table surface needs to be fed into a planing machine, the depth of the planing paperboard is 1/3 of that of the planing machine, the flatness of the table surface is improved, the detection point is detected on the circuit board surface before production, the detection point is only used for the position needing uncovering, a control point is made every 10mm, and the thickness of the detection point is used as a reference thickness point.
In some embodiments, as shown in fig. 1, if the insulating medium layer 30 to be removed by uncovering is a pure glue layer 32, uncovering is performed by laser ablation, and as the accuracy of uncovering by laser ablation is relatively good, the uniformity of uncovering depth can reach +/-0.02 mm;
further, the rigid plate 20 and the insulating medium layer 30 can be sequentially removed by laser ablation, and the rigid plate 20 and the insulating medium layer 30 can be removed by the same process without switching the removal process.
Further, in order to avoid damaging the flexible board 10 during the uncovering process, a high temperature protective film 40 with pressure resistance is attached to the surface of the flexible board 10, and the protective film 40 is removed together with the cover (such as the pure glue layer 32 corresponding to the flex region a) after uncovering;
in some embodiments, if the thicknesses of the rigid board 20 and the insulating medium layer 30 corresponding to the bending region a are larger, the mechanical milling and the laser ablation can be combined, so that the uncovering efficiency is ensured, and the uncovering precision can be improved.
Wherein the combination of mechanical milling and laser ablation includes two modes:
mode one: a groove is milled in the rigid plate 20 corresponding to the bending area a by adopting mechanical milling, the depth of the groove is required to be milled through the rigid plate 20, and then the pure adhesive layer corresponding to the bending area a is etched by adopting laser sintering.
Mode two: the part of the rigid plate 20 corresponding to the bending area a is milled and removed by mechanical milling, and then the pure glue layer 32 corresponding to the bending area a is removed by laser ablation.
Further, when the uncovering is performed by laser ablation, the direction of the flexible board 10 is deviated by 0.025mm-0.05mm at the uncovering edge (namely the joint of the bending area a and the rigid-flexible joint area b) so as to ensure that the rigid board 20 is not carved by the laser ablation.
Step four: the post-process includes electrical measurement, shipment inspection, FQC press-baking, FQC, FQA, packaging, etc.
According to the application, the insulating medium layer 30 of the rigid-flex board 100 is the pure glue layer 32, and when the insulating medium layer 30 is removed by laser ablation, the pure glue layer 32 is uniform in laser energy absorption, so that the depth of the flex area after uncovering is uniform; since the pure adhesive layer 32 does not contain glass fiber cloth, when the insulating medium layer 30 of the first face 12 and the second face 14 is removed by laser ablation, the problem that the ablation depth is difficult to control due to inconsistent laser energy absorptivity of glass fiber and resin materials is avoided, and further the flexible board 10 is prevented from being damaged.
Further, different uncovering modes are selected according to different uncovering thicknesses (namely, the thicknesses of the pure glue layer 32 and the rigid plate 20 corresponding to the bending area a) so as to ensure that the flexible plate 10 is not damaged in the uncovering process and ensure the quality of the rigid-flex printed circuit board 100.
The uncovering method of the embodiment of the application is suitable for manufacturing all rigid-flex boards 100 with the flexible boards 10 inside and the rigid boards 20 outside.
An embodiment of the second aspect of the present application proposes a flex-rigid board 100, where the flex-rigid board 100 is manufactured by the method for uncovering the flex-rigid board 100 in any of the above embodiments.
The insulating medium layer 30 of the rigid-flex board 100 is a pure glue layer 32, and when the insulating medium layer 30 is removed by laser ablation, the depth of the flex area after uncovering is ensured to be uniform because the pure glue layer 32 absorbs laser energy uniformly; since the pure glue layer 32 does not contain glass fiber cloth, when the insulating medium layer 30 is removed by laser ablation, the problem that the ablation depth is difficult to control due to inconsistent laser energy absorptivity of glass fiber and resin materials is avoided, and the flexible board 10 is prevented from being damaged.
The above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application, and are intended to be included in the scope of the present application.
Claims (10)
1. The uncovering method of the rigid-flex printed circuit board is characterized by comprising the following steps of:
providing a flexible plate, wherein the flexible plate comprises adjacent bending areas and rigid-flexible combination areas;
an insulating medium layer is overlapped on at least one side of the flexible plate, and the insulating medium layer comprises a pure glue layer;
laminating a rigid plate on the insulating medium layer to form a laminated structure;
pressing the laminated structure to form a pressing piece;
uncovering the pressing piece to remove the insulating medium layer and the rigid plate corresponding to the bending area;
wherein, the uncovering mode of the insulating medium layer is laser ablation.
2. The method of claim 1, wherein the dielectric layer further comprises a prepreg layer, the prepreg layer being laminated to at least one side of the flexible board, the pure layer being laminated to the prepreg layer, the prepreg layer having a fenestration area corresponding to the flex area;
before forming the laminated structure, the method further comprises:
and windowing the windowing area, wherein the flexible folding area is positioned in the windowing area.
3. The method according to claim 1 or 2, wherein the material of the pure glue layer is a thermosetting resin.
4. The method according to claim 3, wherein the material of the pure glue layer is any one of epoxy resin, acrylic resin and polyimide resin.
5. The method of claim 2, wherein the prepreg layer is a low-flow prepreg or a no-flow prepreg.
6. The method of claim 1, wherein said uncovering said compression element comprises:
the dielectric layer and the rigid plate of the flex zone are removed by laser ablation.
7. The method of claim 1, wherein said uncovering said compression element comprises:
and if the sum of the thickness of the insulating medium layer and the thickness of the rigid plate is greater than 0.2mm, removing the rigid plate in the bending area by mechanical milling, and removing the insulating medium layer by laser ablation.
8. The method of claim 7, wherein the removing the rigid plate of the flex zone with mechanical milling comprises:
detecting the probe points on the surface of the rigid plate, wherein the interval between two adjacent probe points is 10mm;
and taking the detection point as a reference point of mechanical milling, and removing the rigid plate of the bending area by adopting mechanical milling.
9. The method of claim 1, wherein prior to forming the laminate structure, the method further comprises:
and a protective film is arranged at the flexible bending area of the flexible plate, and the protective film is positioned between the insulating medium layer and the flexible plate.
10. A rigid-flex board manufactured by the method of uncovering a rigid-flex board according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310816372.0A CN116963415A (en) | 2023-07-04 | 2023-07-04 | Uncovering method of rigid-flex printed circuit board and rigid-flex printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310816372.0A CN116963415A (en) | 2023-07-04 | 2023-07-04 | Uncovering method of rigid-flex printed circuit board and rigid-flex printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116963415A true CN116963415A (en) | 2023-10-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310816372.0A Pending CN116963415A (en) | 2023-07-04 | 2023-07-04 | Uncovering method of rigid-flex printed circuit board and rigid-flex printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116963415A (en) |
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2023
- 2023-07-04 CN CN202310816372.0A patent/CN116963415A/en active Pending
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