CN116916555A

CN116916555A - Production process for improving printing precision of waterproof glue of flexible circuit board

Info

Publication number: CN116916555A
Application number: CN202310909270.3A
Authority: CN
Inventors: 谭儒峰; 李柏翰; 张佩韵
Original assignee: Injection Precision Rubber Suzhou Co ltd
Current assignee: Injection Precision Rubber Suzhou Co ltd
Priority date: 2023-07-24
Filing date: 2023-07-24
Publication date: 2023-10-20

Abstract

The invention discloses a production process for improving the printing precision of waterproof glue of a flexible circuit board, which is characterized in that after the production of a lower line is completed, the lamination of the waterproof glue of a lower layer corresponding to a middle PET is completed and the alignment combination of the lower line is completed, the alignment printing of the waterproof glue of an upper layer is directly carried out on the surface of the middle PET based on the printing position of the waterproof glue of the lower layer, and then the alignment combination is carried out on the waterproof glue of the upper layer corresponding to the upper layer, the PET of the middle layer and the lower line. According to the invention, when the upper waterproof glue is directly printed on the middle PET, the printed lower waterproof glue is used as a reference to realize direct alignment printing with the lower PET, so that the combined offset tolerance of 0.2mm between the upper waterproof glue and the lower PET in the prior art is reduced, and the offset tolerance of the two waterproof glue can be controlled within 0.2 mm.

Description

Production process for improving printing precision of waterproof glue of flexible circuit board

Technical Field

The invention relates to the technical field of flexible circuit boards, in particular to a production process for improving the printing precision of waterproof glue of a flexible circuit board.

Background

The flexible circuit board is mainly applied to the fields of household appliance keys, computer keys and equipment with various key functions, and realizes the electrical functions by printing conductive silver paste, insulating UV, carbon and the like on PET.

As shown in fig. 1, the flexible circuit board in the prior art mainly comprises eleven parts of an upper layer PET1, an upper layer circuit 2, an upper layer insulating UV3, an upper layer jumper wire 4, an upper layer waterproof glue 5, a middle layer PET6, a lower layer waterproof glue 7, a lower layer jumper wire 8, a lower layer insulating UV9, a lower layer circuit 10, a lower layer PET11 and the like in sequence. The upper layer circuit 2, the upper layer insulating UV3, the upper layer jumper 4 and the upper layer waterproof adhesive 5 are sequentially printed on the upper layer PET1 to form an upper line, the lower layer circuit 10, the lower layer insulating UV9, the lower layer jumper 8 and the lower layer waterproof adhesive 7 are sequentially printed on the lower layer PET11 to form a lower line, the output end of the lower layer circuit 10 of the lower line is subjected to film pasting protection, then the middle layer PET6 is subjected to line setting and line setting combination, and finally the upper line setting middle layer PET6 and the lower line setting are combined to achieve the integral combination of the flexible circuit board.

According to the production process of the flexible circuit board, the upper waterproof glue 5 has a printing offset tolerance of 0.2mm when being printed on the upper PET1, and the upper waterproof glue 5 and the lower waterproof glue 7 have a combined offset tolerance of 0.2mm when being combined on the lower PET1, so that the dislocation of the upper waterproof glue 5 and the lower waterproof glue 7 after combination is serious (the accumulated offset tolerance can reach 0.4mm at maximum), and the problem of influencing the key hand feeling and poor waterproof performance is caused.

Disclosure of Invention

To solve the technical problems:

the invention provides a production process for improving the printing precision of waterproof glue of a flexible circuit board, which comprises the following steps:

s1, printing an upper-layer circuit, an upper-layer insulating UV and an upper-layer jumper wire on an upper-layer PET in sequence to form an upper wire;

s2, sequentially printing a lower-layer circuit, a lower-layer insulating UV, a lower-layer jumper wire and a lower-layer waterproof adhesive on the lower-layer PET to form a lower line, and attaching a protective film to the output end of the lower-layer circuit;

s3, laminating the lower waterproof glue corresponding to the middle PET layer to complete alignment combination with the lower line;

s4, performing alignment printing of the upper waterproof glue on the surface of the middle PET layer based on the printing position of the lower waterproof glue;

s5, aligning and combining the upper line corresponding to the upper waterproof glue, the middle PET and the lower line.

The invention provides another production process for improving the printing precision of the waterproof glue of the flexible circuit board, which comprises the following steps:

s1, sequentially printing a lower-layer circuit, a lower-layer insulating UV, a lower-layer jumper wire and a lower-layer waterproof adhesive on a lower-layer PET (polyethylene terephthalate) to form a lower line, and attaching a protective film to the output end of the lower-layer circuit;

s2, laminating the lower waterproof glue corresponding to the middle PET layer to complete alignment combination with the lower line;

s3, performing alignment printing of the upper waterproof glue on the surface of the middle PET layer based on the printing position of the lower waterproof glue;

s4, printing an upper-layer circuit, an upper-layer insulating UV and an upper-layer jumper wire on the upper-layer PET in sequence to form an upper wire;

According to the technical scheme, when the upper waterproof glue is directly printed on the middle PET layer, the printed lower waterproof glue can be used as a reference to realize direct alignment printing with the lower PET layer, so that the combined offset tolerance of 0.2mm between the upper waterproof glue and the lower PET layer in the prior art is reduced, and the offset tolerance of the two waterproof glue can be controlled within 0.2mm, therefore, the problem of large offset tolerance of the two waterproof glue printing can be reduced, and the hand feeling and waterproof performance of keys can be effectively improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the description of the embodiments will be briefly described below.

Fig. 1 is an exploded view of a flexible circuit board according to an embodiment.

The figures represent the numbers: 1. upper layer PET;2. an upper layer line; 3. upper layer insulating UV;4. an upper jumper; 5. upper waterproof glue; 6. middle layer PET;7. lower waterproof glue; 8. a lower jumper; 9. a lower insulating UV;10. a lower layer circuit; 11. lower PET.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

Example 1:

the embodiment 1 provides a production process for improving the printing precision of waterproof glue of a flexible circuit board, which comprises the following steps:

s1, printing an upper layer circuit 2, an upper layer insulating UV3 and an upper layer jumper 4 on an upper layer PET1 in sequence to form an upper line;

s2, sequentially printing a lower-layer circuit 10, a lower-layer insulating UV9, a lower-layer jumper wire 8 and a lower-layer waterproof adhesive 7 on a lower-layer PET11 to form a lower line, and attaching a protective film to the output end of the lower-layer circuit 10;

s3, laminating the middle PET6 corresponding to the lower waterproof glue 7 to complete alignment combination with the lower line;

s4, performing alignment printing of the upper waterproof glue 5 on the surface of the middle PET6 based on the printing position of the lower waterproof glue 7;

s5, aligning and combining the upper line corresponding to the upper layer waterproof glue 5, the middle layer PET6 and the lower line, so as to form the flexible circuit board with the structure shown in FIG. 1.

Example 2:

the embodiment 2 provides another production process for improving the printing precision of the waterproof glue of the flexible circuit board, which comprises the following steps:

s1, sequentially printing a lower layer circuit 10, a lower layer insulating UV9, a lower layer jumper wire 8 and a lower layer waterproof adhesive 7 on a lower layer PET11 to form a lower line, and attaching a protective film to the output end of the lower layer circuit 10;

s2, laminating the middle PET6 corresponding to the lower waterproof glue 7 to complete alignment combination with the lower line;

s3, performing alignment printing of the upper waterproof glue 5 on the surface of the middle PET6 based on the printing position of the lower waterproof glue 7;

s4, printing an upper layer circuit 2, an upper layer insulating UV3 and an upper layer jumper 4 on the upper layer PET1 in sequence to form an upper line;

According to the flexible circuit board production process provided by the embodiment 1 and the embodiment 2, when the upper layer waterproof glue is directly printed on the middle layer PET, the printed lower layer waterproof glue can be used as a reference to realize direct alignment printing with the lower layer PET, so that the combined offset tolerance of 0.2mm between the upper layer waterproof glue and the lower layer PET in the prior art is reduced, and the offset tolerance of the two waterproof glue can be controlled within 0.2 mm.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to the embodiments described above will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. The production process for improving the printing precision of the waterproof glue of the flexible circuit board is characterized by comprising the following steps of:

s1, sequentially printing an upper layer circuit (2), an upper layer insulating UV (3) and an upper layer jumper wire (4) on an upper layer PET (1) to form an upper line;

s2, sequentially printing a lower-layer circuit (10), a lower-layer insulating UV (9), a lower-layer jumper wire (8) and a lower-layer waterproof adhesive (7) on a lower-layer PET (11) to form a lower line, and attaching a protective film to the output end of the lower-layer circuit (10);

s3, laminating the middle PET (6) corresponding to the lower waterproof adhesive (7) to complete alignment combination with the lower line;

s4, performing alignment printing of the upper waterproof glue (5) on the surface of the middle PET (6) based on the printing position of the lower waterproof glue (7);

s5, aligning and combining the upper line corresponding to the upper layer waterproof glue (5), the middle layer PET (6) and the lower line.

2. The production process for improving the printing precision of the waterproof glue of the flexible circuit board is characterized by comprising the following steps of:

s1, sequentially printing a lower-layer circuit (10), a lower-layer insulating UV (9), a lower-layer jumper wire (8) and a lower-layer waterproof adhesive (7) on a lower-layer PET (11) to form a lower line, and attaching a protective film to the output end of the lower-layer circuit (10);

s2, laminating the middle PET (6) corresponding to the lower waterproof adhesive (7) to complete alignment combination with the lower line;

s3, performing alignment printing of the upper waterproof glue (5) on the surface of the middle PET (6) based on the printing position of the lower waterproof glue (7);

s4, sequentially printing an upper layer circuit (2), an upper layer insulating UV (3) and an upper layer jumper wire (4) on the upper layer PET (1) to form an upper line;