CN116913854A - Substrate conveying equipment - Google Patents
Substrate conveying equipment Download PDFInfo
- Publication number
- CN116913854A CN116913854A CN202311133266.9A CN202311133266A CN116913854A CN 116913854 A CN116913854 A CN 116913854A CN 202311133266 A CN202311133266 A CN 202311133266A CN 116913854 A CN116913854 A CN 116913854A
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- conveying assembly
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- 239000000758 substrate Substances 0.000 title claims abstract description 50
- 230000007246 mechanism Effects 0.000 claims abstract description 88
- 230000001360 synchronised effect Effects 0.000 claims abstract description 4
- 230000005540 biological transmission Effects 0.000 claims description 26
- 238000007599 discharging Methods 0.000 claims description 11
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application discloses substrate conveying equipment, which comprises a mounting conveying mechanism, wherein the mounting conveying mechanism comprises a base, a first conveying component, a second conveying component, a conveying mechanism and an adjusting mechanism, the first conveying component and the second conveying component are arranged at the same height and are used for conveying substrates, and the conveying mechanism drives the first conveying component and the second conveying component to realize synchronous conveying; the first conveying assembly and the second conveying assembly can synchronously lift through the adjusting mechanism; be equipped with the loading board between first conveying subassembly with be equipped with the second conveying subassembly, the loading board is used for supporting and is located first conveying subassembly with the eccentric mechanism of base plate on the second conveying subassembly can promote first conveying subassembly and second conveying subassembly, control the base plate height, be equipped with the loading board between first conveying subassembly and the second conveying subassembly, thereby the eccentric mechanism control base plate height makes the loading board prop up the base plate and guarantees the base plate levelness when the subsides dress, improves the dress precision.
Description
Technical Field
The application relates to the technical field of semiconductor packaging, in particular to substrate conveying equipment.
Background
Along with the continuous development of science and technology, electronic products are continuously developed towards the direction of high density and high integration, and the requirements on mounting accuracy are higher and higher, including the accuracy of placing chips on the preset positions of a substrate.
The existing mounting equipment is used for transporting the substrate through the conveying belt, the problem that the substrate levelness is poor possibly exists, and the accuracy of chip mounting cannot be guaranteed during mounting.
Disclosure of Invention
The application aims at overcoming the defects and shortcomings of the prior art, and provides substrate conveying equipment, which is provided with an adjusting mechanism and a bearing plate, wherein the adjusting mechanism can enable a substrate to fall on the bearing plate, so that the levelness of the substrate is ensured, and the mounting precision of a chip is improved, and the technical scheme is as follows:
the substrate conveying equipment comprises a mounting conveying mechanism, wherein the mounting conveying mechanism comprises a base, a first conveying assembly, a second conveying assembly, a conveying mechanism and an adjusting mechanism, the first conveying assembly and the second conveying assembly are arranged at the same height and used for conveying substrates, and the conveying mechanism drives the first conveying assembly and the second conveying assembly to realize synchronous conveying; the first conveying assembly and the second conveying assembly can synchronously lift through the adjusting mechanism; and a bearing plate is arranged between the first conveying assembly and the second conveying assembly and is used for supporting the substrate positioned on the first conveying assembly and the second conveying assembly.
Preferably, the adjusting mechanism comprises an eccentric mechanism, a first sliding component, a second sliding component, a third sliding component and a connecting plate fixed on the first sliding component, and the first sliding component is arranged on the base; the first conveying assembly can move up and down along the connecting plate through the second sliding assembly, and the second conveying assembly can move up and down along one side of the base through the third sliding assembly.
Preferably, the eccentric mechanism comprises a second motor and at least one eccentric shaft, the second motor drives the at least one eccentric shaft to synchronously rotate, the eccentric shaft is arranged below the first conveying assembly and the second conveying assembly, and supporting pieces contacted with the eccentric shaft are respectively arranged below the first conveying assembly and the second conveying assembly.
Preferably, the support comprises a bearing or a roller.
Preferably, the eccentric mechanism further comprises a second sensor for assisting in controlling the rotation angle of the eccentric shaft.
Preferably, a first sensor for detecting whether the substrate is conveyed in place is arranged on one side of the bearing plate.
Preferably, the adjusting mechanism further includes a driving shaft sliding seat and a driving shaft fixing seat, the driving shaft fixing seat supports a driving shaft driving the first and second conveying assemblies, and the driving shaft fixing seat can move up and down along the driving shaft sliding seat.
Preferably, the bearing plate is provided with a vacuum seat, and micropores for realizing negative pressure are densely distributed on the upper surface of the vacuum seat.
Preferably, the carrier plate moves up and down by the adjusting mechanism.
The application also provides substrate conveying equipment, which comprises a mounting conveying mechanism, wherein the mounting conveying mechanism comprises a base, a first conveying assembly, a second conveying assembly, a conveying mechanism and an adjusting mechanism, the first conveying assembly and the second conveying assembly are arranged at the same height and used for conveying substrates, and the conveying mechanism drives the first conveying assembly and the second conveying assembly to realize synchronous conveying; a bearing plate is arranged between the first conveying assembly and the second conveying assembly and is used for supporting the substrates positioned on the first conveying assembly and the second conveying assembly; the bearing plate moves up and down through the adjusting mechanism.
The application also provides substrate conveying equipment, which comprises the mounting conveying mechanism, a feeding mechanism and a discharging mechanism, wherein the number of the mounting conveying mechanisms is at least one.
The beneficial effects of the application are as follows:
through setting up adjustment mechanism, can adjust the height of first conveying subassembly and second conveying subassembly, and then control the height of base plate, be equipped with the loading board between first conveying subassembly and the second conveying subassembly, adjustment mechanism control base plate height makes the base plate fall on the loading board when the dress to guarantee the levelness of base plate, thereby improve the dress precision of chip.
Drawings
FIG. 1 is an isometric view of the present application;
FIG. 2 is a top view of the present application;
FIG. 3 is a cross-sectional view at A-A of the present application;
fig. 4 is an axial schematic view of the mounting and conveying mechanism of the present application.
In the figure:
1-feeding mechanism, 2-mounting conveying mechanism, 3-discharging mechanism, 30-tensioning wheel, 40-tensioning wheel fixing seat, 4-base, 41-adjusting plate, 42-movable plate, 5-first conveying component, 6-second conveying component, 7-conveying mechanism, 71-first motor, 72-driving shaft, 73-driving shaft sliding seat, 74-driving shaft fixing seat, 8-bearing plate, 9-eccentric mechanism, 91-second motor, 92-eccentric shaft, 93-eccentric shaft fixing seat, 10-adjusting mechanism, 101-first sliding component, 102-second sliding component, 103-connecting plate, 104-third sliding component, 105-fourth sliding component, 111-first sensor, 112-second sensor, 1000-supporting piece, 1001-first driving belt and 1002 second driving belt.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Example 1
Referring to fig. 1 to 4, a substrate conveying apparatus of a chip package conveying apparatus includes a mounting conveying mechanism, the mounting conveying mechanism 2 includes a base 4, a first conveying component 5, a second conveying component 6, a conveying mechanism 7, a carrier plate 8 and an eccentric mechanism 9, the first conveying component 5 and the second conveying component 6 are disposed at the same height for conveying a substrate, the conveying mechanism 7 is respectively connected with the first conveying component 5 and the second conveying component 6 and is used for driving the first conveying component 5 and the second conveying component 6, the carrier plate is used for supporting the substrate on the first conveying component 5 and the second conveying component 6, and the first conveying component and the second conveying component are used for conveying the substrate along a third direction (left-right direction in fig. 2).
Referring to fig. 2, the mounting and conveying mechanism 2 further includes an adjusting mechanism 10, where the adjusting mechanism includes an eccentric mechanism 9, a first sliding component 101, a second sliding component 102, a third sliding component 104, and a connecting plate 103, in this embodiment, the connecting plate is "L" shaped, the first sliding component 101 is disposed on the base 4, and is connected to the first sliding component 101 and the first conveying component 5 through the connecting plate 103, a first sensor 111 is disposed on one side of the carrier plate 8, and is used for detecting whether the substrate is conveyed in place, and the first conveying component 5 and the second conveying component 6 are disposed oppositely, and are used for conveying the substrate, and the conveying mechanism 7 synchronously drives the first conveying component 5 and the second conveying component 6, and the carrier plate 8 is disposed between the first conveying component 5 and the second conveying component 6.
The first conveying assembly 5 moves up and down along the connecting plate 103 through the second sliding assembly 102; the second transfer assembly 6 moves up and down along one side of the base 4 by a third sliding assembly 104; in this embodiment, the first sliding component 101 may specifically be a sliding rail and a sliding block; the second sliding component 102 may be a sliding rail and a sliding block, the third sliding component 104 may be a sliding rail and a sliding block, the first sliding component 101 may push the first conveying component 5 to move along a first direction (back and forth in fig. 4), and the first conveying component 5 and the second conveying component 6 may move along a second direction (up and down in fig. 3) through the second sliding component 102 and the third sliding component 104, and the distance between the first conveying component 5 and the second conveying component 6 may be adjusted through the first sliding component 101 so as to aim at substrates with different specifications and sizes.
Referring to fig. 2 to 4, the transmission mechanism 7 includes a first motor 71 and a driving shaft 72, the first motor 71 is disposed on the other side of the base 4, the first motor 71 is in transmission connection with the driving shaft 72 through a first transmission belt 1001, the driving shaft 72 drives the first transmission assembly 5 and the second transmission assembly 6 to rotate synchronously, the first sliding assembly 101 can slide on the driving shaft 72, the first motor 71 drives the driving shaft 72 to drive the first transmission assembly 5 and the second transmission assembly 6 to rotate synchronously, besides, the first motor 71 and the driving shaft 72 may also be in gear transmission, chain transmission or coupling connection.
The first conveying assembly comprises an adjusting plate 41, a first supporting block, a first driven wheel, a first tensioning wheel, a first belt and a first driving wheel, wherein the first supporting block, the first driven wheel, the first tensioning wheel, the first belt and the first driving wheel are arranged on the adjusting plate, the first driven wheel, the first tensioning wheel and the first driving wheel are connected through the first belt, the first supporting block is used for supporting the first belt, the first tensioning wheel is used for controlling the tensioning force of the belt, the second conveying assembly comprises a movable plate 42, a second supporting block, a second driving wheel, a second tensioning wheel and a second belt, the second supporting block, the second driven wheel and the second tensioning wheel are arranged on the movable plate, the second driving wheel and the second tensioning wheel are connected through the second belt, the second supporting block is used for supporting the second belt, the second tensioning wheel is used for controlling the tensioning force of the second belt, and the first driving wheel and the second driving wheel are respectively arranged on the driving shaft.
The eccentric mechanism 9 comprises a second motor 91 and an eccentric shaft 92, the second motor 91 is arranged on the other side of the base 4, the first conveying component 5 and the second conveying component 6 are respectively provided with a supporting piece 1000 tangential to the surface of the eccentric shaft 92, the second motor 91 and the eccentric shaft 92 are in transmission connection, two sides of the bearing plate 8 are respectively provided with the eccentric shaft 92, the eccentric shafts 92 are connected through a second transmission belt 1002, the second motor 91 drives any eccentric shaft 92 to synchronously rotate through the second transmission belt 1002, in addition, chain transmission or gear transmission and the like can be adopted between the second motor 91 and the eccentric shaft 92, a second sensor 112 is arranged on one side of the eccentric shaft 92 and used for assisting in controlling the rotation angle of the eccentric shaft 92, and the eccentric mechanism can be replaced by a screw rod or a cylinder and the like.
The tensioning mechanism is used for controlling tensioning force of the second transmission belt 1002, the tensioning mechanism comprises a tensioning wheel fixing seat 40 and a tensioning wheel 30, the tensioning wheel 30 is tightly pressed on the second transmission belt 1002, the tensioning wheel fixing seat 40 is arranged on a base 4, an adjusting groove is formed in the tensioning wheel fixing seat 40, the tensioning wheel 30 is adjustably arranged on the tensioning wheel fixing seat, a supporting piece 1000 is arranged on the first transmission assembly 5 and the second transmission assembly 6, the first transmission assembly 5 and the second transmission assembly 6 are driven by a second motor 91 to push by the eccentric shaft 92 to move up and down along the second sliding assembly 102, so that substrates located on the first transmission assembly and the second transmission assembly can move up and down, a bearing plate 8 capable of supporting the substrates is arranged between the first transmission assembly 5 and the second transmission assembly 6, the substrates are supported by the bearing plate 8 during mounting, levelness of the substrates can be guaranteed, and mounting accuracy is improved.
The base 4 is provided with a driving shaft sliding seat 73 for fixing the driving shaft 72 and a driving shaft fixing seat 74, the driving shaft 72 passes through the driving shaft fixing seat 74, the driving shaft fixing seat 74 is connected to the driving shaft sliding seat 73 through a fourth sliding component 105, one end of the eccentric shaft 92 is further provided with an eccentric shaft fixing seat 93, the eccentric shaft fixing seat 93 is coaxially arranged with the second motor 91 and supports one end of the eccentric shaft 92, and the other end of the eccentric shaft 92 is arranged on one side of the base 4.
Example two
The present embodiment provides a substrate conveying apparatus, which is different from the first embodiment mainly in that: the position of the substrate in the height direction is unchanged, and the substrate is supported or separated by the up-and-down movement of the bearing plate 8;
the specific implementation mode is as follows:
the bearing plate 8 is arranged on the base 4 through a bearing plate supporting seat, the bearing plate 8 moves up and down along the bearing plate supporting seat through a third sliding piece, the eccentric shaft 92 is arranged below the bearing plate 8, a supporting piece 1000 is arranged on the bearing plate 8, the supporting piece 1000 is tangential to the outer surface of the eccentric shaft 92, the first conveying component 5 is connected with the first sliding component 101, the first conveying component 5 can move along a first direction (front and back direction) through the first sliding component 101, the second conveying component 6 is arranged on one side of the base 4, when the eccentric shaft 92 is driven to rotate by the second motor 91, the eccentric shaft 92 pushes the bearing plate 8 to move along a second direction (up and down direction) through the second sliding component 102, and the bearing plate can support a base plate.
Other features of this embodiment are the same as those of the first embodiment, and will not be described again.
Example III
On the basis of the first embodiment or the second embodiment, the vacuum seat is provided on the carrying plate 8, as shown in fig. 1 and fig. 4, micropores for realizing negative pressure are densely distributed on the upper surface of the vacuum seat, and the substrate can be more firmly supported by the vacuum seat.
Example IV
On the basis of the first embodiment, the second embodiment or the third embodiment, the substrate conveying device comprises a base 4, a feeding mechanism 1, at least one mounting conveying mechanism 2 and a discharging mechanism 3, wherein the feeding mechanism 1, the at least one mounting conveying mechanism 2 and the discharging mechanism 3 are sequentially arranged on the base 4, one or more mounting conveying mechanisms 2 can be arranged, in the embodiment, two mounting conveying mechanisms 2 are arranged, and the substrate conveying device is suitable for double-station mounting. The feeding mechanism 1 and the discharging mechanism 3 can be interchanged according to the conveying direction.
The feeding mechanism 1 is used for feeding a substrate to be mounted, and the mounting conveying mechanism is used for bearing the substrate so as to facilitate mounting a chip on the substrate and conveying the chip; the discharging mechanism is used for discharging the mounted substrate; the discharging end of the feeding mechanism 1 is communicated with the feeding end of the mounting conveying mechanism 2, and the discharging end of the mounting conveying mechanism 2 is communicated with the feeding end of the discharging mechanism 3.
Claims (7)
1. A substrate conveying apparatus, characterized in that: the device comprises a mounting conveying mechanism, wherein the mounting conveying mechanism comprises a base, a first conveying assembly, a second conveying assembly, a transmission mechanism and an adjusting mechanism, the first conveying assembly and the second conveying assembly are arranged at the same height and used for conveying a substrate, and the transmission mechanism drives the first conveying assembly and the second conveying assembly to realize synchronous conveying; the first conveying assembly and the second conveying assembly can synchronously lift through the adjusting mechanism; a bearing plate is arranged between the first conveying assembly and the second conveying assembly and is used for supporting the substrates positioned on the first conveying assembly and the second conveying assembly;
the adjusting mechanism comprises an eccentric mechanism, a first sliding component, a second sliding component, a third sliding component and a connecting plate fixed on the first sliding component, and the first sliding component is arranged on the base; the first conveying assembly can move up and down along the connecting plate through the second sliding assembly, and the second conveying assembly can move up and down along one side of the base through the third sliding assembly;
the adjusting mechanism further comprises a driving shaft sliding seat and a driving shaft fixing seat, the driving shaft fixing seat supports a driving shaft for driving the first conveying assembly and the second conveying assembly, and the driving shaft fixing seat can move up and down along the driving shaft sliding seat;
the eccentric mechanism comprises a second motor and at least one eccentric shaft, the second motor drives the at least one eccentric shaft to synchronously rotate, the eccentric shaft is arranged below the first conveying assembly and the second conveying assembly, and supporting pieces which are in contact with the eccentric shaft are respectively arranged below the first conveying assembly and the second conveying assembly.
2. The substrate conveying apparatus according to claim 1, wherein: the support comprises a bearing or a roller.
3. The substrate conveying apparatus according to claim 1, wherein: the eccentric mechanism further comprises a second sensor for assisting in controlling the rotation angle of the eccentric shaft.
4. The substrate conveying apparatus according to claim 1, wherein: and one side of the bearing plate is provided with a first sensor for detecting whether the substrate is conveyed in place or not.
5. The substrate conveying apparatus according to claim 1, wherein: the bearing plate is provided with a vacuum seat, and micropores for realizing negative pressure are densely distributed on the upper surface of the vacuum seat.
6. The substrate conveying apparatus according to claim 1, wherein: the bearing plate moves up and down through the adjusting mechanism.
7. The substrate transfer apparatus according to any one of claims 1 to 6, wherein: the device also comprises a feeding mechanism and a discharging mechanism, wherein the number of the mounting conveying mechanisms is at least one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311133266.9A CN116913854A (en) | 2023-09-05 | 2023-09-05 | Substrate conveying equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311133266.9A CN116913854A (en) | 2023-09-05 | 2023-09-05 | Substrate conveying equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116913854A true CN116913854A (en) | 2023-10-20 |
Family
ID=88363263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311133266.9A Pending CN116913854A (en) | 2023-09-05 | 2023-09-05 | Substrate conveying equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116913854A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005335956A (en) * | 2004-05-27 | 2005-12-08 | Quanta Display Inc | Base board carrying device |
| KR20110095029A (en) * | 2010-02-18 | 2011-08-24 | 삼성테크윈 주식회사 | Conveyer device of chip mounter |
| KR20120075374A (en) * | 2010-12-28 | 2012-07-06 | 에이피시스템 주식회사 | Conveyor module and apparatus for treating substrate having the same |
| CN202601596U (en) * | 2012-05-31 | 2012-12-12 | 北京京东方光电科技有限公司 | Base plate transmission device and vacuum transmission device |
| CN212558253U (en) * | 2020-06-16 | 2021-02-19 | 上海矩子科技股份有限公司 | Overturning conveying device |
| CN113511460A (en) * | 2021-05-28 | 2021-10-19 | 浙江水晶光电科技股份有限公司 | Support plate lifting device and support plate conveying belt detection table |
| CN215099935U (en) * | 2021-05-28 | 2021-12-10 | 浙江水晶光电科技股份有限公司 | Support plate lifting device and support plate conveying belt detection table |
| CN217086544U (en) * | 2022-04-01 | 2022-07-29 | 江苏科瑞恩自动化科技有限公司 | Conveying and feeding device for flat plate elements and wafer ring mounting device |
| CN114975206A (en) * | 2022-06-28 | 2022-08-30 | 深圳新益昌科技股份有限公司 | Substrate transportation module and die bonder |
-
2023
- 2023-09-05 CN CN202311133266.9A patent/CN116913854A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005335956A (en) * | 2004-05-27 | 2005-12-08 | Quanta Display Inc | Base board carrying device |
| KR20110095029A (en) * | 2010-02-18 | 2011-08-24 | 삼성테크윈 주식회사 | Conveyer device of chip mounter |
| KR20120075374A (en) * | 2010-12-28 | 2012-07-06 | 에이피시스템 주식회사 | Conveyor module and apparatus for treating substrate having the same |
| CN202601596U (en) * | 2012-05-31 | 2012-12-12 | 北京京东方光电科技有限公司 | Base plate transmission device and vacuum transmission device |
| CN212558253U (en) * | 2020-06-16 | 2021-02-19 | 上海矩子科技股份有限公司 | Overturning conveying device |
| CN113511460A (en) * | 2021-05-28 | 2021-10-19 | 浙江水晶光电科技股份有限公司 | Support plate lifting device and support plate conveying belt detection table |
| CN215099935U (en) * | 2021-05-28 | 2021-12-10 | 浙江水晶光电科技股份有限公司 | Support plate lifting device and support plate conveying belt detection table |
| CN217086544U (en) * | 2022-04-01 | 2022-07-29 | 江苏科瑞恩自动化科技有限公司 | Conveying and feeding device for flat plate elements and wafer ring mounting device |
| CN114975206A (en) * | 2022-06-28 | 2022-08-30 | 深圳新益昌科技股份有限公司 | Substrate transportation module and die bonder |
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Country or region after: China Address after: 214000 Jiangsu Wuxi Jinshanbei Science and Technology Industrial Park C1-8 Applicant after: Ennaji Intelligent Equipment (Wuxi) Co.,Ltd. Address before: 214000 Jiangsu Wuxi Jinshanbei Science and Technology Industrial Park C1-8 Applicant before: ENERGY INTELLIGENT TECHNOLOGY WUXI CO.,LTD. Country or region before: China |