CN116896849A - Heat radiation structure for modularized electronic element - Google Patents

Heat radiation structure for modularized electronic element Download PDF

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Publication number
CN116896849A
CN116896849A CN202310797493.5A CN202310797493A CN116896849A CN 116896849 A CN116896849 A CN 116896849A CN 202310797493 A CN202310797493 A CN 202310797493A CN 116896849 A CN116896849 A CN 116896849A
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CN
China
Prior art keywords
module
heat
medium
electronic component
liquid
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Pending
Application number
CN202310797493.5A
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Chinese (zh)
Inventor
卢艺杰
潘腾飞
魏礼贵
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Xiamen Kehua Digital Energy Tech Co Ltd
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Kehua Data Co Ltd
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Priority to CN202310797493.5A priority Critical patent/CN116896849A/en
Publication of CN116896849A publication Critical patent/CN116896849A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/61—Types of temperature control
    • H01M10/613—Cooling or keeping cold
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/62—Heating or cooling; Temperature control specially adapted for specific applications
    • H01M10/627—Stationary installations, e.g. power plant buffering or backup power supplies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/64—Heating or cooling; Temperature control characterised by the shape of the cells
    • H01M10/647—Prismatic or flat cells, e.g. pouch cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/653—Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/655—Solid structures for heat exchange or heat conduction
    • H01M10/6554—Rods or plates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/655—Solid structures for heat exchange or heat conduction
    • H01M10/6556—Solid parts with flow channel passages or pipes for heat exchange
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/656—Means for temperature control structurally associated with the cells characterised by the type of heat-exchange fluid
    • H01M10/6567—Liquids
    • H01M10/6568—Liquids characterised by flow circuits, e.g. loops, located externally to the cells or cell casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/656—Means for temperature control structurally associated with the cells characterised by the type of heat-exchange fluid
    • H01M10/6569—Fluids undergoing a liquid-gas phase change or transition, e.g. evaporation or condensation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Abstract

The invention provides a heat dissipation structure for a modularized electronic component, which comprises the following components: a contact heat sink medium and at least one heat transfer medium; wherein at least one electronic component forms a module; the number of the modules is one or more; the bottom surface of each electronic element in the module is directly contacted or indirectly contacted with a contact type heat dissipation medium; at least one heat conducting medium is in direct or indirect contact with any one or more electronic components, and the distance between the upper boundary of the heat conducting medium and the top surface of the module is equal to a first preset value, and the distance between the lower boundary of the heat conducting medium and the bottom surface of the module is equal to a second preset value; the thermal conductivity of the thermally conductive medium is greater than the thermal conductivity of the electronic component. Through set up the heat conduction medium in the side of module, can be with the heat transfer of module top to the bottom to reduce the module and go up the difference in temperature, effectively avoid energy storage battery local thermal runaway.

Description

Heat radiation structure for modularized electronic element
Technical Field
The present invention relates to electronic device temperature control, and more particularly to a heat dissipation structure for modularized electronic devices.
Background
The temperature of all electronic components is required to be less than the highest required temperature due to stability requirements, service life requirements and the like, and the temperature difference of all electronic components in a working state or starting is required to be within a certain range (generally within 3 ℃).
The conventional heat dissipation structure generally places all electronic components on the upper part of a contact heat dissipation medium (a liquid cooling plate is arranged on the bottom surface of the electronic components), and the electronic components transfer heat to the contact heat dissipation medium through heat conduction structural adhesive to realize heat dissipation.
The conventional heat conducting structure can cause large temperature difference between the upper part and the lower part of the electronic element body, the top temperature of the electronic element is a heat dissipation bottleneck point, and the contact heat dissipation medium with low temperature is contacted with the bottom surface of the electronic element which continuously generates heat, so that the temperature of the bottom surface of the battery core is low and the temperature of the top of the battery core is high. The larger the charge-discharge multiplying power is, the more obvious the high temperature difference is, for example, the upper and lower temperature difference of a 1C working condition battery cell can be up to approximately 20 ℃, and the highest temperature requirement is often difficult to meet as a heat dissipation bottleneck point of a system. Therefore, the conventional heat conduction structure cannot effectively dissipate heat in a part of the area, and local thermal runaway is easy to cause.
Disclosure of Invention
In view of the above, the present invention provides a heat dissipation structure for a modularized electronic device, which is intended to solve the problem that the prior art cannot effectively dissipate heat in a partial area and is easy to cause local thermal runaway.
A first aspect of an embodiment of the present invention provides a heat dissipation structure for a modularized electronic component, including: a contact heat sink medium and at least one heat transfer medium; wherein at least one electronic component forms a module; the number of the modules is one or more;
the bottom surface of each electronic element in the module is directly contacted or indirectly contacted with a contact type heat dissipation medium; at least one heat conducting medium is in direct or indirect contact with any one or more electronic components, and the distance between the upper boundary of the heat conducting medium and the top surface of the module is equal to a first preset value, and the distance between the lower boundary of the heat conducting medium and the bottom surface of the module is equal to a second preset value; the thermal conductivity of the thermally conductive medium is greater than the thermal conductivity of the electronic component.
In some possible implementations, the first preset value is between [0,0.5 h); the second preset value is between 0,0.5 h); h is the distance from the bottom surface to the top surface of the electronic component.
In some possible implementations, the width of each heat transfer medium is equal to a preset multiple of the first width; the width of the surface of the first width module, which is contacted with the heat conduction medium; the preset multiple is between (1/2, 1), the direction from the bottom surface to the top surface of the electronic element is the height direction, and the width direction is vertical to the height direction.
In some possible implementations, the contact heat dissipation medium is a liquid cooling plate, and the module is a battery module; the heat conduction medium is a phase-change temperature-equalizing plate; the battery module is cuboid, and is provided with four side surfaces except the top surface and the bottom surface; the liquid cooling plate is provided with a liquid outlet and a liquid inlet, one side of the battery module close to the liquid outlet and the liquid inlet is provided with a front side surface and a rear side surface respectively, and the left side surface and the right side surface are provided with left side surfaces and right side surfaces; the battery module consists of a plurality of battery cores; the battery cells are arranged in a row from the front side surface to the rear side surface; the phase-change temperature-equalizing plate is contacted with the left side surface and/or the right side surface, and the contact area is equal to the area of the left side surface and/or the right side surface multiplied by a third preset value; the third preset value is between [0.25,1 ].
In some possible implementations, the liquid inlet and the liquid outlet are arranged in a staggered manner; the flow of the cold liquid flowing through the heat dissipation teeth between the liquid inlet and the liquid outlet is a first flow, and a strong flow area is formed; the two sides of the strong flow area along the flowing direction of the cold liquid are weak flow areas; the cold liquid flow path of the weak flow area is larger than that of the first flow path; a phase change temperature equalizing plate is contacted between the battery module in the strong current area and the battery module in the weak current area.
In some possible implementations, the left-to-right direction of the battery module is the first direction; each battery module is arranged along the first direction, and a phase-change temperature equalizing plate is contacted between the battery module close to the liquid inlet and the battery module far away from the liquid inlet.
In some possible implementations, when any cell reaches a preset temperature, the contact state of the phase change temperature equalizing plate and the cell is changed from contact to non-contact; the preset temperature is less than 850 ℃.
In some possible implementations, the phase-change temperature equalizing plate is adhered to at least one side surface of the module through heat-conducting glue; the melting point of the heat-conducting glue is between (140, 850); the thermal conductivity of the heat-conducting glue is greater than that of the module.
In some possible implementations, the shell of the phase change temperature equalizing plate is an aluminum alloy shell; the melting point of the aluminum alloy shell is between 450 ℃ and 650 ℃.
In some possible implementations, the phase change temperature equalizing plate includes: an evaporator, a condenser, a cooling liquid and a capillary channel; the evaporator is arranged on the contact surface of the phase-change temperature-equalizing plate and the battery module; the condenser is arranged at the contact end of the phase-change temperature equalizing plate and the liquid cooling plate; one end of the capillary channel is connected with the evaporator; the other end of the capillary channel is connected with the condenser; the capillary channel is positioned in the aluminum alloy shell close to one side of the battery module; the cooling fluid flows between the evaporator and the condenser through capillary channels.
The heat dissipation structure for a modularized electronic component provided by the embodiment of the invention comprises: a contact heat sink medium and at least one heat transfer medium; wherein at least one electronic component forms a module; the number of the modules is one or more; the bottom surface of each electronic element in the module is directly contacted or indirectly contacted with a contact type heat dissipation medium; at least one heat conducting medium is in direct or indirect contact with any one or more electronic components, and the distance between the upper boundary of the heat conducting medium and the top surface of the module is equal to a first preset value, and the distance between the lower boundary of the heat conducting medium and the bottom surface of the module is equal to a second preset value; the thermal conductivity of the thermally conductive medium is greater than the thermal conductivity of the electronic component. Through set up the heat conduction medium in the side of module, can be with the heat transfer of module top to the bottom to reduce the module and go up the difference in temperature, effectively avoid energy storage battery local thermal runaway.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a heat dissipation structure for a modularized electronic component according to an embodiment of the present invention;
fig. 2 is a schematic diagram of temperature distribution of an energy storage battery under a conventional liquid cooling heat dissipation structure;
fig. 3 is a schematic structural diagram of a heat dissipation structure for a modularized electronic component according to another embodiment of the present invention.
Detailed Description
In the following description, for purposes of explanation and not limitation, specific details are set forth such as the particular system architecture, techniques, etc., in order to provide a thorough understanding of the embodiments of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.
Fig. 1 is a schematic structural diagram of a heat dissipation structure for a modularized electronic component according to an embodiment of the present invention. As shown in fig. 1, in some embodiments, a heat dissipation structure for a modular electronic component includes: a contact heat dissipation medium 11 and at least one heat conduction medium 12; wherein at least one electronic component forms a module; the number of the modules is one or more; the bottom surface of each electronic element in the module is directly contacted or indirectly contacted with the contact heat dissipation medium 11; at least one heat transfer medium 12 is in direct or indirect contact with any one or more electronic components, and the distance between the upper boundary of the heat transfer medium 12 and the top surface of the module is equal to a first preset value, and the distance between the lower boundary of the heat transfer medium 12 and the bottom surface of the module is equal to a second preset value; the thermal conductivity of the thermally conductive medium 12 is greater than the thermal conductivity of the electronic component.
In the embodiment of the present invention, the contact heat dissipation medium 11 may be a medium capable of rapidly dissipating heat, such as a copper plate, an aluminum plate, or a liquid cooling plate, which is not limited herein. The electronic component may be a battery cell, a capacitor, or the like, and is not limited herein. The module may be a module composed of a single large capacitor or a module composed of a plurality of cells, which is not limited herein. The shape of the module may be a rectangular parallelepiped, a cylinder, etc., and is not limited herein. When the module is a cuboid, the heat transfer medium may be adhered to one or more of the four sides of the module, and when the module is a cylinder, the heat transfer medium may be adhered to the only side of the module. The heat transfer medium may be a copper plate, an aluminum plate, a phase change temperature equalizing plate, or the like, and is not limited herein.
In some embodiments, the first preset value is between [0,0.5 h); the second preset value is between 0,0.5 h); h is the distance from the bottom surface to the top surface of the electronic component. The width of each heat transfer medium is equal to a preset multiple of the first width; the width of the surface of the first width module, which is contacted with the heat conduction medium; the preset multiple is between (1/2, 1), the direction from the bottom surface to the top surface of the electronic element is the height direction, and the width direction is vertical to the height direction.
In the embodiment of the invention, when the module is a cuboid, h is specifically the distance from the bottom surface to the top surface of the cuboid, namely the height of the cuboid, and the first width is the width of any one of four side surfaces. When the module is a cylinder, h is specifically the distance from the bottom surface to the top surface of the cylinder, i.e. the height of the cylinder, and the first width is specifically the circumference of the side surface of the cylinder.
For example, the first preset value may be h/4; the second preset value may be h/4; the width of the heat transfer medium may be 1/2 of the first width. The width direction is perpendicular to the height direction. By defining the dimensions of the heat transfer medium, an efficient heat dissipation of the module by the heat transfer medium can be ensured.
The bottom surface of each electronic component in the module is in contact with the contact heat dissipation medium 11, so that the temperature of the top of the module is higher than the bottom of the module, and therefore the heat conduction medium 12 can be stuck on the side surface, so that the heat of the top is conducted to the bottom.
The more the side surfaces of the heat transfer medium 12 are provided, the better the heat transfer effect, and the higher the temperature uniformity. The heat conductive medium 12 may be a sheet, a matrix sheet, or a wafer, and is not limited thereto. The more electronic components are covered by the heat-conducting medium, the higher the temperature uniformity. The smaller the distance between the upper boundary of the heat transfer medium 12 and the top surface of the module, the higher the temperature uniformity. The smaller the distance between the lower boundary of the heat transfer medium 12 and the bottom surface of the module, the higher the uniformity of temperature.
When the distance between the lower boundary of the heat transfer medium and the bottom surface of the module is zero, that is, when the lower boundary of the heat transfer medium 12 contacts the contact heat dissipation medium 11, the heat transfer is changed from the upper-heat transfer medium-lower-contact heat dissipation medium to the upper-heat transfer medium-contact heat dissipation medium, and the heat transfer efficiency is higher.
In some embodiments, the thermally conductive medium 12 is in contact with each electronic component in the module.
In the embodiment of the invention, when the heat conduction medium 12 is in contact with each electronic element in the module, the upper part of each electronic element can be quickly radiated, so that the temperature uniformity among the electronic elements in the module can be realized.
In some embodiments, the contact area between the thermally conductive medium and the side that it contacts is equal to the area of the side that it contacts.
In the embodiment of the present invention, when the contact area is the same as the area of the side contacted, the heat conduction efficiency of the heat conduction medium 12 to the side is maximized. If the heat conduction medium 12 with corresponding size is arranged on the four sides, the heat conduction efficiency can be effectively improved, and the local thermal runaway is avoided.
Fig. 2 is a schematic diagram of temperature distribution of an energy storage battery under a conventional liquid cooling heat dissipation structure. As shown in fig. 2, taking a liquid-cooled energy storage battery as an example, the liquid-cooled plate is mounted on the bottom surface, that is, the electric cores of all the pure energy batteries are mounted on the liquid-cooled plate and are in direct contact with the liquid-cooled plate, the opposite surface of the liquid-cooled plate is a top surface, the liquid-cooled plate is provided with a liquid outlet and a liquid inlet, one side close to the liquid outlet and the liquid inlet and the opposite side thereof are respectively a front side surface and a rear side surface, and the remaining two surfaces are a left side surface and a right side surface. The 12 battery cells in the front-rear direction are one battery module, and four battery modules are arranged in the left-right direction.
From the above temperature distribution diagram, it can be obtained that, for the cell temperature near the liquid inlet is smaller than the cell temperature far from the liquid inlet, the top temperature of the cell is higher than the bottom temperature. In order to avoid local temperature runaway, the present invention is modified as follows based on the liquid-cooled energy storage cell shown in fig. 1.
Fig. 3 is a schematic structural diagram of a heat dissipation structure for a modularized electronic component according to another embodiment of the present invention. Fig. 3 is only a specific example given by way of example, and not by way of limitation, of the present invention. As shown in fig. 3, in some embodiments, the contact heat dissipation medium 11 is a liquid cooling plate 31 and the module is a battery module 32; the heat conduction medium 12 is a phase-change temperature-equalizing plate 33; the battery module 32 is a rectangular parallelepiped having four side surfaces except the top and bottom surfaces; the liquid cooling plate 31 is provided with a liquid outlet and a liquid inlet, one side of the battery module 32 close to the liquid outlet and the liquid inlet is provided with a front side surface and a rear side surface respectively, and the other two sides are provided with a left side surface and a right side surface; the battery module 32 is composed of a plurality of battery cells; the battery cells are arranged in a row from the front side to the back side; the phase-change temperature-equalizing plate is equal to the area of the left side surface and/or the right side surface multiplied by a third preset value; the third preset value is between [0.25,1 ].
In the embodiment of the invention, the battery cells are arranged in a row from the left side face to the right side face; when the phase-change temperature-equalizing plates are in contact with the left side surface and/or the right side surface, and the contact area is equal to the area of the left side surface and/or the right side surface, each phase-change temperature-equalizing plate 33 is in contact with all the electric cores in the corresponding battery module 32; the bottom surface of the phase-change temperature-equalizing plate 33 is in contact with the liquid-cooling plate 31. At this time, the phase change temperature equalizing plate 33 has good thermal conductivity, and can perform overall soaking through phase change, namely, heat on the upper part of the battery cell is transferred to the liquid cooling plate 31, the upper part and the lower part of the battery cell are subjected to temperature equalizing, and the heat of the battery cell far away from the liquid inlet can be transferred to the liquid cooling plate 31, so that the temperature equalizing is performed among the battery cells, and the local thermal runaway of the energy storage battery is effectively avoided.
In the embodiment of the present invention, the arrangement of the battery modules shown in fig. 3, the number of battery cells in the battery modules, and the like are examples of the present invention, and are not limited thereto.
When the battery pack is provided with only one battery module, the phase-change temperature equalizing plates are arranged on the left side and the right side of the battery module.
When the battery pack comprises a plurality of battery modules 32, a phase-change temperature-equalizing plate 33 is arranged between every two adjacent battery modules 32, and the phase-change temperature-equalizing plates 33 are also arranged on the outer sides of the battery modules 32 at the edges, so that the phase-change temperature-equalizing plates are arranged on the left side and the right side of each battery module, the temperature of the left side and the right side of each battery module can be transferred to the liquid cooling plate 31, the temperature equalization can be carried out on the upper part and the lower part of the battery cell monomer and between each battery cell, and the temperature equalization between each battery module can be realized.
In some embodiments, the liquid inlet and the liquid outlet are arranged in a staggered manner; the flow of the cold liquid flowing through the heat dissipation teeth between the liquid inlet and the liquid outlet is a first flow, and a strong flow area is formed; the two sides of the strong flow area along the flowing direction of the cold liquid are weak flow areas; the cold liquid flow path of the weak flow area is larger than that of the first flow path; a phase change temperature equalizing plate is contacted between the battery module in the strong current area and the battery module in the weak current area.
When the contact type heat dissipation medium is a metal plate or an alloy plate, the heat dissipation efficiency of each area of the contact type heat dissipation medium is the same, and when the contact type heat dissipation medium is a liquid cooling plate, the heat dissipation efficiency of each area is different.
In the embodiment of the invention, obviously, the heat dissipation speed of the strong current area is larger than that of the weak current area, so that the heat dissipation speed of the weak current area can be improved and the temperature equalization between the battery modules can be realized by contacting the phase change temperature equalization plate between the battery modules in the strong current area and the battery modules in the weak current area.
In some embodiments, the left side to right side direction of the battery module is a first direction; the cold liquid flowing direction is parallel to the first direction; each battery module is arranged along the first direction, and a phase-change temperature equalizing plate is contacted between the battery module close to the liquid inlet and the battery module far away from the liquid inlet.
In the embodiment of the invention, the initial temperature of the cooling liquid of the liquid cooling plate is low, so that the heat dissipation of the battery module close to the liquid inlet is fast, and the cooling liquid of the liquid cooling plate continuously absorbs heat when flowing through each battery module, so that the temperature of the cooling liquid is relatively high when the cooling liquid is far away from the liquid inlet, and the heat dissipation of the battery module far away from the liquid inlet is slow. Therefore, the phase change temperature equalization plate is contacted between the battery module close to the liquid inlet and the battery module far away from the liquid inlet, and the temperature equalization between the battery modules can be realized.
The direction from the liquid inlet to the liquid outlet is the flowing direction of cold liquid, and the direction is parallel to the arrangement direction of the battery module, so that the battery module can be subjected to temperature equalization in the flowing direction of the cold liquid by arranging the phase change temperature equalization plate along the flowing direction of the cold liquid. According to the definition of the strong current area and the weak current area, the strong current area points to the direction of the weak current area and is perpendicular to the flowing direction of the cold liquid, so that a phase change temperature equalizing plate is contacted between the battery modules in the strong current area and the battery modules in the weak current area, and the temperature equalizing of the battery modules in the strong current area and the weak current area can be realized.
In addition, if the contact type heat dissipation medium is composed of a metal plate and a heat dissipation fan, the metal plate can be divided into a blade area (an area opposite to the heat dissipation fan) and a non-blade area, and obviously the problem of uneven heat dissipation exists in the blade area and the non-blade area as well, so that a phase change temperature equalization plate can be arranged between the battery module of the blade area and the battery module of the non-blade area.
Thermal runaway can be specifically divided into three phases:
first, the self-heating stage (50 ℃ -140 ℃): also called the heat accumulation phase, it starts with the dissolution of the SEI (solid electrolyte interface) film. When the temperature of the SEI film reaches about 90 ℃, the dissolution phenomenon of the SEI film is obviously observed, so that the negative electrode and the lithium-intercalated carbon component contained in the negative electrode are directly exposed in the electrolyte, and the lithium-intercalated carbon reacts with the electrolyte in an exothermic manner, thereby causing the temperature to rise. The increase in temperature in turn promotes further decomposition of the SEI film. If no external cooling means is used, the process can roll forward until the SEI film is completely decomposed. An efficient heat management scheme is needed to be adopted from the outside to inhibit the temperature rise of the lithium battery, so that the SEI film of the battery core is ensured not to rise to the dissolution temperature, and thermal runaway is naturally avoided.
Second, thermal runaway phase (140 ℃ -850 ℃): after the temperature exceeds 140 ℃, positive and negative electrode materials are added into the array of electrochemical reaction, and the mass of the reactant is increased, so that the temperature is increased more rapidly. Externally observable parameter changes are sudden drops in voltage, the process of which is described as: after reaching the temperature range, the diaphragm begins to melt in a large amount, and the anode and the cathode are directly communicated, so that large-scale short circuit is caused. So far, thermal runaway has started and will not stop. In a short time, intense reaction generates a large amount of gas and generates a large amount of heat at the same time, the heat heats the gas, the expanded gas breaks through the cell shell, phenomena such as material injection occur, and partial heat is taken away by the scattered materials. Thermal runaway reaches the most severe state. The highest temperature is reached at this stage as well. If there are other cells around, at this stage, thermal runaway may propagate to other cells by spreading heat to the surroundings. The heat may be conducted through the connected conductive elements, or may be conducted directly between the cell housings because of the volume expansion, with the cells originally held in place, already in close proximity to each other at this time.
Thermal runaway termination phase (850 ℃ -normal temperature): once thermal runaway occurs, its termination can only be complete burnout of the reactants. A report from the fire department shows that for devices containing high energy in a closed housing such as lithium batteries, the fire control means temporarily cannot terminate the ongoing thermal runaway. Fire extinguishing agents do not actually reach the ongoing reactive materials. Firefighters have a high risk in fire but can take relatively limited measures, typically isolating the scene of an accident. The thermal runaway process can be terminated naturally only when the reactants are exhausted.
According to the invention, by arranging the phase-change temperature-equalizing plate 33, the operation of an efficient thermal management scheme can be realized in the self-heating stage of the battery, so that the SEI film of the battery core is prevented from rising to the dissolution temperature and thermal runaway is prevented.
In some embodiments, when any cell reaches a preset temperature, the contact state of the phase change temperature equalizing plate and the cell is changed from contact to non-contact; the preset temperature is less than 850 ℃.
In the embodiment of the invention, the temperature of the lithium battery core is out of control and can reach 850 ℃, and the temperature equalizing plate shell is separated from contact with the out-of-control battery core at 850 ℃, so that the temperature of the out-of-control battery core is prevented from being transmitted to other battery cores through the phase-change temperature equalizing plate with high heat conduction characteristic.
In some embodiments, the phase change temperature equalizing plate is adhered to at least one side of the module through heat conducting glue; the melting point of the heat-conducting glue is between (140, 850). The thermal conductivity of the heat-conducting glue is greater than that of the module.
When the temperature of the battery cell exceeds the melting point of the heat conducting adhesive, the heat conducting adhesive becomes liquid, and the phase change temperature equalizing plate is not adhered to the high-temperature battery cell any more, so that heat is prevented from spreading to other battery cells.
When the melting point of the phase-change temperature-equalizing plate is lower than 850 ℃, the temperature-equalizing plate is not necessarily contacted with the hottest point at the dissolution position of the shell, and heat is prevented from spreading through the temperature-equalizing plate.
In the embodiment of the invention, the shell material of the phase-change temperature-equalizing plate can be metal, alloy and the like, and the material is determined according to the production requirement and cost of the battery, and the melting point is less than 850 ℃, which is not limited.
In some embodiments, the shell of the phase change temperature equalizing plate 33 is an aluminum alloy shell; the melting point of the aluminum alloy shell is between 450 ℃ and 650 ℃.
In some embodiments, the heat dissipation structure for the modularized electronic component includes a plurality of battery modules 32, wherein the bottom surface of each battery module 32 is in contact with the liquid cooling plate 31; two phase-change temperature-equalizing plates 33 are provided between each two adjacent battery modules 32.
In some embodiments, the contact surfaces of the two phase change temperature equalizing plates 33 disposed between each two adjacent battery modules 32 are coated with a heat insulating coating.
In the embodiment of the invention, the temperature equalizing characteristic of the temperature equalizing plate can realize the temperature equalizing of two adjacent battery modules, but in a thermal runaway state, the heat of the thermal runaway battery module is easily transferred to the adjacent battery modules, so that the thermal runaway is spread. Through being provided with two phase transition samming boards 33 between every two adjacent battery module 32, scribble the thermal insulation coating again, the left and right sides of every battery module 32 all is provided with phase transition samming board 33 promptly to make each battery module homoenergetic pass through samming board with heat transfer to the liquid cooling board, realize the samming of each battery module, and the phase transition samming board 33 of each battery module 32 is not shared, avoids thermal runaway to spread between different battery modules.
The above-mentioned melting of the phase change temperature equalizing plate or the heat conductive paste is only an exemplary description of the present invention, and is not limited thereto, and the above-mentioned two out-of-contact manners can be achieved when the heat conductive medium is made of materials other than the phase change temperature equalizing plate. I.e., the melting point of the heat-conducting glue adhering to the heat-conducting medium is between (140, 850) deg.c, or the melting point of the heat-conducting medium is between (140, 850) deg.c.
In some embodiments, the phase change temperature equalizing plate comprises: an evaporator, a condenser, a cooling liquid and a capillary channel; the evaporator is arranged on the contact surface of the phase-change temperature-equalizing plate and the battery module; the condenser is arranged at the contact end of the phase-change temperature equalizing plate and the liquid cooling plate; one end of the capillary channel is connected with the evaporator; the other end of the capillary channel is connected with the condenser; the capillary channel is positioned in the aluminum alloy shell close to one side of the battery module; the cooling fluid flows between the evaporator and the condenser through capillary channels.
In the embodiment of the invention, the principle of each Wen Bangong is the same as that of the heat pipe, and the four main steps of conduction, evaporation, convection and solidification are included. The temperature equalizing plate is a two-phase fluid device formed by injecting pure water (or other liquid working medium) into a container full of microstructures. In the working process, firstly, the vapor chamber base is heated, and the heat source heats the metal mesh micro evaporator; then the cooling liquid (liquid working medium) in the evaporator is heated under the vacuum ultra-low pressure environment and rapidly evaporated into hot air, the soaking plate adopts a vacuum design, and the hot air circulates in a metal mesh micro-environment (capillary channel); and then the hot air rises after being heated and is cooled after meeting a cold source at the upper part of the cooling plate, and is condensed into liquid again in the condenser, and finally the condensed cooling liquid flows back into the bottom surface evaporator through a capillary channel of the metal micro-structure.
Because there is the coolant liquid in the phase transition samming board, consequently can set up the capillary channel that transmits the coolant liquid in being close to in the aluminum alloy shell of battery module one side, when lithium cell thermal runaway, the shell is heated and melts, and the inside coolant liquid of samming board flows into the electric core that is out of control from the shell melting department, can assist to a certain extent to restrain electric core thermal runaway and to the thermal spread of other electric cores, prolongs certain time, strives for certain time for outside water fire control.
The cooling liquid inside the temperature equalizing plate can overflow effectively no matter any part is broken, the cooling liquid can be pressurized to a certain extent when the temperature equalizing plate is filled with the cooling liquid, and when the shell is melted, the cooling liquid is partially vaporized, the pressure becomes higher, so that the influences of atmospheric pressure and self gravity are overcome, and the cooling liquid is sprayed out from the melted broken part.
In addition, in order to ensure that the breaking point is controllable, namely breaking at an expected position, cooling liquid is sprayed to a designated position, the melting point of a shell material at the contact position of the phase-change temperature equalizing plate and the battery module is lower than the melting points of other positions of the phase-change temperature equalizing plate, so that after a certain battery cell is in thermal runaway, the phase-change temperature equalizing plate in thermal contact with the thermal runaway cell is higher than other thermal contact positions due to the fact that the melting point is lower than the melting point of other non-contact positions, and therefore the phase-change temperature equalizing plate only breaks at the contact position of the thermal runaway cell, and cooling liquid in the phase-change temperature equalizing plate is sprayed to the thermal runaway cell.
In some embodiments, the thermal conductivity of the three-dimensional space of the phase change temperature equalizing plate is between 15000W/(m×k) and 50000W/(m×k).
In some embodiments, the phase-change temperature equalizing plates are adhered to two sides of the battery module through heat-conducting glue.
In the embodiment of the invention, besides the phase-change temperature-equalizing plate, the liquid cooling plate is adhered to the battery module through heat-conducting glue.
In some embodiments, the heat dissipation structure for the modular electronic components further comprises steel strips 24; the steel belt 24 is used to fix each battery module 22 and the phase change temperature equalizing plate 23 to which each battery module 22 is attached.
In the embodiment of the invention, the temperature equalizing plate and the battery cell are fastened again through the steel belt.
In summary, the beneficial effects of the invention are as follows:
1. and the two sides of the battery cell module (12 battery cells) are adhered with phase change temperature equalization plates through heat conduction glue, so that the temperature equalization is carried out between the upper part and the lower part of the battery cell monomer and the 12 battery cells.
2. The phase change temperature equalizing plate is added between the two battery core modules to perform temperature equalizing of the two modules.
3. The temperature equalizing plate is contacted with the bottom surface cold plate, and the heat at the upper part of the collecting core is conducted to the bottom surface cold plate to rapidly dissipate heat.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and in part, not described or illustrated in any particular embodiment, reference is made to the related descriptions of other embodiments.
The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention, and are intended to be included in the scope of the present invention.

Claims (10)

1. A heat dissipation structure for a modular electronic component, comprising: a contact heat sink medium and at least one heat transfer medium; wherein at least one electronic component forms a module; the number of the modules is one or more;
the bottom surface of each electronic element in the module is directly contacted or indirectly contacted with the contact type heat dissipation medium; the at least one heat conducting medium is in direct or indirect contact with any one or more electronic components, and the distance between the upper boundary of the heat conducting medium and the top surface of the module is equal to a first preset value, and the distance between the lower boundary of the heat conducting medium and the bottom surface of the module is equal to a second preset value; the thermal conductivity of the thermally conductive medium is greater than the thermal conductivity of the electronic component.
2. The heat dissipating structure for a modular electronic component of claim 1, wherein the first predetermined value is between [0,0.5 h); the second preset value is between 0,0.5 h); h is the distance from the bottom surface to the top surface of the electronic component.
3. The heat dissipating structure for a modular electronic component of claim 1 wherein the width of each thermally conductive medium is equal to a preset multiple of the first width; the first width is the width of the surface of the module, which is contacted with the heat conduction medium; the preset multiple is between (1/2, 1), the direction from the bottom surface to the top surface of the electronic element is the height direction, and the width direction is perpendicular to the height direction.
4. The heat dissipating structure for a modular electronic component of claim 1, wherein the contact heat dissipating medium is a liquid cooling plate and the module is a battery module; the heat conduction medium is a phase-change temperature-equalizing plate; the battery module is cuboid, and is provided with four side surfaces except the top surface and the bottom surface; the liquid cooling plate is provided with a liquid outlet and a liquid inlet, one side of the battery module close to the liquid outlet and the liquid inlet is provided with a front side surface and a rear side surface respectively, and the other two sides are provided with a left side surface and a right side surface; the battery module consists of a plurality of electric cores; the battery cells are arranged in a row from the front side surface to the rear side surface; the phase-change temperature-equalizing plate is contacted with the left side surface and/or the right side surface, and the contact area is equal to the area of the left side surface and/or the right side surface multiplied by a third preset value; the third preset value is between [0.25,1 ].
5. The heat dissipating structure for a modular electronic component of claim 4 wherein said liquid inlet and said liquid outlet are offset; the flow of the cold liquid flowing through the heat dissipation teeth between the liquid inlet and the liquid outlet is a first flow, and a strong flow area is formed; the two sides of the strong flow area along the flowing direction of the cold liquid are weak flow areas; the cold liquid flow path of the weak flow area is larger than that of the first flow path; a phase change temperature equalizing plate is contacted between the battery module in the strong current area and the battery module in the weak current area.
6. The heat dissipation structure for a modularized electronic component as described in claim 4, wherein a left side to right side direction of the battery module is a first direction; the cold liquid flowing direction is parallel to the first direction; each battery module is arranged along the first direction, and a phase-change temperature equalizing plate is contacted between the battery module close to the liquid inlet and the battery module far away from the liquid inlet.
7. The heat dissipating structure for a modular electronic component of claim 4, wherein the contact state of the phase change temperature equalization plate with any cell is changed from contact to non-contact when the cell reaches a predetermined temperature; the preset temperature is less than 850 ℃.
8. The heat dissipating structure for a modular electronic component of claim 7, wherein said phase change temperature equalizing plate is attached to at least one side of said module by a thermally conductive adhesive; the melting point of the heat conducting glue is between (140, 850); the heat conduction glue has a heat conduction rate greater than that of the module.
9. The heat dissipating structure for a modular electronic component of claim 7, wherein the housing of the phase change temperature equalizing plate is an aluminum alloy housing; the melting point of the aluminum alloy shell is between 450 ℃ and 650 ℃.
10. The heat dissipating structure for a modular electronic component of claim 9, wherein the phase change temperature equalizing plate comprises: an evaporator, a condenser, a cooling liquid and a capillary channel; the evaporator is arranged on the contact surface of the phase-change temperature-equalizing plate and the battery module; the condenser is arranged at the contact end of the phase-change temperature equalizing plate and the liquid cooling plate; one end of the capillary channel is connected with the evaporator; the other end of the capillary channel is connected with the condenser; the capillary channel is positioned in the aluminum alloy shell close to one side of the battery module; the cooling fluid flows between the evaporator and the condenser through capillary channels.
CN202310797493.5A 2023-06-30 2023-06-30 Heat radiation structure for modularized electronic element Pending CN116896849A (en)

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CN202310797493.5A CN116896849A (en) 2023-06-30 2023-06-30 Heat radiation structure for modularized electronic element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310797493.5A CN116896849A (en) 2023-06-30 2023-06-30 Heat radiation structure for modularized electronic element

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CN116896849A true CN116896849A (en) 2023-10-17

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