CN116880681A - Computer heat dissipation system and method capable of automatically controlling heat dissipation capacity - Google Patents
Computer heat dissipation system and method capable of automatically controlling heat dissipation capacity Download PDFInfo
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 127
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- 230000033228 biological regulation Effects 0.000 claims description 5
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- 229910052744 lithium Inorganic materials 0.000 description 2
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- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
The invention relates to the technical field of computers and discloses a computer heat dissipation system and a method for automatically controlling heat dissipation capacity. The power consumption acquisition module is used for measuring the power consumption of the main heating component of the computer and comprises a direct current measurement submodule, a voltage measurement submodule, an analog-to-digital conversion submodule and a multiplication arithmetic unit, and transmitting data to the data processing module, and the data processing module is used for processing the data to obtain the real-time power consumption of the main heating component of the computer. The computer runs large-scale programs or runs high-load operations such as games, the running power consumption is increased rapidly, the central processing unit and the display card adapter are still at lower temperature, the CPU is required to run for a period of time after the temperature is increased, the generated heat can be dissipated in advance by increasing the heat dissipation capacity, and the temperature rise of the CPU is slowed down.
Description
Technical Field
The invention relates to a computer heat dissipation system and a method for automatically controlling heat dissipation capacity, and belongs to the technical field of computers.
Background
Computers are now one of the indispensable tools in our daily life, work, study. With the progress of technology, computer performance is continuously improved, and computer configuration is also higher and higher. With the problems of aging and the like of computer components, the heat dissipation performance of a computer is gradually an important index for inspecting the performance of the computer.
The main heating components of the computer are a CPU, a GPU and the like, and the CPU and the GPU can generate heat frequently due to the use of a user. Most of the existing computers place a thermal diode at the highest temperature of the CPU core and close to an ALU unit, if the hottest place of the CPU exceeds a certain value, a second set of heat temperature control device can send a signal to enable a heat control circuit system to start working, and the load of the CPU is reduced by reducing the frequency multiplication of the CPU so as to achieve the effect of cooling. In order to prevent the CPU from being overheated to cause performance degradation or damage to the CPU, the computer is provided with a heat dissipation system to cool down the CPU. The existing heat dissipation system has two starting modes, one is manual control, so that the heat dissipation system continuously generates noise in the using process of the computer, and additional power consumption is generated at the same time; the other is to monitor and adjust the heat dissipation capacity of the computer according to the real-time temperature of the CPU of the computer, but in some occasions, for example, when running a large-scale program or performing high-load operation such as games, the heat dissipation system needs to be opened in advance to perform cooling treatment, otherwise, the cooling speed is not ideal under the condition that the power consumption of the components such as the CPU, the GPU and the like continuously heats. When the cooling speed of the radiator is not in line with the heating speed, the CPU reaches the designated temperature very quickly, so that the performance is reduced, and the user experience and the service life of the computer are affected.
Disclosure of Invention
The invention aims to provide a computer heat dissipation system and a computer heat dissipation method capable of automatically controlling heat dissipation capacity, which achieve the effect of heat dissipation in advance and accurate cooling by monitoring real-time power consumption of a computer and accurately controlling the rotating speed of a fan by the temperature of key components.
In order to achieve the above purpose, the invention is realized by adopting the following technical scheme.
In one aspect, the present invention provides a computer heat dissipation method for automatically controlling heat dissipation, including:
s1, calculating the total heating power of each computer component，Is a guide for connecting computer heating componentsLine power->Is the resistivity of the connecting wire, +.>Is the length of the connecting wire, < >>Is the real-time power consumption of computer component i, +.>Real-time current for computer component i;
s2: calculating the actual heat dissipation capacity of the computer;
s3: calculating the air quantity required by computer heat dissipation according to the actual heat dissipation capacity;
s4: the air quantity of the computer is controlled by changing the rotating speed of the fan motor.
Still further, the computer heating member includes:
what is needed is a central processor and display adapter that monitors temperature and power consumption in real time; only the hard disk, motherboard and battery are needed to monitor power consumption.
Further, the specific steps of S2 are as follows:
when the actual temperature of one of the CPU and the GPU exceeds the preset temperature, calculating the excessive heat dissipation capacity according to different temperatures; the preset temperature isWhen the heat dissipation capacity is set to->At this time, the total heat dissipation capacity->,/>Is real-time power consumption.
Further, the specific step of S3 is as follows:
the calculation formula of the air quantity in the cabinet is，/>Is the real-time temperature of the air outlet, which is->Is the external ambient temperature>Is the heat sink power.
Further, the specific step of S4 is as follows:
controlling the rotating speed of the motor according to the mode of controlling the voltages at two ends of the motor; the relation between the rotating speed and the voltage of the motor is that，
Is the supply voltage, +.>Is the motor current,/->Is the total resistance of the motor circuit, < >>Is a potential coefficient>Is excitation magnetic flux, n is the rotating speed;
motor voltageAnd the motor rotation speed is regulated according to the regulation of the duty ratio in a direct proportion relation with the duty ratio D.
A computer heat dissipation system for automatically controlling heat dissipation, comprising:
the power consumption acquisition module is used for acquiring real-time power consumption of the computer heating component;
the data processing module consists of a data collecting sub-module and a data analyzing sub-module and is used for calculating real-time air quantity according to the real-time power consumption information obtained by the power consumption obtaining module;
and the heat radiation system control module is used for controlling the opening and closing of the heat radiation system and simultaneously controlling the heat radiation capacity of the heat radiator when the heat radiation system is opened by amplifying the electric signals through the driving chip L289N according to the real-time air quantity obtained by the data processing module.
Still further, the power consumption acquisition module includes:
the device comprises a direct current measuring sub-module, a voltage measuring sub-module, an analog-to-digital conversion sub-module and a multiplication operator;
the direct current measuring sub-module consists of a Hall closed-loop current sensor and a current-voltage converter and is connected with the analog-digital conversion sub-module; the Hall closed-loop current sensor measures the current at two ends of the computer heating component, the current signal is converted into a voltage signal by the current-voltage converter, and the voltage signal is transmitted to the analog-to-digital conversion sub-module to convert the analog signal into a binary digital signal;
the voltage measuring submodule is an MWE8017/C intelligent voltage measuring chip and is connected with the analog-digital conversion submodule; the analog-to-digital conversion sub-module converts the measured analog signals into digital signals and is connected with the multiplication arithmetic unit;
the multiplication operator realizes multiplication of digital signals, performs multiplication operation on two binary numbers, outputs a result, and is connected with the data collection submodule.
Still further, the data collection submodule includes:
the data collection submodule is responsible for receiving the power consumption information from the power consumption acquisition module and collecting the real-time temperature information of the computer central processor and the display adapter, and is connected with the data analysis submodule; the data collection sub-module is used for obtaining real-time power consumption information of the heating component through the power consumption obtaining module and obtaining real-time temperature information through the central processing unit and the thermosensitive secondary in the display adapter.
Still further, the data analysis submodule includes:
the data analysis sub-module is responsible for processing various power consumption and temperature information collected by the data collection sub-module and is connected with the heat dissipation system control module.
Still further, the heat dissipation system control module includes:
the driving circuit adjusts the duty ratio to control the rotating speed of the motor through a PWM fixed-frequency bandwidth method;
PWM changes the magnitude of the voltage by changing the duty cycle, thereby changing the rotational speed of the motor.
Still further, the heat sink includes:
the radiator consists of a fan, an air inlet, a filter screen, an air outlet and radiating fins; the fan adopts an axial flow type and is arranged at the air inlet; the central processing unit and the display adapter are arranged at the air outlet; the hard disk is arranged at the air inlet; the heat dissipation area of the key components is increased by adopting the heat dissipation fins to accelerate heat dissipation or the wind direction is guided by the wind pipe to conduct fixed-point heat dissipation.
The invention has the beneficial effects that:
the invention directly measures the real-time voltage and current of the main heating component of the computer, estimates the real-time power consumption of the heating component, is more accurate and rapid, does not occupy the system utilization rate of the computer, directly controls the heat dissipation capacity of the computer radiator, and ensures that the heat dissipation effect of the computer is optimal. Meanwhile, the heat radiation system disclosed by the invention radiates heat in advance when the power consumption of the computer is greatly increased, delays the heating process of the central processing unit and the display adapter of the computer, reduces the possibility of the performance reduction of the computer caused by the temperature rise, improves the user experience and prolongs the service life of the computer.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention.
FIG. 1 is a flow chart of the operation of a computer heat dissipation system for automatically controlling heat dissipation in accordance with the present invention;
fig. 2 is a schematic diagram of the air duct of the heat dissipation system of the computer heat dissipation system capable of automatically controlling heat dissipation capacity according to the present invention.
Detailed Description
It should be noted that: the invention provides a computer heat dissipation system and a method for automatically controlling heat dissipation capacity, which are suitable for computers with higher performance and high heat dissipation performance requirements.
The following detailed description of the present invention is made with reference to the accompanying drawings and specific embodiments, and it is to be understood that the specific features of the embodiments and the embodiments of the present invention are detailed description of the technical solutions of the present invention, and not limited to the technical solutions of the present invention, and that the embodiments and the technical features of the embodiments of the present invention may be combined with each other without conflict.
The term "and/or" is merely an association relationship describing an associated object, meaning that there may be three relationships, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone. The character "/", generally indicates that the front and rear associated objects are an or relationship.
Example 1
The embodiment describes an implementation manner of a power consumption acquisition module in a computer heat dissipation system capable of automatically controlling heat dissipation capacity, where the power consumption acquisition module includes a direct current measurement sub-module, a voltage measurement sub-module, an analog-to-digital conversion sub-module and a multiplication operator. The direct current measuring stator module consists of a Hall closed-loop current sensor and a current-voltage converter, wherein two input pins of the sensor are connected to V+ and G on a computer component, and the sensor is output to the current-voltage converter to be converted into a voltage signal; the voltage measuring stator module isMWE8017/C intelligent voltage measuring chip; the analog-digital conversion sub-module and the multiplication arithmetic unit are realized by a single chip microcomputer, and the single chip microcomputer measures the voltage dataAnd current data->Multiplication is->And converted into an 8-bit digital signal to be transmitted to a data processing module.
The five components of the computer are a central processing unit, an input device, an output device, a memory and a controller. Wherein, the main heating components are as follows:
the CPU is an operation core and a control core of a computer, is responsible for reading instructions, decoding the instructions and executing the instructions, when the computer runs large software or performs operations such as a large amount of data operation, the high integration of the CPU at present can not lead wires to be wide, and the resistivity of the wires can be rapidly increased, so that the temperature of the CPU is rapidly increased due to heat generated by the transmission loss of electric energy in the CPU, and the temperature of the CPU is increased to reduce the performance of the computer to prevent the CPU from burning, so that the heat dissipation of the CPU is important in the heat dissipation process. The CPU is placed in the main air duct in a heat dissipation mode, the power consumption of the CPU is accurately measured through the sensor, and meanwhile, the heating data of the CPU is monitored by utilizing data obtained by the heat-sensitive secondary of the computer.
The output device of the computer is generally a display adapter, namely a graphics card GPU, and the graphics card is an important component in a host computer, is a device for converting digital and analog signals of the computer, and is used for outputting and displaying graphics. The display card is connected to the computer main board, and converts the digital signal of the computer into analog signal for display, and the display card has image processing capacity to assist CPU in work and raise the overall operation speed. Graphics cards are important to those engaged in professional graphic designs. With the increasing demand of computers for image quality, the heat generated by display cards gradually exceeds that of a CPU, and the display cards become one of main heat generating components of the computers. Although the temperature that the display card can withstand is higher than the CPU, too high a temperature also tends to degrade the performance of the display card, so the cooling of the display card is also important. The invention also carries out accurate measurement on the heating power consumption of the display card, and simultaneously collects the temperature data of the display card collected by the thermosensitive secondary. In the air duct, the display card and the CPU are in parallel positions, and are not mutually influenced.
The memory of the computer is mainly a hard disk, and the hard disk can generate heat to cause the rise of the environmental temperature in the high-speed storage and reading process. For mechanical hard disks, high speed rotation of the disk at 5400 rpm or 7200 rpm is a major cause of heat generation, in which case motor efficiency is less than 100% and heat generation is necessary. For the hard disk, the heat of the hard disk is difficult to influence the performance of the hard disk, but the temperature in the case is increased along with the heat generation and heat dissipation of the hard disk, and the use of other components is influenced, so that proper cooling is also necessary, and the hard disk is also arranged in the air duct.
The motherboard of the computer is integrated with a semiconductor chip such as a display card and a CPU and a connection circuit, and heat is dissipated due to internal resistance, so that the temperature of the chassis is increased. The invention collects the power consumption of the main board mainly by measuring the current at two ends of each component and transmitting the current to the data processing module.
In addition, some computers have built-in batteries, which generate a lot of heat due to the internal resistance during charge and discharge. For lithium batteries or other batteries, as the battery ages, the electrolyte is dried or the polymer ages, and the lithium ion or anode and cathode materials become worse, the chemical internal resistance of the lithium battery further increases, which causes not only the decrease of the battery capacity, but also the further increase of the heat productivity of the battery during charging and discharging. The heating of the battery generally does not influence the normal operation of the computer, the battery is generally arranged at the corner of the computer and is tightly adhered to the case shell, and heat is radiated through the heat conduction characteristic of metal, but the temperature of the surrounding environment is increased in the heat radiation process, so the invention brings the heating power consumption of the battery into calculation, and the battery is also positioned at an air outlet in an air duct, thereby being convenient for heat radiation.
The embodiment adopts a hardware module to collect power consumption data, is convenient for collecting real-time power consumption of a computer, and does not occupy system utilization rate resources. Compared with the mode of predicting the power consumption by adopting historical data, the method has the advantages of more real-time performance and accuracy, and has very little influence on the performance of the CPU of the computer.
Example 2
The embodiment provides an implementation mode of computer heat dissipation system data for automatically controlling heat dissipation capacity, which is realized by integrating a data processing module. The data processing module is divided into a data collecting sub-module and a data analyzing sub-module. The data collecting sub-module is in charge of receiving the power consumption information from the power consumption acquisition module and collecting real-time temperature information of the main heating component of the computer, and is connected with the data analysis sub-module, and the data analysis sub-module is in charge of processing the digital signals from the data collecting sub-module, calculating the real-time heat dissipation capacity, and converting the result into the digital signals to be transmitted to the heat dissipation system control module.
(1) Relation between computer heating power consumption and heat dissipation capacity
Heating power and rate from individual computer components collected by the data collection submodule，/>Is the power of the wire connected with the computer heating component, < >>Is the resistivity of the connecting wire, +.>The length of the connecting wire is a fixed value.
The flow velocity formula of the fan in the cabinet isWherein->Is the temperature of the air outlet->Is +.>Is defined as>The calculated Q is the heating power consumption of the computer, which is determined by the power consumption of the main heating component of the computer and the power consumption of the radiator and other parts, and V is the air quantity of the radiator. From this, the formula of the air volume of the computer radiator can be obtained as follows:
。
the difference between the present embodiment and the conventional heat dissipation system for adjusting the heat dissipation capacity through temperature monitoring is that the real-time heat dissipation power consumption of the computer is incorporated into the reference standard. When the CPU and the display card adapter are at lower temperature, the computer operation power consumption is increased rapidly, the CPU temperature is increased and needs to be operated for a period of time, the heat generated by the heat dissipation is dissipated in advance, and the increase of the CPU temperature is slowed down.
(2) Influence of CPU and GPU temperatures
The most temperature-affected components in a computer are mainly a CPU (central processing unit) and a GPU (display adapter). The invention also monitors the temperature of the CPU and the GPU in real time, and the data collecting sub-module mainly collects the real-time temperature data measured by the heat sensitive secondary built-in the CPU and the GPU. The real-time temperature of the CPU and the GPU is also an important reference standard of heat dissipation capacity, and when the temperature is too high, the heat dissipation capacity should be increased along with the heat dissipation capacity, and the whole heat dissipation capacity is in a linear relation.
According to the reference standard of temperature and power consumption, the heat dissipation capacity is different from the heat relation generated by real-time power consumption according to the difference of the temperatures of the CPU and the GPU. The CPU of the computer has proper working temperature of 45-65 deg.c and partial computers with slight difference. For the condition that the temperatures of the CPU and the GPU exceed the preset minimum starting temperature, the heat dissipation capacity is larger than the heat generated by real-time power consumption, so that the CPU is properly cooled; for CPU and GPU temperatures less than the predetermined minimum start-up temperature, the heat dissipation should be less than the heat generated by real-time power consumption.
According to the specific computer model difference and performance difference, the preset temperature of the CPU or the GPU can be not less than one, the preset temperature is set to be more than one, and the excessive heat dissipation capacity is standardized according to the different temperatures. The heat dissipation capacity should be increased in equal proportion according to the temperature, and the preset temperature isWhen the heat dissipation capacity is set to->The total heat dissipation capacity should be,/>Is real-time power consumption. The heat dissipation capacity is increased to enhance the cooling effect and avoid the degradation of the computer performance caused by overheat of the CPU or the GPU.
Example 3
The embodiment describes a control module implementation of a computer heat dissipation system that automatically controls heat dissipation. The control module mainly comprises a driving circuit, and controls the output voltage through an amplifier by an input control voltage signal, so as to control the power of the radiator and control the heat dissipation capacity. The control module is mainly divided into two parts, one part is an amplifier, and the electric signal transmitted by the data processing module is amplified and converted into an electric signal which can be identified by the circuit; the other part is a driving circuit, and the driving circuit controls the rotating speed of the fan by controlling the voltage at two ends of the driving motor, so that the purpose of controlling the heat dissipation capacity of the heat dissipation system is achieved.
(1) Driving circuit
The driving circuit adopts an L289N driving chip of SGS company to control the rotating speed of the motor. The L289N driving chip can provide 50V driving voltage at most, and the average voltage output by the L289N driving chip is controlled by a control signal transmitted by the data processing module, so that the rotating speed of the motor is controlled.
IN1 and IN2 are used to control the start and stop of the motor and rotate IN the forward direction, IN1 is 1, IN2 is 0 and rotates IN the reverse direction, and IN the reverse direction, all IN 0 or all IN1 are braked, so that the motor IN the heat dissipation system of the embodiment does not rotate IN the reverse direction. At the same time, this is also the PWM (Pulse Width Modulation) input inlet, controlling motor speed.
The embodiment uses a PWM speed regulation method with a fixed bandwidth, wherein the main speed regulation index of PWM is duty ratio, and the PWM frequency generated by the timer T1M1 is not changed. PWM adjusts the average value of the output signal by varying the pulse width of the signal, thereby effecting control of the components in the circuit. In the PWM tone width determining method, the signal waveform is a rectangular wave of a fixed frequency, and the pulse width is changed according to the control signal. When the control signal is high, the pulse width increases, and the average value of the output signal also increases; and vice versa. Therefore, under different application scenes, the voltage at the two ends of the motor can be accurately controlled by changing the frequency and the duty ratio of the PWM waveform. The PWM fixed-frequency bandwidth method has the advantages of wide adjustment range, high response speed, low energy consumption and the like.
(2) Motor speed control
The relationship between the rotational speed n of the motor and other parameters can be expressed as:
-a supply voltage (V);
-a motor current (a);
-the motor circuit total resistance (Ω);
-potential coefficient>The method comprises the steps of carrying out a first treatment on the surface of the P-electromagnetic logarithm; n-conductor number; a-parallel branch number;
-an excitation magnetic flux (Wb);
from the above formula, the rotational speed of the motor can be determined by varying the motor supply voltage.
The duty cycle is linear with the rotational speed. The maximum rotation speed of the motor isWhen the duty cycle is 1, the average rotational speed of the motor is +.>When the duty ratio is D<1, average speed of the motor>According to the adjustment of the duty ratio, the adjustment of the rotating speed is realized. The duty cycle is the proportion of the power-on time to the total time within one pulse cycle time. When the highest power-on voltage is U, the duty ratio is 50%, and the actual average voltage is U/2, so that the average voltage of the motor and the duty ratio are in linear relation through the adjustment of the duty ratio, namely +.>Thereby controlling the motor speed.
The duty cycle can be adjusted from 0 to 1, and the rotation speed of the motor is adjusted from 0 to the maximum. Therefore, the PWM frequency and width fixing method used in the embodiment can accurately adjust the rotating speed of the motor, no redundant energy is lost in the middle, the adjusting interval of the rotating speed of the motor is increased, and the adjustability of the heat dissipation capacity is improved.
Example 4
The embodiment describes an implementation manner of a radiator in a computer heat dissipation system capable of automatically controlling heat dissipation capacity, the radiator adopts an axial flow fan with adjustable rotation speed, the rotation speed is adjusted according to the temperatures of a CPU and a GPU and the real-time power consumption of a computer, an air outlet is close to the CPU, and an air duct passes through a main heating component of the computer, as shown in fig. 2. After the control module starts the fan, clean dust-free air is blown into the chassis by the fan through the air inlet, and after the air passes through main heating components such as a CPU (Central processing Unit), a display card, a hard disk and the like, heat is taken out from the air outlet.
(1) Heat dissipation capacity of heat dissipation system
The heat dissipation system of this embodiment mainly adopts forced air cooling heat dissipation mode, adopts axial fan, and axial fan rotational speed is adjustable, carries out accurate regulation and control to axial fan through drive circuit. In order to ensure the adjustability of the heat dissipation capacity, the main air inlet is arranged on the side face of the case, the air outlet is arranged on the side face of the top of the case, and the inside of the case except the air inlet and the air outlet is airtight and airtight, so that the heat dissipation effect is prevented from being reduced due to the influence of the air channel. The CPU and the GPU which are sensitive to temperature influence and the main board are close to the air outlet, the case with the battery is partially provided with the battery, the battery is also required to be installed at the corner close to the air outlet, and parts with smaller heat, such as a hard disk, and the like, are required to be installed at the position close to the air inlet.
The heat dissipation capacity is usually related to the air quantity of the fan, and the type selection of the fan is also very important. The air volume of a fan is generally related to the diameter of the fan blades, the angles of the blades and the number of the blades. When the fan is fixed in shape selection and environmental factors are not changed, the air quantity is only related to the rotating speed of the fan.
The amount of heat dissipation is also related to whether or not there is a shade in the air duct. In the air duct, the influence on the air duct is reduced as much as possible except that the main heating components are installed, the phenomenon of back flow hedging is avoided, and the influence on wind speed is reduced.
(2) Heat dissipation at critical locations
In order to better radiate heat for the CPU and the GPU, the preferred improvement mode is to install the radiating fins, and the radiating fins are tightly attached to the CPU or the GPU to conduct heat to the air better by utilizing the heat conductivity of metal, so that the heat radiation is accelerated. At the same time, wind energy produced by the heat sink takes heat away faster. The radiating fins are made of aluminum alloy materials with good heat conductivity and low price, and copper with better heat conductivity and higher price can be used as a material conditionally.
For some portable computers, the heat sink is reduced in size while also dissipating heat from critical components such as the CPU and GPU to ensure stable performance. The fan selection typically selects a low noise, high rotational speed, small size fan. For key parts, a pipeline is used for guiding wind direction, and core components such as a CPU, a GPU and the like are subjected to key heat dissipation. In order to optimize the air flow, an inlet and outlet channel is arranged, and the bubbling pressure is increased to increase the air flow, so that the dead angle of heat dissipation is prevented.
It will be appreciated by those skilled in the art that embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present invention is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flowchart illustrations and/or block diagrams, and combinations of flows and/or blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
The embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present invention and the scope of the claims, which are all within the protection of the present invention.
Claims (11)
1. A computer heat dissipation method for automatically controlling heat dissipation, comprising:
s1, calculating the total heating power of each computer component，/>Is the power of the wire connected with the computer heating component, < >>Is the resistivity of the connecting wire, +.>Is the length of the connecting wire, < >>Is the real-time power consumption of computer component i, +.>Real-time current for computer component i;
s2: calculating the actual heat dissipation capacity of the computer;
s3: calculating the air quantity required by computer heat dissipation according to the actual heat dissipation capacity;
s4: the air quantity of the computer is controlled by changing the rotating speed of the fan motor.
2. The computer heat dissipation method for automatically controlling heat dissipation according to claim 1, wherein the computer heat generating member comprises:
what is needed is a central processor and display adapter that monitors temperature and power consumption in real time; only the hard disk, motherboard and battery are needed to monitor power consumption.
3. The computer heat dissipation method for automatically controlling heat dissipation capacity according to claim 1, wherein the specific steps of S2 are as follows:
when the actual temperature of one of the CPU and the GPU exceeds the preset temperature, calculating the excessive heat dissipation capacity according to different temperatures; the preset temperature isWhen the heat dissipation capacity is set to->At this time, the total heat dissipation capacity->,/>Is real-time power consumption.
4. The computer heat dissipation method for automatically controlling heat dissipation capacity according to claim 1, wherein the specific steps of S3 are as follows:
the calculation formula of the air quantity in the computer cabinet is，/>Is the real-time temperature of the air outlet, which is->Is the external ambient temperature>Is the heat sink power.
5. The computer heat dissipation method for automatically controlling heat dissipation capacity according to claim 1, wherein the specific step of S4 is as follows:
controlling the rotating speed of the motor according to the mode of controlling the voltages at two ends of the motor; the relation between the rotating speed and the voltage of the motor is that，
Is the supply voltage, +.>Is the motor current,/->Is the total resistance of the motor circuit, < >>Is a potential coefficient>Is excitation magnetic flux, n is the rotating speed;
motor voltageAnd the motor rotation speed is regulated according to the regulation of the duty ratio in a direct proportion relation with the duty ratio D.
6. A computer heat dissipation system for automatically controlling heat dissipation capacity based on a computer heat dissipation method for automatically controlling heat dissipation capacity according to any one of claims 1-5, comprising:
the power consumption acquisition module is used for acquiring real-time power consumption of the computer heating component;
the data processing module consists of a data collecting sub-module and a data analyzing sub-module and is used for calculating real-time air quantity according to the real-time power consumption information obtained by the power consumption obtaining module;
and the heat radiation system control module is used for controlling the opening and closing of the heat radiation system through amplifying the electric signals by the driving chip L289N according to the real-time air quantity obtained by the data processing module and controlling the heat radiation quantity of the heat radiator when the heat radiation system is opened.
7. The computer heat dissipation system that automatically controls heat dissipation according to claim 6, wherein the power consumption acquisition module comprises:
the device comprises a direct current measuring sub-module, a voltage measuring sub-module, an analog-to-digital conversion sub-module and a multiplication operator;
the direct current measuring sub-module consists of a Hall closed-loop current sensor and a current-voltage converter and is connected with the analog-digital conversion sub-module; the Hall closed-loop current sensor measures the current at two ends of the computer heating component, the current signal is converted into a voltage signal by the current-voltage converter, and the voltage signal is transmitted to the analog-to-digital conversion sub-module to convert the analog signal into a binary digital signal;
the voltage measuring submodule is an MWE8017/C intelligent voltage measuring chip and is connected with the analog-digital conversion submodule; the analog-to-digital conversion sub-module converts the measured analog signals into digital signals and is connected with the multiplication arithmetic unit;
the multiplication operator realizes multiplication of digital signals, performs multiplication operation on two binary numbers, outputs a result, and is connected with the data collection submodule.
8. The computer heat dissipation system for automatically controlling heat dissipation according to claim 6, wherein the data collection submodule comprises:
the data collection submodule is responsible for receiving the power consumption information from the power consumption acquisition module and collecting the real-time temperature information of the computer central processor and the display adapter, and is connected with the data analysis submodule; the data collection sub-module is used for obtaining real-time power consumption information of the heating component through the power consumption obtaining module and obtaining real-time temperature information through the central processing unit and the thermosensitive secondary in the display adapter.
9. A computer heat sink system for automatically controlling heat dissipation according to claim 6, wherein the data analysis submodule comprises:
the data analysis sub-module is responsible for processing various power consumption and temperature information collected by the data collection sub-module and is connected with the heat dissipation system control module.
10. The computer heat dissipation system for automatically controlling heat dissipation according to claim 6, wherein the heat dissipation system control module comprises:
the driving circuit adjusts the duty ratio to control the rotating speed of the motor through a PWM fixed-frequency bandwidth method;
PWM changes the magnitude of the voltage by changing the duty cycle, thereby changing the rotational speed of the motor.
11. A computer heat dissipation system for automatically controlling heat dissipation according to claim 6 and wherein said heat sink comprises:
the radiator consists of a fan, an air inlet, a filter screen, an air outlet and radiating fins; the fan adopts an axial flow type and is arranged at the air inlet; the central processing unit and the display adapter are arranged at the air outlet; the hard disk is arranged at the air inlet; the heat dissipation area of the key components is increased by adopting the heat dissipation fins to accelerate heat dissipation or the wind direction is guided by the wind pipe to conduct fixed-point heat dissipation.
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