CN116367508A - Heat dissipation method and heat dissipation system of edge computing unit and edge computing unit - Google Patents
Heat dissipation method and heat dissipation system of edge computing unit and edge computing unit Download PDFInfo
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Abstract
The application provides a heat dissipation method, a heat dissipation system and an edge computing unit of the edge computing unit, wherein the method obtains current of a system to which the edge computing unit belongs; acquiring the temperature of a system to which the edge computing unit belongs; radiating according to the current, the temperature and the current threshold; the current threshold is determined according to the environment temperature of the system and the maximum temperature of the central processing unit of the system. According to the method, heat is radiated through the current and the current threshold value determined according to the environment temperature of the system and the maximum temperature of the central processing unit of the system, heat radiation treatment can be performed in advance, timely and effective heat radiation is guaranteed, the working temperature performance of the edge computing unit is improved, and the edge computing unit is enabled to operate more stably.
Description
Technical Field
The present disclosure relates to the field of edge computing units, and more particularly, to a heat dissipation method and system for an edge computing unit.
Background
The intelligent traffic edge computing Unit is intelligent Road Side equipment oriented to an intelligent traffic scene, is connected with various Road Side equipment such as a vehicle networking RSU (Road Side Unit), a laser radar, a high-definition camera and the like, provides various technologies and capabilities for decision making and the like for vehicle-Road cooperative application, and realizes localized processing of Road Side data and equipment linkage control.
The edge computing unit is generally mounted on a pole housing of the intelligent road side. The edge computing unit needs to have larger processing and computing capabilities to realize local real-time acquisition, storage, circulation, analysis and decision of the road side equipment data, and upload the processed effective information to the cloud control platform.
The edge computing unit is composed of high performance processing units such as NVIDA Jetson AGX Orin with an operational power up to 200TOPS (1 TOPS represents a processor that can perform one trillion times per second (10) 12 ) Operation). Under such high computing power, the power of an edge computing unit with 200TOPS computing power is about 100W, while under the condition of such high power, the temperature of the system is easy to rise, and when the temperature of the system is high, a central processor in the edge computing unit can reduce the heating of the system in a frequency-reducing mode (the system can restore the original working frequency after the temperature of the system is reduced), but the frequency reduction can influence the working stability of the system; as the system temperature increases, the temperature exceeds the highest temperature at which the chip is safely operating, causing permanent damage to the chip.
Therefore, the heat dissipation requirement of the edge computing unit is strict, the heat dissipation requirement must be exerted to ensure that the system can timely dissipate heat to the system under the maximum power operation, the system temperature is ensured not to exceed the highest temperature of the safe operation of the chip, and the system is required to be maintained to operate at a lower temperature under the normal temperature environment so as to prevent the high-performance processing unit from being operated at a high temperature in a down-conversion mode. That is, the heat dissipation of the edge computing unit must ensure that the system can dissipate heat in time under the maximum power operation, so as to ensure that the temperature of the system does not exceed the highest temperature of the safe operation of the chip.
In the existing heat dissipation method, as shown in fig. 1, the system is implemented by detecting the temperature of the system to realize heat dissipation control, when the temperature is increased, the working efficiency of the heat dissipation device such as a fan is improved, for example, the rotation speed of the fan is increased to increase the heat dissipation capacity, and when the temperature is reduced, the rotation speed of the fan is properly reduced to reduce the heat dissipation capacity.
The existing heat dissipation method realizes heat dissipation control by detecting the temperature of a system, and the temperature parameter in the heat dissipation system is a feedback quantity, so that heat dissipation adjustment is performed after the core temperature of the system rises, and the collected temperature information is generally only a central processing unit, so that the heat dissipation method has hysteresis, namely, the temperature reduction treatment is performed after the temperature of the system rises, and the temperature condition of main heating areas such as a power chip cannot be known in time.
Disclosure of Invention
In order to solve one of the above technical drawbacks, the present application provides a heat dissipation method of an edge computing unit, a heat dissipation system and an edge computing unit.
In a first aspect of the present application, a heat dissipation method of an edge computing unit is provided, where the method includes:
acquiring current of a system to which the edge computing unit belongs;
acquiring the temperature of a system to which the edge computing unit belongs;
Radiating according to the current, the temperature and the current threshold; the current threshold is determined according to the environment temperature of the system and the maximum temperature of the central processing unit of the system.
Optionally, before heat dissipation according to the current, the temperature and the current threshold, the method further comprises:
acquiring the environment temperature of a system to which the system belongs;
calculating the temperature difference between the maximum temperature of a central processing unit of the system and the ambient temperature;
determining the power corresponding to the temperature difference according to the corresponding relation between the preset temperature difference and the power;
the quotient of the corresponding power and the voltage of the system is determined as a current threshold.
Optionally, the heat dissipation according to the current, the temperature and the current threshold includes:
determining the output power of the heat dissipation part driving circuit according to the product of the temperature and the temperature coefficient, the product of the difference between the current and the current threshold value and the current coefficient;
the heat radiation capability of the heat radiation member is controlled based on the output power of the heat radiation member driving circuit.
Optionally, when the temperature is lower than the temperature threshold, the temperature coefficient is 0; when the current is smaller than the current threshold, the current coefficient is 0;
the temperature threshold is determined according to the junction temperature of the central processing unit of the system.
In a second aspect of the present application, there is provided a heat dissipation system of an edge computing unit, the system comprising: the device comprises a central processing unit, a temperature detection module, a current detection module, a heat dissipation part driving circuit and a heat dissipation part;
The current detection module is used for collecting the current of the system to which the edge calculation unit belongs;
the temperature detection module is used for collecting the temperature of the system to which the edge calculation unit belongs;
the central processing unit is used for acquiring the current acquired by the current detection module and acquiring the temperature acquired by the temperature detection module; controlling a heat dissipation part driving circuit to drive a heat dissipation part to dissipate heat of the central processing unit according to the current, the temperature and the current threshold; the current threshold is determined according to the environment temperature of the system and the maximum temperature of the central processing unit of the system.
Optionally, the current threshold is a quotient of a power corresponding to a temperature difference between a maximum temperature of the central processing unit and an ambient temperature and a voltage of the system to which the current threshold belongs.
Optionally, the central processing unit is used for determining the output power of the heat dissipation part driving circuit according to the product of temperature and temperature coefficient, the product of the difference between the current and the current threshold value and the current coefficient;
the heat dissipation part driving circuit is used for outputting output power;
and the heat dissipation part is used for controlling the heat dissipation capacity of dissipating heat of the central processing unit under the drive of the output power.
Optionally, the temperature detection module comprises a temperature sensor located in a heating area of the system to which the edge calculation unit belongs, and a temperature sensor located inside the central processing unit.
Optionally, the central processing unit acquires the current acquired by the current detection module through an integrated circuit bus IIC interface; acquiring the temperature acquired by the temperature detection module through an IIC interface; and controlling the heat dissipation part driving circuit through the Pulse Width Modulation (PWM) pin according to the current, the temperature and the current threshold.
Optionally, the heat dissipating component comprises an inner heat dissipating component and an outer heat dissipating component;
an internal heat dissipation part adopting an active heat dissipation mode; comprises a core heat dissipation component; the core heat dissipation component is arranged outside the metal shell of the edge computing unit; the metal shell is provided with radiating fins; the heat radiation fins and the metal shell are connected with heat conduction silicone grease;
and the external heat dissipation part is positioned at the ventilation opening of the pole-holding box.
In a third aspect of the present application, there is provided an edge calculation unit including: the heat dissipating system according to the second aspect described above.
The application provides a heat dissipation method, a heat dissipation system and an edge computing unit of the edge computing unit, wherein the method obtains current of a system to which the edge computing unit belongs; acquiring the temperature of a system to which the edge computing unit belongs; radiating according to the current, the temperature and the current threshold; the current threshold is determined according to the environment temperature of the system and the maximum temperature of the central processing unit of the system. According to the method, heat is radiated through the current and the current threshold value determined according to the environment temperature of the system and the maximum temperature of the central processing unit of the system, heat radiation treatment can be performed in advance, timely and effective heat radiation is guaranteed, the working temperature performance of the edge computing unit is improved, and the edge computing unit is enabled to operate more stably.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute an undue limitation to the application. In the drawings:
FIG. 1 is a schematic diagram of a conventional heat dissipation method;
fig. 2 is a flow chart of a heat dissipation method of an edge computing unit according to an embodiment of the present application;
fig. 3 is a schematic diagram of a heat dissipation system of an edge computing unit according to an embodiment of the present application;
fig. 4 is a schematic diagram of a heat dissipation system of another edge computing unit according to an embodiment of the present application.
Detailed Description
In order to make the technical solutions and advantages of the embodiments of the present application more apparent, the following detailed description of exemplary embodiments of the present application is given with reference to the accompanying drawings, and it is apparent that the described embodiments are only some of the embodiments of the present application and not exhaustive of all the embodiments. It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other.
In the process of realizing the application, the inventor finds that the existing heat dissipation method realizes heat dissipation control by detecting the temperature of a system, and the temperature parameter in the heat dissipation system is a feedback quantity, so that heat dissipation adjustment is performed after the core temperature of the system rises, and the collected temperature information is generally only an SOC chip, so that the heat dissipation method has hysteresis, namely, the temperature reduction treatment is performed after the temperature of the system rises, and the temperature condition of main heating areas such as a power chip cannot be known in time.
In view of the above problems, embodiments of the present application provide a heat dissipation method and a heat dissipation system for an edge computing unit, and an edge computing unit, where the method obtains a current of a system to which the edge computing unit belongs; acquiring the temperature of a system to which the edge computing unit belongs; radiating according to the current, the temperature and the current threshold; the current threshold is determined according to the environment temperature of the system and the maximum temperature of the central processing unit of the system. According to the method, heat is radiated through the current and the current threshold value determined according to the environment temperature of the system and the maximum temperature of the central processing unit of the system, heat radiation treatment can be performed in advance, timely and effective heat radiation is guaranteed, the working temperature performance of the edge computing unit is improved, and the edge computing unit is enabled to operate more stably.
Referring to fig. 2, the implementation process of the heat dissipation method of the edge computing unit provided in this embodiment is as follows:
and 201, acquiring the current of a system to which the edge computing unit belongs.
When step 201 is implemented, the current of the system to which the edge computing unit belongs may be acquired by a current sensor.
The temperature rise of the system to which the edge computing unit belongs (such as the edge computing unit system) is caused by the increase of the power of the system, and the current of the system can represent the power of the system, the voltage of the system is fixed, and the larger the current of the system is, the larger the power of the system is. Therefore, when the system current increases, which indicates an increase in the system power, the method of the present embodiment determines that the temperature of the system will start to increase accordingly, and further enhancement of the heat dissipation capability of the system is required to suppress the process of increasing the temperature of the system.
In this embodiment and the following embodiments, for convenience of description, a system to which the edge computing unit belongs will be referred to simply as a system to which the edge computing unit belongs.
202, the temperature of the system to which the edge calculation unit belongs is obtained.
The temperature obtained in this step may be an internal temperature in a central processor of a system to which the edge calculation unit belongs, and/or a temperature of a main heat generation region of the system to which the edge calculation unit belongs.
For example, the temperature sensor is placed in a main heating area (such as the vicinity of a main power supply of the system) of the system of the edge computing unit, and/or the temperature sensor is integrated inside the central processing unit (such as the NVIDA Jetson AGX Orin module is integrated with the temperature sensor), and the temperature sensor is used for collecting the multi-point environmental temperature in the system, so that the temperature detection is more timely.
203, performing heat dissipation according to the current, the temperature and the current threshold.
The current threshold is determined according to the environment temperature of the system and the maximum temperature of the central processing unit of the system.
Prior to performing step 203, a current threshold is determined. When the system operates under constant power in a constant temperature environment, the temperature can gradually rise and finally reach dynamic balance of one temperature, and the difference between the system temperature and the environment temperature when the dynamic balance of the temperature is reached is the temperature rise under the constant power. The temperature rise is a relatively stable value, and can not generate larger change due to the change of the environmental temperature, and the corresponding relation between the temperature rise and each constant power operation can be determined through experimental measurement, for example, the system power corresponding to the system temperature rise at 10 ℃, 20 ℃ and 30 ℃ can be determined.
Based on this, the current threshold determination scheme is:
301, acquiring the ambient temperature of the system to which the system belongs.
The ambient temperature obtained here is the actual operating ambient temperature at which the system is operating.
302, the temperature difference (temperature difference, i.e., temperature rise) between the maximum temperature of the central processing unit of the system and the ambient temperature is calculated.
The maximum temperature of the CPU here is the limit operating temperature allowed by the CPU.
The difference between the allowable limit operation temperature of the central processing unit and the actual working environment temperature, namely the temperature difference, namely the temperature rise, is calculated in the step.
303, determining the power corresponding to the temperature difference according to the corresponding relation between the preset temperature difference and the power.
After the temperature difference is obtained, the power corresponding to the temperature difference calculated in step 302 is obtained according to the corresponding relationship between the stored temperature difference (i.e. temperature rise) and power, which is obtained by experimental measurement in advance.
304, the quotient of the corresponding power and the voltage of the system is determined as a current threshold.
Since the voltage of the system is constant, the current is the power/voltage according to the relationship of power=voltage. Thus, after the corresponding power is obtained in step 303, the quotient of the voltage of the corresponding system is determined as the current threshold.
Based on the current threshold, the implementation scheme of step 203 is:
203-1, determining the output power of the heat sink driving circuit according to the product of the temperature and the temperature coefficient, the product of the difference between the current and the current threshold and the current coefficient.
Wherein, the liquid crystal display device comprises a liquid crystal display device,
when the current is smaller than the current threshold, the current coefficient is 0.
And when the temperature is lower than the temperature threshold value, the temperature coefficient is 0.
The temperature threshold is determined according to the junction temperature of the central processing unit of the system, for example, the temperature threshold is 1/3 of the junction temperature of the central processing unit of the system.
The junction temperature is the highest temperature of the central processing unit (semiconductor chip wafer, die).
Let the temperature obtained in step 202 be T System and method for controlling a system The current obtained in step 202 is I System and method for controlling a system The current threshold obtained through steps 301 to 304 is I Threshold value A temperature coefficient of K T The current coefficient is K I Output power of heat sink driving circuit=t System and method for controlling a system *K T +(I System and method for controlling a system -I Threshold value )*K I 。
Wherein the temperature is K T And current coefficient K I The value of (2) is a constant, an empirical value, and can be determined experimentally. However, if I System and method for controlling a system <I Threshold value Then K is I =0, if T System and method for controlling a system <T Threshold value (e.g., T Threshold value Cpu junction temperature of the system of which K is 1/3), then K T ＝0。
203-2, controlling the heat dissipation capacity of the heat dissipation member based on the output power of the heat dissipation member driving circuit.
In specific implementation, according to the relationship between the current obtained in step 201 and the current threshold, the relationship between the temperature obtained in step 202 and the temperature threshold may be one of the following four cases, and step 203 in each case may calculate the output power of the heat dissipation part driving circuit by using a different scheme, so as to control the heat dissipation capability of the heat dissipation part based on the output power of the heat dissipation part driving circuit. In particular, the method comprises the steps of,
first case: the current is less than the current threshold (i.e. I System and method for controlling a system <I Threshold value ) And the temperature is less than the temperature threshold (i.e. T System and method for controlling a system <T Threshold value )。
In the first case, K I ＝0，K T =0. Therefore, the output power of the heat sink driving circuit=0.
That is, in the first case, the output power of the heat sink driving circuit is 0, and the heat sink is in the off state, and the system is in the passive heat dissipation state.
Second case: the current is not less than the current threshold (i.e. I System and method for controlling a system ≥I Threshold value ) But the temperature is less than the temperature threshold (i.e. T System and method for controlling a system <T Threshold value )。
In the second case, K I ≠0，K T =0. Therefore, the output power of the heat sink driving circuit= (I System and method for controlling a system -I Threshold value )*K I 。
That is, in the second case, although the temperatures of all the temperature detection areas are lower than the temperature threshold, the system current is not lower than the current threshold, and at this time, the system power is already up, so that it can be predicted that the system temperature will rise within a certain time, and the heat dissipation component is opened to conduct active heat dissipation in advance. The driving power of the heat sink is the output power of the heat sink driving circuit, i.e. System and method for controlling a system -I Threshold value )*K I . As can be seen from the formula, the principle of heat dissipation in the second case is I System and method for controlling a system The larger the output power of the heat dissipation part driving circuit is, the larger the driving power of the heat dissipation part is, the better the heat dissipation effect of the heat dissipation part is (for example, the higher the revolution number of the heat dissipation part is), the stronger the temperature rising inhibiting capability of the system is, and the faster the heat dissipation of the system is.
Third case: the current is less than the current threshold (i.e. I System and method for controlling a system <I Threshold value ) But the temperature is not less than the temperature threshold (i.e. T System and method for controlling a system ≥T Threshold value )。
In the third case, K I ＝0，K T Not equal to 0. Therefore, the output power of the heat sink driving circuit=t System and method for controlling a system *K T 。
That is, in the third case, the temperature of a certain area of the system is not lower than the temperature threshold, but the current of the system is lower than the current threshold, and the fan is turned on to actively dissipate heat. The driving power of the heat dissipation part is the output power of the driving circuit of the heat dissipation part, namely T System and method for controlling a system *K T . As can be seen from the formula, in the third case, the output power of the heat sink driving circuit and the temperature obtained in step 202 (i.e., T System and method for controlling a system ) In positive correlation, i.e. the total heat dissipation principle is the temperature obtained in step 202 (i.e. T System and method for controlling a system ) The higher the output power of the heat dissipation part driving circuit is, the higher the driving power of the heat dissipation part is, the better the heat dissipation effect of the heat dissipation part is (such as the higher the revolution number of the heat dissipation part is), the stronger the temperature rising inhibiting capability of the system is, and the faster the heat dissipation of the system is.
Fourth case: the current is not less than the current threshold (i.e. I System and method for controlling a system ≥I Threshold value ) But the temperature is not less than the temperature threshold (i.e. T System and method for controlling a system ≥T Threshold value )。
In the fourth case, K I ≠0，K T Not equal to 0. Therefore, the output power of the heat sink driving circuit=t System and method for controlling a system *K T +(I System and method for controlling a system -I Threshold value )*K I 。
That is, in the fourth case, the temperature of a certain area of the belonging system is not lower than the temperature threshold value and the current of the belonging system is not lower than the current threshold value, at this time, the power of the belonging system is already up and the temperature of the belonging system is already high, it can be predicted that the temperature of the belonging system will further rise due to the increase of the power of the belonging system, so the heat sink driving circuit needs to further increase the output power based on the original output power, the increased output power and the current obtained in step 201 (i.e. System and method for controlling a system ) In positive correlation, i.e. the current obtained in step 201 (i.e. I System and method for controlling a system ) When the power is increased, the output power of the heat dissipation part driving circuit is further increased, so that heat dissipation is faster, and the influence caused by the increase of the power of the system is reduced.
I.e., the heat dissipation effect in the fourth case is the temperature obtained in step 202 (i.e., T System and method for controlling a system ) The higher the output power of the heat sink driving circuit, the higher the driving power of the heat sink, the better the heat dissipation effect of the heat sink (i.e. the higher the number of revolutions of the heat sink), and the current obtained in step 201 (i.e. I System and method for controlling a system ) When the power is increased, the output power of the heat dissipation part driving circuit is further increased, and the heat dissipation is achievedThe driving power of the heat component is further increased, the heat dissipation effect of the heat dissipation component is better (such as the rotation number of the heat dissipation component is higher), the temperature rising capability of the system is further improved, and the heat dissipation of the system is faster.
The heat dissipation system method of the edge computing unit can realize timely heat dissipation of the edge computing unit and ensure timely and effective discharge of system heat.
According to the heat dissipation system method of the edge computing unit, the output power of the heat dissipation part driving circuit can be adjusted according to the different heating areas of the system, and when the highest working temperature of a chip in the heating area is lower (temperature sensitive area), the output power of the heat dissipation part is further enhanced.
The heat dissipation method of the edge computing unit can realize timely heat dissipation of the edge computing unit and ensure that the heat of the system is effectively discharged in time. Compared with the existing heat dissipation method, the heat dissipation output can be adjusted according to the temperature and the power of the system.
According to the heat dissipation method of the edge computing unit, heat dissipation adjustment is performed by detecting the current of the system, the temperature rise of the system is caused by the increase of the power of the system (the increase of the power supply current of the system), when the power of the system is increased, larger heat is brought about, the heat can cause the temperature rise of the system, and heat dissipation can be performed in advance by detecting the current of the system without waiting until the temperature of the system is increased.
According to the heat dissipation method of the edge computing unit, the temperature rise of the system is judged in advance according to the power increase condition of the system, heat dissipation treatment can be performed in advance, and heat dissipation is more timely.
In the heat dissipation method of the edge computing unit provided by the embodiment, the output power of the heat dissipation part driving circuit is dynamically adjusted according to the temperature of the system and the power of the system, so that the temperature change of the system is smoother, the condition that the temperature of the system is suddenly high and suddenly low is reduced, and the influence on the working stability caused by the fact that the working frequency is repeatedly adjusted due to the repeated change of the temperature of the central processing unit is avoided.
The conventional heat dissipation method often has only one temperature acquisition point, and when the temperature of the system is locally increased, the heat cannot be well dissipated, and the temperature acquisition points of the heat dissipation method of the edge computing unit provided by the embodiment are simultaneously carried out in the main heating areas (a system power supply, a central processing unit, a temperature sensitive device area and the like) of the system, so that the problem that the heat cannot be well dissipated when the temperature of the system is locally increased is avoided.
In the heat dissipation method of the edge computing unit provided by the embodiment, the output power of the heat dissipation component driving circuit can be adjusted according to the temperature of the system, and further adjustment can be performed according to the current of the system on the basis of the output power, so that the temperature control of the system is more stable and the temperature rise can be restrained in advance. According to the heat dissipation method of the edge computing unit, the temperature rise of the system is judged in advance according to the power increase condition of the system, heat dissipation treatment can be performed in advance, and heat dissipation is more timely. The heat dissipation treatment can be performed in advance, so that the heat dissipation is more timely, and the heat dissipation device has the characteristics of being capable of dissipating heat in advance and simple to realize.
The heat dissipation capacity (such as the rotation speed of a fan) of the heat dissipation method of the edge computing unit provided by the embodiment can be adjusted according to different heating areas of the system, and when the highest working temperature of a chip in the heating area is lower, the output power of the heat dissipation component is further enhanced.
The embodiment provides a heat dissipation method of an edge computing unit, which comprises the steps of obtaining current of a system to which the edge computing unit belongs; acquiring the temperature of a system to which the edge computing unit belongs; radiating according to the current, the temperature and the current threshold; the current threshold is determined according to the environment temperature of the system and the maximum temperature of the central processing unit of the system. According to the method provided by the embodiment, heat is radiated through the current and the current threshold value determined according to the environment temperature of the system and the maximum temperature of the central processing unit of the system, so that heat can be radiated in advance, timely and effective radiation of heat is ensured, the working temperature performance of the edge computing unit is improved, and the edge computing unit operates more stably.
Based on the same inventive concept of the heat dissipation method of the edge computing unit shown in fig. 2, the present embodiment provides a heat dissipation system of the edge computing unit, referring to fig. 3, the heat dissipation system of the edge computing unit provided in the present embodiment includes: the device comprises a central processing unit, a temperature detection module, a current detection module, a heat dissipation part driving circuit and a heat dissipation part.
1. Current detection module
The current detection module is used for collecting the current of the system to which the edge calculation unit belongs.
The current detection module is composed of a current sensor for detecting the power supply current of the system, and can transmit the total current parameter of the system back to the central processing unit through an interface of IIC (Inter-Integrated Circuit, integrated circuit bus) and the like.
The temperature rise of the system to which the edge computing unit belongs (such as the edge computing unit system) is caused by the increase of the power of the system, and the current of the system can represent the power of the system, the voltage of the system is fixed, and the larger the current of the system is, the larger the power of the system is. Therefore, when the system current increases, which indicates an increase in the system power, the system of the present embodiment determines that the temperature of the system will start to increase accordingly, and further enhancement of the heat dissipation capability of the system is required to suppress the process of increasing the temperature of the system.
2. Temperature detection module
The temperature detection module is used for collecting the temperature of the system to which the edge calculation unit belongs.
In addition, the temperature detection module comprises a temperature sensor positioned in a heating area in the system to which the edge calculation unit belongs, and a temperature sensor positioned in the central processing unit.
For example, the temperature sensor is placed in a main heating area (such as near a main power supply) of the system and integrated inside the central processing unit (such as NVIDA Jetson AGX Orin module is integrated with the temperature sensor), and the temperature sensor is used for collecting the multi-point environmental temperature of the system and transmitting the temperature data to the central processing unit, so that the temperature detection is more timely.
3. Central processing unit
The central processing unit obtains the current collected by the current detection module through the integrated circuit bus IIC interface. And acquiring the temperature acquired by the temperature detection module through the IIC interface. And controlling the heat dissipation part driving circuit through the Pulse Width Modulation (PWM) pin according to the current, the temperature and the current threshold.
The central processing unit may be a NVIDA Jetson AGX Orin high-performance processing unit of the system to which the edge computing unit belongs, or a separate MCU (Microcontroller Unit, micro control unit) in specific implementation. The central processing unit is connected with the temperature detection module through an IIC interface to acquire temperature parameters. The central processing unit is connected with the current detection module through an IIC interface to acquire system current parameters. The central processing unit provides driving signals (which can also be controlled by other interfaces) for the heat dissipation part driving circuit through PWM (Pulse Width Modulation) pins.
And the central processing unit is used for acquiring the current acquired by the current detection module and acquiring the temperature acquired by the temperature detection module. And controlling the heat dissipation part driving circuit to drive the heat dissipation part to dissipate heat of the CPU according to the current, the temperature and the current threshold value.
The current threshold is determined according to the environment temperature of the system and the maximum temperature of the central processing unit of the system.
In addition, the current threshold is the quotient of the power corresponding to the temperature difference between the maximum temperature of the CPU and the ambient temperature and the voltage of the system to which the CPU belongs.
When the central processing unit controls the heat dissipation part driving circuit to drive the heat dissipation part to dissipate heat according to the current, the temperature and the current threshold value, the output power of the heat dissipation part driving circuit can be determined according to the product of the temperature and the temperature coefficient and the product of the difference between the current and the current threshold value and the current coefficient, and the output power of the heat dissipation part driving circuit is controlled to be the determined output power.
4. Driving circuit for heat dissipation part
And a heat sink driving circuit for outputting the output power to the heat sink based on the control of the CPU. I.e. the heat sink driving circuit is used for driving the heat sink.
For example, the heat sink driving circuit: for driving the operation of the fan (or water pump) in the heat dissipation part, the central processing unit can control and drive the rotating speed of the fan (or water pump) in the heat dissipation part through the output power of the driving circuit of the heat dissipation part.
5. Heat dissipation part
The heat dissipation members include an inner heat dissipation member and an outer heat dissipation member, as shown in fig. 4.
1) Internal heat dissipation component
And the internal heat dissipation part adopts an active heat dissipation mode. Including core heat sink elements. The core heat dissipation component is mounted outside the metal housing of the edge computing unit. The metal shell is provided with radiating fins. The heat fins and the metal housing are connected to the thermally conductive silicone grease.
For example, the internal heat dissipation component is formed by a fan in an active heat dissipation mode, and the fan can transmit the rotation speed information back to the central processing unit.
The active heat dissipation can also consist of a water cooling mode or a water cooling and air cooling mode, and the water cooling mode is to control a water pump to conduct water circulation heat dissipation.
The heat sink fins on the metal housing of the edge calculation unit and the metal housing are connected to a thermally conductive silicone grease on a PCB (Printed Circuit Board ). The main heating chip position on the circuit board of the corresponding edge computing unit on the metal shell is provided with a corresponding boss which extends to the chip surface and realizes the soft contact between the metal boss and the chip surface through heat conduction silicone grease.
The fan is arranged outside the metal shell, after the fan is started, air on the surface of the shell flows to take away heat, and the metal shell can be provided with radiating fins to increase the radiating area.
2) External heat dissipation part
And the external heat dissipation part is positioned at the ventilation opening of the pole-holding box.
For example, the outside radiating part comprises the fan of installing at the pole-holding case vent, realizes the exchange of pole-holding case inside empty steam and outside cold air, plays the effect of radiating to the pole-holding case inside, further strengthens the system heat-sinking capability.
And the heat radiation component is used for controlling the heat radiation capacity for radiating the CPU under the driving of the output power of the heat radiation component driving circuit, and the effect (such as rotating speed) of the heat radiation capacity can be output to the CPU so as to radiate the CPU.
In specific implementation, the output signal of the central processing unit controls the output power of the heat dissipation part driving circuit, and the higher the output power of the heat dissipation part driving circuit is, the faster the rotating speed of the heat dissipation part fan is, and the faster the heat dissipation of the system is. The smaller the output power of the heat dissipation part driving circuit is, the slower the rotating speed of the heat dissipation part fan is, and the slower the heat dissipation of the system is.
The heat dissipation system of the edge computing unit provided in this embodiment is embodied,
the current detection module collects the current of the system to which the edge calculation unit belongs and transmits the collected current to the central processing unit.
The temperature detection module collects the temperature of the system to which the edge calculation unit belongs and transmits the collected temperature to the central processing unit.
The CPU dissipates heat according to the current, temperature and current threshold.
Specifically, the central processing unit determines the output power of the heat dissipation part driving circuit according to the product of the temperature and the temperature coefficient, the product of the difference between the current and the current threshold value and the current coefficient. The CPU controls the heat dissipation part driving circuit to output the output power to the heat dissipation part, and the heat dissipation part adjusts heat dissipation capacity (such as the revolution of a fan) under the driving of the output power of the heat dissipation part driving circuit so as to dissipate heat of the CPU.
The cpu determines the current threshold before the cpu dissipates heat based on the current, temperature, and current threshold. When the system operates under constant power in a constant temperature environment, the temperature can gradually rise and finally reach dynamic balance of one temperature, and the difference between the system temperature and the environment temperature when the dynamic balance of the temperature is reached is the temperature rise under the constant power. The temperature rise is a relatively stable value, and can not generate larger change due to the change of the environmental temperature, and the corresponding relation between the temperature rise and each constant power operation can be determined through experimental measurement, for example, the system power corresponding to the system temperature rise at 10 ℃, 20 ℃ and 30 ℃ can be determined.
Based on this, the current threshold is determined from the ambient temperature of the system to which it belongs and the maximum temperature of the central processor of the system to which it belongs. For example, the ambient temperature of the system to which it belongs is obtained. The temperature difference (temperature difference, i.e., temperature rise) between the maximum temperature of the central processing unit of the system and the ambient temperature is calculated. And determining the power corresponding to the temperature difference according to the preset corresponding relation between the temperature difference and the power. The quotient of the corresponding power and the voltage of the system is determined as a current threshold.
Since the voltage of the system is constant, the current is the power/voltage according to the relationship of power=voltage. Thus, after the corresponding power is obtained, the quotient of the corresponding power and the voltage of the system is determined as a current threshold.
In addition, when the central processing unit determines the output power of the heat dissipation part driving circuit according to the product of the temperature and the temperature coefficient, the product of the difference between the current and the current threshold value and the current coefficient, if the current is smaller than the current threshold value, the current coefficient is 0. If the temperature is below the temperature threshold, the temperature coefficient is 0.
The temperature threshold is determined according to the junction temperature of the central processing unit of the system, for example, the temperature threshold is 1/3 of the junction temperature of the central processing unit of the system.
Let the temperature collected by the temperature detection module be T System and method for controlling a system (i.e. the temperature obtained by the CPU is T System and method for controlling a system ) The current collected by the current detection module is I System and method for controlling a system (i.e. the current drawn by the CPU is I) System and method for controlling a system ) The current threshold is I Threshold value A temperature coefficient of K T The current coefficient is K I The cpu determines that the output power of the heat sink driving circuit=t System and method for controlling a system *K T +(I System and method for controlling a system -I Threshold value )*K I 。
Wherein the temperature is K T And current coefficient K I The value of (2) is a constant, an empirical value, and can be determined experimentally. However, if I System and method for controlling a system <I Threshold value Then K is I =0, if T System and method for controlling a system <T Threshold value (e.g., T Threshold value Cpu junction temperature of the system of which K is 1/3), then K T ＝0。
In a specific implementation, according to the relationship between the obtained current and the current threshold, the relationship between the obtained temperature and the temperature threshold may occur in one of the following four cases, where the central processor in each case may calculate the output power of the heat dissipation part driving circuit by adopting a different scheme, so as to control the heat dissipation capability of the heat dissipation part based on the output power of the heat dissipation part driving circuit. In particular, the method comprises the steps of,
first case: the current is less than the current threshold (i.e. I System and method for controlling a system <I Threshold value ) And the temperature is less than the temperature threshold (i.e. T System and method for controlling a system <T Threshold value )。
In the first case, K I ＝0，K T =0. Therefore, the output power of the heat sink driving circuit=0.
That is, in the first case, the cpu determines that the output power of the heat sink driving circuit is 0, and then the driving power of the heat sink is 0, and the heat sink is in the off state, and at this time, the system is in the passive heat dissipation state, and the passive heat dissipation is performed through the housing and the fins.
Second case: the current is not less than the current threshold (i.e. I System and method for controlling a system ≥I Threshold value ) But the temperature is less than the temperature threshold (i.e. T System and method for controlling a system <T Threshold value )。
In the second case, K I ≠0，K T =0. Therefore, the cpu determines the output power= (I) of the heat sink driving circuit System and method for controlling a system -I Threshold value )*K I 。
That is, in the second case, although all the temperature detection regions are below the temperature threshold valueThe system current is not less than the current threshold, and the system temperature is low at the moment, but the system power is already up, so that the temperature of the system can be predicted to rise within a certain time, and the heat dissipation part is opened to conduct active heat dissipation in advance. The driving power of the heat sink is the output power of the heat sink driving circuit, i.e. System and method for controlling a system -I Threshold value )*K I . As can be seen from the formula, the principle of heat dissipation in the second case is I System and method for controlling a system The larger the output power of the heat dissipation part driving circuit is, the larger the driving power of the heat dissipation part is, the better the heat dissipation effect of the heat dissipation part is (for example, the higher the revolution number of the heat dissipation part is), the stronger the temperature rising inhibiting capability of the system is, and the faster the heat dissipation of the system is.
Third case: the current is less than the current threshold (i.e. I System and method for controlling a system <I Threshold value ) But the temperature is not less than the temperature threshold (i.e. T System and method for controlling a system ≥T Threshold value )。
In the third case, K I ＝0，K T Not equal to 0. Therefore, the output power of the cpu heat sink driving circuit=t System and method for controlling a system *K T 。
That is, in the third case, the temperature of a certain area of the system is not lower than the temperature threshold, but the current of the system is lower than the current threshold, and the fan is turned on to actively dissipate heat. The driving power of the heat dissipation part is the output power of the driving circuit of the heat dissipation part, namely T System and method for controlling a system *K T . As can be seen from the formula, in the third case, the output power of the heat sink driving circuit and the temperature (i.e., T System and method for controlling a system ) In positive correlation, i.e. the total heat dissipation principle is the temperature obtained by the CPU (i.e. T System and method for controlling a system ) The higher the output power of the heat dissipation part driving circuit is, the higher the driving power of the heat dissipation part is, the better the heat dissipation effect of the heat dissipation part is (such as the higher the revolution number of the heat dissipation part is), the stronger the temperature rising inhibiting capability of the system is, and the faster the heat dissipation of the system is.
Fourth case: the current is not less than the current threshold (i.e. I System and method for controlling a system ≥I Threshold value ) But the temperature is not less than the temperature threshold (i.e. T System and method for controlling a system ≥T Threshold value )。
In the fourth case, K I ≠0，K T Not equal to 0. Therefore, the cpu determines the output power=t of the heat sink driving circuit System and method for controlling a system *K T +(I System and method for controlling a system -I Threshold value )*K I 。
That is, in the fourth case, the temperature of a certain area of the belonging system is not lower than the temperature threshold value and the current of the belonging system is not lower than the current threshold value, at this time, the power of the belonging system is already up and the temperature of the belonging system is already high, it can be predicted that the temperature of the belonging system will further rise due to the increase of the power of the belonging system, so the heat sink driving circuit needs to further increase the output power based on the original output power, the increased output power and the current acquired by the cpu (i.e. System and method for controlling a system ) In positive correlation, i.e. the current drawn by the CPU (i.e. I System and method for controlling a system ) When the power is increased, the output power of the heat dissipation part driving circuit is further increased, so that heat dissipation is faster, and the influence caused by the increase of the power of the system is reduced.
I.e. the heat dissipation effect in the fourth case is the temperature obtained by the CPU (i.e. T System and method for controlling a system ) The higher the output power of the heat sink driving circuit, the higher the driving power of the heat sink, the better the heat dissipation effect of the heat sink (i.e. the higher the number of revolutions of the heat sink), the current obtained by the cpu (i.e. I System and method for controlling a system ) When the temperature rise of the system is restrained, the temperature rise of the system is further enhanced, and the heat dissipation of the system is faster.
The heat dissipation system of the edge computing unit provided in this embodiment can adjust the output power of the heat dissipation component driving circuit according to the different heat generation areas of the system, and further enhance the output power of the heat dissipation component when the highest operating temperature of the chip in the heat generation area is low (temperature sensitive area).
The heat dissipation system of the edge computing unit provided by the embodiment can realize timely heat dissipation of the edge computing unit and ensure that the heat of the system is timely and effectively discharged.
The heat dissipation system of the edge computing unit provided in this embodiment performs heat dissipation adjustment by detecting the current level of the system, where the increase in temperature of the system is caused by the increase in power of the system (increase in power supply current of the system), and when the power of the system increases, the heat brings about a larger heat quantity, which causes the increase in temperature of the system, and by detecting the current of the system, heat dissipation can be performed in advance without waiting for the temperature of the system to have increased.
In the heat dissipation system of the edge computing unit provided by the embodiment, the output power of the heat dissipation part driving circuit is dynamically adjusted according to the temperature of the system and the power of the system, so that the temperature change of the system is smoother, the condition that the temperature of the system is suddenly high and suddenly low is reduced, and the influence on the working stability caused by the fact that the working frequency is repeatedly adjusted due to the repeated change of the temperature of the central processing unit is avoided.
The heat dissipation component (fan) of the heat dissipation system of the edge computing unit is simultaneously installed on the edge computing unit shell and inside the holding pole box for placing the edge computing unit, the edge computing unit can simultaneously control the operation of the heat dissipation component installed on the edge computing unit shell and inside the holding pole box for placing the edge computing unit, and the heat dissipation effect is further enhanced.
The conventional heat dissipation method usually only has one temperature acquisition point, and when the temperature of the system is locally increased, the heat cannot be well dissipated, and the temperature acquisition points of the heat dissipation system of the edge computing unit provided by the embodiment are simultaneously carried out in the main heating areas (a system power supply, a central processing unit, a temperature sensitive device area and the like) of the system, so that the problem that the heat cannot be well dissipated when the temperature of the system is locally increased is avoided.
The output power of the heat dissipation component driving circuit in the heat dissipation system of the edge computing unit provided by the embodiment can be adjusted according to the temperature of the system, and can be further adjusted according to the current of the system on the basis of the output power, so that the temperature control of the system is more stable, the temperature rise can be restrained in advance, and the heat dissipation control can be performed according to the current of the system, so that the heat dissipation can be performed in advance when the temperature of the system is not raised but is about to rise. According to the heat radiation system of the edge computing unit, the temperature rise of the system is judged in advance according to the power increase condition of the system, and heat radiation treatment can be performed in advance, so that heat radiation is more timely. The heat dissipation treatment can be performed in advance, so that the heat dissipation is more timely, and the heat dissipation device has the characteristics of being capable of dissipating heat in advance and simple to realize.
The heat dissipation system of the edge computing unit provided by the embodiment adds the heat conduction boss design in the main heat-generating area, so that the heat-generating areas such as a power supply and the like can be well dissipated through the heat conduction boss by dissipating heat of the central processing unit.
The heat dissipation capability (such as the rotation speed of a fan) of the heat dissipation component of the heat dissipation system of the edge computing unit provided by the embodiment can be adjusted according to different heat generation areas of the system, and when the highest working temperature of the chip of the heat generation area is lower, the output power of the heat dissipation component is further enhanced.
The application provides a cooling system of edge computing unit, this system dispels the heat through electric current and according to the current threshold value of the ambient temperature of affiliated system and the biggest temperature determination of central processing unit of affiliated system, can carry out the heat dissipation in advance and handle, has guaranteed the timely effective efflux of heat, promotes edge computing unit operating temperature performance, makes edge computing unit operation more steady.
Based on the same inventive concept of the heat dissipation method of the edge computing unit shown in fig. 2, the present embodiment provides an edge computing unit including a heat dissipation system as shown in fig. 3.
The implementation of the heat dissipation system is shown in the embodiment of fig. 3, and will not be described in detail here.
The application provides an edge computing unit, wherein including cooling system, this cooling system dispels the heat through electric current and according to the current threshold value that the ambient temperature of the system that edge computing unit belonged to and the maximum temperature of the central processing unit of the system that edge computing unit belonged to confirm, can dispel the heat in advance and handle, has guaranteed the timely effective effluvium of heat, promotes edge computing unit operating temperature performance, makes edge computing unit operation more steady.
It will be appreciated by those skilled in the art that embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein. The solutions in the embodiments of the present application may be implemented in various computer languages, for example, object-oriented programming language Java, and an transliterated scripting language JavaScript, etc.
The present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the application. It will be understood that each flow and/or block of the flowchart illustrations and/or block diagrams, and combinations of flows and/or blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
While preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the application.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present application without departing from the spirit or scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims and the equivalents thereof, the present application is intended to cover such modifications and variations.
Claims (11)
1. A method of dissipating heat from an edge computing unit, the method comprising:
Acquiring the current of a system to which the edge computing unit belongs;
acquiring the temperature of a system to which the edge computing unit belongs;
radiating according to the current, the temperature and a current threshold; the current threshold is determined according to the environment temperature of the system and the maximum temperature of the central processing unit of the system.
2. The method of claim 1, wherein prior to said dissipating heat in accordance with said current, said temperature, and a current threshold, further comprising:
acquiring the environment temperature of a system to which the system belongs;
calculating the temperature difference between the maximum temperature of a central processing unit of the system and the ambient temperature;
determining the power corresponding to the temperature difference according to the corresponding relation between the preset temperature difference and the power;
the quotient of the corresponding power and the voltage of the system is determined as a current threshold.
3. The method of claim 1, wherein the dissipating heat according to the current, the temperature, and a current threshold comprises:
determining the output power of the heat dissipation part driving circuit according to the product of the temperature and the temperature coefficient, the product of the difference between the current and the current threshold value and the current coefficient;
and controlling the heat radiation capability of the heat radiation component based on the output power of the heat radiation component driving circuit.
4. A method according to claim 3, wherein the temperature coefficient is 0 when the temperature is below a temperature threshold; when the current is smaller than a current threshold value, the current coefficient is 0;
wherein the temperature threshold is determined according to the junction temperature of a central processing unit of the system.
5. A heat dissipation system for an edge computing unit, the system comprising: the device comprises a central processing unit, a temperature detection module, a current detection module, a heat dissipation part driving circuit and a heat dissipation part;
the current detection module is used for collecting the current of the system to which the edge calculation unit belongs;
the temperature detection module is used for collecting the temperature of the system to which the edge calculation unit belongs;
the central processing unit is used for acquiring the current acquired by the current detection module and acquiring the temperature acquired by the temperature detection module; controlling the heat dissipation part driving circuit to drive the heat dissipation part to dissipate heat of the central processing unit according to the current, the temperature and the current threshold; the current threshold is determined according to the environment temperature of the system and the maximum temperature of the central processing unit of the system.
6. The system of claim 5, wherein the current threshold is a quotient of a power corresponding to a temperature difference between the maximum temperature of the cpu and an ambient temperature and a voltage of the system.
7. The system of claim 5, wherein the central processing unit is configured to determine the output power of the heat sink driving circuit based on a product of the temperature and a temperature coefficient, a product of a difference between the current and a current threshold, and a current coefficient;
the heat dissipation part driving circuit is used for outputting the output power;
and the heat dissipation part is used for controlling the heat dissipation capacity of dissipating heat of the central processing unit under the drive of the output power.
8. The system of claim 5, wherein the temperature detection module comprises a temperature sensor located in a heat generating region of the system to which the edge computing unit belongs, and a temperature sensor located inside the central processor.
9. The system of claim 5, wherein the central processor obtains the current collected by the current detection module through an integrated circuit bus IIC interface; acquiring the temperature acquired by the temperature detection module through an IIC interface; and controlling the heat dissipation part driving circuit through a Pulse Width Modulation (PWM) pin according to the current, the temperature and the current threshold.
10. The system of claim 5, wherein the heat sink member comprises an inner heat sink member and an outer heat sink member;
The internal heat dissipation part adopts an active heat dissipation mode; comprises a core heat dissipation component; the core heat dissipation component is mounted outside the metal shell of the edge computing unit; the metal shell is provided with radiating fins; the heat radiating fins and the metal shell are connected to heat conducting silicone grease;
the external heat dissipation part is positioned at the ventilation opening of the pole-holding box.
11. An edge computing unit comprising a heat dissipation system as claimed in any one of claims 5 to 10.
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