CN101174169A - Temperature detecting system and method - Google Patents
Temperature detecting system and method Download PDFInfo
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- CN101174169A CN101174169A CNA2006101427438A CN200610142743A CN101174169A CN 101174169 A CN101174169 A CN 101174169A CN A2006101427438 A CNA2006101427438 A CN A2006101427438A CN 200610142743 A CN200610142743 A CN 200610142743A CN 101174169 A CN101174169 A CN 101174169A
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Abstract
The invention relates to a temperature detection system and the method thereof. The invention is used to detect the operating temperature of a pre-testing object in the electronic equipment, when the detected temperature is higher than a predetermined value, the invention drives a heat radiation unit in the electronic equipment to radiate the heat of the pre-testing object. The method is as follow: the operating current of the pre-testing object is detected, and the detected operating current can be transformed into a digital signal which can be read by the electronic equipment; the consumed power of the pre-testing object is calculated based on the digital signal, and is taken as the operating temperature of the pre-testing object, and the corresponding operating temperature of the consumed power drives the heat radiation unit to radiate the heat of the pre-testing object.
Description
Technical field
The present invention relates to a kind of temperature detecting system and method, more detailed it, relate to the power that is consumed according to working current that object to be measured detected is obtained this object to be measured relatively, and with the working temperature of this consumed power, to order about a kind of temperature detecting system and the method that heat-sink unit dispels the heat to this object to be measured when this working temperature is higher than a predetermined value detecting as this object to be measured.
Background technology
Along with development of science and technology, the usefulness of each class of electronic devices is promoted relatively, such as the working temperature that system works produced of measuring this electronic equipment, the existing measurement of adopting temperature sensing wafer (IC) to realize system is produced temperature more, so, this type of thermometric mode, this temperature sensing wafer must be closed on be arranged at and to carry out thermometric object, for example central processing unit or hard disk, be subject to temperature sensing wafer and set-up mode thereof, therefore existing thermometric mode can not be measured at all the electronic component temperature in the electronic equipment.
Other is the person, the temperature sensing wafer that is adopted in this type of thermometric mode itself has fixing transmission line specification, so that object to be measured is carried out temperature survey by this transmission line, so object to be measured then must possess and have and the corresponding connecting line of this transmission line, yet generally speaking, object to be measured does not have the connecting line corresponding with the transmission line of this temperature sensing wafer, therefore, this type of thermometric mode also is subject to the connecting line corresponding with the transmission line of this temperature sensing wafer.
Therefore, how to design a kind of temperature detecting system, the position is set need be subject to object to be measured position and temperature detecting and handles and go up electronic equipment and need the corresponding problem that possess the transmission line that can support this temperature sensing wafer to overcome the temperature sensing wafer, real is present problem demanding prompt solution.
Summary of the invention
In view of above-mentioned prior art problems, a purpose of the present invention is to provide a kind of temperature detecting system and method, in order to solve the temperature sensing wafer be provided with limited location in object to be measured position and temperature detecting handle and go up electronic equipment and need the corresponding problem that possess the transmission line that can support this temperature sensing wafer.
Another object of the present invention is to provide a kind of temperature detecting system and method, in order to detect the power that this temperature detecting object is consumed, and according to the relation of the consumed power of the radiating efficiency of heat-sink unit and this electronic equipment to control the cooling mechanism that this heat-sink unit can provide, use as the Energy Saving Control of electronic equipment on total system.
A further object of the present invention is to provide a kind of temperature detecting system and method, in order to power consumption and the calorimetry of detecting electronic equipment on total system.
For reaching above-mentioned all purposes and other purpose, the invention provides a kind of temperature detecting system and method.Temperature detecting system of the present invention is in order to the object to be measured in the electronic equipment is carried out the detecting of working temperature, and this object to be measured is dispelled the heat detecting the heat-sink unit that orders about when working temperature is higher than a predetermined value in this electronic equipment, this temperature detecting system comprises: detecting module is in order to detect the working current of this object to be measured; Modular converter is in order to the working current that this detecting module detected is converted to digital signal and is exported; And control module, when system is used to receive the digital signal that this modular converter exports, carry out the consumed power that computing obtains this object to be measured according to this digital signal, and with the working temperature of this consumed power, and order about this heat-sink unit with the pairing working temperature of this consumed power this object to be measured is dispelled the heat as this object to be measured.
In the present invention, consumed power by this object to be measured determines the heat that this object to be measured produces, make thus this control module according to the relation of the consumed power of the radiating efficiency of heat-sink unit and object to be measured to control the heat dissipation of this heat-sink unit, for example, this heat-sink unit is a fan, when the heat that this object to be measured produced is too high, this control module is ordered about fan and is turned round at full speed, to reduce the heat that this object to be measured is produced, and because the object to be measured in this electronic equipment can be out of service relatively in response to the system operation situation of electronic equipment, so object to be measured can't consume any power when out of service, and show fan running or make this fan maintain the low-speed running state because of taboo, so can effectively control the noise that fan is produced when rotation speed change.Therefore, temperature detecting system of the present invention is promptly according to temperature effect that power consumption caused and as the reference of cooling mechanism.
Carrying out exothermic temperature method for detecting of the present invention by temperature detecting system of the present invention is in order to the object to be measured in the electronic equipment is carried out the detecting of working temperature, and this object to be measured is dispelled the heat detecting the heat-sink unit that orders about when working temperature is higher than a predetermined value in this electronic equipment, this temperature detecting method system may further comprise the steps: the working current of detecting this object to be measured; The working current that is detected is converted to the digital signal that can supply this electronic equipment to read; And carry out the consumed power that computing obtains this object to be measured according to this digital signal, and with the working temperature of this consumed power as this object to be measured, and order about this heat-sink unit with the pairing working temperature of this consumed power this object to be measured is carried out heat radiation.
Than prior art, temperature detecting system of the present invention and method can effectively be got rid of being provided with of existing temperature sensing wafer needs to consider that object to be measured position and temperature detecting are handled goes up electronic equipment and need the corresponding problem that possess the transmission line that can support this temperature sensing wafer, in addition, owing to carry out heat radiation according to object actual power consumption situation to be measured, so effectively generation of controlling noise, and also can exempt the setting of temperature sensing wafer, thereby reduce the electrical source consumption of electronic equipment; On the other hand, controlling the heat dissipation of this heat-sink unit, and then reach Energy Saving Control according to the relation of the consumed power of the radiating efficiency of heat-sink unit and object to be measured to electronic equipment.Moreover, more can try to achieve the consumed power of object to be measured by temperature detecting system of the present invention, and with this power consumption as object to be measured itself, or can try to achieve all power consumptions of electronic equipment total system, according to temperature effect that power consumption caused and as the reference of cooling mechanism, in other words, also can control the heat dissipation that this heat-sink unit can be brought into play according to the total system of electronic equipment or the local power that electronic component consumed, thus as electronic equipment for the Energy Saving Control on dispelling the heat.
Description of drawings
Figure 1 shows that the basic framework block schematic diagram of temperature detecting system of the present invention; And
Figure 2 shows that the basic flow sheet of temperature detecting method of the present invention.
[main element symbol description]
1 temperature detecting system
10 detecting modules
11 modular converters
12 control modules
2 electronic equipments
20 objects to be measured
21 heat-sink units
S201～S203 step
Embodiment
Below by particular specific embodiment explanation embodiments of the present invention, the those skilled in the art can understand other advantages of the present invention and effect easily by the content that this instructions disclosed.The present invention also can be implemented or be used by other different specific embodiments, and the every details in this instructions also can be based on different viewpoints and application, carries out various modifications and change under the spirit of the present invention not deviating from.
As shown in Figure 1, be the basic framework block schematic diagram of temperature detecting system 1 of the present invention.This temperature detecting system 1 is to be applied in the electronic equipment 2, and be located in this electronic equipment 2 in can be directly, so that the object to be measured in this electronic equipment 2 20 is carried out temperature sensing, and the heat-sink unit 21 that orders about behind temperature sensing in this electronic equipment 2 is carried out and the corresponding cooling mechanism of this temperature sensing result, present embodiment, this object 20 to be measured is CPU for example, and this heat-sink unit 21 is a fan for example, this cooling mechanism for example comprises that working as the temperature sensing result is high temperature, then electronic equipment 2 orders about fan and turns round at full speed, to downgrade the temperature of this object 20 to be measured.Because the electronic component in the electronic equipment 2 can produce operation or state out of service relatively in response to system operation situation, therefore when electronic component moves with corresponding consumed power, relative, when electronic component is out of service, can't consume any power, therefore, temperature detecting system 1 of the present invention is promptly according to temperature effect that power consumption caused and as the reference of cooling mechanism.
Temperature detecting system 1 of the present invention is to comprise: detecting module 10, modular converter 11, control module 12 and storer 120 below promptly are elaborated at temperature detecting system 1 of the present invention.
This detecting module 10 is in order to detecting this object 20 working currents to be measured, and the detecting by this electric current is to obtain the consumed power of correspondence, and generally speaking, this detecting module 10 is a current-sensing circuit.In the present embodiment, the working current of object 20 to be measured determines the power that it consumes, and can determine the heat that this object 20 to be measured is produced by the power that is consumed, and thus as the working temperature of this object to be measured.
This modular converter 11 is to carry out analogy digital conversion (ADC) in order to the working current that this detecting module 10 is detected, this working current is converted to digital signal output.This control module 12 is when being used to receive the digital signal that this modular converter 11 exported, to carry out relative cooling mechanisms according to 21 pairs of these objects 20 to be measured of this heat-sink unit of this Digital Signals.Wherein, 11 of this control module 12 and modular converters are the transmission process that reaches digital signal by transmission lines such as I2C or GPIO.
This control module 12 is the control center of this electronic equipment 2 for example, and for example, if this electronic equipment 2 is desktop computer or notebook computer, then 12 of this control modules are central processing unit (CPU); If this electronic equipment 2 is a server, then 12 of this control modules are baseboard management controller (BMC).Generally speaking, this control module 12 and storer 120 electric connections in order to store many operational factors, wherein this operational factor means the control rotating speed of fan and the resistance of object to be measured, and the control rotating speed of each fan is also corresponding with default consumed power, so, to receive digital signal in control module 12 after through being exported after 11 conversions of this modular converter, according to the initial output source that produces this digital signal, that is the initial generation source of this digital signal is this object 20 to be measured, obtain the resistance of this object 20 to be measured and this resistance and received digital signal (electric current of this object to be measured of promptly flowing through) are carried out computing, to obtain the power that this object 20 to be measured is consumed, make this control module 12 in this storer 12, obtain the fan control rotating speed corresponding, and then order about this heat-sink unit 21 and dispel the heat according to the fan control rotating speed of obtaining with it according to the consumed power of obtained object to be measured 20.
As from the foregoing, this detecting module 10 is by detecting the electric current that this object 20 to be measured is flowed through, and carry out digital conversion by 11 pairs of measured electric currents of this modular converter, the resistance of the object to be measured 20 that is prestored according to received digital signal and storer 120 for this control module 12 obtains the power that this object 20 to be measured is consumed, order about this heat-sink unit with the rotation speed of the fan corresponding again and carry out heat radiation with this power, therefore, temperature detecting system 1 of the present invention is to add current-sensing circuit (being detecting module) and existing electronic equipment 2 original analogy digital conversion circuit that provides (being modular converter) and control modules are provided, can try to achieve the consumed power of object to be measured and with this working temperature as object to be measured itself, or can try to achieve all effect consumption of electronic equipment total system, according to temperature effect that power consumption caused and as the reference of cooling mechanism.Can effectively get rid of being provided with of existing temperature sensing wafer by temperature detecting system 1 of the present invention and need to consider that object to be measured position and temperature detecting are handled goes up electronic equipment and need the corresponding problem that possess the transmission line that can support this temperature sensing wafer, in addition, owing to carry out heat radiation according to object actual power consumption situation to be measured, the effectively generation of controlling noise, and also can exempt the setting of temperature sensing wafer, thereby the electrical source consumption of reduction electronic equipment, on the other hand, controlling the heat dissipation of this heat-sink unit 21, and then reach Energy Saving Control according to the relation of the consumed power of the radiating efficiency of heat-sink unit 21 and object to be measured to electronic equipment 2.
The process flow diagram of carrying out temperature detecting method of the present invention by temperature detecting system of the present invention 1 as shown in Figure 2, this method comprises following implementation step: in step S201, by the working current of the object to be measured 20 in detecting module 10 these electronic equipments 2 of detecting.Then, proceed to step S202.
In step S202, carry out digital conversion by modular converter 11 according to the working current that detecting module 10 is detected, to be converted to the digital signal of subset 2 interpretations of can powering.Then, proceed to step S203.
In step S203, this control module 12 calculates the power that this object 20 to be measured is consumed according to received digital signal, makes this control module 12 carry out corresponding cooling mechanism with the power control heat-sink unit 21 that calculates.What this must illustrate be, because this control module 12 is and electrically connects in order to the storer 120 that stores many operational factors, wherein this operational factor means the control rotating speed of fan and the resistance of object to be measured, and the control rotating speed of each fan is also corresponding with default consumed power, for example, the high more then rotation speed of the fan of consumed power is high more, so receiving the digital signal of being exported (electric current of this object to be measured of promptly flowing through) after 11 conversions of this modular converter, this control module 12 carries out computing with the resistance of this object 20 to be measured, to obtain the power that this object 20 to be measured is consumed, that is, the acquisition mode of power comprises that the operating voltage of object to be measured multiply by the working current of object to be measured, perhaps the working current of object to be measured square after multiply by the resistance of object to be measured again, in present embodiment system with the working current of object to be measured square after multiply by the resistance of object to be measured again to obtain the consumed power of this object to be measured, make this control module 12 obtain the fan control rotating speed corresponding again, and then order about this heat-sink unit 21 and dispel the heat according to the fan control rotating speed of obtaining with it according to the consumed power of obtained object to be measured 20.
Than prior art, temperature detecting system of the present invention and method, main system is by the working current of these detecting module 10 these objects 20 to be measured of detecting, and this working current is converted to digital signal for 12 interpretations of the control module in the electronic equipment 2, obtain the consumed power of this object 20 to be measured again through the compute mode of consumed power, to control the operation of this heat-sink unit 21 according to the radiation parameter corresponding with this consumed power.Therefore, can effectively get rid of being provided with of existing temperature sensing wafer by temperature detecting system of the present invention and method and need to consider that object to be measured position and temperature detecting are handled goes up electronic equipment and need the corresponding problem that possess the transmission line that can support this temperature sensing wafer; In addition, the present invention is owing to carry out heat radiation according to object actual power consumption situation to be measured, so can adjust fan running work in good time, for example, just order about when the power that object to be measured consumed reaches high power fan at full speed mode turn round, otherwise, thereby any power consumption do not arranged if object to be measured is out of service, then prohibit and show fan running or make this fan maintain the low-speed running state, therefore, temperature sensing system of the present invention and method also can effectively be controlled the noise that fan is produced when rotation speed change.
Claims (8)
1. temperature detecting system, in order to the object to be measured in the electronic equipment is carried out the detecting of working temperature, and this object to be measured is dispelled the heat detecting the heat-sink unit that orders about when working temperature is higher than a predetermined value in this electronic equipment, this temperature detecting system comprises:
Detecting module is in order to detect the working current of this object to be measured;
Modular converter is in order to the working current that this detecting module detected is converted to digital signal and is exported; And
Control module, when system is used to receive the digital signal that this modular converter exports, carry out the consumed power that computing obtains this object to be measured according to this digital signal, and with the working temperature of this consumed power, and order about this heat-sink unit with the pairing working temperature of this consumed power this object to be measured is dispelled the heat as this object to be measured.
2. temperature detecting system according to claim 1, wherein, this heat-sink unit is a fan, and this control module system with in order to electrically connect with the storer that stores many operational factors, this operational factor system comprises the control rotating speed of fan and the resistance of object to be measured, and the control rotating speed of each fan is corresponding with default consumed power, to receive digital signal in control module after through being exported after this modular converter conversion, take out the initial resistance that generates the object to be measured of this digital signal from this storer, and this resistance and received digital signal carried out computing, to obtain the power that this object to be measured is consumed, make this control module obtain the fan control rotating speed corresponding from this storer, and then order about this fan and dispel the heat according to the fan control rotating speed of obtaining with it according to the consumed power of obtained object to be measured.
3. temperature detecting system according to claim 1, wherein, this electronic equipment is a server, be located in this server in this temperature detecting system system, and this control module is the baseboard management controller (BMC) of this server.
4. temperature detecting system according to claim 1, wherein, this electronic equipment is a computer, be located in this computer in this temperature detecting system system, and this control module is the central processing unit (CPU) of this computer.
5. temperature detecting method, in order to the object to be measured in the electronic equipment is carried out the detecting of working temperature, and this object to be measured is dispelled the heat detecting the heat-sink unit that orders about when working temperature is higher than a predetermined value in this electronic equipment, this method may further comprise the steps:
Detect the working current of this object to be measured;
The working current that is detected is converted to the digital signal that can supply this electronic equipment to read; And
Carry out the consumed power that computing obtains this object to be measured according to this digital signal, and with the working temperature of this consumed power, and order about this heat-sink unit with the pairing working temperature of this consumed power this object to be measured is dispelled the heat as this object to be measured.
6. temperature detecting method according to claim 5, wherein, this heat-sink unit is a fan, and this electronic equipment cording has in order to store the storer of many operational factors, this operational factor comprises the control rotating speed that refers to fan and the resistance value of object to be measured, and the control rotating speed of each fan is corresponding with default consumed power, with after receiving this digital signal, take out the initial resistance value that generates the object to be measured of this digital signal from this storer, and this resistance value and received digital signal carried out computing, to obtain the power that this object to be measured is consumed, and obtain the fan control rotating speed corresponding from this storer, and then order about this fan and dispel the heat according to the fan control rotating speed of obtaining with it according to the consumed power of obtained object to be measured.
7. temperature detecting method according to claim 5, wherein, this electronic equipment is a server, and by the baseboard management controller in this server (BMC) carry out aforementioned according to this digital signal carry out computing obtain this object to be measured consumed power step and order about the step that this heat-sink unit dispels the heat to this object to be measured.
8. temperature detecting method according to claim 5, wherein, this electronic equipment is a computer, and the central processing unit (CPU) by this computer carry out aforementioned according to this digital signal carry out computing obtain this object to be measured consumed power step and order about the step that this heat-sink unit dispels the heat to this object to be measured.
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| Application Number | Priority Date | Filing Date | Title |
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| CNB2006101427438A CN100541392C (en) | 2006-10-30 | 2006-10-30 | Temperature detecting system and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101427438A CN100541392C (en) | 2006-10-30 | 2006-10-30 | Temperature detecting system and method |
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| CN101174169A true CN101174169A (en) | 2008-05-07 |
| CN100541392C CN100541392C (en) | 2009-09-16 |
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| CNB2006101427438A Expired - Fee Related CN100541392C (en) | 2006-10-30 | 2006-10-30 | Temperature detecting system and method |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102110040A (en) * | 2011-01-27 | 2011-06-29 | 浪潮电子信息产业股份有限公司 | Method of BMC for adjusting CPU alarm temperature based on CPUs with different powers |
| CN102141942A (en) * | 2011-04-01 | 2011-08-03 | 奇智软件（北京）有限公司 | Method and device for monitoring and protecting equipment |
| CN102478934A (en) * | 2010-11-24 | 2012-05-30 | 英业达股份有限公司 | Radiating device and radiating method thereof |
| CN103092732A (en) * | 2013-01-23 | 2013-05-08 | 加弘科技咨询(上海)有限公司 | System used for dynamically monitoring device by scripts |
| CN103790846A (en) * | 2012-10-31 | 2014-05-14 | 英业达科技有限公司 | Fan rotating speed control method and device |
| CN104021256A (en) * | 2014-06-24 | 2014-09-03 | 浪潮电子信息产业股份有限公司 | Method for realizing heat radiation through current variation |
| CN106884808A (en) * | 2015-12-15 | 2017-06-23 | 昆达电脑科技(昆山)有限公司 | Frame fan control system and its method |
| WO2018033075A1 (en) * | 2016-08-18 | 2018-02-22 | Huawei Technologies Co., Ltd. | Proactive fan speed adjustment |
| CN109375744A (en) * | 2018-10-30 | 2019-02-22 | 郑州云海信息技术有限公司 | A kind of cooling control method of server video card |
| CN110703828A (en) * | 2019-09-25 | 2020-01-17 | 苏州浪潮智能科技有限公司 | BMC-based temperature detection method, system and device |
| CN112732053A (en) * | 2021-01-20 | 2021-04-30 | 山东云海国创云计算装备产业创新中心有限公司 | Server heat dissipation method, device, equipment and medium |
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2006
- 2006-10-30 CN CNB2006101427438A patent/CN100541392C/en not_active Expired - Fee Related
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102478934A (en) * | 2010-11-24 | 2012-05-30 | 英业达股份有限公司 | Radiating device and radiating method thereof |
| CN102478934B (en) * | 2010-11-24 | 2014-06-18 | 英业达股份有限公司 | Radiating device and radiating method thereof |
| CN102110040A (en) * | 2011-01-27 | 2011-06-29 | 浪潮电子信息产业股份有限公司 | Method of BMC for adjusting CPU alarm temperature based on CPUs with different powers |
| CN102141942A (en) * | 2011-04-01 | 2011-08-03 | 奇智软件（北京）有限公司 | Method and device for monitoring and protecting equipment |
| CN103790846A (en) * | 2012-10-31 | 2014-05-14 | 英业达科技有限公司 | Fan rotating speed control method and device |
| CN103790846B (en) * | 2012-10-31 | 2016-02-17 | 英业达科技有限公司 | Fan rotational frequency control method and device |
| CN103092732B (en) * | 2013-01-23 | 2016-08-17 | 加弘科技咨询(上海)有限公司 | Utilize the system of the dynamic monitoring device of script |
| CN103092732A (en) * | 2013-01-23 | 2013-05-08 | 加弘科技咨询(上海)有限公司 | System used for dynamically monitoring device by scripts |
| CN104021256A (en) * | 2014-06-24 | 2014-09-03 | 浪潮电子信息产业股份有限公司 | Method for realizing heat radiation through current variation |
| CN106884808A (en) * | 2015-12-15 | 2017-06-23 | 昆达电脑科技(昆山)有限公司 | Frame fan control system and its method |
| WO2018033075A1 (en) * | 2016-08-18 | 2018-02-22 | Huawei Technologies Co., Ltd. | Proactive fan speed adjustment |
| CN109375744A (en) * | 2018-10-30 | 2019-02-22 | 郑州云海信息技术有限公司 | A kind of cooling control method of server video card |
| CN110703828A (en) * | 2019-09-25 | 2020-01-17 | 苏州浪潮智能科技有限公司 | BMC-based temperature detection method, system and device |
| CN110703828B (en) * | 2019-09-25 | 2021-08-31 | 苏州浪潮智能科技有限公司 | BMC-based temperature detection method, system and device |
| CN112732053A (en) * | 2021-01-20 | 2021-04-30 | 山东云海国创云计算装备产业创新中心有限公司 | Server heat dissipation method, device, equipment and medium |
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| CN100541392C (en) | 2009-09-16 |
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Effective date of registration: 20141202 Address after: 200002 Nanjing East Road, Shanghai, No. 181, No. Patentee after: State Grid Shanghai Municipal Electric Power Company Patentee after: EAST CHINA POWER TRANSMISSION AND TRANSFORMATION ENGINEERING COMPANY Address before: Taipei City, Taiwan, China Patentee before: Inventec Corporation |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090916 Termination date: 20151030 |
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| EXPY | Termination of patent right or utility model |