CN115543042A

CN115543042A - Heat dissipation control method, controller, assembly, accelerator card and electronic equipment

Info

Publication number: CN115543042A
Application number: CN202211070221.7A
Authority: CN
Inventors: 胡浩
Original assignee: Shenzhen Zhixing Technology Co Ltd
Current assignee: Shenzhen Zhixing Technology Co Ltd
Priority date: 2022-09-01
Filing date: 2022-09-01
Publication date: 2022-12-30

Abstract

The application discloses a heat dissipation control method, a controller, a component, an accelerator card and an electronic device, wherein the heat dissipation control method comprises the following steps: acquiring the real-time temperature of an operation chip; determining a target rotating speed corresponding to the real-time temperature according to the real-time temperature and the temperature control parameter, wherein the temperature control parameter is pre-configured for the heat dissipation controller by a programmable controller and is used for representing the corresponding relation between the temperature and the rotating speed; the rotating speed of the fan is adjusted to the target rotating speed, wherein the fan is used for radiating heat of the operation chip, the rotating speed of the fan is automatically controlled by hardware, the problem that the temperature is uncontrollable due to the fact that software of a programmable controller is halted is avoided, the operation chip on the accelerator card can be protected from being damaged due to overheating during large-scale operation such as private data calculation, and the stability and the service life of the accelerator card are improved.

Description

Heat dissipation control method, controller, assembly, accelerator card and electronic equipment

Technical Field

The present application relates to the field of electronic circuit technologies, and in particular, to a heat dissipation control method, a controller, a component, an accelerator card, and an electronic device.

Background

In large-scale data operation, because the amount of private data is huge, the operation speed is often increased by installing an accelerator card for a server, especially in a private calculation scene, the private data is often encrypted and calculated due to protection of the private data, so that the operation amount or operation dimensionality is greatly increased, and especially, the accelerator card needs to be installed in the server to increase the operation efficiency. However, in order to achieve a high operation speed, the accelerator card generally uses a high-performance operation chip, and the power consumption during operation is very large, and thus the heat generation amount is also large.

In order to protect the operation chip from being damaged by overheating, the general method is as follows: the operation chip is provided with a radiator and a cooling fan, the ARM chip is used for adjusting the rotating speed of the cooling fan in real time according to the core temperature of the operation chip, and the ARM chip needs to continuously read the temperature in the whole adjusting process to adjust the rotating speed of the fan, so that the adjusting process is highly dependent on software built in the ARM chip. When the software built in the ARM chip crashes in the running process or the rotating speed of the fan cannot be adjusted after the ARM chip is damaged, the temperature of the operation chip cannot be controlled in real time, and the operation chip can be damaged due to too high temperature.

Disclosure of Invention

The application aims to provide a heat dissipation control method, a controller, a component, an accelerator card and electronic equipment, the rotating speed of a fan is automatically controlled by hardware, the problem that the temperature is uncontrollable due to software crash is avoided, an operation chip on the accelerator card can be better protected from being damaged due to overheating, and the stability and the service life of the accelerator card are improved.

In order to achieve the above purpose, the present application provides the following technical solutions:

a heat dissipation control method is applied to a heat dissipation controller and comprises the following steps:

acquiring the real-time temperature of an operation chip;

determining a target rotating speed corresponding to the real-time temperature according to the real-time temperature and the temperature control parameter, wherein the temperature control parameter is pre-configured for the heat dissipation controller by a programmable controller and is used for representing the corresponding relation between the temperature and the rotating speed;

and adjusting the rotating speed of a fan to the target rotating speed, wherein the fan is used for radiating heat for the operation chip.

Preferably, the temperature control parameter is a discrete parameter curve describing a one-to-one correspondence relationship between a plurality of temperature thresholds and a plurality of PWM duty cycles, wherein the PWM duty cycles are used for characterizing the rotation speed of the fan.

Further, the determining a target rotation speed corresponding to the real-time temperature according to the real-time temperature and the temperature control parameter includes:

searching a target temperature threshold which is smaller than the real-time temperature and has the minimum difference with the real-time temperature from the temperature thresholds in the discrete parameter curve;

determining a target PWM duty ratio corresponding to the searched target temperature threshold according to the corresponding relation;

the adjusting the rotation speed of the fan to the target rotation speed includes:

adjusting a PWM duty cycle that controls the fan speed to the target PWM duty cycle.

Preferably, the determining a target rotation speed corresponding to the real-time temperature according to the real-time temperature and the temperature control parameter includes:

comparing the real-time temperature with each temperature threshold value in the discrete parameter curve one by one from a minimum temperature threshold value, and acquiring process PWM duty ratios corresponding to the temperature threshold values smaller than the real-time temperature one by one until the real-time temperature is smaller than a next temperature threshold value, and recording the finally acquired process PWM duty ratios as target PWM duty ratios;

and adjusting the PWM duty ratio for controlling the rotating speed of the fan to the process PWM duty ratio until the process PWM duty ratio is the target PWM duty ratio, and then, not adjusting.

Preferably, after acquiring the real-time temperature of the operation chip and before determining the target rotation speed corresponding to the real-time temperature, the method further includes:

judging whether the real-time temperature is higher than a first preset temperature threshold value or not;

if the real-time temperature is higher than the first preset temperature threshold value, continuing to execute the step of determining the target rotating speed corresponding to the real-time temperature;

if the real-time temperature is not higher than the first preset temperature threshold, returning to the step of acquiring the real-time temperature of the operation chip;

the first preset temperature threshold is pre-configured by the programmable control unit for the heat dissipation control unit.

Preferably, the first preset temperature threshold is smaller than the minimum temperature threshold among the temperature thresholds in the discrete parameter curve.

Preferably, after obtaining the real-time temperature of the operation chip and before determining the target rotation speed corresponding to the real-time temperature, the method further includes:

judging whether the real-time temperature is higher than a second preset temperature threshold value or not;

if the real-time temperature is higher than the second preset temperature threshold, controlling a power supply unit to stop supplying power to the operation chip; the second preset temperature threshold is preset by the programmable controller for the heat dissipation controller;

and if the real-time temperature is not higher than the second preset temperature threshold, executing the step of determining the target rotating speed corresponding to the real-time temperature.

Preferably, the second preset temperature threshold is greater than the minimum temperature threshold among the temperature thresholds in the discrete parameter curve.

Preferably, after the controlling and supplying unit stops supplying power to the computing chip, the method further includes:

judging whether the acquired real-time temperature is lower than a third preset temperature threshold value or not;

when the real-time temperature is lower than a third preset temperature threshold value, controlling the power supply unit to supply power to the operation chip;

wherein the third preset temperature threshold is pre-configured for the heat dissipation controller by the programmable controller.

Preferably, the third preset temperature threshold is smaller than the second preset temperature threshold.

A heat dissipation controller, comprising:

the temperature acquisition module is configured to acquire the real-time temperature of the operation chip;

the determining module is configured to determine a target rotating speed corresponding to the real-time temperature according to the real-time temperature and a temperature control parameter, wherein the temperature control parameter is pre-configured for the heat dissipation controller by a programmable controller and is used for representing the corresponding relation between the temperature and the rotating speed;

the adjusting module is configured to adjust the rotating speed of a fan to the target rotating speed, wherein the fan is used for dissipating heat for the operation chip.

Preferably, the temperature control parameter is a discrete parameter curve for describing a one-to-one correspondence relationship between a plurality of temperature thresholds and a plurality of PWM duty cycles, wherein the PWM duty cycles are used for characterizing the rotation speed of the fan;

the determining module is specifically configured to search a target temperature threshold which is smaller than the real-time temperature and has the smallest difference with the real-time temperature from the temperature thresholds in the discrete parameter curve, and determine a target PWM duty ratio corresponding to the searched target temperature threshold according to the corresponding relationship;

the adjustment module is specifically configured to adjust a PWM duty cycle that controls the fan speed to the target PWM duty cycle.

Preferably, the determining module is further configured to:

after the real-time temperature of the operation chip is obtained and before the target rotating speed corresponding to the real-time temperature is determined, whether the real-time temperature is higher than a first preset temperature threshold value or not is judged, and when the real-time temperature is not higher than the first preset temperature threshold value, the step of obtaining the real-time temperature of the operation chip is returned.

Preferably, the heat dissipation controller further comprises a control module;

the determining module is further configured to, after the real-time temperature of the operation chip is obtained and before the target rotating speed corresponding to the real-time temperature is determined, determine whether the real-time temperature is higher than a second preset temperature threshold;

the control module is configured to control a power supply unit to stop supplying power to the operation chip when the real-time temperature is higher than the second preset temperature threshold;

the second preset temperature threshold is preset by the programmable controller for the heat dissipation controller.

Further, after the control power supply unit stops supplying power to the operation chip,

the determining module is further configured to determine whether the acquired real-time temperature is lower than a third preset temperature threshold;

the control module is further configured to control the power supply unit to supply power to the operation chip when the real-time temperature is lower than the third preset temperature threshold;

A heat radiation component comprises the heat radiation controller, and a programmable controller and a fan which are respectively connected with the heat radiation controller by signals, wherein,

the programmable controller is configured to send temperature control parameters to the heat dissipation controller;

the heat dissipation controller is configured to acquire the real-time temperature of the operation chip; determining a target rotating speed corresponding to the real-time temperature according to the real-time temperature and the temperature control parameter, wherein the temperature control parameter is pre-configured for the heat dissipation controller by a programmable controller and is used for representing the corresponding relation between the temperature and the rotating speed; adjusting the rotating speed of a fan to the target rotating speed, wherein the fan is used for radiating heat for the operation chip;

the fan is configured to operate according to the target rotational speed.

Preferably, the programmable controller with the heat dissipation controller is installed on same PCBA board, the fan passes through PCBA board with heat dissipation controller electric connection.

Preferably, the programmable controller and the heat dissipation controller are electrically connected through an SMBus.

Preferably, the programmable controller is based on a CPU, GPU, MCU or FPGA chip.

Preferably, the programmable controller and the operation chip are the same chip.

Preferably, the fan comprises a bladed fan or a bladeless fan.

A heat dissipation method is applied to the heat dissipation assembly and comprises the following steps:

the programmable controller sends temperature control parameters to the heat dissipation controller;

the heat dissipation controller acquires the real-time temperature of the operation chip; determining a target rotating speed corresponding to the real-time temperature according to the real-time temperature and the temperature control parameter; adjusting the rotating speed of a fan to the target rotating speed, wherein the temperature control parameter is pre-configured by a programmable controller for the heat dissipation controller and is used for representing the corresponding relation between the temperature and the rotating speed, and the fan is used for dissipating heat for the operation chip;

the fan operates according to the target rotation speed.

An accelerator card comprises the heat dissipation assembly.

An electronic device comprises the heat dissipation assembly or the accelerator card.

Preferably, the electronic device is a server or a kiosk supporting privacy computing.

Compared with the prior art, the fixing device for the pipe coiling device has the following beneficial effects:

according to the heat dissipation control method, the programmable controller is used for pre-configuring temperature control parameters for representing the corresponding relation between the temperature and the rotating speed for the heat dissipation controller, and then the programmable controller does not need to participate in the temperature control process, the rotating speed of the fan is automatically controlled by hardware, so that the problem of uncontrollable temperature caused by the crash of software of the programmable controller is solved; after the heat dissipation controller acquires the real-time temperature of the operation chip, the target rotating speed is determined according to the real-time temperature and the temperature control parameter, and then the rotating speed of the fan is adjusted to the target rotating speed to help the operation chip dissipate heat, so that the operation chip on the accelerator card can be protected from being damaged due to overheating, the stability of the accelerator card is improved, and the service life of the accelerator card is prolonged.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

fig. 1 is a schematic flow chart illustrating a heat dissipation control method according to an embodiment of the present application;

FIG. 2 is a graphical illustration of a discrete parameter curve of a temperature control parameter in an embodiment of the present application;

FIG. 3 is a schematic flow chart illustrating the process of determining a target rotation speed corresponding to a real-time temperature in an embodiment of the present application;

FIG. 4 is a schematic flow chart of a low-temperature energy-saving method in an embodiment of the present application;

FIG. 5 is a schematic flow chart illustrating a high temperature protection method according to an embodiment of the present application;

fig. 6 is a schematic block diagram of a heat dissipation controller according to an embodiment of the present disclosure;

fig. 7 is a schematic block diagram of a heat dissipation control assembly according to an embodiment of the present disclosure;

FIG. 8 is a schematic diagram of an exemplary heat dissipation control assembly according to an embodiment of the present disclosure;

FIG. 9 is a schematic diagram of another embodiment of a heat dissipation control assembly according to the present application;

FIG. 10 is a schematic structural diagram of an accelerator card according to an embodiment of the present application;

fig. 11 is a schematic view of an assembly structure of an accelerator card according to an embodiment of the present application.

The reference numbers illustrate:

10. an accelerator card; 11. a housing module; 1101. an airflow inlet; 1102. an airflow outlet; 111. a cover; 112. a mounting plate; 113. a base plate; 12. PCBA board; 13. a heat sink; 14. a fan.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying figures are described in detail below. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be implemented in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

Example one

Referring to fig. 1, the present embodiment provides a heat dissipation control method applied to a heat dissipation controller, the method including:

acquiring the real-time temperature of an operation chip;

determining a target rotating speed corresponding to the real-time temperature according to the real-time temperature and a temperature control parameter, wherein the temperature control parameter is preset for a heat dissipation controller by a programmable controller and is used for representing the corresponding relation between the temperature and the rotating speed;

and adjusting the rotating speed of the fan to a target rotating speed, wherein the fan is used for radiating heat for the operation chip.

In the heat dissipation control method provided by this embodiment, the programmable controller is used to pre-configure the temperature control parameters for representing the corresponding relationship between the temperature and the rotation speed for the heat dissipation controller, and then the programmable controller does not participate in the temperature control process, and the rotation speed of the fan is automatically controlled by hardware, so that the problem of uncontrollable temperature caused by the crash of software of the programmable controller is avoided; after the heat dissipation controller acquires the real-time temperature of the operation chip, the target rotating speed is determined according to the real-time temperature and the temperature control parameter, and then the rotating speed of the fan is adjusted to the target rotating speed to help the operation chip dissipate heat, so that the operation chip on the accelerator card can be protected from being damaged due to overheating, the stability of the accelerator card is improved, and the service life of the accelerator card is prolonged.

In a specific implementation, the temperature control parameter may be a discrete parameter curve describing a one-to-one correspondence of a plurality of temperature thresholds and a plurality of PWM duty cycles, wherein the PWM duty cycles are used to characterize the rotational speed of the fan. Those skilled in the art can understand that the temperature control parameter may also be a two-dimensional data structure such as a table for describing a one-to-one correspondence relationship between a plurality of temperature thresholds and a plurality of PWM duty ratios, which may facilitate the heat dissipation controller to rapidly adjust the fan speed based on the real-time temperature, so as to further protect the operation chip.

Referring to fig. 2, the temperature control parameter is 12 LUT parameters inside the heat dissipation controller configured by the programmable controller to the heat dissipation controller, each LUT includes a temperature threshold and a PWM duty of the fan, a temperature-fan speed parameter curve is formed by the parameters of the 12 LUTs, and when the core temperature of the operation chip exceeds the temperature threshold stored in the corresponding LUT, the fan controller automatically adjusts the PWM duty of the fan to the PWM duty stored in the current LUT. In the process, the programmable controller only needs to configure parameters for the heat dissipation controller, and does not need to participate in the temperature control process, the heat dissipation controller automatically completes temperature detection according to a discrete parameter curve configured by the programmable controller, and then adjusts the rotating speed of the heat dissipation fan according to the temperature, so that the operation chip is effectively protected, and the operation chip is prevented from being burnt out due to overheating.

On this basis, please participate in fig. 3, and determine the target rotation speed corresponding to the real-time temperature according to the real-time temperature and the temperature control parameter, which includes:

adjusting a rotational speed of a fan to a target rotational speed, comprising:

and adjusting the PWM duty ratio for controlling the rotating speed of the fan to the target PWM duty ratio.

In specific implementation, the target temperature threshold which is smaller than the real-time temperature and has the smallest difference with the real-time temperature is searched from the temperature thresholds in the discrete parameter curve, and the real-time temperature and each temperature threshold in the discrete parameter curve can be compared one by one from the minimum temperature threshold, and the process PWM duty ratio corresponding to each temperature threshold which is smaller than the real-time temperature is obtained one by one until the real-time temperature is smaller than the next temperature threshold, and the finally obtained process PWM duty ratio is recorded as the target PWM duty ratio; the real-time temperature and each temperature threshold in the discrete parameter curve may be compared one by one from the maximum temperature threshold until the real-time temperature is greater than the next temperature threshold, and the PWM duty corresponding to the next temperature threshold may be regarded as the target PWM duty.

In a specific implementation, the manner of adjusting the PWM duty cycle for controlling the fan speed to the target PWM duty cycle may be performed step by step, for example: comparing the real-time temperature with each temperature threshold value in the discrete parameter curve one by one from the minimum temperature threshold value, acquiring process PWM duty ratios corresponding to the temperature threshold values smaller than the real-time temperature one by one, adjusting the PWM duty ratios for controlling the rotating speed of the fan to the process PWM duty ratios until the real-time temperature is smaller than the next temperature threshold value, recording the finally acquired process PWM duty ratios as target PWM duty ratios, adjusting the PWM duty ratios for controlling the rotating speed of the fan to the target PWM duty ratios, and ending the adjusting process based on the real-time temperature; the skilled person can analogize that: when the temperature of the operation chip is reduced, the temperature thresholds can be compared one by one, and the rotating speed of the fan is gradually reduced. In the adjusting mode, the rotating speed of the fan is gradually adjusted according to the gradient, so that the fan can be prevented from frequently adjusting the speed of the fan in a large span, and the service life of the fan is prolonged.

When the operation chip is not called or the operation amount is small, the generated heat is small, no additional heat dissipation is needed, and in order to avoid excessive power consumption, please refer to the low-temperature energy-saving method flow shown in fig. 4, the heat dissipation control method provided in this embodiment further includes, after obtaining the real-time temperature of the operation chip, before determining the target rotation speed corresponding to the real-time temperature:

the first preset temperature threshold is preset by the programmable control unit for the heat dissipation control unit.

The first preset temperature threshold value is the highest temperature value of the operation chip without auxiliary heat dissipation of the fan, the programmable controller can be used as a heat dissipation controller to be configured in advance according to specific operating environments and other use scenes, the fan is controlled to be out of work when the real-time temperature of the operation chip is lower than the first preset temperature threshold value, namely all output electric signals for controlling the rotation of the fan are low level, electric energy is saved, and meanwhile the service life of the fan is prolonged.

In a specific implementation, the first preset temperature threshold is smaller than the minimum temperature threshold of the temperature thresholds in the discrete parameter curve.

When the operation chip is operated in a high-temperature environment or in a very large scale, the generated heat is very high, and the heat may not be effectively dissipated only by an external fan, so as to avoid damage to the operation chip, please refer to the high-temperature protection method flow shown in fig. 5, where the heat dissipation control method provided in this embodiment further includes, after obtaining the real-time temperature of the operation chip, before determining the target rotation speed corresponding to the real-time temperature:

if the real-time temperature is higher than a second preset temperature threshold value, controlling a power supply unit to stop supplying power to the operation chip; the second preset temperature threshold is preset by the programmable controller for the heat dissipation controller;

and if the real-time temperature is not higher than the second preset temperature threshold, executing a step of determining a target rotating speed corresponding to the real-time temperature.

The second preset temperature threshold is the lowest temperature value at which the operation chip cannot effectively assist in heat dissipation by means of a fan, the programmable controller can be used for being configured in advance for the heat dissipation controller according to specific operating environments and other use scenes, the second preset temperature threshold is a high-temperature early warning threshold which is used for outputting a turn-off signal, when the core temperature of the operation chip exceeds the threshold, the heat dissipation controller can output a low-level signal for turning off a core power supply of the operation chip, after the core power supply is turned off, other power supplies are sequentially turned off according to a power-on time sequence, and the operation chip stops working.

In a specific implementation, the second preset temperature threshold is greater than the maximum temperature threshold of the temperature thresholds in the discrete parameter curve. At this time, the heat dissipation controller may be further configured to output a PWM duty ratio for controlling the rotation of the fan to be 1, that is, all the output electrical signals for controlling the rotation of the fan are at a high level, and dissipate heat with the full speed as the operation chip.

Further, the heat dissipation control method provided in this embodiment, after controlling the power supply unit to stop supplying power to the operation chip, further includes:

when the real-time temperature is lower than a third preset temperature threshold value, controlling a power supply unit to supply power to the operation chip;

the third preset temperature threshold is preset by the programmable controller for the heat dissipation controller.

Namely, the programmable controller sets a third preset temperature threshold for canceling the shutdown signal to the heat dissipation controller, and when the core temperature of the operation chip is reduced below the third preset temperature threshold, the shutdown signal is cleared, the core power supply is powered on again, and other power supplies are sequentially powered on according to the power-on time sequence. The third preset temperature threshold is smaller than the second preset temperature threshold, the operation chip can normally work under the third preset temperature threshold, then the fan controller automatically completes temperature detection according to a discrete parameter curve configured by the programmable controller, and then the rotating speed of the cooling fan is adjusted according to the temperature, so that the operation chip on the accelerator card can be better protected from being damaged due to overheating, and the stability and the service life of the accelerator card are improved.

Through the above description of the embodiments, those skilled in the art can clearly understand that the method according to the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but the former is a better implementation mode in many cases. Based on such understanding, the technical solutions of the present invention may be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal device (such as a mobile phone, a computer, a server, or a network device) to execute the method according to the embodiments of the present invention.

Example two

Corresponding to the first embodiment, an embodiment of the present application further provides a heat dissipation controller, where in the present embodiment, the same or similar contents as those in the first embodiment may be referred to the above description, and are not repeated herein.

Referring to fig. 6, the heat dissipation controller provided in this embodiment includes:

the device comprises a determining module, a control module and a control module, wherein the determining module is configured to determine a target rotating speed corresponding to real-time temperature according to the real-time temperature and a temperature control parameter, and the temperature control parameter is pre-configured for a heat dissipation controller by a programmable controller and is used for representing the corresponding relation between the temperature and the rotating speed;

the adjusting module is configured to adjust the rotating speed of the fan to a target rotating speed, wherein the fan is used for dissipating heat for the operation chip.

By utilizing the heat dissipation controller provided by the embodiment, a control mode that software detects temperature and then adjusts the rotating speed of the fan is replaced by hardware automatic control, and by utilizing the heat dissipation controller, software in the programmable controller only needs to do parameter configuration work when a system (such as a server system provided with the heat dissipation controller) is started, and subsequent temperature control does not need software participation, so that the problems of software halt and uncontrollable temperature caused by the fault of the programmable controller are avoided, an operation chip can be better protected from being damaged due to overheating, and the stability and the service life of the operation chip are improved.

Preferably, the temperature control parameter is a discrete parameter curve for describing a one-to-one correspondence relationship between a plurality of temperature thresholds and a plurality of PWM duty cycles, wherein the PWM duty cycles are used for characterizing the rotation speed of the fan; on this basis, the determining module is specifically configured to search a target temperature threshold which is smaller than the real-time temperature and has the smallest difference with the real-time temperature from the temperature thresholds in the discrete parameter curve, and determine a target PWM duty ratio corresponding to the searched target temperature threshold according to the corresponding relationship; the adjustment module is specifically configured to adjust a PWM duty cycle that controls the fan speed to a target PWM duty cycle.

In a specific implementation, the temperature control parameter may be 12 LUT parameters shown in fig. 2 inside the heat dissipation controller configured by the programmable controller to the heat dissipation controller, each LUT includes a temperature threshold and a PWM duty of the fan, a temperature-fan speed parameter curve is formed by the parameters of the 12 LUTs, and when the core temperature of the operation chip exceeds the temperature threshold stored in the corresponding LUT, the fan controller automatically adjusts the PWM duty of the fan to the PWM duty stored in the current LUT. In the process, the programmable controller only needs to configure parameters for the heat dissipation controller, and does not need to participate in the temperature control process, the heat dissipation controller automatically completes temperature detection according to a discrete parameter curve configured by the programmable controller, and then adjusts the rotating speed of the heat dissipation fan according to the temperature, so that the operation chip is effectively protected, and the operation chip is prevented from being burnt out due to overheating.

In addition, when the operation chip is not called or the operation amount is small, the generated heat is little, no additional heat dissipation is needed, and in order to avoid excessive electric energy loss, the determination module is further configured to: after the real-time temperature of the operation chip is obtained, before the target rotating speed corresponding to the real-time temperature is determined, whether the real-time temperature is higher than a first preset temperature threshold value or not is judged, and when the real-time temperature is not higher than the first preset temperature threshold value, the step of obtaining the real-time temperature of the operation chip is returned. The first preset temperature threshold value is the highest temperature value of the operation chip without auxiliary heat dissipation of the fan, the programmable controller can be used as a heat dissipation controller to be configured in advance according to specific operating environments and other use scenes, the fan is controlled to be out of work when the real-time temperature of the operation chip is lower than the first preset temperature threshold value, namely all output electric signals for controlling the rotation of the fan are low level, electric energy is saved, and meanwhile the service life of the fan is prolonged. In a specific implementation, the first preset temperature threshold is smaller than the minimum temperature threshold of the temperature thresholds in the discrete parameter curve.

On the other hand, when the operation chip is operated in a high-temperature environment or in a super-large scale, the generated heat is very high, the heat can not be effectively dissipated only by an external fan, and in order to avoid the damage of the operation chip, the heat dissipation controller also comprises a control module; on the basis, the determining module is further configured to judge whether the real-time temperature is higher than a second preset temperature threshold value or not after the real-time temperature of the operation chip is obtained and before the target rotating speed corresponding to the real-time temperature is determined; the control module is configured to control the power supply unit to stop supplying power to the operation chip when the real-time temperature is higher than a second preset temperature threshold value; the second preset temperature threshold is preset by the programmable controller for the heat dissipation controller.

The second preset temperature threshold is the lowest temperature value at which the operation chip cannot effectively assist in heat dissipation by means of a fan, the programmable controller can be used for being configured in advance for the heat dissipation controller according to specific operating environments and other use scenes, the second preset temperature threshold is a high-temperature early warning threshold which is used for outputting a turn-off signal, when the core temperature of the operation chip exceeds the threshold, the heat dissipation controller can output a low-level signal for turning off a core power supply of the operation chip, after the core power supply is turned off, other power supplies are sequentially turned off according to a power-on time sequence, and the operation chip stops working. In a specific implementation, the second preset temperature threshold is greater than the maximum temperature threshold of the temperature thresholds in the discrete parameter curve. At this time, the heat dissipation controller may be further configured to output a PWM duty ratio of 1 for controlling the rotation of the fan, that is, all the output electrical signals for controlling the rotation of the fan are at a high level, and dissipate heat at full speed for the operation chip.

After the power supply unit is controlled to stop supplying power to the operation chip, the determining module is further configured to judge whether the acquired real-time temperature is lower than a third preset temperature threshold value; the control module is also configured to control the power supply unit to supply power to the operation chip when the real-time temperature is lower than a third preset temperature threshold; the third preset temperature threshold is preset by the programmable controller for the heat dissipation controller. Namely, the programmable controller sets a third preset temperature threshold for canceling the shutdown signal to the heat dissipation controller, and when the core temperature of the operation chip is reduced below the third preset temperature threshold, the shutdown signal is cleared, the core power supply is powered on again, and other power supplies are sequentially powered on according to the power-on time sequence. The third preset temperature threshold is smaller than the second preset temperature threshold, the operation chip can normally work under the third preset temperature threshold, then the fan controller automatically completes temperature detection according to a discrete parameter curve configured by the programmable controller, and then the rotating speed of the cooling fan is adjusted according to the temperature, so that the operation chip on the accelerator card can be better protected from being damaged due to overheating, and the stability and the service life of the accelerator card are improved.

EXAMPLE III

Corresponding to the first embodiment and the second embodiment, an embodiment of the present application further provides a heat dissipation assembly, where in the present embodiment, the same or corresponding contents as those in the first embodiment or the second embodiment refer to the above description, and are not repeated herein.

Referring to fig. 7, the present embodiment provides a heat dissipation assembly, which includes a heat dissipation control unit, and a programmable control unit and a fan respectively connected to the heat dissipation control unit via signals, wherein,

the programmable control unit is configured to send a temperature control parameter to the heat dissipation control unit, wherein the temperature control parameter is used for representing the corresponding relation between the temperature and the rotating speed of the fan;

the heat dissipation control unit is configured to receive the temperature control parameter and load the temperature control parameter into a memory; acquiring the real-time temperature of an operation chip, determining a target rotating speed corresponding to the real-time temperature according to the real-time temperature and a temperature control parameter, and generating a rotating speed control signal for controlling the fan to adjust to the target rotating speed;

the fan is configured to operate according to the rotating speed control signal to dissipate heat of the operation chip.

When a system (such as a server system provided with the heat dissipation assembly) is started, the programmable control unit configures temperature control parameters for the heat dissipation control unit, the programmable control unit does not participate in temperature detection and fan control any more after the configuration is finished, the heat dissipation control unit completely utilizes a hardware circuit to automatically detect the temperature and automatically control the rotating speed of the fan, the problem of uncontrollable temperature caused by software halt and programmable control unit failure is avoided, and an operation chip can be better protected from being damaged due to overheating.

In specific implementation, the programmable control unit and the heat dissipation control unit are installed on the same PCBA board, the programmable control unit and the heat dissipation control unit are electrically connected through SMBus (System Management Bus) to achieve low-cost implementation control capability, and the fan is electrically connected with the heat dissipation control unit through the PCBA board to receive an electric signal which is output by the heat dissipation control unit and used for controlling the rotating speed of the fan, and supplies power to the fan when the PCBA board is connected with a power supply.

In addition, the programmable control unit is based on a CPU, a GPU, an MCU or an FPGA chip, and any programmable chip can be selected according to a board card or equipment applied to the heat dissipation assembly in actual operation to realize the functions.

For example, referring to fig. 8, when the board card has an ARM chip and an FPGA chip for operation, the ARM chip can be used to implement the function of the programmable control unit, that is, the ARM chip is used to configure parameters for the heat dissipation control unit, and the ARM chip does not participate in the temperature control process, and the heat dissipation control unit automatically completes temperature detection of the FPGA chip, and adjusts the rotation speed of the heat dissipation fan according to the real-time temperature of the FPGA chip and the discrete parameter curve configured by the ARM.

On the other hand, the programmable control unit and the arithmetic chip may be the same chip. For example, referring to fig. 9, when the board card has only an FPGA chip for operation, the FPGA chip may also achieve the function of the programmable control unit, that is, the FPGA chip is used to configure parameters for the heat dissipation control unit, and the FPGA chip does not participate in the temperature control process, so that the heat dissipation control unit automatically completes temperature detection of the FPGA chip, and adjusts the rotation speed of the heat dissipation fan according to the real-time temperature of the FPGA chip and the discrete parameter curve configured by the FPGA.

In addition, the heat dissipation control unit is integrated with a temperature sensor, and the temperature controller can be fixedly connected with the operation chip in a heat dissipation silica gel mode and the like and is used for collecting the real-time temperature of the operation chip and storing the real-time temperature into a register inside the heat dissipation control unit. In another embodiment, when the temperature sensor module is integrated inside the operation chip, the temperature controller is integrated with an analog signal input terminal, and the analog signal input terminal is in signal connection with the temperature sensor module inside the operation chip to acquire the real-time temperature of the operation chip and store the real-time temperature in the register inside the heat dissipation control unit.

And then the heat dissipation control unit compares the real-time temperature with each temperature threshold of the discrete parameter curve by using an analog circuit comparator, or converts the real-time temperature into a digital voltage signal by using an analog-to-digital converter, and compares the real-time temperature with each temperature threshold of the discrete parameter curve by using a digital circuit comparator, so as to adjust the fan to the rotating speed which is most suitable for the current temperature.

In specific implementation, the fan comprises a blade fan or a bladeless fan, and the installation position driven by the fan can be adjusted according to a specific board/equipment structure, so that the fan can effectively drive airflow to take away heat on the operation chip in combination with a heat dissipation channel of the board/equipment, and the heat dissipation effect is improved. It can be understood by those skilled in the art that the fan may also directly cool the operation chip by directing the air outlet direction to the operation chip or directing to a heat sink equipped with the heat dissipation chip, and the specific installation manner is not specifically limited in this embodiment, but the protection scope of the present application is not limited thereto.

In a specific implementation, the temperature control parameter may be a discrete parameter curve describing a one-to-one correspondence relationship between a plurality of temperature thresholds and a plurality of PWM duty cycles, where the PWM duty cycles are used to represent a rotation speed of the fan, and the rotation speed control signal output by the heat dissipation control unit is a PWM signal. Those skilled in the art can understand that the temperature control parameter may also be a two-dimensional data structure such as a table for describing a one-to-one correspondence relationship between a plurality of temperature thresholds and a plurality of PWM duty ratios, which may facilitate the heat dissipation control unit to rapidly adjust the fan speed based on the real-time temperature to further protect the operation chip.

Referring to fig. 2, the temperature control parameter may be stored in an LUT in the memory of the heat dissipation control unit, where the LUT is a Look-Up-Table (Look-Up-Table), which is essentially a RAM, and after data is written into the RAM in advance, each time a signal is input, the input is equal to inputting an address to perform Table lookup, find out the content corresponding to the address, and then output the content. Correspondingly, the temperature control parameter can be 12 LUT parameters in the heat dissipation control unit configured by the programmable control unit to the heat dissipation control unit, each LUT comprises a temperature threshold and a PWM duty ratio of the fan, a temperature-fan rotating speed parameter curve is formed by the parameters of the 12 LUTs, and when the temperature of the inner core of the operation chip exceeds the temperature threshold stored in the corresponding LUT, the fan control unit automatically adjusts the PWM duty ratio of the fan to the PWM duty ratio stored in the current LUT. In the process, the programmable control unit only needs to configure parameters for the heat dissipation control unit and does not need to participate in the temperature control process, the heat dissipation control unit automatically completes temperature detection by using a hardware circuit according to a discrete parameter curve configured by the programmable control unit, and then adjusts the rotating speed of the heat dissipation fan according to the temperature, so that the operation chip is effectively protected, and the operation chip is prevented from being burnt out due to overheating.

Preferably, the heat dissipation control unit is internally provided with a comparison module, and the comparison module is respectively in signal connection with the register and the LUT in the memory to acquire the real-time temperature and the temperature control parameter of the operation chip. On this basis, the heat dissipation control unit is further configured to obtain, by using the comparison module, a target temperature threshold which is smaller than the real-time temperature and has a minimum difference with the real-time temperature among the temperature thresholds of the discrete parameter curve, and read a target PWM duty corresponding to the target temperature threshold.

In a specific implementation, the comparing module may be implemented by an integrated circuit, and may be implemented by both an analog comparator and a digital comparator, which is not limited in this embodiment, for example, implemented by a common LM339 voltage comparator or an LM 324. The mode that the comparison module searches and obtains a target temperature threshold which is smaller than the real-time temperature and has the minimum difference with the real-time temperature from the temperature thresholds in the discrete parameter curve can be used for comparing the real-time temperature with each temperature threshold in the discrete parameter curve one by one from the minimum temperature threshold, obtaining the process PWM duty ratio corresponding to each temperature threshold which is smaller than the real-time temperature one by one until the real-time temperature is smaller than the next temperature threshold, and marking the finally obtained process PWM duty ratio as the target PWM duty ratio; the real-time temperature and each temperature threshold in the discrete parameter curve may be compared one by one from the maximum temperature threshold until the real-time temperature is greater than the next temperature threshold, and the PWM duty corresponding to the next temperature threshold may be regarded as the target PWM duty.

When the operation chip is not called or the operation amount is small, the generated heat is small, extra heat dissipation is not needed, and in order to avoid excessive electric energy loss, the programmable control unit is also configured to send a first preset temperature threshold value to the heat dissipation control unit; correspondingly, the heat dissipation control unit is also configured to receive a first preset temperature threshold and load the first preset temperature threshold into the memory; and judging whether the real-time temperature is higher than a first preset temperature threshold value or not by using the comparison module, and generating a PWM (pulse width modulation) signal for controlling the fan to be turned off when the real-time temperature is lower than the first preset temperature threshold value.

The first preset temperature threshold value is the highest temperature value of the operation chip without auxiliary heat dissipation of the fan, the programmable control unit can be used as the heat dissipation control unit to be configured in advance according to specific operation environments and other use scenes, the fan is controlled to be out of work when the real-time temperature of the operation chip is lower than the first preset temperature threshold value, namely all output electric signals for controlling the rotation of the fan are low level, electric energy is saved, and meanwhile the service life of the fan is prolonged.

When the operation chip is operated in a high-temperature environment or in a super-large scale, the generated heat is very high, the heat can not be effectively dissipated only by an external fan, and in order to avoid damage to the operation chip, the heat dissipation assembly further comprises a power supply unit which is used for supplying power to the programmable control unit, the heat dissipation control unit and the operation chip; the programmable control unit is further configured to send a second preset temperature threshold to the heat dissipation control unit, the heat dissipation control unit is further configured to receive the second preset temperature threshold and load the second preset temperature threshold into the memory, the comparison module is used for judging whether the real-time temperature is higher than the second preset temperature threshold, and the power supply unit is controlled to stop supplying power to the operation chip when the real-time temperature is higher than the second preset temperature threshold.

The second preset temperature threshold is the lowest temperature value at which the operation chip cannot effectively assist in heat dissipation by means of a fan, the programmable control unit can be used as a heat dissipation control unit to be configured in advance according to specific operating environments and other use scenes, the high-temperature early warning threshold is a high-temperature early warning threshold which outputs a turn-off signal, when the core temperature of the operation chip exceeds the threshold, the heat dissipation control unit outputs a low-level signal to turn off a core power supply of the operation chip, after the core power supply is turned off, other power supplies are sequentially turned off according to a power-on time sequence, and the operation chip stops working.

In a specific implementation, the second preset temperature threshold is greater than the maximum temperature threshold of the temperature thresholds in the discrete parameter curve. At this time, the heat dissipation control unit may be further configured to output a PWM duty ratio of 1 for controlling the rotation of the fan, that is, all the output electrical signals for controlling the rotation of the fan are at a high level, and dissipate heat at full speed for the operation chip.

Further, the programmable control unit is further configured to preset a third temperature threshold to the heat dissipation control unit; the heat dissipation control unit is also configured to receive a second preset temperature threshold and load the second preset temperature threshold into the memory; and after the power supply unit is controlled to stop supplying power to the operation chip, the comparison module is used for judging whether the real-time temperature is lower than a third preset temperature threshold value or not, and the power supply unit is controlled to supply power to the operation chip again when the real-time temperature is lower than the third preset temperature threshold value.

Namely, the programmable control unit sets a third preset temperature threshold value for canceling the power supply shutdown signal to the heat dissipation control unit, when the core temperature of the operation chip is reduced below the third preset temperature threshold value, the shutdown signal is cleared, the core power supply is powered on again, and other power supplies are sequentially powered on according to the power-on time sequence. The third preset temperature threshold is smaller than the second preset temperature threshold, the operation chip can normally work under the third preset temperature threshold, then the fan control unit automatically completes temperature detection according to a discrete parameter curve configured by the programmable control unit, and then the rotating speed of the cooling fan is adjusted according to the temperature, so that the operation chip on the accelerator card can be better protected from being damaged due to overheating, and the stability and the service life of the accelerator card are improved.

From the above description of the embodiments, those skilled in the art can clearly understand that the method according to the above embodiments can be implemented by means of a general hardware platform, for example, the heat dissipation control unit in the present embodiment can be implemented based on the digital temperature sensor and control IC of LM96063-LLP10 or other LM96063 series. Based on such understanding, the technical solutions of the present invention may be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal device (such as a mobile phone, a computer, a server, or a network device) to execute the method according to the embodiments of the present invention.

Example four

Corresponding to the first embodiment, the second embodiment and the third embodiment, embodiments of the present application further provide a heat dissipation method, wherein in this embodiment, the same or corresponding contents as those in the first embodiment are referred to the above description, and are not repeated.

A heat dissipation method applied to the heat dissipation assembly of the three embodiments includes:

the heat dissipation controller acquires the real-time temperature of the operation chip; determining a target rotating speed corresponding to the real-time temperature according to the real-time temperature and the temperature control parameter; adjusting the rotating speed of the fan to a target rotating speed, wherein the temperature control parameter is pre-configured for the heat dissipation controller by the programmable controller and is used for representing the corresponding relation between the temperature and the rotating speed, and the fan is used for dissipating heat for the operation chip;

the fan is operated according to the target rotation speed.

The temperature control parameter is a discrete parameter curve used for describing a one-to-one correspondence relationship between a plurality of temperature thresholds and a plurality of PWM duty ratios, wherein the PWM duty ratios are used for representing the rotating speed of the fan.

The heat dissipation controller determines a target rotating speed corresponding to the real-time temperature according to the real-time temperature and the temperature control parameter, and the method comprises the following steps:

the heat dissipation controller adjusts the rotation speed of the fan to a target rotation speed, and comprises:

The heat dissipation controller determines a target rotating speed corresponding to the real-time temperature according to the real-time temperature and the temperature control parameter, and can also adopt the following mode:

comparing the real-time temperature with each temperature threshold value in the discrete parameter curve one by one from the minimum temperature threshold value, and acquiring process PWM duty ratios corresponding to the temperature threshold values smaller than the real-time temperature one by one until the real-time temperature is smaller than the next temperature threshold value, wherein the finally acquired process PWM duty ratios are recorded as target PWM duty ratios;

and adjusting the PWM duty ratio for controlling the rotating speed of the fan to the process PWM duty ratio until the process PWM duty ratio is the target PWM duty ratio, and then not adjusting.

After the heat dissipation controller obtains the real-time temperature of the operation chip and before the target rotating speed corresponding to the real-time temperature is determined, the following steps can be further executed:

and if the real-time temperature is not higher than the first preset temperature threshold value, returning to the step of acquiring the real-time temperature of the operation chip.

After the heat dissipation controller obtains the real-time temperature of the operation chip and before the target rotating speed corresponding to the real-time temperature is determined, the following steps can be executed:

Further, after the heat dissipation controller controls the power supply unit to stop supplying power to the operation chip, the following steps may be further performed:

According to the heat dissipation method, software in the programmable controller only needs to perform parameter configuration work when the system is started, subsequent temperature control does not need software participation, the heat dissipation controller is utilized to realize that the rotating speed of the fan is automatically controlled by hardware, the problem that temperature cannot be controlled due to software crash and programmable controller failure is avoided, the operation chip can be better protected from being damaged due to overheating, and therefore the stability and the service life of the board card and the equipment are improved.

EXAMPLE five

Corresponding to the above embodiments, an accelerator card is further provided in the embodiments of the present application, wherein in the present embodiment, the same or corresponding contents as those in the above embodiments refer to the above description, and are not repeated herein.

Referring to fig. 10 to 11, an accelerator card according to the present embodiment includes the above heat dissipation assembly. The accelerator card 10 can be applied to scenes such as privacy computation and the like which need large-scale operation, and the accelerator card 10 comprises the heat dissipation component, the PCBA board 12 and a shell module 11 for accommodating the heat dissipation component and the PCBA board 12. The programmable controller and the heat dissipation controller of the heat dissipation assembly are mounted on the PCBA board, and the programmable controller and the heat dissipation controller are electrically connected through an SMBus (System Management Bus) to realize low-cost implementation control capability, and the fan 14 is electrically connected with the heat dissipation controller through the PCBA board to receive an electric signal output by the heat dissipation controller and used for controlling the rotation speed of the fan, and supplies power to the fan 14 when the PCBA board is connected with a power supply.

In addition, a heat dissipation airflow channel is arranged in the accelerator card, the heat dissipation airflow channel passes through the surface of the operation chip or an external radiator of the operation chip, and the installation position of the fan is adjusted and fixed based on the heat dissipation airflow channel, so that the fan drives airflow to take away heat on the operation chip through the heat dissipation airflow channel.

In one embodiment, the housing module 11 includes a cover 111, a bracket plate 112 and a bottom plate 113, and the cover 111 is connected to the bracket plate 112 and the bottom plate 113 respectively, and enclosed by the cover 111 and the bracket plate 112 to form a receiving cavity, the housing module 11 is provided with an airflow inlet 1101 and an airflow outlet 1102; the PCBA 12 is arranged on the surface of the support plate 112, which is opposite to the accommodating cavity, and part of the PCBA 12 is embedded in the support plate 112 and exposed in the accommodating cavity; the PCBA board 12 is provided with a heat sink 13 used in cooperation with the PCBA board 12, the heat sink 13 is accommodated in the accommodating cavity and connected with the support plate 112 for dissipating heat of the PCBA board 12, more specifically, the heat sink and the operation chip mounted on the PCBA board 12 are fixed by means of high thermal conductivity silica gel or the like for dissipating heat of the operation chip; the fan 14 of the heat dissipation assembly is accommodated in the accommodating cavity and connected with the support plate 112, so as to drive the airflow outside the accommodating cavity to flow into the accommodating cavity from the airflow inlet 1101, perform heat exchange with the heat sink 13 and flow out from the airflow outlet 1102, thereby effectively improving the heat exchange efficiency between the airflow and the heat sink 13, quickly taking away the heat generated by the PCBA board 12, especially the heat generated by the operation chip, reducing the accumulation of heat in the accelerator card, and finally effectively improving the heat dissipation effect of the accelerator card.

On the other hand, when the system (for example, a server system provided with the accelerator card) is started, the programmable controller configures temperature control parameters for the heat dissipation controller, the programmable controller does not participate in temperature detection and fan control any more after the configuration is completed, the heat dissipation controller automatically detects the temperature and automatically controls the rotating speed of the fan, the problem that the temperature is not controllable due to software crash and programmable controller failure is avoided, and the operation chip can be better protected from being damaged due to overheating.

EXAMPLE six

Corresponding to the above embodiments, embodiments of the present application further provide an electronic device, where in this embodiment, the same or corresponding contents as those in the above embodiments are referred to with the above description, and are not repeated herein.

An electronic device comprises the heat dissipation assembly or the accelerator card, and particularly, the electronic device can be a server or a machine supporting privacy calculation. In some embodiments, the electronic device may include two or more accelerator cards provided in the fifth embodiment, where multiple accelerator cards are mounted side by side in corresponding portions of the electronic device, and a space is provided between two adjacent accelerator cards to facilitate air circulation and heat dissipation.

It will be apparent to those skilled in the art that portions of the present disclosure may be implemented in hardware, software, firmware, or a combination thereof. In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples. The modules or steps of the invention described above may be implemented in a general purpose computing device, they may be centralized on a single computing device or distributed across a network of multiple computing devices, and they may alternatively be implemented in program code executable by a computing device, such that they may be stored in a memory device and executed by a computing device, and in some cases, the steps shown or described may be performed in an order different than that described herein, or they may be separately fabricated into individual integrated circuit modules, or multiple ones of them may be fabricated into a single integrated circuit module. Thus, the present invention is not limited to any specific combination of hardware and software.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A heat dissipation control method is applied to a heat dissipation controller and comprises the following steps:

acquiring the real-time temperature of an operation chip;

2. The method of claim 1, wherein the temperature control parameter is a discrete parameter curve describing a one-to-one correspondence of a plurality of temperature thresholds and a plurality of PWM duty cycles, wherein the PWM duty cycles are used to characterize a rotational speed of the fan.

3. The method of claim 2, wherein said determining a target speed corresponding to said real-time temperature based on said real-time temperature and temperature control parameters comprises:

4. The method according to any one of claims 1 to 3, wherein after acquiring the real-time temperature of the operation chip and before determining the target rotation speed corresponding to the real-time temperature, the method further comprises:

5. The method according to any one of claims 1 to 3, wherein after acquiring the real-time temperature of the operation chip and before determining the target rotation speed corresponding to the real-time temperature, the method further comprises:

if the real-time temperature is higher than the second preset temperature threshold value, controlling a power supply unit to stop supplying power to the operation chip; the second preset temperature threshold is preset by the programmable controller for the heat dissipation controller;

6. The method of claim 5, wherein after the controlling the power supply unit stops supplying power to the computing chip, the method further comprises:

7. A heat dissipation controller, comprising:

8. The thermal dissipation controller of claim 7, wherein the temperature control parameter is a discrete parameter curve describing a one-to-one correspondence of a plurality of temperature thresholds and a plurality of PWM duty cycles, wherein the PWM duty cycles are used to characterize a rotational speed of the fan;

9. The heat dissipation controller of claim 7 or 8, wherein the determination module is further configured to:

10. The heat dissipation controller of claim 7 or 8, further comprising a control module;

the determining module is further configured to, after the real-time temperature of the computing chip is obtained and before the target rotating speed corresponding to the real-time temperature is determined, determine whether the real-time temperature is higher than a second preset temperature threshold;

wherein the second preset temperature threshold is pre-configured for the heat dissipation controller by the programmable controller.

11. The heat dissipation controller of claim 10, wherein after the control power supply unit stops supplying power to the computing chip,

12. A heat dissipation assembly, comprising the heat dissipation controller of any one of claims 7 to 11, and a programmable controller and a fan in signal connection with the heat dissipation controller, respectively,

the fan is configured to operate according to the target rotational speed.

13. The heat sink assembly of claim 12, wherein the programmable controller and the heat sink controller are mounted on a same PCBA board, the fan being electrically connected to the heat sink controller through the PCBA board.

14. The heat dissipation assembly of claim 12, wherein the programmable controller and the heat dissipation controller are electrically connected via an SMBus.

15. The heat removal assembly of any of claims 12-14, wherein the programmable controller is based on a CPU, GPU, MCU or FPGA chip.

16. The heat dissipating assembly of any of claims 12-14, wherein the programmable controller and the computing chip are the same chip.

17. The heat removal assembly of any of claims 12-14, wherein the fan comprises a bladed fan or a bladeless fan.

18. A heat dissipating method applied to the heat dissipating module according to any one of claims 12 to 17, comprising:

the fan operates according to the target rotation speed.

19. An accelerator card comprising a heat sink assembly as claimed in any one of claims 12 to 17.

20. An electronic device comprising the heat dissipating assembly of any of claims 12 to 17 or comprising the accelerator card of claim 19.

21. The electronic device of claim 20, wherein the electronic device is a server or kiosk that supports privacy computing.