CN116878703A - MSG pressure sensor and assembly method - Google Patents
MSG pressure sensor and assembly method Download PDFInfo
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- CN116878703A CN116878703A CN202311139446.8A CN202311139446A CN116878703A CN 116878703 A CN116878703 A CN 116878703A CN 202311139446 A CN202311139446 A CN 202311139446A CN 116878703 A CN116878703 A CN 116878703A
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- 238000000034 method Methods 0.000 title claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 41
- 239000002184 metal Substances 0.000 claims abstract description 41
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 29
- 239000010703 silicon Substances 0.000 claims abstract description 29
- 230000001681 protective effect Effects 0.000 claims abstract description 26
- 230000008054 signal transmission Effects 0.000 claims abstract description 9
- 239000003292 glue Substances 0.000 claims description 30
- 229910000831 Steel Inorganic materials 0.000 claims description 8
- 238000002955 isolation Methods 0.000 claims description 8
- 239000010959 steel Substances 0.000 claims description 8
- 239000000565 sealant Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 229910000861 Mg alloy Inorganic materials 0.000 claims description 3
- 230000003993 interaction Effects 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims 1
- 238000012545 processing Methods 0.000 abstract description 13
- 238000007789 sealing Methods 0.000 description 14
- 230000035882 stress Effects 0.000 description 14
- 239000000919 ceramic Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000010705 motor oil Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/04—Metal casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/141—Monolithic housings, e.g. molded or one-piece housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/04—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of resistance-strain gauges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
- H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The application relates to the technical field of pressure sensors and discloses an MSG pressure sensor and an assembly method, wherein the MSG pressure sensor comprises a shell, a sensitive core, a circuit board, a protective cover and a plug connector, wherein a medium channel and a mounting cavity which are communicated are formed in the shell; the sensitive core body is arranged in the medium channel; the top of the sensitive core body is provided with a sensitive film, and the top surface of the sensitive film is provided with a silicon strain gauge; the circuit board is fixed in the mounting cavity, and the silicon strain gauge is electrically connected with the circuit board through a wire; the protective cover is fixed on the top surface of the circuit board and covers the silicon strain gauge; the plug connector is electrically connected with the circuit board through the signal transmission part; according to the application, the sensitive core body made of the hard metal is arranged in the shell made of the soft metal, so that the sensitive core body of the MSG pressure sensor can be unified, and when the MSG pressure sensor is different in size due to different fields, the shell is made of the soft metal, so that the processing is convenient, and the processing difficulty and the processing cost of the MSG pressure sensors with different sizes can be reduced.
Description
Technical Field
The application relates to the technical field of pressure sensors, in particular to an MSG pressure sensor and an assembling method.
Background
MSG pressure sensors employing micro-fused silicon gauge (MSG) technology have been widely used in various fields such as vehicle braking systems, vehicle stability control systems, fuel pressure monitoring systems, and transmission systems. MSG pressure sensors typically include a silicon strain gauge element glass bonded to a metal diaphragm of a pressure port body and forming a sensing element, wherein the silicon strain gauge forms a wheatstone bridge whose node voltage signal changes as the metal diaphragm deforms after the wheatstone bridge is powered up, depending on the characteristics of the silicon strain gauge that have a reduced piezoresistive value and an increased tensile resistance value. The signal is then calibrated to a linear output proportional to the pressure exerted on the metal diaphragm.
Ceramic pressure sensors are also used in the automotive applications described above. However, ceramic pressure sensors have low accuracy, and in order to achieve sealing, O-rings are assembled in the conventional ceramic pressure sensors to seal, and as the service time of the ceramic pressure sensors increases, there are problems of aging of the rings and leakage of products. Ceramic pressure sensors are currently being replaced with MSG pressure sensors.
The structure of the existing MSG pressure sensor is shown in fig. 1, the sensitive core body serves as a part of shell structure, and the sensitive core body is directly arranged on a medium pipeline to be measured during application. The following disadvantages exist in production and use:
firstly, in the production process, due to different product application requirements, the required threaded interfaces of the MSG pressure sensor have various forms, for example, an air conditioner pipeline, an engine oil pipeline, a gearbox oil pipeline and the like all have specific interface size requirements, and if the existing MSG pressure sensor changes the size, an elastomer processing cutter, a silicon strain gauge sintering clamp and the like matched with the existing MSG pressure sensor need to be redesigned and processed, so that the input cost is high;
secondly, the existing MSG pressure sensor is generally integrally connected through hard metal when in use, and a sensitive core of the MSG pressure sensor is in direct contact with the outside when in actual use, so that the problem of assembly stress conduction exists;
in addition, the special steel used by the existing MSG pressure sensor has higher price and processing cost, and the cost requirement of a terminal customer on the MSG pressure sensor is not met; in addition, the existing MSG pressure sensor has only a meter-shaped structure and no pressure-insulating structure.
Disclosure of Invention
In view of the shortcomings of the background technology, the application provides an MSG pressure sensor and an assembling method, wherein the MSG pressure sensor adopts a structure that a sensitive core body and a shell are separated, and the sensitive core body and the shell are made of different materials, so that the sensitive core body can be unified, the mass production is convenient, and the product cost is reduced. In addition, the MSG pressure sensor can effectively isolate the installation stress, so that the product performance is more stable.
In order to solve the technical problems, in a first aspect, the application provides an MSG pressure sensor, which comprises a housing, wherein a medium channel and a mounting cavity which are communicated are sequentially formed in the housing from bottom to top, a mounting thread is arranged at the bottom of the housing, and the housing is made of soft metal; the HRC of the soft metal is less than 20;
the sensitive core body is arranged at one end of the medium channel, which is communicated with the mounting cavity, and is partially positioned in the mounting cavity, a sensitive film is arranged at the top of the sensitive core body, at least one silicon strain gauge is arranged on the top surface of the sensitive film, and the sensitive core body is made of hard metal; the HRC of the hard metal is more than or equal to 20;
the circuit board is fixed in the mounting cavity and positioned above the sensitive core body, and the silicon strain gauge is electrically connected with the circuit board through a wire;
the protective cover is positioned right above the sensitive core body and covers the silicon strain gauge, and is fixed on the top surface of the circuit board;
the plug connector is electrically connected with the signal transmission end of the circuit board through the signal transmission piece, is used for carrying out signal interaction with the circuit board, is installed in the installation cavity and is located above the circuit board.
In a certain implementation manner of the first aspect, at least one protruding portion is provided on a side wall of the medium channel, where the sensitive core is mounted.
In a certain implementation manner of the first aspect, a sealant layer is disposed above the circuit board in the mounting cavity, and the height of the sealant layer is lower than that of the protective cover.
In a certain implementation manner of the first aspect, an air hole is formed at the top of the protective cover.
In a certain implementation manner of the first aspect, a positioning groove is formed in the side wall of the mounting cavity along the vertical direction, and a positioning block protruding out of the side wall of the circuit board and matched with the positioning groove is arranged on the circuit board and is located in the positioning groove.
In a certain implementation manner of the first aspect, the mounting cavity comprises a first cavity, a second cavity and a third cavity which are sequentially communicated from bottom to top and are sequentially widened, a part of the sensitive core is located in the first cavity, a glue groove is formed in the bottom of the second cavity, a glue layer for fixing the circuit board is arranged in the glue groove, and the plug connector is mounted in the third cavity.
In a certain implementation manner of the first aspect, a stress isolation groove is formed in the periphery of the sensitive core at the bottom of the first cavity.
In a second aspect, the application also provides an assembling method of the MSG pressure sensor, the pressure sensor comprises a shell made of soft metal, a sensitive core made of hard metal, a circuit board, a protective cover and a plug connector, wherein the HRC of the soft metal is smaller than 20, and the HRC of the hard metal is larger than or equal to 20; the inside of the shell is provided with a medium channel and a mounting cavity which are communicated from bottom to top, the mounting cavity comprises a first cavity, a second cavity and a third cavity which are communicated from bottom to top in sequence and are widened in sequence, and the bottom of the second cavity is provided with a glue groove; the top of the sensitive core body is provided with a sensitive film, and the sensitive film is provided with at least one silicon strain gauge;
the method comprises the following steps:
s1: fixing the lower end of the sensitive core body at the upper end of the medium channel by cold press riveting technology;
s2: injecting glue into the glue groove, and fixing the circuit board at the bottom of the second cavity through the glue;
s3: a protective cover for covering the silicon strain gauge is adhered to the top surface of the circuit board;
s4: the signal transmission end of the circuit is electrically connected with the plug connector through a wire, and the plug connector is installed in the third cavity.
In certain embodiments of the second aspect, the soft metal is aluminum, copper, magnesium alloy, or aluminum alloy, and the hard metal is steel.
In an embodiment of the second aspect, after the protective cover is adhered to the top surface of the circuit board in S3, the top surface area of the circuit board is filled with glue in the vacuum box to form a sealant layer.
Compared with the prior art, the application has the following beneficial effects:
firstly, a sensitive core body made of hard metal is arranged in a shell made of soft metal, so that the sensitive core body can be unified for the MSG pressure sensor, and when the MSG pressure sensor is different in size due to different fields, the shell is made of soft metal, so that the processing is convenient, and the processing difficulty and the processing cost of the MSG pressure sensor with different sizes can be reduced;
secondly, stress can be isolated by arranging a shell made of soft metal and arranging a stress isolation groove on the shell, so that the product performance of the application is ensured to be more stable;
in addition, the top surface of the circuit board is provided with the protective cover, and whether the top of the protective cover is provided with air holes or not can determine whether the circuit board is a gauge pressure type product or a pressure insulation type product; moreover, the whole structure has no sealing ring, and the problems of ageing of the sealing ring and leakage caused by bad compliance are avoided;
finally, the riveting reliability of the sensitive core body and the shell can be effectively improved by arranging the protruding part on the outer arm of the sensitive core body.
Drawings
FIG. 1 is a schematic diagram of a conventional MSG pressure sensor;
FIG. 2 is an internal cross-sectional view of a pressure-insulated pressure sensor in an embodiment;
FIG. 3 is an exploded view of a pressure sensor of the pressure-insulating type in the example;
FIG. 4 is an internal cross-sectional view of a gauge pressure sensor in an embodiment;
FIG. 5 is an exploded view of a gauge pressure sensor in an embodiment;
FIG. 6 is a schematic view of the structure of the positioning slot and the positioning block in the embodiment;
FIG. 7 is a schematic view of the structure of the glue groove on the housing in the embodiment;
fig. 8 is a cross-sectional view of a third pressure sensor in an embodiment.
Detailed Description
Illustrative embodiments of the application include, but are not limited to, a silicon strain gauge and method of assembly.
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the application. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this disclosure, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items. The word "comprising" or "comprises", and the like, means that elements or items appearing before "comprising" or "comprising" are encompassed by the element or item recited after "comprising" or "comprising" and equivalents thereof, and that other elements or items are not excluded. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. It should be understood that although the terms first, second, third, etc. may be used herein to describe various information, these information should not be limited by these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the application. The term "if" as used herein may be interpreted as "at..once" or "when..once" or "in response to a determination", depending on the context.
Example 1
As shown in fig. 2 and 3, an MSG pressure sensor includes
The shell 1 is made of soft metal, and a medium channel 10 and a mounting cavity 11 which are communicated are sequentially formed in the shell 1 from bottom to top; the bottom of the shell 1 is provided with mounting threads;
the sensitive core body 2 is made of hard metal, is arranged at one end of the medium channel 10, which is communicated with the mounting cavity 11, and is partially positioned in the mounting cavity 11; referring to fig. 7, a sensitive film is arranged on the top of the sensitive core 2, and a silicon strain gauge 7 is arranged on the top surface of the sensitive film; the number of the silicon strain gauges 7 can be set according to actual requirements, and is not limited herein;
the circuit board 3 is fixed in the mounting cavity 11 and is positioned above the sensitive core body 2, and the silicon strain gauge 7 is electrically connected with the circuit board 3 through a wire;
a protective cover 4 fixed to the top surface of the circuit board 3 and covering the silicon strain gauge 7;
the plug-in component 6 is electrically connected with the signal transmission end 30 of the circuit board 3 through the signal transmission component 5 and is used for carrying out signal interaction with the circuit board 3, is installed in the installation cavity 11 and is positioned above the circuit board 3.
Aiming at the application fields of different MSG pressure sensors, the MSG pressure sensor adopts the unified sensitive core body 2, and only the mounting threads of the shell body 1 are different, so that the unified processing and the large-scale production of the sensitive core body 2 can be realized, and the production cost can be greatly reduced. In addition, the shell 1 is made of soft metal, so that the shell 1 is not as difficult to process as the shell with the integral steel structure of the existing MSG pressure sensor, and only the mounting threads are changed in different application fields, so that the processing difficulty and the processing cost of the MSG pressure sensor can be reduced.
In addition, as shown in fig. 8, in order to isolate stress, a stress isolation groove 14 is formed at the periphery of the sensitive core 2 at the bottom of the first cavity 111. For the MSG pressure sensor of the present application, since the sensitive core 2 is fixed to the housing 1 by cold press riveting technique. The housing 1 is provided with a stress isolation structure, namely a stress isolation groove 14, so as to ensure the performance of the MSG pressure sensor of the present application.
Specifically, in this embodiment, the soft metal is aluminum, copper, magnesium alloy or aluminum alloy, and the hard metal is steel. Wherein the sensitive core 2 is fixed to the medium channel 10 by cold-press riveting technique, thereby forming a unitary structure. The connection surface of the sensitive core body 2 and the medium channel 10 is used as a cold pressing place, and for the MSG pressure sensor, because the MSG pressure sensor is in direct contact with the outside and is a soft metal shell body such as aluminum, copper and the like, the stress caused by the torque of a spanner can be partially counteracted at the cold pressing place during the assembly of the MSG pressure sensor, and the stress isolation structure arranged on the aluminum or copper shell body can completely isolate the outside stress, so that the detection precision of the MSG pressure sensor is ensured.
In addition, in this embodiment, in order to ensure the riveting reliability of the sensitive core 2 and the housing 1, at least one protruding portion is provided on the side wall of the medium channel 10 where the sensitive core 2 is mounted, that is, a plurality of teeth are provided on the side wall of the medium channel 10 where the sensitive core 2 is mounted, and when cold-pressing riveting is performed, the protruding portion, that is, the teeth can be embedded into the inner side wall of the medium channel 10, so as to ensure the riveting reliability. Through practical tests, the MSG pressure sensor can bear 50MPa and above pressure, and can replace the existing MSG pressure sensor with an integral steel structure.
For the MSG pressure sensor in this embodiment, it is a pressure-insulation type MSG pressure sensor, so the circuit board 3 and the protective cover 4 are also used for realizing the sealing of the space above the silicon strain gauge 7, and in order to further improve the sealing performance of the present application, a sealing glue layer is disposed above the circuit board 3 in the mounting cavity 11, and the height of the sealing glue layer is lower than that of the protective cover 4. In actual use, the sealing between the circuit board 3 and the housing 1 can be further realized by the sealing glue layer, and the sealing of the connection surface of the protective cover 4 and the circuit board 3 can be realized.
In this embodiment, the specific mounting manner of the circuit board 3 and the connector 6 is as follows: referring to fig. 2 and 7, the mounting cavity 11 includes a first cavity 111, a second cavity 112 and a third cavity 113 which are sequentially communicated from bottom to top and are sequentially widened, a portion of the sensitive core 2 is located in the first cavity 111, a glue groove 13 is formed in the bottom of the second cavity 112, a glue layer for fixing a circuit board is arranged in the glue groove 13, and the plug connector 6 is mounted in the third cavity 113.
In addition, in this embodiment, in order to facilitate the worker to install the circuit board 3 in the second cavity 112, referring to fig. 6, a positioning slot 12 is further formed on a side wall of the second cavity 112, and a positioning block protruding from the side wall of the circuit board 3 and matching with the positioning slot 12 is disposed on the circuit board 3, and is located in the positioning slot 12. It should be noted that, although no reference numerals are given to the positioning blocks in fig. 6, the positioning blocks may be known from the protruding portions in the positioning grooves 12.
In summary, in the MSG pressure sensor in this embodiment, firstly, the sensitive core 2 made of hard metal is installed in the shell 1 made of soft metal, so that the sensitive core 2 can be unified for the MSG pressure sensor, when the MSG pressure sensor has different sizes due to different fields, the shell 1 is made of soft metal, so that the processing difficulty and the processing cost of the MSG pressure sensor with different sizes can be reduced;
in addition, the shell 1 made of soft metal is arranged, and the stress isolation structure is arranged on the shell 1, so that stress can be isolated, and the product performance of the application is ensured to be more stable; moreover, the whole device has no sealing ring, so that the problem of leakage caused by ageing or inaccurate assembly of the sealing ring is avoided;
finally, the riveting reliability of the sensitive core body 2 and the shell body 1 can be effectively improved by arranging the protruding parts on the outer arms of the sensitive core body 2.
Example two
Unlike the MSG pressure sensor in the first embodiment, the MSG pressure sensor provided in this embodiment is a gauge pressure type pressure sensor, that is, the silicon strain gauge 7 of the sensitive core 2 communicates with the atmospheric pressure. In order to achieve the communication between the silicon strain gauge 7 and the atmospheric pressure, as shown in fig. 4 and 5, the top of the protective cover 4 is provided with an air hole 40, and in addition, since there is no need to form a sealing space above the silicon strain gauge 7, the MSG pressure sensor in this embodiment may not form a sealing glue layer on the top surface of the circuit board 3.
Example III
The embodiment provides an assembling method of an MSG pressure sensor, wherein the pressure sensor comprises a shell 1 made of soft metal, a sensitive core 2 made of hard metal, a circuit board 3, a protective cover 4 and a plug connector 6; the inside of the shell 1 is provided with a medium channel 10 and a mounting cavity 11 which are communicated from bottom to top, the mounting cavity 11 comprises a first cavity 111, a second cavity 112 and a third cavity 113 which are communicated from bottom to top in sequence and are widened in sequence, and the bottom of the second cavity 112 is provided with a glue groove 13; the top of the sensitive core body 2 is provided with a sensitive film, and the sensitive film is provided with a silicon strain gauge 7; the method comprises the following steps:
s1: the lower end of the sensitive core body 2 is fixed at the upper end of the medium channel 10 by cold press riveting technology;
s2: glue is injected into the glue groove 13, and then the circuit board 3 is fixed at the bottom of the second cavity 112 through the glue;
s3: a protective cover 4 which is adhered to the top surface of the circuit board 3 and covers the silicon strain gauge;
s4: the signal transmitting end 30 of the circuit board 3 is electrically connected to the connector 6 by a wire, and the connector 6 is mounted in the third cavity 113.
Specifically, in this embodiment, the soft metal material is aluminum or copper, and the hard metal material is steel.
In this embodiment, if the MSG pressure sensor manufactured by the method of the present application is a pressure-insulated MSG pressure sensor, after the protective cover 4 is adhered to the circuit board 3 in step S3, the top surface of the circuit board 3 is subjected to glue filling to form a sealant layer, and in addition, the glue filling needs to be performed in a vacuum box, so that vacuum can be formed under the protective cover 4.
In addition, in this embodiment, in order to ensure the riveting reliability of the sensitive core 2 and the medium channel 10, at least one protruding portion is provided on the side wall of the sensitive core 2 mounted on the medium channel 10, that is, a plurality of teeth are provided on the side wall of the sensitive core 2 mounted on the medium channel 10, and when cold-pressing riveting is performed, the protruding portion, that is, the teeth can be embedded into the inner side wall of the medium channel 10, so as to ensure the riveting reliability. Through practical tests, the MSG pressure sensor can bear 50MPa and above pressure, and can replace the existing MSG pressure sensor with an integral steel structure.
In addition, if the MSG pressure sensor manufactured by the method of the present application is a gauge pressure type MSG pressure sensor, a protective cover having an air hole at the top is adhered to the top surface of the circuit board 3 in step S3.
The present application has been made in view of the above-described circumstances, and it is an object of the present application to provide a portable electronic device capable of performing various changes and modifications without departing from the scope of the technical spirit of the present application. The technical scope of the present application is not limited to the description.
Claims (8)
1. An MSG pressure sensor, comprising
The shell is internally provided with a medium channel and a mounting cavity which are communicated in sequence from bottom to top, the bottom of the shell is provided with mounting threads, the shell is made of soft metal, and the HRC of the soft metal is smaller than 20;
the sensitive core body is arranged at one end of the medium channel, which is communicated with the mounting cavity, and is partially positioned in the mounting cavity, a sensitive film is arranged at the top of the sensitive core body, at least one silicon strain gauge is arranged on the top surface of the sensitive film, the sensitive core body is made of hard metal, and the HRC of the hard metal is more than or equal to 20;
the circuit board is fixed in the mounting cavity and positioned above the sensitive core body, and the silicon strain gauge is electrically connected with the circuit board through a wire;
the protective cover is positioned right above the sensitive core body and covers the silicon strain gauge, and is fixed on the top surface of the circuit board;
the plug-in component is electrically connected with the signal transmission end of the circuit board through the signal transmission component, is used for carrying out signal interaction with the circuit board, is arranged in the mounting cavity and is positioned above the circuit board;
the mounting cavity comprises a first cavity, a second cavity and a third cavity which are sequentially communicated from bottom to top and are sequentially widened, a part of the sensitive core body is positioned in the first cavity, a glue groove is formed in the bottom of the second cavity, a glue layer for fixing a circuit board is arranged in the glue groove, and the plug connector is mounted in the third cavity; the bottom of the first cavity is provided with a stress isolation groove at the periphery of the sensitive core.
2. An MSG pressure sensor as claimed in claim 1, wherein the soft metal is aluminium, copper, magnesium alloy or aluminium alloy; the hard metal is steel.
3. An MSG pressure sensor as claimed in claim 1 or 2, characterized in that the sensitive core is provided with at least one projection on the side wall of the medium channel.
4. The MSG pressure sensor of claim 1 wherein a sealant layer is disposed within the mounting cavity above the circuit board, the sealant layer having a height that is less than a height of the protective cover.
5. The MSG pressure sensor of claim 1 wherein the top of the protective cover is vented.
6. The MSG pressure sensor of claim 1 wherein the side wall of the mounting cavity is provided with a positioning slot along a vertical direction, the circuit board is provided with a positioning block protruding from the side wall of the circuit board and matched with the positioning slot, and the positioning block is located in the positioning slot.
7. An assembling method of an MSG pressure sensor, which is used for assembling the MSG pressure sensor according to any one of claims 1-6, characterized in that the pressure sensor comprises a soft metal shell, a hard metal sensitive core, a circuit board, a protective cover and a plug-in connector; the inside of the shell is sequentially provided with a medium channel and a mounting cavity which are communicated from bottom to top, the mounting cavity comprises a first cavity, a second cavity and a third cavity which are sequentially communicated from bottom to top and are sequentially widened, and the bottom of the second cavity is provided with a glue groove; the top of the sensitive core body is provided with a sensitive film, and the sensitive film is provided with at least one silicon strain gauge;
the method comprises the following steps:
s1: fixing the lower end of the sensitive core body at the upper end of the medium channel by cold press riveting technology;
s2: injecting glue into the glue groove, and fixing the circuit board at the bottom of the second cavity through the glue;
s3: a protective cover for covering the silicon strain gauge is adhered to the top surface of the circuit board;
s4: the signal transmission end of the circuit board is electrically connected with the plug connector through a wire, and the plug connector is installed in the third cavity.
8. The method of assembling an MSG pressure sensor of claim 7 wherein after the protective cover is bonded to the top surface of the circuit board in S3, the top surface area of the circuit board is filled with glue in a vacuum box to form a sealant layer.
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| US20030184982A1 (en) * | 2002-03-29 | 2003-10-02 | Kenji Chikuan | Pressure sensor and method for manufacturing the same |
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| CN116878703B (en) | 2023-12-19 |
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