CN116873508B - Automatic feeding mechanism based on silicon wafer cleaning - Google Patents
Automatic feeding mechanism based on silicon wafer cleaning Download PDFInfo
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- CN116873508B CN116873508B CN202311084274.9A CN202311084274A CN116873508B CN 116873508 B CN116873508 B CN 116873508B CN 202311084274 A CN202311084274 A CN 202311084274A CN 116873508 B CN116873508 B CN 116873508B
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- lifting
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 130
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 121
- 239000010703 silicon Substances 0.000 title claims abstract description 121
- 238000004140 cleaning Methods 0.000 title claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 120
- 230000000903 blocking effect Effects 0.000 claims abstract description 44
- 235000012431 wafers Nutrition 0.000 claims description 109
- 230000001681 protective effect Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/02—Devices for feeding articles or materials to conveyors
- B65G47/04—Devices for feeding articles or materials to conveyors for feeding articles
- B65G47/12—Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles
- B65G47/14—Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles arranging or orientating the articles by mechanical or pneumatic means during feeding
- B65G47/1407—Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles arranging or orientating the articles by mechanical or pneumatic means during feeding the articles being fed from a container, e.g. a bowl
- B65G47/1442—Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles arranging or orientating the articles by mechanical or pneumatic means during feeding the articles being fed from a container, e.g. a bowl by means of movement of the bottom or a part of the wall of the container
- B65G47/145—Jigging or reciprocating movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of silicon wafer feeding equipment, in particular to an automatic feeding mechanism based on silicon wafer cleaning, which comprises a bottom plate and a support frame fixedly arranged on the bottom plate, wherein a lifting plate capable of moving up and down is arranged on the support frame, a driving mechanism for driving the lifting plate is arranged on the support frame, and a supporting plate for placing a material basket is fixedly arranged on the lifting plate; the lifting plate is provided with a fixing mechanism for fixing the basket, and the fixing mechanism can move back and forth on the lifting plate; the material basket is provided with a blocking mechanism for blocking the silicon wafer, and a lug for pushing up the blocking mechanism is fixedly arranged on one side of the lifting plate, which is close to the material basket. After the material basket is separated from the feeding mechanism, the silicon wafer is always placed in the material basket under the action of the stop mechanism, so that the silicon wafer can not fall out of the material basket when the material basket filled with the silicon wafer is carried or in the subsequent cleaning process, and the protection treatment of the silicon wafer in the material basket is realized.
Description
Technical Field
The invention relates to the technical field of silicon wafer feeding equipment, in particular to an automatic feeding mechanism based on silicon wafer cleaning.
Background
In semiconductor manufacturing, cleaning of a silicon wafer is a very important step. Silicon wafers are subject to various contaminants including dust, grease, metal ions, etc. during the fabrication process, which can seriously affect the performance of the silicon wafer, and therefore cleaning the silicon wafer is a key step to ensure its performance. However, before cleaning the silicon wafer, a plurality of silicon wafers need to be loaded into a material basket so as to realize centralized cleaning of the silicon wafers, so that the efficiency of a cleaning procedure is improved, and the existing silicon wafer feeding mode is specifically as follows:
the Chinese patent document with publication number of CN216835956U discloses a basket adjusting device and a silicon wafer collecting system, and specifically discloses: the lifting mechanism is used for driving the material basket accommodating mechanism to lift so as to drive the material basket in the material basket accommodating mechanism to lift; the material basket jacking and translating mechanism is arranged on the material basket accommodating mechanism and is used for jacking the material basket in the material basket accommodating mechanism upwards and driving the material basket to translate. Through being provided with basket jacking translation mechanism, basket adjusting device can drive the basket translation in the horizontal direction to make each silicon chip in the basket hold the chamber realize with silicon chip conveying mechanism's automatic butt joint, finally promoted receipts piece efficiency.
As can be seen from the above, a pair of silicon wafer accommodating cavities are arranged in the material basket on the existing silicon wafer collecting system, after the material basket is put on the material basket accommodating mechanism, the lifting mechanism is operated to drive the material basket accommodating mechanism to lift so as to drive the material basket to lift, and the silicon wafer can be continuously and automatically collected into the silicon wafer accommodating cavities of the material basket under the cooperation of the silicon wafer conveying mechanism; when another silicon wafer accommodating cavity is required to be aligned with the silicon wafer conveying mechanism, the material basket lifting and translating mechanism is operated to drive the material basket to translate so as to align the other silicon wafer accommodating cavity on the material basket with the silicon wafer conveying mechanism, and finally, the lifting mechanism is operated again so as to drive the material basket to lift. However, after each silicon wafer accommodating cavity in the material basket is fully filled with silicon wafers, the material basket needs to be carried to a station of a subsequent cleaning procedure so as to carry out cleaning treatment on the silicon wafers, however, in the process of carrying the material basket filled with the silicon wafers, when the material basket is deviated, the silicon wafers can fall out from the material basket, and in the subsequent cleaning process, the silicon wafers can also fall out from the material basket, and the silicon wafers in the material basket are not further protected, so that the carrying efficiency and the subsequent cleaning efficiency are affected. Therefore, an automatic feeding mechanism based on silicon wafer cleaning is provided to solve the technical problems.
Disclosure of Invention
The invention aims to provide an automatic feeding mechanism based on silicon wafer cleaning aiming at the defects of the prior art, so as to solve the technical problems that the silicon wafers in a basket are not protected.
In order to achieve the above purpose, the technical scheme of the invention is as follows:
an automatic feeding mechanism based on silicon wafer cleaning comprises a bottom plate and a supporting frame fixedly arranged on the bottom plate, wherein a lifting plate capable of moving up and down is arranged on the supporting frame, a driving mechanism for driving the lifting plate is arranged on the supporting frame, and a supporting plate for placing a material basket is fixedly arranged on the lifting plate;
a pair of fixing plates are arranged on the bottom plate, a conveying part for conveying the silicon wafers is arranged between the fixing plates, a baffle plate for limiting the silicon wafers is fixedly arranged on the fixing plates, and a pushing mechanism for pushing the silicon wafers on the conveying part into the material basket is arranged on the baffle plate;
the lifting plate is provided with a fixing mechanism for fixing the basket, and the fixing mechanism can move back and forth on the lifting plate; a blocking mechanism for blocking the silicon wafer is arranged on the material basket, and a lug for pushing up the blocking mechanism is fixedly arranged on one side of the lifting plate, which is close to the material basket;
the pushing mechanism comprises a supporting plate fixedly arranged on the baffle plate, a guide rod is fixedly arranged on the supporting plate through a fixed block, the guide rod is horizontally arranged and axially perpendicular to the conveying direction of the silicon wafer, a movable plate is slidably arranged on the guide rod, a connecting rod is fixedly arranged on one side, close to the material basket, of the movable plate, and a pushing plate for pushing the silicon wafer on the conveying part into the material basket is arranged on the end part of the connecting rod; the support plate is also provided with a driving motor, and the output shaft of the driving motor is provided with a first screw rod which is in threaded connection with the movable plate.
Further, the material basket comprises a pair of backboards arranged up and down and a plurality of basket rods arranged between the backboards, and the basket body for loading silicon wafers is formed by surrounding the pair of backboards and the plurality of basket rods.
Further, the fixing mechanism comprises a moving plate arranged on the lifting plate, the moving plate is arranged on one side of the lifting plate far away from the material basket, and an electric push rod for pushing the moving plate to move is arranged between the lifting plate and the moving plate; a support rod is fixedly arranged on the movable plate, the support rod is horizontally arranged and axially consistent with the conveying direction of the silicon wafers, a pair of clamping rods which are distributed left and right are slidably arranged on the support rod, and the end parts of the clamping rods penetrate through the lifting plate and are respectively arranged at the left side and the right side of the backboard; the ends of the clamping rods distributed left and right are provided with inserting rods, the inserting rods are arranged on one side of the clamping rods, which is close to the backboard, and the left side and the right side of the backboard are provided with inserting holes for inserting the inserting rods; the movable plate is provided with power components for driving the clamping rods distributed left and right to approach or separate from each other.
Further, the power part comprises a double-shaft motor arranged on the moving plate, and second screw rods are respectively arranged on output shafts at two sides of the double-shaft motor and are respectively in threaded connection with different clamping rods.
Further, the material blocking mechanism comprises a pair of rotating shafts respectively arranged on different basketball boards, rotating blocks are fixedly arranged on each rotating shaft, and material blocking rods for blocking silicon wafers are fixedly arranged between the rotating blocks; the upper backboard is fixedly provided with a guide block at the top, a sliding rod used for contacting with the convex block is slidingly arranged on the guide block, and a rack meshed with the first gear is arranged at the end part of the sliding rod close to the first gear; a spring for resetting is arranged between the slide bar and the guide block.
Further, a protective shell for covering the slide bar is also arranged on the backboard.
Further, the lifting rods are fixedly arranged on the left side and the right side of the lifting plate, the lifting rods are slidably arranged on the supporting frame, sliding grooves which are arranged along the length direction of the lifting rods are formed in the side edges of the lifting rods, and limiting blocks which are arranged in the sliding grooves are fixedly arranged at the bottom end of the supporting frame.
Further, the driving mechanism comprises a rack arranged on the lifting rod, the rack is vertically arranged and arranged on one side of the lifting rod away from the lifting plate, the support frame is provided with a stepping motor through a mounting frame, and a second gear is arranged above an output shaft of the stepping motor and penetrates through the support frame to be meshed with the rack.
The invention has the beneficial effects that: when the silicon wafer lifting device is used, firstly, a basket to be filled with silicon wafers is placed on a supporting plate, and then, a fixing mechanism is operated, so that the basket is fixed, and the basket cannot deviate in the descending process; after the material basket is fixed, the fixing mechanism moves backwards on the lifting plate, so that the material basket is driven to move towards the direction close to the lifting plate, the material blocking mechanism is contacted with the convex blocks, and the convex blocks jack the material blocking mechanism so as to realize automatic opening of the material blocking mechanism; then, the conveying component is operated, after the silicon wafer is conveyed to a designated position, the pushing mechanism is operated, the silicon wafer at the designated position is pushed into the material basket, the pushing mechanism is operated to reset, the driving mechanism drives the lifting plate to move downwards for a certain distance, meanwhile, the lifting plate moves downwards together with the material basket, and the moving distance is consistent with the thickness of the silicon wafer; after the material basket descends once, the conveying component is operated again to convey the next silicon wafer to the appointed position for loading, and automatic loading of the silicon wafer is achieved through the reciprocating mode.
After the silicon wafer is fully filled in the material basket, the fixing mechanism moves forward to reset, the material basket is driven to move in the direction away from the lifting plate, so that the blocking mechanism is separated from the convex blocks, the blocking mechanism automatically closes and resets after the blocking mechanism is separated from the convex blocks the silicon wafer in the material basket, the lifting plate is driven by the driving mechanism to move upwards to an initial position, and finally, the fixing mechanism is operated again to stop fixing the material basket, so that the material basket filled with the silicon wafer can be carried to the next cleaning procedure.
After the material basket is separated from the feeding mechanism, the silicon wafer is always placed in the material basket under the action of the stop mechanism, so that the silicon wafer can not fall out of the material basket when the material basket filled with the silicon wafer is carried or in the subsequent cleaning process, and the protection treatment of the silicon wafer in the material basket is realized.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a schematic perspective view of another view of the present invention.
Fig. 3 is a schematic structural diagram of the pushing mechanism of the present invention.
Fig. 4 is a schematic structural view of the fixing mechanism of the present invention.
Fig. 5 is a schematic view of another view structure of the fixing mechanism of the present invention.
FIG. 6 is a schematic view of a dam mechanism according to the present invention.
Fig. 7 is a schematic structural view of the driving mechanism of the present invention.
Fig. 8 is a schematic view of a part of the structure of the driving mechanism of the present invention.
The reference numerals include:
1. a bottom plate; 2. a mounting plate; 3. a support frame; 301. a limiting block; 4. a lifting plate; 401. a lifting rod; 402. a chute; 5. a supporting plate; 6. a basket; 601. a backboard; 602. a basket rod; 7. a fixing plate; 8. a conveying member; 9. a baffle; 10. a pushing mechanism; 1001. a support plate; 1002. a guide rod; 1003. a fixed block; 1004. a movable plate; 1005. a connecting rod; 1006. a push plate; 1007. a driving motor; 1008. a first screw rod; 11. a fixing mechanism; 1101. a moving plate; 1102. an electric push rod; 1103. a support rod; 1104. a clamping rod; 1105. a rod; 1106. a jack; 1107. a biaxial motor; 1108. a second screw rod; 12. a material blocking mechanism; 1201. a rotation shaft; 1202. a rotating block; 1203. a material blocking rod; 1204. a first gear; 1205. a guide block; 1206. a slide bar; 1207. a rack; 1208. a spring; 1209. a protective shell; 1210. a bump; 13. a driving mechanism; 1301. a rack; 1302. a stepping motor; 1303. a mounting frame; 1304. and a second gear.
Detailed Description
The following describes in detail an automatic feeding mechanism based on silicon wafer cleaning with reference to the accompanying drawings.
As shown in fig. 1-2, an embodiment of an automatic feeding mechanism based on silicon wafer cleaning of the invention comprises a bottom plate 1 for supporting and a supporting frame 3 fixedly arranged on the bottom plate 1, wherein the supporting frame 3 and the bottom plate 1 are fixedly arranged through a mounting plate 2, and the bottom plate 1 can be fixedly arranged on designated equipment through bolts so as to arrange the whole feeding mechanism at a corresponding station of a production line. The lifting plate 4 capable of lifting is arranged on the supporting frame 3, however, in order to drive the lifting plate 4 to move up and down on the supporting frame 3, a driving mechanism 13 for driving the lifting plate 4 is also arranged on the supporting frame 3, and under the action of the driving mechanism 13, the lifting plate 4 can automatically move up and down on the supporting frame 3; secondly, a supporting plate 5 for placing the material basket 6 is fixedly arranged on the lifting plate 4, after the material basket 6 to be filled with silicon wafers is placed on the supporting plate 5, the driving mechanism 13 is started, so that the lifting plate 4 is driven to move up and down on the supporting frame 3, and the material basket 6 is carried to move up and down together under the action of the supporting plate 5. Further, a pair of fixing plates 7 are further arranged on the bottom plate 1, a conveying component 8 for conveying silicon wafers is arranged between the fixing plates 7, a baffle 9 for limiting the silicon wafers is fixedly arranged on the fixing plates 7, so that the silicon wafers are prevented from separating from the original conveying track in the process of conveying the silicon wafers by the conveying component 8, and the silicon wafers are conveyed to a designated position for loading treatment under the action of the conveying component 8; however, in order to load the silicon wafer at the designated position into the basket 6, a pushing mechanism 10 for pushing the silicon wafer on the conveying component 8 into the basket 6 is arranged on the baffle 9, and the automatic feeding is realized under the cooperation of the pushing mechanism 10, the conveying component 8 and the driving mechanism 13; specifically, after the basket 6 to be filled with the silicon wafer is placed on the supporting plate 5, the conveying component 8 is operated so as to transport the silicon wafer to a designated position, after the silicon wafer is positioned at the designated position, the conveying component 8 stops operating, then the pushing mechanism 10 is operated again, the silicon wafer positioned at the designated position is pushed into the basket 6, the pushing mechanism 10 is operated again to reset, the driving mechanism 13 drives the lifting plate 4 to move downwards for a certain distance, and simultaneously the basket 6 is carried to move downwards together, and the moving distance is consistent with the thickness of the silicon wafer; after the basket 6 descends once, the conveying part 8 is operated again to convey the next silicon wafer to the appointed position for loading, and the automatic loading of the silicon wafer is realized by reciprocating.
In addition, in order to prevent the lifting plate 4 from shifting during the process of carrying the basket 6 to descend, a fixing mechanism 11 for fixing the basket 6 is arranged on the lifting plate 4, and after the basket 6 is placed on the supporting plate 5, the fixing mechanism 11 is operated to fix the basket 6 so that the basket 6 cannot shift during the descending process; and the material basket 6 can be automatically aligned to the pushing mechanism 10 under the action of the fixing mechanism 11, so that the pushing mechanism 10 can accurately push the silicon wafers on the conveying component 8 into the material basket 6. Secondly, after the material basket 6 is filled with silicon chips, in order to realize protecting the silicon chips in the material basket 6, a stop mechanism 12 for blocking the silicon chips is arranged on the material basket 6, so that the silicon chips are always placed in the material basket 6 under the action of the stop mechanism 12 after the material basket 6 is separated from the feeding mechanism, and the silicon chips cannot fall out from the material basket 6 in the process of carrying the material basket 6 filled with the silicon chips or in the subsequent cleaning process. In order to realize the automatic operation of the material blocking mechanism 12, the fixing mechanism 11 can move back and forth on the lifting plate 4, after the material basket 6 is fixed, the fixing mechanism 11 moves back on the lifting plate 4, then the material basket 6 is driven to move towards the direction close to the lifting plate 4, wherein a lug 1210 for pushing up the material blocking mechanism 12 is fixedly arranged on one side of the lifting plate 4 close to the material basket 6, when the fixing mechanism 11 drives the material basket 6 to move towards the direction close to the lifting plate 4, the material basket 6 contacts with the lug 1210 with the material blocking mechanism 12, so that the material blocking mechanism 12 is pushed up, the material blocking mechanism 12 is automatically opened, and after the material blocking mechanism is opened, silicon wafers on the conveying part 8 can be pushed into the material basket 6 under the action of the pushing mechanism 10; after the material basket 6 is filled with silicon chips, the fixing mechanism 11 moves forwards to reset, and then the material basket 6 is driven to move towards the direction far away from the lifting plate 4, so that the blocking mechanism 12 is separated from the protruding block 1210, the blocking mechanism 12 automatically closes and resets after the separation so as to block the silicon chips in the material basket 6, then the driving mechanism 13 drives the lifting plate 4 to move upwards to an initial position, and finally the fixing mechanism 11 is operated to stop fixing the material basket 6, so that the material basket 6 filled with the silicon chips can be carried to the next cleaning procedure.
As shown in fig. 3, the pushing mechanism 10 comprises a supporting plate 1001 fixedly arranged on a baffle plate 9, a guide rod 1002 is fixedly arranged on the supporting plate 1001 through a fixed block 1003, the guide rod 1002 is horizontally arranged and axially perpendicular to the conveying direction of silicon wafers, a movable plate 1004 is slidably arranged on the guide rod 1002, a connecting rod 1005 is fixedly arranged on one side of the movable plate 1004 close to the basket 6, a pushing plate 1006 for pushing the silicon wafers on the conveying part 8 into the basket 6 is arranged on the end portion of the connecting rod 1005, after the conveying part 8 conveys the silicon wafers to a designated position, the conveying part 8 stops running, then the movable plate 1004 applies force, the movable plate 1004 slides on the guide rod 1002 towards the direction close to the basket 6, the silicon wafers on the conveying part 8 are pushed into the basket 6 under the action of the pushing plate 1006, and finally the movable plate 1004 slides towards the direction far away from the basket 6 for resetting. In addition, in order to automatically push the silicon wafer on the conveying component 8 into the basket 6, a driving motor 1007 is further arranged on the supporting plate 1001, a first screw rod 1008 is arranged on an output shaft of the driving motor 1007, and the first screw rod 1008 is in threaded connection with the movable plate 1004; when the driving motor 1007 drives the first screw 1008 to rotate forward and backward, the movable plate 1004 can be driven to slide on the guide rod 1002 towards the direction close to or far away from the basket 6, so as to automatically push the silicon wafer on the conveying component 8 into the basket 6, and then reset.
Specifically, the material basket 6 comprises a pair of backboards 601 arranged up and down and a plurality of basket rods 602 arranged between the backboards 601, the basket boards 601 and the basket rods 602 are enclosed to form a frame body, and the silicon wafer is filled into the frame body; as shown in fig. 4-5, the fixing mechanism 11 includes a moving plate 1101 disposed on the lifting plate 4, the moving plate 1101 is disposed on one side of the lifting plate 4 away from the basket 6, and an electric push rod 1102 for pushing the moving plate 1101 to move is disposed between the lifting plate 4 and the moving plate 1101, and after the electric push rod 1102 is started, the telescopic rod extends out, so as to push the moving plate 1101 to move in a direction away from the basket 6. Wherein, a supporting rod 1103 is fixedly arranged on the moving plate 1101, the supporting rod 1103 is horizontally arranged and axially consistent with the conveying direction of the silicon wafer, a pair of clamping rods 1104 distributed left and right are slidingly arranged on the supporting rod 1103, and the end parts of the clamping rods 1104 penetrate through the lifting plate 4 and are respectively arranged at the left side and the right side of the backboard 601; when opposing forces are applied to the pair of laterally spaced clamp bars 1104, the clamp bars 1104 slide on the support bars 1103 in a direction toward each other, and the ends of the clamp bars 1104 move in a direction toward the backboard 601, whereas when opposing forces are applied to the clamp bars 1104, the ends of the clamp bars 1104 move in a direction away from the backboard 601. Furthermore, the end parts of the clamping rods 1104 distributed left and right are respectively provided with an inserting rod 1105, the inserting rods 1105 are arranged on one side of the clamping rods 1104 close to the backboard 601, in addition, the left side and the right side of the backboard 601 are respectively provided with an inserting hole 1106 for inserting the inserting rods 1105, when the clamping rods 1104 distributed left and right apply opposite force, the clamping rods 1104 slide towards the directions close to each other so as to insert the inserting rods 1105 into the inserting holes 1106, and after the inserting, the material basket 6 can be fixed; additionally, after the electric push rod 1102 is started, the moving plate 1101 is pushed to move towards a direction away from the lifting plate 4, under the action of the clamping rod 1104 for fixing the material basket 6, the material basket 6 is carried to move towards a direction close to the lifting plate 4, so that the material blocking mechanism 12 is contacted with the protruding block 1210, the material blocking mechanism 12 is pushed open, the material blocking mechanism 12 is automatically opened, and after the material blocking mechanism is opened, the silicon wafer on the conveying part 8 can be pushed into the material basket 6 under the action of the pushing mechanism 10.
However, in order to drive the left and right clamping bars 1104 to move in directions approaching to or separating from each other, a dual-shaft motor 1107 is further installed on the moving plate 1101, and two output shafts of the dual-shaft motor 1107 are respectively provided with a second screw rod 1108, and the second screw rods 1108 on two sides are respectively in threaded connection with different clamping bars 1104. When the second screw rod 1108 on two sides is driven by the double-shaft motor 1107 to rotate in the forward and reverse directions, the left and right clamping rods 1104 can be driven to move in the directions close to or far from each other, so that the basket 6 can be automatically clamped or unclamped.
As shown in fig. 6, the material blocking mechanism 12 includes a pair of rotation shafts 1201 respectively disposed on different backboards 601, and each rotation shaft 1201 is fixedly provided with a rotation block 1202, a material blocking rod 1203 for blocking the silicon wafer is fixedly disposed between the rotation blocks 1202, and when the material blocking rod 1203 contacts with the silicon wafer, the silicon wafer in the material basket 6 is blocked to perform protection treatment on the filled silicon wafer; when the rotating shaft 1201 is rotated, the rotating block 1202 drives the material blocking rod 1203 to be away from the silicon wafer, so that the silicon wafer can be taken out from the material basket 6. In order to drive the rotation shaft 1201 to rotate, the stop mechanism 12 further comprises a first gear 1204, wherein the first gear 1204 is arranged on the rotation shaft 1201 of the upper backboard 601, a guide block 1205 is fixedly arranged at the top of the upper backboard 601, a sliding rod 1206 for contacting with the protruding block 1210 is slidingly arranged on the guide block 1205, and a rack 1207 meshed with the first gear 1204 is arranged at the end of the sliding rod 1206 near the first gear 1204; when the electric push rod 1102 is started, the moving plate 1101 is pushed to move towards the direction away from the lifting plate 4, under the action of the clamping rod 1104 for fixing the material basket 6, the material basket 6 is carried to move towards the direction close to the lifting plate 4, after the sliding rod 1206 is contacted with the protruding block 1210, the clamping rod 1104 continues to carry the material basket 6 for a distance, so that the protruding block 1210 pushes the sliding rod 1206 to move towards the direction close to the first gear 1204, the rack 1207 drives the first gear 1204 to rotate, so as to drive the rotating shaft 1201 to rotate, and the material blocking rod 1203 can be driven to be far away from the silicon wafer.
Further, a spring 1208 for resetting is arranged between the slide bar 1206 and the guide block 1205, when the projection 1210 pushes the slide bar 1206 to move towards the direction approaching to the first gear 1204, the material blocking bar 1203 is far away from the silicon chip, and the spring 1208 is compressed; when the moving plate 1101 resets in a direction approaching to the lifting plate 4, the basket 6 is carried to reset, so that the slide rod 1206 is separated from the protruding block 1210, the slide rod 1206 resets under the action of the compression spring 1208, and the blocking rod 1203 contacts with the silicon wafer to protect the filled silicon wafer. In addition, a protective shell 1209 is provided on the backboard 601 to cover the slide bar 1206, and the slide bar 1206 is protected by the protective shell 1209.
Specifically, the lifting plate 4 is fixedly provided with the lifting rod 401 on the left side and the right side, the lifting rod 401 is slidably arranged on the supporting frame 3, a chute 402 arranged along the length direction of the lifting rod 401 is arranged on the side edge of the lifting rod 401, a limiting block 301 arranged in the chute 402 is fixedly arranged at the bottom end of the supporting frame 3, when the lifting plate 4 moves up and down on the supporting frame 3, the limiting block 301 slides in the chute 402, and under the action of the limiting block 301, so that when the lifting plate 4 slides to the bottommost end of the supporting frame 3, the lifting plate 4 cannot be separated from the supporting frame 3, and limiting treatment on the lifting plate 4 is realized.
As shown in fig. 7-8, the driving mechanism 13 includes a rack 1301 disposed on the lifting rod 401, the rack 1301 is vertically disposed and disposed on a side of the lifting rod 401 far away from the lifting plate 4, wherein a step motor 1302 is installed on the supporting frame 3 through a mounting frame 1303, and a second gear 1304 is disposed above an output shaft of the step motor 1302, and the second gear 1304 is meshed with the rack 1301 through the supporting frame 3. When the lifting plate 4 needs to be driven to move downwards, the stepping motor 1302 is started, so that the second gear 1304 is driven to rotate anticlockwise (the rotation direction is based on fig. 7), and under the cooperation of the second gear 1304 and the rack 1301, the lifting rod 401 is driven to slide downwards on the supporting frame 3, and the lifting plate 4 moves downwards; after the stepping motor 1302 drives the elevation plate 4 to descend by a specified distance (the distance is consistent with the thickness of the silicon wafer), the stepping motor 1302 stops running.
In view of the above, the present invention has the above-mentioned excellent characteristics, so that it can be used to improve the performance and practicality of the prior art, and is a product with great practical value.
The foregoing is merely exemplary of the present invention, and those skilled in the art should not be considered as limiting the invention, since modifications may be made in the specific embodiments and application scope of the invention in light of the teachings of the present invention.
Claims (8)
1. Automatic feed mechanism based on silicon chip washs, its characterized in that: comprises a bottom plate (1) and a supporting frame (3) fixedly arranged on the bottom plate (1), wherein a lifting plate (4) capable of moving up and down is arranged on the supporting frame (3), a driving mechanism (13) for driving the lifting plate (4) is arranged on the supporting frame (3), and a supporting plate (5) for placing a material basket (6) is fixedly arranged on the lifting plate (4);
a pair of fixing plates (7) are arranged on the bottom plate (1), a conveying component (8) for conveying silicon wafers is arranged between the fixing plates (7), a baffle plate (9) for limiting the silicon wafers is fixedly arranged on the fixing plates (7), and a pushing mechanism (10) for pushing the silicon wafers on the conveying component (8) into the material basket (6) is arranged on the baffle plate (9);
the lifting plate (4) is provided with a fixing mechanism (11) for fixing the basket (6), and the fixing mechanism (11) can move back and forth on the lifting plate (4); a blocking mechanism (12) for blocking the silicon wafer is arranged on the material basket (6), and a lug (1210) for pushing up the blocking mechanism (12) is fixedly arranged on one side of the lifting plate (4) close to the material basket (6);
the pushing mechanism (10) comprises a supporting plate (1001) fixedly arranged on a baffle plate (9), a guide rod (1002) is fixedly arranged on the supporting plate (1001) through a fixed block (1003), the guide rod (1002) is horizontally arranged and axially perpendicular to the conveying direction of the silicon wafer, a movable plate (1004) is slidably arranged on the guide rod (1002), a connecting rod (1005) is fixedly arranged on one side, close to the basket (6), of the movable plate (1004), and a pushing plate (1006) for pushing the silicon wafer on the conveying component (8) into the basket (6) is arranged on the end part of the connecting rod (1005); a driving motor (1007) is further arranged on the supporting plate (1001), a first screw rod (1008) is arranged on an output shaft of the driving motor (1007), and the first screw rod (1008) is in threaded connection with the movable plate (1004).
2. The automatic feeding mechanism based on silicon wafer cleaning according to claim 1, wherein: the material basket (6) comprises a pair of backboards (601) which are arranged up and down and a plurality of basket rods (602) which are arranged between the backboards (601), and the basket body for loading silicon wafers is formed by surrounding the pair of backboards (601) and the plurality of basket rods (602).
3. The automatic feeding mechanism based on silicon wafer cleaning according to claim 2, wherein: the fixing mechanism (11) comprises a moving plate (1101) arranged on the lifting plate (4), the moving plate (1101) is arranged on one side of the lifting plate (4) away from the basket (6), and an electric push rod (1102) for pushing the moving plate (1101) to move is arranged between the lifting plate (4) and the moving plate (1101); a supporting rod (1103) is fixedly arranged on the movable plate (1101), the supporting rod (1103) is horizontally arranged and axially consistent with the conveying direction of the silicon wafer, a pair of clamping rods (1104) which are distributed left and right are slidingly arranged on the supporting rod (1103), and the end parts of the clamping rods (1104) penetrate through the lifting plate (4) and are respectively arranged at the left side and the right side of the backboard (601); the ends of the clamping rods (1104) distributed left and right are provided with inserting rods (1105), the inserting rods (1105) are arranged on one side of the clamping rods (1104) close to the backboard (601), and the left side and the right side of the backboard (601) are provided with inserting holes (1106) for inserting the inserting rods (1105); the moving plate (1101) is provided with power components for driving the clamping rods (1104) distributed left and right to approach each other or separate from each other.
4. An automatic feeding mechanism based on silicon wafer cleaning according to claim 3, wherein: the power component comprises a double-shaft motor (1107) arranged on the moving plate (1101), second screw rods (1108) are respectively arranged on output shafts at two sides of the double-shaft motor (1107), and the second screw rods (1108) at two sides are respectively in threaded connection with different clamping rods (1104).
5. The automatic feeding mechanism based on silicon wafer cleaning according to claim 2, wherein: the material blocking mechanism (12) comprises a pair of rotating shafts (1201) respectively arranged on different backboard (601), each rotating shaft (1201) is fixedly provided with a rotating block (1202), and a material blocking rod (1203) for blocking the silicon wafer is fixedly arranged between the rotating blocks (1202); the novel basketball stand is characterized by further comprising a first gear (1204), wherein the first gear (1204) is arranged on a rotating shaft (1201) of the upper backboard (601), a guide block (1205) is fixedly arranged at the top of the upper backboard (601), a sliding rod (1206) for contacting with a convex block (1210) is slidably arranged on the guide block (1205), and a rack (1207) meshed with the first gear (1204) is arranged at the end, close to the first gear (1204), of the sliding rod (1206); a spring (1208) for resetting is arranged between the slide bar (1206) and the guide block (1205).
6. The automatic feeding mechanism based on silicon wafer cleaning according to claim 5, wherein: a protective shell (1209) for covering the slide bar (1206) is also arranged on the backboard (601).
7. The automatic feeding mechanism based on silicon wafer cleaning according to claim 1, wherein: lifting rods (401) are fixedly arranged on the left side and the right side of the lifting plate (4), the lifting rods (401) are slidably arranged on the supporting frame (3), sliding grooves (402) which are arranged along the length direction of the lifting rods (401) are formed in the side edges of the lifting rods (401), and limiting blocks (301) which are arranged in the sliding grooves (402) are fixedly arranged at the bottom end of the supporting frame (3).
8. The automatic feeding mechanism based on silicon wafer cleaning according to claim 7, wherein: the driving mechanism (13) comprises a rack (1301) arranged on the lifting rod (401), the rack (1301) is vertically arranged and arranged on one side, far away from the lifting plate (4), of the lifting rod (401), the supporting frame (3) is provided with a stepping motor (1302) through a mounting rack (1303), a second gear (1304) is arranged above an output shaft of the stepping motor (1302), and the second gear (1304) penetrates through the supporting frame (3) to be meshed with the rack (1301).
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| CN202311084274.9A CN116873508B (en) | 2023-08-28 | 2023-08-28 | Automatic feeding mechanism based on silicon wafer cleaning |
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| CN202311084274.9A CN116873508B (en) | 2023-08-28 | 2023-08-28 | Automatic feeding mechanism based on silicon wafer cleaning |
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| CN117747510B (en) * | 2023-12-22 | 2024-10-01 | 东莞市鼎力自动化科技有限公司 | Anti-breaking inserting piece equipment for large-size silicon wafer |
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| CN116873508A (en) | 2023-10-13 |
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Denomination of invention: An automatic feeding mechanism based on silicon wafer cleaning Granted publication date: 20240126 Pledgee: Dongguan branch of Bank of Dongguan Co.,Ltd. Pledgor: DONGGUAN DINGLI AUTOMATION TECHNOLOGY Co.,Ltd. Registration number: Y2024980029086 |
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