CN116864399A - Chip heat dissipation device and manufacturing method thereof - Google Patents
Chip heat dissipation device and manufacturing method thereof Download PDFInfo
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- CN116864399A CN116864399A CN202310973723.9A CN202310973723A CN116864399A CN 116864399 A CN116864399 A CN 116864399A CN 202310973723 A CN202310973723 A CN 202310973723A CN 116864399 A CN116864399 A CN 116864399A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 140
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 28
- 238000004080 punching Methods 0.000 claims abstract description 13
- 238000003475 lamination Methods 0.000 claims abstract description 7
- 238000005520 cutting process Methods 0.000 claims abstract description 3
- 238000005192 partition Methods 0.000 claims description 77
- 239000007788 liquid Substances 0.000 claims description 47
- 125000006850 spacer group Chemical group 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 15
- 238000005219 brazing Methods 0.000 claims description 5
- 230000000295 complement effect Effects 0.000 claims description 4
- 239000000110 cooling liquid Substances 0.000 description 32
- 239000011324 bead Substances 0.000 description 7
- 238000001816 cooling Methods 0.000 description 7
- 230000003247 decreasing effect Effects 0.000 description 6
- 239000002826 coolant Substances 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a chip heat dissipation device and a manufacturing method thereof, wherein the manufacturing method of the chip heat dissipation device comprises the following steps: step S1, obtaining a metal sheet, wherein the thickness of the metal sheet is a thickness capable of meeting the punching requirement; step S2, stamping the metal sheet, and cutting out a preset pattern to form a plurality of sheet-shaped heat dissipation sheets, wherein the sheet-shaped heat dissipation sheets comprise a first type sheet-shaped heat dissipation sheet and a second type sheet-shaped heat dissipation sheet; s3, selecting a certain amount of first-type sheet radiating sheets/second-type sheet radiating sheets according to the thickness of the radiating plate, respectively performing alignment lamination to form a first radiating plate/second radiating plate, and selecting a certain amount of first radiating plate and second radiating plate to sequentially laminate; and S4, sequentially stacking the top plate, the heat dissipation plate and the bottom plate in a aligned manner to form the chip heat dissipation device. The manufacturing method of the chip heat dissipation device has the advantages of greatly shortened processing time, high efficiency, low cost and high adjustability.
Description
Technical Field
The invention relates to the field of chips, in particular to a chip heat dissipation device and a manufacturing method thereof.
Background
During the use of the chips (the central processing unit chip, the graphic processing chip and the IGBT chip), a large amount of heat is generated, and the chips are required to be radiated so as to ensure smooth operation of the chips.
The existing chip heat dissipation device is low in efficiency, high in cost and small in variability due to the fact that a cooling liquid flow channel is formed by sampling and grooving the surface of a metal plate.
Disclosure of Invention
The present invention aims to provide a chip heat sink and a method for manufacturing the same, which have the advantages of greatly shortened processing time, high efficiency, low cost and high adjustability.
In order to solve the above problems, a first aspect of the present invention provides a method for manufacturing a chip heat sink, the method for manufacturing a chip heat sink comprising:
step S1, obtaining a metal sheet, wherein the thickness of the metal sheet is a thickness capable of meeting the punching requirement;
step S2, stamping the metal sheet, cutting out a preset pattern to form a plurality of sheet-shaped heat dissipation sheets, wherein the sheet-shaped heat dissipation sheets comprise a first type sheet-shaped heat dissipation sheet and a second type sheet-shaped heat dissipation sheet,
each sheet-shaped heat dissipation sheet comprises a frame, one or more partition boards and a plurality of groups of partition strips, wherein the partition boards are arranged in an area surrounded by the frame, the partition boards are longitudinally arranged, at least one longitudinal end of each partition board is provided with a first gap with the transverse side wall of the frame, when one partition board is arranged, the partition boards are arranged in the middle of the area surrounded by the frame, when the number of the partition boards is multiple, the partition boards are arranged at intervals along the transverse direction, a second gap is arranged between the longitudinal side wall of the frame and the partition boards adjacent to the partition boards, and between two adjacent partition boards, the groups of partition strips are in one-to-one correspondence with the second gaps, each group of partition strips comprises a plurality of partition strips arranged at intervals along the longitudinal direction, the partition strips are flush with the upper surface/lower surface of the frame, the partition strips are arranged in the second gaps, and the transverse ends of the partition strips are respectively connected with the frame and the partition boards, or respectively connected with the two adjacent partition boards,
the frame of each lamellar radiating sheet is consistent with the shape of the partition plate, and the inclination angles of the parting strips of the first lamellar radiating sheet and the second lamellar radiating sheet relative to the longitudinal side wall of the frame are inconsistent;
s3, obtaining the number of layers of the radiating plate and the thickness of each layer of the radiating plate required by the chip radiating device, selecting a certain amount of first-type sheet radiating thin plates/second-type sheet radiating thin plates according to the thickness of the radiating plate, respectively performing alignment lamination to form a first radiating plate/second radiating plate, selecting a certain amount of first radiating plate and second radiating plate according to the number of layers of the radiating plate, and sequentially laminating, wherein the radiating plates of two adjacent layers are the first radiating plate and the second radiating plate;
and S4, acquiring a top plate and a bottom plate, wherein the outer edges of the top plate and the bottom plate are consistent with the outer edges of the frames, liquid inlets and liquid outlets are respectively formed in two longitudinal sides of the top plate, and the top plate, the heat dissipation plate and the bottom plate are sequentially aligned and laminated to form the chip heat dissipation device.
Further, a plurality of the sheet-like heat dissipation sheets are sequentially laminated by a vacuum brazing method.
Further, the angle between the parting bead and the longitudinal side wall of the frame is 60-95 degrees, or 105-120 degrees.
Further, the spacer bars of the first type of sheet heat dissipation sheet and the second type of sheet heat dissipation sheet are complementary in angle to the longitudinal side walls of the bezel.
Further, the first pattern formed by the parting strips of the first type of lamellar heat dissipation sheet is axisymmetric with the second pattern formed by the parting strips of the second type of lamellar heat dissipation sheet, and the axisymmetric symmetry axis is formed in the middle part of the second gap in the transverse direction.
Further, the first heat sink and the second heat sink are stacked in alignment according to the number of layers required for the heat sink being two, and the first heat sink, the second heat sink, and the first heat sink are stacked in alignment in order, or the second heat sink, the first heat sink, and the second heat sink are stacked in alignment in order according to the number of layers required for the heat sink being three.
Further, in the step S2, the number of times of stamping the metal sheet includes one, two or three times, and mounting holes for mounting chips are formed on the upper surface of the bottom plate and/or the upper surface of the top plate at positions corresponding to the frame and the partition plate of the heat dissipation plate, one chip corresponds to one second gap, and in each second gap, the number of gaps between adjacent partition strips in each group of partition strips of each layer of heat dissipation plate corresponds to the required heat dissipation amount of the chip corresponding to the group of partition strips.
Further, the step S4 further includes:
and acquiring a liquid inlet connector and a liquid outlet connector, connecting the liquid inlet connector with the liquid inlet, and connecting the liquid outlet connector with the liquid outlet.
Further, in the step S2, when the number of the separators is plural, in adjacent separators, a first gap is formed by punching a connection portion between a first longitudinal end of one of the separators and the frame and a connection portion between a second longitudinal end of the other separator and the frame, and the first longitudinal end and the second longitudinal end face two opposite lateral side walls of the frame, respectively, or both ends of the adjacent two separators and the connection portion of the frame are punched to form the first gap.
The first aspect of the present invention provides a chip heat dissipation device, which is manufactured by any one of the manufacturing methods of the chip heat dissipation device.
Due to the technical scheme, the invention has the following beneficial effects:
according to the manufacturing method of the chip heat dissipation device, the metal thin plates are punched to form the plurality of sheet heat dissipation thin plates comprising the first sheet heat dissipation thin plates and the second sheet heat dissipation thin plates, a certain amount of the first sheet heat dissipation thin plates/the second sheet heat dissipation thin plates are respectively and positively stacked according to the number of radiating plate layers required by the chip heat dissipation device and the thickness required by each layer of radiating plate, a certain amount of the first radiating plate and the second radiating plate are sequentially stacked according to the number of radiating plate layers and are then aligned and stacked with the top plate and the bottom plate, so that the chip heat dissipation device is formed. And the thickness of the radiating plate can be conveniently adjusted by increasing or decreasing the sheet radiating sheet, and the heat exchange area of the chip radiating device can be conveniently adjusted by increasing or decreasing the layer number of the radiating plate, so that the adjustability is high and the universality is strong.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the following description will make a brief introduction to the drawings used in the description of the embodiments or the prior art. It is evident that the drawings in the following description are only some embodiments of the present invention and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.
FIG. 1 is a flow chart of a method of fabricating a chip heat sink according to an embodiment of the invention;
FIG. 2 is a schematic view of a sheet metal heat sink sheet made in accordance with a first embodiment of the present invention;
FIG. 3 is a schematic view of a sheet metal heat sink sheet made in accordance with a second embodiment of the present invention;
FIG. 4 is a schematic illustration of an assembly of a finned heat sink sheet in accordance with an embodiment of the present invention;
FIG. 5 is an assembly view of a chip heat sink according to an embodiment of the invention;
FIG. 6 is a block diagram of a chip heat sink;
fig. 7 is a schematic view showing the flow of a coolant inside a chip heat sink according to the first embodiment of the present invention;
fig. 8 is an enlarged view of area a of fig. 7;
FIG. 9 is a schematic view showing the flow of coolant inside a chip heat sink according to a second embodiment of the present invention;
fig. 10 is a structural view of a sheet-like heat dissipation sheet according to an embodiment of the present invention.
Reference numerals:
100. a top plate; 110. a liquid inlet; 120. a liquid outlet; 130. a mounting hole; 200. a heat dissipation plate; 201. a frame; 202. a partition plate; 203. a parting bead; 210. a first heat dissipation plate; 210a, a first type of laminar heat sink sheet; 220. a second heat dissipation plate; 220a, a second type of laminar heat dissipation sheet; 300. a bottom plate; 410. a liquid inlet joint; 420. a liquid outlet joint; 500. a metal thin plate; 600. symmetry axis.
Detailed Description
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.
Next, a method for manufacturing a chip heat dissipating device according to an embodiment of the present invention is described.
As shown in fig. 1, the method for manufacturing the chip heat dissipation device according to the embodiment of the invention includes:
in step S1, the metal sheet 500 is obtained, and the thickness of the metal sheet is a thickness capable of satisfying the punching demand thereof.
That is, the material and thickness of the metal sheet 500 may be selected from the viewpoint of the stamping apparatus and the stamping process to facilitate stamping, and cost reduction can be achieved by replacing the conventional thick aluminum plate or copper plate with the metal sheet 500.
In step S2, the metal sheet 500 is punched and cut into a predetermined pattern to form a plurality of sheet-like heat dissipation sheets including a first type sheet-like heat dissipation sheet 210a and a second type sheet-like heat dissipation sheet.
Each sheet-shaped heat dissipation sheet comprises a frame 201, one or more partition plates 202 and a plurality of groups of partition plates 203, wherein the partition plates 202 are arranged in an area surrounded by the frame 201, the partition plates 202 are longitudinally arranged, at least one longitudinal end of each partition plate 202 is in a first gap with the transverse side wall of the frame 201, when one partition plate 202 is arranged, the partition plates 202 are arranged in the middle of the area surrounded by the frame 201, when the number of the partition plates 202 is multiple, the partition plates 202 are arranged at intervals along the transverse direction, a second gap is arranged between the longitudinal side wall of the frame 201 and the partition plates 202 adjacent to the partition plates, and between two adjacent partition plates 202, the groups of partition plates 203 are in one-to-one correspondence with the second gaps, each group of partition plates 203 comprises a plurality of partition plates 203 which are arranged at intervals along the longitudinal direction, each partition plate 203 is flush with the upper surface/lower surface of the frame 201, and the two transverse ends of each partition plate 203 are respectively connected with the frame 201 and the partition plates 202 or respectively connected with the two adjacent partition plates 202.
Wherein the shape of the frame 201 and the partition 202 of each sheet is identical, and the inclination angles of the division bars 203 of the first type sheet 210a and the second type sheet 220a are not identical with respect to the longitudinal side wall of the frame 201.
As shown in fig. 2, the first type heat sink sheet 210a may be formed by punching the metal sheet 500 with a first type die, the second type heat sink sheet 220a may be formed by punching the metal sheet 500 with a second type die, or the first type heat sink sheet 210a and the second type heat sink sheet 220a may be formed simultaneously by punching the metal sheet 500 with a third type die.
Compared with machining (CNC and the like), the stamping method has the advantages that the machining time is greatly shortened, the sheet-shaped heat-dissipating sheet can be rapidly formed, and the productivity and the efficiency are high. Even if a single sheet-shaped heat dissipation sheet is scrapped due to processing failure, the loss is low, and the cost can be effectively reduced.
The rims 201 and the spacers 202 of the first type and second type heat dissipating sheets are identical in shape, and the inclination angles of the spacers 203 of the first type and second type heat dissipating sheets 210a and 220a with respect to the longitudinal side walls of the rims 201 are not identical. After the first type heat sink sheet 210a and the second type heat sink sheet are stacked later, since the inclination angles of the two sheets are not identical with respect to the longitudinal side wall of the frame 201, the two sheets may cross, and the cooling liquid may flow from the first type heat sink 200 to the second type heat sink 200 or from the second type heat sink 200 to the first type heat sink 200 through the crossing.
Depending on whether only one or both ends of the separator 202 in the longitudinal direction are spaced apart from the lateral side wall of the frame 201 by a first gap, two cases can be distinguished:
in the first case, as shown in fig. 2, the longitudinal ends of the partition 202 have a first gap from the lateral side walls of the frame 201.
In the second case, as shown in fig. 3, one end of the spacer 202 in the longitudinal direction has a first gap from the lateral side wall of the frame 201.
Step S3, the number of layers of the heat dissipation plate 200 and the thickness of each layer of the heat dissipation plate 200 required by the chip heat dissipation device are obtained, a certain amount of first-type sheet heat dissipation plates 210a and second-type sheet heat dissipation plates 220a are selected according to the thickness of the heat dissipation plate 200 to be respectively stacked in alignment, a first heat dissipation plate 210 and a second heat dissipation plate 220 are formed, and a certain amount of first heat dissipation plate 210 and second heat dissipation plate 220 are selected according to the number of layers of the heat dissipation plate 200 to be sequentially stacked.
For example, as shown in fig. 4, the number of layers of the heat dissipation plates 200 required for the chip heat dissipation device is two, the thickness of each heat dissipation plate 200 is 6mm, the thickness of the sheet heat dissipation plate is 2mm, three first type sheet heat dissipation plates 210a are selected to be aligned and stacked to form a first heat dissipation plate 210, and three second type sheet heat dissipation plates 220a are selected to be aligned and stacked to form a second heat dissipation plate 220. The first heat spreader 210 and the second heat spreader 220 are stacked in alignment to form a two-layer heat spreader 200 required for a chip heat spreader. Wherein, the first heat dissipation plate, the second heat dissipation plate, and the first heat dissipation plate … … are stacked in order, and the two adjacent heat dissipation plates are the first heat dissipation plate and the second heat dissipation plate (the types of the two adjacent heat dissipation plates are not consistent).
Wherein the heat sink 200 comprises a first heat sink 201 and/or a second heat sink 202.
In step S4, the top plate 100 and the bottom plate 300 are obtained, the outer edges of the top plate 100 and the bottom plate 300 are consistent with the outer edges of the frame 201, the liquid inlet 110 and the liquid outlet 120 are respectively formed on two longitudinal sides of the top plate 100, and the top plate 100, the heat dissipation plate 200 and the bottom plate 300 are sequentially stacked in alignment to form the chip heat dissipation device.
As shown in fig. 5 and 6, the top plate 100, the heat dissipating plate 200, and the bottom plate 300 are stacked in this order to form a chip heat dissipating device. A liquid inlet 110 and a liquid outlet 120 are formed at both sides of the top plate 100 in the longitudinal direction, respectively. The lower surface of the top plate 100 is abutted against the lower surface of the heat dissipation plate 200 of the topmost layer. The upper surface of the bottom plate 300 is closely adhered to the lower surface of the heat dissipation plate 200 at the lowermost layer. The outer edge (outer edge) of the top plate 100 covers at least the inner edge (inner edge) of the rim 201 and the outer edge of the bottom plate 300 covers at least the inner edge of the rim 201. The lower surface of the bottom plate 300 and/or the upper surface of the top plate 100 are used for connection with a chip. The cooling liquid can flow into the chip heat dissipation device through the liquid inlet 110, and the cooling liquid can flow out of the chip heat dissipation device through the liquid outlet.
For example, as shown in fig. 7 and 8, the cooling liquid flows laterally from the liquid inlet 110 on one side in the longitudinal direction of the frame 201 to each first gap adjacent to the liquid inlet 110, and flows longitudinally into each second gap, in which the cooling liquid flows through the lower layer slit (the lower layer slit formed by the adjacent barrier ribs 203 of the lower layer heat sink 200 (the second heat sink 202)) first along the extending direction of the lower layer slit, then flows to the intersecting slit (the intersecting slit formed by the intersecting portion between the upper layer slit and the lower layer slit), rises from the intersecting slit, then flows to the upper layer slit (the upper layer slit formed by the adjacent barrier ribs 203 of the upper layer heat sink 200 (the first heat sink 201)) along the extending direction of the upper layer slit, then flows to the intersecting slit, descends from the intersecting slit, then flows … … along the extending direction of the lower layer slit, finally flows to the liquid outlet hole on the other side in the longitudinal direction of the frame 201, and flows out of the chip heat sink from the liquid outlet 120.
In the above-formed chip heat dissipation device, the top plate 100, the multi-layer heat dissipation plate 200 and the bottom plate 300 are sequentially stacked, a cooling chamber containing cooling liquid can be formed on the lower surface of the top plate 100, the side frame 201 of the multi-layer heat dissipation plate 200 and the upper surface of the bottom plate 300, the depth of the cooling liquid, namely, the total thickness of the multi-layer side frame 201, can flow into the cooling chamber through the liquid inlet 110, the cooling liquid can longitudinally flow between the multi-layer partition plate 202 and the multi-layer side frame 201 and in a second gap between the adjacent multi-layer partition plates 202, and transversely flow in a first gap between the multi-layer partition plates 202 and the multi-layer side frame 201, and when the cooling liquid longitudinally flows in the second gap, the cooling liquid can longitudinally flow through an upper layer gap formed by adjacent parting strips 203 on the upper layer of the heat dissipation plate 200 on two adjacent sides, a lower layer gap formed by adjacent parting strips 203 on the lower layer, and cross holes formed by the upper layer gaps and the lower layer gaps on the lower layer of the adjacent parting strips 203, the formed flow channels are three-dimensional channels, the cooling liquid can contact the inner walls of the side frames 201 of each layer of the cooling plate 200, the side walls of the parting strips 203, the side walls of the upper layers and the upper layers 203 and the cross heat exchange layers at the lower layers at the cross-layer parting strips 203, the cross-section areas of the upper layers and the upper layers 203 and the adjacent parting strips and the heat exchange layers are avoided, and the heat exchange layers at the cross-layer layers between the upper layers and the adjacent heat dissipation layers are increased.
According to the manufacturing method of the chip heat dissipation device, the metal sheet 500 is punched to form a plurality of sheet heat dissipation sheets comprising the first type sheet heat dissipation sheet and the second type sheet heat dissipation sheet, a certain amount of the first type sheet heat dissipation sheet 210 a/the second type sheet heat dissipation sheet 220a are respectively aligned and laminated according to the number of the heat dissipation sheets 200 and the thickness required by each layer of the heat dissipation sheets 200, a certain amount of the first heat dissipation sheet 210 and the second heat dissipation sheet 220 are selected according to the number of the heat dissipation sheets 200 to be sequentially laminated and then aligned and laminated with the top plate 100 and the bottom plate 300, so that the chip heat dissipation device is formed through a punching process and lamination. The thickness of the heat dissipating plate 200 can be conveniently adjusted by increasing or decreasing the number of the sheet-shaped heat dissipating plates, and the heat exchanging area of the chip heat dissipating device can be conveniently adjusted by increasing or decreasing the number of the layers of the heat dissipating plate 200, so that the heat dissipating plate has high adjustability and strong universality.
In some embodiments of the invention, a plurality of sheet-like heat sink sheets are laminated in sequence by vacuum brazing.
For example, as shown in fig. 4 and 5, three first-type heat radiation sheets 210a and three second-type heat radiation sheets 220a are laminated in order by vacuum brazing.
The connection between the sheet-shaped heat dissipation sheets can be tight in a vacuum brazing mode, gaps between the sheet-shaped heat dissipation sheets are avoided, and the corrosion resistance of the chip heat dissipation device can be improved.
In some embodiments of the invention, the spacer 203 is at an angle of 60 to 95 degrees, or 105 to 120 degrees, to the longitudinal side wall of the bezel 201.
The lamination of the sheet-shaped heat dissipation plates can make the angle between the spacer 203 of the first heat dissipation plate 210 or the second heat dissipation plate 220 and the longitudinal side wall of the frame 201 be 60 degrees to 95 degrees, or 105 degrees to 120 degrees.
As shown in fig. 2 and 3, in two adjacent layers of heat dissipation plates 200, the angle between the parting bead 203 of the first heat dissipation plate 210 and the longitudinal side wall of the frame 201 is α, and the angle between the parting bead 203 of the second heat dissipation plate 220 and the longitudinal side wall of the frame 201 is β.
Wherein alpha is the degree to the degree, and beta is the degree to the degree. This angle allows the parting bead 203 to be closer to a transverse line, enabling more parting beads 203 to be disposed in the second gap, improving the heat transfer area.
Alternatively, the spacer bars 203 of the first type of sheet heat sink sheet 210a and the second type of sheet heat sink sheet 220a are complementary in angle to the longitudinal side walls of the bezel 201.
That is, the α and β are complementary, so that the overlapping ratio of the division bars 203 of the first heat dissipation plate 210 and the division bars 203 of the second heat dissipation plate 220 can be increased, and the heat exchange area can be further increased.
Further, the first pattern formed by the division bars 203 of the first type of heat sink sheet 210a is axisymmetric to the second pattern formed by the division bars 203 of the second type of heat sink sheet, and an axisymmetric symmetry axis 600 is formed at the middle of the second gap in the lateral direction.
As shown in fig. 10, the symmetry axis 600 is the center line of the longitudinal side walls of the frame 201 and the longitudinal side walls of the partitions 202 adjacent to the longitudinal frame 201, or the center lines of the longitudinal side walls of the adjacent two partitions 202. The first pattern and the second pattern which are axisymmetric can make the overlapping rate of the parting bead 203 higher, remarkably increase the heat exchange area, and the uniformity of the flow of the cooling liquid at two sides of the symmetry axis 600 of the cooling liquid is higher, so that the uniformity of heat exchange is increased. The symmetry axis 600 is in the horizontal middle part of second clearance, and the nearer symmetry axis 600, the heat transfer area is bigger, and is big with the middle part heat of chip, and heat is little to the periphery corresponds, can concentrate the heat dissipation to the middle part of chip, improves radiating efficiency.
In some embodiments of the present invention, the first heat spreader 210 and the second heat spreader 220 are stacked in alignment according to the number of layers required for the heat spreader 200 being two, the first heat spreader 210, the second heat spreader 220, and the first heat spreader 210 are stacked in alignment in sequence, or the second heat spreader 220, the first heat spreader 210, and the second heat spreader 220 are stacked in alignment in sequence according to the number of layers required for the heat spreader 200 being three.
As shown in fig. 5, the number of layers required for the heat sink 200 is two. When the number of layers required for the heat dissipation plate 200 is three, a layer of the second heat dissipation plate 220 can be stacked above the original first heat dissipation plate 210 on the basis of the two layers of the heat dissipation plate 200, or a layer of the first heat dissipation plate 210 can be stacked above the original second heat dissipation plate 220, so that three layers of heat dissipation plates 200 can be formed, and by analogy, four layers of heat dissipation plates 200 and five layers of heat dissipation plates 200 can be formed.
It should be noted that the above is only an optional example, and the number of layers of the heat dissipation plate 200 is not limited, and may be seven layers, eight layers, etc., which are all understood to be within the scope of the present invention. Thus, the multi-layered heat sink 200 can be simply formed, and the coolant can pass through the multi-layered heat sink from the intersecting space, thereby increasing the heat exchange area.
In some embodiments of the present invention, the number of times the sheet metal 500 is punched in step S2 includes one, two or three times.
As shown in fig. 2 and 3, the metal sheet 500 may be stamped and formed in one pass to form a sheet-like heat sink sheet. The sheet metal 500 may be cut into a plurality of rectangular sheets conforming to the frame 201, and then the rectangular sheets may be punched to form a sheet-like heat dissipation sheet.
The above is an alternative example, and the number of punching operations is not limited here.
As shown in fig. 5, the mounting holes 130 are provided in nine groups (corresponding to nine second gaps), four of the mounting holes 130 are provided in each group, and fasteners can pass through the mounting holes 130 of the mounting portions at the four corners of the chip, so that the chip is closely attached to the chip heat sink.
As shown in fig. 7, among nine groups of division bars 203 (corresponding to nine second gaps), the number of gaps between adjacent division bars 203 in each group of division bars 203 in the third second gap, the sixth second gap and the ninth second gap is smaller than that of other gaps, the heat dissipation required by the chips corresponding to the second gaps is smaller, the flow rate of the cooling liquid flowing through the second gaps is reduced, the heat exchange area in the second gaps is reduced, more cooling liquid can flow into other second gaps, and the chips corresponding to other second gaps can be dissipated, so that the chips with different requirements can be dissipated in a targeted manner.
In some embodiments of the present invention, step S4 further comprises obtaining a liquid inlet connector 410 and a liquid outlet connector 420, connecting the liquid inlet connector 410 with the liquid inlet 110, and connecting the liquid outlet connector 420 with the liquid outlet 120.
As shown in fig. 5, the liquid inlet 110 is connected to a liquid inlet pipe through a liquid inlet joint 410, and the liquid outlet 120 is connected to a liquid outlet pipe through a liquid outlet joint 420, so that the tightness can be increased, and leakage of cooling liquid can be avoided.
In some embodiments of the present invention, when the number of the spacers 202 is plural, in the adjacent spacers 202, a first gap is formed by punching a connection portion between a first longitudinal end of one spacer 202 and the frame 201 and a connection portion between a second longitudinal end of the other spacer 202 and the frame 201, the first longitudinal end and the second longitudinal end respectively face opposite lateral side walls of the frame 201, or a first gap is formed by punching a connection portion between both ends of the adjacent two spacers 202 and the frame 201.
That is, two cases can be distinguished:
in the first case, as shown in fig. 2, in the adjacent spacers 202, the first gap is formed by pressing the connection portions between the two ends of the adjacent spacers 202 and the frame 201. The longitudinal both ends of the spacer 202 have a first gap from the lateral side walls of the bezel 201.
The flow of the cooling liquid in the chip cooling device of this structure is shown in fig. 7.
In the second case, as shown in fig. 3, in the adjacent spacers 202, a first gap is formed by punching a connection portion of a first longitudinal end of one spacer 202 with the frame 201 and a connection portion of a second longitudinal end of the other spacer 202 with the frame 201. One end of the spacer 202 in the longitudinal direction has a first gap from the lateral side wall of the bezel 201.
The flow of the cooling liquid in the chip cooling device of this structure is shown in fig. 9. The cooling liquid flows in from the liquid inlet 110, then longitudinally flows through each second gap in turn, forms a serpentine flow channel, and finally flows out from the liquid outlet 120. Compared with the cooling liquid flowing through all the second gaps synchronously as shown in fig. 7, the cross-sectional area of the cooling liquid flowing through is relatively small, and when the liquid inlet amount of the cooling liquid is fixed, the flow velocity of the cooling liquid is increased, so that the heat exchange coefficient is increased, and the heat exchange capacity is improved. In addition, the retention of the cooling liquid after heat exchange can be reduced, and the heat exchange efficiency is improved.
The following describes a chip heat dissipating device according to an embodiment of the present invention. The chip heat sink is manufactured by the manufacturing method of any one of the chip heat sinks.
A chip heat sink as shown in fig. 5 and 6 may be formed. The top plate 100, the multi-layer heat dissipation plate 200 and the bottom plate 300 are sequentially stacked, a cooling chamber for containing cooling liquid can be formed on the lower surface of the top plate 100, the side frame 201 of the multi-layer heat dissipation plate 200 and the upper surface of the bottom plate 300, the depth of the cooling liquid is the total thickness of the multi-layer side frame 201, the cooling liquid can flow into the cooling chamber through the liquid inlet 110, the cooling liquid can longitudinally flow between the multi-layer partition plate 202 and the multi-layer side frame 201 and in a second gap between the adjacent multi-layer partition plates 202, and transversely flow in a first gap between the multi-layer partition plates 202 and the multi-layer side frame 201, and when the cooling liquid longitudinally flows in the second gap, the cooling liquid can flow through an upper layer gap formed by adjacent parting strips 203 of an upper layer in the heat dissipation plate 200 on two adjacent sides, a lower layer gap formed by adjacent parting strips 203 on the lower layer, and cross holes formed by the upper layer gaps and the lower layer gaps crossing the lower layer gaps, the formed by cross holes of the upper layer gaps and the lower layer gaps are three-dimensional flow channels, the cooling liquid can contact the inner wall of the side frame 201 of each layer heat dissipation plate 200, the side walls of the parting strips 203, the upper surface of the parting strips 203 and the heat exchange coefficient at the cross-layer parting strips 203 is reduced, and the heat exchange area of the upper layer 203 is avoided, and the heat exchange area of the upper layer and the lower layer between the parting strips is increased.
In addition, the chip heat dissipation device is formed through stamping process and lamination, compared with the chip heat dissipation device formed through common machining, the processing time is greatly shortened, the efficiency is high, the cost is low, the requirement of mass processing is met, even if a single sheet-shaped heat dissipation sheet is scrapped due to processing failure, the loss is low, and the cost can be reduced. The thickness of the heat dissipating plate 200 can be conveniently adjusted by increasing or decreasing the sheet-like heat dissipating plate, and the heat exchanging area of the chip heat dissipating device can be conveniently adjusted by increasing or decreasing the number of layers of the heat dissipating plate 200, so that the heat dissipating plate has high adjustability and high versatility.
The foregoing is only illustrative of the present invention and is not to be construed as limiting thereof, but rather as various modifications, equivalent arrangements, improvements, etc., within the spirit and principles of the present invention.
Claims (10)
1. The manufacturing method of the chip heat dissipation device is characterized by comprising the following steps:
step S1, obtaining a metal sheet, wherein the thickness of the metal sheet is a thickness capable of meeting the punching requirement;
step S2, stamping the metal sheet, cutting out a preset pattern to form a plurality of sheet-shaped heat dissipation sheets, wherein the sheet-shaped heat dissipation sheets comprise a first type sheet-shaped heat dissipation sheet and a second type sheet-shaped heat dissipation sheet,
each sheet-shaped heat dissipation sheet comprises a frame, one or more partition boards and a plurality of groups of partition strips, wherein the partition boards are arranged in an area surrounded by the frame, the partition boards are longitudinally arranged, at least one longitudinal end of each partition board is provided with a first gap with the transverse side wall of the frame, when one partition board is arranged, the partition boards are arranged in the middle of the area surrounded by the frame, when the number of the partition boards is multiple, the partition boards are arranged at intervals along the transverse direction, a second gap is arranged between the longitudinal side wall of the frame and the partition boards adjacent to the partition boards, and between two adjacent partition boards, the groups of partition strips are in one-to-one correspondence with the second gaps, each group of partition strips comprises a plurality of partition strips arranged at intervals along the longitudinal direction, the partition strips are flush with the upper surface/lower surface of the frame, the partition strips are arranged in the second gaps, and the transverse ends of the partition strips are respectively connected with the frame and the partition boards, or respectively connected with the two adjacent partition boards,
the frame of each lamellar radiating sheet is consistent with the shape of the partition plate, and the inclination angles of the parting strips of the first lamellar radiating sheet and the second lamellar radiating sheet relative to the longitudinal side wall of the frame are inconsistent;
s3, obtaining the number of layers of the radiating plates required by the chip radiating device and the thickness of each layer of the radiating plates, selecting a certain amount of first-type sheet radiating plates/second-type sheet radiating plates according to the thickness of the radiating plates, respectively performing alignment lamination to form a first radiating plate/second radiating plate, and selecting a certain amount of first radiating plates and second radiating plates according to the number of layers of the radiating plates to perform sequential lamination, wherein the radiating plates of two adjacent layers are the first radiating plate and the second radiating plate;
and S4, acquiring a top plate and a bottom plate, wherein the outer edges of the top plate and the bottom plate are consistent with the outer edges of the frames, liquid inlets and liquid outlets are respectively formed in two longitudinal sides of the top plate, and the top plate, the heat dissipation plate and the bottom plate are sequentially aligned and laminated to form the chip heat dissipation device.
2. The method for manufacturing a chip heat sink according to claim 1, wherein a plurality of the sheet-like heat sink sheets are laminated in order by vacuum brazing.
3. The method of claim 1, wherein the spacer bars are at an angle of 60-95 degrees or 105-120 degrees to the longitudinal side walls of the frame.
4. A method of manufacturing a chip heat sink according to claim 3, wherein the spacer bars of the first type and the second type of heat sink sheets are complementary in angle to the longitudinal side walls of the frame.
5. The method of claim 4, wherein the first pattern formed by the spacers of the first type of sheet-like heat sink is axisymmetric with the second pattern formed by the spacers of the second type of sheet-like heat sink, and the symmetry axis of the axisymmetry is formed in the middle of the second gap in the lateral direction.
6. The method of manufacturing a chip heat sink according to claim 1, wherein the number of layers required for the heat sink is two, the first heat sink and the second heat sink are stacked in alignment, the first heat sink, the second heat sink and the first heat sink are stacked in alignment in order, or the second heat sink, the first heat sink and the second heat sink are stacked in alignment in order, based on the number of layers required for the heat sink being three.
7. The method according to claim 1, wherein the number of times of stamping the metal thin plate in the step S2 includes one, two or three times, and mounting holes for mounting chips are formed in positions corresponding to the frame and the partition plate of the heat dissipation plate on the upper surface of the bottom plate and/or the upper surface of the top plate, one chip corresponding to one second gap, and in each second gap, the number of gaps between adjacent ones of the division bars in each group of the heat dissipation plates corresponds to the heat dissipation amount required for the chips corresponding to the group of the division bars.
8. The method for manufacturing a chip heat dissipating device according to claim 1, wherein the step S4 further comprises:
and acquiring a liquid inlet connector and a liquid outlet connector, connecting the liquid inlet connector with the liquid inlet, and connecting the liquid outlet connector with the liquid outlet.
9. The method of manufacturing a heat dissipating device according to claim 1, wherein in the step S2, when the number of the spacers is plural, in adjacent spacers, a connection portion between a first longitudinal end of one of the spacers and the frame and a connection portion between a second longitudinal end of the other spacer and the frame are punched to form the first gap, and the first longitudinal end and the second longitudinal end respectively face two opposite lateral sidewalls of the frame or punch both ends of two adjacent spacers and the connection portion of the frame to form the first gap.
10. A chip heat sink, characterized in that the chip heat sink is manufactured by the manufacturing method of the chip heat sink according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310973723.9A CN116864399A (en) | 2023-08-04 | 2023-08-04 | Chip heat dissipation device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310973723.9A CN116864399A (en) | 2023-08-04 | 2023-08-04 | Chip heat dissipation device and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN116864399A true CN116864399A (en) | 2023-10-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310973723.9A Pending CN116864399A (en) | 2023-08-04 | 2023-08-04 | Chip heat dissipation device and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN116864399A (en) |
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2023
- 2023-08-04 CN CN202310973723.9A patent/CN116864399A/en active Pending
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