CN116855923A - 一种铜球表面化学镀锡的方法 - Google Patents

一种铜球表面化学镀锡的方法 Download PDF

Info

Publication number
CN116855923A
CN116855923A CN202310824346.2A CN202310824346A CN116855923A CN 116855923 A CN116855923 A CN 116855923A CN 202310824346 A CN202310824346 A CN 202310824346A CN 116855923 A CN116855923 A CN 116855923A
Authority
CN
China
Prior art keywords
tin
copper
ball
solution
copper ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310824346.2A
Other languages
English (en)
Inventor
汉晶
李腾
孟洲
晋学轮
郭福
马立民
王乙舒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing University of Technology
Original Assignee
Beijing University of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing University of Technology filed Critical Beijing University of Technology
Priority to CN202310824346.2A priority Critical patent/CN116855923A/zh
Publication of CN116855923A publication Critical patent/CN116855923A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/14—Treatment of metallic powder
    • B22F1/142—Thermal or thermo-mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/14—Treatment of metallic powder
    • B22F1/145—Chemical treatment, e.g. passivation or decarburisation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1689—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
    • C23C18/1834—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
    • C23G5/032—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing oxygen-containing compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Chemically Coating (AREA)

Abstract

本发明公开了一种铜球表面化学镀锡的方法，属于材料的制备与连接技术领域。所述铜球表面化学镀锡方法的步骤包括：先利用盐酸乙醇溶液对铜球表面进行酸洗并酸化，然后除去铜球表面的盐酸乙醇溶液，再对铜球表面进行化学镀锡。本发明基于铜球与锡基焊料的结合较差的问题，通过先对铜球表面进行化学镀锡，其关键步骤在于铜球表面的酸洗并酸化，该操作可以改善铜球与锡镀层的结合性能，进一步以锡镀层为过渡，解决了铜球与锡基焊料结合较差的问题。本发明提供的制备方法工艺简单，成本低廉，可制作出镀敷材料厚度可控的镀锡铜球。

Description

一种铜球表面化学镀锡的方法
技术领域
本发明属于材料的制备与连接技术领域，具体涉及一种铜球表面化学镀锡的方法。
背景技术
焊点在微电子互连中起到机械连接和电信号传输的作用。目前，随着微电子封装内部空间减小，元器件数量增多，元器件产热加剧；造成焊点所承受的电流密度不断增加，在热力学和动力学因素的驱动下，焊料中形成的IMCs会生长或溶解，造成焊点的失效，从而影响电子产品的使用寿命和可靠性。
微电子封装中，由于外层封装材料与PCB板之间存在热膨胀系数不匹配的问题，所以当环境温度过高容易造成焊点失效。增加焊点高度能够有效的释放积累的热应力，从而改善这一问题，然而对应焊点的电学性能会随着焊点尺寸的增加而下降。通过用焊料包裹一个硬质的核形成核壳复合焊点能够兼顾上述两种性能。传统核壳焊点有两种：塑料核和铜核。但由于塑料不能导电，在大电流的情况下容易导致包裹的焊料电流过大，造成电迁移失效。并且，铜核相对于塑料核具有更加优良的电导率、热导率和机械强度。此外，铜的熔点远高于传统锡基焊料，所以在焊接过程中保持固态，作为间隔物保证焊点的高度以及芯片与基板的共面性，从而提高其热疲劳寿命。因此，通过采用锡基铜核焊球作为球栅阵列封装材料是十分必要的。然而，由于锡在铜球表面的润湿性较差，锡基铜核焊球难以通过传统手段直接将铜核与锡基焊料结合。
发明内容
本发明的目的在于提供一种铜球表面化学镀锡的方法。通过化学镀的方法将铜球表面镀锡来解决铜球与锡基焊料结合较差的问题。
为实现上述目的，本发明提供了如下技术方案：
本发明技术方案之一：提供一种铜球表面化学镀锡的方法，包括以下步骤：
先利用盐酸乙醇溶液对铜球表面进行酸洗并酸化，然后除去铜球表面的盐酸乙醇溶液，再对铜球表面进行化学镀锡。
本发明通过对铜球表面进行酸洗并酸化，为铜球提供表面活性，使Sn盐溶液中的Sn能够在铜球表面以单质析出。
优选地，所述盐酸乙醇溶液由盐酸、乙醇和乙二醇混合得到，其中盐酸、乙醇和乙二醇的用量比为1mL:19mL:0.1g。
优选地，所述酸洗并酸化具体为：将所述铜球置于所述盐酸乙醇溶液中超声，完成酸洗并酸化的过程；更优选地，酸洗并酸化的时间为10min。
优选地，所述化学镀锡所用锡镀液的配制步骤包括：将亚磷酸钠、硫脲、对苯二酚和乙二胺四乙酸溶于水中，再加入甲烷磺酸和乙二醇，得到溶液A；将甲基烷酸锡溶解于盐酸中，得到溶液B；将所述溶液A与溶液B混合，得到锡镀液。
本发明为保证溶液A中的溶质充分溶解，可以对溶液A进行加热，优选温度为80℃。
更优选地，所述亚磷酸钠、硫脲、对苯二酚、乙二胺四乙酸与水的质量体积比为3.5g:5g:0.01g:0.04g:100mL；所述甲烷磺酸、乙二醇与水的体积比为0.4:1.7:100；所述甲基烷酸锡、盐酸与水的体积比为5:3:100。
优选的，所述化学镀锡在25℃下进行；时间优选为15min。
本发明可以通过控制化学镀锡的时间，以获得镀锡厚度不同的镀锡铜球。
本发明技术方案之二：提供一种根据上述铜球表面化学镀锡的方法制得的镀锡铜球。
本发明技术方案之三：提供一种锡基铜核焊球的制备方法，包括以下步骤：将上述镀锡铜球的锡镀层均匀化，然后与锡基焊料加热重溶，得到锡基铜核焊球。
本发明加热重溶的温度控制在铜球的熔点以下，可通过控制锡基焊料的加入量以获得不同锡层厚度的锡基铜核焊球。
优选地，使镀锡铜球的锡镀层均匀化的操作为将所述镀锡铜球研磨、抛光，完成锡镀层的均匀化。
优选地，加热重溶后还包括研磨和抛光步骤，以获得锡层均匀的锡基铜核焊球。
本发明技术方案之四：提供一种根据上述锡基铜核焊球的制备方法制得的锡基铜核焊球。
本发明的有益技术效果如下：
本发明基于铜球与锡基焊料的结合较差的问题，通过先对铜球表面进行化学镀锡，其关键步骤在于铜球表面的酸洗并酸化，该操作可以改善铜球与锡镀层的结合性能，进一步以锡镀层为过渡，解决了铜球与锡基焊料结合较差的问题。本发明可通过SEM技术测定铜球表面镀敷材料的厚度，且通过EDS技术确定了铜球表面镀敷材料的成分为锡。
本发明提供的制备方法工艺简单，成本低廉，可制作出镀敷材料厚度可控的镀锡铜球。
附图说明
图1为实施例1中镀锡铜球SEM图片。
图2为实施例1中镀锡铜球EDS图片。
图3为实施例1所制得锡基铜核焊球SEM图片。
图4为对比例1所制得锡基铜核焊球的金相照片。
具体实施方式
现详细说明本发明的多种示例性实施方式，该详细说明不应认为是对本发明的限制，而应理解为是对本发明的某些方面、特性和实施方案的更详细的描述。应理解本发明中所述的术语仅仅是为描述特别的实施方式，并非用于限制本发明。
另外，对于本发明中的数值范围，应理解为还具体公开了该范围的上限和下限之间的每个中间值。在任何陈述值或陈述范围内的中间值，以及任何其他陈述值或在所述范围内的中间值之间的每个较小的范围也包括在本发明内。这些较小范围的上限和下限可独立地包括或排除在范围内。
除非另有说明，否则本文使用的所有技术和科学术语具有本发明所述领域的常规技术人员通常理解的相同含义。虽然本发明仅描述了优选的方法和材料，但是在本发明的实施或测试中也可以使用与本文所述相似或等同的任何方法和材料。
关于本文中所使用的“包含”、“包括”、“具有”、“含有”等等，均为开放性的用语，即意指包含但不限于。
实施例1
锡基铜核焊球的制备：
(1)称取3.5g亚磷酸钠、5g硫脲、0.01g对苯二酚和0.04g乙二胺四乙酸加入到100ml去离子水中，电磁搅拌至溶解，转速100rpm；再滴入0.4mL甲烷磺酸和0.7mL乙二醇溶液，80℃水浴加热，并且电磁搅拌，转速为100rpm，得到溶液A；
(2)制备20mL盐酸-乙醇溶液(体积比＝1:19)，称取0.1g乙二醇加入到盐酸-乙醇溶液中，搅拌至溶解备用；
(3)称取4g直径为250μm的铜球，使用(2)中溶液在超声清洗机中清洗并酸化10min；
(4)将清洗后的铜球用去离子水在超声清洗机中反复清洗5次；
(5)称量5mL甲基烷酸锡加入至3mL盐酸中，搅拌至溶解，得到溶液B；
(6)将溶液B倒入溶液A中，保持电磁搅拌，转速100rpm，将水浴温度降低至25℃，得到溶液C；
(7)将(4)中铜球倒入溶液C中，保持电磁搅拌，转速200rpm，保持25℃水浴加热，反应时间为15min；
(8)将(7)中反应结束后的铜球用乙醇溶液在超声清洗机清洗后备用；
(9)研磨(8)中铜球至最大横截面(通过测量铜球的直径可以得到最大截面，需要在研磨过程中使用显微镜反复测量确认)，并进行抛光，最终获得镀锡铜球；
所制备的镀锡铜球SEM图片见图1，EDS图片见图2(左图为Cu的EDS图片，右图为Sn的EDS图片)；根据图1和图2中能够确定，铜球表面镀敷材料厚度为2.37μm以及镀敷材料的成分为Sn。
(10)将(9)中的镀锡铜球与Sn-3.0Ag-0.5Cu焊球共同放在带有凹坑的铝板中，260℃加热重熔结合成锡基铜核焊球；
(11)研磨(10)中锡基铜核焊球至最大横截面，并进行抛光，最终得到锡层厚度为25μm的锡基铜核焊球，其SEM图片见图3。
对比例1
锡基铜核焊球的制备：
(1)制备20mL盐酸-乙醇溶液(体积比＝1:19)，称取0.1g乙二醇加入到盐酸-乙醇溶液中，搅拌至溶解备用；
(2)称取4g直径为250μm的铜球，使用(1)中溶液在超声清洗机中清洗并酸化10min；
(3)将清洗后的铜球用去离子水在超声清洗机中反复清洗5次；
(4)将(3)中的铜球与Sn-3.0Ag-0.5Cu焊球共同放在带有凹坑的铝板中，260℃加热重熔结合成锡基铜核焊球。
所得锡基铜核焊球的金相照片见图4，从图中能够看出，所得锡基铜核焊球的锡层并不能完全包裹铜层，为不合格产品。
对比例2
锡基铜核焊球的制备：
与实施例1相比，区别仅在于，将步骤(2)中的盐酸乙醇溶液替换为市售的铜材油污清洗剂(主要成分为氢氧化钠、碳酸钠、三乙醇胺、三聚磷酸钠、焦磷酸钠、月桂酸二乙醇酰胺和水)，其他步骤与实施例1相同。
该对比例在化学镀锡阶段出现锡层生长不均，结合力不强的问题，因而未进行后续操作。
以上所述的实施例仅是对本发明的优选方式进行描述，并非对本发明的范围进行限定，在不脱离本发明设计精神的前提下，本领域普通技术人员对本发明的技术方案做出的各种变形和改进，均应落入本发明权利要求书确定的保护范围内。

Claims (10)

1.一种铜球表面化学镀锡的方法，其特征在于，包括以下步骤：先利用盐酸乙醇溶液对铜球表面进行酸洗并酸化，然后除去铜球表面的盐酸乙醇溶液，再对铜球表面进行化学镀锡。
2.根据权利要求1所述的铜球表面化学镀锡的方法，其特征在于，所述盐酸乙醇溶液由盐酸、乙醇和乙二醇混合得到，其中盐酸、乙醇和乙二醇的用量比为1mL:19mL:0.1g。
3.根据权利要求1所述的铜球表面化学镀锡的方法，其特征在于，所述酸洗并酸化具体为：将所述铜球置于所述盐酸乙醇溶液中超声，完成酸洗并酸化的过程。
4.根据权利要求1所述的铜球表面化学镀锡的方法，其特征在于，所述化学镀锡所用锡镀液的配制步骤包括：将亚磷酸钠、硫脲、对苯二酚和乙二胺四乙酸溶于水中，再加入甲烷磺酸和乙二醇，得到溶液A；将甲基烷酸锡溶解于盐酸中，得到溶液B；将所述溶液A与溶液B混合，得到锡镀液。
5.根据权利要求4所述的铜球表面化学镀锡的方法，其特征在于，所述亚磷酸钠、硫脲、对苯二酚、乙二胺四乙酸与水的质量体积比为3.5g:5g:0.01g:0.04g:100mL；所述甲烷磺酸、乙二醇与水的体积比为0.4:1.7:100；所述甲基烷酸锡、盐酸与水的体积比为5:3:100。
6.根据权利要求1所述的铜球表面化学镀锡的方法，其特征在于，所述化学镀锡在25℃下进行。
7.一种根据权利要求1-6任一项所述铜球表面化学镀锡的方法制得的镀锡铜球。
8.一种锡基铜核焊球的制备方法，其特征在于，包括以下步骤：将权利要求7所述镀锡铜球的锡镀层均匀化，然后与锡基焊料加热重溶，得到锡基铜核焊球。
9.根据权利要求8所述的锡基铜核焊球的制备方法，其特征在于，加热重溶后还包括研磨和抛光步骤，以获得锡层均匀的锡基铜核焊球。
10.一种根据权利要求8或9所述锡基铜核焊球的制备方法制得的锡基铜核焊球。
CN202310824346.2A 2023-07-06 2023-07-06 一种铜球表面化学镀锡的方法 Pending CN116855923A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310824346.2A CN116855923A (zh) 2023-07-06 2023-07-06 一种铜球表面化学镀锡的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310824346.2A CN116855923A (zh) 2023-07-06 2023-07-06 一种铜球表面化学镀锡的方法

Publications (1)

Publication Number Publication Date
CN116855923A true CN116855923A (zh) 2023-10-10

Family

ID=88226324

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310824346.2A Pending CN116855923A (zh) 2023-07-06 2023-07-06 一种铜球表面化学镀锡的方法

Country Status (1)

Country Link
CN (1) CN116855923A (zh)

Similar Documents

Publication Publication Date Title
JP2012178349A (ja) 導電性微粒子及び基板構成体
JP2011029395A (ja) 電子部品用複合ボールの製造方法
Njuki et al. Understanding and preventing Cu–Sn micro joint defects through design and process control
CN116855923A (zh) 一种铜球表面化学镀锡的方法
TWI440518B (zh) 多層結構之高溫焊料及其製造方法
CN114043122B (zh) 一种含有Cu@Sn核壳双金属粉高温钎料及其制备方法和应用
JP5108456B2 (ja) 導電性微粒子
CN114974656A (zh) 一种纳米复合低温浆料、制备方法及其应用
CN112894195A (zh) 一种钎焊用低银无铅钎料合金及其制备方法
CN114211069B (zh) 一种基于imc焊盘的多晶结构焊点制取方法
CN114226901B (zh) 一种多双孪晶组和细小晶粒构成的多晶结构焊点生成方法
Anuar et al. Intermetallic Compound Layer Growth at the Interface between Sn-Ag and ENImAg Surface Finish
Yang et al. Interfacial Reaction and Failure Mechanism of SAC/Co-P Solder Joint under Rapid Thermal Fatigue
JP5526997B2 (ja) Ｂｉ系はんだ接合用の電子部品と基板及び電子部品実装基板
WO2004002674A1 (ja) スズ−銀系無鉛はんだ
CN115070031B (zh) Cu@In@Ag核壳结构互连材料及其制备方法
CN115175466B (zh) 一种提升陶瓷覆铜基板表面电镀锡镍合金的焊接方法
US20240002979A1 (en) Printed wiring board, printed circuit board, and electronic component
EP1329911A1 (en) Conductive fine particles, method for plating fine particles, and substrate structural body
CN117328063A (zh) 一种高熵铜核球及其制备方法
CN114211067A (zh) 一种通过预制imc焊盘形成多晶结构焊点的方法
KR20160080014A (ko) Bi-코팅된 무연 솔더 볼 및 이의 제조방법
CN117123965A (zh) 一种新型SnBi基复合低温钎料制备方法及其用途
KR101196972B1 (ko) 전자부품용 복합 볼의 제조방법
CN116037921A (zh) 一种复合金属材料、包含其的高热导率低温钎料膏

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination