CN116852256A - Grinding pad trimming device - Google Patents

Grinding pad trimming device Download PDF

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Publication number
CN116852256A
CN116852256A CN202311058207.XA CN202311058207A CN116852256A CN 116852256 A CN116852256 A CN 116852256A CN 202311058207 A CN202311058207 A CN 202311058207A CN 116852256 A CN116852256 A CN 116852256A
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CN
China
Prior art keywords
polishing pad
dressing
unit
current signal
surface roughness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311058207.XA
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Chinese (zh)
Inventor
戴文俊
黄仁东
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Shanghai IC R&D Center Co Ltd
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Shanghai IC R&D Center Co Ltd
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Priority to CN202311058207.XA priority Critical patent/CN116852256A/en
Publication of CN116852256A publication Critical patent/CN116852256A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention provides a polishing pad dressing device, which comprises a detection unit, a control unit and a dressing unit; the detection unit comprises a first piezoelectric probe, a second piezoelectric probe and a third piezoelectric probe, wherein the first piezoelectric probe is used for contacting with a plurality of areas of the polishing pad to generate a first current signal representing the surface roughness of each area of the polishing pad; the control unit is used for receiving the first current signal and judging whether the surface roughness of each area of the polishing pad accords with the standard by judging whether the first current signal is in a set standard interval, if not, a first instruction and the position information of the corresponding area of the polishing pad are sent to the trimming unit so that the trimming unit trims the corresponding area of the polishing pad, the surface roughness of the polishing pad is always kept in a normal use state, the process capability of chemical mechanical polishing is improved, the normal operation time is prolonged, and the shutdown maintenance time is reduced.

Description

Grinding pad trimming device
Technical Field
The invention relates to the technical field of integrated circuit manufacturing, in particular to a polishing pad trimming device.
Background
In recent years, with the upgrading of wafer processing technology and the shrinking of the sizes of wires and gates, the requirement of photolithography on the surface flatness of the wafer is increasing, so chemical-mechanical polishing (CMP) process is widely used and becomes an essential part of the semiconductor process flow.
In the existing chemical mechanical polishing process, a polishing table rotates to drive a polishing pad to rotate, a surface to be polished of a wafer to be polished is pressed on the polishing pad and rotates relative to the polishing pad, and meanwhile, polishing liquid is supplied to the surface of the polishing pad, so that uneven deposition layers on the wafer are quickly removed by utilizing chemical reaction provided by the polishing liquid and mechanical polishing effect generated by the pressing of the wafer under the polishing head, planarization is completed, wherein the roughness of the surface of the polishing pad greatly influences the working capacity and the normal operation time of the machine, the surface of the polishing pad is excessively flat and is unfavorable for the normal process, the service life of the polishing pad is further reduced due to the excessively rough surface of the polishing pad, and the shutdown maintenance time is prolonged.
Disclosure of Invention
The present invention provides a polishing pad dressing device to solve the problem that the surface roughness of the polishing pad cannot be maintained in a proper range, which affects the normal chemical mechanical polishing process or affects the service life of the polishing pad.
In order to solve the above technical problems, the present invention provides a polishing pad dressing apparatus, comprising: the device comprises a detection unit, a control unit and a trimming unit; the detection unit comprises a first piezoelectric probe for contacting with a plurality of areas of the polishing pad to generate a first current signal capable of characterizing the surface roughness of each area of the polishing pad; the control unit is used for receiving the first current signal from the detection unit, judging whether the surface roughness of each area of the polishing pad meets the standard by judging whether the received first current signal is in a set standard interval, and if not, sending a first instruction and position information of the corresponding area of the polishing pad to the trimming unit; and the dressing unit is used for dressing the corresponding area of the grinding pad when the first instruction and the position information are received.
Preferably, in the polishing pad dressing device, the plurality of regions of the polishing pad include a plurality of annular regions centered around the center of the polishing pad, and the plurality of annular regions are sequentially arranged in a distance from the center of the polishing pad and form a full region of the polishing pad.
Preferably, in the polishing pad dressing apparatus, the first piezoelectric probe has a movable end and a fixed end, and the first piezoelectric probe swings around the fixed end located outside the polishing pad so that the movable end contacts each region of the polishing pad, and detects the surface roughness of each region of the polishing pad as the polishing pad rotates.
Preferably, in the polishing pad dressing apparatus, the first piezoelectric probe performs a reciprocating swing motion, and the swing angle is gradually increased or gradually decreased, or the first piezoelectric probe performs a stepping swing motion, so that the movable end contacts each region of the polishing pad, and the surface roughness of each region of the polishing pad is detected as the polishing pad swings.
Preferably, in the polishing pad dressing device, the first piezoelectric probe is stopped when swinging to the surface of the polishing pad, and the stopping time is at least the time of one rotation of the polishing pad.
Preferably, in the polishing pad dressing device, the detecting unit further includes a second piezoelectric probe, the second piezoelectric probe is used for contacting with the corresponding region of the polishing pad to generate a second current signal while the dressing unit is dressing the corresponding region of the polishing pad, and transmitting the second current signal to the control unit, the control unit determines whether the second current signal is within the set standard interval to determine whether the surface roughness of the corresponding region of the polishing pad meets the standard, if not, a second instruction is sent to the dressing unit, and the dressing unit adjusts the dressing parameter according to the second instruction and dresses the corresponding region of the polishing pad based on the adjusted dressing parameter.
Preferably, in the polishing pad dressing device, the dressing parameter includes dressing pressure and/or dressing time.
Preferably, in the polishing pad dressing apparatus, the second piezoelectric probe and the dressing unit are disposed on the same mechanical arm.
Preferably, in the polishing pad dressing apparatus, further comprising: the control unit is also used for sending a stop instruction to the detection unit and the trimming unit when judging that the surface roughness of each area meets the standard, and the detection unit and the trimming unit stop working when receiving the stop instruction.
Preferably, in the polishing pad dressing device, the detecting unit further includes a signal amplifying and converting module and a signal analyzing module; the signal amplification and conversion module is used for receiving the current signal, amplifying the current signal, obtaining a current waveform matched with the surface roughness of each area of the polishing pad, and converting the current signal in an analog signal form into the current signal in a digital signal form; the signal analysis module is used for receiving the current signal in a digital form and analyzing and obtaining surface roughness data corresponding to each region of the polishing pad.
In summary, the present invention provides a polishing pad dressing apparatus, comprising: the device comprises a detection unit, a control unit and a trimming unit; the detection unit comprises a first piezoelectric probe for contacting with a plurality of areas of the polishing pad to generate a first current signal capable of characterizing the surface roughness of each area of the polishing pad; the control unit is used for receiving the first current signal from the detection unit, judging whether the surface roughness of each area of the polishing pad meets the standard by judging whether the received first current signal is in a set standard interval, and if not, sending a first instruction and position information of the corresponding area of the polishing pad to the trimming unit; and the dressing unit is used for dressing the corresponding area of the grinding pad when the first instruction and the position information are received.
Compared with the prior art, the invention has the following beneficial effects:
1. the first piezoelectric probes are contacted with the polishing pads with different roughness to generate different first current signals, whether the surface roughness of each area of the polishing pad meets the standard is judged through the first current signals, if not, the surface roughness of the corresponding area is trimmed by the trimming unit, so that the surface roughness of the polishing pad is always kept in a normal use state, the process capability of chemical mechanical polishing is improved, the normal operation time is prolonged, and the shutdown maintenance time is reduced;
2. the inner and outer wear of the polishing pad is different due to the difference of the inner and outer linear speeds of the polishing pad, and the polishing pad is divided into a plurality of areas, so that specific areas of the surface roughness of the polishing pad can be detected in a targeted manner.
Drawings
Fig. 1 to 2 are a top view and a side view of a polishing pad dressing apparatus according to a first embodiment of the present invention;
FIG. 3 is a schematic diagram illustrating the internal and external loss of a polishing pad according to an embodiment of the present invention;
fig. 4 to 5 are a top view and a side view of a polishing pad dressing apparatus according to a second embodiment of the present invention;
wherein, each reference sign is:
10-a detection unit; 20-finishing unit; 30-a polishing pad;
11-a first piezoelectric probe; 12-a second piezoelectric probe;
111-active end; 112-a fixed end;
41-medial region; 42-lateral region.
Detailed Description
The key idea of the embodiment of the invention is to provide a polishing pad dressing device and a polishing pad dressing method, so that the surface roughness of a polishing pad is always kept within a reasonable use range under the action of a dressing device, thereby improving the process capability of chemical mechanical polishing, improving the normal running time and reducing the shutdown maintenance time.
Based on the core idea, the embodiment of the invention provides a polishing pad dressing device and a polishing pad dressing method. Further details are provided below in conjunction with the drawings and the detailed description. It should be noted that the drawings are in a very simplified form and are all to a non-precise scale, merely for convenience and clarity in aiding in the description of embodiments of the invention. Furthermore, the structures shown in the drawings are often part of actual structures. In particular, the drawings are shown with different emphasis instead being placed upon illustrating the various embodiments.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise. The terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; the device can be mechanically connected, electrically connected and communicated; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
[ embodiment one ]
Referring to fig. 1 to 2, a polishing pad dressing apparatus according to a first embodiment includes: a detection unit 10, a control unit and a trimming unit 20; the detection unit 10 comprises a first piezoelectric probe 11, wherein the first piezoelectric probe 11 is used for contacting with a plurality of areas of the polishing pad 30 to generate a first current signal capable of representing the surface roughness of each area of the polishing pad 30; the control unit is configured to receive the first current signal from the detection unit 10, determine whether the surface roughness of each area of the polishing pad 30 meets a standard by determining whether the received first current signal is within a set standard interval, and if not, send a first instruction and position information of the corresponding area of the polishing pad 30 to the dressing unit 20; and the dressing unit 20 is configured to, upon receiving the first instruction and the position information, dress a corresponding region of the polishing pad 30.
The contact of the first piezoelectric probe 11 with the polishing pad 30 with different roughness can generate different first current signals, and the first current signals are used for judging whether the surface roughness of each area of the polishing pad 30 meets the standard or not, if not, the surface roughness of the corresponding area is trimmed by the trimming unit 20, so that the surface roughness of the polishing pad 30 is always kept in a normal use state, the process capability of chemical mechanical polishing is improved, the normal running time is prolonged, and the shutdown maintenance time is reduced; further, the specific area of the surface roughness of the polishing pad 30 can be detected specifically by dividing the polishing pad 30 into a plurality of areas, which are different in the inside and outside wear of the polishing pad 30 due to the difference in the inside and outside linear velocity of the polishing pad 30.
The first piezoelectric probe 11 is capable of mutually converting mechanical energy and electrical energy, and is slightly deformed when being contacted with the polishing pad 30 under the action of mechanical stress, so that the relative displacement of the centers of positive and negative charges inside is caused to generate polarization, and bound charges with opposite signs are generated on the surfaces of two ends of the material. Thus, when the first piezoelectric probe 11 contacts the polishing pad 30 having different surface roughness, a differential current signal is generated, and preferably, in this embodiment, the first piezoelectric probe 11 contacts a location and generates the first current signal, which is indicative of the surface roughness of the location.
Further, since the first piezoelectric probe 11 generates the first current signal under the action of mechanical stress, in some embodiments, the first piezoelectric probe 11, when contacting the polishing pad 30, relies on its own gravity, the polishing pad 30 provides a reaction force to the first piezoelectric probe 11 to generate the first current signal, so that no pressure needs to be applied to the first piezoelectric probe 11, and no pressure applied to the first piezoelectric probe 11 needs to be controlled to be equal when detecting each area of the polishing pad 30, so that the operation is convenient; in other embodiments, considering that the greater the mechanical stress, the stronger the first current signal generated by the first piezoelectric probe 11, and preferably, a pressure is applied to the first piezoelectric probe 11, and the first piezoelectric probe 11 contacts the surface of the polishing pad 30, the stronger the current signal generated at this time, and the more intuitive the current waveform chart obtained later.
Further, the first piezoelectric probe 11 is vertically contacted with the surface of the polishing pad 30, so as to avoid the influence of the angle between the first piezoelectric probe 11 and the polishing pad 30 on the accuracy of the obtained current signal.
For the convenience of detection, the polishing pad 30 is divided into a plurality of regions, and as can be seen from fig. 1, the plurality of regions of the polishing pad 30 are a plurality of annular regions centered on the center of the polishing pad 30, and the plurality of annular regions are sequentially arranged in a distance from the center of the polishing pad 30 to form a polishing surface region of the polishing pad 30.
Typically, the polishing pad 30 is circular in shape, so that a plurality of the annular regions may constitute exactly the full area of the polishing pad 30.
It will be appreciated that the area of one of the annular regions is equal to the area of the contact surface of the first piezoelectric probe 11 with the polishing pad 30 around the center of the polishing pad 30.
In some application scenarios, it is desirable that the surface roughness of the entire area of the polishing pad 30 is detected by the first piezoelectric probe 11, and the generated first current signal is sent to the control unit in real time, after the surface roughness of the entire area of the polishing pad 30 is detected by the first piezoelectric probe 11, the control unit determines whether the first current signal received in real time during the detection of the first piezoelectric probe 11 is within the standard interval set in the control unit, if not, sends a first instruction and position information of the corresponding area of the polishing pad 30 to the trimming unit 20, and the trimming unit 20 trims the corresponding area of the polishing pad 30; if so, a stop command is sent to the detection unit 10, and the detection unit 10 stops detection when receiving the stop command, and at this time, the first piezoelectric probe 11 stops detection and is separated from the surface of the polishing pad 30.
It is understood that the corresponding area of the polishing pad 30 is the area to be modified.
Optionally, the dressing unit 20 is a dresser.
In other application scenarios, since the linear velocity of the polishing pad 30 is greater at the edge position of the polishing pad 30 during polishing, the polishing liquid at the edge position is less likely to stay on the polishing pad 30 during polishing, and excessive loss of the polishing pad 30 is caused, as shown in fig. 3, in which the polishing loss of the outer region 42 of the polishing pad is more serious than that of the inner region 41. The correction parameters of the dressing unit 20 for different areas of the polishing pad 30 are kept unchanged, so that the dressing effect of the dressing unit on different areas of the polishing pad 30 is the same, that is, the dressing effect of the dressing unit on the surface roughness of different areas of the polishing pad 30 is uniform, so that as the service time of the polishing pad 30 is prolonged, the instability difference of the polishing rate is larger and larger, thereby not meeting the requirements of the chemical mechanical polishing process, but further causing the reduction of the service life of the polishing pad 30, and therefore, the area division detection of the surface roughness of the polishing pad 30 dressed by the dressing unit 20 is necessary.
In order to intuitively compare the surface roughness of the inner area 41 and the outer area 42 of the polishing pad 30, in this embodiment, the detecting unit 10 further includes a signal amplifying and converting module and a signal analyzing module; the signal amplification and conversion module is configured to receive the current signal and amplify the current signal to obtain a current waveform that matches the surface roughness of each region of the polishing pad 30, and convert the current signal in an analog signal form into the current signal in a digital signal form; the signal analysis module is configured to receive the current signal in digital form, and analyze and obtain surface roughness data corresponding to each region of the polishing pad 30. That is, the polishing pad conditioning apparatus provided in this embodiment can compare the current waveforms of the inner region 41 and the outer region 42 of the polishing pad 30, and further analyze the specific surface roughness data difference between the inner region 41 and the outer region 42 of the polishing pad 30.
In an alternative embodiment, in an application scenario where the surface roughness of the entire area of the polishing pad 30 needs to be detected, the control unit may not only compare the first current signal received in real time with the standard interval set in the control unit, but also convert the first current signal into the surface roughness data, and set a standard roughness data interval in the control unit, so as to determine whether the surface roughness of the area of the polishing pad 30 meets the standard. The standard interval may be a current signal obtained by detecting the polishing pad 30 with the detecting unit 10, wherein the current signal is capable of representing the surface roughness of the polishing pad 30, the minimum value of the obtained current signal is used as the minimum value of the standard interval, and the maximum value of the obtained current signal is used as the maximum value of the standard interval.
When the polishing pad conditioning apparatus is applied to the detection of a specified region of the polishing pad 30, the standard interval may be a surface roughness of other regions of the same polishing pad 30 detected by the detection unit 10, the obtained current signal may be a current signal capable of characterizing the surface roughness of other regions, and the minimum value of the obtained current signal may be taken as the minimum value of the standard interval, and the maximum value of the obtained current signal may be taken as the maximum value of the standard interval.
Further, the standard interval may be an interval where a current signal indicating that the polishing pad 30 is in a normal operation state is obtained by a person skilled in the art according to previous experience accumulated for the polishing pad 30.
In this embodiment, in the application scenario of performing the full area detection on the polishing pad 30, the first piezoelectric probe 11 may contact each area on the surface of the polishing pad 30, and in the application scenario of performing the zone detection on the inner area 41 or the outer area 42 of the polishing pad 30, the first piezoelectric probe 11 may detect the designated area of the polishing pad 30 in a targeted manner.
For the above-mentioned detection purpose, preferably, the first piezoelectric probe has a movable end 111 and a fixed end 112, and the first piezoelectric probe swings around the fixed end 112 located outside the polishing pad 30, so that the movable end 111 contacts each region of the polishing pad 30, and detects the surface roughness of each region of the polishing pad 30 as the polishing pad 30 rotates.
Further, the first piezoelectric probe 11 performs a reciprocating swing motion, and the swing angle is gradually increased or gradually decreased, or the first piezoelectric probe 11 performs a stepping swing motion, so that the movable end 111 contacts each region of the polishing pad 30, and detects the surface roughness of each region of the polishing pad 30 along with the swing of the polishing pad 30.
Specifically, the first piezoelectric probe 11 has an initial position, and when the first piezoelectric probe 11 is located at the initial position, the first piezoelectric probe 11 is not in contact with the polishing pad 30. As the angle at which the first piezoelectric probe 11 swings gradually increases or gradually decreases, the piezoelectric probe contacts each region of the polishing pad 30 and gradually approaches the center of the polishing pad 30 or gradually moves away from the center of the polishing pad 30; alternatively, as the polishing pad 30 performs a step-and-swing motion, it is sequentially contacted with a plurality of regions of the polishing pad 30.
It will be appreciated that the area of the polishing pad 30 contacted by each oscillation of the first piezoelectric probe 11 is different.
When the first piezoelectric probe 11 performs a step-and-swing motion, in an alternative embodiment, the first piezoelectric probe 11 is lifted up after detecting the surface roughness of a region, and swings by an angle on the basis of the detected surface roughness of the region, so that the first piezoelectric probe 11 moves to the upper side of the next region and then descends to contact with the polishing pad 30, so as to detect the surface roughness of the region. In a preferred embodiment, the first piezoelectric probe 11 directly performs the swinging motion after detecting the surface roughness of a region, so that the first piezoelectric probe 11 is shifted to the next region by sliding contact with the surface of the polishing pad 30 to detect the surface roughness of the region, and the first piezoelectric probe 11 is shifted to a different detection region in this way, without performing the steps of "lifting" and "lowering", simply and directly, simplifying the detection steps.
Please refer to "s" in fig. 1, which is a motion trace of the first piezoelectric probe 11 on the polishing pad 30.
Further, in order to ensure that the first piezoelectric probe 11 detects all areas of the polishing pad 30, it is preferable that the first piezoelectric probe 11 is stopped when swinging to the surface of the polishing pad 30, and the stopping time is at least one rotation time of the polishing pad 30.
In general, the rotation speed of the polishing pad 30 is constant during the inspection and dressing, and thus, it is possible to confirm the time during which the first piezoelectric probe 11 is stopped on the surface of the polishing pad 30 at that position and waits for the polishing pad 30 to rotate one turn by confirming the distance between the first piezoelectric probe 11 and the center of the polishing pad 30.
[ example two ]
The second embodiment differs from the first embodiment in that: the second piezoelectric probe 12 is added so that the trimming unit 20 can also detect whether the trimmed area meets the standard while trimming.
Referring to fig. 4 to 5, the detecting unit 10 further includes a second piezoelectric probe 12, where the second piezoelectric probe 12 is configured to contact with the corresponding region of the polishing pad 30 to generate a second current signal while the dressing unit 20 is dressing the corresponding region of the polishing pad 30, and transmit the second current signal to the control unit, and the control unit determines whether the second current signal is within the set standard interval to determine whether the surface roughness of the corresponding region of the polishing pad 30 meets the standard, and if not, sends a second instruction to the dressing unit 20, and the dressing unit 20 adjusts a dressing parameter according to the second instruction and dresses the corresponding region of the polishing pad 30 based on the adjusted dressing parameter.
Further, the second piezoelectric probe 12 and the trimming unit 20 are disposed on the same mechanical arm, so that the second piezoelectric probe 12 can timely and pertinently detect the surface roughness of the area trimmed by the trimming unit 20.
By adding the second piezoelectric probe 12, the working method of the polishing pad 30 trimming device is as follows: since the polishing pad 30 dressing device is described in detail in the first embodiment in determining whether the polishing pad 30 needs to be dressed, the description is omitted here. The dressing unit 20, upon receiving the first command and the position information, performs dressing on the corresponding region of the polishing pad 30, and at the same time, contacts the second piezoelectric probe 12 disposed on the same mechanical arm as the dressing unit 20 with the corresponding region of the polishing pad 30, and generates the second current signal, which characterizes the surface roughness of the dressed corresponding region of the polishing pad 30. The control unit receives the second current signal, and determines whether the second current signal is within the set standard interval, and further determines whether the surface roughness of the corresponding area of the polishing pad 30 meets the standard, if not, a second instruction is sent to the trimming unit 20, the trimming unit 20 adjusts the trimming parameter according to the second instruction, and trims the corresponding area of the polishing pad 30 based on the adjusted trimming parameter, and similarly, the second piezoelectric probe 12 detects the surface roughness of the corresponding area of the polishing pad 30 after trimming in real time during trimming until the surface roughness of the corresponding area of the polishing pad 30 meets the standard; if the standard is met, a stop instruction is sent to the detection unit 10 and the trimming unit 20, and the detection unit 10 and the trimming unit 20 stop working when receiving the stop instruction.
In particular, the trimming parameters include trimming pressure and/or trimming time. If the second piezo-electric probe 12 detects that the surface roughness of the corresponding area is too small, the trimming parameters may be adjusted, including: increasing the dressing pressure and/or the dressing time to increase the surface roughness of the corresponding region; if the second piezo-electric probe 12 detects that the surface roughness of the corresponding area is too large, the trimming parameters may be adjusted, including: reducing the dressing pressure and/or shortening the dressing time to reduce the surface roughness of the corresponding region.
It will be appreciated that the mode of operation of the second piezoelectric probe 12 as detected by the dressing unit 20 may also be adapted to dressing the full area of the polishing pad 30.
In the application scenario of the full-area dressing of the polishing pad 30, the dressing unit 20 may receive the plurality of position information sent by the control unit, and when the second piezoelectric probe 12 detects that the surface roughness at a position meets the standard while dressing a position, the dressing unit 20 may call the next position information, and perform dressing again, so as to reciprocate.
In summary, an embodiment of the present invention provides a polishing pad dressing apparatus, including: the device comprises a detection unit, a control unit and a trimming unit; the detection unit comprises a first piezoelectric probe for contacting with a plurality of areas of the polishing pad to generate a first current signal capable of characterizing the surface roughness of each area of the polishing pad; the control unit is used for receiving the first current signal from the detection unit, judging whether the surface roughness of each area of the polishing pad meets the standard by judging whether the received first current signal is in a set standard interval, and if not, sending a first instruction and position information of the corresponding area of the polishing pad to the trimming unit; and the dressing unit is used for dressing the corresponding area of the grinding pad when the first instruction and the position information are received. The first piezoelectric probes are contacted with the polishing pads with different roughness to generate different first current signals, whether the surface roughness of each area of the polishing pad meets the standard is judged through the first current signals, if not, the surface roughness of the corresponding area is trimmed by the trimming unit, so that the surface roughness of the polishing pad is always kept in a normal use state, the process capability of chemical mechanical polishing is improved, the normal operation time is prolonged, and the shutdown maintenance time is reduced; the inner and outer wear of the polishing pad is different due to the difference of the inner and outer linear speeds of the polishing pad, and the polishing pad is divided into a plurality of areas, so that the designated area of the surface roughness of the polishing pad can be detected in a targeted manner.
It should also be appreciated that while the present application has been disclosed in the context of a preferred embodiment, the above embodiment is not intended to limit the present invention. Many possible variations and modifications of the disclosed technology can be made by anyone skilled in the art without departing from the scope of the technology, or the technology can be modified to be equivalent. Therefore, any simple modification, equivalent variation and modification of the above embodiments according to the technical substance of the present invention still fall within the scope of the technical solution of the present invention.

Claims (10)

1. A polishing pad conditioning apparatus, comprising: the device comprises a detection unit, a control unit and a trimming unit;
the detection unit comprises a first piezoelectric probe for contacting with a plurality of areas of the polishing pad to generate a first current signal capable of characterizing the surface roughness of each area of the polishing pad;
the control unit is used for receiving the first current signal from the detection unit, judging whether the surface roughness of each area of the polishing pad meets the standard by judging whether the received first current signal is in a set standard interval, and if not, sending a first instruction and position information of the corresponding area of the polishing pad to the trimming unit; the method comprises the steps of,
the dressing unit is used for dressing the corresponding area of the grinding pad when the first instruction and the position information are received.
2. The polishing pad conditioning apparatus according to claim 1, wherein the plurality of regions of the polishing pad include a plurality of annular regions centered around a center of the polishing pad, the plurality of annular regions being arranged in order from a distance from the center of the polishing pad and constituting a full region of the polishing pad.
3. The polishing pad conditioning apparatus of claim 1 wherein said first piezoelectric probe has a movable end and a fixed end, said first piezoelectric probe being oscillated about said fixed end outside said polishing pad to bring said movable end into contact with each region of said polishing pad and to detect the surface roughness of each region of said polishing pad as said polishing pad rotates.
4. The polishing pad conditioning apparatus according to claim 3, wherein the first piezoelectric probe reciprocates with an angle of oscillation that gradually increases or gradually decreases, or the first piezoelectric probe oscillates stepwise so that the movable end contacts each region of the polishing pad and detects the surface roughness of each region of the polishing pad as the polishing pad oscillates.
5. The polishing pad conditioning apparatus of claim 3 wherein the first piezoelectric probe is stopped when it swings to the surface of the polishing pad, and the stopping time is at least one revolution of the polishing pad.
6. The polishing pad dressing apparatus according to claim 1, wherein the detecting unit further comprises a second piezoelectric probe for contacting the corresponding region of the polishing pad to generate a second current signal while the dressing unit is dressing the corresponding region of the polishing pad, and transmitting the second current signal to the control unit, the control unit determining whether the second current signal is within the set standard interval to determine whether the surface roughness of the corresponding region of the polishing pad meets a standard, and if not, transmitting a second instruction to the dressing unit, the dressing unit adjusting a dressing parameter according to the second instruction, and dressing the corresponding region of the polishing pad based on the adjusted dressing parameter.
7. The polishing pad conditioning apparatus of claim 6 wherein the conditioning parameters include conditioning pressure and/or conditioning time.
8. The polishing pad conditioning apparatus of claim 6 wherein the second piezoelectric probe and the conditioning unit are disposed on the same mechanical arm.
9. The polishing pad conditioning device according to claim 1 or 6, further comprising: the control unit is also used for sending a stop instruction to the detection unit and the trimming unit when judging that the surface roughness of each area meets the standard, and the detection unit and the trimming unit stop working when receiving the stop instruction.
10. The polishing pad conditioning device according to claim 1, wherein the detection unit further comprises a signal amplification conversion module and a signal analysis module;
the signal amplification and conversion module is used for receiving a current signal, amplifying the current signal, obtaining a current waveform matched with the surface roughness of each area of the polishing pad, and converting the current signal in an analog signal form into the current signal in a digital signal form;
the signal analysis module is used for receiving the current signal in a digital form and analyzing and obtaining surface roughness data corresponding to each region of the polishing pad.
CN202311058207.XA 2023-08-22 2023-08-22 Grinding pad trimming device Pending CN116852256A (en)

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