CN116851909A - Bessel beam-based femtosecond laser processing system and method - Google Patents
Bessel beam-based femtosecond laser processing system and method Download PDFInfo
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- CN116851909A CN116851909A CN202310861960.6A CN202310861960A CN116851909A CN 116851909 A CN116851909 A CN 116851909A CN 202310861960 A CN202310861960 A CN 202310861960A CN 116851909 A CN116851909 A CN 116851909A
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- 239000000463 material Substances 0.000 claims abstract description 25
- 239000004973 liquid crystal related substance Substances 0.000 claims description 30
- 238000003754 machining Methods 0.000 claims description 13
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- 239000002184 metal Substances 0.000 description 3
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- 238000010146 3D printing Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- Engineering & Computer Science (AREA)
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- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a femtosecond laser processing system and method based on Bessel beams, and relates to the technical field of laser processing. Wherein, the femtosecond laser processing system includes: the device comprises a femtosecond laser, a modulation module, a Bessel beam generating piece and a scanning module which are sequentially arranged, wherein the femtosecond laser is used for emitting Gaussian beams; the modulation module is used for modulating the Gaussian beam to obtain a polarized Gaussian beam; the Bessel beam generator is used for converting the polarized Gaussian beam into a Bessel beam; the scanning module is used for reflecting and transmitting the Bessel light beam so as to enable the reflected and transmitted Bessel light beam to process the working surface of the material to be processed. By implementing the technical scheme of the invention, the problem that the Gaussian beam cannot control the heat deposition around the material is solved, part of heat can be redistributed to a position far away from the center, the thermal gradient is reduced, the thermal profile and microstructure grains are optimized, and the quality of laser processing is improved.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a Bessel-beam-based femtosecond laser processing system and method.
Background
Most of the current high-power laser systems generally output a Gaussian beam, the amplitude of the Gaussian beam is Gaussian in cross section, the intensity is concentrated on an axis and nearby, the Gaussian beam is easy to scatter, and the shape of a light spot is an irregular circle with a beam waist. The problem that the heat deposition around the material to be processed can not be controlled by using Gaussian beams in the metal 3D printing process, the problem that a larger temperature gradient and complex bath instability are generated at the position where laser meets metal powder are caused, strong vapor is generated, a deep cavity, namely a keyhole, is formed in a metal substrate in the construction process, bubbles are generated in the bath by the keyhole, and air holes are formed, so that the mechanical performance of a finished part is reduced, and the quality of laser processing is poor.
Accordingly, in order to solve the above-mentioned problems, the present invention provides a Bessel beam-based femtosecond laser processing system and method capable of improving laser processing quality.
Disclosure of Invention
The invention provides a Bessel beam-based femtosecond laser processing system and a Bessel beam-based femtosecond laser processing method, which aim to solve the problem of poor processing quality of the existing laser.
To achieve the above object, in one aspect, the present invention provides a bessel beam-based femtosecond laser processing system, including: the device comprises a femtosecond laser, a modulation module, a Bessel beam generating piece and a scanning module which are sequentially arranged, wherein the femtosecond laser is used for emitting Gaussian beams; the modulation module is used for modulating the Gaussian beam to obtain a polarized Gaussian beam; the Bessel beam generator is used for converting the polarized Gaussian beam into a Bessel beam; the scanning module is used for reflecting and transmitting the Bessel light beam so as to enable the reflected and transmitted Bessel light beam to process a working surface of a material to be processed.
The further technical scheme is as follows: the femtosecond laser processing system further comprises a main control module, the Bessel beam generating piece is a liquid crystal spatial light modulator, the main control module is used for setting main lobe slope parameters and size parameters in the liquid crystal spatial light modulator, the liquid crystal spatial light modulator comprises a phase calculation module and a main lobe size calculation module, and the phase calculation module and the main lobe size calculation module are used for calculating the phase and the center main lobe size of the Bessel beam respectively according to the main lobe slope parameters and the size parameters.
The further technical scheme is as follows: the modulation module comprises a first modulation piece and a second modulation piece which are sequentially arranged, wherein the first modulation piece is used for modulating the Gaussian beam into a circular polarized Gaussian beam, and the second modulation piece is used for modulating the polarization state of the circular polarized Gaussian beam to obtain the polarized Gaussian beam.
The further technical scheme is as follows: the first modulator is a wave plate, and the second modulator is a polarizer.
The further technical scheme is as follows: the femtosecond laser processing system further comprises a diaphragm arranged between the second modulator and the Bessel beam generator, wherein the diaphragm is used for eliminating stray light in the polarized Gaussian beam.
The further technical scheme is as follows: the first reflecting mirror is arranged between the first modulating piece and the femtosecond laser and is used for steering the Gaussian beam emitted from the femtosecond laser and then emitting the Gaussian beam to the first modulating piece; the second reflector is arranged between the second modulator and the diaphragm and is used for turning the polarized Gaussian beam emitted from the second modulator and then directing the polarized Gaussian beam to the diaphragm.
The further technical scheme is as follows: the femtosecond laser processing system further comprises a beam expanding module, wherein the beam expanding module is arranged between the first reflecting mirror and the femtosecond laser and is used for expanding the Gaussian beam emitted from the femtosecond laser.
The further technical scheme is as follows: the scanning module comprises a reflecting module and a transmitting module which are sequentially arranged, the reflecting module is used for turning the Bessel beam emitted from the Bessel beam generating piece and then directing the Bessel beam to the transmitting module, and the transmitting module is used for focusing the Bessel beam emitted from the reflecting module so as to process a working surface of a material to be processed.
The further technical scheme is as follows: the transmission module is a focusing lens group, the reflection module comprises a motor and a vibrating lens arranged on the motor, and the vibrating lens can form a set movement track according to the rotation of the motor.
In order to achieve the above object, in another aspect, the present invention further provides a method for femtosecond laser processing based on a bessel beam, including: emitting a Gaussian beam by a femtosecond laser; the Gaussian beam is injected into a modulation module to be modulated into a polarized Gaussian beam; the polarized Gaussian beam is emitted into the Bessel beam generating piece and then converted into a Bessel beam; and the Bessel beam is emitted into the scanning module to process the working surface of the material to be processed after being reflected and transmitted.
The embodiment of the invention provides a Bessel-beam-based femtosecond laser processing system and a Bessel-beam-based femtosecond laser processing method, wherein a Gaussian beam emitted by a femtosecond laser is firstly emitted into a modulation module to be modulated into a polarized Gaussian beam; then the polarized Gaussian beam is injected into a Bessel beam generating piece and then converted into a Bessel beam; finally, the Bessel beam is injected into the scanning module to process the working surface of the material to be processed after reflection and transmission, so that the problem that the Gaussian beam cannot control heat deposition around the material is solved, part of heat can be redistributed to a position far away from the center, the thermal gradient is reduced, the thermal profile and microstructure grains are optimized, and the quality of laser processing is improved.
Drawings
FIG. 1 is a block diagram of a Bessel beam-based femtosecond laser machining system according to one embodiment of the invention;
FIG. 2 is a block diagram of a Bessel beam-based femtosecond laser machining system according to another embodiment of the invention;
FIG. 3 is a schematic diagram of a Bessel beam-based femtosecond laser machining system according to one embodiment of the invention;
FIG. 4 is a flow chart of a Bessel beam-based femtosecond laser machining method of the present invention;
reference numerals:
11. a femtosecond laser; 12. a modulation module; 121. a first pod; 122. a second pod; 13. a Bessel beam generator; 14. a scanning module; 141. a reflection module; 142. a transmission module; 15. a main control module; 16. a diaphragm; 17. a first mirror; 18. a second mirror; 19. and a beam expanding module.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, in which like reference numerals represent like components. It will be apparent that the embodiments described below are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Fig. 1 is a block diagram of a bessel beam-based femtosecond laser machining system according to an embodiment of the present invention, as shown in fig. 1, including: a femtosecond laser 11, a modulation module 12, a bessel beam generator 13 and a scanning module 14 which are sequentially arranged, wherein the femtosecond laser 11 is used for emitting Gaussian beams; the modulation module 12 is configured to modulate the gaussian beam to obtain a polarized gaussian beam; the bessel beam generator 13 is configured to convert the polarized gaussian beam into a bessel beam; the scanning module 14 is configured to reflect and transmit the bessel beam, so that the reflected and transmitted bessel beam processes a working surface of a material to be processed. It should be noted that, in this embodiment, the gaussian beam is converted into the bessel beam, because the bessel beam can control the problem of heat deposition around the material, i.e. can redistribute part of the heat to a position far from the center, so as to reduce the thermal gradient, optimize the thermal profile and microstructure grains, and thus improve the quality of laser processing. The intensity distribution of the Bessel beam in the cross section perpendicular to the propagation direction is a central light spot and a plurality of concentric circles, and the Bessel beam has the characteristics of no diffractiveness and no divergence during propagation. The part constructed by using the Bessel beam is denser and stronger than the structure constructed by using the traditional Gaussian beam, has more excellent stretching capability, can reduce the cost brought by subsequent treatment after the part is manufactured by using the Gaussian beam, and saves the manufacturing time.
Referring to fig. 2, fig. 2 is a block diagram of a femtosecond laser processing system based on a bessel beam according to another embodiment of the invention. As shown in fig. 2, the femto-second laser processing system further includes a main control module 15, the bessel beam generating element 13 is a liquid crystal spatial light modulator (SLM, spatial Light Modulator), the main control module 15 is configured to set a main lobe slope parameter and a main lobe size parameter in the liquid crystal spatial light modulator, the liquid crystal spatial light modulator includes a phase calculating module and a main lobe size calculating module, and the phase calculating module and the main lobe size calculating module are configured to calculate a phase and a center main lobe size of the bessel beam according to the main lobe slope parameter and the size parameter. It should be noted that, due to the programmable characteristic, the SLM can dynamically control the amplitude or the phase, and can generate any light field according to different application requirements, so that the SLM has a relatively strong flexibility. The phase distribution of the incident light field can be directly modulated by the phase type SLM according to the difference of the modulation light wave parameters, and in this embodiment, the modulation principle of the phase type SLM is mainly implemented by the birefringence of the liquid crystal molecules, that is, the long axis of the liquid crystal molecules is the optical axis, the long axis and the short axis have different refractive indexes, the incident light is decomposed into two polarized components in orthogonal directions by the liquid crystal molecules, the extraordinary ray (e-ray) is parallel to the optical axis direction, and the ordinary ray (o-ray) is perpendicular to the optical axis direction. By changing the voltage applied to the liquid crystal pixel molecules, different included angles exist between the liquid crystal molecules and the electric field, namely, a certain included angle is formed between the direction vector of the liquid crystal molecules and the polarization direction of incident light, so that the effective refractive index of the liquid crystal is changed to change the size of the optical path through which light passes, and the purpose of phase modulation is achieved.
In this embodiment, the main control module 15 is a personal computer (PC, personal Computer); because the main lobe sizes of the Bessel beams at different propagation distances directly influence the processing effect of the material to be processed, the center main lobe sizes of the Bessel-like beams on the limited propagation distances are accurately regulated and controlled by the liquid crystal SLM, and the Bessel beams with different characteristics can be obtained by selecting different parameters to load the liquid crystal SLM. In practical application, the Bessel-like beam phase function in the phase calculation module is shown in formula (1), wherein in formula (1), k is as follows 0 The wavelength of incident light is =2pi/λ, λ is the polar diameter of the incident light, r is the polar diameter of the incident light, A, B is the main lobe slope parameter and the size parameter of the Bessel-like light beam, and the change relation of the central main lobe size FWHM of the Bessel-like light beam along with the axial propagation distance z in the main lobe size calculation module can be obtained by combining the geometric relation of the Bessel-like light field wave vector, as shown in formula (2), the relation that the central main lobe size of the Bessel light beam linearly increases with the axial distance z can be seen by formula (2), and the central main lobe size of the Bessel light beam can be regulated by regulating the main lobe slope parameter A and the size parameter B, so that the real-time regulation of the Bessel light beam is realized.
FWHM＝2.25(B+Az)/k 0 (2)
With continued reference to fig. 2, the modulation module 12 includes a first modulator 121 and a second modulator 122 that are sequentially disposed, where the first modulator 121 is configured to modulate the gaussian beam into a circular polarized gaussian beam, and the second modulator 122 is configured to modulate a polarization state of the circular polarized gaussian beam to obtain the polarized gaussian beam. Specifically, the first modulator 121 is a wave plate, and the second modulator 122 is a polarizer. In this embodiment, the rotation of the liquid crystal molecules in the liquid crystal SLM does not affect the refractive index of the ordinary ray component, and thus the phase modulation of the o ray cannot be achieved, and therefore, it is necessary to modulate the polarization state of the incident light beam so that only the extraordinary ray e ray exists, that is, a polarizer is disposed in front of the liquid crystal SLM.
With continued reference to fig. 2, the femto-second laser processing system further includes a diaphragm 16 disposed between the second modulator 122 and the bessel beam generator 13, that is, the diaphragm 16 is disposed between the polarizer and the liquid crystal SLM, and the diaphragm 16 is configured to eliminate stray light in the polarized gaussian beam.
With continued reference to fig. 2, the femto-second laser processing system further includes a first mirror 17 and a second mirror 18, where the first mirror 17 is disposed between the first modulator 121 and the femto-second laser 11, and is configured to divert the gaussian beam emitted from the femto-second laser 11 and then direct the gaussian beam toward the first modulator 121; the second reflecting mirror 18 is disposed between the second modulator 122 and the diaphragm 16, and is configured to redirect the polarized gaussian beam emitted from the second modulator 122 toward the diaphragm 16.
With continued reference to fig. 2, the femto-second laser processing system further includes a beam expansion module 19, where the beam expansion module 19 is disposed between the first reflecting mirror 17 and the femto-second laser 11, and is configured to expand the gaussian beam emitted from the femto-second laser 11, so that the spot diameter of the expanded gaussian beam meets the actual requirement.
With continued reference to fig. 2, the scanning module 14 includes a reflecting module 141 and a transmitting module 142 sequentially disposed, where the reflecting module 141 is configured to redirect the bessel beam emitted from the bessel beam generator 13 to the transmitting module 142, and the transmitting module 142 is configured to focus the bessel beam emitted from the reflecting module 141 to process a working surface of the material to be processed. Specifically, the transmission module 142 is a focusing lens group, the reflection module 141 includes a motor and a galvanometer mounted on the motor, and the galvanometer can form a set motion track according to rotation of the motor so as to process the working surface of the material to be processed.
Referring to fig. 3, fig. 3 is a processing schematic diagram of a bessel-beam-based femtosecond laser processing system according to an embodiment of the invention. As shown in fig. 3, the femtosecond laser processing system includes a femtosecond laser 11, a beam expander, a reflecting mirror 1, a stripping, a polarizer, a reflecting mirror 2, a diaphragm 16, an SLM, a three-dimensional scanning module, and a working surface, which are sequentially arranged, wherein a PC is connected with the SLM. It can be understood that the beam expansion is the beam expansion module 19, the reflecting mirror 1 and the reflecting mirror 2 are the first reflecting mirror 17 and the second reflecting mirror 18, the SLM is a liquid crystal SLM, the three-dimensional scanning module is the scanning module 14, the pc is the main control module 15, and the working surface is the working surface of the material to be processed. In practical processing, the femtosecond laser 11 emits gaussian light beams into linear polarized light, the linear polarized light after beam expansion is turned by the reflector 1 and then is emitted to the wave plate, the linear polarized light is modulated into circular polarized light by the wave plate, the polarization state of the circular polarized light is regulated by the polarizer to enable the polarization direction of the circular polarized light to be parallel to the direction of the optical axis of the uniaxial crystal, at the moment, only extraordinary light e exists in the incident light entering the liquid crystal SLM, and the liquid crystal SLM generates pure phase modulation on the incident linear polarized light, and the specific polarization modulation principle is as follows:
assuming that the beam output by the femtosecond laser 11 is horizontally polarized light, that is, the polarization state of the beam can be expressed as a stokes vector as shown in a matrix expression (1-1).
When the light beam passes through the wave plate, the energy of the light beam is unchanged, but the polarization state of the emergent light beam is changed, the optical wave plate can be used for completely describing the polarization property of the medium through a Mueller matrix, and the expression of the Mueller matrix of the wave plate with the azimuth angle of 45 degrees is shown as (1-2).
S out The stokes vector of the emergent light beam after passing through the wave plate is expressed, so that the output of the femtosecond laser 11 after outputting horizontal polarized light is obtained, the output is circularly polarized light after modulating through the wave plate, and the specific matrix expression is shown as (1-3).
The circularly polarized light is polarized and modulated by a polarizer, so that the polarization direction of the circularly polarized light is parallel to the optical axis direction of the uniaxial crystal, namely, the output light only comprises extraordinary light e, and the liquid crystal SLM is utilized to carry out phase modulation on the light beam so as to obtain a Bessel light beam, and the Bessel light beam is specifically shown as a formula (1-4).
The bessel beam is then input to the scanning module 14 for reflection and projection to process the working surface of the material to be processed. It should be noted that, setting the slope parameter and the size parameter of the main lobe of the bessel beam by the PC, so that the limit and the central main lobe size of the bessel beam can be calculated by the above formula (1) and formula (2), and further different bessel beams can be regulated and controlled according to different requirements of the material to be processed.
Referring to fig. 4, fig. 4 shows a flow chart of a bessel beam-based femtosecond laser processing method of the present invention, which is applied to a central controller, as shown in fig. 4, and includes the following steps S110 to S140.
S110, emitting Gaussian beams through a femtosecond laser;
s120, the Gaussian beam is injected into a modulation module to be modulated into a polarized Gaussian beam;
s130, the polarized Gaussian beam is emitted into a Bessel beam generating piece and then converted into a Bessel beam;
and S140, the Bessel beam is injected into the scanning module to process the working surface of the material to be processed after reflection and transmission.
In the embodiment, firstly, a processing staff sets a main lobe slope parameter and a size parameter of a liquid crystal SLM according to a processing surface of a material to be processed, and after the setting is completed, a Gaussian beam is emitted by a femtosecond laser; the Gaussian beam is subjected to a beam expanding module so that the diameter of a light spot meets the actual requirement; the expanded Gaussian beam is turned by a first reflector and then is transmitted into a modulation module to be modulated into a polarized Gaussian beam, and specifically, the expanded Gaussian beam is transmitted into a wave plate and a polarizer in sequence to be modulated into the polarized Gaussian beam; the polarized Gaussian beam is emitted into the Bessel beam generating piece and then converted into a Bessel beam; and the Bessel beam is emitted into the scanning module to process the working surface of the material to be processed after being reflected and transmitted.
In summary, in the femtosecond laser processing system and method based on the bessel beam provided in the embodiment, the gaussian beam emitted by the femto-second laser is first emitted into the wave plate and the wave plate lifter to be modulated into the polarized gaussian beam; then the polarized Gaussian beam is injected into a liquid crystal SLM and converted into a Bessel beam; finally, the Bessel beam is injected into the scanning module to process the working surface of the material to be processed after reflection and transmission, so that the problem that the Gaussian beam cannot control heat deposition around the material is solved, part of heat can be redistributed to a position far away from the center, the thermal gradient is reduced, the thermal profile and microstructure grains are optimized, and the quality of laser processing is improved. Furthermore, the main lobe slope parameter and the size parameter of the liquid crystal SLM can be set through the PC, so that different Bessel beams can be regulated and controlled according to different requirements of materials to be processed, and the liquid crystal SLM processing device is simple in operation and high in flexibility.
The invention has been described in connection with the preferred embodiments, but the invention is not limited to the embodiments disclosed above, but it is intended to cover various modifications, equivalent combinations according to the essence of the invention.
Claims (10)
1. A femtosecond laser processing system based on Bessel beam is characterized by comprising a femtosecond laser, a modulation module, a Bessel beam generating piece and a scanning module which are sequentially arranged, wherein,
the femtosecond laser is used for emitting Gaussian beams;
the modulation module is used for modulating the Gaussian beam to obtain a polarized Gaussian beam;
the Bessel beam generator is used for converting the polarized Gaussian beam into a Bessel beam;
the scanning module is used for reflecting and transmitting the Bessel light beam so as to enable the reflected and transmitted Bessel light beam to process a working surface of a material to be processed.
2. The bezier beam-based femtosecond laser processing system according to claim 1, further comprising a master control module, wherein the bezier beam generating element is a liquid crystal spatial light modulator, the master control module is configured to set a main lobe slope parameter and a main lobe size parameter in the liquid crystal spatial light modulator, the liquid crystal spatial light modulator comprises a phase calculation module and a main lobe size calculation module, and the phase calculation module and the main lobe size calculation module are configured to calculate a phase and a center main lobe size of the bezier beam according to the main lobe slope parameter and the size parameter, respectively.
3. The bezier beam-based femtosecond laser processing system according to claim 1, wherein said modulation module includes a first modulator for modulating said gaussian beam into a circularly polarized gaussian beam and a second modulator for modulating a polarization state of said circularly polarized gaussian beam to obtain said polarized gaussian beam, which are sequentially arranged.
4. The bessel-based beam femtosecond laser machining system of claim 3, wherein said first modulator is a wave plate and said second modulator is a polarizer.
5. A bessel beam-based femtosecond laser machining system according to claim 3, further comprising a diaphragm disposed between said second modulator and said bessel beam generator, said diaphragm for eliminating stray light in said polarized gaussian beam.
6. The bezier beam-based femtosecond laser machining system according to claim 5, further comprising a first mirror and a second mirror, said first mirror being provided between said first modulator and said femtosecond laser for steering said gaussian beam emitted from said femtosecond laser and then directing it toward said first modulator; the second reflector is arranged between the second modulator and the diaphragm and is used for turning the polarized Gaussian beam emitted from the second modulator and then directing the polarized Gaussian beam to the diaphragm.
7. The bezier beam-based femtosecond laser machining system according to claim 6, further comprising a beam expansion module provided between said first mirror and said femtosecond laser for expanding said gaussian beam emitted from said femtosecond laser.
8. The bezier beam-based femtosecond laser processing system according to claim 1, wherein the scanning module includes a reflection module and a transmission module disposed in order, the reflection module being configured to steer the bezier beam emitted from the bezier beam generator to the transmission module, and the transmission module being configured to focus the bezier beam emitted from the reflection module to process a working surface of the material to be processed.
9. The bezier beam-based femtosecond laser processing system according to claim 1, wherein the transmission module is a focusing lens group, the reflection module includes a motor and a galvanometer mounted on the motor, and the galvanometer can form a set motion track according to rotation of the motor.
10. A bessel beam-based femtosecond laser machining method, characterized in that the bessel beam-based femtosecond laser machining method is based on the bessel beam-based femtosecond laser machining system according to any one of claims 1 to 9, the femtosecond laser machining method comprising:
emitting a Gaussian beam by a femtosecond laser;
the Gaussian beam is injected into a modulation module to be modulated into a polarized Gaussian beam;
the polarized Gaussian beam is emitted into the Bessel beam generating piece and then converted into a Bessel beam;
and the Bessel beam is emitted into the scanning module to process the working surface of the material to be processed after being reflected and transmitted.
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