CN116838644A - Temperature-controllable gas steady flow box structure and steady flow method - Google Patents
Temperature-controllable gas steady flow box structure and steady flow method Download PDFInfo
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- CN116838644A CN116838644A CN202310901713.4A CN202310901713A CN116838644A CN 116838644 A CN116838644 A CN 116838644A CN 202310901713 A CN202310901713 A CN 202310901713A CN 116838644 A CN116838644 A CN 116838644A
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- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000010438 heat treatment Methods 0.000 claims abstract description 42
- 239000004065 semiconductor Substances 0.000 claims abstract description 19
- 230000000087 stabilizing effect Effects 0.000 claims abstract description 12
- 238000001816 cooling Methods 0.000 claims description 23
- 239000003381 stabilizer Substances 0.000 claims 1
- 238000012360 testing method Methods 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 238000005057 refrigeration Methods 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/40—Casings; Connections of working fluid
- F04D29/403—Casings; Connections of working fluid especially adapted for elastic fluid pumps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D27/00—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids
- F04D27/001—Testing thereof; Determination or simulation of flow characteristics; Stall or surge detection, e.g. condition monitoring
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D27/00—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids
- F04D27/006—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids by influencing fluid temperatures
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/58—Cooling; Heating; Diminishing heat transfer
- F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The invention discloses a temperature-controllable gas steady flow box structure and a steady flow method, belongs to the technical field of gas rectifying devices, and aims to solve the problem that a gas compressor takes gas in the atmosphere and the quality of intake air is low. The semiconductor refrigerating piece is arranged between the outer wall of the steady flow box and the inner wall of the steady flow box; the flow tube is arranged on the flow stabilizing box air outlet end socket, a rectifier is arranged at one end, close to the flow stabilizing box air inlet end socket, of the flow stabilizing box inner wall, and a heating unit is arranged at one end, close to the flow stabilizing box air outlet end socket. The high-temperature gas can be reduced to the designated temperature through the semiconductor refrigerating sheet, and the low-temperature gas can be heated to the designated temperature through the heating resistor plate, so that the inlet air temperature of the air compressor is flexibly controlled, and the operation stability of the air compressor is ensured.
Description
Technical Field
The invention belongs to the technical field of gas rectifying devices, and particularly relates to a temperature-controllable gas steady flow box structure and a steady flow method.
Background
Compressors are components in gas turbine engines that utilize high-speed rotating blades to apply work to air to increase the pressure of the air. The front end parts of the blades of the impeller of the air compressor are curved and are called guide wheels, the shell is provided with an air inlet end and an air outlet end of air flow, the air inlet end is generally axially arranged, and the flow channel is slightly tapered so as to reduce air inlet resistance; the air outlet end is generally designed into a volute shape with the flow channels gradually expanding along the circumference, so that high-speed air flow can be continuously diffused, and the total efficiency of the supercharger is improved.
The air compressor is divided into an axial flow type air compressor and a centrifugal type air compressor, at present, no matter the axial flow type air compressor or the centrifugal type air compressor generally takes air in the atmosphere, the air inlet end is generally provided with a simple air inlet filter device, and an air inlet anti-icing device is additionally arranged when the air compressor runs in a region with a relatively large temperature difference change. The air compressor and the gas turbine unit with low performance requirements can meet the system operation requirements, but the simple air inlet arrangement can not meet the air inlet requirements when the air compressor and the gas turbine unit with strict air inlet condition requirements are particularly used for experimental study.
Disclosure of Invention
The invention aims to provide a temperature-controllable gas steady flow box structure and a steady flow method, which are used for solving the problems of low air intake quality and low air intake quality of a gas compressor in the atmosphere. The technical scheme adopted by the invention is as follows:
a temperature-controllable gas steady flow box structure comprises a rectifying unit, a cooling unit, a heating unit, an air outlet unit and a supporting unit;
the rectifying unit comprises a steady flow box air inlet end socket and a rectifier, and an air inlet is formed in the steady flow box air inlet end socket; the cooling unit comprises a steady flow box outer wall and a steady flow box inner wall which are sleeved with each other, and a semiconductor refrigerating sheet is arranged between the steady flow box outer wall and the steady flow box inner wall; the air outlet unit comprises a steady flow box air outlet end socket, a flow tube is arranged on the steady flow box air outlet end socket, and the inner end of the flow tube is in a bell mouth shape;
the steady flow box air inlet end socket, the steady flow box outer wall and the steady flow box air outlet end socket are sequentially connected, a rectifier is arranged at one end, close to the steady flow box air inlet end socket, in the steady flow box inner wall, a heating unit is arranged at one end, close to the steady flow box air outlet end socket, and the cooling unit is arranged on the supporting unit.
Further, the rectifier comprises two parallel first end covers and second end covers, the ends of the first end covers and the second end covers are respectively connected with the inner wall of the steady flow box, the rectifying tubes are uniformly distributed, one ends of the rectifying tubes respectively penetrate through the first end covers and are connected with the first end covers in a flush mode, and the other ends of the rectifying tubes respectively penetrate through the second end covers and are connected with the second end covers in a flush mode.
Further, the heating unit comprises a plurality of fixed plates and a plurality of heating resistance plates, the fixed plates are circumferentially distributed, fan-shaped airflow channels are formed between the opposite end faces of any two adjacent fixed plates, the inner ends of the fixed plates are connected, the outer ends of the fixed plates are respectively connected with the inner wall of the steady flow box, and the heating resistance plates are arranged on the same end face of the fixed plates in a one-to-one correspondence mode.
Further, the heating resistance plate is six or eight.
Further, the air inlet and the steady flow box air inlet end socket are coaxially arranged, and the flow pipe coaxially penetrates through the steady flow box air outlet end socket.
Further, the supporting unit comprises two saddle-shaped supports, and the two saddle-shaped supports are supported on the lower side of the outer wall of the steady flow box.
Further, the saddle type support close to the air inlet end socket of the steady flow box is an F-shaped saddle type support, and the saddle type support close to the air outlet end socket of the steady flow box is an S-shaped saddle type support.
The invention also provides a temperature-controllable gas steady flow method, which is realized by virtue of the temperature-controllable gas steady flow box structure and comprises the following steps of:
step one: starting the air compressor to enable air to enter the steady flow box from the air inlet, and rectifying the air through the rectifying unit;
step two: the method comprises the steps that the air temperature at the tail end of a rectifier is collected through a first temperature sensor, when the temperature collected by the first temperature sensor is higher than the air temperature range required by a unit, a semiconductor refrigerating sheet is electrified positively, a cooling unit refrigerates inwards and heats outwards, and a heating unit is closed; when the temperature acquired by the first temperature sensor is lower than the air temperature range required by the unit, the cooling unit is closed, and the heating unit is started; when the temperature acquired by the first temperature sensor is in the air temperature range required by the unit, the cooling unit and the heating unit are both closed;
step three: collecting air humidity at the tail end of the rectifier through a humidity sensor, when the temperature collected by the first temperature sensor is lower than the air temperature range required by the unit and the humidity collected by the humidity sensor is higher than the air humidity range required by the unit, starting a heating unit, reversely electrifying a semiconductor refrigerating sheet, and refrigerating and heating the semiconductor refrigerating sheet to the outside by a cooling unit so as to defrost;
step four: and (3) acquiring the air temperature of the flow tube through a second temperature sensor, and when the air temperature of the flow tube exceeds the air temperature range required by the unit, improving the current intensity of the working part corresponding to the second step so as to strengthen the heating or refrigerating process.
Compared with the prior art, the invention has the beneficial effects that:
the invention provides a temperature-controllable gas steady flow box structure and a steady flow method, which are used for rectifying and temperature controlling devices with high air inlet requirements for compressors and the like. The steady flow box is of a cylindrical structure and is formed by welding an air inlet end socket, an air outlet end socket and a cylinder body, gas enters from an air inlet of the steady flow box structure, flows out through a flow pipe after being rectified by a rectifier, reduces high-temperature gas to a specified temperature through a semiconductor refrigerating sheet, and heats low-temperature gas to the specified temperature through a heating resistor plate, so that the air temperature at an inlet of the compressor is flexibly controlled, and the operation stability of the compressor is ensured. By utilizing the semiconductor refrigeration characteristic, the air inlet of the air compressor can be cooled, the load of complex cooling water circulation can be replaced or reduced, the air inlet temperature of the air compressor is maintained in a constant setting range, and the air inlet condition is accurately ensured. The required monitoring components and control system components can be installed on the rectifying box according to actual requirements. The invention can ensure the test precision and improve the test stability if used in a test system. The invention can be used in various fans, avoids air inlet distortion, improves working efficiency and ensures safe operation of equipment.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic diagram of a rectifier;
FIG. 3 is a left side view of FIG. 2;
fig. 4 is a schematic structural view of the heating unit;
FIG. 5 is a schematic view of a saddle seat;
FIG. 6 is a left side view of FIG. 5;
FIG. 7 is a bottom plate view of an F-shaped saddle mount;
FIG. 8 is a bottom plate view of an S-shaped saddle support
FIG. 9 is a flow chart of a temperature controllable gas flow stabilization method.
In the figure: the device comprises a 1-rectifying unit, a 11-steady flow box air inlet end socket, a 12-rectifier, a 121-first end cover, a 122-rectifying pipe, a 123-second end cover, a 2-cooling unit, a 21-steady flow box outer wall, a 22-semiconductor refrigerating sheet, a 23-steady flow box inner wall, a 3-heating unit, a 31-fixing plate, a 32-heating resistor plate, a 4-air outlet unit, a 41-steady flow box air outlet end socket, a 42-flow pipe, a 5-supporting unit and a 51-saddle support.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the present invention is described below by means of specific embodiments shown in the accompanying drawings. It should be understood that the description is only illustrative and is not intended to limit the scope of the invention. In addition, in the following description, descriptions of well-known structures and techniques are omitted so as not to unnecessarily obscure the present invention.
The connection mentioned in the invention is divided into fixed connection and detachable connection, wherein the fixed connection is a conventional fixed connection mode such as folding connection, rivet connection, bonding connection, welding connection and the like, the detachable connection comprises a conventional detachable mode such as bolt connection, buckle connection, pin connection, hinge connection and the like, and when a specific connection mode is not limited, at least one connection mode can be found in the conventional connection mode by default to realize the function, and the person skilled in the art can select the function according to the needs. For example: the fixed connection is welded connection, and the detachable connection is bolted connection.
The present invention will be described in further detail below with reference to the accompanying drawings, the following examples being illustrative of the present invention and the present invention is not limited to the following examples.
Embodiment one: as shown in fig. 1 to 8, a temperature-controllable gas steady flow box structure comprises a rectifying unit 1, a cooling unit 2, a heating unit 3, an air outlet unit 4 and a supporting unit 5;
the rectifying unit 1 comprises a steady flow box air inlet end enclosure 11 and a rectifier 12, wherein an air inlet is formed in the steady flow box air inlet end enclosure 11; the cooling unit 2 comprises a steady flow box outer wall 21 and a steady flow box inner wall 23 which are sleeved with each other, the steady flow box outer wall 21 and the steady flow box inner wall 23 are of cylindrical structures, and a semiconductor refrigerating sheet 22 is arranged between the steady flow box outer wall 21 and the steady flow box inner wall 23; the air outlet unit 4 comprises a steady flow box air outlet seal head 41, a flow tube 42 is arranged on the steady flow box air outlet seal head 41, and the inner end of the flow tube 42 is bell-mouthed;
the steady flow box air inlet end enclosure 11, the steady flow box outer wall 21 and the steady flow box air outlet end enclosure 41 are sequentially and axially connected, a rectifier 12 is arranged at one end, close to the steady flow box air inlet end enclosure 11, in the steady flow box inner wall 23, a heating unit 3 is arranged at one end, close to the steady flow box air outlet end enclosure 41, and a cooling unit 2 is arranged on the supporting unit 5.
The rectifier 12 comprises a first end cover 121 and a second end cover 123 which are parallel, the ends of the first end cover 121 and the second end cover 123 are respectively connected with the inner wall 23 of the steady flow box, a plurality of rectifying tubes 122 are uniformly distributed, one ends of the rectifying tubes 122 respectively penetrate through the first end cover 121 and are connected with the first end cover 121 in a flush mode, and the other ends of the rectifying tubes 122 respectively penetrate through the second end cover 123 and are connected with the second end cover 123 in a flush mode. The rectifier 12 comprises a plurality of uniformly arranged rectifying tubes 122 with the same pipe diameter, the lengths of the rectifying tubes 122 exceed the lengths of the first end cover 121 and the second end cover 123, the peripheries of the rectifying tubes 122 are fixed with the first end cover 121 and the second end cover 123 by spot welding, and after the positioning and the installation are finished, the long parts of the rectifying tubes 122 are cut off to be flush with the first end cover 121 or the second end cover 123. The whole rectifier 12 is pushed into the inner wall 23 of the steady flow box from the side of the air inlet end enclosure 11 of the steady flow box, the end parts of the two sides are fixed by spot welding, and then the air inlet end enclosure 11 of the steady flow box is welded.
The heating unit 3 comprises a plurality of fixing plates 31 and a plurality of heating resistor plates 32, the circumference of the plurality of fixing plates 31 is distributed, fan-shaped airflow channels are formed between the opposite end faces of any two adjacent fixing plates 31, the inner ends of the plurality of fixing plates 31 are connected, the outer ends of the plurality of fixing plates 31 are respectively connected with the inner wall 23 of the steady flow box, and the plurality of heating resistor plates 32 are arranged on the same end face of the plurality of fixing plates 31 in a one-to-one correspondence manner.
The heating resistor plate 32 is six or eight.
The air inlet and the steady flow box air inlet end enclosure 11 are coaxially arranged, and a flow pipe 42 coaxially penetrates through the steady flow box air outlet end enclosure 41. The flow tube 42 is inserted into the outlet of the steady flow box air outlet seal 41, the insertion position is approximately centered, and the outlet of the steady flow box air outlet seal 41 is welded with the outer wall 21 of the steady flow box after the flow tube 42 is fixed by spot welding inside and outside the outlet of the steady flow box air outlet seal 41.
The support unit 5 includes two saddle brackets 51, and both saddle brackets 51 are supported on the lower side of the outer wall 21 of the flow stabilizing box.
The saddle support 51 close to the steady flow box air inlet end enclosure 11 is an F-shaped saddle support 51, and the saddle support 51 close to the steady flow box air outlet end enclosure 41 is an S-shaped saddle support 51. The fixing holes on the bottom plate of the F-shaped saddle support 51 are round holes, the fixing holes on the bottom plate of the S-shaped saddle support 51 are oblong holes, one of the two saddle supports 51 is in the F shape, the other saddle support is in the S shape, the distance between the fixing bolts of the two saddle supports 51 is allowed to be in a certain range, and the fixing of the saddle supports 51 is facilitated.
Embodiment two: as shown in fig. 9, a temperature-controllable gas flow stabilizing method is implemented by means of the temperature-controllable gas flow stabilizing box structure according to the first embodiment, and includes the following steps:
step one: starting a gas compressor, enabling air to enter a steady flow box from the gas inlet, and rectifying through a rectifying unit 1;
step two: the air temperature at the tail end of the rectifier 12 is collected through a first temperature sensor, the tail end refers to one end of the air flowing out of the rectifier 12, when the temperature collected by the first temperature sensor is higher than the air temperature range required by a unit, the semiconductor refrigerating sheet 22 is electrified positively, the cooling unit 2 refrigerates inwards and heats outwards, and the heating unit 3 is closed; when the temperature acquired by the first temperature sensor is lower than the air temperature range required by the unit, the cooling unit 2 is closed, and the heating unit 3 is started; when the temperature acquired by the first temperature sensor is in the air temperature range required by the unit, the cooling unit 2 and the heating unit 3 are both closed;
step three: the humidity sensor is used for collecting the air humidity at the tail end of the rectifier 12, the air humidity has a corresponding relation with the air temperature, the humidity is high in the air low-temperature state, and the humidity is low in the air high-temperature state, so when the temperature collected by the first temperature sensor is lower than the air temperature range required by the unit and the humidity collected by the humidity sensor is higher than the air humidity range required by the unit, the heating unit 3 is started, the semiconductor refrigerating sheet 22 is electrified reversely, and the cooling unit 2 refrigerates outwards and heats inwards to defrost;
step four: the air temperature of the flow tube 42 is collected by the second temperature sensor, and when the air temperature of the flow tube 42 exceeds the air temperature range required by the unit, the current intensity of the working component corresponding to the second step is increased so as to strengthen the heating or refrigerating process.
The semiconductor refrigeration piece 22 is used for cooling the air in the steady flow box to the required air inlet temperature, according to the characteristics of the semiconductor refrigeration piece 22, the cold end faces the inner wall 23 of the steady flow box, the hot end faces the outer wall 21 of the steady flow box, and the heat of the hot end can be flexibly radiated by adopting a plurality of radiating means such as fans, cooling water and the like according to the required radiating capacity.
The invention provides a temperature-controllable gas steady flow box structure and a steady flow method, which are used for rectifying and temperature controlling devices with high air inlet requirements for compressors and the like. The steady flow box is of a cylindrical structure and is formed by welding an air inlet end socket, an air outlet end socket and a cylinder body, gas enters from an air inlet of the steady flow box structure, flows out through a flow pipe 42 after being rectified by a rectifier 12, reduces high-temperature gas to a specified temperature through a semiconductor refrigerating sheet 22, and heats low-temperature gas to the specified temperature through a heating resistance plate 32, so that the air temperature of an inlet of the air compressor is flexibly controlled, and the operation stability of the air compressor is ensured. By utilizing the semiconductor refrigeration characteristic, the air inlet of the air compressor can be cooled, the load of complex cooling water circulation can be replaced or reduced, the air inlet temperature of the air compressor is maintained in a constant setting range, and the air inlet condition is accurately ensured. The required monitoring components and control system components can be installed on the rectifying box according to actual requirements. The invention can ensure the test precision and improve the test stability if used in a test system. The invention can be used in various fans, avoids air inlet distortion, improves working efficiency and ensures safe operation of equipment.
The above embodiments are only illustrative of the present invention and do not limit the scope thereof, and those skilled in the art may also make modifications to parts thereof without departing from the spirit of the invention.
Claims (8)
1. A but gaseous stationary flow case structure of control temperature, its characterized in that: comprises a rectifying unit (1), a cooling unit (2), a heating unit (3), an air outlet unit (4) and a supporting unit (5);
the rectifying unit (1) comprises a steady flow box air inlet end socket (11) and a rectifier (12), and an air inlet is formed in the steady flow box air inlet end socket (11); the cooling unit (2) comprises a steady flow box outer wall (21) and a steady flow box inner wall (23) which are sleeved with each other, and a semiconductor refrigerating sheet (22) is arranged between the steady flow box outer wall (21) and the steady flow box inner wall (23); the air outlet unit (4) comprises a steady flow box air outlet end socket (41), a flow tube (42) is arranged on the steady flow box air outlet end socket (41), and the inner end of the flow tube (42) is in a bell mouth shape;
the steady flow box air inlet end enclosure (11), the steady flow box outer wall (21) and the steady flow box air outlet end enclosure (41) are sequentially connected, a rectifier (12) is arranged at one end, close to the steady flow box air inlet end enclosure (11), in the steady flow box inner wall (23), a heating unit (3) is arranged at one end, close to the steady flow box air outlet end enclosure (41), and a cooling unit (2) is arranged on the supporting unit (5).
2. The temperature-controllable gas flow stabilizing box structure according to claim 1, wherein: the rectifier (12) comprises two parallel first end covers (121) and second end covers (123), the outer ends of the first end covers (121) and the second end covers (123) are respectively connected with the inner wall (23) of the steady flow box, a plurality of rectifying tubes (122) are uniformly distributed, one ends of the rectifying tubes (122) respectively penetrate through the first end covers (121) and are connected with the first end covers (121) in a flush mode, and the other ends of the rectifying tubes (122) respectively penetrate through the second end covers (123) and are connected with the second end covers (123) in a flush mode.
3. The temperature-controllable gas flow stabilizing box structure according to claim 1, wherein: the heating unit (3) comprises a plurality of fixing plates (31) and a plurality of heating resistance plates (32), wherein the plurality of fixing plates (31) are circumferentially distributed, fan-shaped airflow channels are formed between the opposite end faces of any two adjacent fixing plates (31), the inner ends of the plurality of fixing plates (31) are connected, the outer ends of the plurality of fixing plates (31) are respectively connected with the inner wall (23) of the steady flow box, and the plurality of heating resistance plates (32) are arranged on the same end face of the plurality of fixing plates (31) in a one-to-one correspondence mode.
4. A temperature controllable gas flow stabilizing box structure according to claim 3, wherein: the heating resistor plate (32) is six or eight.
5. The temperature-controllable gas flow stabilizing box structure according to claim 1, wherein: the air inlet and the steady flow box air inlet end enclosure (11) are coaxially arranged, and the flow pipe (42) coaxially penetrates through the steady flow box air outlet end enclosure (41).
6. A temperature controllable gas flow stabilizer structure according to any one of claims 1-5, wherein: the supporting unit (5) comprises two saddle supports (51), and the two saddle supports (51) are supported on the lower side of the outer wall (21) of the steady flow box.
7. The temperature controllable gas flow stabilizing box structure according to claim 6, wherein: the saddle support (51) close to the steady flow box air inlet end socket (11) is an F-shaped saddle support, and the saddle support (51) close to the steady flow box air outlet end socket (41) is an S-shaped saddle support.
8. A temperature-controllable gas steady flow method, realized by the temperature-controllable gas steady flow box structure according to any one of claims 1-7, characterized by comprising the following steps:
step one: starting a gas compressor to enable air to enter the steady flow box from the gas inlet, and rectifying the air through the rectifying unit (1);
step two: the air temperature at the tail end of the rectifier (12) is collected through a first temperature sensor, when the temperature collected by the first temperature sensor is higher than the air temperature range required by the unit, the semiconductor refrigerating sheet (22) is electrified forward, the cooling unit (2) refrigerates inwards and heats outwards, and the heating unit (3) is closed; when the temperature acquired by the first temperature sensor is lower than the air temperature range required by the unit, the cooling unit (2) is closed, and the heating unit (3) is opened; when the temperature acquired by the first temperature sensor is in the air temperature range required by the unit, the cooling unit (2) and the heating unit (3) are both closed;
step three: collecting air humidity at the tail end of a rectifier (12) through a humidity sensor, when the temperature collected by the first temperature sensor is lower than the air temperature range required by a unit and the humidity collected by the humidity sensor is higher than the air humidity range required by the unit, starting a heating unit (3), reversely electrifying a semiconductor refrigerating sheet (22), and refrigerating and heating the cooling unit (2) to the outside so as to defrost;
step four: and acquiring the air temperature of the outflow flow pipe (42) through a second temperature sensor, and when the air temperature of the outflow flow pipe (42) exceeds the air temperature range required by the unit, improving the current intensity of the working part corresponding to the second step so as to strengthen the heating or refrigerating process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310901713.4A CN116838644A (en) | 2023-07-21 | 2023-07-21 | Temperature-controllable gas steady flow box structure and steady flow method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310901713.4A CN116838644A (en) | 2023-07-21 | 2023-07-21 | Temperature-controllable gas steady flow box structure and steady flow method |
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| Publication Number | Publication Date |
|---|---|
| CN116838644A true CN116838644A (en) | 2023-10-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310901713.4A Pending CN116838644A (en) | 2023-07-21 | 2023-07-21 | Temperature-controllable gas steady flow box structure and steady flow method |
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| Country | Link |
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| CN (1) | CN116838644A (en) |
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- 2023-07-21 CN CN202310901713.4A patent/CN116838644A/en active Pending
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