CN219698290U - Novel C-shaped frame cooling structure - Google Patents
Novel C-shaped frame cooling structure Download PDFInfo
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- CN219698290U CN219698290U CN202320849679.6U CN202320849679U CN219698290U CN 219698290 U CN219698290 U CN 219698290U CN 202320849679 U CN202320849679 U CN 202320849679U CN 219698290 U CN219698290 U CN 219698290U
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- cooling
- novel
- backflow pipeline
- frame body
- pipeline
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- 238000001816 cooling Methods 0.000 title claims abstract description 75
- 238000005057 refrigeration Methods 0.000 claims abstract description 36
- 239000004065 semiconductor Substances 0.000 claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000003756 stirring Methods 0.000 claims description 14
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 17
- 230000033764 rhythmic process Effects 0.000 abstract description 7
- 239000002826 coolant Substances 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 abstract description 4
- 238000000605 extraction Methods 0.000 abstract description 3
- 238000004321 preservation Methods 0.000 abstract description 2
- 239000000110 cooling liquid Substances 0.000 description 20
- 230000009286 beneficial effect Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model relates to the technical field of thickness gauges, in particular to a novel C-shaped frame cooling structure. Including C type frame body and backflow pipeline, the internally mounted of C type frame body has cooling pipeline, inlet tube, water pump, refrigeration case one and heat preservation cover, and backflow pipeline installs in cooling pipeline's left end, and backflow pipeline's outside is fixed with conducting strip, heat conduction sleeve pipe and exhaust fan, and backflow pipeline's lower extreme is connected with refrigeration case two, and semiconductor refrigeration board is installed in refrigeration case two's left side. The heat conducting fin cools down the coolant liquid through return line, and the exhaust fan will heat conduction sleeve pipe inside hot air extraction, and fresh air can get into heat conduction sleeve pipe's inside through the sleeve pipe port and cool down the heat conducting fin, and then cool down the inside coolant liquid of return line, can cool down the upper cross rod and the lower cross rod of C type frame body respectively through cooling line, can increase the cooling efficiency to C type frame body, and then can guarantee production rhythm, guarantees production efficiency.
Description
Technical Field
The utility model relates to the technical field of thickness gauges, in particular to a novel C-shaped frame cooling structure.
Background
In production, the hot rolled strip is at high temperature, and the C-shaped frame is baked at high temperature all the time because the thickness of the strip is required to be monitored all the time in production. Normally within the affordable range of the refrigeration system of the C-frame itself, but individual production lines have the need for coil rolling, the strip needs to be reciprocated all the way under the C-frame. The cooling and radiating system of the C-shaped frame exceeds the upper limit, the temperature cannot be reduced, and the service life of equipment is influenced; in order to control the temperature, the production rhythm must be reduced, which affects the production efficiency very much.
Disclosure of Invention
In view of the above problems, an object of the present utility model is to: the novel C-shaped frame cooling structure is provided, so that the problem that the cooling and radiating system of the C-shaped frame exceeds the upper limit, the temperature cannot be reduced, and the service life of equipment is influenced is solved; in order to control the temperature, the production rhythm must be reduced, which affects the production efficiency very much.
In order to achieve the above purpose, the utility model adopts the technical scheme that: the utility model provides a novel C type frame cooling structure, includes C type frame body and backflow pipeline, the internally mounted of C type frame body has cooling pipeline, and cooling pipeline's left end is connected with the inlet tube, the below of inlet tube is connected with the water pump, and the lower extreme of inlet tube is provided with refrigeration case one, the outside parcel of inlet tube has the insulation can, backflow pipeline installs in cooling pipeline's left end, and backflow pipeline's outside equidistant heat conducting strip that is fixed with, backflow pipeline's outside has cup jointed the heat conduction sleeve pipe, and heat conduction sleeve pipe's both ends joint has the sleeve pipe port, a plurality of air extraction fan is installed to heat conduction sleeve pipe's top, backflow pipeline's lower extreme is connected with refrigeration case two, agitating unit is installed on refrigeration case two's right side, and the semiconductor refrigeration board is installed in refrigeration case two's left side, semiconductor refrigeration board's left side is provided with the heat dissipation fan, refrigeration case two's below is connected with connecting tube.
The beneficial effects of the utility model are as follows: the heat conducting fin cools down the coolant liquid through return line, and the exhaust fan will heat conduction sleeve pipe inside hot air extraction, and fresh air can get into heat conduction sleeve pipe's inside through the sleeve pipe port and cool down the heat conducting fin, and then cool down the inside coolant liquid of return line, can cool down the upper cross rod and the lower cross rod of C type frame body respectively through cooling line, can increase the cooling efficiency to C type frame body, and then can guarantee production rhythm, guarantees production efficiency.
In order to increase the cooling efficiency of the device:
as a further improvement of the above technical scheme: the number of the cooling pipelines is two, and the two cooling pipelines are respectively arranged on the upper cross rod and the lower cross rod of the C-shaped frame body.
The beneficial effects of this improvement are: the cooling pipeline can be used for cooling the upper cross rod and the lower cross rod of the C-shaped frame body respectively, so that the cooling efficiency of the C-shaped frame body can be increased, the production rhythm can be further ensured, and the production efficiency is ensured.
In order to facilitate the cooling of the return pipe:
as a further improvement of the above technical scheme: the heat conducting fin is arranged in a circular shape, and the heat conducting fin and the backflow pipeline are arranged in an axis superposition mode.
The beneficial effects of this improvement are: the circular ring type and the axis are overlapped, so that the heat conducting fin can uniformly cool the return pipeline.
To facilitate air entering the interior of the heat conducting sleeve:
as a further improvement of the above technical scheme: the sleeve port is connected with the heat conduction sleeve in a clamping way, and a through hole is formed in the sleeve port.
The beneficial effects of this improvement are: the clamping connection can enable the connection between the sleeve port and the heat conduction sleeve to be firmer and more reliable, and the through holes can facilitate air to enter the heat conduction sleeve.
In order to facilitate the cooling of the cooling liquid in the second refrigeration box:
as a further improvement of the above technical scheme: and the semiconductor refrigeration plate is tightly attached to the second refrigeration box.
The beneficial effects of this improvement are: the close fitting can enable the semiconductor refrigeration plate to conduct temperature of the refrigeration box II more reliably and accurately.
In order to facilitate the communication between the second refrigeration box and the first refrigeration box:
as a further improvement of the above technical scheme: and an electromagnetic valve is arranged on the connecting pipeline.
The beneficial effects of this improvement are: the electromagnetic valve can be used for conveniently switching on and switching off the semiconductor refrigeration plate and the refrigeration box I.
In order to uniformly cool the cooling liquid:
as a further improvement of the above technical scheme: the stirring device comprises a motor, the motor is arranged on the outer side of the second refrigerating box, and a stirring rod is arranged at the output end of the motor.
The beneficial effects of this improvement are: the motor can drive the stirring rod to stir the cooling liquid, so that the cooling liquid is cooled uniformly.
In order to facilitate the rotation of the stirring rod:
as a further improvement of the above technical scheme: the stirring rod and the second refrigerating box are arranged in parallel.
The beneficial effects of this improvement are: the stirring rod can rotate more reliably and stably due to the mutual parallel arrangement, and then cooling of cooling liquid can be facilitated.
Drawings
Fig. 1 is a schematic diagram of an overall front view structure.
Fig. 2 is a schematic diagram of the whole right-view structure.
Fig. 3 is a schematic diagram of an overall right-view cross-sectional structure.
Fig. 4 is a schematic diagram of a cooling pipe axis measurement structure.
Fig. 5 is an enlarged schematic view of the structure at a in fig. 1.
In the figure: 1. a C-shaped frame body; 2. a cooling pipe; 3. a water inlet pipe; 31. a water pump; 32. a first refrigerating box; 33. a thermal insulation sleeve; 41. a return line; 42. a heat conductive sheet; 43. a heat conducting sleeve; 44. a cannula port; 45. an exhaust fan; 5. a second refrigerating box; 51. a motor; 52. a stirring rod; 53. a semiconductor refrigeration plate; 54. a heat dissipation fan; 55. and connecting pipelines.
Detailed Description
In order that those skilled in the art may better understand the technical solutions of the present utility model, the following detailed description of the present utility model with reference to the accompanying drawings is provided for exemplary and explanatory purposes only and should not be construed as limiting the scope of the present utility model.
As shown in fig. 1-5, a novel C-shaped frame cooling structure comprises a C-shaped frame body 1 and a backflow pipeline 41, wherein a cooling pipeline 2 is installed in the C-shaped frame body 1, the left end of the cooling pipeline 2 is connected with a water inlet pipe 3, the lower part of the water inlet pipe 3 is connected with a water pump 31, the lower end of the water inlet pipe 3 is provided with a first refrigerating box 32, the outer side of the water inlet pipe 3 is wrapped with a heat preservation sleeve 33, the backflow pipeline 41 is installed at the left end of the cooling pipeline 2, the outer side of the backflow pipeline 41 is fixed with heat conducting fins 42 at equal intervals, the outer side of the backflow pipeline 41 is sleeved with a heat conducting sleeve 43, sleeve ports 44 are clamped at two ends of the heat conducting sleeve 43, a plurality of exhaust fans 45 are installed above the heat conducting sleeve 43, the lower end of the backflow pipeline 41 is connected with a second refrigerating box 5, the right side of the second refrigerating box 5 is provided with a stirring device, the left side of the second refrigerating box 5 is provided with a semiconductor refrigerating plate 53, the left side of the second refrigerating box 53 is provided with a heat dissipation fan 54, the lower side of the second refrigerating box 5 is connected with a connecting pipeline 55, the heat conduction sheet 42 cools the cooling liquid passing through the backflow pipeline 41, the air draft fan 45 extracts the hot air in the heat conduction sleeve 43, fresh air enters the heat conduction sleeve 43 through the sleeve port 44 to cool the heat conduction sheet 42, the cooling liquid in the backflow pipeline 41 is cooled, the upper cross rod and the lower cross rod of the C-shaped frame body 1 can be cooled respectively through the cooling pipeline 2, the cooling efficiency of the C-shaped frame body 1 can be increased, the production rhythm can be further ensured, the production efficiency is ensured, the number of the cooling pipelines 2 is two, which are respectively arranged on the upper cross rod and the lower cross rod of the C-shaped frame body 1, the cooling efficiency to C type frame body 1 can be increased through cooling pipe 2 respectively to the last horizontal pole of C type frame body 1 and the cooling down of horizontal pole, and then can guarantee production rhythm, guarantee production efficiency, the conducting strip 42 adopts the ring shape setting, and adopts the axis coincidence setting between conducting strip 42 and the return line 41, and ring type and the axis coincidence setting can make conducting strip 42 carry out even cooling to return line 41, be the block connection between sleeve pipe port 44 and the heat conduction sleeve pipe 43, and offered the through-hole on the sleeve pipe port 44, the block connection can make the sleeve pipe port 44 and the connection between the heat conduction sleeve pipe 43 more firm reliable, and the through-hole can make things convenient for the inside of air entering heat conduction sleeve pipe 43, closely laminate between semiconductor refrigeration board 53 and refrigeration case two 5, and closely laminate and can make semiconductor refrigeration board 53 more reliable accurate to the heat conduction of refrigeration case two 5, install the solenoid valve on the connecting line 55, the solenoid valve can make things convenient for semiconductor refrigeration board 53 and refrigeration case one 32's break-make, agitating unit includes motor 51, motor 51 is installed in motor two the output that the motor 5 just need the agitating and agitating handle 52, and agitating handle 52 can be rotated between the agitating handle 52, and agitating handle 52 can be rotated and agitating handle 52, and agitating handle 52 can be more evenly and agitating handle, and agitating handle 52 and agitating handle is more and the agitating handle is installed.
The working principle of the utility model is as follows: when the device is used, the water pump 31 conveys cooling liquid inside the first cooling box 32 to the inside of the water inlet pipe 3, and respectively enters the inside of the cooling pipeline 2, the upper cross rod and the lower cross rod of the C-shaped frame body 1 are cooled, then the cooling liquid can flow back to the inside of the backflow pipeline 41, when the cooling liquid passes through the backflow pipeline 41, the heat conducting fin 42 can cool the cooling liquid passing through the backflow pipeline 41, the air suction fan 45 pumps hot air inside the first cooling box 43, fresh air can enter the inside of the first cooling box 43 through the sleeve port 44 to cool the heat conducting fin 42, the mode can be adopted to primarily cool the cooling liquid flowing back, the cooling liquid can flow back to the inside of the second cooling box 5 after primarily cooling, the semiconductor cooling plate 53 can cool the cooling liquid, the cooling fan 54 can cool the heating end of the semiconductor cooling plate 53 to ensure the normal operation of the device, the motor 51 can drive the stirring rod 52 to stir the cooling liquid at the moment, the cooling liquid can be enabled to cool down uniformly, the cooling liquid can slowly flow into the inside of the first cooling box 32 through the connecting pipeline 55, the first cooling box 32 can cool down the cooling liquid through the inside of the first cooling box port 44, the first cooling box can cool down the cooling liquid can continuously through the cooling box 31, the cooling efficiency can be increased to the inside the cooling box 2 can be guaranteed to the cooling frame body 2 after the preliminary cooling liquid can cool down through the cooling box 1, and the cooling frame body can be cooled down through the cooling frame 2, and the cooling frame 2 can be cooled down through the cooling frame 2 can be cooled down respectively 2 and the cooling frame 2 can be cooled down respectively.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The principles and embodiments of the present utility model have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the method of the present utility model and its core ideas. The foregoing is merely illustrative of the preferred embodiments of the utility model, and it is noted that there is virtually no limit to the specific structure which may be imposed by those skilled in the art without departing from the spirit of the utility model, and that modifications, adaptations, or variations of the foregoing features may be combined in a suitable manner; such modifications, variations and combinations, or the direct application of the inventive concepts and aspects to other applications without modification, are contemplated as falling within the scope of the present utility model.
Claims (8)
1. The utility model provides a novel C type frame cooling structure, includes C type frame body (1) and backflow pipeline (41), its characterized in that: the inside mounting of C type frame body (1) has cooling tube (2), and the left end of cooling tube (2) is connected with inlet tube (3), the below of inlet tube (3) is connected with water pump (31), and the lower extreme of inlet tube (3) is provided with refrigeration case one (32), the outside parcel of inlet tube (3) has insulation can (33), backflow pipeline (41) are installed in the left end of cooling tube (2), and the outside equidistant heat conducting strip (42) that are fixed with of backflow pipeline (41), heat conduction sleeve (43) have been cup jointed in the outside of backflow pipeline (41), and the both ends joint of heat conduction sleeve (43) has sleeve pipe port (44), a plurality of induced draught fan (45) are installed to the top of heat conduction sleeve (43), the lower extreme of backflow pipeline (41) is connected with refrigeration case two (5), agitating unit is installed on the right side of refrigeration case two (5), and semiconductor refrigeration board (53) are installed in the left side of refrigeration case two (5), the left side of semiconductor board (53) is provided with heat dissipation case two (55), refrigeration case two (55) are connected.
2. The novel C-frame cooling structure of claim 1, wherein: the number of the cooling pipelines (2) is two, and the two cooling pipelines are respectively arranged on the upper cross rod and the lower cross rod of the C-shaped frame body (1).
3. The novel C-frame cooling structure of claim 1, wherein: the heat conducting fin (42) is arranged in a circular ring shape, and the heat conducting fin (42) and the backflow pipeline (41) are arranged in an axis superposition mode.
4. The novel C-frame cooling structure of claim 1, wherein: the sleeve port (44) is connected with the heat conducting sleeve (43) in a clamping way, and a through hole is formed in the sleeve port (44).
5. The novel C-frame cooling structure of claim 1, wherein: the semiconductor refrigeration plate (53) is tightly attached to the second refrigeration box (5).
6. The novel C-frame cooling structure of claim 1, wherein: and an electromagnetic valve is arranged on the connecting pipeline (55).
7. The novel C-frame cooling structure of claim 1, wherein: the stirring device comprises a motor (51), the motor (51) is arranged on the outer side of the second refrigerating box (5), and a stirring rod (52) is arranged at the output end of the motor (51).
8. The novel C-frame cooling structure of claim 7, wherein: the stirring rod (52) and the second refrigerating box (5) are arranged in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320849679.6U CN219698290U (en) | 2023-04-17 | 2023-04-17 | Novel C-shaped frame cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320849679.6U CN219698290U (en) | 2023-04-17 | 2023-04-17 | Novel C-shaped frame cooling structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219698290U true CN219698290U (en) | 2023-09-15 |
Family
ID=87966260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320849679.6U Active CN219698290U (en) | 2023-04-17 | 2023-04-17 | Novel C-shaped frame cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219698290U (en) |
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2023
- 2023-04-17 CN CN202320849679.6U patent/CN219698290U/en active Active
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