CN116834415A - 一种抗菌抗静电包装材料及其制备方法 - Google Patents
一种抗菌抗静电包装材料及其制备方法 Download PDFInfo
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- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- WSQZNZLOZXSBHA-UHFFFAOYSA-N 3,8-dioxabicyclo[8.2.2]tetradeca-1(12),10,13-triene-2,9-dione Chemical compound O=C1OCCCCOC(=O)C2=CC=C1C=C2 WSQZNZLOZXSBHA-UHFFFAOYSA-N 0.000 description 1
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Abstract
本发明公开了一种抗菌抗静电包装材料,所述包装材料为三明治结构,所述三明治结构最内层为高分子材料,次内层为抗菌层,最外层包括热塑性材料、石墨、铜粉,所述包装材料是由多层三明治结构组成的复合结构。本发明还公开了一种抗菌抗静电包装材料的制备方法。本发明采用上述一种抗菌抗静电包装材料,可降解,具有抗菌抗静电双重功能,生产材料易得,生产成本低,密封性好,支撑强度高,可靠性好。
Description
技术领域
本发明涉及包装材料技术领域,尤其是涉及一种抗菌抗静电包装材料及其制备方法。
背景技术
包装材料在日常生活和工业生产中的应用都是非常普遍的,各个行业对包装材料有着不同的需求。
炮弹是一种易燃、易爆的危险物资,运输和储存过程对包装材料提出了苛刻的要求,包括:防水、防霉菌、防腐蚀、防紫外线、红外隐身、阻燃。一般炮弹包装材料要求导电性能优异,有良好的绝缘性能和抗静电性能,而且可以根据需要,调整材料配方,使其具有一定的电磁吸波性能,适应高技术战场的作战条件。弹药在运输和储存中除必须防止水、紫外线、霉菌、昆虫和空气中的水蒸气、氧、二氧化硫、盐份等有害物的侵蚀之外,还要防止静电、电磁、震动的危害。如何改进弹药包装,满足弹药运输、储存和使用的基本要求,是弹药包装研究人员的当务之急。因此,认真研究弹药包装的特点和发展趋势,有助于加速我国弹药包装的改革与发展。新材料及其工艺技术飞速的发展,使得弹药包装技术得到了相应的发展,许多过去未解决的防护问题随着新材料的出现迎刃而解,因此,材料科学的发展给弹药包装发展注入了新的活力。
现有的防静电技术主要是在材料表面涂抹抗静电剂,从而使包装薄膜具有一定的导电性能,但由于抗静电剂多为表面活性剂,可以游离在物体表面,易与空气中的一些物质发生作用,从而对抗静电性能产生影响。现有的抗菌抗静电的包装材料或者涂料,抗静电用石墨烯,金属铂,抗菌用纳米银、氧化锌、氧化铜和化学抗菌剂等。石墨烯价格昂贵,不易分散,纳米银虽然具有较好的抑菌效果,但其造价较高,化学抗菌剂不稳定、可靠性不高。
发明内容
本发明的目的是提供一种抗菌抗静电包装材料,可降解,具有抗菌抗静电双重功能,生产材料易得,生产成本低,密封性好,支撑强度高,可靠性好。本发明的另一个目的是提供一种抗菌抗静电包装材料的制备方法。
为实现上述目的,本发明提供了一种抗菌抗静电包装材料,所述包装材料为三明治结构,所述三明治结构最内层为高分子材料,次内层为抗菌层,最外层包括热塑性材料、石墨、铜粉,所述包装材料是由多层三明治结构组成的复合结构。
优选的,所述高分子材料为可降解高分子材料,所述可降解高分子材料为聚乳酸、聚己二酸/对苯二甲酸丁二酯、聚丁二酸丁二醇酯、聚丁二酸-己二酸丁二酯、聚己内酯、聚碳酸亚丙酯、聚羟基乙酸、聚对二氧环己酮中的一种或几种。
优选的,所述抗菌层由金属铜、金属镁、镁合金中的一种或几种组成。
优选的,所述热塑性材料为聚乙烯、聚三亚甲基碳酸酯、聚丙烯、聚氯乙烯、聚氨酯、聚羟基脂肪酸酯、腈-丁二烯-苯乙烯三元共聚物中的一种或几种。
优选的,所述石墨为鳞片石墨。
上述的一种抗菌抗静电包装材料的制备方法,包括如下步骤:
(1)先将最内层高分子材料制备成包装薄膜;
(2)采用真空蒸镀方式将抗菌层制备在步骤(1)所得的包装薄膜上;
(3)将最外层的热塑性材料与石墨和铜粉混合注塑,与步骤(2)所得抗菌包装薄膜粘合,即得包装材料的三明治结构;
(4)根据需要将步骤(3)所得三明治结构多层组合,即得抗菌抗静电包装材料。
本发明所述的一种抗菌抗静电包装材料及其制备方法的优点和积极效果是:
1、本发明包装材料为复合三明治结构,密封性好,支撑强度更高,最内层提供支撑强度,可承受抽真空操作;次内层为金属铜、金属镁,铜具有抗菌性能,镁具有降解功能,同时具有抗菌性能;最次外层提供支持,密封,防水等功能,石墨和铜粉主要起到导电、抗静电的作用。
2、本发明包装材料采用金属镁、金属铜、镁合金为抗菌层,与纳米银、化学抗菌剂相比价格低,性能稳定。
3、本发明包装材料采用石墨和铜粉抗静电,与石墨烯和金属铂相比,材料易得,价格低,适合大规模生产。
具体实施方式
以下通过实施例对本发明的技术方案作进一步说明。
除非另外定义,本发明使用的技术术语或者科学术语应当为本发明所属领域内具有一般技能的人士所理解的通常意义。本发明中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性,而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同,而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接,而是可以包括电性的连接,不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系,当被描述对象的绝对位置改变后,则该相对位置关系也可能相应地改变。
一种抗菌抗静电包装材料,包装材料为三明治结构,三明治结构最内层为高分子材料,高分子材料为可降解高分子材料,次内层为抗菌层,最外层包括热塑性材料、石墨、铜粉,包装材料是由多层三明治结构组成的复合结构。
实施例1
一种抗菌抗静电包装材料的制备方法,包括如下步骤:
(1)先将聚乳酸制备成包装薄膜,提供支撑强度,可承受抽真空密封。
(2)采用真空蒸镀方式将金属镁和金属铜制备在步骤(1)所得的包装薄膜上,铜具有抗菌性能,镁具有降解功能,同时具有抗菌性能。金属铜、金属镁与纳米银、化学抗菌剂相比,价格低,性能稳定可靠性好。
(3)将最外层的聚乙烯与鳞片石墨和铜粉混合注塑,与步骤(2)所得抗菌包装薄膜粘合,即得包装材料的三明治结构,最外层提供支撑,密封,防水等功能,鳞片石墨和铜粉,主要起到导电,抗静电的作用。鳞片石墨、铜粉与石墨烯、金属铂相比价格低,原料易得。
(4)根据需要将步骤(3)所得三明治结构多层组合,即为抗菌抗静电包装材料,包装材料由多层三明治结构复合组成,支撑强度高密封性好。
实施例2
一种抗菌抗静电包装材料的制备方法,包括如下步骤:
(1)先将聚己内酯、聚碳酸亚丙酯、聚羟基乙酸混合均匀制备成包装薄膜,提供支撑强度,可承受抽真空密封。
(2)采用真空蒸镀方式将金属镁、金属铜和镁合金混合均匀制备在步骤(1)所得的包装薄膜上,铜具有抗菌性能,镁和镁合金具有降解功能,镁具有抗菌性能。
(3)将最外层的聚三亚甲基碳酸酯与鳞片石墨和铜粉混合注塑,与步骤(2)所得抗菌包装薄膜粘合,即得包装材料的三明治结构,最外层提供支撑,密封,防水等功能,鳞片石墨和铜粉,主要起到导电,抗静电的作用。
(4)根据需要将步骤(3)所得三明治结构多层组合,即得抗菌抗静电包装材料,包装材料由多层三明治结构复合组成,支撑强度高密封性好。
实施例3
一种抗菌抗静电包装材料的制备方法,包括如下步骤:
(1)先将聚己二酸/对苯二甲酸丁二酯、聚丁二酸丁二醇酯、聚丁二酸-己二酸丁二酯混合均匀制备成包装薄膜,提供支撑强度,可承受抽真空密封。
(2)采用真空蒸镀方式将金属镁混合均匀制备在步骤(1)所得的包装薄膜上,镁具有降解功能,同时具有抗菌性能。
(3)将最外层的聚丙烯、聚氯乙烯、聚氨酯与鳞片石墨和铜粉混合注塑,与步骤(2)所得抗菌包装薄膜粘合,即得包装材料的三明治结构,最外层提供支撑,密封,防水等功能,鳞片石墨和铜粉,主要起到导电,抗静电的作用。
(4)根据需要将步骤(3)所得三明治结构多层组合,即得抗菌抗静电包装材料,包装材料由多层三明治结构复合组成,支撑强度高密封性好。
对比例1
一种抗静电包装材料的制备方法,包括如下步骤:
(1)先将聚乳酸制备成包装薄膜,提供支撑强度,可承受抽真空密封。
(2)将聚乙烯与鳞片石墨和铜粉混合注塑,与步骤(1)所得包装薄膜粘合,即得抗静电包装薄膜,提供支撑,密封,防水等功能,鳞片石墨和铜粉,主要起到导电,抗静电的作用。
(3)根据需要将步骤(2)所得抗静电包装薄膜多层组合,即为抗静电包装材料,包装材料由多层结构复合组成,支撑强度高密封性好。
对比例2
一种抗菌包装材料的制备方法,包括如下步骤:
(1)先将聚乳酸制备成包装薄膜,提供支撑强度,可承受抽真空密封。
(2)采用真空蒸镀方式将金属镁和金属铜制备在步骤(1)所得的包装薄膜上,铜具有抗菌性能,镁具有降解功能,同时具有抗菌性能。
(3)将最外层的聚乙烯,与步骤(2)所得抗菌包装薄膜粘合,即得包装材料的三明治结构,最外层提供支撑,密封,防水等功能。
(4)根据需要将步骤(3)所得三明治结构多层组合,即得抗菌包装材料,包装材料由多层三明治结构复合组成,支撑强度高密封性好。
验证例
(1)分别测定实施例1-3和对照例1的抗菌性能
将实施例1-3和对比例2所得包装材料裁剪成尺寸相同的样片,称其重量,放入锥形瓶中,并根据GB/T16886.12-2005的要求,按0.1g/mL的比例加入去离子水,置于37℃的恒温水浴振荡器中以150rpm的转速振荡浸泡,分别测试浸泡15天和30天后的样片的抗菌性能。实验结果如表1所示。
表1抗菌率测试结果
实验结果表明实施例1-3的抗菌性能达到80-90%,对比例1的抗菌性能为0。
(2)分别测定实施例1-3和对比例2的抗静电性能
采用表面电阻测试仪分别测定实施例1-3制备的包装材料与对比例2制备的包装材料的表面电阻率。实验结果如表2所示。
表2电阻率测试结果
实施例1 | 实施例2 | 实施例3 | 对比例2 | |
电阻率(Ω/m) | 10-2 | 10-3 | 10-5 | >1015 |
实施例1-3的电阻率为10-2-10-5Ω/m,对比例2的电阻率为>1015Ω/m,电阻率越高,电阻越高,导电性能越差,抗静电性能越差。
因此,本发明采用上述一种抗菌抗静电包装材料及其制备方法,包装材料可降解,具有抗菌抗静电双重功能,生产材料易得,生产成本低,密封性好,支撑强度高,可靠性好。
最后应说明的是:以上实施例仅用以说明本发明的技术方案而非对其进行限制,尽管参照较佳实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对本发明的技术方案进行修改或者等同替换,而这些修改或者等同替换亦不能使修改后的技术方案脱离本发明技术方案的精神和范围。
Claims (6)
1.一种抗菌抗静电包装材料,其特征在于:所述包装材料为三明治结构,所述三明治结构最内层为高分子材料,次内层为抗菌层,最外层包括热塑性材料、石墨、铜粉,所述包装材料是由多层三明治结构组成的复合结构。
2.根据权利要求1所述的一种抗菌抗静电包装材料,其特征在于:所述高分子材料为可降解高分子材料,所述可降解高分子材料为聚乳酸、聚己二酸/对苯二甲酸丁二酯、聚丁二酸丁二醇酯、聚丁二酸-己二酸丁二酯、聚己内酯、聚碳酸亚丙酯、聚羟基乙酸、聚对二氧环己酮中的一种或几种。
3.根据权利要求1所述的一种抗菌抗静电包装材料,其特征在于:所述抗菌层由金属铜、金属镁、镁合金中的一种或几种组成。
4.根据权利要求1所述的一种抗菌抗静电包装材料,其特征在于:所述热塑性材料为聚乙烯、聚三亚甲基碳酸酯、聚丙烯、聚氯乙烯、聚氨酯、聚羟基脂肪酸酯、腈-丁二烯-苯乙烯三元共聚物中的一种或几种。
5.根据权利要求1所述的一种抗菌抗静电包装材料,其特征在于:所述石墨为鳞片石墨。
6.根据权利要求1-5任一项所述的一种抗菌抗静电包装材料的制备方法,其特征在于,包括如下步骤:
(1)先将最内层高分子材料制备成包装薄膜;
(2)采用真空蒸镀方式将抗菌层制备在步骤(1)所得的包装薄膜上;
(3)将最外层的热塑性材料与石墨和铜粉混合注塑,与步骤(2)所得抗菌包装薄膜粘合,即得包装材料的三明治结构;
(4)根据需要将步骤(3)所得三明治结构多层组合,即得抗菌抗静电包装材料。
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