CN116825772A - Double-sided side light emitting device and support and double-sided display screen thereof - Google Patents

Abstract

The present invention relates to a double-sided side light emitting device comprising: the circuit board is provided with a first circuit layer on the first surface and a second circuit layer on the second surface; the first cup layer is arranged on the first surface of the circuit board and is provided with a hollow first cup cavity for exposing the first circuit layer; the second cup layer is arranged on the second surface of the circuit board and is provided with a hollow second cup cavity for exposing the second circuit layer; the pin group is formed by a metallized half hole arranged on one side surface of the circuit board and is electrically connected with the first circuit layer and the second circuit layer respectively; the first light-emitting unit is arranged on the first circuit layer in the first cup cavity; the second light-emitting unit is arranged on a second circuit layer in the second cup cavity. The invention also relates to a bracket of the double-sided side light emitting device and a double-sided display screen. The double-sided side light emitting device has the advantages of high integration level, thin thickness, simplicity in manufacture and the like, and can be applied to a double-sided display screen to improve the integration level of the screen body and reduce the cost of the screen body.

Description

Double-sided side light emitting device and support and double-sided display screen thereof

Technical Field

The invention relates to the technical field of luminous display, in particular to a double-sided luminous device and a bracket thereof, and also relates to a double-sided display screen using the double-sided luminous device.

Background

The side-emitting lamp bead has the advantages that the driving circuit is positioned on one side of the light-emitting surface (front surface) of the lamp bead, but not on the opposite surface (back surface) of the light-emitting surface of the lamp bead, so that the back space of the side-emitting lamp bead is left empty and can be applied to a transparent screen. The transparent screen is only one of the applications of the side-emitting lamp beads, and if another lamp bead is integrated on the back surface of the side-emitting lamp bead, a side-emitting device capable of emitting light on two sides can be formed and is applied to a double-sided display screen (such as a part of outdoor advertising boards has the requirement of double-sided display). Compared with the scheme that the reverse sides of two conventional display screens are bonded together to form a double-sided display screen, the double-sided display screen manufactured by the double-sided light emitting device has higher circuit integration level, lower cost and thinner thickness, and has a certain application prospect.

However, the existing double-sided light emitting device has the defects of unreasonable pin arrangement, difficult manufacture, difficult double-sided pixel integration and the like, and cannot simultaneously have the advantages of side light emission and double-sided light emission. For example, patent document CN202121497507.4 discloses a double-sided light-emitting lamp bead, wherein pins of the lamp bead are arranged on one of light-emitting surfaces instead of on a side surface of the lamp bead, and when the lamp bead is actually applied to a double-sided display screen, the pins of the lamp bead affect the light-emitting surface; meanwhile, as the lamp bead adopts the TOP support structure, pins are required to be LED out to the back surface of the lamp bead from the inside through a bending process, and the manufacturing process of the TOP lamp bead cannot lead out a plurality of pins of the LED chips on two sides to the side surface of the lamp bead.

Disclosure of Invention

In order to overcome at least one defect in the prior art, the invention provides a double-sided side light emitting device, which has the advantages of high integration level, thin thickness, simple manufacture and the like, and can be applied to a double-sided display screen to improve the integration level of the screen body and reduce the cost of the screen body.

The technical scheme adopted by the invention is as follows:

in a first aspect, the present invention provides a double-sided side-emitting device comprising:

the circuit board is provided with a first surface and a second surface, wherein the first surface is provided with a first circuit layer, and the second surface is provided with a second circuit layer;

the first cup layer is arranged on the first surface of the circuit board and provided with a hollow first cup cavity for exposing the first circuit layer;

the second cup layer is arranged on the second surface of the circuit board and is provided with a hollow second cup cavity so as to expose the second circuit layer;

the pin group is formed by a metallized half hole arranged on one side surface of the circuit board and is respectively and electrically connected with the first circuit layer and the second circuit layer;

the first light-emitting unit is arranged on the first circuit layer in the first cup cavity and is electrically connected with the first circuit layer;

the second light-emitting unit is arranged on the second circuit layer in the second cup cavity and is electrically connected with the second circuit layer.

The invention uses the metallized half hole arranged on one side surface of the circuit board as the pin of the device, solves the technical difficulty that the prior art can not manufacture the double-sided side light-emitting device, does not need to manufacture the pin through the bending process of TOP products, and has simpler and feasible manufacturing process. The double-sided side light-emitting device can realize double-sided light emission, and the pins are arranged on the side surface of the device and cannot influence the light-emitting surface. The double-sided side light emitting device can be used for a double-sided display screen, improves the integration level of a screen body, reduces the cost of the screen body, and has the advantages of high integration level, thin thickness, simplicity in manufacturing and the like.

More preferably, the first light emitting unit includes a first red light chip, a first green light chip, and a first blue light chip, and the second light emitting unit includes a second red light chip, a second green light chip, and a second blue light chip.

More preferably, the first circuit layer includes a plurality of pads arranged at intervals, and each chip of the first light emitting unit is arranged on the pad of the first circuit layer;

the second circuit layer comprises a plurality of bonding pads which are arranged at intervals, and each chip of the second light-emitting unit is arranged on the bonding pad of the second circuit layer;

the pin group comprises a plurality of metallized half holes which are arranged at intervals and respectively used as a plurality of pins;

each pad of the first wiring layer is connected to one pin of the pin group, and each pad of the second wiring layer is connected to one pin of the pin group.

More preferably, the pin group comprises a first pin, a second pin, a third pin, a fourth pin and a fifth pin;

the positive electrodes of the first red light chip, the first green light chip and the first blue light chip are correspondingly and electrically connected to the second pin, the fifth pin and the first pin through three bonding pads in the first circuit layer respectively, and the negative electrodes of the first red light chip, the first green light chip and the first blue light chip are electrically connected to the third pin through the same bonding pad in the first circuit layer;

the negative electrodes of the second red light chip, the second green light chip and the second blue light chip are correspondingly and electrically connected to the second pin, the fifth pin and the first pin respectively through three bonding pads in the second circuit layer, and the positive electrodes of the second red light chip, the second green light chip and the second blue light chip are electrically connected to the fourth pin through the same bonding pad in the second circuit layer.

More preferably, on the side surface of the circuit board provided with the pin group, the first pin, the second pin, the third pin, the fourth pin and the fifth pin are sequentially arranged at intervals along the length direction of the side surface;

the side surface is provided with a first side edge and a second side edge which are connected with the first surface and the second surface, the first pin is adjacent to the first side edge, and the fifth pin is adjacent to the second side edge;

the distance between the first pin and the first side is different from the distance between the fifth pin and the second side.

More preferably, the circuit board has a first side and a second side opposite to each other, the first side is provided with the pin group formed by the metallized half holes, and the second side is also provided with the metallized half holes.

More preferably, the metallized semi-hole on the first side is formed by asymmetrically dividing a metallized round hole, and the circumference of the metallized semi-hole is smaller than the semicircular circumference of the metallized round hole;

the metalized half hole on the second side surface is formed by asymmetrically dividing a metalized round hole, and the circumference of the metalized half hole is larger than that of the metalized round hole.

More preferably, the first cup cavity is filled with an encapsulation colloid covering the first light-emitting unit, and the second cup cavity is filled with an encapsulation colloid covering the second light-emitting unit.

In a second aspect, the present invention provides a mount for a two-sided light emitting device, comprising:

the circuit board is provided with a first surface and a second surface, wherein the first surface is provided with a first circuit layer, and the second surface is provided with a second circuit layer;

the first cup layer is arranged on the first surface of the circuit board and provided with a hollow first cup cavity for exposing the first circuit layer;

the second cup layer is arranged on the second surface of the circuit board and is provided with a hollow second cup cavity so as to expose the second circuit layer;

and the pin group is formed by a metallized half hole arranged on one side surface of the circuit board and is respectively and electrically connected with the first circuit layer and the second circuit layer.

More preferably, the first cup layer is fixedly laminated on the first surface of the circuit board, and the second cup layer is fixedly laminated on the second surface of the circuit board.

The invention combines the cup layer with the cup cavity and the surface of the circuit board to form the bracket through the pressing technology, so that the double-sided side light-emitting device has the function of a reflecting cup of the TOP type lamp bead, and the problem that the pins are invalid due to the fact that the molding glue molded by the CHIP packaging technology enters the half holes as the metallization is avoided.

More preferably, the plurality of pins are arranged at intervals along the length direction of the side surface on the side surface of the circuit board provided with the pin group;

the circuit board is provided with the side face of the pin group and is provided with a first side edge and a second side edge which are connected with the first surface and the second surface;

the distance between the first side and the adjacent pin is different from the distance between the second side and the adjacent pin.

In a third aspect, the present invention provides a dual-sided display screen comprising a plurality of the dual-sided light emitting devices.

The invention has the following beneficial effects:

1. the invention uses the metallized half hole arranged on one side surface of the circuit board as the pin of the device, solves the problem that the prior TOP product cannot manufacture the pin of the side light-emitting device due to the bending process, and the pin formed on the side surface cannot occupy any light-emitting surface of the device. The double-sided side light-emitting device has the advantages of side light emission and double-sided light emission, can be used for a double-sided display screen, improves the integration level of the screen body and reduces the cost of the screen body.

2. The invention adopts a pressing process, and combines the first cup layer with the first cup cavity and the second cup layer with the second cup cavity with the two sides of the circuit board respectively, so that the double-sided side light-emitting device has the function of a reflection cup of a TOP type lamp bead, and the problem that the pins are invalid due to the fact that packaging glue molded by compression molding enters a metallized half hole when adopting a CHIP packaging process is avoided, and the packaging glue can be prevented from entering the metallized half hole when the packaging glue is manufactured by dispensing glue into the first cup cavity of the first cup layer and the second cup cavity of the second cup layer.

3. The invention designs the distances between the two sides of the circuit board and the adjacent pins to be unequal, so that the two pins positioned at the most edge can be conveniently distinguished, and the pin direction of the device can be conveniently identified.

4. The invention designs the metalized half hole on one side surface of the circuit board as a pin group to be smaller than a semicircle, designs the metalized half hole on the other side surface to be larger than the semicircle, and is convenient for distinguishing the two opposite side surfaces, thereby being convenient for identifying the pin surface of the device.

5. The combined application of the 3 rd and 4 th designs plays a role in positioning the device in four directions, namely up, down, left and right, so that each pin of the device can be identified in practical application.

6. In the invention, a specific circuit design is adopted in the device, 3 of the 5 pins are set to be used as RGB pins shared by pixels on the front side and the back side of the device respectively, and the other 2 pins are used as a common electrode of the pixels on the front side and a common electrode of the pixels on the back side respectively, so that the front side and the back side of the device can be lighted up in a rapid and alternate manner. Therefore, the double-sided display screen can be driven in a scanning mode, and two pictures can be controlled by one signal only by staggering the phases of scanning signals on the front side and the back side, so that the rapid alternate display is realized.

For a better understanding and implementation, the present invention is described in detail below with reference to the drawings.

Drawings

Fig. 1A and 1B are schematic views of two light emitting surfaces of a double-sided side light emitting device according to a preferred embodiment of the present invention, respectively, wherein fig. 1A shows a first surface of a circuit board and fig. 1B shows a second surface of the circuit board;

fig. 2 is a perspective view of a holder for a double-sided light emitting device;

FIG. 3 is a schematic view of a first surface of a circuit board in a rack;

FIG. 4 is a cross-sectional view taken along the direction A-A in FIG. 3;

fig. 5A is a schematic diagram of an arrangement of a first circuit layer and a connection relationship between the first circuit layer and each pin, and fig. 5B is a schematic diagram of an arrangement of a second circuit layer and a connection relationship between the second circuit layer and each pin;

fig. 6 is a partial view of a surface of a double-layer PCB board during fabrication of a double-sided side light emitting device, showing a first surface of an insulating board provided with a first circuit layer;

fig. 7 is a schematic structural view of a double-sided display screen according to a preferred embodiment of the present invention.

Reference numerals:

the double-sided light emitting device 1, the wiring board 2, the insulating board 20, the first surface 2a, the second surface 2b, the first side 21, the second side 22, the first side 21a, the second side 21 b;

first wiring layer 31, pad one 31a, pad two 31b, pad three 31c, pad four 31d, second wiring layer 32, pad five 32a, pad six 32b, pad seven 32c, pad eight 32d;

a first cup layer 4, a first cup cavity 40, a second cup layer 5, a second cup cavity 50;

pin set 6, metallized half holes 60, 60', hole wall 601, copper layer 602, metallized round hole 600, pin one 61, pin two 62, pin three 63, pin four 64, pin five 65;

the first red light chip R1, the first green light chip G1, the first blue light chip B1, the second red light chip R2, the second green light chip G2, the second blue light chip B2, the bonding wire L, the distance d1 between the first pin 61 and the first side 21a, and the distance d2 between the fifth pin 65 and the second side 21B;

a double-layer PCB 200, a transverse cutting line 71, and a longitudinal cutting line 72;

a double-sided display 8, a light bar 9, and conductive traces 90.

Detailed Description

In the description of the present invention, it should be noted that, for the azimuth words such as the terms "center", "transverse (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., the azimuth and positional relationships are based on the azimuth or positional relationships shown in the drawings, only for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or element to be referred to must have a specific azimuth, be constructed and operated in a specific azimuth, and should not be construed as limiting the specific scope of protection of the present invention.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features. Thus, the definition of "a first", "a second", etc., may explicitly or implicitly include one or more such features, and in the description of the present invention, the meaning of "a plurality", etc., is two or more, unless otherwise specifically defined.

In the present invention, unless explicitly stated and limited otherwise, the terms "assembled," "connected," and "connected" are to be construed broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; or may be a mechanical connection; can be directly connected or connected through an intermediate medium, and can be communicated with the inside of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

Referring to fig. 1A, 1B and 2-4, a dual-sided light emitting device 1 according to a preferred embodiment of the present invention includes a bracket, a first light emitting unit and a second light emitting unit, where the bracket includes a circuit board 2, a first cup layer 4, a second cup layer 5 and a lead group 6.

The wiring board 2 includes an insulating board 20, a first wiring layer 31, and a second wiring layer 32, the insulating board 20 having opposite first and second surfaces 2a and 2b. The first circuit layer 31 is disposed on the first surface 2a, and the second circuit layer 32 is disposed on the second surface 2b.

As shown in fig. 1A, the first cup layer 4 is disposed on the first surface 2a of the circuit board 2, and is disposed around the peripheral area of the circuit board 2, so as to form a hollow first cup cavity 40, where the first circuit layer 31 is exposed in the first cup cavity 40, and is used for mounting the first light emitting unit. The first cup 40 is in particular a cylindrical cavity.

As shown in fig. 1B, the second cup layer 5 is disposed on the second surface 2B of the circuit board 2, and is disposed around the peripheral area of the circuit board 2, so as to form a hollow second cup cavity 50, where the second circuit layer 32 is exposed in the second cup cavity 50, and is used for mounting the second light emitting unit. The second cup 50 is in particular a cylindrical cavity.

As shown in fig. 2-4, the pin group 6 is formed by a metallized half hole 60 provided on one side of the circuit board 2, electrically connecting the first circuit layer 31 and the second circuit layer 32, respectively, and the pin group 6 is used for electrical connection with an external circuit.

The first circuit layer 31 and the second circuit layer 32 are specifically copper layers. The walls 601 of the metallized semi-holes 60 are covered with a copper layer 602, which copper layer 602 may be connected to the copper layers of the first and second wiring layers 31, 32, respectively, and which copper layer 602 covers only the sides of the wiring board 2 and not the sides of the first and second cup layers 4, 5, see fig. 4.

The first light emitting unit is disposed on the first circuit layer 31 in the first cup 40 and is electrically connected to the first circuit layer 31. The second light emitting unit is disposed on the second circuit layer 32 in the second cup 50 and is electrically connected to the second circuit layer 32.

Preferably, the first cup layer 4 is pressed and fixed on the first surface 2a of the circuit board 2, and the second cup layer 5 is pressed and fixed on the second surface 2b of the circuit board 2.

The insulating plate 20 is generally made of insulating resin, and the first cup layer 4 and the second cup layer 5 are made of insulating materials, such as insulating resin, thermoplastic plastic or thermosetting plastic, which can be combined with the insulating plate 20 by heating, pressing, etc.

Specifically, as shown in fig. 1A and 1B, the first light emitting unit and the second light emitting unit are RGB chips, the first light emitting unit includes a first red light chip R1, a first green light chip G1 and a first blue light chip B1, and the second light emitting unit includes a second red light chip R2, a second green light chip G2 and a second blue light chip B2, so that the dual-sided side light emitting device 1 can be used for full-color display.

Accordingly, the first circuit layer 31 includes a plurality of pads disposed at intervals, and each chip of the first light emitting unit is disposed on the pad of the first circuit layer 31. The second circuit layer 32 includes a plurality of pads disposed at intervals, and the chips of the second light emitting unit are disposed on the pads of the second circuit layer 32. The pin set 6 includes a plurality of metallized half holes 60 arranged at intervals to serve as a plurality of pins, respectively. Each pad of the first wiring layer 31 is connected to one pin of the pin group 6, and each pad of the second wiring layer 32 is connected to one pin of the pin group 6.

Specifically, the pin group 6 includes a first pin 61, a second pin 62, a third pin 63, a fourth pin 64, and a fifth pin 65.

The chips of the first light emitting unit adopt a common cathode design, positive electrodes of the first red light chip R1, the first green light chip G1 and the first blue light chip B1 are respectively and correspondingly electrically connected to the second pin 62, the fifth pin 65 and the first pin 61 through three bonding pads in the first circuit layer 31, and negative electrodes of the first red light chip R1, the first green light chip G1 and the first blue light chip B1 are electrically connected to the third pin 63 through the same bonding pad in the first circuit layer 31.

The chips of the second light emitting unit adopt a common anode design, the negative electrodes of the second red light chip R2, the second green light chip G2 and the second blue light chip B2 are respectively and correspondingly electrically connected to the second pin 62, the fifth pin 65 and the first pin 61 through three bonding pads in the second circuit layer 32, and the positive electrodes of the second red light chip R2, the second green light chip G2 and the second blue light chip B2 are electrically connected to the fourth pin 64 through the same bonding pad in the second circuit layer 32.

As shown in fig. 2, the circuit board 2 is a rectangular board, and has two sets of opposite sides, wherein one set of opposite sides is a first side 21 and a second side 22, the pin set 6 is disposed on the first side 21, and the first side 21 has a first side 21a and a second side 21b connecting the first surface 2a and the second surface 2b.

On the first side 21, the first lead 61, the second lead 62, the third lead 63, the fourth lead 64 and the fifth lead 65 are sequentially arranged at intervals along the length direction of the first side 21. The first lead 61 is adjacent to the first side 21a and the fifth lead 65 is adjacent to the second side 21b.

To facilitate visual distinction between pin 61 and pin five 65, the distance d1 between pin one 61 and the first side 21a is different from the distance d2 between pin five 65 and the second side 21b, see fig. 3. Specifically, in the illustrated embodiment, the distance d1 between the first pin 61 and the first side 21a is smaller than the distance d2 between the fifth pin 65 and the second side 21b, i.e., d1< d2.

Specifically, with respect to the first side 21, the second side 22 is also provided with a spaced metallized half hole 60', and the metallized half hole 60' is not used as a pin, is not electrically connected to other elements, and is separated from the first circuit layer 31 and the second circuit layer 32. Moreover, the size of the metallized semi-aperture 60 on the first side 21 is different from the size of the metallized semi-aperture 60' on the second side 22.

As a further preferred aspect, referring to fig. 6, the metallized semi-hole 60 on the first side 21 is formed by asymmetrically dividing the metallized round hole 600, that is, along a cutting line that does not pass through the center of the metallized round hole, and has a circumference smaller than the semicircular circumference of the metallized round hole 600; the metallized semi-hole 60' on the second side 22 is formed by asymmetrically dividing the metallized circular hole 600, that is, along a cutting line that does not pass through the center of the circle, and has a circumference greater than the circumference of the semicircle of the metallized circular hole 600.

It can be seen that the perimeter of the metallized semi-aperture 60 on the first side 21 provided with the pin set 6 is significantly smaller than the perimeter of the metallized semi-aperture 60' on the second side 22.

In the application of the device, on one hand, the perimeter of the metalized half hole 60 is obviously different from that of the metalized half hole 60', so that the metalized half hole 60' and the metalized half hole are easily distinguished, and the side of the device provided with the pin group 6 is conveniently identified; on the other hand, the metallized half holes 60 smaller than the semicircle are used as pins for welding to an external circuit, so that the effective contact area between the pins and the solder paste can be increased, the difficulty of the welding process is reduced, and the welding reliability is improved.

As shown in fig. 3, since the distance d1 between the first pin 61 and the first side 21a is smaller than the distance d2 between the fifth pin 65 and the second side 21b, and the circumference of the metallized half hole 60 on the first side 21 is smaller than the circumference of the metallized half hole 60' on the second side 22, the four directions of up, down, left and right of the device can be determined by manual visual inspection or machine image recognition, and each pin of the device can be recognized in practical application.

More specifically, referring to fig. 5A and 5B, fig. 5A shows the arrangement of the first circuit layer 31 on the first surface 2a and the connection relationship with each pin, and fig. 5A shows the arrangement of the second circuit layer 32 on the second surface 2B and the connection relationship with each pin.

The first red light chip R1 is a red light LED chip with a reverse polarity vertical structure, a negative electrode of the first red light chip is positioned at the top, and a positive electrode of the first red light chip is positioned at the bottom; the second red light chip R2 is a red light LED chip with a positive polarity vertical structure, the positive electrode of the red light LED chip is positioned at the top, and the negative electrode of the red light LED chip is positioned at the bottom; the first green light chip G1 and the second green light chip G2 are green light LED chips with normal mounting structures; the first blue light chip B1 and the second blue light chip B2 are blue light LED chips with normal mounting structures.

As shown in fig. 5A, the first circuit layer 31 includes a first pad 31a, a second pad 31b, a third pad 31c, and a fourth pad 31d. The first red light chip R1, the first green light chip G1 and the first blue light chip B1 are arranged in a row at intervals and fixed on the first bonding pad 31a, and the first green light chip G1 is located between the first red light chip R1 and the first blue light chip B1. The positive electrode at the bottom of the first red light chip R1 is eutectic welded to the first bonding pad 31a, and the negative electrode at the top of the first red light chip is connected to the second bonding pad 31b through a bonding wire L. The positive electrode of the first green chip G1 is connected to the third pad 31c through the bonding wire L, and the negative electrode thereof is connected to the second pad 31b through the bonding wire L. The positive electrode of the first blue light chip B1 is connected to the fourth land 31d through the bonding wire L, and the negative electrode thereof is connected to the second land 31B through the bonding wire L.

As shown in fig. 5B, the second wiring layer 32 includes a pad five 32a, a pad six 32B, a pad seven 32c, and a pad eight 32d. The second red light chip R2, the second green light chip G2 and the second blue light chip B2 are arranged in a row at intervals and are fixed on the fifth bonding pad 32a, and the second green light chip G2 is located between the second red light chip R2 and the second blue light chip B2. The positive electrode at the top of the second red light chip R2 is connected to the bonding pad six 32b through a bonding wire L, and the negative electrode at the bottom thereof is eutectic-bonded to the bonding pad five 32a. The positive electrode of the second green chip G2 is connected to the pad six 32b by the bonding wire L, and the negative electrode thereof is connected to the pad seven 32c by the bonding wire L. The positive electrode of the first blue light chip B1 is connected to the pad six 32B through the bonding wire L, and the negative electrode thereof is connected to the pad eight 32d through the bonding wire L.

Accordingly, the pads of the first circuit layer 31 extend to the first side 21 provided with the lead group 6 on the first surface 2a of the circuit board 2, and the pads of the second circuit layer 32 extend to the first side 21 on the second surface 2b. Specifically, the first pad 31a and the fifth pad 32a are connected to the second pin 62, the third pad 31c and the seventh pad 32c are connected to the fifth pin 65, the fourth pad 31d and the eighth pad 32d are connected to the first pin 61, the second pad 31b is connected to the third pin 63, and the sixth pad 32b is connected to the fourth pin 64, respectively.

Thus, if the first surface 2a and the second surface 2b are respectively the front surface and the back surface of the device, the first pin 61, the second pin 62 and the fifth pin 65 are respectively used as RGB pins shared by the front and back pixels of the device, the third pin 63 is used as a common negative electrode of the front pixel, and the fourth pin 64 is used as a common positive electrode of the back pixel.

When the third pin 63 is connected with the driving circuit, the fourth pin 64 is disconnected, and the first pin 61, the second pin 62 and the fifth pin 65 control the display of the front pixels of the device; when the fourth pin 64 is connected with the driving circuit, the third pin 63 is disconnected, and the first pin 61, the second pin 62 and the fifth pin 65 control the display of the reverse side pixels of the device; thus, the front and back sides of the device can be lit in rapid alternating fashion.

In the first circuit layer 31, the area of the first bonding pad 31a for die bonding is the largest, the first bonding pad is disposed in the center of the first surface 2a of the circuit board 2, the second bonding pad 31b is disposed on one side of the first bonding pad 31a close to the lead group 6, and the third bonding pad 31c and the fourth bonding pad 31d are symmetrically disposed on the other side of the first bonding pad 31a far from the lead group 6.

In the second circuit layer 32, the area of the fifth bonding pad 32a for die bonding is the largest, the fifth bonding pad is disposed in the center of the second surface 2b of the circuit board 2, the sixth bonding pad 32b is disposed on one side of the fifth bonding pad 32a close to the lead group 6, and the seventh bonding pad 32c and the eighth bonding pad 32d are symmetrically disposed on the other side of the fifth bonding pad 32a far from the lead group 6.

The pad arrangement in the first wiring layer 31 and the pad arrangement in the second wiring layer 32 may be mirror symmetrical, see fig. 5A and 5B.

In addition to the illustrated embodiments, the first and second wiring layers may take other pad arrangements to connect with the chip and/or pins in other ways.

For packaging and protecting the device, the first cup cavity 40 of the first cup layer 4 is filled with a packaging colloid (not shown) to cover each chip of the first light emitting unit; the second cup layer 5 of the second cup layer 5 is also filled with an encapsulant (not shown) to cover each chip of the second light emitting unit. The encapsulation colloid can be epoxy resin.

A method of manufacturing the double-sided side light emitting device 1, comprising:

(1) As shown in fig. 6, a double-layer PCB 200 provided with a metallized circular hole 600 is fabricated:

a plurality of transverse cut lines 71 and a plurality of longitudinal cut lines 72 are preset on the insulating plate 20, and the transverse cut lines 71 and the longitudinal cut lines 72 divide the insulating plate 20 into a plurality of rectangular unit areas.

A first circuit layer 31 is formed on the first surface 2a of the insulating plate 20 such that a set of the first circuit layers 31 is provided in each unit area of the first surface 2a. A second circuit layer 32 is formed on the second surface 2b of the insulating plate 20, such that a set of the second circuit layers 32 is provided in each unit area on the second surface 2b.

Round through holes are drilled in the insulating plate 20 along two longitudinal cutting lines 72 of each unit area, and then a copper layer is deposited on the wall surface of the through holes to form metallized round holes 600. Referring to fig. 6, in each cell region, two longitudinal cutting lines 72 do not pass through the center of the corresponding metallized round hole 600, one longitudinal cutting line 72 divides the corresponding metallized round hole 600 into metallized half holes 60 having a circumference smaller than a semicircle, and the other longitudinal cutting line 72 divides the corresponding metallized round hole 600 into metallized half holes 60' having a circumference larger than a semicircle.

In each cell region, the first and second wiring layers 31 and 32 are connected to the metallized semi-hole 60 having a circumference smaller than the semicircle, but are not connected to the metallized semi-hole 60' having a circumference larger than the semicircle.

The first cup layer 4 provided with the circular insulation through holes is pressed and fixed on the first surface 2a of the insulating board 20, after the pressing and fixing, a hollow first cup cavity 40 is arranged in each unit area of the first cup layer 4 so as to expose the corresponding first circuit layer 31, and the insulation through holes on the first cup layer 4 are mutually aligned and communicated with the metallized round holes 600 on the insulating board 20.

A second cup layer 5 with a circular insulation through hole is pressed and fixed on the second surface 2b of the insulating board 20, after the pressing and fixing, a hollow second cup cavity 50 is arranged in each unit area of the second cup layer 5 to expose the corresponding second circuit layer 32, and the insulation through hole on the second cup layer 5 is aligned and communicated with the metallized round hole 600 on the insulating board 20.

A double-layer PCB board 200 provided with metallized circular holes 600 is manufactured.

(2) Die bonding, wire bonding and packaging:

and placing and fixing each chip of the first light emitting unit on the first circuit layer 31 in each unit area of the double-layer PCB 200, bonding the chip and the first circuit layer 31 by using the bonding wires L, filling epoxy resin into the first cup cavity 40, and hardening to obtain the packaging colloid.

And placing and fixing each chip of the second light emitting unit on the second circuit layer 32 in each unit area of the double-layer PCB 200, bonding the chip and the second circuit layer 32 by using bonding wires L, filling epoxy resin into the second cup cavity 50, and hardening to obtain the packaging colloid.

(3) Cutting:

the double-layer PCB 200 is cut along the transverse cut line 71 and the longitudinal cut line 72, that is, the double-layer PCB 200 is divided according to each unit area, so as to obtain a plurality of individual double-sided side light emitting devices 1.

After the metallized round hole 600 is divided along the longitudinal cutting line 72 that does not pass through the center of the circle, five metallized half holes 60 with a circumference smaller than a semicircle are formed on one side of each obtained double-sided light emitting device 1, and are used as the lead group 6, and five metallized half holes 60' with a circumference larger than a semicircle are formed on the opposite side, so that the distinction from the lead group 6 is facilitated.

(4) The produced double-sided side light emitting device 1 was subjected to test sorting.

(5) And braiding and packaging the double-sided side light emitting device 1 with qualified quality.

Referring to fig. 7, a dual-sided display screen 8 according to a preferred embodiment of the present invention includes a plurality of the dual-sided light emitting devices 1.

Specifically, the dual-sided display 8 includes a plurality of LED light bars 9, the LED light bars 9 include a conductive circuit 90 and a plurality of dual-sided light emitting devices 1, the plurality of dual-sided light emitting devices 1 are arranged on the conductive circuit 90, and the pin group 6 of each dual-sided light emitting device 1 is installed on the conductive circuit 90 in a connection manner. The LED lamp strips 9 are arranged in parallel and electrically connected, and are spliced to form the double-sided display screen 8.

Therefore, the double-sided display screen 8 has two luminous display surfaces, the front and the back can be displayed, and the display pictures on the front and the back can be controlled independently, so that the double-sided display screen can be used for application scenes such as advertising screens.

The double-sided display screen 8 is specifically driven in a scanning manner, so that two pictures can be controlled by one signal only by staggering phases of scanning signals on the front side and the back side, as described above, when the pin three 63 is connected with the driving circuit, the pin four 64 is disconnected, and at the moment, the pin one 61, the pin two 62 and the pin five 65 control display of pixels on the front side of the device; when the fourth pin 64 is connected with the driving circuit, the third pin 63 is disconnected, and the first pin 61, the second pin 62 and the fifth pin 65 control the display of the reverse side pixels of the device; thus, the front and back sides of the double-sided display screen 8 can be displayed in a rapid alternating manner.

The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention.

Claims (15)

1. A double-sided side-emitting device, comprising:

the circuit board is provided with a first surface and a second surface, wherein the first surface is provided with a first circuit layer, and the second surface is provided with a second circuit layer;

the first cup layer is arranged on the first surface of the circuit board and provided with a hollow first cup cavity for exposing the first circuit layer;

the second cup layer is arranged on the second surface of the circuit board and is provided with a hollow second cup cavity so as to expose the second circuit layer;

the pin group is formed by a metallized half hole arranged on one side surface of the circuit board and is respectively and electrically connected with the first circuit layer and the second circuit layer;

the first light-emitting unit is arranged on the first circuit layer in the first cup cavity and is electrically connected with the first circuit layer;

the second light-emitting unit is arranged on the second circuit layer in the second cup cavity and is electrically connected with the second circuit layer.

2. The two-sided light emitting device of claim 1, wherein:

the first light emitting unit comprises a first red light chip, a first green light chip and a first blue light chip, and the second light emitting unit comprises a second red light chip, a second green light chip and a second blue light chip.

3. The two-sided light emitting device of claim 2, wherein:

the first circuit layer comprises a plurality of bonding pads which are arranged at intervals, and each chip of the first light-emitting unit is arranged on the bonding pad of the first circuit layer;

the second circuit layer comprises a plurality of bonding pads which are arranged at intervals, and each chip of the second light-emitting unit is arranged on the bonding pad of the second circuit layer;

the pin group comprises a plurality of metallized half holes which are arranged at intervals and respectively used as a plurality of pins;

each pad of the first wiring layer is connected to one pin of the pin group, and each pad of the second wiring layer is connected to one pin of the pin group.

4. A two-sided light emitting device according to claim 3 wherein:

the pin group comprises a first pin, a second pin, a third pin, a fourth pin and a fifth pin;

the positive electrodes of the first red light chip, the first green light chip and the first blue light chip are correspondingly and electrically connected to the second pin, the fifth pin and the first pin through three bonding pads in the first circuit layer respectively, and the negative electrodes of the first red light chip, the first green light chip and the first blue light chip are electrically connected to the third pin through the same bonding pad in the first circuit layer;

the negative electrodes of the second red light chip, the second green light chip and the second blue light chip are correspondingly and electrically connected to the second pin, the fifth pin and the first pin respectively through three bonding pads in the second circuit layer, and the positive electrodes of the second red light chip, the second green light chip and the second blue light chip are electrically connected to the fourth pin through the same bonding pad in the second circuit layer.

5. The two-sided light emitting device of claim 4, wherein:

the first pin, the second pin, the third pin, the fourth pin and the fifth pin are sequentially arranged at intervals along the length direction of the side surface on the side surface of the circuit board provided with the pin group;

the side surface is provided with a first side edge and a second side edge which are connected with the first surface and the second surface, the first pin is adjacent to the first side edge, and the fifth pin is adjacent to the second side edge;

the distance between the first pin and the first side is different from the distance between the fifth pin and the second side.

6. The two-sided light emitting device of claim 1, wherein:

the circuit board is provided with a first side face and a second side face which are opposite, the first side face is provided with the pin group formed by the metallized half holes, and the second side face is also provided with the metallized half holes.

7. The two-sided light emitting device of claim 6, wherein:

the metalized half hole on the first side surface is formed by asymmetrically dividing a metalized round hole, and the circumference of the metalized half hole is smaller than that of the metalized round hole;

the metalized half hole on the second side surface is formed by asymmetrically dividing a metalized round hole, and the circumference of the metalized half hole is larger than that of the metalized round hole.

8. The two-sided light emitting device of claim 1, wherein:

the first cup cavity is filled with packaging colloid covering the first light-emitting unit, and the second cup cavity is filled with packaging colloid covering the second light-emitting unit.

9. A mount for a two-sided light emitting device, comprising:

the circuit board is provided with a first surface and a second surface, wherein the first surface is provided with a first circuit layer, and the second surface is provided with a second circuit layer;

the first cup layer is arranged on the first surface of the circuit board and provided with a hollow first cup cavity for exposing the first circuit layer;

the second cup layer is arranged on the second surface of the circuit board and is provided with a hollow second cup cavity so as to expose the second circuit layer;

and the pin group is formed by a metallized half hole arranged on one side surface of the circuit board and is respectively and electrically connected with the first circuit layer and the second circuit layer.

10. The stent of claim 9, wherein: the first cup layer is fixedly laminated on the first surface of the circuit board, and the second cup layer is fixedly laminated on the second surface of the circuit board.

11. The stent of claim 9, wherein:

the first circuit layer comprises a plurality of bonding pads which are arranged at intervals and used for arranging RGB chips;

the second circuit layer comprises a plurality of bonding pads which are arranged at intervals and used for arranging RGB chips;

the pin group comprises a plurality of metallized half holes which are arranged at intervals and respectively used as a plurality of pins;

each pad of the first wiring layer is connected to one pin of the pin group, and each pad of the second wiring layer is connected to one pin of the pin group.

12. A stent as defined in claim 11 wherein:

the plurality of pins are arranged on the side surface of the circuit board, provided with the pin group, at intervals along the length direction of the side surface;

the circuit board is provided with the side face of the pin group and is provided with a first side edge and a second side edge which are connected with the first surface and the second surface;

the distance between the first side and the adjacent pin is different from the distance between the second side and the adjacent pin.

13. The stent of claim 9, wherein:

the circuit board is provided with a first side face and a second side face which are opposite, the first side face is provided with the pin group formed by the metallized half holes, and the second side face is also provided with the metallized half holes.

14. A stent as defined in claim 13 wherein:

the metalized half hole on the first side surface is formed by asymmetrically dividing a metalized round hole, and the circumference of the metalized half hole is smaller than that of the metalized round hole;

the metalized half hole on the second side surface is formed by asymmetrically dividing a metalized round hole, and the circumference of the metalized half hole is larger than that of the metalized round hole.

15. A dual sided display screen, comprising:

a plurality of the double-sided light emitting devices of any one of claims 1-8.