CN116825696B - Micro part disc arranging machine and disc arranging method - Google Patents
Micro part disc arranging machine and disc arranging method Download PDFInfo
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- CN116825696B CN116825696B CN202310820153.XA CN202310820153A CN116825696B CN 116825696 B CN116825696 B CN 116825696B CN 202310820153 A CN202310820153 A CN 202310820153A CN 116825696 B CN116825696 B CN 116825696B
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- 238000000034 method Methods 0.000 title claims description 19
- 230000007246 mechanism Effects 0.000 claims abstract description 62
- 238000012546 transfer Methods 0.000 claims abstract description 28
- 235000012431 wafers Nutrition 0.000 claims description 112
- 238000003860 storage Methods 0.000 claims description 48
- 239000000463 material Substances 0.000 claims description 27
- 238000001179 sorption measurement Methods 0.000 claims description 4
- 239000013078 crystal Substances 0.000 abstract description 31
- 230000008569 process Effects 0.000 description 10
- 238000007599 discharging Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010924 continuous production Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000013519 translation Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of disc arranging machines, in particular to a micro part disc arranging machine which comprises a frame and further comprises a plurality of disc arranging units sequentially arranged on the frame: the device comprises a wafer loading and unloading mechanism, a jig loading and unloading mechanism, a suction mechanism and a transfer bracket. The wafer loading and unloading mechanism is used for loading or unloading operation to the wafer plate, the tool loading and unloading mechanism is used for loading or unloading operation to the tool plate, the suction mechanism is used for moving the wafer from the wafer loading and unloading mechanism to the tool loading and unloading position, and the transfer support is used for transferring and temporarily storing during loading and unloading of the tool. The device has high automation degree, reduces labor cost, avoids manual direct contact with products, greatly improves the balance efficiency and safety of crystals or other small parts, realizes accurate transfer of the crystals or other small parts, and ensures the placement quality of the crystals or other small parts.
Description
Technical Field
The invention relates to the technical field of disc arranging machines, in particular to a micro part disc arranging machine and a disc arranging method.
Background
In the processing and assembly processes of some products, a plurality of small parts are required to be placed at small part placement positions on the jig according to a preset arrangement sequence, in general, a plurality of small part placement positions which are vertically and horizontally arranged on the jig can be preset, each small part is placed at a corresponding position, and the stability of the assembly of the small parts and the ceramic plate is guaranteed.
To the whole array wobble plate of tiny spare part like crystal, at present, adopt artifical goods of furniture for display rather than for use all the time in the trade, the workman is manual snatchs the widget from the charging tray promptly and puts it in the corresponding position department of tool board, put and adhere to the widget of ceramic plate according to preset arrangement order when the widget is whole, the workman takes away the ceramic plate again after putting the position, this process is loaded down with trivial details time consuming, inefficiency, workman intensity of labour is big, the quality of putting of widget also hardly obtains guaranteeing, greatly influence the assembly efficiency and the assembly quality of widget and ceramic plate, and then influence subsequent processing and the assembly quality of product.
Disclosure of Invention
The present invention is directed to a micro part arranging machine and arranging method, which at least solves one of the problems mentioned in the background art.
The technical scheme of the invention is as follows:
the utility model provides a tiny part wobble plate machine, includes the frame, still includes to set gradually in the frame:
the wafer loading and unloading mechanism comprises a wafer storage assembly and a wafer transportation assembly, wherein a wafer plate is stored in the wafer storage assembly, and the wafer transportation assembly can pull out the wafer plate;
the jig loading and unloading mechanism comprises a jig storage assembly and a jig transportation assembly, wherein jig plates are stored in the jig storage assembly, and the jig transportation assembly can pull out the jig plates along the edges;
the suction mechanism is used for taking out the wafer from the wafer plate and placing the wafer on the jig plate;
the transfer support is arranged between the jig storage assembly and the jig transportation assembly.
Further, the jig transporting assembly comprises a first driving device, a first track and a first sliding frame, wherein the first driving device drives the first sliding frame to slide on the first track, a third driving device and a first extending plate are arranged in the first sliding frame, and the third driving device drives the first extending plate to move up and down.
Further, a supporting plate is arranged above the third driving device, the supporting plate is fixedly connected with the first extending plate, a vacuum adsorption device is arranged below the supporting plate, and a fixing groove for accommodating the supporting plate is formed in a position, corresponding to the supporting plate, in the first sliding frame.
Further, a fourth driving device is arranged below the jig storage assembly and drives the jig storage assembly to lift so as to load and unload the jigs.
Further, the wafer transportation assembly comprises a second driving device, a second track and a second sliding block, the second driving device drives the second sliding block to slide on the second track, the second sliding block is fixedly connected with a second extending plate, a fifth driving device is arranged below the wafer storage assembly, and the fifth driving device drives the wafer storage assembly to lift.
Further, a plurality of protrusions are arranged on the second extending plate, a plurality of grooves are correspondingly arranged on the wafer plate, and the grooves are movably connected with the protrusions.
Further, the suction mechanism comprises a material taking track, a material taking assembly and a suction head which is arranged on the material taking assembly and used for sucking wafers, and the material taking assembly can drive the suction head to reciprocate between the wafer plate and the jig plate along the material taking track.
Further, a positioning mechanism is arranged on the frame and comprises an upper positioning assembly and a lower positioning assembly, the upper positioning assembly obtains the position information of the wafer or the jig plate and sends the position information to the material taking assembly, and the lower positioning assembly obtains the position information of the suction head and sends the position information to the material taking assembly.
Further, the take-off assembly includes a rotary drive.
The method for arranging the micro parts adopts the micro part arranging machine and comprises the following steps: the wafer transport assembly is capable of pulling out a wafer sheet stored in the wafer storage assembly; the wafer is taken out from the wafer plate by the suction mechanism; the jig transporting assembly pulls the jig plate stored in the jig storing assembly out to the transfer bracket along the first guide rail; the first driving device drives the first sliding frame to the transfer bracket; the third driving device drives the supporting plate to support the jig plate and the extending plate; the first driving device drives the first sliding frame to drive the jig plate to the lower part of the suction mechanism; the suction mechanism places the wafer on the jig plate; the jig transporting assembly pushes the jig plate completed by the swinging plate back into the jig storing assembly.
The invention provides a micro part tray arranging machine through improvement, which has at least one of the following improvements and advantages compared with the prior art:
according to the invention, the crystal plate loaded with crystals is conveyed to the lower part of the clamping component through the crystal conveying component, the jig plate loaded with the swinging plate jig is conveyed to the transfer support through the first extending plate of the jig conveying component, then the jig plate positioned at the transfer support is supported and fixed through the supporting plate of the jig conveying component, after the supporting and fixing, the jig plate is moved to the lower part of the suction mechanism, and small parts such as crystals are continuously clamped onto the jig plate through the suction mechanism until the swinging plate of the crystals or other small parts is completed. The device has high automation degree, reduces labor cost, avoids manual direct contact with products, greatly improves the wobble plate efficiency and safety of crystals or other small parts, realizes accurate transfer of the crystals or other small parts, and ensures the placement quality of the crystals or other small parts.
Drawings
The invention is further explained below with reference to the drawings and examples:
FIG. 1 is a schematic view of a wobble plate machine according to the present invention;
FIG. 2 is a schematic diagram of the feeding and discharging mechanism of the jig;
FIG. 3 is a schematic structural view of a crystal feeding and discharging mechanism according to the present invention;
FIG. 4 is a schematic view of the structure of the suction mechanism according to the present invention;
FIG. 5 is a schematic view of a part of the structure of the feeding and discharging mechanism of the jig;
FIG. 6 is a schematic view of a part of the structure of the feeding and discharging mechanism of the jig;
FIG. 7 is a schematic view of a part of the structure of the feeding and discharging mechanism of the jig;
FIG. 8 is an enlarged schematic view of the structure at A in FIG. 3;
fig. 9 is an enlarged schematic view of the structure at B in fig. 4.
Reference numerals illustrate:
1. a frame; 2. a wafer loading and unloading mechanism; 21. a wafer storage assembly; 23. a wafer plate; 231. a groove; 221. a second driving device; 222. a second track; 223. a second slider; 224. a second extension plate; 211. a fifth driving device; 2241. a protrusion; 3. a jig feeding and discharging mechanism; 31. a jig storage component; 32. a jig transport assembly; 33. a jig plate; 321. a first driving device; 322. a first track; 323. a first carriage; 324. a third driving device; 325. a first extension plate; 326. a supporting plate; 327. a fixing groove; 311. a fourth driving device; 4. a suction mechanism; 41. a material taking track; 42. a material taking assembly; 43. a suction head; 5. a transfer bracket; 6. a positioning mechanism; 61. an upper positioning assembly; 62. and a lower positioning assembly.
Detailed Description
The following detailed description of the invention clearly and completely describes the technical solution in the embodiments of the invention.
In the description of the present invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality is one or more, the meaning of a plurality is two or more, and greater than, less than, exceeding, etc. are understood to exclude the present number, and above, below, within, etc. are understood to include the present number. It should also be understood that the term "and/or" as used in this specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless expressly specified otherwise.
In addition, in the description of the present application and the appended claims, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and are not to be construed as indicating or implying relative importance.
In the description of the present invention, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present invention can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
The invention provides a micro part disc arranging machine through improvement, which comprises the following technical scheme:
referring to fig. 1, a micro part tray arranging machine comprises a frame 1 and further comprises a plurality of tray arranging units sequentially arranged on the frame 1: the wafer loading and unloading mechanism 2, the jig loading and unloading mechanism 3, the suction mechanism 4 and the transfer support 5. The wafer loading and unloading mechanism 2 is used for loading or unloading operations on the wafer plate 23, the jig loading and unloading mechanism 3 is used for loading or unloading operations on the jig plate 33, the suction mechanism 4 is used for moving the wafer from the wafer loading and unloading mechanism 2 to the jig loading and unloading position, and the transfer support 5 is used for transferring temporary storage during loading and unloading of the jig.
Referring to fig. 3, the wafer loading and unloading mechanism 2 includes a wafer storage assembly 21 and a wafer transport assembly, wherein a wafer sheet 23 is stored in the wafer storage assembly 21, and the wafer transport assembly can pull out the wafer sheet 23. Referring to fig. 2, the jig loading and unloading mechanism 3 includes a jig storage component 31 and a jig transporting component 32, wherein a jig plate 33 is stored in the jig storage component 31, and the jig transporting component 32 can pull out the jig plate 33. Referring to fig. 4, the suction mechanism 4 is used for taking out the wafer from the wafer plate 23 and placing the wafer on the jig plate 33.
The micro part tray arranging machine utilizes a wafer loading and unloading mechanism 2 and a jig loading and unloading mechanism 3 to respectively convey a wafer plate 23 and a jig plate 33 for loading; the wafer on the wafer plate 23 is grabbed by the suction mechanism 4 and placed at the corresponding position of the jig plate 33, so that automatic wafer feeding is realized, and the wafer is ensured to be accurately placed on the jig plate 33 according to a preset arrangement sequence to complete the assembly of the wafer and the jig plate 33. The micro part tray arranging machine adopts a full-automatic production operation mode, has high integration level, greatly improves the tray arranging efficiency, reduces the labor cost and simultaneously ensures the assembly quality of the micro parts and the ceramic plate.
In some embodiments of the present invention, referring to fig. 2, considering that the process of transferring the jig plates 33 from the jig storage assembly 31 one by the jig transport assembly 32 is long, the positions of the jig plates 33 may deviate during the transportation, and the jig plates 33 may shift, be in disorder in position, etc. during the drawing process due to vibration of the whole automation equipment, etc., the transfer bracket 5 is disposed, and the transfer bracket 5 is disposed between the jig storage assembly 31 and the jig transport assembly 32. The transfer support 5 is used for transferring the jig plate 33, and repositioning the position of the jig plate 33 on one hand; on the other hand, through setting up transfer support 5, with tool transportation subassembly 32 to the tool board 33 from tool storage subassembly 31 in proper order transfer to the stroke of suction means 4 below one by one shorten, avoid overlength stroke to lead to the position deviation of tool board 33 too big, ensure the uniformity of all tool boards 33, improve subsequent assembly efficiency and quality.
In some embodiments, in order to facilitate the drawing of the jig plate 33 by the jig transporting assembly 32, referring to fig. 2 and 5, the jig transporting assembly 32 includes a first driving device 321, a first rail 322 and a first carriage 323, the first driving device 321 drives the first carriage 323 to slide on the first rail 322, the first driving device 321 may be a conventional motor, the motor is in transmission connection with the first carriage 323 through a screw rod, the first driving device 321 may also be a conventional cylinder, and a push rod of the cylinder is fixedly connected with the first carriage 323, which is not limited by a specific structure, so that the jig transporting assembly 32 can draw the jig plate 33 in the above manner.
A third driving device 324 and a first extension plate 325 are disposed in the first carriage 323, and the third driving device 324 drives the first extension plate 325 to move up and down. A supporting plate 326 is disposed above the third driving device 324, and the supporting plate 326 is fixedly connected to the first extending plate 325. The third driving device 324 may be a conventional cylinder fixedly connected to the supporting plate 326, and in some embodiments, in order to ensure the stability of the lifting of the supporting plate 326, a plurality of third driving devices 324 may be provided, and the specific structure of the third driving device 324 is not limited, so that the lifting of the supporting plate 326 may be achieved in the above manner.
It can be understood that in the automatic tray arranging process of the micro part tray arranging machine, the jig transporting assembly 32 in the jig loading and unloading mechanism 3 firstly takes out the jig plate 33 in the jig storing assembly 31 and transfers the jig plate 33 to the transferring support 5. Specifically, the first extending board 325 translates on the first rail 322 along with the first carriage 323 under the driving of the first driving device 321, the first extending board 325 is inserted into the jig storage assembly 31 to support the jig board 33, then the first extending board 325 drives the jig board 33 to the upper side of the transfer frame 5 under the driving of the first driving device 321, and then the third driving device 324 drives the first extending board 325 to descend, so that the jig board 33 falls on the transfer frame 5. Then, the first driving device 321 drives the first carriage 323 and the support to slide along the first track 322 to the position of the transfer support 5, at this time, the support plate 326 is located under the jig plate 33, then the third driving device 324 drives the support plate 326 to rise, the jig plate 33 is supported in the fixing groove 327, and then the first driving device 321 transfers the support plate 326 and the jig plate 33 to the position under the suction mechanism 4 along the first track 322 for placing. The whole fixture loading and unloading mechanism 3 is ingenious in structure, frequent loading or unloading does not need to be manually conducted, complicated operation of manually arranging the trays one by one is omitted, manpower and material resources are greatly saved, the whole fixture loading and unloading process is fully-automatic, the action is smooth and continuous, the tray arranging efficiency of products is greatly improved, and the fixture loading and unloading mechanism is suitable for large-scale continuous production.
In some embodiments, in order to make the jig plate 33 not easy to shift due to vibration or other influence of the whole equipment during the swaying process, in order to make crystals or other small parts after swaying stably placed on the jig plate 33, referring to fig. 6, a vacuum adsorption device (not shown) is disposed below the supporting plate 326, and when the suction mechanism 4 places the crystals or other small parts on the jig plate 33, the vacuum adsorption device adsorbs the crystals or other small parts, so that the crystals or other small parts are not easy to shift again after placement is completed, and placement is more accurate. A fixing groove 327 for accommodating the pallet 326 is provided in the first carriage 323 at a position corresponding to the pallet 326. The support plate 326 may drive the jig plate 33 thereon to rise under the driving of the third driving device 324, the jig plate 33 rises into the fixing groove 327 in the first carriage 323, the fixing groove 327 is used for fixing the jig plate 33, at this time, the displacement of the whole jig plate 33 in the up-down direction is limited by the first carriage 323 and the support plate 326, and the displacement of the whole jig plate 33 in the front-back and left-right directions is limited by the fixing groove 327, so that the problems of displacement, messy positions and the like of the jig plate 33, which may occur due to vibration and the like of the whole automation equipment, are effectively avoided, and the placement of crystals or other small parts is more accurate and efficient.
In some embodiments, in order to store more jig boards 33 at a time, the jig boards 33 are in a multi-layer structure, it is easy to think that the jig storage component 31 stores multiple layers of jig boards 33, and the jig transportation component 32 only has a lifting device with a shorter stroke, and cannot take out the jig boards 33 with a higher or lower layer number, so that a fourth driving device 311 is arranged below the jig storage component 31, see fig. 7, and the fourth driving device 311 drives the jig storage component 31 to lift for loading and unloading the jigs. When the placement of the jig plate 33 is completed, the fourth driving device 311 drives the jig storage assembly 31 to have a layer with a space slightly lower than the first extending plate 325, and the first extending plate 325 is inserted into the space layer and then receives the jig plate 33 after the placement is completed; then the first extending plate 325 is withdrawn from the jig storage assembly 31, the fourth driving device 311 drives the jig storage assembly 31 to the jig plate 33 of the next empty tray to be slightly higher than the first extending plate 325, and then the first extending plate 325 is inserted into the jig storage assembly 31 to take out the jig plate 33 of the next empty tray, and the above steps are repeated. The whole process is fully automatic, the jig transporting assembly 32 can be smoothly and continuously automatically taken out of the jig storing assembly 31 or put back to the jig plate 33, the loading and unloading operation of the jig is completed, the production efficiency is high, and the jig transporting assembly is suitable for large-scale continuous production.
In some embodiments, in order to facilitate the pulling out of the wafer plate 23 by the wafer transport assembly, referring to fig. 3 and 8, the wafer transport assembly includes a second driving device 221, a second rail 222, and a second slider 223, where the second driving device 221 drives the second slider 223 to slide on the second rail 222, and the second slider 223 is fixedly connected with a second extension board 224, and the second extension board 224 is used to take out the wafer plate 23 from the wafer storage assembly 21. The second driving device 221 may be a conventional motor, the motor is in transmission connection with the first carriage 323 through a screw rod, the second driving device 221 may also be a conventional cylinder, a push rod of the cylinder is fixedly connected with the second slider 223, and the specific structure is not limited, so that the wafer transporting assembly can take out the wafer plate 23 through the above manner.
A fifth driving device 211 is disposed below the wafer storage assembly 21, and the fifth driving device 211 drives the wafer storage assembly 21 to lift. It is easy to think that, similar to the jig storage assembly 31, in order to place more wafer boards 23, the wafer storage assembly 21 is also of a multi-layer design, and a fifth driving device 211 is arranged below the wafer storage assembly 21 to drive the wafer storage assembly 21 to lift and lower, so as to adapt to loading and unloading in cooperation with the wafer transport assembly.
In some embodiments, it is easy to think that if the second extending plate 224 is used alone to mount the wafer plate 23 and then pull out, the wafer plate 23 is easy to slip or slip out, in order to pull out the wafer plate 23 more firmly, the second extending plate 224 is provided with a plurality of protrusions 2241, and the wafer plate 23 is correspondingly provided with a plurality of grooves 231, and the grooves 231 are movably connected with the protrusions 2241. The protrusions 2241 correspond to the grooves 231, the protrusions 2241 on the second extending plate 224 can be clamped into the grooves 231 to drive the wafer plate 23 to move along the second track 222 in a direction away from the wafer storage assembly 21, and the wafer plate 23 is not easy to slip or deviate due to the driving of the protrusions 2241, and the protrusions 2241 are movably connected with the grooves 231 on the wafer plate 23 through the protrusions 2241 arranged on the second extending plate 224, so that stable transportation of the wafer plate 23 is realized.
It will be appreciated that in the automatic tray arranging process of the micro parts arranging machine, the second extending plate 224 of the wafer loading and unloading mechanism 2 is inserted into the wafer storage device under the driving of the second driving device 221, then the wafer storage device is lowered under the driving of the fifth driving device 211, and the wafer plate 23 falls on the second extending plate 224. The second drive means 221 then drive the second slider 223 and the second extension plate 224 along the second track 222 close to the suction means 4 until the crystal plate is below the suction means 4. The whole process is fully automatic, the crystal transport assembly can smoothly and continuously take out or put back the crystal plate from the crystal storage assembly automatically, the loading and unloading operation of the crystal is completed, the production efficiency is high, and the method is suitable for large-scale continuous production.
In some embodiments, referring to fig. 4 and fig. 9, in order to enable gripping of crystals or other small parts in more directions, the suction mechanism 4 includes a material taking track 41, a material taking component 42, and a suction head 43 disposed on the material taking component 42 and used for sucking wafers, where the material taking component 42 may drive the suction head 43 to reciprocate between the wafer plate 23 and the jig plate 33 along the material taking track 41, the suction head 43 is a conventional vacuum suction head 43 structure, or the suction head 43 may be replaced by a pneumatic clamping jaw for gripping or releasing the crystals, i.e., the suction head 43 may also be a pneumatic clamping jaw including two synchronous movements, and the pneumatic clamping jaw or suction head 43 may be selected according to the structure of the actual product, so that the whole tray arranging machine is convenient to adapt to small parts with different structures.
In some embodiments, since the crystals or other small parts have directions, in order to differentiate the directions of the crystals or small parts, the material taking assembly 42 includes a rotation driving device to implement a rotation transfer of the suction head 43 in space, and the suction head 43 is used to drive the crystals or small parts to rotate so as to adjust the directions. The material taking assembly 42 may further drive the suction head 43 to perform fine movement parallel to the first track 322 and lift in a vertical direction, so as to finely adjust the position of the suction head 43, and perform more fine swaying operation.
In some embodiments, in order to more precisely determine the position of the crystal or other small part or jig plate 33, referring to fig. 4 and 9, the frame 1 is provided with a positioning mechanism 6, and the positioning mechanism 6 includes an upper positioning assembly 61 and a lower positioning assembly 62, where the upper positioning assembly 61 obtains the position information of the wafer or jig plate 33 and sends the position information to the material taking assembly 42, and the lower positioning assembly 62 obtains the position information of the suction head 43 and sends the position information to the material taking assembly 42. The upper positioning assembly 61 and the lower positioning assembly 62 may each be a CCD camera. It will be appreciated that, in order to enable the upper positioning assembly 61 to obtain the position of the wafer or the jig plate 33, the positioning mechanism 6 is further provided with a translation assembly, where the translation assembly includes a third track, a third slider, and a sixth driving device, where the upper positioning assembly 61 is fixedly connected to the third slider, and the sixth driving device drives the third slider to slide on the third track. The upper positioning assembly 61 is driven by the third slider to slide reciprocally along the third slider, so as to capture and position the wafer feeding position on the second rail 222 and the jig plate 33 feeding position on the first rail 322. The upper positioning assembly 61 feeds back the position of the photographed wafer to the background program, so as to determine whether the suction head 43 needs to rotate at an angle under the driving of the driving device to adapt to the position of the wafer material, thereby improving the placement quality of the wafer. The lower positioning component 62 is used for shooting and positioning the position of the suction head 43, so as to determine whether the air suction head 43 needs to be driven by a motor to rotate at an angle to adapt to the position of the jig plate 33, and the placement quality of small parts is improved.
The method for arranging the micro parts adopts the micro part arranging machine and comprises the following steps: the wafer transport assembly is capable of pulling out the wafer sheet 23 stored in the wafer storage assembly 21; the suction mechanism 4 takes out the wafer from the wafer plate 23; the jig transporting assembly 32 pulls the jig plate 33 stored in the jig storing assembly 31 to the transfer bracket 5 along the first guide rail; the first driving device 321 drives the first carriage 323 to the transfer bracket 5; the third driving device 324 drives the supporting plate 326 and the extending plate 325 to support the jig plate 33; the first driving device 321 drives the first carriage 323 to drive the jig plate 33 to the lower part of the suction mechanism 4; the suction mechanism 4 places the wafer on the jig plate 33; the jig transporting assembly 32 pushes the jig plate 33 completed by the swing tray back into the jig storing assembly 31.
The micro part tray arranging machine adopts a full-automatic production operation mode, has high integration level, greatly improves the assembly efficiency of the crystal or other small parts and the jig plate 33, reduces the labor cost and simultaneously ensures the assembly quality between the crystal or other small parts and the jig plate 33.
The present invention is not limited to the above-mentioned embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present invention are intended to be included in the scope of the present invention.
Claims (8)
1. The utility model provides a tiny part wobble plate machine, includes frame (1), its characterized in that still includes to set gradually on frame (1):
the wafer loading and unloading mechanism (2) comprises a wafer storage assembly (21) and a wafer transport assembly, wherein a wafer plate (23) is stored in the wafer storage assembly (21), and the wafer transport assembly can pull out the wafer plate (23);
the jig loading and unloading mechanism (3) comprises a jig storage assembly (31) and a jig transportation assembly (32), a jig plate (33) is stored in the jig storage assembly (31), the jig transportation assembly (32) can pull out the jig plate (33) along the drawing direction, the jig transportation assembly (32) comprises a first driving device (321), a first track (322) and a first sliding frame (323), the first driving device (321) drives the first sliding frame (323) to slide on the first track (322), a third driving device (324) and a first extending plate (325) are arranged in the first sliding frame (323), the third driving device (324) drives the first extending plate (325) to move up and down, a supporting plate (326) is arranged above the third driving device (324), the supporting plate (326) is fixedly connected with the first extending plate (325), a vacuum adsorption device is arranged below the first sliding frame (326), and the first sliding frame (326) and the position (326) are correspondingly provided with a supporting plate (325) to be used for accommodating and fixing the supporting plate (327);
the suction mechanism (4) is used for taking out the wafer from the wafer plate (23) and placing the wafer on the jig plate (33);
the transfer support (5), transfer support (5) set up tool storage module (31) with between tool transportation subassembly (32).
2. The micro part tray arranging machine according to claim 1, wherein a fourth driving device (311) is arranged below the jig storage assembly (31), and the fourth driving device (311) drives the jig storage assembly (31) to lift for jig loading and unloading.
3. The micro part tray arranging machine according to claim 2, wherein the wafer transporting assembly comprises a second driving device (221), a second rail (222) and a second sliding block (223), the second driving device (221) drives the second sliding block (223) to slide on the second rail (222), the second sliding block (223) is fixedly connected with a second extending plate (224), a fifth driving device (211) is arranged below the wafer storing assembly (21), and the fifth driving device (211) drives the wafer storing assembly (21) to lift.
4. A micro parts tray arranging machine according to claim 3, wherein a plurality of protrusions (2241) are provided on the second extending plate (224), a plurality of grooves (231) are correspondingly provided on the wafer plate (23), and the grooves (231) are movably connected with the protrusions (2241).
5. The micro part tray arranging machine according to claim 4, wherein the sucking mechanism (4) comprises a material taking track (41), a material taking assembly (42) and a suction head (43) arranged on the material taking assembly (42) and used for sucking wafers, and the material taking assembly (42) can drive the suction head (43) to reciprocate between the wafer plate (23) and the jig plate (33) along the material taking track (41).
6. The micro part tray arranging machine according to claim 5, wherein a positioning mechanism (6) is arranged on the frame (1), the positioning mechanism (6) comprises an upper positioning component (61) and a lower positioning component (62), the upper positioning component (61) obtains position information of the wafer or jig plate (33) and sends the position information to the material taking component (42), and the lower positioning component (62) obtains position information of the suction head (43) and sends the position information to the material taking component (42).
7. A micro parts palletizer according to claim 5 or 6, wherein the take-out assembly (42) comprises rotary drive means.
8. A method for arranging micro parts, characterized in that the method comprises the steps of: the wafer transport assembly is capable of pulling out a wafer sheet (23) stored in a wafer storage assembly (21); the suction mechanism (4) takes out the wafer from the wafer plate (23); the jig transporting assembly (32) pulls the jig plate (33) stored in the jig storing assembly (31) to the transfer bracket (5) along the first guide rail; the first driving device (321) drives the first sliding frame (323) to the position of the transit bracket (5); the third driving device (324) drives the supporting plate (326) and the extending plate (325) to support the jig plate (33); the first driving device (321) drives the first sliding frame (323) to drive the jig plate (33) to the lower part of the suction mechanism (4); the suction mechanism (4) places the wafer on the jig plate (33); the jig transporting assembly (32) pushes the jig plate (33) completed by the swinging plate back into the jig storing assembly (31).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310820153.XA CN116825696B (en) | 2023-07-06 | 2023-07-06 | Micro part disc arranging machine and disc arranging method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310820153.XA CN116825696B (en) | 2023-07-06 | 2023-07-06 | Micro part disc arranging machine and disc arranging method |
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| Publication Number | Publication Date |
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| CN116825696A CN116825696A (en) | 2023-09-29 |
| CN116825696B true CN116825696B (en) | 2024-03-22 |
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| Application Number | Title | Priority Date | Filing Date |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010129949A (en) * | 2008-12-01 | 2010-06-10 | Fuji Mach Mfg Co Ltd | Component supply apparatus |
| CN111806978A (en) * | 2020-06-23 | 2020-10-23 | 珠海市协正智能装备有限公司 | Balance placing machine |
| CN113979028A (en) * | 2021-11-17 | 2022-01-28 | 绍兴奥美电子科技有限公司 | Automatic wafer feeding and tray arranging machine and tray arranging method thereof |
| CN215815812U (en) * | 2021-09-27 | 2022-02-11 | 深圳宝创电子设备有限公司 | Full-automatic lens chip dispensing and pasting machine |
| CN217675420U (en) * | 2022-05-17 | 2022-10-28 | 东莞市正远智能装备有限公司 | Automatic balance equipment |
-
2023
- 2023-07-06 CN CN202310820153.XA patent/CN116825696B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010129949A (en) * | 2008-12-01 | 2010-06-10 | Fuji Mach Mfg Co Ltd | Component supply apparatus |
| CN111806978A (en) * | 2020-06-23 | 2020-10-23 | 珠海市协正智能装备有限公司 | Balance placing machine |
| CN215815812U (en) * | 2021-09-27 | 2022-02-11 | 深圳宝创电子设备有限公司 | Full-automatic lens chip dispensing and pasting machine |
| CN113979028A (en) * | 2021-11-17 | 2022-01-28 | 绍兴奥美电子科技有限公司 | Automatic wafer feeding and tray arranging machine and tray arranging method thereof |
| CN217675420U (en) * | 2022-05-17 | 2022-10-28 | 东莞市正远智能装备有限公司 | Automatic balance equipment |
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| Publication number | Publication date |
|---|---|
| CN116825696A (en) | 2023-09-29 |
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