CN116825415A - Mirror module, synchrotron radiation device and free electron laser device - Google Patents
Mirror module, synchrotron radiation device and free electron laser device Download PDFInfo
- Publication number
- CN116825415A CN116825415A CN202310786433.3A CN202310786433A CN116825415A CN 116825415 A CN116825415 A CN 116825415A CN 202310786433 A CN202310786433 A CN 202310786433A CN 116825415 A CN116825415 A CN 116825415A
- Authority
- CN
- China
- Prior art keywords
- heating
- cooling
- reflecting surface
- mirror module
- connection layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003574 free electron Substances 0.000 title claims abstract description 15
- 230000005469 synchrotron radiation Effects 0.000 title claims description 10
- 238000001816 cooling Methods 0.000 claims abstract description 88
- 238000010438 heat treatment Methods 0.000 claims abstract description 80
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 6
- 230000005496 eutectics Effects 0.000 claims description 6
- 229910052733 gallium Inorganic materials 0.000 claims description 6
- 229910052738 indium Inorganic materials 0.000 claims description 6
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical group [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 6
- 230000000452 restraining effect Effects 0.000 claims description 2
- 230000005855 radiation Effects 0.000 abstract description 5
- 230000001360 synchronised effect Effects 0.000 abstract description 5
- 230000002401 inhibitory effect Effects 0.000 abstract description 4
- 238000001179 sorption measurement Methods 0.000 description 10
- 230000002829 reductive effect Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000000670 limiting effect Effects 0.000 description 5
- 239000000498 cooling water Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000010485 coping Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Abstract
The application discloses a reflector module, a synchronous radiation device and a free electron laser device, and relates to the technical field of synchronous radiation and free electron laser. The reflector module comprises a reflector body, a heating component and a cooling component, wherein the reflector body is provided with an upper surface and a side surface, the upper surface is a reflecting surface of a light beam, the side surface is penetrated and provided with a groove, the groove is arranged along a first direction, and the groove is used for inhibiting thermal deformation of the reflector body: the heating component is connected to the side face, is positioned on one side of the groove close to the upper surface and is used for performing temperature compensation on the reflecting surface; the cooling component is connected with the heating component and transfers heat of the heating component so as to reduce the temperature of the reflecting surface. The reflector module provided by the application can play a role in meeting the preset requirement on the condition that the light spot center is inconsistent with the physical center of the reflecting surface, and the height error RMS value and the slope error RMS value of the reflector surface are both satisfied.
Description
Technical Field
The application relates to the technical field of synchronous radiation and free electron laser, in particular to a reflector module, a synchronous radiation device and a free electron laser device.
Background
The mirrors of beam lines in synchrotron radiation and free electron laser devices typically absorb the thermal load from the light source. After the reflector absorbs the heat power of the light source, a temperature gradient is generated on the reflector, so that the thermal deformation of the reflector occurs, and the transmission efficiency and the transmission quality of X-rays are finally adversely affected.
The fourth generation light source, whether it is a diffraction limit ring or a free electron laser device, puts very high demands on the shape control of the mirror body of the mirror, and generally requires a height error RMS (Root Mean Square) value of about 1nm and a slope error RMS value of about 100nrad, so that a proper shape scheme must be adopted for the mirror.
The current cooling scheme of the beam line reflector has the side grooving design adopted in the related technology besides the common side contact cooling, and the surface thermal deformation under the action of specific heat load is minimized by optimizing parameters such as grooving position, depth, width and the like. The domestic Shanghai light source provides a side local cooling scheme, and under the condition that the appearance of the reflector is kept complete, the length and the width of a side contact area of the cooling copper block and the reflector are optimized, so that a very small surface shape error can be obtained for a certain load. In addition to side contact cooling, there are also solutions for short-sized optical elements that utilize internal channel cooling. On the basis of this, cooling solutions for free electron laser device beam line optics have also been developed. For example, a cooling scheme using an electric heating plate for temperature compensation is proposed in the related art.
The common point of these schemes is that they are only effective for a substantial coincidence of the spot center and the surface center of the mirror. When the spot center on the reflecting surface is inconsistent with the physical center of the reflecting surface, the scheme is not applicable.
Disclosure of Invention
In view of the above, the present application aims to overcome the defects in the prior art, and provides a reflector module, a synchrotron radiation device and a free electron laser device, so as to solve the technical problem that the reflector module capable of coping with the condition that the spot center on the reflecting surface is inconsistent with the physical center of the reflecting surface is lacking in the prior art.
The application provides:
a mirror module, comprising:
the lens body has upper surface and side, the side with the upper surface is connected, the upper surface is the reflecting surface of light beam, the side runs through and sets up flutedly, the recess sets up along first direction, the recess is used for restraining the thermal deformation of lens body:
the heating component is connected to the side face, is positioned on one side, close to the upper surface, of the groove, and is used for performing temperature compensation on the reflecting surface;
and the cooling component is connected with the heating component and transfers heat of the heating component so as to reduce the temperature of the reflecting surface.
In addition, the reflector module according to the application can also have the following additional technical characteristics:
in some embodiments of the application, the mirror module further comprises a first connection layer connecting the mirror body and the heating assembly.
In some embodiments of the application, the mirror module further comprises a second connection layer connecting the cooling assembly and the heating assembly.
In some embodiments of the application, the first connection layer is a film of indium gallium eutectic solution, the first connection layer having a thickness of 50 microns; the second connecting layer is an indium gallium eutectic solution film, and the thickness of the second connecting layer is 50 microns.
In some embodiments of the present application, the heating assembly includes a heat conductive block, a plurality of heating sheets connected to a surface of the heat conductive block, and a heating controller electrically connected to the plurality of heating sheets, wherein the first connection layer connects the heat conductive block and the side surface, respectively.
In some embodiments of the application, the plurality of heating tabs are spaced apart along the first direction, the plurality of heating tabs being disposed proximate the upper surface.
In some embodiments of the present application, the cooling assembly includes a cooling pipeline, and the second connection layer connects the cooling pipeline and the heat conducting block, respectively, and the cooling pipeline is externally connected with a cooling system.
In some embodiments of the present application, the number of the side surfaces is two, the two side surfaces are arranged at two sides of the upper surface at intervals along a second direction, the number of the heating component and the cooling component is two, and the first direction and the second direction are perpendicular;
the two groups of heating components are symmetrically arranged on the two side surfaces along the first direction, and the two groups of cooling components are symmetrically arranged on the two heating components along the first direction.
The application also provides a synchronous radiation device which comprises the reflector module.
The application also provides a free electron laser device which comprises the reflector module.
Compared with the prior art, the application has the beneficial effects that: the application provides a reflector module, which is characterized in that under the condition that the light spot center is inconsistent with the physical center of a reflecting surface, the grooves are arranged to inhibit the deformation of a reflector body so as to control the surface shape of the reflecting surface, the cooling component is arranged in a matched manner to reduce the temperature of the reflector body so as to control the surface shape of the reflecting surface, and the heating component is arranged in a matched manner to heat the reflector body so as to compensate the surface shape of the reflecting surface. Finally, the height error RMS value of the reflecting surface is kept at about 1nm, the slope error RMS value is kept at about 100nrad, and the preset requirement is met.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 shows a schematic diagram of the operation of a mirror;
FIG. 2 shows one of the structural schematic diagrams of the mirror module of the present application;
FIG. 3 shows a schematic cross-sectional view at A-A in FIG. 2;
FIG. 4 shows a second schematic diagram of the mirror module of the present application;
FIG. 5 shows a third schematic diagram of the reflector module of the present application;
FIG. 6 shows a schematic diagram of the operation of the mirror module;
fig. 7 shows a deformation distribution graph in the normal direction of a meridian line obtained by irradiation of X-rays to a reflecting surface;
fig. 8 shows a slope error distribution graph in the normal direction of a meridian line obtained by irradiating an X-ray onto a reflecting surface.
Description of main reference numerals: 10-X rays; 20-facula; 30-meridian; a 100-mirror module; 110-mirror body; 111-upper surface; 112-side; 113-grooves; 120-heating assembly; 121-a heat conducting block; 1211-a first surface; 1212-a second surface; 1213-a third surface; 122-heating plate; 123-a first connection layer; 130-a cooling assembly; 131-cooling pipelines; 132-a through hole; 133-a second connection layer; 134-a third connection layer; d1—a first direction; d2—a second direction; d3—third direction.
Detailed Description
Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
As shown in fig. 1 and 2, when the reflecting surface of the mirror body 110 is irradiated with light of a certain energy, a spot 20 is formed on the surface of the reflecting surface, and the heat deposited on the reflecting surface increases the temperature of the mirror body 110, thereby affecting the surface shape accuracy of the reflecting surface.
In view of the above problems, as shown in fig. 1 to 3, an embodiment of the present application provides a mirror module 100 for suppressing deformation of a reflecting surface in the case where a light beam irradiates the reflecting surface. Particularly, in the case of inconsistent physical centers of the spot 20 and the reflecting surface, the mirror module 100 of the present application can maintain the mirror surface height error RMS value at the order of 1nm, and the slope error RMS value at the order of 100 nrad.
The mirror module 100 includes a mirror body 110, a heating assembly 120, and a cooling assembly 130.
In the present embodiment, the mirror body 110 has a rectangular parallelepiped shape, and has length, width, and height dimensions of: 700mm, 60mm. The beam is X-ray 10, the spot 20 is formed when the X-ray 10 irradiates the reflecting surface, the spot 20 is located on a meridian 30 of the reflecting surface, and the meridian 30 is a symmetrical center line of the reflecting surface along the length direction.
The mirror body 110 has an upper surface 111 and a side surface 112, the side surface 112 is connected to the upper surface 111, the light beam irradiates the upper surface 111 and forms the spot 20, and the upper surface 111 is a reflecting surface of the light beam.
The number of the side surfaces 112 is two, and the two side surfaces 112 are respectively connected to two sides of the upper surface 111 along the second direction D2 of the mirror body 110.
In the present embodiment, the first direction D1 is a longitudinal direction of the mirror body 110, the second direction D2 is a width direction of the mirror body 110, and the third direction D3 is a height direction of the mirror body 110.
The groove 113 penetrates the side surface 112 along the first direction D1, and the groove 113 is used for inhibiting thermal deformation of the mirror body 110, thereby controlling the surface shape of the reflecting surface.
Each side surface 112 of the mirror body 110 is provided with a groove 113, and in order to better inhibit thermal deformation of the mirror body 110, two grooves 113 are symmetrically distributed on the two side surfaces 112. The grooves 113 serve to block and optimize the heat flow path inside the mirror 110, and make the heat distribution of the mirror 110 more uniform.
Parameters such as power, position and size of the groove 113 and the heating assembly 120 are optimized through finite element software, and the depth of the groove 113 is 10mm and the height is 10mm.
A heating element 120 is attached to the side 112, the heating element 120 being located on a side of the recess 113 near the upper surface 111, the heating element 120 being configured to temperature compensate the reflective surface to reduce the temperature gradient near the spot 20 and thereby control the shape of the reflective surface.
In the present embodiment, in order to better compensate for the surface shape of the reflection surface, the number of the heating elements 120 is two, and the two heating elements 120 are symmetrically disposed on the two side surfaces 112 along the first direction D1.
Specifically, the heating assembly 120 includes a heat-conducting block 121, a plurality of heating plates 122, and a heating controller (not shown). The first connection layer 123 is connected to the heat conducting block 121 and the side surface 112, the plurality of heating plates 122 are connected to the surface of the heat conducting block 121, and the heating controller is electrically connected to the plurality of heating plates 122.
In the present embodiment, the heat conductive block 121 is made of a single crystal silicon material. The heat conduction block 121 is substantially rectangular parallelepiped, and the length of the heat conduction block 121 along the second direction D2 is 676mm, the length of the heat conduction block 121 along the second direction D2 is 20mm, and the length along the third direction D3 is 10mm.
As shown in fig. 3, the heat conductive block 121 has a first surface 1211 parallel to the upper surface 111, a second surface 1212 connected to the first surface 1211, and a third surface 1213 connected to the cooling assembly 130.
The plurality of heating plates 122 are disposed at intervals along the first direction D1, so that the temperature gradient of the spot 20 in the meridian 30 direction can be effectively reduced.
Further, a plurality of heating plates 122 are disposed adjacent to the upper surface 111. Specifically, the heating sheet 122 may be disposed on any one of the first surface 1211, the second surface 1212, and the third surface 1213, and in this embodiment, the first surface 1211 is closest to the reflective surface, and the heating sheet 122 generates heat with the highest conduction efficiency, so that it is preferable to dispose a plurality of heating sheets 122 on the first surface 1211.
The number of heating plates 122 may be set according to practical needs, and is not limited.
In the present embodiment, the number of heating sheets 122 is 21, and all the heating sheets 122 are disposed on the first surface 1211 of the heat conductive block 121. Each heater plate 122 is a 30mm x 8mm rectangular ceramic plate, and the spacing between each heater plate 122 is 2mm.
The heating controller is configured to determine a heating control command for each heating plate 122 according to the position of the light spot 20, and the heating plate 122 changes a voltage (or current) according to the heating control command to heat the mirror body 110 so as to compensate for the surface shape of the mirror surface.
In this embodiment, the power of each heating plate 122 may be calculated according to simulation software, and the specific calculation process is:
the light spot 20 moves on the reflecting surface along the first direction D1, and the light spot 20 moves and stays to a preset position;
analyzing deformation quantity generated by the reflecting surface at a preset position;
calculating the power of each heating plate 122 according to the deformation amount;
deriving a control command corresponding to each heating plate 122 according to the power of each heating plate 122;
the control instruction is input to the heating controller, so that the actual application is facilitated.
In this embodiment, the first surface 1211 is disposed flush with the upper surface 111, so that the contact area between the first connection layer 123 and the heat conduction block 121 can be increased, thereby making the connection between the mirror body 110 and the heat conduction block 121 more secure.
The reflector module 100 further includes a first connection layer 123, where the first connection layer 123 connects the reflector 110 and the heating element 120.
In the present embodiment, the first connection layer 123 is an indium gallium eutectic solution film, and the thickness of the first connection layer 123 is 50 μm. In other embodiments, the first connection layer 123 may also be a germanium sheet.
The thickness of the first connection layer 123 is variable, and the magnitude thereof is related to the adsorption force of the side surface 112 and the surface of the heat conductive block 121. Factors influencing the adsorption force include the side surface 112, the roughness of the surface of the heat conductive block 121, the material of the side surface 112, and the like. It is understood that the thickness of the first connection layer 123 may be reduced when the adsorption force of the side surface 112 and the surface of the heat conductive block 121 is increased; when the adsorption force of the surfaces of the side surface 112 and the heat conducting block 121 is reduced, the thickness of the first connecting layer 123 may be increased, or the material of the first connecting layer 123 may be changed, so that the first connecting layer 123 and the surfaces of the side surface 112 and the heat conducting block 121 have good adsorption force.
The cooling assembly 130 is connected to the heating assembly 120, and the cooling assembly 130 transfers heat of the heating assembly 120 to lower the temperature of the reflecting surface, thereby controlling the surface shape of the reflecting surface.
In the present embodiment, in order to control the surface shape of the reflecting surface, the number of the cooling modules 130 is two, and the two cooling modules 130 are symmetrically connected to the two heating modules 120 along the first direction D1.
Specifically, as shown in fig. 3, the cooling assembly 130 includes a cooling pipe 131, the second connecting layer 133 is respectively connected to the cooling pipe 131 and the heat conducting block 121, and the cooling pipe 131 is externally connected to a cooling system (not shown) for reducing the temperature of the mirror body 110, and the externally connected cooling system is used for providing circulating cooling water as a cooling source.
The cooling pipeline 131 runs through and is provided with the through hole 132, and circulating cooling water flows through the through hole 132 to reduce the heat of the cooling pipeline 131, and as the cooling pipeline 131 is connected with the heat conducting block 121, the heat of the heat conducting block 121 is transferred to the cooling pipeline 131, the temperature of the heat conducting block 121 is reduced, the mirror body 110 is connected with the heat conducting block 121, and the heat of the mirror body 110 is sequentially transferred to the heat conducting block 121 and the cooling pipeline 131, so that the purposes of reducing the temperature of the mirror body 110 and inhibiting the deformation of the reflecting surface are finally achieved.
In this embodiment, the cooling pipe 131 is in a hollow long shape, the length of the cooling pipe 131 along the first direction D1 is 676mm, the length of the cooling pipe along the third direction D3 is 10mm, the diameter of the through hole 132 formed in the middle of the cooling pipe is 8mm, and the through hole 132 is used for cooling the lens 110 by circulating cooling water of the circulating cooling system, and the cooling water can remove heat of the cooling pipe 131.
In some embodiments, the cooling channels are thermally conductive. Alternatively, the heat conducting material may be copper or aluminum.
In other embodiments, the cooling system external to the cooling line 131 provides a temperature range of 18 ℃ to 25 ℃ for the circulated cooling.
Alternatively, the temperature of the circulated cooling provided by the cooling system may be selected to be 18.5 ℃, 18.9 ℃, 19 ℃, 19.4 ℃, 20.2 ℃, 20.6 ℃, 21 ℃, 21.8 ℃, 22.1 ℃, 22.5 ℃, 23 ℃, 23.5 ℃, 24 ℃, 24.2 ℃, 24.6 ℃ or 24.9 ℃. It is to be understood that the foregoing is illustrative only and is not to be construed as limiting the scope of the application.
The mirror module 100 further includes a second connection layer 133, and the second connection layer 133 connects the cooling assembly 130 and the heating assembly 120.
Specifically, the second connection layer 133 is an indium gallium eutectic solution film, and the thickness of the second connection layer 133 is 50 micrometers. In other embodiments, the second connection layer 133 may also be a germanium sheet.
The thickness of the second connection layer 133 is variable, and the magnitude thereof is related to the adsorption force of the cooling line 131 and the surface of the heat conductive block 121. Factors influencing the adsorption force include the cooling line 131, the roughness of the surface of the heat conduction block 121, the material of the cooling line 131, and the like. It is understood that the thickness of the second connection layer 133 may be reduced when the adsorption force of the surfaces of the cooling pipe 131 and the heat conductive block 121 is increased; when the adsorption force of the surfaces of the cooling pipeline 131 and the heat conducting block 121 is reduced, the thickness of the second connecting layer 133 may be increased, or the material of the second connecting layer 133 may be changed, so that the second connecting layer 133 and the surfaces of the cooling pipeline 131 and the heat conducting block 121 have good adsorption force.
As shown in fig. 3 to 5, the cooling line 131 is provided at a distance from the side surface 112, or the cooling line 131 is connected to the side surface 112.
As shown in fig. 3 and 5, when the cooling duct 131 is disposed at a distance from the side surface 112, the cooling duct 131 is connected to the third surface 1213, or the cooling duct 131 is connected to the second surface 1212. Such a connection method not only can cool the mirror body 110 and suppress thermal deformation of the reflecting surface, but also can prevent vibration generated by the cooling pipe 131 from being directly transmitted to the mirror body 110, thereby reducing influence of vibration on the mirror body 110 and keeping the mirror body 110 stable.
It should be noted that, as shown in fig. 3, when the cooling pipe 131 is connected to the third surface 1213, the second connection layer 133 is disposed between the third surface 1213 and the cooling pipe 131, respectively. As shown in fig. 5, when the cooling pipe 131 is connected to the second surface 1212, the second connection layer 133 is disposed between the second surface 1212 and the cooling pipe 131, respectively.
As shown in fig. 4, when the cooling pipe 131 is connected to the side 112, a third connection layer 134 may be further disposed between the cooling pipe 131 and the side 112, and the third connection layer 134 and the second connection layer 133 or the first connection layer 123 may have the same material and thickness. With such a structure, the structural stability of the mirror module 100 can be increased, and the cooling efficiency of the mirror body 110 can be improved.
As shown in fig. 6, the reflector module 100 operates according to the following principle:
when the reflecting surface of the mirror body 110 is irradiated with the X-rays 10, the heat deposited on the reflecting surface will raise the temperature of the mirror body 110, and the reflecting surface is deformed by heating due to the non-uniformity of the temperature rise, thereby affecting the surface shape accuracy of the reflecting surface.
In particular, in the case that the center of the spot 20 is not consistent with the physical center of the reflecting surface, the RMS values of the deformation curve and the slope error in the meridian normal direction in the ordinary cooling scheme cannot meet the requirements.
The reflector module 100 of the application controls the surface shape of the reflecting surface by using the groove 113 to restrain the thermal deformation of the reflector 110, then arranging the cooling component 130 in a matching way to reduce the temperature of the reflector 110 so as to control the surface shape of the reflecting surface, and then heating the reflector 110 by matching with the heating component 120 so as to compensate the surface shape of the reflecting surface, so that the reflector module 100 can cool the reflector 110 through the cooling component 130 and control the surface shape of the reflecting surface and compensate the surface shape of the reflecting surface through the heating component 120 while processing high heat load.
In summary, the groove 113 is formed on the mirror body 110, and is used for inhibiting thermal deformation of the mirror body 110 to control the surface shape of the reflecting surface, the cooling component 130 is used for cooling the mirror body 110 to control the surface shape of the reflecting surface, the heating component 120 is used for heating the mirror body 110 to compensate the surface shape of the reflecting surface, and under the synergistic effect of the groove 113, the cooling component 130 and the heating component 120, the height error RMS value and the slope error RMS value of the reflecting surface meet the preset requirements under the condition that the center of the light spot 20 and the physical center of the reflecting surface are inconsistent.
As shown in fig. 7 and 8, the mirror body 110 of the mirror module 100 of the present application absorbs 16.6W of thermal power, the mirror surface shape has a height error RMS value of 0.12nm, and a slope error RMS value of 4.6nrad. The RMS value is significantly reduced, both in terms of height error and slope error, which is highly advantageous for beam transport in fourth generation source beam lines.
The fourth generation light source (X-ray laser) is a new generation light source which is being explored after the third generation synchrotron radiation light source, and is greatly superior to the third generation synchrotron radiation light source in brightness, coherence and time structure. Currently, the most commonly used fourth generation light source devices are synchrotron radiation devices and free electron laser devices.
The present application also provides a synchrotron radiation device, which includes the reflector module 100 as described above, and has all the beneficial effects of the reflector module 100 in any of the above embodiments, which are not described in detail herein.
The application also provides a free electron laser device, which comprises the reflector module 100, and all the beneficial effects of the reflector module 100 in any of the above embodiments are not described herein.
As can be seen from the results of fig. 7 and 8, after the mirror module 100 is used, both the height error and the slope error of the mirror are reduced by one order of magnitude, so that the height error RMS is in the order of 1nm, the slope error RMS is in the order of 100nrad, and the severe requirements of the synchrotron radiation light source and the free electron laser device on the surface shape can be satisfied.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While embodiments of the present application have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the application, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the application.
Claims (10)
1. A mirror module, comprising:
the lens body has upper surface and side, the side with the upper surface is connected, the upper surface is the reflecting surface of light beam, the side runs through and sets up flutedly, the recess sets up along first direction, the recess is used for restraining the thermal deformation of lens body:
the heating component is connected to the side face, is positioned on one side, close to the upper surface, of the groove, and is used for performing temperature compensation on the reflecting surface;
and the cooling component is connected with the heating component and transfers heat of the heating component so as to reduce the temperature of the reflecting surface.
2. The mirror module of claim 1, further comprising a first connection layer connecting the mirror body and the heating assembly.
3. The mirror module of claim 2, further comprising a second connection layer connecting the cooling assembly and the heating assembly.
4. A mirror module according to claim 3, wherein the first connection layer is an indium gallium eutectic solution film, the first connection layer having a thickness of 50 microns; the second connecting layer is an indium gallium eutectic solution film, and the thickness of the second connecting layer is 50 microns.
5. The mirror module of claim 3, wherein the heating assembly comprises a heat conducting block, a plurality of heating plates, and a heating controller, the first connection layer connects the heat conducting block and the side surface, the plurality of heating plates are connected to a surface of the heat conducting block, and the heating controller is electrically connected to the plurality of heating plates.
6. The mirror module of claim 5, wherein the plurality of heating tabs are spaced apart along the first direction, the plurality of heating tabs being disposed proximate the upper surface.
7. The reflector module of claim 5, wherein the cooling assembly comprises a cooling pipeline, the second connecting layer connects the cooling pipeline and the heat conducting block respectively, and the cooling pipeline is externally connected with a cooling system.
8. The mirror module of any one of claims 1 to 7, wherein the number of sides is two, the two sides are disposed at intervals on both sides of the upper surface along a second direction, the number of the heating assembly and the cooling assembly are two groups, and the first direction and the second direction are perpendicular;
the two groups of heating components are symmetrically arranged on the two side surfaces along the first direction, and the two groups of cooling components are symmetrically arranged on the two heating components along the first direction.
9. A synchrotron radiation device comprising a mirror module according to any one of claims 1 to 8.
10. A free electron laser device comprising a mirror module according to any of claims 1 to 8.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202310786433.3A CN116825415A (en) | 2023-06-29 | 2023-06-29 | Mirror module, synchrotron radiation device and free electron laser device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202310786433.3A CN116825415A (en) | 2023-06-29 | 2023-06-29 | Mirror module, synchrotron radiation device and free electron laser device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN116825415A true CN116825415A (en) | 2023-09-29 |
Family
ID=88127159
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202310786433.3A Pending CN116825415A (en) | 2023-06-29 | 2023-06-29 | Mirror module, synchrotron radiation device and free electron laser device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN116825415A (en) |
-
2023
- 2023-06-29 CN CN202310786433.3A patent/CN116825415A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101158229B1 (en) | Photovoltaic generator with a spherical imaging lens for use with a paraboloidal solar reflector | |
US8810775B2 (en) | EUV mirror module with a nickel electroformed curved mirror | |
CN104210673B (en) | A kind of thermal control method of the quick molectron of star | |
AU6325199A (en) | Photovoltaic device | |
JPH1093169A (en) | Diode laser-pumped solid-state laser gain module | |
CA2228244C (en) | Semiconductor excitation solid-state laser apparatus | |
US9513569B2 (en) | Optical collector for collecting extreme ultraviolet radiation, method for operating such an optical collector, and EUV source with such a collector | |
Siegel et al. | Design, modeling, and characterization of a 10 kWe metal halide high flux solar simulator | |
CN116825415A (en) | Mirror module, synchrotron radiation device and free electron laser device | |
CN113917650A (en) | Cooling structure and method for improving thermal deformation and vibration stability of reflector | |
JPH07261100A (en) | Shape-variable mirror | |
CN219892601U (en) | Mirror module, synchrotron radiation device and free electron laser device | |
CN107065389A (en) | A kind of liquid crystal optical phased array device for being resistant to high laser power | |
CN116315996A (en) | Mirror module, synchrotron radiation device and free electron laser device | |
JPH01268080A (en) | Solid-state laser device | |
CN104596125A (en) | Cavity solar receiver with lighting cover | |
CN115019995A (en) | Reflector surface shape control module, synchrotron radiation device and free electron laser device | |
CN114974644A (en) | Reflector cooling compensation structure, synchrotron radiation device and free electron laser device | |
CN217007742U (en) | Asymmetric fluting cooling structure suitable for horizontal reflection-type speculum | |
JP2763187B2 (en) | Solid-state laser device | |
KR101959272B1 (en) | Floating concentrated solar cell and hybrid generator system | |
Khounsary et al. | On optimal contact cooling of high‐heat‐load x‐ray mirrors | |
CN216280858U (en) | Light-gathering solar simulator | |
CN115483597A (en) | Low-temperature reflector surface shape control device, synchrotron radiation device and free electron laser device | |
CN107623251A (en) | Space overlapping high-power semiconductor laser for laser melting coating folds array 1 system |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |