CN116799023A - Display panel manufacturing method, display panel and display device - Google Patents

Display panel manufacturing method, display panel and display device Download PDF

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Publication number
CN116799023A
CN116799023A CN202210257971.9A CN202210257971A CN116799023A CN 116799023 A CN116799023 A CN 116799023A CN 202210257971 A CN202210257971 A CN 202210257971A CN 116799023 A CN116799023 A CN 116799023A
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China
Prior art keywords
layer
substrate
lead
array substrate
opening
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CN202210257971.9A
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Chinese (zh)
Inventor
李云泽
钱先锐
李洋
汪浩
万宝红
廖小刚
袁盼
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Chengdu Vistar Optoelectronics Co Ltd
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Chengdu Vistar Optoelectronics Co Ltd
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Application filed by Chengdu Vistar Optoelectronics Co Ltd filed Critical Chengdu Vistar Optoelectronics Co Ltd
Priority to CN202210257971.9A priority Critical patent/CN116799023A/en
Publication of CN116799023A publication Critical patent/CN116799023A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The embodiment of the application provides a preparation method of a display panel, the display panel and a display device. The preparation method comprises the following steps: preparing an array substrate layer on a first substrate, wherein the array substrate layer comprises a driving circuit, a connecting end and an outgoing end which are mutually connected with the driving circuit; transferring a plurality of light-emitting units to one side of a first substrate of the array substrate layer, wherein the light-emitting units are connected with a driving circuit through connecting ends, so that the driving circuit can drive the light-emitting units to emit light; preparing a second substrate on one side of the plurality of light emitting units, which is away from the array substrate layer; removing the first substrate and turning over the second substrate so that the second substrate provides support for the array substrate layer and the light emitting unit; preparing a lead layer on one side of the array substrate layer, which is away from the light-emitting unit, so as to form a display unit, wherein the lead layer comprises leads connected with the lead-out ends; and splicing the display units to form a display panel, wherein the light emitting units of the display units are positioned on the same side of the display panel.

Description

Display panel manufacturing method, display panel and display device
Technical Field
The present application relates to the field of display devices, and in particular, to a method for manufacturing a display panel, and a display device.
Background
Micro light emitting diodes (Micro LEDs) are devices of a size between a few microns and hundreds of microns, which make it possible to use a single LED as a Pixel (Pixel) for display, since they are much smaller than conventional LEDs. A Micro LED display is a display that uses a high-density Micro LED array as a display pixel array to display an image.
At present, in the Micro LED display technology, large-size display is realized by modularization of a display unit and splicing of a plurality of display units. However, the display effect is affected by the obvious display limit of the splice position of the spliced display panel.
Disclosure of Invention
The embodiment of the application provides a preparation method of a display panel, the display panel and a display device, and aims to improve the display effect of the display panel.
An embodiment of a first aspect of the present application provides a method for manufacturing a display panel, including:
preparing an array substrate layer on a first substrate, wherein the array substrate layer comprises a driving circuit, a connecting end and an outgoing end which are mutually connected with the driving circuit;
transferring a plurality of light-emitting units to one side of a first substrate of the array substrate layer, wherein the light-emitting units are connected with a driving circuit through connecting ends, so that the driving circuit can drive the light-emitting units to emit light;
preparing a second substrate on one side of the plurality of light emitting units, which is away from the array substrate layer;
removing the first substrate and turning over the second substrate so that the second substrate provides support for the array substrate layer and the light emitting unit;
preparing a lead layer on one side of the array substrate layer, which is away from the light-emitting unit, so as to form a display unit, wherein the lead layer comprises leads connected with the lead-out ends;
and splicing the display units to form a display panel, wherein the light emitting units of the display units are positioned on the same side of the display panel.
According to an embodiment of the first aspect of the present application, in the step of preparing the array substrate layer on the first substrate: the array substrate layer comprises an insulating material part, and at least part of the insulating material part is positioned on one side of the leading-out end facing the first substrate;
the step of preparing the lead layer on one side of the array substrate layer away from the light emitting unit further comprises the following steps:
patterning the insulating layer to form a first opening so that the lead-out end is exposed from the first opening;
in the step of preparing the lead layer on the side of the array substrate layer facing away from the light emitting unit, the leads are connected with the lead-out ends through the first openings.
According to any of the foregoing embodiments of the first aspect of the present application, the second substrate is a light-transmitting substrate.
According to any of the foregoing embodiments of the first aspect of the present application, in the step of preparing an array substrate layer on a first substrate: the array substrate further comprises a metal layer, the insulating material part comprises a supporting layer positioned at one side of the metal layer facing the first substrate, and the leading-out end is positioned at one side of the metal layer facing the supporting layer;
in the step of patterning the insulating material portion to form a first opening so that the lead-out terminal is exposed from the first opening, patterning the support layer is performed so that at least a portion of the first opening is located in the support layer.
According to any of the foregoing embodiments of the first aspect of the present application, in the step of preparing an array substrate layer on a first substrate: the array substrate further comprises a metal layer, the metal layer comprises a metal part, the insulating material part comprises an insulating part which is positioned in the metal layer and used for mutually insulating a plurality of metal parts in the metal layer, and the orthographic projection of the metal part on the first substrate and the orthographic projection of the leading-out end on the first substrate are arranged in a staggered manner;
and patterning the insulating material part to form a first opening so that the leading-out end is exposed from the first opening, and patterning the insulating medium layer so that at least part of the first opening is formed in the insulating medium layer.
According to any of the foregoing embodiments of the first aspect of the present application, in the step of removing the first substrate and flipping the second substrate so that the second substrate provides support to the array substrate layer and the light emitting unit:
the first substrate is removed before the second substrate is flipped or the second substrate is flipped before the first substrate is removed.
According to any one of the foregoing embodiments of the first aspect of the present application, a lead layer is prepared on a side of the array substrate layer facing away from the light emitting unit to form the display unit, where the lead layer includes a lead connected to the lead terminal, and the lead includes a binding terminal located on a side of the light emitting unit facing away from the second substrate;
the method further comprises the following steps before the step of splicing the display units to form the display panel:
and preparing an insulating material layer on the lead layer, and patterning the insulating material layer to form a protective layer, wherein the protective layer is provided with a second opening so that the binding end is exposed from the second opening, and the driving block is connected with the binding end.
The embodiment of the second aspect of the present application further provides a molded display panel prepared by using the preparation method of any one of the embodiments of the first aspect.
According to an embodiment of the second aspect of the present application, the array substrate layer includes an insulating material portion, at least a portion of the insulating material portion is located on a side of the lead-out terminal facing the first substrate, a first opening is formed in the insulating material portion, and the leads are electrically connected to each other through the first opening and the lead-out terminal.
According to any one of the foregoing embodiments of the second aspect of the present application, the array substrate further includes a metal layer, the insulating material portion includes a supporting layer located on a side of the metal layer facing away from the light emitting unit, and at least a portion of the first opening is disposed on the supporting layer.
According to any one of the foregoing embodiments of the second aspect of the present application, the array substrate further includes a metal layer, the metal layer includes a metal portion, the insulating material portion includes an insulating portion located in the metal layer and used for insulating a plurality of metal portions in the metal layer from each other, and an orthographic projection of the metal portion along a thickness direction of the display panel and an orthographic projection of the lead-out terminal along the thickness direction are arranged in a staggered manner, and at least a portion of the first opening is disposed in the insulating portion.
According to any one of the foregoing embodiments of the second aspect of the present application, the lead further includes a binding end located at a side of the light emitting unit facing away from the second substrate, the binding end being connected with the driving block;
the display unit further comprises a protective layer, wherein the protective layer is positioned on one side, away from the light-emitting unit, of the lead layer, the protective layer comprises a second opening, so that the driving block is exposed out of the second opening, and the binding end is connected with the driving block in the second opening.
An embodiment of the third aspect of the present application further provides a display device, including a display panel provided in any one of the embodiments of the second aspect.
In the method for manufacturing the display panel provided by the embodiment of the application, firstly, the array substrate layer is manufactured on the first substrate, and then the light-emitting unit is transferred to the array substrate layer, so that the light-emitting unit and the driving circuit of the array substrate layer are connected with each other through the connecting end, and the driving unit can drive the light-emitting unit to emit light. Then preparing a second substrate on one side of the light-emitting unit, which is away from the array substrate, then removing the first substrate and overturning the second substrate, wherein the second substrate can provide support for the light-emitting unit and the array substrate layer, can avoid deformation of the array substrate layer, and is convenient for preparing leads on one side of the array substrate layer, which is away from the second substrate. In the display unit manufactured and molded by the manufacturing method provided by the embodiment of the application, the lead is positioned at the backlight side of the display unit, the lead does not need to run the side surface of the display unit, and when a plurality of display units are spliced to form the display panel, the size of the splicing seam of two adjacent display units can be reduced, so that the display effect of the display panel can be improved.
Therefore, the second substrate is arranged, so that the second substrate provides support for the array substrate, the lead wire is conveniently prepared on the array substrate, the lead wire of the display unit can be arranged on the backlight side of the array substrate, and the splice seam of two adjacent display units is further reduced, so that the aim of improving the display effect of the display panel is fulfilled.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading the following detailed description of non-limiting embodiments thereof, taken in conjunction with the accompanying drawings in which like or similar reference characters designate the same or similar features.
Fig. 1 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the first aspect of the present application;
fig. 2 to 8 are schematic views illustrating a manufacturing process of a display panel according to an embodiment of the first aspect of the present application;
fig. 9 to 11 are schematic structural views of a display panel according to another embodiment of the first aspect of the present application;
fig. 12 and 13 are schematic views illustrating a part of a process structure of a method for manufacturing a display panel according to another embodiment of the first aspect of the present application;
fig. 14 is a schematic structural view of a display panel according to an embodiment of the second aspect of the present application;
fig. 15 is a schematic structural diagram of a display panel according to still another embodiment of the second aspect of the present application.
Reference numerals illustrate:
100. a first substrate;
200. an array substrate layer; 210. a driving circuit; 220. a connection end; 230. a lead-out end; 240. an insulating material portion; 241. a first opening; 242. a support layer; 243. an insulating part;
300. a light emitting unit;
400. a second substrate;
500. a lead layer; 510. a lead wire; 520. a binding end;
600. a protective layer; 610. a second opening;
700. and a driving block.
Detailed Description
Features and exemplary embodiments of various aspects of the application are described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the application. It will be apparent, however, to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the application by showing examples of the application. In the drawings and the following description, at least some well-known structures and techniques have not been shown in detail in order not to unnecessarily obscure the present application; also, the dimensions of some of the structures may be exaggerated for clarity. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
In the description of the present application, it is to be noted that, unless otherwise indicated, the meaning of "plurality" is two or more; the terms "upper," "lower," "left," "right," "inner," "outer," and the like are merely used for convenience in describing the present application and to simplify the description, and do not denote or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the present application. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The directional terms appearing in the following description are all directions shown in the drawings and do not limit the specific structure of the embodiment of the present application. In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected. The specific meaning of the above terms in the present application can be understood as appropriate by those of ordinary skill in the art.
In order to better understand the present application, a display panel, a display device, and a method of manufacturing a display panel according to embodiments of the present application are described in detail below with reference to fig. 1 to 15.
Referring to fig. 1 to 8, fig. 1 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the application. Fig. 2 to 8 are schematic structural process diagrams of a method for manufacturing a display panel according to an embodiment of the application.
As shown in fig. 1 to 8, the method for manufacturing a display panel provided by the application includes:
step S01: as shown in fig. 2, an array substrate layer 200 is prepared on a first substrate 100, and the array substrate layer 200 includes a driving circuit 210, and a connection terminal 220 and a lead-out terminal 230 connected to the driving circuit 210.
Step S02: as shown in fig. 3, a plurality of light emitting units 300 are transferred to one side of the first substrate 100 of the array substrate layer 200, and the light emitting units 300 are connected to the driving circuit 210 through the connection terminals 220, so that the driving circuit 210 can drive the light emitting units 300 to emit light.
Alternatively, the light emitting unit 300 may include a red light emitting unit, a green light emitting unit, and a blue light emitting unit. The heights of the red light emitting unit, the green light emitting unit, and the blue light emitting unit protruding from the array substrate layer 200 may be the same or different. The light emitting unit 300 may be, for example, a Micro light emitting diode (Micro LED).
Step S03: as shown in fig. 4, a second substrate 400 is prepared on a side of the plurality of light emitting cells 300 facing away from the array substrate layer 200.
Step S04: as shown in fig. 5, the first substrate 100 is removed and the second substrate 400 is turned over so that the second substrate 400 provides support to the array substrate layer 200 and the light emitting unit 300.
Step S05: as shown in fig. 6, a lead layer 500 is prepared on a side of the array substrate layer 200 facing away from the light emitting unit 300 to form a display unit, and the lead layer 500 includes a lead 510 connected to the terminal 230.
Step S06: the display panel is formed by splicing a plurality of display units, and the light emitting units 300 of the display units are positioned on the same side of the display panel.
Alternatively, as shown in fig. 7, a protective layer 600 may be further prepared on the lead layer 500 after step S05. To provide protection to the leads 510 of the lead layer 500 through the protection layer 600.
Alternatively, as shown in fig. 8, the second substrate 400 may also be flipped after step S05 so that the light emitting unit 300 is located above the lead layer 500.
In the method for manufacturing the display panel provided by the embodiment of the application, firstly, the array substrate layer 200 is manufactured on the first substrate 100 through the step S01, and then, the light emitting unit 300 is transferred to the array substrate layer 200 through the step S02, so that the light emitting unit 300 and the driving circuit 210 of the array substrate layer 200 are connected with each other through the connection terminal 220, and the driving unit can drive the light emitting unit 300 to emit light. Then, the second substrate 400 is prepared on the side, away from the array substrate, of the light emitting unit 300 through the step S03, then, the first substrate 100 is removed and the second substrate 400 is turned over through the step S04, and the second substrate 400 can provide support for the light emitting unit 300 and the array substrate layer 200, so that deformation of the array substrate layer 200 can be avoided, and the subsequent preparation of the lead 510 on the side, away from the second substrate 400, of the array substrate layer 200 through the step S05 is facilitated. In the display unit manufactured and molded by the manufacturing method provided by the embodiment of the application, the lead 510 is positioned on the backlight side of the display unit, and the lead 510 does not need to be routed from the side surface of the display unit, when a plurality of display units are spliced to form the display panel by the step S06, the size of the splicing seam of two adjacent display units can be reduced, and the display effect of the display panel can be further improved.
Therefore, in the embodiment of the application, the second substrate 400 is additionally arranged in the preparation process of the display panel, so that the second substrate 400 provides support for the array substrate, the lead 510 is conveniently prepared on the array substrate, the lead 510 of the display unit can be arranged on the backlight side of the array substrate, and the splice seam of two adjacent display units is further reduced, thereby achieving the purpose of improving the display effect of the display panel.
In addition, in step S03, the second substrate 400 not only can provide support to the array substrate layer 200, but also can improve the deformation of the array substrate layer 200 and the defect of the relative position change of the plurality of light emitting units 300, and the second substrate 400 can also provide heat dissipation, which is beneficial to the heat dissipation of the light emitting units 300.
In step S01, the driving circuit 210 of the array substrate layer 200 may include components such as a thin film transistor and a capacitor. The thin film transistor includes a source electrode, a drain electrode, a gate electrode, and a semiconductor portion. The source and drain electrodes may be located on the same metal layer (not shown), and the gate electrode may be located on another metal layer, and an insulating material portion 240 is disposed between two adjacent metal layers to avoid short-circuiting. Accordingly, the array substrate layer 200 includes an insulating material portion and a metal layer.
Alternatively, as shown in fig. 9, at least a part of the insulating material portion 240 is located on a side of the lead-out terminal 230 facing the first substrate 100. In step S04, the insulating material portion 240 can provide protection to the terminal 230 from damage to the terminal 230 when the first substrate 100 is removed.
In some alternative embodiments, when at least part of the insulating material portion 240 is located on the side of the lead-out terminal 230 facing the first substrate 100, as shown in fig. 10, before step S05, the method further includes: the insulating material portion 240 is patterned to form a first opening 241 such that the lead terminal 230 is exposed through the first opening 241. As shown in fig. 11, in step S05, the lead 510 is connected to the lead-out terminal 230 via the first opening 241.
In these alternative embodiments, the insulating material portion 240 can provide protection to the terminals 230 by having the insulating material portion 240 cover the terminals 230 such that the first substrate 100 is removed. Patterning the insulating material portion 240 can expose the lead terminal 230, and as the lead layer 500 continues to be prepared, the material of the lead 510 can flow into the first opening 241 and interconnect with the lead terminal 230.
In the embodiment of the present application, in step S01, the array substrate layer 200 includes a metal layer (not shown in the drawings) and an insulating material portion 240, the insulating material portion 240 may include a support layer located in the metal layer toward the first substrate 100, and/or the metal layer includes a metal portion, and the insulating material portion 240 may include an insulating portion located in the metal layer for insulating two adjacent metal portions from each other.
As shown in fig. 12, in some alternative embodiments, the insulating material portion 240 includes a support layer 242 on a side of the metal layer facing the first substrate 100. Then in step S01, the support layer 242 may be first prepared on the first substrate 100, and then the metal layer and other insulating material portions 240 of the array substrate layer 200 may be prepared on a side of the support layer 242 facing away from the first substrate 100.
As shown in fig. 13, before step S05, the method further includes: the supporting layer 242 is patterned, so that at least a portion of the first opening 241 is located in the supporting layer 242, and the leading-out end 230 is exposed from the first opening 241.
Optionally, the insulating material portion 240 may further include both the supporting layer 242 and the insulating portion 243, and then the supporting layer 242 and the insulating portion 243 may be simultaneously patterned to form the first opening 241 in step S05. In step S06, the lead 510 is connected to each other through the first opening 241 and the lead terminal 230.
Alternatively, when the support layer 242 is formed on the first substrate 100, referring to fig. 12 and 13, the lead-out terminal 230 may be located on a side of the metal layer facing the support layer 242, and when patterning the support layer 242, only the first opening 241 is formed in the support layer 242, so that the lead-out terminal 230 is exposed from the support layer 242, so as to avoid damage to other wires in the array substrate layer 200.
Alternatively, the material of the support layer 242 may include at least one of silicon nitride and silicon oxide. The material of the support layer 242 may also include an organic material and/or an inorganic material.
With continued reference to fig. 9 and 10, in some alternative embodiments, the insulating material portion 240 includes an insulating portion 243, the metal layer includes a metal portion, and the insulating portion 243 is located in the metal layer and is used to insulate the plurality of metal portions from one another. When the insulating material portion 240 needs to be patterned so that the lead-out terminal 230 is exposed from the first opening 241, the front projection of the metal portion on the first substrate 100 and the front projection of the lead-out terminal 230 on the first substrate 100 are arranged in a staggered manner. In the step of patterning the insulating material portion 240 to form the first opening 241 so that the lead terminal 230 is exposed from the first opening 241, the insulating portion 243 is patterned so that at least a portion of the first opening 241 is formed in the insulating portion 243. The front projection of the metal portion on the first substrate 100 and the front projection of the lead-out end 230 on the first substrate 100 are arranged in a staggered manner, so as to avoid damage to the metal portion during patterning the insulating portion 243, resulting in poor contact of the driving circuit 210 and affecting the yield of the display panel.
Alternatively, the connection terminal 220 includes a first connection terminal and a second connection terminal, one of which may be an anode and the other may be a cathode, and the driving circuit 210 connects the light emitting unit 300 through the first connection terminal and the second connection terminal and drives the light emitting unit 300 to emit light.
Optionally, in step S02, after transferring the plurality of light emitting units 300 onto the array substrate layer 200, the light emitting units 300 may be further subjected to an encapsulation process to form an encapsulation layer, and protection may be provided to the light emitting units 300 through the encapsulation layer.
Alternatively, the light emitting unit 300 includes a first contact electrode and a second contact electrode, one of which is connected to the first connection terminal and the other is connected to the second connection terminal, and the driving circuit 210 may drive the light emitting unit 300 to emit light through the first contact electrode and the second contact electrode.
Optionally, after the first substrate 100 is not removed and the second substrate 400 is prepared, that is, after step S03, the side of the first substrate 100 is the backlight side of the light emitting unit 300, and the side of the second substrate 400 is the light emitting side of the light emitting unit 300. Optionally, the second substrate 400 is a light-transmitting substrate, so as to improve the influence of the second substrate 400 on the light output of the display panel. Alternatively, the second substrate 400 may be glass, for example, high light-transmitting glass, so that the second substrate 400 can provide not only good support to the array substrate layer 200 and the light emitting unit 300, but also good light transmission.
In step S04, the second substrate 400 may be turned over before the first substrate 100 is removed, or the second substrate 400 may be turned over after the first substrate 100 is removed, as long as the second substrate 400 can be made to provide support to the array substrate layer 200 and the light emitting unit 300.
In step S05, a conductive material layer may be coated on a side of the array substrate layer 200 facing away from the light emitting unit 300, and a photoresist is selected to pattern the conductive material layer to form the lead layer 500. The leads 510 of the lead layer 500 are interconnected with the terminals 230. The types of the lead wire 510 are various, and the lead wire 510 may be a data line, a scan line, a power line, a voltage reference line, a ground line, a light emission control line, or the like.
In some alternative embodiments, referring to fig. 11 to 14, in step S05, the lead 510 includes a binding end 520 on a side of the light emitting unit 300 facing away from the second substrate 400. The method further comprises the following steps before the step S06: a layer of insulating material is prepared on the lead layer 500 and patterned to form a cap layer 600, the cap layer 600 having a second opening 610 such that the bonding end 520 is exposed through the second opening 610 and the driving block 700 is connected to the bonding end 520.
In these alternative embodiments, protective layer 600 is fabricated on lead layer 500, and protective layer 600 is capable of providing protection to leads 510 of lead layer 500. The driving block 700 is connected to the bonding terminal 520, and the driving block 700 can transmit a driving signal to the driving circuit 210 via the lead 510 to the bonding terminal 520.
Optionally, after step S06, a touch layer, a polarizer, a cover plate, and the like may be further formed on a side of the second substrate 400 facing away from the light emitting unit 300.
An embodiment of a second aspect of the present application provides a display panel, where the display panel is formed by a preparation method provided in any one of the embodiments of the first aspect. The display panel provided by the embodiment of the application has the beneficial effects of the preparation method because the display panel is prepared and molded by the preparation method, and the details are not repeated here.
As shown in fig. 14, the display panel provided by the embodiment of the application includes a second substrate 400, a light emitting unit 300 disposed on the second substrate 400, and an array substrate layer 200 disposed on a side of the light emitting unit 300 facing away from the second substrate 400.
Optionally, the array substrate layer 200 includes an insulating material part 240 and a metal layer (not shown in the drawings), at least a portion of the insulating material part 240 is located at a side of the lead-out terminal 230 facing the light emitting unit 300, a first opening 241 is formed in the insulating material part 240, and the lead 510 is electrically connected to each other through the first opening 241 and the lead-out terminal 230.
As described above, the array substrate layer 200 includes the metal layer and the insulating material part 240, and the insulating material part 240 may include the support layer 242 positioned in the metal layer toward the first substrate 100, and/or the insulating material part 240 may include the insulating part 243 positioned in the metal layer for insulating the plurality of metal parts from each other.
As shown in fig. 14, in some alternative embodiments, the insulating material portion 240 includes a supporting layer 242 on a side of the metal layer facing away from the light emitting unit 300, at least a portion of the first opening 241 is disposed in the supporting layer 242, and the leads 510 are electrically connected to each other via the first opening 241 and the lead-out terminals 230. In these alternative embodiments, the support layer 242 can provide protection to the pigtail 230 by providing the support layer 242. The influence on the lead-out terminal 230 when the first substrate 100 is removed can be improved.
In other alternative embodiments, as shown in fig. 15, the metal layer includes a metal portion, the insulating material portion 240 includes an insulating portion 243 disposed in the metal layer and insulating the metal portions from each other, at least a portion of the insulating portion 243 is disposed on a side of the terminal 230 facing away from the second substrate 400, an orthographic projection of the metal portion along a thickness direction of the display panel and an orthographic projection of the terminal 230 along the thickness direction are offset, and at least a portion of the first opening 241 is disposed in the insulating portion 243. The metal part may be a source, a gate, a drain, or the like of the thin film transistor, or the metal part may be a capacitor plate.
In some alternative embodiments, as shown in fig. 14 and 15, the lead layer 500 further includes a binding end 520 located at a side of the light emitting unit 300 facing away from the second substrate 400, the display unit further includes a protective layer 600, the protective layer 600 is located at a side of the lead layer 500 facing away from the light emitting unit 300, the protective layer 600 includes a second opening 610 such that the driving block 700 is exposed from the second opening 610, and the binding end 520 is connected to the driving block 700 within the second opening 610.
In these alternative embodiments, protective layer 600 is disposed over lead layer 500, and protective layer 600 is capable of providing protection to leads 510 of lead layer 500. The driving block 700 is connected to the bonding terminal 520, and the driving block 700 can transmit a driving signal to the driving circuit 210 via the lead 510 to the bonding terminal 520.
Embodiments of the third aspect of the present application further provide a display device, including a display panel according to any one of the embodiments of the second aspect. Since the display device provided by the embodiment of the third aspect of the present application includes the display panel of any one of the embodiments of the second aspect, the display device provided by the embodiment of the third aspect of the present application has the beneficial effects of the display panel of any one of the embodiments of the second aspect, and is not described herein.
The display device in the embodiment of the application comprises, but is not limited to, a mobile phone, a personal digital assistant (Personal Digital Assistant, abbreviated as PDA), a tablet computer, an electronic book, a television, an access control, a smart phone, a console and other devices with display functions.
While the application has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the application. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict. The present application is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions falling within the scope of the claims.

Claims (10)

1. A method for manufacturing a display panel, comprising:
preparing an array substrate layer on a first substrate, wherein the array substrate layer comprises a driving circuit, a connecting end and an extraction end which are mutually connected with the driving circuit;
transferring a plurality of light emitting units to one side of the first substrate of the array substrate layer, wherein the light emitting units are connected with the driving circuit through the connecting end, so that the driving circuit can drive the light emitting units to emit light;
preparing a second substrate on one side of the plurality of light emitting units, which is away from the array substrate layer;
removing the first substrate and turning over the second substrate so that the second substrate provides support to the array substrate layer and the light emitting unit;
preparing a lead layer on one side of the array substrate layer, which faces away from the light emitting unit, to form a display unit, wherein the lead layer comprises leads connected with the lead ends;
and splicing a plurality of display units to form the display panel, wherein the light-emitting units of the display units are positioned on the same side of the display panel.
2. The method of claim 1, wherein in the step of preparing an array substrate layer on the first substrate: the array substrate layer comprises an insulating material part, and at least part of the insulating material part is positioned on one side of the leading-out end, facing the first substrate;
the step of preparing a lead layer on the side of the array substrate layer facing away from the light emitting unit further comprises:
patterning the insulating material part to form a first opening so that the leading-out end is exposed from the first opening;
in the step of preparing a lead layer on the side of the array substrate layer facing away from the light emitting unit, the lead is connected with the lead-out terminal through the first opening;
preferably, the second substrate is a light-transmitting substrate.
3. The method of claim 2, wherein in the step of preparing the array substrate layer on the first substrate: the array substrate further comprises a metal layer, the insulating material part comprises a supporting layer positioned on one side of the metal layer facing the first substrate, and the leading-out end is positioned on one side of the metal layer facing the supporting layer;
and in the step of patterning the insulating material part to form a first opening so that the leading-out end is exposed out of the first opening, patterning the supporting layer so that at least part of the first opening is positioned on the supporting layer.
4. The method of claim 2, wherein in the step of preparing the array substrate layer on the first substrate: the array substrate further comprises a metal layer, the metal layer comprises a metal part, the insulating material part comprises an insulating part which is positioned in the metal layer and used for mutually insulating a plurality of metal parts in the metal layer, and the orthographic projection of the metal part on the first substrate and the orthographic projection of the leading-out end on the first substrate are arranged in a staggered manner;
and patterning the insulating material part to form a first opening, so that the leading-out end is exposed from the first opening, and patterning the insulating part to form at least part of the first opening on the insulating part.
5. The method of claim 1, wherein in the step of removing the first substrate and flipping the second substrate such that the second substrate provides support to the array substrate layer and the light emitting cells:
the first substrate is removed before the second substrate is flipped or the second substrate is flipped before the first substrate is removed.
6. The method of claim 1, wherein the step of determining the position of the substrate comprises,
preparing a lead layer on one side of the array substrate layer, which is away from the light-emitting unit, so as to form a display unit, wherein the lead layer comprises a lead connected with the lead-out end, and the lead comprises a binding end positioned on one side of the light-emitting unit, which is away from the second substrate;
before the step of splicing the plurality of display units to form the display panel, the method further comprises the following steps:
and preparing an insulating material layer on the lead layer, and patterning the insulating material layer to form a protective layer, wherein the protective layer is provided with a second opening so that the binding end is exposed from the second opening, and the driving block is connected to the binding end.
7. A display panel, characterized in that the display panel is manufactured and molded by the manufacturing method according to any one of claims 1 to 6.
8. The display panel according to claim 7, wherein the array substrate layer includes an insulating material portion, at least a portion of the insulating material portion is located on a side of the lead-out terminal facing the first substrate, a first opening is formed in the insulating material portion, and the lead is electrically connected to each other via the first opening and the lead-out terminal;
preferably, the array substrate further includes a metal layer, the insulating material portion includes a supporting layer located at a side of the metal layer away from the light emitting unit, and at least part of the first opening is disposed in the supporting layer;
preferably, the array substrate further includes a metal layer, the metal layer includes a metal portion, the insulating material portion includes an insulating portion located in the metal layer and used for making a plurality of inter-insulation between the metal portions in the metal layer, orthographic projection of the metal portion along a thickness direction of the display panel and orthographic projection of the lead-out end along the thickness direction are arranged in a staggered manner, and at least part of the first openings are disposed in the insulating portion.
9. The display panel of claim 7, wherein the lead further comprises a binding end at a side of the light emitting unit facing away from the second substrate, the binding end being connected with a driving block;
the display unit further comprises a protective layer, the protective layer is located on one side, away from the light-emitting unit, of the lead layer, the protective layer comprises a second opening, the driving block is exposed out of the second opening, and the binding end is connected with the driving block in the second opening.
10. A display device comprising the display panel of any one of claims 7-10.
CN202210257971.9A 2022-03-16 2022-03-16 Display panel manufacturing method, display panel and display device Pending CN116799023A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210257971.9A CN116799023A (en) 2022-03-16 2022-03-16 Display panel manufacturing method, display panel and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210257971.9A CN116799023A (en) 2022-03-16 2022-03-16 Display panel manufacturing method, display panel and display device

Publications (1)

Publication Number Publication Date
CN116799023A true CN116799023A (en) 2023-09-22

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210257971.9A Pending CN116799023A (en) 2022-03-16 2022-03-16 Display panel manufacturing method, display panel and display device

Country Status (1)

Country Link
CN (1) CN116799023A (en)

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