CN113851491A - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN113851491A CN113851491A CN202111123942.5A CN202111123942A CN113851491A CN 113851491 A CN113851491 A CN 113851491A CN 202111123942 A CN202111123942 A CN 202111123942A CN 113851491 A CN113851491 A CN 113851491A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
Abstract
The invention discloses a display panel and a display device.A touch structure comprises an insulating layer, wherein at least one of the insulating layers is made of an organic material, so that the bending performance of a flexible folding display screen can be improved; and the insulating layer made of organic materials is set to be in a non-overlapping state between the orthographic projection of the display substrate and the orthographic projection of the binding area on the display substrate, so that the segment difference of the binding terminal of the binding area can be reduced, and the problem of poor crimping when the binding terminal is crimped with the drive chip and the flexible circuit board is avoided.
Description
Technical Field
The invention relates to the technical field of touch display, in particular to a display panel and a display device.
Background
With the development of an Active-matrix organic light emitting diode (AMOLED) technology, the development of display devices has entered into an era of full-screen and narrow-frame, and in order to bring better use experience to users, full-screen, narrow-frame, high resolution, curling, wearing, folding, and the like will certainly become an important development direction of future AMOLEDs; in order to realize a lighter and thinner Panel to adapt to the later folding and curling products, a Flexible Multi-Layer On Cell (FMLOC) touch technology has been developed.
Disclosure of Invention
The embodiment of the invention provides a display panel and a display device, which are used for avoiding the problem of poor crimping of binding terminals in a binding area.
An embodiment of the present invention provides a display panel, including:
a display substrate having a display area and a non-display area, the non-display area including a binding area;
the touch structure is positioned on the display substrate and comprises at least one insulating layer; the material of at least one of the at least one insulating layer is an organic material; wherein the content of the first and second substances,
the orthographic projection of the insulating layer made of the organic material on the display substrate is not overlapped with the orthographic projection of the binding region on the display substrate.
Optionally, in the display panel provided in the embodiment of the present invention, the touch structure includes: the display device comprises a first insulating layer, a first electrode layer, a second insulating layer and a second electrode layer, wherein the first insulating layer is positioned on the display substrate, the first electrode layer is positioned on one side, away from the display substrate, of the first insulating layer, the second insulating layer is positioned on one side, away from the display substrate, of the first electrode layer, and the second electrode layer is positioned on one side, away from the display substrate, of the second insulating layer;
the display substrate includes: the semiconductor device comprises a substrate, a first source drain metal layer and a second source drain metal layer, wherein the first source drain metal layer is positioned between the substrate and the first insulating layer;
the display substrate further includes a plurality of binding terminals disposed on the substrate and disposed in the binding region, the binding terminals including: the first conducting layer, the second conducting layer which is positioned at one side of the first conducting layer far away from the substrate base plate, and the third conducting layer which is positioned at one side of the second conducting layer far away from the substrate base plate; the first conducting layer and the first source drain metal layer are arranged on the same layer, the second conducting layer and the second source drain metal layer are arranged on the same layer, and the third conducting layer and the second electrode layer are arranged on the same layer.
Optionally, in the display panel provided in the embodiment of the present invention, the first insulating layer has a first through hole at a position corresponding to the bonding terminal, and an orthogonal projection of the first through hole on the substrate is located within an orthogonal projection range of the bonding terminal on the substrate; the orthographic projection of the second insulating layer on the substrate base plate and the orthographic projection of the binding region on the substrate base plate do not overlap.
Optionally, in the display panel provided in the embodiment of the present invention, a material of the first insulating layer is an inorganic material, and a material of the second insulating layer is an organic material.
Optionally, in the display panel provided in the embodiment of the present invention, an orthogonal projection of the first insulating layer on the substrate base does not overlap an orthogonal projection of the bonding region on the substrate base, the second insulating layer has a second through hole at a position corresponding to the bonding terminal, and an orthogonal projection of the second through hole on the substrate base is located within an orthogonal projection range of the bonding terminal on the substrate base.
Optionally, in the display panel provided in the embodiment of the present invention, a material of the first insulating layer is an organic material, and a material of the second insulating layer is an inorganic material.
Optionally, in the display panel provided in the embodiment of the present invention, orthographic projections of the first insulating layer and the second insulating layer on the substrate do not overlap with orthographic projections of the bonding region on the substrate.
Optionally, in the display panel provided in the embodiment of the present invention, the materials of the first insulating layer and the second insulating layer are both organic materials.
Optionally, in the display panel provided in the embodiment of the present invention, the bonding terminal further includes a fourth conductive layer located between the second conductive layer and the third conductive layer, and the fourth conductive layer and the first electrode layer are disposed in the same layer.
Optionally, in the display panel provided in the embodiment of the present invention, the display panel further includes: the first flat layer is positioned between the first source drain metal layer and the second source drain metal layer, the passivation layer is positioned between the first source drain metal layer and the first flat layer, the second flat layer is positioned between the second source drain metal layer and the first insulating layer, the pixel defining layer is positioned between the second flat layer and the first insulating layer, and the spacer layer is positioned between the pixel defining layer and the first insulating layer; wherein the content of the first and second substances,
the orthographic projections of the first flat layer, the pixel defining layer and the spacer layer on the substrate base plate and the orthographic projection of the binding region on the substrate base plate are not overlapped, the passivation layer is provided with a third through hole at a position corresponding to the binding terminal, the orthographic projection of the third through hole on the substrate base plate is positioned in the orthographic projection range of the binding terminal on the substrate base plate, the second flat layer is provided with a fourth through hole at a position corresponding to the binding terminal, and the orthographic projection of the fourth through hole on the substrate base plate is positioned in the orthographic projection range of the binding terminal on the substrate base plate.
Correspondingly, the embodiment of the invention also provides a display device, which comprises the display panel provided by the embodiment of the invention.
The embodiment of the invention has the following beneficial effects:
the invention discloses a display panel and a display device.A touch structure comprises an insulating layer, wherein at least one of the insulating layers is made of an organic material, so that the bending performance of a flexible folding display screen can be improved; and the insulating layer made of organic materials is set to be in a non-overlapping state between the orthographic projection of the display substrate and the orthographic projection of the binding area on the display substrate, so that the segment difference of the binding terminal of the binding area can be reduced, and the problem of poor crimping when the binding terminal is crimped with the drive chip and the flexible circuit board is avoided.
Drawings
Fig. 1 is a schematic top view of a display panel according to an embodiment of the present invention;
fig. 2 is a schematic cross-sectional view of a display panel in a display area according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a bond terminal of the corresponding bond region of the structure shown in FIG. 2;
FIG. 4 is an enlarged view of the inner film layer shown in FIG. 3;
fig. 5 is a schematic cross-sectional view of a display panel in a display area according to another embodiment of the present invention;
FIG. 6 is a schematic diagram of a bond terminal of the corresponding bond region of the structure shown in FIG. 5;
FIG. 7 is an enlarged view of the inner film layer shown in FIG. 6;
fig. 8 is a schematic cross-sectional view of a display panel in a display area according to another embodiment of the present invention;
FIG. 9 is a schematic diagram of a bond terminal of the corresponding bond region of the structure shown in FIG. 8;
FIG. 10 is an enlarged view of the inner film layer shown in FIG. 9;
fig. 11 is a schematic top view of a plurality of binding terminals within a binding region;
fig. 12 is a schematic top view of a display device according to an embodiment of the invention.
Detailed Description
The FMLOC touch structure generally includes a first insulating layer, a first electrode layer, a second insulating layer, and a second electrode layer, which are stacked, where the first insulating layer and the second insulating layer are both inorganic material layers, that is, the FMLOC touch structure in the related art adopts an all-inorganic scheme, and the scheme is optimized for an integrated COE (Color Filter on Encap) technology, and can obtain an optimal optical characteristic. However, with the demand for flexibility and folding and the improvement of the touch performance requirement, it is common to set both the first insulating layer and the second insulating layer in the FMLOC touch structure as organic materials, and the scheme of the all-organic materials has better flexibility function; alternatively, one of the first insulating layer and the second insulating layer is provided as an organic material and the other is provided as an inorganic material, and this organic material + inorganic material scheme has a moderate flexible function and moderate optical characteristics.
At present, full-screen display products are the mainstream of development, and a mode of bonding by using COP (Chip on PI, which is used for directly bonding a driver Chip on a display panel) becomes the development direction in the future. The display panel generally sets up the binding area, the binding area is formed with the binding terminal, the binding terminal is used for binding with driver chip, flexible circuit board etc. nevertheless adopt all organic material and organic material + inorganic material's scheme to aforementioned FMLOC touch-control structure, generally in the correlation technique with organic material rete etching rectangular hole in order to expose the binding terminal, binding terminal all around edge region is covered by the organic material rete, because the thickness of organic material rete is generally thicker, lead to binding terminal regional difference great in section around and the middle zone, when later stage and driver chip, flexible circuit board etc. crimping, the problem of crimping badness appears easily.
The present invention is directed to solving the problem of poor crimping when a binding terminal is crimped, and in order to make the objects, technical solutions and advantages of the present invention more clear, a display panel provided in an embodiment of the present invention will be described in further detail below with reference to the accompanying drawings. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment of the invention provides a display panel and a display device, wherein the display panel comprises a display substrate and a touch structure which are arranged in a laminated manner, FIG. 1 is a schematic top view, FIG. 2, FIG. 5 and FIG. 8 are schematic cross-sectional views of the display panel in the display area, fig. 3 is a schematic view of one bonding terminal of the bonding region corresponding to the structure shown in fig. 2, fig. 4 is an enlarged schematic view of an inner film layer of a dotted-line frame in fig. 3, fig. 6 is a schematic view of one bonding terminal of the bonding region corresponding to the structure shown in fig. 5, fig. 7 is an enlarged schematic view of an inner film layer of a dotted-line frame in fig. 6, fig. 9 is a schematic view of one bonding terminal of the bonding region corresponding to the structure shown in fig. 8, fig. 10 is an enlarged schematic view of an inner film layer of a dotted-line frame in fig. 9, fig. 11 is a schematic top view of a plurality of bonding terminals in a bonding region, and fig. 12 is a schematic top view of a display device.
The shapes and sizes of the various elements in the drawings are not to scale and are merely intended to illustrate the invention.
An embodiment of the present invention provides a display panel, as shown in fig. 1 to 10, including:
the display device comprises a display substrate 1, wherein the display substrate 1 is provided with a display area AA and a non-display area NA, and the non-display area NA comprises a binding area BA;
a touch structure 2 located on the display substrate 1, the touch structure 2 including at least one insulating layer (for example, two insulating layers 21 and 22); the material of at least one of the at least one insulating layer (21 and 22) is an organic material; wherein the content of the first and second substances,
the orthographic projection of the insulating layer (21 and/or 22) made of organic materials on the display substrate 1 does not overlap with the orthographic projection of the bonding area BA on the display substrate 1.
According to the display panel provided by the embodiment of the invention, at least one of the insulating layers included in the touch structure is made of the organic material, so that the bending performance of the flexible folding display screen can be improved; and the insulating layer made of organic materials is set to be in a non-overlapping state between the orthographic projection of the display substrate and the orthographic projection of the binding area on the display substrate, so that the segment difference of the binding terminal of the binding area can be reduced, and the problem of poor crimping when the binding terminal is crimped with the drive chip and the flexible circuit board is avoided.
In specific implementation, in the display panel provided in the embodiment of the present invention, as shown in fig. 2, fig. 5 and fig. 8, the touch structure 2 includes: a first insulating layer 21 located on the display substrate 1, a first electrode layer 22 located on a side of the first insulating layer 21 away from the display substrate 1, a second insulating layer 23 located on a side of the first electrode layer 22 away from the display substrate 1, and a second electrode layer 24 located on a side of the second insulating layer 23 away from the display substrate 1;
the display substrate 1 includes: the semiconductor device comprises a substrate 11, a first source-drain metal layer 12 located between the substrate 11 and a first insulating layer 21, and a second source-drain metal layer 13 located between the first source-drain metal layer 12 and the first insulating layer 21;
as shown in fig. 1, the display panel further includes a plurality of binding terminals 3 disposed on the substrate base 11 and disposed at the binding area BA, as shown in fig. 3, 4, 6, 7, 9 and 10, the binding terminals 3 including: a first conductive layer 31, a second conductive layer 32 located on a side of the first conductive layer 31 away from the substrate 11, and a third conductive layer 33 located on a side of the second conductive layer 32 away from the substrate 11; the first conductive layer 31 is provided in the same layer as the first source-drain metal layer 12, the second conductive layer 32 is provided in the same layer as the second source-drain metal layer 13, and the third conductive layer 33 is provided in the same layer as the second electrode layer 24. Thus, the original composition pattern is only required to be changed when the first source-drain metal layer 12 is formed, the patterns of the first conductive layer 31 and the first source-drain metal layer 12 can be formed through one composition process, the process for independently preparing the first conductive layer 31 is not required to be added, the original composition pattern is only required to be changed when the second source-drain metal layer 13 is formed, the patterns of the second conductive layer 32 and the second source-drain metal layer 13 can be formed through one composition process, the process for independently preparing the second conductive layer 32 is not required to be added, the original composition pattern is only required to be changed when the second electrode layer 24 is formed, the patterns of the third conductive layer 33 and the second electrode layer 24 can be formed through one composition process, the process for independently preparing the third conductive layer 33 is not required to be added, the preparation process flow can be simplified, the production cost is saved, and the production efficiency is improved.
In specific implementation, the first electrode layer 22 includes a plurality of bridge electrodes (22), and the second electrode layer 24 includes a plurality of first touch electrodes and a plurality of second touch electrodes (not shown) extending in different directions and arranged in an insulated and crossed manner; the first touch electrode includes a plurality of first touch electrode blocks (24), and the bridge electrode (22) electrically connects the first touch electrode blocks (24) through via holes penetrating the second insulating layer 23.
In specific implementation, the first touch electrode is a touch driving electrode, and the second touch electrode is a touch sensing electrode; or the first touch electrode is a touch sensing electrode, and the second touch electrode is a touch driving electrode.
In practical implementation, in the display panel provided in the embodiment of the present invention, as shown in fig. 2 to 4, the material of the first insulating layer 21 is an inorganic material, and the material of the second insulating layer 23 is an organic material. By setting the material of the second insulating layer 23 to be an organic material, the bending performance of the flexible and foldable display product can be improved.
In practical implementation, in the above display panel provided by the embodiment of the present invention, as shown in fig. 3 and 4, the first insulating layer 21 made of an inorganic material has a first through hole 211 at a position corresponding to the binding terminal 3, and an orthographic projection of the first through hole 211 on the substrate base plate 11 is located within an orthographic projection range of the binding terminal 3 on the substrate base plate 11, that is, the first insulating layer 21 only covers a peripheral edge portion of the binding terminal 3 to expose the binding terminal 3; the orthographic projection of the second insulating layer 23 made of the organic material on the substrate base plate 11 is not overlapped with the orthographic projection of the binding area BA on the substrate base plate 11, that is, the second insulating layer 23 made of the organic material is completely removed in the binding area BA, so that the film layer section difference of the binding terminal 3 is reduced. Specifically, depositing an inorganic material film layer on the display substrate 1, depositing a first metal layer on the inorganic material film layer, and etching the first metal layer, so that the first metal layer forms a first electrode layer 22 pattern in the display area AA, and the first metal layer is completely removed in the binding area BA; then, etching the inorganic material film layer, so that a first through hole 211 is formed in the inorganic material film layer at a position of the binding area BA corresponding to the binding terminal 3, that is, a first insulating layer 21 is formed; then, forming a layer of organic material film, patterning the organic material film, so that the organic material film has a via hole for overlapping the first electrode layer 22 and the second electrode layer 24 in the display area AA, and the organic material film is completely removed in the binding area BA to reduce a step difference between the edge area and the middle area of the binding terminal 3, i.e., forming a second insulating layer 23; then, depositing a second metal layer on the second insulating layer 23, and etching the second metal layer, so that the second metal layer forms a second electrode layer 24 in the display area AA, and the second metal layer forms a third conductive layer 33 in the bonding area BA; the third conductive layer 33 protects the second conductive layer 32 as a part of the binding terminal 3. The inventor of the present invention found that, in the structure shown in fig. 3, the film layer step difference is about 2.8 μm, and compared with the all-inorganic scheme (the first insulating layer 21 and the second insulating layer 23 are both made of inorganic materials, the first metal layer is completely removed in the bonding region, the first insulating layer 21 and the second insulating layer 23 are etched by using one mask process, the first insulating layer 21 and the second insulating layer 23 are both provided with via holes at the positions of the bonding terminals 3, that is, the first insulating layer 21 and the second insulating layer 23 both cover the peripheral edge portions of the bonding terminals 3), the film layer step difference is 3.78 μm, the structure shown in fig. 3 provided by the embodiment of the present invention can reduce the step difference between the edge region and the middle region of the bonding terminals 3 by completely removing the second insulating layer 23 made of organic materials in the bonding region BA, and the edge region of the bonding terminals 3 is not covered by the thicker second insulating layer 23 made of organic materials, therefore, the scheme of the embodiment of the invention has both flexible function and optical performance.
It should be noted that, in the manufacturing process of the binding terminal shown in fig. 3, the inorganic material film layer is etched after the first metal layer is etched, because if the inorganic material film layer is etched first, the first metal layer is in contact with the second conductive layer when the first metal layer is deposited, and the second conductive layer is easily etched when the first metal layer is etched, so that the first metal layer is etched first and then the inorganic material film layer is etched, and the inorganic material film layer plays a role in protecting the second conductive layer from being etched.
In practical implementation, in the display panel provided in the embodiment of the present invention, as shown in fig. 5 to 7, the material of the first insulating layer 21 is an organic material, and the material of the second insulating layer 23 is an inorganic material. By setting the material of the first insulating layer 21 to be an organic material, the bending performance of the flexible foldable display product can be improved.
In specific implementation, in the display panel provided in the embodiment of the present invention, as shown in fig. 6 and fig. 7, an orthographic projection of the first insulating layer 21 made of an organic material on the substrate 11 does not overlap with an orthographic projection of the bonding area BA on the substrate 11, that is, the first insulating layer 21 made of an organic material is completely removed in the bonding area BA, so as to reduce the film layer step difference of the bonding terminals 3; the second insulating layer 23 made of an inorganic material has a second through hole 231 at a position corresponding to the binding terminal 3, and an orthogonal projection of the second through hole 231 on the substrate 11 is located within an orthogonal projection range of the binding terminal 3 on the substrate 11, that is, the second insulating layer 23 covers only a peripheral edge portion of the binding terminal 3 to expose the binding terminal 3.
In practical implementation, in the above display panel provided in the embodiment of the present invention, as shown in fig. 6 and 7, the bonding terminal 3 further includes a fourth conductive layer 34 located between the second conductive layer 32 and the third conductive layer 33, and the fourth conductive layer 34 is disposed in the same layer as the first electrode layer 22. Thus, the patterns of the fourth conductive layer 34 and the first electrode layer 22 can be formed by one-time composition process only by changing the original composition pattern when the first electrode layer 22 is formed, and a process for separately preparing the fourth conductive layer 34 is not required to be added, so that the preparation process flow can be simplified, the production cost can be saved, and the production efficiency can be improved.
Specifically, as shown in fig. 6 and 7, an organic material film is deposited on the display substrate 1, and the organic material film is etched, so that the organic material film is completely removed in the bonding area BA, so as to reduce the step difference between the edge area and the middle area of the bonding terminal 3, i.e., form the first insulating layer 21; then, depositing a first metal layer on the first insulating layer 21, and etching the first metal layer, so that the first metal layer forms a first electrode layer 22 pattern in the display area AA, the first metal layer remains in the bonding area BA to form a fourth conductive layer 34, and the fourth conductive layer 34 serves as a part of the bonding terminal 3 to protect the second conductive layer 32 from being etched; then, depositing an inorganic material film layer on the first electrode layer 22, patterning the inorganic material film layer, forming a via hole for overlapping the first electrode layer 22 and the second electrode layer 24 in the display area AA by using the inorganic material film layer, and forming a second through hole 231 in the binding area BA at a position corresponding to the binding terminal 3, that is, forming a second insulating layer 23; then, depositing a second metal layer on the second insulating layer 23, and etching the second metal layer, so that the second metal layer forms a second electrode layer 24 in the display area AA, and the second metal layer forms a third conductive layer 33 in the bonding area BA; the third conductive layer 33 protects the fourth conductive layer 34 as a part of the binding terminal 3. Through the measurement of the inventor of the present application, it is found that, with the film layer step of the structure of the binding terminal 3 shown in fig. 6 being about 2.88 μm, compared with the film layer step of the all-inorganic solution being 3.78 μm, the first insulating layer 21 made of an organic material is completely removed in the binding region BA, and the edge region of the binding terminal 3 is not covered by the first insulating layer 21 made of an organic material, so that the step difference between the edge region and the middle region of the binding terminal 3 can be reduced, and by providing the fourth conductive layer 34, the fourth conductive layer 34 is equivalent to being higher than the middle region of the binding terminal 3, so that the film layer step of the binding terminal 3 can be further reduced, and therefore, the solution of the embodiment of the present invention has both a flexible function and an optical performance.
In practical implementation, in the display panel provided in the embodiment of the present invention, as shown in fig. 8 to 10, the materials of the first insulating layer 21 and the second insulating layer 23 are both organic materials. By setting the materials of the first insulating layer 21 and the second insulating layer 23 as organic materials, the bending performance of the flexible foldable display product can be further improved.
In specific implementation, as shown in fig. 9 and 10, in the above-mentioned display panel provided in the embodiment of the present invention, the orthographic projections of the first insulating layer 21 and the second insulating layer 22 on the substrate 11 do not overlap with the orthographic projection of the bonding area BA on the substrate 11, that is, the first insulating layer 21 and the second insulating layer 22 made of organic materials are completely removed in the bonding area BA, so as to reduce the film layer segment difference of the bonding terminals 3.
In specific implementation, in the above display panel provided in the embodiment of the present invention, as shown in fig. 9 and 10, the bonding terminal 3 further includes a fourth conductive layer 34 located between the second conductive layer 32 and the third conductive layer 33, and the fourth conductive layer 34 is disposed in the same layer as the first electrode layer 22. Thus, the patterns of the fourth conductive layer 34 and the first electrode layer 22 can be formed by one-time composition process only by changing the original composition pattern when the first electrode layer 22 is formed, and a process for separately preparing the fourth conductive layer 34 is not required to be added, so that the preparation process flow can be simplified, the production cost can be saved, and the production efficiency can be improved.
Specifically, as shown in fig. 9 and 10, a first organic material film layer is deposited on the display substrate 1, and the first organic material film layer is etched, so that the first organic material film layer is completely removed in the bonding area BA, so as to reduce a step difference between the edge area and the middle area of the bonding terminal 3, i.e., form a first insulating layer 21; then, depositing a first metal layer on the first insulating layer 21, and etching the first metal layer, so that the first metal layer forms a first electrode layer 22 pattern in the display area AA, the first metal layer remains in the bonding area BA to form a fourth conductive layer 34, and the fourth conductive layer 34 serves as a part of the bonding terminal 3 to protect the second conductive layer 32 from being etched; then, depositing a second organic material film layer on the first electrode layer 22, patterning the second organic material film layer, forming a via hole for overlapping the first electrode layer 22 and the second electrode layer 24 in the display area AA by the second organic material film layer, and completely removing the second organic material film layer in the binding area BA to reduce a step difference between an edge area and a middle area of the binding terminal 3, i.e., forming a second insulating layer 23; next, a second metal layer is deposited on the second insulating layer 23 and is etched, so that the second metal layer forms a second electrode layer 24 in the display area AA, and the second metal layer forms a third conductive layer 33 in the bonding area BA. Through the measurement of the inventor of the present application, it is found that, with the film layer step of the structure of the binding terminal 3 shown in fig. 9 being about 2.75 μm, compared with the film layer step of the all-inorganic solution being 3.78 μm, the first insulating layer 21 and the second insulating layer 23 made of organic materials are completely removed in the binding region BA, and the edge region of the binding terminal 3 is not covered by the thicker first insulating layer 21 and the second insulating layer 23 made of organic materials, so that the step difference between the edge region and the middle region of the binding terminal 3 can be further reduced, and by providing the fourth conductive layer 34, the fourth conductive layer 34 is equivalent to a pad-up of the middle region of the binding terminal 3, the film layer step of the binding terminal 3 can be further reduced, so the solution of the embodiment of the present invention has both flexible function and optical performance.
It should be noted that the structure shown in fig. 9 adopts the first organic material film layer and the second organic material film layer which are etched by two mask processes, and certainly, the first organic material film layer and the second organic material film layer can also be etched by one mask process, so that the first metal layer in the bonding area BA needs to be completely removed, but because the organic material film layer is generally thick, the etching by one mask process is difficult to be complete, two mask processes can be adopted, but one mask process or two mask processes can be selected according to actual needs.
In practical implementation, in the display panel provided in the embodiment of the present invention, as shown in fig. 2, 5 and 8, the display substrate 1 further includes: a first planarization layer 14 between the first source-drain metal layer 12 and the second source-drain metal layer 13, a passivation layer 15 between the first source-drain metal layer 12 and the first planarization layer 14, a second planarization layer 16 between the second source-drain metal layer 13 and the first insulating layer 21, a pixel defining layer 17 between the second planarization layer 16 and the first insulating layer 21, and a spacer layer 18 between the pixel defining layer 17 and the first insulating layer 21.
As shown in fig. 3, 6 and 9, the orthographic projection of the first flat layer 14, the pixel defining layer 17 and the spacer layer 18 on the substrate 11 does not overlap with the orthographic projection of the bonding area BA on the substrate 11, the passivation layer 15 has a third through hole 151 at a position corresponding to the bonding terminal 3, the orthographic projection of the third through hole 151 on the substrate 1 is located within the orthographic projection range of the bonding terminal 3 on the substrate 11, the second flat layer 16 has a fourth through hole 161 at a position corresponding to the bonding terminal 3, and the orthographic projection of the fourth through hole 161 on the substrate 11 is located within the orthographic projection range of the bonding terminal 3 on the substrate 11, that is, the second flat layer 16 covers only the peripheral edge portion of the bonding terminal 3 to expose the bonding terminal 3. Specifically, providing the second flat layer 16 so as to cover the peripheral edge portion of the binding terminal 3 can relieve stress generated when the binding terminal 3 is crimped with the driver chip or the flexible circuit board.
In specific implementation, as shown in fig. 3, 6 and 9, the first through hole 211, the second through hole 231, the third through hole 151 and the fourth through hole 161 substantially overlap.
As shown in fig. 11, the binding terminal 3 only shows the third conductive layer 33 and the fourth conductive layer 34, and since the binding terminal 3 is generally long, the first through hole 211, the second through hole 231, the third through hole 151, and the fourth through hole 161 are long holes.
In practical implementation, in the display panel provided in the embodiment of the present invention, as shown in fig. 2, 5 and 8, the display substrate 1 further includes: an anode electrode 19 located between the second flat layer 16 and the pixel defining layer 17, a light-emitting layer 20 located between the spacer layer 18 and the first insulating layer 21, a cathode electrode 25 located between the light-emitting layer 20 and the first insulating layer 21, and an encapsulation layer located between the cathode electrode 25 and the first insulating layer 21; the encapsulation layer includes a first inorganic layer 201, an organic layer 202 and a second inorganic layer 203, which are stacked, the anode 19, the light emitting layer and the cathode constitute a light emitting device, and the encapsulation layer 20 covers only the display area AA, that is, encapsulates the display area AA to prevent external moisture from entering the display substrate 1, so that the light emitting device in the display area AA fails.
In practical implementation, in the display panel provided in the embodiment of the present invention, as shown in fig. 2, 5 and 8, the display substrate 1 further includes: a buffer layer 26 located between the substrate 11 and the first source-drain metal layer 12, an active layer 27 located between the buffer layer 26 and the first source-drain metal layer 12, a first gate insulating layer 28 located between the active layer 27 and the first source-drain metal layer 12, a first gate layer 29 located between the first gate insulating layer 28 and the first source-drain metal layer 12, a second gate insulating layer 30 located between the first gate layer 29 and the first source-drain metal layer 12, a second gate layer 35 located between the second gate insulating layer 30 and the first source-drain metal layer 12, and an interlayer insulating layer 36 located between the second gate layer 35 and the first source-drain metal layer 12; the first source-drain metal layer 12 is electrically connected to the active layer 27 through via holes sequentially penetrating through the interlayer insulating layer 36, the second gate insulating layer 30 and the first gate insulating layer 28, the anode 19 is electrically connected to the second source-drain metal layer 13 through via holes sequentially penetrating through the second planarization layer 16, and the second source-drain metal layer 13 is electrically connected to the first source-drain metal layer 12 through via holes sequentially penetrating through the first planarization layer 14 and the passivation layer 15.
In specific implementation, as shown in fig. 2, 5 and 8, the display panel provided in the embodiment of the present invention further includes: the third flat layer 37 is located on the side of the second electrode layer 24 away from the substrate 11, the black matrix layer 38 and the color film layer 39(R, G, B color film) are located on the side of the third flat layer 37 away from the substrate 11, and the fourth flat layer 40 is located on the side of the black matrix layer 38 and the color film layer 39 away from the substrate 11.
In specific implementation, the inorganic material in the embodiment of the present invention may be silicon nitride, silicon oxide, or the like, and the organic material may be a material such as resin.
In practical implementation, the display panel provided in the embodiments of the present invention may further include other functional film layers known to those skilled in the art, which are not described in detail herein.
Based on the same inventive concept, the embodiment of the invention further provides a display device, which comprises the display panel provided by the embodiment of the invention. The display device can be implemented by referring to the above embodiments of the display panel, and repeated descriptions are omitted.
In specific implementation, as shown in fig. 12, the display device provided in the embodiment of the present invention further includes: the display device comprises a signal wire (not shown), a driving chip 100 (driving chip) and a flexible circuit board 110 (flexible circuit board), wherein the driving chip 100 is in pressure joint with the binding terminal 3 in fig. 1, the flexible circuit board 110 is connected with the driving chip 100, one end of the signal wire is electrically connected with the display area AA, and the other end of the signal wire is electrically connected with the driving chip 100, so that signal transmission is realized.
It should be noted that, in the embodiment of the present invention, a COP bonding method is taken as an example, but the present invention is not limited thereto, and a COF (Chip On Film) bonding method and the like may be used.
In practice, the display device provided by the embodiment of the present invention may further include other functional film layers known to those skilled in the art, which are not described in detail herein.
The display device may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.
The invention discloses a display panel and a display device.A touch structure comprises an insulating layer, wherein at least one of the insulating layers is made of an organic material, so that the bending performance of a flexible folding display screen can be improved; and the insulating layer made of organic materials is set to be in a non-overlapping state between the orthographic projection of the display substrate and the orthographic projection of the binding area on the display substrate, so that the segment difference of the binding terminal of the binding area can be reduced, and the problem of poor crimping when the binding terminal is crimped with the drive chip and the flexible circuit board is avoided.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (11)
1. A display panel, comprising:
a display substrate having a display area and a non-display area, the non-display area including a binding area;
the touch structure is positioned on the display substrate and comprises at least one insulating layer; the material of at least one of the at least one insulating layer is an organic material; wherein the content of the first and second substances,
the orthographic projection of the insulating layer made of the organic material on the display substrate is not overlapped with the orthographic projection of the binding region on the display substrate.
2. The display panel of claim 1, wherein the touch structure comprises: the display device comprises a first insulating layer, a first electrode layer, a second insulating layer and a second electrode layer, wherein the first insulating layer is positioned on the display substrate, the first electrode layer is positioned on one side, away from the display substrate, of the first insulating layer, the second insulating layer is positioned on one side, away from the display substrate, of the first electrode layer, and the second electrode layer is positioned on one side, away from the display substrate, of the second insulating layer;
the display substrate includes: the semiconductor device comprises a substrate, a first source drain metal layer and a second source drain metal layer, wherein the first source drain metal layer is positioned between the substrate and the first insulating layer;
the display substrate further includes a plurality of binding terminals disposed on the substrate and disposed in the binding region, the binding terminals including: the first conducting layer, the second conducting layer which is positioned at one side of the first conducting layer far away from the substrate base plate, and the third conducting layer which is positioned at one side of the second conducting layer far away from the substrate base plate; the first conducting layer and the first source drain metal layer are arranged on the same layer, the second conducting layer and the second source drain metal layer are arranged on the same layer, and the third conducting layer and the second electrode layer are arranged on the same layer.
3. The display panel according to claim 2, wherein the first insulating layer has a first through hole at a position corresponding to the bonding terminal, and an orthographic projection of the first through hole on the substrate base plate is located within an orthographic projection range of the bonding terminal on the substrate base plate; the orthographic projection of the second insulating layer on the substrate base plate and the orthographic projection of the binding region on the substrate base plate do not overlap.
4. The display panel according to claim 3, wherein a material of the first insulating layer is an inorganic material, and a material of the second insulating layer is an organic material.
5. The display panel according to claim 2, wherein an orthographic projection of the first insulating layer on the substrate base plate does not overlap with an orthographic projection of the bonding region on the substrate base plate, the second insulating layer has a second through hole at a position corresponding to the bonding terminal, and the orthographic projection of the second through hole on the substrate base plate is located within an orthographic projection range of the bonding terminal on the substrate base plate.
6. The display panel according to claim 5, wherein a material of the first insulating layer is an organic material, and a material of the second insulating layer is an inorganic material.
7. The display panel of claim 2, wherein an orthographic projection of the first insulating layer and the second insulating layer on the substrate base does not overlap with an orthographic projection of the bonding region on the substrate base.
8. The display panel according to claim 7, wherein the material of each of the first insulating layer and the second insulating layer is an organic material.
9. The display panel according to claim 6 or 8, wherein the binding terminal further comprises a fourth conductive layer between the second conductive layer and the third conductive layer, the fourth conductive layer being disposed in the same layer as the first electrode layer.
10. The display panel according to any one of claims 2 to 8, wherein the display panel further comprises: the first flat layer is positioned between the first source drain metal layer and the second source drain metal layer, the passivation layer is positioned between the first source drain metal layer and the first flat layer, the second flat layer is positioned between the second source drain metal layer and the first insulating layer, the pixel defining layer is positioned between the second flat layer and the first insulating layer, and the spacer layer is positioned between the pixel defining layer and the first insulating layer; wherein the content of the first and second substances,
the orthographic projections of the first flat layer, the pixel defining layer and the spacer layer on the substrate base plate and the orthographic projection of the binding region on the substrate base plate are not overlapped, the passivation layer is provided with a third through hole at a position corresponding to the binding terminal, the orthographic projection of the third through hole on the substrate base plate is positioned in the orthographic projection range of the binding terminal on the substrate base plate, the second flat layer is provided with a fourth through hole at a position corresponding to the binding terminal, and the orthographic projection of the fourth through hole on the substrate base plate is positioned in the orthographic projection range of the binding terminal on the substrate base plate.
11. A display device characterized by comprising the display panel according to any one of claims 1 to 10.
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|---|---|---|---|
| CN202111123942.5A CN113851491A (en) | 2021-09-24 | 2021-09-24 | Display panel and display device |
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| CN202111123942.5A CN113851491A (en) | 2021-09-24 | 2021-09-24 | Display panel and display device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023142014A1 (en) * | 2022-01-29 | 2023-08-03 | 京东方科技集团股份有限公司 | Touch display panel, touch display device, and touch display motherboard |
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2021
- 2021-09-24 CN CN202111123942.5A patent/CN113851491A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023142014A1 (en) * | 2022-01-29 | 2023-08-03 | 京东方科技集团股份有限公司 | Touch display panel, touch display device, and touch display motherboard |
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