CN116798921B - Wafer horizontal cleaning device - Google Patents
Wafer horizontal cleaning device Download PDFInfo
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- CN116798921B CN116798921B CN202311074362.0A CN202311074362A CN116798921B CN 116798921 B CN116798921 B CN 116798921B CN 202311074362 A CN202311074362 A CN 202311074362A CN 116798921 B CN116798921 B CN 116798921B
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- 238000004140 cleaning Methods 0.000 title claims abstract description 63
- 235000012431 wafers Nutrition 0.000 claims abstract description 122
- 230000007246 mechanism Effects 0.000 claims abstract description 52
- 238000007599 discharging Methods 0.000 claims abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 60
- 238000007789 sealing Methods 0.000 claims description 43
- 238000003860 storage Methods 0.000 claims description 17
- 239000007921 spray Substances 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 10
- 238000005192 partition Methods 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 2
- 230000000903 blocking effect Effects 0.000 abstract description 11
- 230000007306 turnover Effects 0.000 description 7
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 6
- 235000017491 Bambusa tulda Nutrition 0.000 description 6
- 241001330002 Bambuseae Species 0.000 description 6
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 239000011425 bamboo Substances 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 238000005406 washing Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000011010 flushing procedure Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 239000010865 sewage Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The application relates to the field of wafer cleaning, in particular to a wafer horizontal cleaning device, which comprises a workbench and a rotating disc rotatably arranged on the workbench, wherein a plurality of fixed rings are arranged on the outer wall of the rotating disc, a plurality of hinge holes are formed in the top of each fixed ring, hinge rods are arranged in each hinge hole, a fan-shaped blocking plate is arranged on each hinge rod, and a plane for placing wafers can be formed by the fan-shaped blocking plates; the wafer cleaning device comprises a wafer cleaning device, a wafer cleaning device and a wafer cleaning device, wherein a plurality of avoidance grooves for avoiding a fan-shaped plugging plate are formed in the inner wall of each fixing ring, a limiting mechanism capable of fixing the wafer is arranged on each fixing ring, a cleaning mechanism is arranged on a workbench and can enable a plane to be opened so as to flush two sides of the wafer, and a discharging mechanism for taking out the cleaned wafer is also arranged on the workbench.
Description
Technical Field
The application relates to the field of wafer cleaning, in particular to a wafer horizontal cleaning device.
Background
Wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits, the original material of which is silicon. The high-purity polycrystalline silicon is dissolved and then doped with silicon crystal seed, and then slowly pulled out to form cylindrical monocrystalline silicon. The silicon ingot is ground, polished, and sliced to form a silicon wafer, i.e., a wafer.
Chinese patent: CN113770079B discloses a wafer cleaning device for cleaning a wafer, comprising a workbench, a rotary clamping assembly and a cleaning assembly; the wafer is arranged on the workbench; the rotary clamping assembly is arranged on the workbench and is provided with at least three rotary ends which are uniformly arranged along the circumferential direction of the wafer and have the same rotation direction, and the at least three rotary ends are abutted against the thin edge of the wafer and are used for driving the wafer to rotate along the axial direction of the wafer; the cleaning assembly comprises a horizontally arranged cleaning brush, the cleaning brush is rotationally connected with the workbench, the cleaning brush is arranged on the surface of the wafer, a cavity is formed in the cleaning brush, the cavity is communicated with the outer surface of the cleaning brush, the cleaning brush enables the cavity to be externally connected with a cleaning medium through a rotary joint, and the wafer is cleaned through the rotation of the wetted cleaning brush.
In this application, only can wash the one side of single wafer at every turn, the cleaning efficiency is lower to contradict the location and drive the wafer through a plurality of gyro wheels and rotate, when the wafer washs, because the wafer is in the rotation state, the rivers can probably the wafer produce the slope and then make the wafer produce the skew, can lead to the wafer to produce the damage.
Disclosure of Invention
To the problem that prior art exists, provide a wafer level belt cleaning device, carry out the bearing to the wafer through a plurality of fan-shaped shutoff boards, when wasing, fan-shaped shutoff board is opened and is fixed a position the wafer through a plurality of square conflict pieces, through the cooperation of two seal drums and a plurality of high pressure nozzle, carry out abluent in-process to the wafer both sides, shelter from pure water, avoid it to splash, through the cooperation of rolling disc and shedding mechanism, can be continuous process the wafer, raise machining efficiency.
In order to solve the problems in the prior art, the application adopts the following technical scheme:
the wafer horizontal cleaning device comprises a workbench, a rotating disc, a cleaning mechanism, an adjusting assembly, a limiting mechanism and a discharging mechanism; the rotating disc is arranged on the workbench in a horizontal state and can rotate, a plurality of connecting strips are arranged on the outer wall of the rotating disc along the circumferential direction, a fixed ring is arranged at one end, far away from the rotating disc, of each connecting strip, the fixed ring is arranged in a horizontal state, a plurality of hinge holes are formed in the top of the fixed ring along the axial direction, hinge rods can be rotatably arranged in each hinge hole, a fan-shaped plugging plate is arranged on each hinge rod, a plurality of avoidance grooves for avoiding the fan-shaped plugging plate are formed in the outer wall of the fixed ring along the axial direction, and a plane for placing wafers can be formed by the fan-shaped plugging plates; the cleaning mechanism is arranged on the workbench and comprises two sealing barrels which can be mutually close to and far away from each other, the two sealing barrels are coaxially arranged in a vertical state, the opening ends of the two sealing barrels are oppositely arranged, an annular water storage cavity is formed in each sealing barrel, an annular chute communicated with the annular water storage cavity is formed in the inner wall of each sealing barrel, a rotating ring is rotatably arranged in each annular chute, a plurality of water supply holes are formed in the inner wall of the rotating ring along the axial direction, a water supply pipe is radially arranged in each water supply hole, a plurality of high-pressure spray heads are arranged in each water supply pipe along the axial direction, and a water supply port communicated with the annular water storage cavity is formed in the outer wall of each sealing barrel; the adjusting component is arranged on the lower sealing cylinder and can synchronously rotate a plurality of hinging rods on the corresponding fixing rings along with the approach of the two sealing cylinders; the limiting mechanisms are provided with a plurality of groups, the limiting mechanisms are arranged inside the corresponding fixed rings, each limiting mechanism comprises a plurality of abutting rods which are radially arranged along the axis of the corresponding fixed ring, and one end, close to the axis of the corresponding fixed ring, of each abutting rod is provided with a square abutting block; the unloading mechanism is arranged on the workbench and is positioned on one side of the rotating disc away from the detection mechanism, and the unloading mechanism can take out the cleaned wafer from the inside of the fixed ring.
Preferably, the outer wall of each rotating ring is provided with a plurality of blades along the axis direction, each annular water storage cavity is internally provided with an annular partition plate, the annular partition plate is provided with a plurality of inclined holes along the axis direction, and each inclined hole is internally provided with a conical driving tube.
Preferably, a plurality of water supply pipes positioned in the same rotating ring are communicated with one another near one ends of the axes of the corresponding rotating rings, a central pipe extending vertically downwards is arranged at the center of the rotating ring, and the central pipe is communicated with the plurality of water supply pipes.
Preferably, the adjustment assembly comprises a mounting ring; the bottom of each fixed ring is provided with a plurality of mounting holes communicated with corresponding hinge holes along the axis direction, the mounting holes and the corresponding hinge holes are coaxially arranged, one end of each hinge rod close to the mounting holes is provided with a rotating column, the outer wall of each rotating column is provided with an arc-shaped guide groove in a mirror image mode, the mounting rings are fixedly sleeved outside the corresponding sealing cylinders in a horizontal state, and the top of each mounting ring is provided with a plurality of first L-shaped guide rods corresponding to the arc-shaped guide grooves along the axis direction; and a reset torsion spring is arranged at the position of each hinge rod in the corresponding mounting hole.
Preferably, the cleaning mechanism further comprises a vertical sliding rail and a driving motor; the vertical slide rail is vertical state setting on the workstation, and the inside rotatable two-way lead screw that is provided with of vertical slide rail, driving motor set up at vertical slide rail top and be used for driving two-way lead screw and rotate, and the inside slidable of vertical slide rail is provided with two L shape fixed bars, and two L shape fixed bars are in the both ends threaded connection of two-way lead screw respectively, and the one end that vertical slide rail was kept away from to every L shape fixed bar is connected with corresponding seal barrel.
Preferably, the limiting mechanism further comprises a pushing cylinder, a moving ring, a first abutting spring and a second abutting spring; the upper end of the inner wall of each fixed ring is radially provided with a plurality of sliding holes along the axial direction, the inner wall mirror image of each sliding hole is provided with a plurality of first guide grooves, each pushing cylinder is provided with a plurality of first guide blocks corresponding to the first guide grooves, and the first guide blocks can be slidably arranged in the corresponding first guide grooves; the inner wall mirror image of each pushing cylinder is provided with a second guide groove, the outer wall mirror image of one end of each abutting rod far away from the square abutting block is provided with a second guide block corresponding to the second guide groove, and the abutting rods can be slidably arranged in the corresponding pushing cylinders; the top of the fixed ring is provided with a plurality of guide rods along the axis direction, the movable ring is coaxially arranged above the corresponding fixed ring in a horizontal state, the top of the movable ring is provided with guide holes corresponding to the guide rods along the axis direction, the guide rods can be slidably arranged in the corresponding guide holes, each guide rod is sleeved with a tightening spring, and the tightening springs are positioned between the corresponding movable ring and the fixed ring; the plurality of first abutting springs are arranged in the sliding holes and positioned between the corresponding pushing cylinders and the inner walls of the bottoms of the corresponding sliding holes; the plurality of second abutting springs are arranged in the pushing cylinder and positioned between the inner wall of the bottom of the corresponding pushing cylinder and the corresponding abutting rods; the center department of one end that square conflict piece was kept away from to every conflict pole is provided with the haulage rope, and the solid fixed ring top is provided with a plurality of intercommunication along the axis direction and corresponds the rope guiding hole of sliding hole, and every promotion section of thick bamboo bottom center department is provided with the first perforation that is used for supplying the haulage rope to pass through, and the removal ring bottom is provided with a plurality of connecting portions along the axis direction, and the haulage rope passes corresponding first perforation in proper order, draws the rope guiding hole to be connected with corresponding connecting portion.
Preferably, a rectangular groove for accommodating the wafer is formed in the center of one side of each square abutting block, which is far away from the corresponding abutting rod, and inclined surfaces for guiding the wafer are formed in the inner walls of the two sides of each rectangular groove; the inner wall of the bottom of each rectangular groove is provided with a strip-shaped chute along the length direction, and a reciprocating plate is arranged in the strip-shaped chute in a sliding manner; an annular air supply cavity is arranged in each fixed ring, and each annular air supply cavity is communicated with a plurality of sliding holes; two air supply channels are formed in the mirror image inside each abutting rod, are communicated with the corresponding sliding holes, are communicated with the corresponding rectangular grooves and are positioned at two ends of the strip-shaped sliding groove along the length direction; the center of the rotating disc is provided with a connecting hole, a gas-liquid slip ring is arranged in the connecting hole, one side of the top of each fixed ring, which is close to the connecting strip, is provided with an air supply hole communicated with the annular air supply cavity, and the output end of the gas-liquid slip ring is communicated with the corresponding air supply hole through a connecting hose; the bottom of the workbench is provided with a servo motor for driving the rotating disc to rotate.
Preferably, the discharging mechanism comprises a conveying belt, a hydraulic rod, a collision ring and a turnover disc; the conveying belt is arranged on the workbench and is positioned on one side of the rotating disc, far away from the vertical sliding rail, two placement plates are arranged on two sides of the conveying belt along the length direction, two hydraulic rods are arranged on the corresponding placement plates in a vertical state, and the abutting ring is arranged above the two hydraulic rods in a horizontal state and is connected with the corresponding hydraulic rod executing part; a plurality of second L-shaped guide rods corresponding to the arc-shaped guide grooves are arranged at the top of the abutting ring along the axial direction; the rotating rods can be rotatably arranged in the corresponding rotating holes, and one end of each rotating rod extending out of the corresponding abutting ring is provided with a horizontal torsion spring; a horizontal plate is arranged at the top of one end of the conveying belt, which is close to the turnplate, and a pushing rod for pushing the turnplate to turn is arranged on the horizontal plate.
Compared with the prior art, the application has the beneficial effects that:
1. according to the application, through the cooperation of the sealing cylinders and the contact resisting rods, a worker places the wafer on a plane formed by the fan-shaped sealing plates, and a sealed columnar space is formed along with the mutual approaching of the two sealing cylinders, so that the wafer is prevented from splashing in the cleaning process, the contact resisting rods can be used for abutting against the wafer, the wafer is suspended in the fixed ring, the time for the worker to adjust is shortened, the two sides of the wafer are cleaned through the high-pressure spray heads, and the wafer can be continuously cleaned through the cooperation of the rotating disc and the discharging mechanism, so that the cleaning efficiency is improved.
2. According to the application, the rotating ring is arranged, when pure water is conveyed into the annular water storage cavity, the blades are pushed to rotate by the plurality of conical driving pipes, so that the plurality of high-pressure spray heads can comprehensively wash the two sides of the wafer, and the hollow pipes are arranged, so that the pure water can impact the centers of the two sides of the wafer and collide with the pure water sprayed by the plurality of high-pressure spray heads, the surface of the wafer is covered more comprehensively, and the cleaning effect of the wafer is improved.
3. According to the application, through the cooperation of the gas-liquid garter and the contact rod, when the two sealing cylinders are close to each other, the square contact block moves towards the direction close to the wafer, the wafer can be tilted through the inclined surface, so that the wafer can be moved into the rectangular groove and contacted with the reciprocating plate, then, a worker can convey gas into the annular gas supply cavity through the gas-liquid sliding ring, the gas enters the two gas supply channels through the sliding holes and blows the two sides of the wafer, so that the wafer can be suspended in the rectangular groove, and along with the continuous impact of the high-pressure spray head, the wafer can vibrate reciprocally along the length direction of the strip-shaped sliding groove, not only can the cleaning effect of the wafer be improved, but also the surface of the wafer can be dried when the wafer is not washed, and the subsequent transportation is facilitated.
Drawings
FIG. 1 is a perspective view of a wafer level cleaning apparatus;
FIG. 2 is an enlarged view of a portion of FIG. 1 at A;
FIG. 3 is a side view of a wafer level cleaning apparatus;
FIG. 4 is a perspective view of a retaining ring and a limiting mechanism in a wafer level cleaning apparatus;
FIG. 5 is an enlarged view of a portion of FIG. 4 at B;
FIG. 6 is a top view of a retaining ring and stop mechanism in a wafer level cleaning apparatus;
FIG. 7 is a plan cross-sectional view of FIG. 6 taken along the direction C-C;
FIG. 8 is a partial enlarged view at D in FIG. 7;
FIG. 9 is an enlarged view of a portion of FIG. 7 at E;
FIG. 10 is an exploded perspective view of a stationary ring and hinge rod in a wafer level cleaning apparatus;
FIG. 11 is a bottom view of a cleaning mechanism in a wafer level cleaning apparatus;
FIG. 12 is a perspective cross-sectional view of a cleaning mechanism in a wafer level cleaning apparatus;
FIG. 13 is an enlarged view of a portion of FIG. 12 at F;
FIG. 14 is a partial perspective exploded view of a cleaning mechanism in a wafer level cleaning apparatus;
fig. 15 is an exploded perspective view of a discharge mechanism in a wafer level cleaning apparatus.
The reference numerals in the figures are:
1-a workbench; 11-a servo motor;
2-rotating a disc; 21-connecting strips; 211-bar grooves; 22-a fixed ring; 221-a hinge hole; 222-avoiding grooves; 223-mounting holes; 224-a sliding hole; 2241-first guide slots; 225-a guide bar; 2251-tightening the spring; 226-rope guiding holes; 227-an annular air supply chamber; 228-a gas supply hole; 23-hinging rod; 231-sector-shaped plugging plates; 232-rotating the column; 233-arc-shaped guide grooves; 234-reset torsion spring; 24-connecting holes; 25-gas-liquid slip rings; 251-connecting hoses;
3-a cleaning mechanism; 31-sealing the cylinder; 311-annular water storage cavity; 312-annular chute; 313-water feed port; 314-a sewage outlet; 315-annular separator plate; 316-inclined hole; 317-conical drive tube; 32-rotating a ring; 321-water supply holes; 322-leaves; 33-a water supply pipe; 331-high pressure spray head; 34-a central tube; 35-vertical slide rails; 351-a bidirectional screw rod; 352-L-shaped fixing strip; 36-driving a motor;
4-an adjustment assembly; 41-mounting ring; 42-a first L-shaped guide bar;
5-a limiting mechanism; 51-a touch-up lever; 511-square-shaped interference blocks; 5111-rectangular groove; 5112-inclined plane; 5113-a bar chute; 5114-shuttle plate; 512-second guide block; 513-hauling ropes; 514-gas supply channel; 52-pushing the cylinder; 521-a first guide block; 522-a second guide groove; 523-first perforations; 53-a shift ring; 531-guide holes; 532-connection; 54-a first interference spring; 55-a second interference spring;
6-a discharging mechanism; 61-a conveyor belt; 611-placing a plate; 612-horizontal plate; 613-pushing rod; 62-a hydraulic rod; 63-an interference ring; 631-a second L-shaped guide rod; 632-a rotation hole; 64-turning disc; 641-turning a rod; 642-horizontal torsion spring.
Detailed Description
The application will be further described in detail with reference to the drawings and the detailed description below, in order to further understand the features and technical means of the application and the specific objects and functions achieved.
Referring to fig. 1 to 15, a wafer horizontal cleaning device comprises a workbench 1, a rotating disc 2, a cleaning mechanism 3, an adjusting component 4, a limiting mechanism 5 and a discharging mechanism 6; the rotating disc 2 is arranged on the workbench 1 in a horizontal state and can rotate, a plurality of connecting strips 21 are arranged on the outer wall of the rotating disc 2 along the circumferential direction, a fixed ring 22 is arranged at one end, far away from the rotating disc 2, of each connecting strip 21, the fixed ring 22 is arranged in a horizontal state, a plurality of hinge holes 221 are formed in the top of the fixed ring 22 along the axial direction, a hinge rod 23 can be rotatably arranged in each hinge hole 221, a fan-shaped blocking plate 231 is arranged on each hinge rod 23, a plurality of avoiding grooves 222 for avoiding the fan-shaped blocking plate 231 are formed in the outer wall of the fixed ring 22 along the axial direction, and a plane for placing wafers can be formed by the fan-shaped blocking plates 231; the cleaning mechanism 3 is arranged on the workbench 1, the cleaning mechanism 3 comprises two sealing drums 31 which can be mutually close to and far away from each other, the two sealing drums 31 are coaxially arranged in a vertical state, the opening ends of the two sealing drums 31 are oppositely arranged, an annular water storage cavity 311 is arranged in each sealing drum 31, an annular chute 312 communicated with the annular water storage cavity 311 is arranged on the inner wall of each sealing drum 31, a rotating ring 32 is rotatably arranged in each annular chute 312, a plurality of water supply holes 321 are formed in the inner wall of the rotating ring 32 along the axial direction, water supply pipes 33 are radially arranged in each water supply hole 321, a plurality of high-pressure spray heads 331 are arranged in each water supply pipe 33 along the axial direction, and a water supply opening 313 communicated with the annular water storage cavity 311 is formed in the outer wall of each sealing drum 31; the adjusting component 4 is arranged on the lower sealing cylinder 31 and can synchronously rotate the plurality of hinging rods 23 on the corresponding fixed ring 22 along with the approaching of the two sealing cylinders 31; the limiting mechanisms 5 are provided with a plurality of groups, the limiting mechanisms 5 are arranged in the corresponding fixed rings 22, the limiting mechanisms 5 comprise a plurality of abutting rods 51 which are radially arranged along the axes of the corresponding fixed rings 22, and one end, close to the axes of the corresponding fixed rings 22, of each abutting rod 51 is provided with a square abutting block 511; the unloading mechanism 6 is arranged on the workbench 1 and is positioned on one side of the rotating disc 2 away from the detecting mechanism, and the unloading mechanism 6 can take out the cleaned wafer from the inside of the fixed ring 22.
The wafer is placed inside the fixed ring 22 by a worker in turn, at this time, the plurality of sector-shaped blocking plates 231 can form a plane for carrying the wafer so that the wafer is placed on the plane in a horizontal state, then, the worker adjusts the rotating disc 2 so that the fixed ring 22 carrying the wafer can be moved between the two sealing drums 31, at this time, the three are on the same axis, then, by adjusting the two sealing drums 31 to be close to each other, the adjusting assembly 4 provided on the lower sealing drum 31 can synchronously rotate the plurality of hinge rods 23, each connecting rod 21 is provided with the bar-shaped groove 211 for avoiding the sector-shaped blocking plate 231 so that the corresponding fixed ring 22 is in an open state, then, the plurality of abutting rods 51 synchronously move toward the direction close to the axis of the corresponding fixed ring 22 so that the plurality of square abutting blocks 511 can be contacted with the outer wall of the wafer, the wafer can be suspended in the fixed ring 22 in a horizontal state, then, a worker continuously conveys pure water into the annular water storage cavities 311 corresponding to the two sealing drums 31 sequentially through the water conveying ports 313 on the outer walls of the sealing drums 31, the pure water enters the water supply pipes 33 through the water supply holes 321 on the rotating ring 32 and washes the surfaces of the two sides of the wafer through the high-pressure spray nozzles 331, the plane formed by the high-pressure spray nozzles on the same water supply pipe 33 is arranged at a certain angle with the surface of the wafer, so that the sprayed pure water can obliquely impact the surface of the wafer, the cleaning effect on the surface of the wafer is improved, the washing efficiency is improved, at the moment, a sealed columnar space can be formed among the two sealing drums 31, the fixed ring 22 and the fan-shaped blocking plates 231, so that the pure water is prevented from splashing everywhere in the washing process, and the bottom of the sealing drum 31 at the lower end is provided with the drain 314, the workbench 1 is provided with a circular avoidance opening for avoiding the lower end sealing cylinder 31, and workers can hook an external hose to collect sewage after flushing, so that continuous flushing is facilitated; the rotating ring 32 can rotate along the annular sliding groove 312, so that the two sides of the wafer can be comprehensively washed, the washing quality of the wafer is improved, after washing is finished, the two sealing drums 31 are separated from each other, so that the washed wafer can fall onto a plane formed by the fan-shaped plugging plates 231, then the rotating disc 2 continues to rotate, the washed wafer is taken down from the plane through the unloading mechanism 6, and therefore the wafer can be washed continuously, and the washing efficiency is improved.
Referring to fig. 12 to 14, the outer wall of each rotating ring 32 is provided with a plurality of blades 322 in the axial direction, an annular partition plate 315 is provided in each annular water storage chamber 311, the annular partition plate 315 is provided with a plurality of inclined holes 316 in the axial direction, and a tapered driving tube 317 is provided in each inclined hole 316.
Through being provided with annular division board 315 to divide into two annular space with annular water storage chamber 311, annular spout 312 and the annular space intercommunication that is close to sealed section of thick bamboo 31 open end, water supply port 313 and the annular space intercommunication of keeping away from sealed section of thick bamboo 31 open end, the staff carries the pure water in to annular water storage chamber 311 through water supply port 313, and the pure water contacts the blade 322 of rotor ring 32 outer wall through the toper drive pipe 317 that sets up in inclined hole 316, thereby drives rotor ring 32 and rotates along corresponding sealed section of thick bamboo 31 axis, thereby makes pure water carry out comprehensive washing to the wafer surface.
Referring to fig. 12 to 14, a plurality of water supply pipes 33 located in the same rotary ring 32 communicate with each other near one end of the axis of the corresponding rotary ring 32, and a central pipe 34 extending vertically downward is provided at the center of the rotary ring 32, the central pipe 34 communicating with the plurality of water supply pipes 33.
Through being provided with center tube 34 to can make pure water impact the both sides center department of wafer and collide each other with the pure water that a plurality of high pressure shower nozzles 331 sprayed, carry out more comprehensive coverage to the wafer surface, thereby improve the cleaning performance to the wafer.
Referring to fig. 10 to 12, the adjustment assembly 4 includes a mounting ring 41; the bottom of each fixed ring 22 is provided with a plurality of mounting holes 223 communicated with corresponding hinge holes 221 along the axial direction, the mounting holes 223 and the corresponding hinge holes 221 are coaxially arranged, one end of each hinge rod 23 close to the mounting hole 223 is provided with a rotary column 232, the outer wall mirror image of each rotary column 232 is provided with an arc-shaped guide groove 233, the mounting ring 41 is fixedly sleeved outside the corresponding sealing cylinder 31 in a horizontal state, and the top of the mounting ring 41 is provided with a plurality of first L-shaped guide rods 42 corresponding to the arc-shaped guide grooves 233 along the axial direction; a return torsion spring 234 is provided at a position where each hinge lever 23 is located in the corresponding mounting hole 223.
When the flushing is performed, under the torsion action of the reset torsion spring 234, the fan-shaped plugging plates 231 can rotate along the axes of the corresponding hinge rods 23, so that the inside of the fixed ring 22 is plugged; when two seal drums 31 are close to each other, the installation ring 41 fixedly arranged on the outer wall of the seal drum 31 at the lower end can move along with the movement of the seal drum 31 towards the direction close to the bottom of the fixed ring 22, and then, the plurality of first L-shaped guide rods 42 arranged on the installation ring 41 can be contacted with the arc-shaped guide grooves 233 on the corresponding rotating columns 232, so that the rotating columns 232 can rotate along with the movement of the installation ring 41, the hinge rod 23 can overcome the torsion force of the reset torsion spring 234 to drive the plurality of fan-shaped blocking plates 231 to move along the direction away from the axis of the corresponding fixed ring 22, and the inside of the fixed ring 22 is in an open state, so that the two sides of a wafer can be conveniently washed.
Referring to fig. 11 to 12, the cleaning mechanism 3 further includes a vertical slide rail 35 and a drive motor 36; the vertical slide rail 35 is vertical state setting on workstation 1, and the inside rotatable of vertical slide rail 35 is provided with two-way lead screw 351, and driving motor 36 sets up at vertical slide rail 35 top and is used for driving two-way lead screw 351 to rotate, and the inside slidable of vertical slide rail 35 is provided with two L shape fixed strips 352, and two L shape fixed strips 352 are in two end threaded connection of two-way lead screw 351 respectively, and the one end that every L shape fixed strip 352 kept away from vertical slide rail 35 is connected with corresponding seal tube 31.
Through being provided with driving motor 36, the staff adjusts driving motor 36 and drives two-way lead screw 351 and rotate to along with the rotation of two-way lead screw 351 to make two L shape fixed strip 352 strips be close to each other, the one end that vertical slide rail 35 was kept away from to every L shape fixed strip 352 is connected with corresponding seal section of thick bamboo 31, thereby can make two seal section of thick bamboo 31 be close to each other, thereby can wash the both sides of wafer.
Referring to fig. 4 to 8, the limit mechanism 5 further includes a pushing cylinder 52, a moving ring 53, a first abutting spring 54, and a second abutting spring 55; the upper end of the inner wall of each fixed ring 22 is radially provided with a plurality of sliding holes 224 along the axial direction, the inner wall of each sliding hole 224 is provided with a plurality of first guide grooves 2241 in a mirror image manner, each pushing cylinder 52 is provided with a plurality of first guide blocks 521 corresponding to the first guide grooves 2241 in a mirror image manner, and the first guide blocks 521 can be slidably arranged in the corresponding first guide grooves 2241; the inner wall mirror image of each pushing cylinder 52 is provided with a second guide groove 522, the outer wall mirror image of one end of each abutting rod 51 far away from the square abutting block 511 is provided with a second guide block 512 corresponding to the second guide groove 522, and the abutting rods 51 can be slidably arranged in the corresponding pushing cylinders 52; a plurality of guide rods 225 are arranged at the top of the fixed ring 22 along the axial direction, the movable ring 53 is coaxially arranged above the corresponding fixed ring 22 in a horizontal state, guide holes 531 corresponding to the guide rods 225 are arranged at the top of the movable ring 53 along the axial direction, the guide rods 225 can be slidably arranged in the corresponding guide holes 531, a tightening spring 2251 is sleeved on each guide rod 225, and the tightening spring 2251 is positioned between the corresponding movable ring 53 and the fixed ring 22; the first abutting springs 54 are multiple, and the first abutting springs 54 are arranged in the sliding holes 224 and are positioned between the corresponding pushing cylinders 52 and the inner walls of the bottoms of the corresponding sliding holes 224; the second abutting springs 55 are multiple, and the second abutting springs 55 are arranged in the pushing cylinder 52 and are positioned between the inner wall of the bottom of the corresponding pushing cylinder 52 and the corresponding abutting rods 51; a traction rope 513 is arranged at the center of one end of each abutting rod 51 far away from the square abutting block 511, a plurality of rope guiding holes 226 communicated with the corresponding sliding holes 224 are formed in the top of the fixed ring 22 along the axis direction, a first through hole 523 used for the traction rope 513 to pass through is formed in the center of the bottom of each pushing cylinder 52, a plurality of connecting parts 532 are arranged at the bottom of the movable ring 53 along the axis direction, and the traction rope 513 sequentially penetrates through the corresponding first through hole 523 and the rope guiding holes 226 to be connected with the corresponding connecting parts 532.
When the wafer is not washed, the moving ring 53 can synchronously pull the plurality of traction ropes 513 under the action of the elastic force of the tightening spring 2251, so that the contact rod 51 and the pushing barrel 52 retract into the corresponding sliding holes 224, thereby facilitating the placement of the wafer on the plane formed by the plurality of fan-shaped blocking plates 231 by a worker, when the two sealing barrels 31 are mutually close, the sealing barrel 31 at the upper end is close to the moving ring 53, so that the moving ring 53 can move towards the direction close to the fixed ring 22, the traction ropes 513 are relaxed, and under the action of the elastic force of the first abutting spring 54 and the second abutting spring 55, the pushing barrel 52 and the abutting rod 51 can sequentially move towards the axial direction of the corresponding fixed ring 22 and contact with the outer wall of the wafer, so that the wafer can be suspended at the center of the fixed ring 22, and the high-pressure spray head 331 can conveniently wash the surfaces on both sides of the wafer.
Referring to fig. 2, 3, 5 and 9, a rectangular groove 5111 for accommodating a wafer is provided at the center of one side of each square abutting block 511 away from the corresponding abutting rod 51, and inclined surfaces 5112 for guiding the wafer are provided at both side inner walls of each rectangular groove 5111; a strip-shaped chute 5113 is arranged on the inner wall of the bottom of each rectangular groove 5111 along the length direction, and a round trip plate 5114 is arranged in the strip-shaped chute 5113 in a sliding manner; an annular air supply chamber 227 is provided inside each of the fixed rings 22, and each annular air supply chamber 227 communicates with the plurality of sliding holes 224; two air supply channels 514 are formed in the inner mirror image of each abutting rod 51, the air supply channels 514 are communicated with the corresponding sliding holes 224, and the two air supply channels 514 are communicated with the corresponding rectangular grooves 5111 and are positioned at two ends of the strip-shaped sliding groove 5113 along the length direction; a connecting hole 24 is formed in the center of the rotating disc 2, a gas-liquid slip ring 25 is arranged in the connecting hole 24, a gas supply hole 228 communicated with an annular gas supply cavity 227 is formed in one side, close to the connecting strip 21, of the top of each fixed ring 22, and the output end of the gas-liquid slip ring 25 is communicated with the corresponding gas supply hole 228 through a connecting hose 251; the bottom of the workbench 1 is provided with a servo motor 11 for driving the rotating disc 2 to rotate.
When two seal drums 31 are close to each other, square conflict piece 511 moves towards being close to the wafer direction, can warp the wafer through the inclined plane 5112 that sets up, thereby make the wafer can remove in the rectangular groove 5111 and with the round trip plate 5114 contact, afterwards, the staff can be through gas-liquid sliding ring 25 to annular air feed chamber 227 in carry gas, gas enters into two air feed passageway 514 through slide hole 224 and blows the wafer both sides, thereby make the wafer can hang in the rectangular groove 5111 inside, along with the continuous impact of high pressure shower nozzle 331, thereby can make the wafer reciprocate along the length direction of bar spout 5113 vibrations, not only can improve the cleaning effect to the wafer, can also dry the wafer surface when not rinsing, thereby be convenient for carry out subsequent transportation.
Referring to fig. 1, 3, and 15, the discharge mechanism 6 includes a conveyor belt 61, a hydraulic lever 62, an interference ring 63, and a turn-over plate 64; the conveying belt 61 is arranged on the workbench 1 and is positioned at one side of the rotating disc 2 far away from the vertical sliding rail 35, two sides of the conveying belt 61 along the length direction are provided with placing plates 611, two hydraulic rods 62 are arranged on the corresponding placing plates 611 in a vertical state, and the abutting ring 63 is arranged above the two hydraulic rods 62 in a horizontal state and is connected with the executing part of the corresponding hydraulic rod 62; a plurality of second L-shaped guide rods 631 corresponding to the arc-shaped guide grooves 233 are provided at the top of the interference ring 63 in the axial direction; the outer wall mirror image of the turning disc 64 is provided with turning rods 641, the inner wall mirror image of the abutting ring 63 is provided with turning holes 632 corresponding to the turning rods 641, the turning rods 641 can be rotatably arranged in the corresponding turning holes 632, and one end of each turning rod 641 extending out of the abutting ring 63 is provided with a horizontal torsion spring 642; a horizontal plate 612 is arranged at the top of one end of the conveyor belt 61 close to the turning disc 64, and a pushing rod 613 for pushing the turning disc 64 to turn is arranged on the horizontal plate 612.
Along with the rotation of the rotating disc 2, when the cleaned rotating disc 2 moves to the upper side of the abutting ring 63 and is coaxially arranged with the abutting ring 63, the two hydraulic rods 62 are adjusted to enable the abutting ring 63 to move towards the direction close to the corresponding fixed ring 22, at this time, the plurality of second L-shaped guide rods 631 arranged on the abutting ring 63 are matched with the arc-shaped guide grooves 233 on the rotating column 232, so that the plurality of fan-shaped blocking plates 231 are mutually far away, the cleaned wafer falls onto the turnover disc 64, at this time, the turnover disc 64 is kept in a horizontal state under the torsion action of the horizontal torsion spring 642, then the hydraulic rods 62 drive the abutting ring 63 to move towards the direction close to the conveying belt 61, at this time, the push rod 613 arranged on the conveying belt 61 can be contacted with one end of the turnover disc 64 far away from the conveying direction of the conveying belt 61, and accordingly the turnover disc 64 can rotate along the axis of the rotating rod 641, the turnover disc 64 is obliquely arranged, and accordingly the cleaned wafer can fall onto the conveying belt 61, and subsequent work can be conveniently carried out by workers.
The foregoing examples merely illustrate one or more embodiments of the application, which are described in greater detail and are not to be construed as limiting the scope of the application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.
Claims (6)
1. The wafer horizontal cleaning device is characterized by comprising a workbench, a rotating disc, a cleaning mechanism, an adjusting component, a limiting mechanism and a discharging mechanism;
the rotating disc is arranged on the workbench in a horizontal state and can rotate, a plurality of connecting strips are arranged on the outer wall of the rotating disc along the circumferential direction, a fixed ring is arranged at one end, far away from the rotating disc, of each connecting strip, the fixed ring is arranged in a horizontal state, a plurality of hinge holes are formed in the top of the fixed ring along the axial direction, hinge rods can be rotatably arranged in each hinge hole, a fan-shaped plugging plate is arranged on each hinge rod, a plurality of avoidance grooves for avoiding the fan-shaped plugging plate are formed in the outer wall of the fixed ring along the axial direction, and a plane for placing wafers can be formed by the fan-shaped plugging plates;
the cleaning mechanism is arranged on the workbench and comprises two sealing barrels which can be mutually close to and far away from each other, the two sealing barrels are coaxially arranged in a vertical state, the opening ends of the two sealing barrels are oppositely arranged, an annular water storage cavity is formed in each sealing barrel, an annular chute communicated with the annular water storage cavity is formed in the inner wall of each sealing barrel, a rotating ring is rotatably arranged in each annular chute, a plurality of water supply holes are formed in the inner wall of the rotating ring along the axial direction, a water supply pipe is radially arranged in each water supply hole, a plurality of high-pressure spray heads are arranged in each water supply pipe along the axial direction, and a water supply port communicated with the annular water storage cavity is formed in the outer wall of each sealing barrel;
the adjusting component is arranged on the lower sealing cylinder and can synchronously rotate a plurality of hinging rods on the corresponding fixing rings along with the approach of the two sealing cylinders;
the limiting mechanisms are arranged in the corresponding fixing rings and comprise a contact resisting rod, a pushing cylinder, a moving ring, a first abutting spring and a second abutting spring; the plurality of abutting rods are radially arranged along the axis of the corresponding fixed ring, and one end, close to the axis of the corresponding fixed ring, of each abutting rod is provided with a square abutting block;
the upper end of the inner wall of each fixed ring is radially provided with a plurality of sliding holes along the axial direction, the inner wall mirror image of each sliding hole is provided with a plurality of first guide grooves, each pushing cylinder is provided with a plurality of first guide blocks corresponding to the first guide grooves, and the first guide blocks can be slidably arranged in the corresponding first guide grooves;
the inner wall mirror image of each pushing cylinder is provided with a second guide groove, the outer wall mirror image of one end of each abutting rod far away from the square abutting block is provided with a second guide block corresponding to the second guide groove, and the abutting rods can be slidably arranged in the corresponding pushing cylinders;
the top of the fixed ring is provided with a plurality of guide rods along the axis direction, the movable ring is coaxially arranged above the corresponding fixed ring in a horizontal state, the top of the movable ring is provided with guide holes corresponding to the guide rods along the axis direction, the guide rods can be slidably arranged in the corresponding guide holes, each guide rod is sleeved with a tightening spring, and the tightening springs are positioned between the corresponding movable ring and the fixed ring;
the plurality of first abutting springs are arranged in the sliding holes and positioned between the corresponding pushing cylinders and the inner walls of the bottoms of the corresponding sliding holes;
the plurality of second abutting springs are arranged in the pushing cylinder and positioned between the inner wall of the bottom of the corresponding pushing cylinder and the corresponding abutting rods;
a traction rope is arranged at the center of one end of each abutting rod far away from the square abutting block, a plurality of rope guiding holes communicated with corresponding sliding holes are formed in the top of the fixed ring along the axis direction, a first perforation for the traction rope to pass through is formed in the center of the bottom of each pushing cylinder, a plurality of connecting parts are arranged at the bottom of the movable ring along the axis direction, and the traction rope sequentially penetrates through the corresponding first perforation and the corresponding rope guiding holes to be connected with the corresponding connecting parts;
a rectangular groove for accommodating the wafer is formed in the center of one side of each square abutting block, which is far away from the corresponding abutting rod, and inclined surfaces for guiding the wafer are formed in the inner walls of the two sides of each rectangular groove;
the inner wall of the bottom of each rectangular groove is provided with a strip-shaped chute along the length direction, and a reciprocating plate is arranged in the strip-shaped chute in a sliding manner;
an annular air supply cavity is arranged in each fixed ring, and each annular air supply cavity is communicated with a plurality of sliding holes; two air supply channels are formed in the mirror image inside each abutting rod, are communicated with the corresponding sliding holes, are communicated with the corresponding rectangular grooves and are positioned at two ends of the strip-shaped sliding groove along the length direction;
the center of the rotating disc is provided with a connecting hole, a gas-liquid slip ring is arranged in the connecting hole, one side of the top of each fixed ring, which is close to the connecting strip, is provided with an air supply hole communicated with the annular air supply cavity, and the output end of the gas-liquid slip ring is communicated with the corresponding air supply hole through a connecting hose;
the bottom of the workbench is provided with a servo motor for driving the rotating disc to rotate;
the unloading mechanism is arranged on the workbench and is positioned on one side of the rotating disc away from the detection mechanism, and the unloading mechanism can take out the cleaned wafer from the inside of the fixed ring.
2. The wafer horizontal cleaning device according to claim 1, wherein a plurality of blades are arranged on the outer wall of each rotating ring along the axial direction, an annular partition plate is arranged in each annular water storage cavity, a plurality of inclined holes are formed in the annular partition plate along the axial direction, and a conical driving pipe is arranged in each inclined hole.
3. The wafer horizontal cleaning device according to claim 1, wherein a plurality of water supply pipes located in the same rotation ring are communicated with each other near one end of the axis of the corresponding rotation ring, and a central pipe extending vertically downward is provided at the center of the rotation ring and is communicated with the plurality of water supply pipes.
4. A wafer level cleaning apparatus as defined in claim 1, wherein the adjustment assembly comprises a mounting ring;
the bottom of each fixed ring is provided with a plurality of mounting holes communicated with corresponding hinge holes along the axis direction, the mounting holes and the corresponding hinge holes are coaxially arranged, one end of each hinge rod close to the mounting holes is provided with a rotating column, the outer wall of each rotating column is provided with an arc-shaped guide groove in a mirror image mode, the mounting rings are fixedly sleeved outside the corresponding sealing cylinders in a horizontal state, and the top of each mounting ring is provided with a plurality of first L-shaped guide rods corresponding to the arc-shaped guide grooves along the axis direction;
and a reset torsion spring is arranged at the position of each hinge rod in the corresponding mounting hole.
5. The wafer level cleaning apparatus of claim 1, wherein the cleaning mechanism further comprises a vertical slide rail and a drive motor;
the vertical slide rail is vertical state setting on the workstation, and the inside rotatable two-way lead screw that is provided with of vertical slide rail, driving motor set up at vertical slide rail top and be used for driving two-way lead screw and rotate, and the inside slidable of vertical slide rail is provided with two L shape fixed bars, and two L shape fixed bars are in the both ends threaded connection of two-way lead screw respectively, and the one end that vertical slide rail was kept away from to every L shape fixed bar is connected with corresponding seal barrel.
6. The wafer level cleaning apparatus of claim 4, wherein the unloading mechanism comprises a conveyor belt, a hydraulic lever, an interference ring, and a turntable;
the conveying belt is arranged on the workbench and is positioned on one side of the rotating disc, far away from the vertical sliding rail, two placement plates are arranged on two sides of the conveying belt along the length direction, two hydraulic rods are arranged on the corresponding placement plates in a vertical state, and the abutting ring is arranged above the two hydraulic rods in a horizontal state and is connected with the corresponding hydraulic rod executing part;
a plurality of second L-shaped guide rods corresponding to the arc-shaped guide grooves are arranged at the top of the abutting ring along the axial direction;
the rotating rods can be rotatably arranged in the corresponding rotating holes, and one end of each rotating rod extending out of the corresponding abutting ring is provided with a horizontal torsion spring;
a horizontal plate is arranged at the top of one end of the conveying belt, which is close to the turnplate, and a pushing rod for pushing the turnplate to turn is arranged on the horizontal plate.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311074362.0A CN116798921B (en) | 2023-08-24 | 2023-08-24 | Wafer horizontal cleaning device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311074362.0A CN116798921B (en) | 2023-08-24 | 2023-08-24 | Wafer horizontal cleaning device |
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| CN116798921B true CN116798921B (en) | 2023-11-21 |
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| KR20030032512A (en) * | 2001-10-18 | 2003-04-26 | 주식회사 라셈텍 | A Wafer Cleaning Device |
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| CN115647969A (en) * | 2022-10-21 | 2023-01-31 | 陈东 | Electronic component chip cutting and thinning device and method |
| CN116013809A (en) * | 2022-11-15 | 2023-04-25 | 江苏美科太阳能科技股份有限公司 | Rotary double-sided cleaning device and cleaning method for monocrystalline silicon piece |
| CN219541158U (en) * | 2023-03-29 | 2023-08-18 | 南阳市达升光学仪器有限公司 | Batch cleaning device |
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2023
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030032512A (en) * | 2001-10-18 | 2003-04-26 | 주식회사 라셈텍 | A Wafer Cleaning Device |
| JP2003203900A (en) * | 2002-10-17 | 2003-07-18 | Nec Electronics Corp | Wafer-processing device and wafer-processing method |
| CN113953240A (en) * | 2021-09-06 | 2022-01-21 | 无锡亚电智能装备有限公司 | Wafer edge brush cleaning mechanism |
| CN115647969A (en) * | 2022-10-21 | 2023-01-31 | 陈东 | Electronic component chip cutting and thinning device and method |
| CN115472553A (en) * | 2022-11-11 | 2022-12-13 | 智程半导体设备科技(昆山)有限公司 | High-stability clamping device for etching or cleaning semiconductor wafer |
| CN116013809A (en) * | 2022-11-15 | 2023-04-25 | 江苏美科太阳能科技股份有限公司 | Rotary double-sided cleaning device and cleaning method for monocrystalline silicon piece |
| CN219541158U (en) * | 2023-03-29 | 2023-08-18 | 南阳市达升光学仪器有限公司 | Batch cleaning device |
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| CN116798921A (en) | 2023-09-22 |
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Denomination of invention: A wafer horizontal cleaning device Granted publication date: 20231121 Pledgee: Agricultural Bank of China Limited Zaozhuang Yicheng sub branch Pledgor: SHANDONG HANTURE TECHNOLOGY CO.,LTD. Registration number: Y2024980000965 |
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