CN220804853U

CN220804853U - All-round no dead angle formula wafer box cleaning machine

Info

Publication number: CN220804853U
Application number: CN202322001325.9U
Authority: CN
Inventors: 刘春峰
Original assignee: Glory Electronic Materials Chongqing Co ltd
Current assignee: Glory Electronic Materials Chongqing Co ltd
Priority date: 2023-07-28
Filing date: 2023-07-28
Publication date: 2024-04-19
Anticipated expiration: 2033-07-28

Abstract

The utility model provides an omnibearing dead-angle-free wafer box cleaning machine, which relates to the technical field of cleaning machines and comprises a workbench, wherein a servo motor is fixedly arranged on the lower surface of a top plate, an adjusting assembly is arranged at the output end of the servo motor, two scraping plates are arranged on the servo motor through the adjusting assembly, a sliding plate is slidably arranged in a mounting box, first limiting plates are fixedly arranged on two sides of the mounting box, and a plurality of second brushes are arranged on the lower surface of the first limiting plate at equal intervals.

Description

All-round no dead angle formula wafer box cleaning machine

Technical Field

The utility model relates to the technical field of cleaning machines, in particular to an omnibearing dead-angle-free wafer box cleaning machine.

Background

The wafer box mainly plays a role in placing and conveying wafers in semiconductor production, dust falls on the wafer box after the wafer box is used for a long time, the wafer box needs to be cleaned regularly, such as a semiconductor wafer box automatic cleaning device disclosed in patent application number CN202123184231.7, the device comprises a machine body, a feed inlet and a discharge outlet are arranged on the machine body, a cleaning mechanism and a drying mechanism are sequentially arranged between the feed inlet and the discharge outlet, the cleaning mechanism comprises a groove washing area and a spraying area, the groove washing area is close to the feed inlet, and the spraying area comprises a cold water spraying area and a hot water spraying area; the drying mechanism is arranged at one end close to the hot water spraying area and at least comprises an infrared drying area, and an infrared generator is arranged at the top of the infrared drying area; the transmission mechanism is arranged on the frame and performs circulating transmission motion on the frame, and the transmission mechanism comprises a synchronous manipulator and a transmission line. This scheme combines together groove washing and spraying to utilize infrared ray and nitrogen gas segmentation to dry, ensure that the clean wafer box after the cleanness is clean dry, no particulate matter and moisture remain, but among the above-mentioned technical scheme, can not rinse the wafer box of different specifications, and the inside some dead angles of wafer box are difficult for wasing, influence clean efficiency.

Disclosure of utility model

The utility model mainly aims to provide an omnibearing dead-angle-free wafer box cleaning machine which can effectively solve the problems that wafer boxes with different specifications cannot be cleaned in the background technology, and some dead angles inside the wafer boxes are difficult to clean, so that the cleaning efficiency is affected.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows: the utility model provides an all-round no dead angle formula wafer box cleaning machine, includes the workstation, fixed surface installs the curb plate on the workstation, curb plate upper end fixed mounting has the roof, fixed surface installs servo motor under the roof, the servo motor output is provided with adjusting part, servo motor installs two scrapers through adjusting part, two the equal equidistance of one side that the scraper blade kept away from each other is provided with a plurality of first brushes, one of them fixed surface installs the mounting box in the scraper blade, the inside slidable mounting of mounting box has the slide, slide lower surface equidistance is provided with a plurality of third brushes, the equal fixed mounting in mounting box both sides has first limiting plate, first limiting plate lower surface equidistance is provided with a plurality of second brushes.

Preferably, the mounting frame is fixedly arranged on the lower surface of the workbench.

Preferably, the upper surface of the workbench is provided with a water storage tank, and the lower end surface of the water storage tank is provided with a water outlet.

Preferably, the inner walls of two sides of the installation box are provided with first sliding grooves, two sides of one end of the sliding plate are fixedly provided with first sliding blocks, and the first sliding blocks are slidably arranged in the first sliding grooves.

Preferably, the adjusting assembly comprises a second limiting plate, the output end of the servo motor is fixedly provided with the second limiting plate, and the two scraping plates are both slidably mounted on the lower surface of the second limiting plate.

Preferably, a bidirectional screw rod is mounted on the second limiting plate, a turntable is fixedly mounted at one end of the bidirectional screw rod, two screw rod threaded sleeves are sleeved in the middle of the bidirectional screw rod, and two scraping plates are connected with the two screw rod threaded sleeves.

Preferably, a second sliding groove is formed in the lower surface of the second limiting plate, a second sliding block is fixedly arranged at the upper end of the scraping plate, and the second sliding block is slidably arranged in the second sliding groove.

Compared with the prior art, the utility model has the following beneficial effects:

(1) The wafer box is sleeved between the two scrapers through staff, the mounting box and the sliding plate are attached to the inner surface of the wafer box, the two screw rod threaded sleeves in the middle of the two screw rod are enabled to move towards the surface far away from each other through the rotation of the two screw rods by the staff, the two scrapers can be driven to move towards the direction far away from each other, the surfaces of the two scrapers are attached to the inner wall of the wafer box, after the distance between the two scrapers is adjusted, the sliding plate can be driven to slide on the inner wall of the mounting box, the length of the sliding plate and the length of the mounting box are adjusted, the length of the sliding plate and the mounting box are enabled to be identical to the diameter of the wafer box, the wafer box is grabbed by the staff by hands at the moment, the second limiting plate is driven to rotate through the output end of the servo motor, meanwhile, the sliding plate and the mounting box are enabled to rotate on the inner surface of the wafer box, the first brush, the second brush and the third brush are enabled to clean the inner part of the wafer box in all aspects, and the wafer boxes with different diameters can not remain.

Drawings

FIG. 1 is a schematic view of a wafer cassette cleaner with no dead angle in all directions;

FIG. 2 is a schematic side view of an all-round dead-angle-free wafer cassette cleaning machine according to the present utility model;

FIG. 3 is a schematic view of a limiting plate structure of an omnibearing dead-angle-free wafer cassette cleaning machine according to the present utility model;

FIG. 4 is a schematic view of a scraper structure of an omnibearing dead-angle-free wafer cassette cleaning machine according to the present utility model;

FIG. 5 is a schematic view of the inner structure of the mounting box of the omnibearing dead-angle-free wafer box cleaning machine;

FIG. 6 is a schematic view of a slide plate structure of an all-round dead-angle-free wafer cassette cleaning machine according to the present utility model.

In the figure: 1. a work table; 2. a mounting frame; 3. a water outlet; 4. a water storage tank; 5. a mounting box; 6. a scraper; 7. an adjustment assembly; 701. a second limiting plate; 702. a turntable; 703. a two-way screw rod; 704. a screw rod threaded sleeve; 8. a servo motor; 9. a side plate; 10. a top plate; 11. a first brush; 12. a slide plate; 13. a first chute; 14. a second brush; 15. a first limiting plate; 16. a third brush; 17. a first slider; 18. a second chute; 19. and a second slider.

Detailed Description

The technical solutions of the embodiments of the present utility model will be clearly and completely described below in conjunction with the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1, 2, 4, 5 and 6, the omnibearing dead-angle-free wafer box cleaning machine comprises a workbench 1, a side plate 9 is fixedly arranged on the upper surface of the workbench 1, a top plate 10 is fixedly arranged on the upper end of the side plate 9, a servo motor 8 is fixedly arranged on the lower surface of the top plate 10, an output end of the servo motor 8 is provided with an adjusting component 7, two scraping plates 6 are arranged on the servo motor 8 through the adjusting component 7, a plurality of first hairbrushes 11 are uniformly and equidistantly arranged on one surface, far away from each other, of each scraping plate 6, a mounting box 5 is fixedly arranged on the inner surface of each scraping plate 6, a sliding plate 12 is slidably arranged in each mounting box 5, a plurality of third hairbrushes 16 are uniformly and fixedly arranged on the lower surface of each sliding plate 12, a first limiting plate 15 is fixedly arranged on two sides of each mounting box 5, and a plurality of second hairbrushes 14 are uniformly arranged on the lower surface of each first limiting plate 15.

As shown in fig. 1, the mounting frame 2 is fixedly mounted on the lower surface of the workbench 1, and the mounting frame 2 is fixedly mounted on the lower surface of the workbench 1, so that the workbench 1 can be supported.

As shown in fig. 1, the water storage tank 4 is provided on the upper surface of the workbench 1, the water outlet 3 is provided on the lower end surface of the water storage tank 4, the wafer box can be conveniently rinsed for the second time by providing the water storage tank 4 on the upper surface of the workbench 1, and the water source can be discharged by providing the water outlet 3.

As shown in fig. 5 and 6, the inner walls of two sides of the mounting box 5 are provided with first sliding grooves 13, two sides of one end of the sliding plate 12 are fixedly provided with first sliding blocks 17, the first sliding blocks 17 are slidably mounted in the first sliding grooves 13, and the first sliding blocks 17 are slidably mounted in the first sliding grooves 13, so that stability is better when the sliding plate 12 moves.

As shown in fig. 3 and 4, the adjusting component 7 includes a second limiting plate 701, a second limiting plate 701 is fixedly mounted at the output end of the servo motor 8, two scraping plates 6 are both slidably mounted on the lower surface of the second limiting plate 701, a bidirectional screw rod 703 is mounted on the second limiting plate 701, a turntable 702 is fixedly mounted at one end of the bidirectional screw rod 703, two screw rod threaded sleeves 704 are sleeved in the middle of the bidirectional screw rod 703, two scraping plates 6 are connected with the two screw rod threaded sleeves 704, a second sliding groove 18 is formed in the lower surface of the second limiting plate 701, a second sliding block 19 is fixedly mounted at the upper end of each scraping plate 6, the second sliding block 19 is slidably mounted in the second sliding groove 18, the wafer box is sleeved between the two scraping plates 6 by a worker, the mounting box 5 and the sliding plate 12 are attached to the inner surface of the wafer box, at this time, the bidirectional screw rod 703 is rotated by the worker, the two screw rod threaded sleeves in the middle of the bidirectional screw rod 703 are moved to the far side, at the moment, the two scraping plates 6 can be driven to move to the far side, the surfaces of the two scraping plates 6 are attached to the inner wall of the wafer box, after the distance between the two scraping plates 6 is adjusted, the sliding plate 12 can be driven to slide on the inner wall of the installation box 5, the lengths of the sliding plate 12 and the installation box 5 are adjusted, the lengths of the sliding plate 12 and the installation box 5 are the same as the diameters of the wafer box, at the moment, a worker grabs the wafer box by hand, at the moment, the output end of the servo motor 8 is used for driving the second limiting plate 701 to rotate, at the same time, the scraping plates 6 are driven to be attached to the inner wall of the wafer box to rotate, the sliding plate 12 and the installation box 5 are attached to the inner surface of the wafer box to rotate, the first brush 11, the second brush 14 and the third brush 16 are used for cleaning the inner part of the wafer box in an all-around manner, and can wash the wafer box of different diameters and still can not remain the dead angle.

The working principle of the omnibearing dead-angle-free wafer box cleaning machine is as follows:

During the use, firstly, the liquid detergent is poured into the wafer box to be cleaned, at this moment, establish the wafer box cover between two scraping plates 6 through the staff, laminate mounting box 5 and slide plate 12 at the wafer box internal surface, at this moment, through the staff rotation two-way lead screw 703, make two lead screw swivel joints at the middle part of two-way lead screw 703 remove to the one side that keeps away from each other, just can drive two scraping plates 6 and remove to the direction that keeps away from each other this moment, make the surface laminating of two scraping plates 6 on the wafer box inner wall, and after the distance between two scraping plates 6 of adjustment, just can drive slide plate 12 and slide on the mounting box 5 inner wall, adjust the length of slide plate 12 and mounting box 5, make the slide plate 12 and the diameter of mounting box 5 the same with the wafer box, at this moment, through the staff's hand grasp wafer box, drive second limiting plate 701 rotates through servo motor 8 output drive scraper plate 6 laminating on the wafer box inner wall simultaneously, make slide plate 12 and mounting box 5 rotate at the wafer box internal surface, make first brush 11, second brush 14, the third brush 16, the inside can not wash the whole wafer box in the aspect, and wash the inside can not wash the dead angle, the inside the wafer box is washed, the inside can be cleaned, and the inside the wafer box is cleaned, the inside the cleaning box is not washed, and the inside the cleaning box is washed.

The foregoing examples of the present invention are merely illustrative of the present invention and are not intended to limit the embodiments of the present invention, and other variations or modifications of different forms may be made by those skilled in the art based on the foregoing description, and it is not intended to be exhaustive of all embodiments, and all obvious variations or modifications that are claimed in the technical solutions of the present invention are within the scope of the present invention.

Claims

1. The utility model provides an all-round no dead angle formula wafer box cleaning machine, includes workstation (1), its characterized in that: the utility model discloses a workbench, including workstation (1), scraper blade (6), mounting box (5), slide (12) are installed to scraper blade (6) internal surface fixed mounting, slide (12) lower surface equidistance is provided with a plurality of third brushes (16), the equal fixed mounting in mounting box (5) both sides has first limiting plate (15), first limiting plate (15) lower surface equidistance is provided with a plurality of second brushes (14), scraper blade (6) upper surface fixed mounting has curb plate (9), curb plate (9) upper surface fixed mounting, curb plate (9) upper end fixed mounting has roof (10), roof (10) lower surface fixed mounting has servo motor (8), servo motor (8) output is provided with adjusting part (7), two scraper blade (6) are installed through adjusting part (7), two one side that scraper blade (6) kept away from each other equal equidistance is provided with a plurality of first brushes (11), one of scraper blade (6) internal surface fixed mounting has mounting box (5), slide (12) internal sliding mounting has.

2. The all-round no dead angle formula wafer box cleaning machine of claim 1, wherein: the lower surface of the workbench (1) is fixedly provided with a mounting frame (2).

3. The all-round no dead angle formula wafer box cleaning machine of claim 1, wherein: the upper surface of the workbench (1) is provided with a water storage tank (4), and the lower end surface of the water storage tank (4) is provided with a water outlet (3).

4. The all-round no dead angle formula wafer box cleaning machine of claim 1, wherein: the mounting box (5) is characterized in that first sliding grooves (13) are formed in the inner walls of the two sides of the mounting box, first sliding blocks (17) are fixedly arranged on the two sides of one end of the sliding plate (12), and the first sliding blocks (17) are slidably arranged in the first sliding grooves (13).

5. The all-round no dead angle formula wafer box cleaning machine of claim 4, wherein: the adjusting assembly (7) comprises a second limiting plate (701), the output end of the servo motor (8) is fixedly provided with the second limiting plate (701), and the two scraping plates (6) are both slidably arranged on the lower surface of the second limiting plate (701).

6. The all-round no dead angle formula wafer box cleaning machine of claim 5, wherein: two-way screw rods (703) are arranged on the second limiting plate (701), a turntable (702) is fixedly arranged at one end of each two-way screw rod (703), two screw rod threaded sleeves (704) are sleeved in the middle of each two-way screw rod (703), and two scraping plates (6) are connected with the two screw rod threaded sleeves (704).

7. The all-round no dead angle formula wafer box cleaning machine of claim 6, wherein: the lower surface of the second limiting plate (701) is provided with a second sliding groove (18), the upper end of the scraping plate (6) is fixedly provided with a second sliding block (19), and the second sliding block (19) is slidably arranged in the second sliding groove (18).