CN116796701A - Device test unit structure automation realization device and method - Google Patents
Device test unit structure automation realization device and method Download PDFInfo
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- CN116796701A CN116796701A CN202311083191.8A CN202311083191A CN116796701A CN 116796701 A CN116796701 A CN 116796701A CN 202311083191 A CN202311083191 A CN 202311083191A CN 116796701 A CN116796701 A CN 116796701A
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- 238000012360 testing method Methods 0.000 title claims abstract description 128
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000003466 welding Methods 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 17
- 239000000945 filler Substances 0.000 claims description 16
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 238000013461 design Methods 0.000 abstract description 9
- 230000006870 function Effects 0.000 description 9
- 230000008676 import Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 235000013599 spices Nutrition 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Abstract
The invention discloses a device test unit structure automation realization device and a device test unit structure automation realization method, wherein the device test unit structure automation realization device comprises an importing module, a processing module and a processing module, wherein the importing module is used for importing a reference file for assisting device test structure modeling; the adjusting module is used for adjusting parameters required by the layout of the test device; a selection module for selecting the type and function of the test device; the parameter adjustment module is used for adjusting parameters of the test device according to the output result of the selection module; and the file export module is used for exporting parameters of the test device. The invention realizes the automatic generation of the Model TestKey, effectively improves the efficiency of Model TestKey design, provides a way for exporting Model TestKey files, realizes the backup and sharing of data, and is convenient for subsequent analysis and arrangement.
Description
Technical Field
The invention belongs to the technical field of device modeling test structures of integrated circuits, and relates to a device test unit structure automation implementation device and method.
Background
Semiconductor device modeling (Spice Model) is a Model extraction of various electrical characteristics of a semiconductor device and is finally used for integrated circuit design, and designing a device modeling test structure (Model TestKey) and parallel flow (Wafer tape out) and testing are indispensable steps before device modeling. The traditional Model TestKey design and layout drawing are carried out manually, and because the Model TestKey comprises a large number of devices with different sizes, test structures of various physical effects and verification structures, the traditional design method consumes a large amount of manpower and time, is easy to cause errors, and directly influences the data accuracy of device characteristic measurement. Semi-automatic auxiliary EDA tools are already available in the prior art, but automatic auxiliary tools are not arranged for automatic generation of Model TestKey only for the Model TestKey layout drawing process.
Disclosure of Invention
The invention provides a device test unit structure automation realization device and method, which realize automatic generation and export of a Model TestKey and reduce labor and time cost.
The invention provides an automatic realizing device for a device testing unit structure, which comprises:
the importing module is used for importing a reference file for modeling an auxiliary device testing structure;
the adjusting module is used for adjusting parameters required by the layout of the test device;
a selection module for selecting the type and function of the test device;
the parameter adjustment module is used for adjusting parameters of the test device according to the output result of the selection module;
and the file export module is used for exporting parameters of the test device.
Further, the reference file includes a DRM file and a GDS file.
Further, the layout required parameters include:
the number of the welding pads and the spacing between the welding pads, the marks of the welding pads and the pins of the testing device, and the positions, the word sizes and the spacing between the marks.
Further, the selection module is used for selecting the type and the function of the tested device by selecting the label corresponding to the tested device.
Further, the parameter adjustment module includes:
the device parameter and filler adding unit is used for adjusting various parameters of the test device and the filler;
a device size setting unit, configured to generate different size point combinations of the test device;
the device metal wiring setting unit is used for adjusting parameters of the metal wire;
the device position setting unit is used for adjusting the position relation between the welding pad and the test device;
the device port connection form setting unit is used for adjusting the lead-out mode of the pins and the connection relation between the pins and the connection layer;
and the device port and welding pad connection relation setting unit is used for adjusting the connection relation between each port of the test device and each welding pad.
Further, the parameters of the test device and the filler include the size range and connection location of the test device and the filler.
Further, the parameters of the metal wire include the width of the metal wire and the positional relationship between the metal wire and the bonding pad.
Further, according to the distance between the test device and the welding pad, the position relation between the welding pad and the test device is automatically adjusted.
Further, the parameter adjustment module further comprises a query window;
and the query window sorts and displays identifiers, parameters and connection relations of all test structures corresponding to all the test devices.
Further, the file export module supports exporting files including Model TestKey GDS, model TestKey CDL, and Model TestKey Manual, CDL and EXCEL format conversion.
The invention also provides a device test unit structure automation implementation method, which adopts the device test unit structure automation implementation device, and the method comprises the following steps:
importing a reference file for assisting device test structure modeling;
importing and adjusting parameters required by the layout of the test device;
selecting the type and function of the test device;
adjusting parameters of the selected test device as needed;
and deriving parameters of the test device.
Further, after the type of the test device is selected in the selection module, a parameter adjustment module automatically generates default parameters of the test device, and the default parameters are adjusted in the parameter adjustment module.
Compared with the prior art, the invention has at least the following technical effects:
according to the invention, modeling of the device testing structure is realized by arranging the import module, the adjustment module and the selection module, modification of corresponding parameters of the testing device is completed by the parameter adjustment module, and finally, related parameters of the testing device are exported by the file export module, so that automatic generation of the Model TestKey is realized, efficiency of Model TestKey design is effectively improved, a way of exporting the Model TestKey file is provided, backup and sharing of data are realized, and subsequent analysis and arrangement are also facilitated.
Drawings
FIG. 1 is a schematic diagram illustrating the positional relationship between a bonding pad and a lead in a first embodiment;
FIG. 2 is a block diagram illustrating a parameter adjustment module according to a first embodiment;
fig. 3 is a flowchart of a method for automating the structure of a device test unit in the second embodiment.
Detailed Description
The following description of an apparatus and method for automating the structure of a device test unit in accordance with the present invention, in conjunction with the schematic drawings, illustrates preferred embodiments of the present invention, it being understood that one skilled in the art may modify the invention as described herein while still achieving the advantageous effects of the invention. Accordingly, the following description is to be construed as broadly known to those skilled in the art and not as limiting the invention.
The invention is more particularly described by way of example in the following paragraphs with reference to the drawings. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the drawings are in a very simplified form and are all to a non-precise scale, merely for convenience and clarity in aiding in the description of embodiments of the invention.
Example 1
The embodiment provides an automation implementation device for testing unit structures of various devices, which comprises:
and the importing module is used for importing a reference file for modeling the auxiliary device test structure.
And the adjusting module is used for adjusting parameters required by the layout of the test device.
And the selection module is used for selecting the type and the function of the test device.
And the parameter adjustment module is used for adjusting the parameters of the test device according to the output result of the selection module.
And the file export module is used for exporting parameters of the test device.
Specifically, the reference file includes a DRM file and a GDS file. Different reference files can be imported according to specific conditions to assist modeling of the device test structure, so that modeling accords with manufacturing process specifications, and modeling accuracy is improved.
Further, the layout required parameters include: the number of PADs (PADs) and the Pitch between PADs (PAD Space), the label of PADs and the label of pins of the test device, and the position of the label, the size of the word and the Pitch between labels (PAD Pitch).
In a specific example, please refer to fig. 1, the number of the bonding PADs is set to 20, the length (PAD Height) of the bonding PADs and the Width (PAD Width) of the bonding PADs may be also set, and the marking numbers 01, 02, …,20 are set in turn at the lower right corner of the bonding PADs, the identifier of the device is DC001, and then the Pin Label marked inside the device Pin is dc001_1, …, and dc001_20, where the position, size, and spacing parameters of the marking may be all adjusted according to the set values.
Further, a label corresponding to the type and function of the device required for testing is selected to select the type and function of the tested device. For example: the functional label may be selected to distinguish between different devices, including: logic gates, memory, and amplifiers, and may also select specifications and performance labels to distinguish between different devices. And when the types and functions of the test devices are selected, the parameter setting module automatically configures default parameters for the test devices.
In this embodiment, please refer to fig. 2, the parameter adjustment module includes:
and the device parameter and filler adding unit is used for adjusting various parameters of the test device and the filler.
And the device size setting unit is used for generating different size point combinations of the test device.
And the device metal wiring setting unit is used for adjusting parameters of the metal wires.
And the device position placing and setting unit is used for adjusting the position relation between the welding pad and the test device.
The device port connection form setting unit is used for adjusting the lead-out mode of the pins and the relation between the pins and the connection layer.
And the device port and welding pad connection relation setting unit is used for adjusting the connection relation between each port of the test device and each welding pad.
More units can be arranged according to specific needs.
In a specific example, the size range and connection location of the test device and the filler may be set within the device parameter and filler addition unit (Device Parameters and Dummy).
In a specific example, if the test device is a MOS transistor, parameters that may be set in the device parameter and the filler adding unit include: the length and width of the device are tested, the connection position and connection row number of the grid electrode of the device are tested, the connection row number of the source electrode and the drain electrode of the device are tested, and the connection position of the substrate is tested. Parameters including the width of the filler, the gap of the filler, the number of the filler, and the like can also be set.
In a Device Dimension setting module (Device Dimension), a plurality of preset dimensions of each Device can be input, a coordinate system with the length and the width of the preset dimensions as coordinate axes is established, and a required intersection point is selected on the coordinate system to finish the selection of the preset dimensions of the devices.
In a device Metal wiring setting unit (Metal Routing), taking an MOS transistor as an example, the width of a Metal wire corresponding to each pin of the MOS transistor and the distance between the Metal wire corresponding to each pin and a pad corresponding to each pin may be set.
In a Device position setting unit (Device position), the pitch between the bonding pads and the pitch between the test Device and the bonding pads can be adjusted, and when the pitch between the bonding pads is smaller than the pitch between the Device and the bonding pads, the Device is placed above the space between the two bonding pads and connected with the bonding pads.
In the device port connection configuration setting unit (Terminal Connect Attributes), for example, a MOS transistor may be used to set connection layers of each pin, and different metal layers may be selectively connected, and connection modes of pins, for example, hierarchy extraction, may be used.
In the device port and bonding pad connection relation setting unit (Device connect to PAD), taking an MOS transistor as an example, the MOS device port is divided into three types, namely a gate, a source and a drain, and the same bonding pad can be connected with the same port of different MOS transistors, or all ports of the device are connected with different bonding pads.
It is understood that the test device capable of being introduced in the invention includes, but is not limited to, a MOS transistor, and may be other various test devices. The parameter adjustment module pops up different parameter selection windows in different units according to the types of the test devices.
After the parameters are adjusted, the device test unit structure automation realizing device generates a Model TestKey according to the parameters and redraws Model TestKey layout.
In a specific example, the parameter adjustment module further includes a query window, so that the user can conveniently check the related parameters of the test device as a whole. The query window sorts and displays connection relations including identifiers, parameters and pins corresponding to all the test devices, for example, taking a MOS transistor as an example, and contents that can be queried in the query window include: the identifier, length and width of the MOS tube, the connection relation between the grid electrode and the welding pad, the connection relation between the source electrode and the welding pad, the connection relation between the drain electrode and the welding pad and the connection relation between the substrate and the welding pad. Different parameters are set for reference of a user according to actual conditions.
Finally, relevant parameters of the test device are exported by the file export module, supporting export of Model TestKey GDS, model TestKey CDL, model TestKey Manual files, CDL and EXCEL format conversion.
According to the embodiment, modeling of the device testing structure is achieved through the setting of the import module, the adjustment module and the selection module, modification of corresponding parameters of the testing device is achieved through the parameter adjustment module, relevant parameters of the testing device are finally exported through the file export module, automatic generation of the Model TestKey and automatic drawing of Model TestKey layout are achieved, efficiency of Model TestKey design is effectively improved, a Model TestKey file export way is provided, backup and sharing of data are achieved, and follow-up analysis and arrangement are facilitated.
Example two
The embodiment provides a device test unit structure automation implementation method, which adopts the device test unit structure automation implementation device in the first embodiment, please refer to fig. 3, the method includes the following steps:
s1, importing a reference file for assisting device test structure modeling;
s2, importing and adjusting parameters required by the layout of the test device;
s3, selecting the type and the function of the test device;
s4, adjusting the parameters of the selected test device according to the requirement;
s5, the parameters of the test device are derived.
Specifically, after reference files including DRM and GDS files for assisting device test structure modeling and the like are imported into the import module, relevant parameters of the welding pad are obtained. According to practical conditions, the number of the welding pads and the spacing between the welding pads, the marks of the welding pads and the marks of the pins of the test device, and the relative parameters such as the positions of the marks, the size of the word size and the spacing between the marks are adjusted in the adjusting module. And selecting the type of the required test device and the function of the device according to the label in the selection module. After the selection is completed, the needed test device is selected, the relevant parameters of the test device are generated in each unit in the parameter adjustment module, the parameters are changed in each unit according to the need, and the default parameters configured by the parameter adjustment module can also be selected. After confirming the relevant parameters of the test device, the relevant parameters of the test device can be derived through the file deriving module.
According to the embodiment, through the device testing unit structure automation realizing device, automatic generation of the Model TestKey and automatic drawing of Model TestKey layout are realized, time and labor cost when a user designs the Model TestKey are reduced, design errors are reduced, and research and development efficiency is improved. After the Model TestKey design is completed, a Model TestKey file can be exported, so that data backup and sharing are realized, and subsequent analysis and arrangement are also facilitated.
Claims (12)
1. An apparatus for automating the structure of a device test unit, comprising:
the importing module is used for importing a reference file for modeling an auxiliary device testing structure;
the adjusting module is used for adjusting parameters required by the layout of the test device;
a selection module for selecting the type and function of the test device;
the parameter adjustment module is used for adjusting parameters of the test device according to the output result of the selection module;
and the file export module is used for exporting parameters of the test device.
2. The device test unit architecture automation implementation of claim 1, wherein the reference file comprises a DRM file and a GDS file.
3. The device test cell structure automation implementation of claim 1, wherein the layout required parameters include:
the number of the welding pads and the spacing between the welding pads, the marks of the welding pads and the pins of the testing device, and the positions, the word sizes and the spacing between the marks.
4. The device test unit architecture automation implementation of claim 1, wherein the selection module is configured to select a type and a function of the device under test by selecting a label corresponding to the device under test.
5. The device test unit architecture automation implementation of claim 1, wherein the parameter adjustment module comprises:
the device parameter and filler adding unit is used for adjusting various parameters of the test device and the filler;
a device size setting unit, configured to generate different size point combinations of the test device;
the device metal wiring setting unit is used for adjusting parameters of the metal wire;
the device position setting unit is used for adjusting the position relation between the welding pad and the test device;
the device port connection form setting unit is used for adjusting the lead-out mode of the pins and the connection relation between the pins and the connection layer;
and the device port and welding pad connection relation setting unit is used for adjusting the connection relation between each port of the test device and each welding pad.
6. The device test unit architecture automation implementation of claim 5,
the parameters of the test device and the filler include the size range and connection location of the test device and the filler.
7. The device test unit architecture automation implementation of claim 5,
the parameters of the metal wire comprise the width of the metal wire and the position relation between the metal wire and the welding pad.
8. The device test unit architecture automation implementation of claim 5,
and automatically adjusting the position relation between the welding pad and the test device according to the distance between the test device and the welding pad.
9. The device test unit architecture automation implementation of claim 1, wherein the parameter adjustment module further comprises a query window;
and the query window sorts and displays identifiers, parameters and connection relations of all test structures corresponding to all the test devices.
10. The device test unit architecture automation implementation of claim 1, wherein the file export module supports export of files including Model TestKey GDS, model TestKey CDL and Model TestKey Manual and CDL and EXCEL format conversion.
11. A device test unit structure automation implementation method, using the device test unit structure automation implementation apparatus of any one of claims 1-10, characterized in that the method comprises the steps of:
importing a reference file for assisting device test structure modeling;
importing and adjusting parameters required by the layout of the test device;
selecting the type and function of the test device;
adjusting parameters of the selected test device as needed;
and deriving parameters of the test device.
12. The method for automated device test unit architecture of claim 11,
after the type of the test device is selected in the selection module, a parameter adjustment module automatically generates default parameters of the test device, and the default parameters are adjusted in the parameter adjustment module.
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