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Enabling chip, package and PCB system co design and analysis in a heterogeneous integration environment-An EDA approach

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A holistic system design approach is presented in this work which helps co-design and analyse a multi technology array of ICs, packages and PCBs. The proposed methodology provides the key functionality to simulate and thus co design an IC in context of its PCB and …

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machine-classified

G06F17/5081 Layout analysis, e.g. layout verification, design rule check
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Bhattacharya et al., 2019

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Author
Bhattacharya R
Lohani J
Gupta A
Aggarwal V
Singh H
Kukal T
Moll C
Baldwin D
Park J

Publication year
2019
Publication venue
2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON)