CN116789361A - Alkali-containing glass, preparation method thereof, glass-containing product, electronic product and application - Google Patents

Alkali-containing glass, preparation method thereof, glass-containing product, electronic product and application Download PDF

Info

Publication number
CN116789361A
CN116789361A CN202310775270.9A CN202310775270A CN116789361A CN 116789361 A CN116789361 A CN 116789361A CN 202310775270 A CN202310775270 A CN 202310775270A CN 116789361 A CN116789361 A CN 116789361A
Authority
CN
China
Prior art keywords
alkali
percent
glass
containing glass
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310775270.9A
Other languages
Chinese (zh)
Inventor
何浩波
王明忠
卢攀峰
钟波
李书志
梁新辉
陈亚洲
汤重
吴湘平
汪钰博
廖其兵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xianning CSG Photoelectric Glass Co Ltd
Original Assignee
Xianning CSG Photoelectric Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xianning CSG Photoelectric Glass Co Ltd filed Critical Xianning CSG Photoelectric Glass Co Ltd
Priority to CN202310775270.9A priority Critical patent/CN116789361A/en
Publication of CN116789361A publication Critical patent/CN116789361A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/097—Glass compositions containing silica with 40% to 90% silica, by weight containing phosphorus, niobium or tantalum
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/095—Glass compositions containing silica with 40% to 90% silica, by weight containing rare earths
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/041—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/22—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
    • G01N27/221—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance by investigating the dielectric properties

Abstract

The application relates to alkali-containing glass, which comprises 60-80% of SiO by mass percent 2 1 to 8 percent of Al 2 O 3 3 to 15 percent of B 2 O 3 0 to 3 percent of P 2 O 5 4 to 20 percent of alkali metal oxide, 0 to 5 percent of alkaline earth metal oxide, 0 to 8 percent of ZnO and 1 to 8 percent of TiO 2 ZrO 0-5% 2 And 0-5% rare earth oxide; calculated by the mass percent of the components, (3 Al 2 O 3 +4B 2 O 3 )/(10Li 2 O+5Na 2 O+3K 2 O+2P 2 O 5 ) The value range of (2) is 0.3-1.31;Na 2 mass percent of O relative to K 2 The value range of the mass percent of O is 0.5-1.3. The alkali-containing glass has lower dielectric constant, dielectric loss and thermal expansion coefficient and higher volume resistivity.

Description

Alkali-containing glass, preparation method thereof, glass-containing product, electronic product and application
Technical Field
The application relates to the technical field of gas sensors, in particular to alkali-containing glass, a preparation method thereof, a glass-containing product, an electronic product and application.
Background
With the rapid development of electronic technology, the miniaturization of electronic components and the continuous improvement of high-frequency technology of working frequency have increasingly higher performance requirements on stability, interconnection delay, power consumption and the like. The glass material is one of key preparation materials of electronic components, and needs to have the characteristics of low dielectric constant, low dielectric loss, low thermal expansion coefficient and the like, but the glass material in the traditional technology is difficult to achieve the point, and the requirements of related industries are difficult to meet.
Disclosure of Invention
Based on this, the object of the present application comprises providing an alkali-containing glass and a method for its preparation, a glass-containing article, an electronic product and an application.
The application provides alkali-containing glass, which comprises the following components in percentage by mass: 60% -80% of SiO 2 1 to 8 percent of Al 2 O 3 3 to 15 percent of B 2 O 3 0 to 3 percent of P 2 O 5 4 to 20 percent of alkali metal oxide and 0 to 5 percent of catalystAlkaline earth metal oxide, 0-8% ZnO and 1-8% TiO 2 ZrO 0-5% 2 And 0% -5% rare earth oxide;
wherein the alkali metal oxide is selected from Li 2 O、Na 2 O and K 2 One or more of O;
the alkaline earth metal oxide is selected from one or more of MgO, caO, srO, baO;
the rare earth oxide is selected from La 2 O 3 、Lu 2 O 3 、Er 2 O 3 、CeO 2 、Nd 2 O 3 、Eu 2 O 3 、Dy 2 O 3 、Y 2 O 3 And Sm 2 O 3 One or more of the following;
calculated by the mass percent of the components, (3 Al 2 O 3 +4B 2 O 3 )/(10Li 2 O+5Na 2 O+3K 2 O+2P 2 O 5 ) The value range of (2) is 0.3-1.31;
Na 2 mass percent of O relative to K 2 The value range of the mass percent of O is 0.5-1.3.
In some embodiments, the alkali-containing glass comprises the following components in percentage by mass: 60.3 to 80 percent of SiO 2 1 to 8 percent of Al 2 O 3 3 to 15 percent of B 2 O 3 0 to 2 percent of P 2 O 5 4 to 16.5 percent of alkali metal oxide, 0 to 5 percent of alkaline earth metal oxide, 0 to 8 percent of ZnO and 1 to 8 percent of TiO 2 ZrO 0-5% 2 And 0% -5% rare earth oxide.
In some embodiments, the alkali-containing glass satisfies one or more of the following conditions (1) - (3):
(1) The alkali metal oxide comprises the following components in percentage by mass: 0% -2% of Li 2 O, na 2-9% 2 O, 2-9% of K 2 O；
(2) The alkaline earth metal oxide comprises the following components in percentage by mass of alkali-containing glass: 0 to 4.9 percent of MgO, 0 to 2 percent of CaO, 0 to 1.2 percent of SrO and 0 to 2.1 percent of BaO;
(3) The rare earth metal oxide comprises the following components in percentage by mass of alkali-containing glass: 0 to 2.6 percent of La 2 O 3 0 to 1.3 percent of Lu 2 O 3 0% -2.5% of Er 2 O 3 CeO 0% -1% 2 0 to 0.8 percent of Nd 2 O 3 0 to 0.6 percent of Eu 2 O 3 Dy 0-1.9% 2 O 3 0 to 0.6 percent of Y 2 O 3 And 0% to 1% Sm 2 O 3 。
In some embodiments, the alkali-containing glass satisfies one or more of the following conditions (1) - (4):
(1) 1.4B by mass percent of the components 2 O 3 /(0.9SiO 2 +Al 2 O 3 +0.7P 2 O 5 ) The value range of (2) is 0.05-0.35;
(2) Calculated as the mass percent of the components, (5 Li) 2 O+2Na 2 O+K 2 O)/(9MgO+4CaO+2SrO+BaO+8ZnO+9TiO 2 +5ZrO 2 ) The range of the value of (2) is 0.15-0.5.
In some embodiments, the alkali-containing glass satisfies one or more of the following conditions (1) - (4):
(1) The alkali-containing glass has a coefficient of thermal expansion CTE (50-350 ℃) of less than 9 x 10 -6 /K；
(2) The dielectric constant epsilon of the alkali-containing glass at 25 ℃ and 1MHz r Less than 8;
(3) The dielectric loss tan delta of the alkali-containing glass at 1MHz is less than 8 multiplied by 10 -3 ，
(4) The volume resistivity of the alkali-containing glass at 250 ℃ is more than 1 multiplied by 10 8 Ω·cm。
In a second aspect of the present application, there is provided a method for producing alkali-containing glass, comprising the steps of:
mixing the components of the alkali-containing glass of the first aspect to obtain a batch;
processing the batch into glass liquid;
and processing the glass liquid into alkali-containing glass.
In some embodiments, the preparation method satisfies one or both of the following conditions (1) to (2):
(1) The step of processing the batch into the molten glass comprises heating treatment, wherein the temperature of the heating treatment is 1560-1650 ℃;
(2) The step of processing the glass liquid into the alkali-containing glass comprises annealing treatment, wherein the annealing temperature is 570-650 ℃.
In a third aspect of the application, there is provided a glass-containing article comprising a glass structure comprising an alkali-containing glass according to the first aspect or an alkali-containing glass prepared by a method of preparation according to the second aspect.
In a fourth aspect of the application, there is provided an electronic product comprising the glass-containing article of the third aspect.
According to a fifth aspect of the application, there is provided an application of the alkali-containing glass according to the first aspect or the alkali-containing glass prepared by the preparation method according to the second aspect in manufacturing of electronic products.
The alkali-containing glass provided by the application can obtain lower dielectric constant, dielectric loss, thermal expansion coefficient and higher volume resistivity; the alkali-containing glass has lower boron content and higher alkali content, and is beneficial to reducing the manufacturing and processing difficulties.
The preparation method of the alkali-containing glass provided by the application has the advantages of simple integral process and low energy consumption.
The glass-containing article provided by the application can achieve lower dielectric constant, dielectric loss and thermal expansion coefficient and has higher volume resistivity.
The electronic product provided by the application adopts the alkali-containing glass which has better dielectric property, and the electronic product can obtain better performance.
The alkali-containing glass provided by the application is applied to the manufacturing process of electronic products, so that the purchasing cost is low, the packaging process is simple, and better performance can be obtained.
Detailed Description
In order that the application may be understood more fully, a more particular description of the application will be rendered by reference to preferred embodiments thereof. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
Terminology
Unless otherwise indicated or contradicted, terms or phrases used herein have the following meanings:
the term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
In the present application, the terms "plurality", and the like relate to, but are not particularly limited to, 2 or more in number. For example, "one or more" means one kind or two or more kinds.
In the present invention, "further," "particularly," etc. are used for descriptive purposes and are not to be construed as limiting the scope of the invention.
In the invention, the technical characteristics described in an open mode comprise a closed technical scheme composed of the listed characteristics and also comprise an open technical scheme comprising the listed characteristics.
In the present invention, a numerical range (i.e., a numerical range) is referred to, and, unless otherwise indicated, a distribution of optional values within the numerical range is considered to be continuous and includes two numerical endpoints (i.e., a minimum value and a maximum value) of the numerical range, and each numerical value between the two numerical endpoints. When a numerical range merely points to integers within the numerical range, unless expressly stated otherwise, both endpoints of the numerical range are inclusive of the integer between the two endpoints, and each integer between the two endpoints is equivalent to the integer directly recited. When multiple numerical ranges are provided to describe a feature or characteristic, the numerical ranges may be combined. In other words, unless otherwise indicated, the numerical ranges disclosed herein are to be understood as including any and all subranges subsumed therein. The "numerical value" in the numerical interval may be any quantitative value, such as a number, a percentage, a proportion, or the like. "numerical intervals" allows for the broad inclusion of numerical interval types such as percentage intervals, proportion intervals, ratio intervals, and the like.
In the present invention, the term "room temperature" generally means 4℃to 35℃and preferably 20.+ -. 5 ℃. In some embodiments of the invention, room temperature refers to 20 ℃ to 30 ℃.
In the present invention, the temperature parameter is allowed to be constant temperature processing, and also allowed to vary within a certain temperature range, unless otherwise specified. It should be appreciated that the constant temperature process described allows the temperature to fluctuate within the accuracy of the instrument control. Allows for fluctuations within a range such as + -5 ℃, + -4 ℃, + -3 ℃, + -2 ℃, + -1 ℃.
In the present invention, referring to a unit of a data range, if a unit is only carried behind a right end point, the units indicating the left and right end points are the same. For example, 2 to 25h means that the units of the left end point "2" and the right end point "25" are both h (hours).
Along with the evolution of the electronic packaging technology, the packaging technology is changed from a plane to a three-dimensional technology, so that the electronic packaging technology can be changed from an initial single integrated module to a multifunctional integrated module and a circuit module, and the electronic packaging technology has more and more functions. The adapter plate (interser) is a carrier for high-density interconnection and integrated passive elements in the three-dimensional integrated microsystem, is a core material for realizing three-dimensional integration, and has the importance equivalent to a molar age silicon substrate. Therefore, dielectric properties are of great significance for signal propagation, characteristic impedance properties (keeping the signal intact, generating no noise) and efficiency of signal propagation of the circuit board.
Glass materials are one of the key materials in the industry of electronic and electric appliances, and play an important role in improving the performance of electronic components (for example, improving stability, reducing interconnection delay and power loss, etc.). The glass material having the characteristics of low dielectric constant, dielectric loss, thermal expansion coefficient and the like can further improve the above-mentioned performance of the electronic component.
The main method for reducing the dielectric constant and dielectric loss of the glass material in the conventional technology is to increase the boron content or reduce the alkali content in the glass material. However, the refractory loss in the melting furnace is higher in the process of melting the glass raw material containing higher boron, so the glass material containing higher boron has more severe requirements on the melting furnace; meanwhile, the alkali content in the glass raw material is low, so that the problems of high processing difficulty of the raw material, complex subsequent glass forming process and the like are caused.
The alkali-containing glass with lower boron content provided by the application can obtain lower dielectric constant, dielectric loss and thermal expansion coefficient, has higher volume resistivity, has better potential in the application aspect of electronic components, and can better solve the problems of warping and high-frequency loss when being applied to chip packaging.
According to a first aspect of the application, there is provided alkali-containing glass, which comprises the following components in percentage by mass: 60% -80% of SiO 2 1 to 8 percent of Al 2 O 3 3 to 15 percent of B 2 O 3 0 to 3 percent of P 2 O 5 4 to 20 percent of alkali metal oxide, 0 to 5 percent of alkaline earth metal oxide, 0 to 8 percent of ZnO and 1 to 8 percent of TiO 2 ZrO 0-5% 2 And 0% -5% rare earth oxide;
wherein the alkali metal oxide is selected from Li 2 O、Na 2 O and K 2 One or more of O;
the alkaline earth metal oxide is selected from one or more of MgO, caO, srO, baO;
the rare earth oxide is selected from La 2 O 3 、Lu 2 O 3 、Er 2 O 3 、CeO 2 、Nd 2 O 3 、Eu 2 O 3 、Dy 2 O 3 、Y 2 O 3 And Sm 2 O 3 One or more of the following;
calculated by the mass percent of the components, (3 Al 2 O 3 +4B 2 O 3 )/(10Li 2 O+5Na 2 O+3K 2 O+2P 2 O 5 ) The value range of (2) is 0.3-1.31;
Na 2 mass percent of O relative to K 2 The value range of the mass percent of O is 0.5-1.3.
The alkali-containing glass provided by the application can obtain lower dielectric constant, dielectric loss, thermal expansion coefficient and higher volume resistivity; the alkali-containing glass has lower boron content and higher alkali content, and is beneficial to reducing the manufacturing and processing difficulties.
In some embodiments, the alkali-containing glass comprises 60 to 80 percent of SiO by mass percent 2 Further, the content may be 60.3 to 80%, and may be selected from any one or any two of the following ranges by mass percent: 60%, 60.3%, 60.4%, 60.5%, 61%, 61.3%, 61.5%, 62%, 62.3%, 62.5%, 62.7%, 62.9%, 63%, 63.5%, 63.9%, 64%, 64.2%, 64.5%, 65%, 65.5%, 65.7%, 66%, 66.1%, 66.5%, 67%, 67.3%, 67.5%, 67.7%, 68%, 68.5%, 69%, 69.5%, 70%, 70.5%, 71%, 71.1%, 71.5%, 72%, 72.1%, 72.5%, 73%, 73.2%, 73.5%, 74%, 74.5%, 74.6%, 75%, 75.5%, 75.9%, 76%, 76.5%, 77%, 77.5%, 78%, 78.5%, 79%, 79.5%, 80%, etc. SiO (SiO) 2 Is the necessary composition of glass, more suitable SiO 2 The content is more favorable for improving the mechanical strength, chemical stability, thermal stability and the like of the glass, is also favorable for further improving the dielectric property of the proportion, for example, lower dielectric constant, dielectric loss and thermal expansion coefficient are obtained, and the volume resistivity is improved. If SiO is 2 Is too high, possiblyThe mechanical strength, chemical stability and thermal stability of the glass are reduced; if SiO is 2 Too low a mass percentage may result in an increase in the melting temperature of the glass, and the glass manufacturing process may consume more energy, such as greater difficulty in melting and fining.
In some embodiments, the alkali-containing glass comprises 1 to 8 percent of Al by mass percent 2 O 3 The composition may also be selected from any one of the following or any two of the following ranges: 1%, 1.3%, 1.5%, 1.7%, 2%, 2.1%, 2.2%, 2.4%, 2.5%, 2.6%, 2.8%, 3%, 3.1%, 3.3%, 3.5%, 4%, 4.5%, 4.6%, 5%, 5.5%, 6%, 6.5%, 7%, 7.5%, 7.6%, 8% and the like. The inventors of the present application found that the adjusted composition may be advantageous for improving the dielectric properties and volume resistivity of the glass, possibly due to Al 2 O 3 As a component of the network structure in the glass, the glass network can be repaired; at the same time make Al more suitable 2 O 3 The content is more favorable for improving the weather resistance of the glass, for example, further reducing the crystallization tendency of the glass, improving the chemical stability, the thermal stability, the mechanical strength, the hardness and the like of the glass. If Al is 2 O 3 Is too high due to the spatial ratio of the network structure SiO 2 The alkali metal ions in the glass are more likely to move between networks under the action of an electric field, so that loss is more likely to be caused, and the dielectric property and the volume resistivity property of the glass are deteriorated. .
In some embodiments, the alkali-containing glass comprises 3 to 15 percent of B by mass percent 2 O 3 The composition may also be selected from any one of the following or any two of the following ranges: 3%, 3.5%, 4%, 4.2%, 4.5%, 4.7%, 5%, 5.2%, 5.5%, 5.7%, 6%, 6.4%, 6.5%, 6.8%, 7%, 7.2%, 7.3%, 7.5%, 7.6%, 8%, 8.5%, 8.9%, 9%, 9.5%, 10%, 10.5%, 11%, 11.5%, 12%, 12.5%, 12.6%, 13%, 13.5%, 14%, 14.5%, 15%, and the like. B (B) 2 O 3 Belongs to glassThe inventors of the present application found that when B 2 O 3 Can form a network with alkali metals and/or alkaline earth metals, the [ BO ] 4 ]Tetrahedral volume is less than [ SiO ] 4 ]Tetrahedron to obtain glass with compact network structure; especially when B 2 O 3 And the content and proportion of alkali metal and/or alkaline earth metal are appropriate (e.g., B 2 O 3 3-15% by mass) can reduce the dielectric constant and dielectric loss of the glass, obviously increase the volume resistivity, reduce the thermal expansion coefficient and simultaneously be beneficial to improving the strength of the glass. Meanwhile, the boron content (3-10wt%) is low, the requirement on the furnace refractory for manufacturing the glass is low, the corrosion to the refractory is small, and the service life of the furnace is prolonged. If B 2 O 3 Too high a mass percentage of [ BO ] in the glass may be caused 4 ]Tetrahedral orientation [ BO 3 ]Triangle transformation, the strength and acid and alkali resistance of the glass are reduced, the dielectric constant, dielectric loss and thermal expansion coefficient of the glass are increased, and the volume resistivity is reduced; meanwhile, the water resistance and mechanical properties of the glass with high boron content can be deteriorated, and the melting temperature of the alkali-containing glass with low boron is lower, so that the glass is more suitable for the production process of float glass; if B 2 O 3 Too low a mass percentage of (B) may result in B 2 O 3 There is limited improvement in the glass network.
In some embodiments, the alkali-containing glass comprises 0 to 3 percent of P by mass percent 2 O 5 Further, the content may be 0 to 2.5%, further 0 to 2%, and may be selected from any one or any two of the following ranges by mass: 0%, 0.2%, 0.3%, 0.5%, 0.6%, 0.7%, 0.8%, 1%, 1.5%, 2%, 2.5%, 3%, etc. More suitable P 2 O 5 The content is more favorable for improving the compactness of the glass structure of the glass, and the possible reasons of improving the mechanical property, the chemical stability and the like of the glass are that P is added 2 O 5 Can make [ BO ] 3 ]Backward [ BO ] 4 ]The transformation is carried out, thereby improving the compactness of the glass structure and the chemical stability of the glass, and the dielectric constant and dielectric loss of the glass Consumption, a reduction in the coefficient of thermal expansion and an increase in the volume resistivity are advantageous. If P 2 O 5 Too high a mass percentage of [ PO ] may result 4 ]The tetrahedral network structure is larger, the migration degree of alkali metal ions is higher, so that the dielectric property of the glass is reduced, and the volume resistivity and the thermal expansion coefficient are improved. And a higher content of P 2 O 5 The corrosion to the kiln refractory is also larger, which is not beneficial to actual production; if P 2 O 5 Such improvement may not be significant when the mass percentage of (c) is too low.
In some embodiments, the alkali-containing glass comprises, by mass, 4% -20% of alkali metal oxide, further may be 4% -18%, further may be 4% -16.5%, and may be selected from any one or any two of the following ranges by mass: 4%, 4.5%, 5%, 5.2%, 5.5%, 6%, 6.5%, 6.9%, 7%, 7.5%, 7.8%, 8%, 8.5%, 8.6%, 8.7%, 9%, 9.4%, 9.5%, 9.9%, 10%, 10.2%, 10.5%, 11%, 11.5%, 11.7%, 11.9%, 12%, 12.4%, 12.5%, 12.6%, 13%, 13.1%, 13.5%, 13.6%, 14%, 14.4%, 14.5%, 14.8%, 14.9%, 15%, 15.5%, 16%, 16.5%, 17%, 17.5%, 18%, 18.5%, 19%, 19.5%, 20%, and the like.
In some embodiments, the alkali-containing glass may be selected from Li 2 O、Na 2 O and K 2 One or more of O.
In some embodiments, the alkali-containing glass comprises 0-5% of alkaline earth metal oxide by mass percent, and can be selected from any one or any two of the following ranges by mass percent: 0%, 0.5%, 0.8%, 1%, 1.2%, 1.3%, 1.4%, 1.5%, 2%, 2.3%, 2.5%, 2.7%, 3%, 3.1%, 3.5%, 3.6%, 4%, 4.1%, 4.5% and 5%. Alkaline earth metal oxides, such as MgO, caO, srO, baO, are external oxides to the glass network that aid in the melting of the glass. The inventors of the present application have also found that some alkaline earth metals oxidizeThe polymer can also play a role in inhibiting the movement of alkali metal ions in the glass in a network, thereby being beneficial to the reduction of the dielectric constant and dielectric loss of the glass and the improvement of the volume resistivity. Meanwhile, when the alkali-containing glass is applied to chip packaging, the air-tightness packaging can be carried out in a mode of low requirement on the surface of the substrate and high bonding reliability by adopting anode bonding, so that the simplification of the chip packaging process and the improvement of the reliability are facilitated. If the mass percentage of alkaline earth metal oxide is too high, the damage to the network structure of the glass may be caused to be large, so that the [ SiO ] of the glass network 4 ]The Si-O bond in the tetrahedron is broken, so that the strength and chemical stability of the glass are reduced, and simultaneously the dielectric constant and dielectric loss of the glass are improved, and the volume resistivity is reduced; part of the reason is that high levels of heavy metal ions can lead to significant increases in the dielectric constant of the glass.
In some embodiments, the alkaline earth metal oxide may be selected from one or more of MgO, caO, srO, baO in the alkali-containing glass.
In some embodiments, the alkali-containing glass wherein the alkaline earth metal oxide is selected from at least one of MgO and CaO.
In some embodiments, the alkali-containing glass comprises 0-5% of rare earth oxide by mass percent, and can be selected from any one of the following or any two of the following ranges by mass percent: 0%, 0.5%, 0.6%, 1%, 1.4%, 1.5%, 1.7%, 1.9%, 2%, 2.3%, 2.5%, 2.7%, 2.8%, 2.9%, 3%, 3.3%, 3.5%, 3.6%, 3.7%, 3.9%, 4%, 4.1%, 4.4%, 4.5%, 4.9%, 5%, etc. The inventors of the present application believe that a more suitable rare earth oxide content is more advantageous for improving the mechanical and dielectric properties of the glass: the field intensity of the rare earth ions is large, the introduced rare earth ions can enter network gaps of the glass and are connected with the negative ion groups to be used for charge compensation, so that the effect of 'network compensation' is achieved; meanwhile, the borate of the rare earth element has lower vapor pressure than the alkaline earth metal borate, and can inhibit volatilization of boron oxide. If the mass percentage of rare earth oxide is too high, more free oxygen may be introduced, and instead a "network breaking" like action occurs, promoting depolymerization of the glass structure, eventually leading to deterioration of the mechanical and dielectric properties of the glass. The inventor of the present application found that as rare earth oxide increases, the dielectric constant and dielectric loss of glass decrease and then increase, while the thermal stability, glass strength and volume resistivity increase and then decrease; in the glass system, when the mass percentage of the rare earth oxide is 0-5%, the glass has better performance.
In some embodiments, the rare earth oxide may be selected from La 2 O 3 、Lu 2 O 3 、Er 2 O 3 、CeO 2 、Nd 2 O 3 、Eu 2 O 3 、Dy 2 O 3 、Y 2 O 3 And Sm 2 O 3 One or more of the following.
In some embodiments, the alkali-containing glass comprises 0-8% of ZnO by mass percent, and can be selected from any one of the following or any two of the following ranges by mass percent: 0%, 0.5%, 1%, 1.3%, 1.5%, 1.7%, 1.9%, 2%, 2.1%, 2.2%, 2.3%, 2.4%, 2.5%, 3%, 3.1%, 3.4%, 3.5%, 4%, 4.5%, 5%, 5.5%, 6%, 6.5%, 7%, 7.5%, 8%, etc.
In some embodiments, the alkali-containing glass comprises 1 to 8 percent of TiO by mass percent 2 The composition may also be selected from any one of the following or any two of the following ranges: 1%, 1.5%, 1.6%, 1.7%, 2%, 2.1%, 2.3%, 2.4%, 2.5%, 2.7%, 2.9%, 3%, 3.1%, 3.2%, 3.5%, 3.9%, 4%, 4.4%, 4.5%, 5%, 5.1%, 5.5%, 6%, 6.5%, 7%, 7.5%, 8%, etc.
ZnO and TiO 2 Are all glass network intermediates, and are more suitable ZnO and/or TiO 2 Is more advantageous for forming a glass network structure comprising tetrahedra. The radius of zinc ions and the radius of titanium ions are smaller, and the formed tetrahedron structure has higher compactness and is beneficial to And a decrease in the coefficient of thermal expansion. The inventors of the present application found that ZnO and TiO were mixed with 2 The content of (2) is adjusted within a proper range, which is more favorable for obtaining glass with lower dielectric constant and dielectric loss and higher volume resistivity, probably because the ionic state of the two ions is +4 when forming a network body, and the glass has an inhibition effect on the migration of +1 alkali metal in the glass. If ZnO and/or TiO in glass 2 The quality percentage of the glass is too high, and the glass performance is influenced more easily because the field intensity of zinc ions and titanium ions is larger.
In some embodiments, the alkali-containing glass comprises 0 to 5 percent of ZrO by mass percent 2 The composition may also be selected from any one of the following or any two of the following ranges: 0%, 0.2%, 0.4%, 0.5%, 0.7%, 0.8%, 1%, 1.1%, 1.2%, 1.3%, 1.4%, 1.5%, 1.7%, 1.8%, 2%, 2.5%, 2.8%, 3%, 3.5%, 4%, 4.5% and 5%.
ZrO 2 Is effective with ZnO and TiO 2 Similarly, it is a constituent of the intermediate of the glass network. The inventors of the present application found that ZrO was more suitable 2 The content is more favorable for forming a glass network with a tetrahedral structure, and the mechanical property and the dielectric property of the glass are further improved. Specifically, zrO 2 Has stronger electric field effect and more proper ZrO 2 The content can better realize the migration of some ions (such as alkali metal ions and the like) under an electric field, and can better promote the improvement of the strength and scratch resistance of the glass surface. If ZrO 2 The excessively high mass percentage may cause a significant increase in energy consumption in the glass melting process.
In some embodiments, the alkali-containing glass comprises the following components in percentage by mass: 60.3 to 80 percent of SiO 2 1 to 8 percent of Al 2 O 3 3 to 15 percent of B 2 O 3 0 to 2 percent of P 2 O 5 4 to 16.5 percent of alkali metal oxide, 0 to 5 percent of alkaline earth metal oxide, 0 to 8 percent of ZnO and 1 to 8 percent of TiO 2 0 to 5 percent ofZrO 2 And 0% -5% rare earth oxide.
In some embodiments, the alkali-containing glass comprises 0 to 2 percent of Li in percentage by mass 2 O can also be selected from any one of the following or any two of the following intervals by mass percent: 0%, 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1%, 1.1%, 1.2%, 1.3%, 1.4%, 1.5%, 1.6%, 1.7%, 1.8%, 1.9%, 2%, etc. More suitable Li 2 The O content is more beneficial to improving the mechanical property and dielectric property of the glass and reducing the process difficulty. The inventors of the present application believe that Li 2 O can play a role in improving the effect of mixed alkali, and meanwhile, the radius is small, the ion field is strong, and the glass network is gathered. If Li 2 Too high a mass percentage of O may cause severe "network breakage" of the glass structure, resulting in deterioration of the dielectric properties of the glass, while too high a mass percentage of Li 2 O also tends to cause glass phase separation and the manufacturing cost is greatly increased.
In some embodiments, the alkali-containing glass comprises 2 to 9 percent of Na by mass percent 2 O can also be selected from any one of the following or any two of the following intervals by mass percent: 2%, 2.4%, 2.5%, 3%, 3.5%, 3.6%, 4%, 4.3%, 4.5%, 4.6%, 5%, 5.4%, 5.5%, 5.7%, 5.8%, 5.9%, 6%, 6.1%, 6.5%, 6.9%, 7%, 7.4%, 7.5%, 8%, 8.5% and 9%, etc. Na (Na) 2 O is an essential component of the glass, and in addition to making the melting of the glass easier, the applicant's inventors have found that Na is more suitable 2 The content of O is more beneficial to the chip packaging process. Silicon-glass anode bonding process is also called electrostatic bonding, in which silicon chip is connected with positive electrode of DC power supply, glass is connected with negative electrode, and both are placed in vacuum cavity, and heated on heating table and applied with pressure, when the external electric field is acted, the conductive ions in the glass, such as Na + Drift to the glass surface of the negative electrode, leaving a negative charge on the glass surface immediately adjacent to the wafer due to Na + Drift of charged particles (directional flow) of the whole electricityThe current flows through the channel, a layer of extremely thin depletion layer is formed on the surface of the glass close to the silicon wafer, meanwhile, the depletion layer is negatively charged, and the silicon wafer is positively charged, so that a large electrostatic attraction force is generated between the silicon wafer and the glass, the silicon wafer and the glass are in close contact, and a physical-chemical reaction is generated on a bonding surface to form a firmly-combined Si-O covalent bond. In the chip packaging process, na is required for anodic bonding between glass and wafer 2 Participation of O. If Na is 2 Too high a mass percentage of O may cause deterioration of weather resistance and stability of the glass, increase of dielectric constant, dielectric loss and thermal expansion coefficient, and decrease of volume resistivity. If Na is 2 Too high a mass percentage of O may cause melting of the glass to become difficult and detrimental to the anodic bonding process of the chip package.
In some embodiments, the alkali-containing glass comprises 2 to 9 percent of K by mass percent 2 O can also be selected from any one of the following or any two of the following intervals by mass percent: 2%, 2.5%, 3%, 3.5%, 3.6%, 4%, 4.1%, 4.3%, 4.5%, 4.6%, 4.7%, 4.8%, 5%, 5.5%, 5.6%, 5.8%, 5.9%, 6%, 6.4%, 6.5%, 6.6%, 6.7%, 7%, 7.3%, 7.5%, 8%, 8.5% and 9%. K (K) 2 O is a component that promotes melting of the glass raw material. The inventors of the present application consider K 2 O mainly plays a role in improving the effect of mixed alkali, which is higher than Li 2 The effect of O on improving the mixed alkali effect is good, probably because the ion radius is larger and migration is not easy. More suitable K 2 The O content is more advantageous for improving the dielectric properties (e.g., volume resistivity) of the glass. If K 2 The excessively high mass percentage of O may cause damage to the network structure of the glass, and the chemical stability and strength of the glass are reduced, and simultaneously, the dielectric property is poor, the volume resistivity is improved, and the thermal expansion coefficient is improved.
In some embodiments, the alkali-containing glass comprises the following alkali metal oxides in percentage by mass of the alkali-containing glass: 0% -2% of Li 2 O, na 2-9% 2 O, 2-9% of K 2 O. The application is characterized in thatThe inventors have also found that Li 2 O、Na 2 O、K 2 O satisfies a certain proportion relation, can amplify the mixed alkali effect, further improves the dielectric property of the glass and better improves the volume resistivity.
In some embodiments, the alkali-containing glass comprises 0 to 4.9 mass percent of MgO, and can be selected from any one or any two of the following ranges in percentage by mass: 0%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1%, 1.4%, 1.5%, 1.7%, 1.9%, 2%, 2.3%, 2.5%, 2.8%, 3%, 3.5%, 3.6%, 4%, 4.1%, 4.2%, 4.3%, 4.4%, 4.5%, 4.6%, 4.7%, 4.8%, 4.9%, etc.
In some embodiments, the alkali-containing glass comprises 0-2% of CaO by mass percent, and can be selected from any one of the following or any two of the following ranges by mass percent: 0%, 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1%, 1.1%, 1.2%, 1.3%, 1.4%, 1.5%, 1.6%, 1.7%, 1.8%, 1.9%, 2%, etc.
In some embodiments, the alkali-containing glass comprises 0 to 1.2 mass percent of SrO, and can be selected from any one or any two of the following ranges in percentage by mass: 0%, 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1%, 1.1%, 1.2%, etc.
In some embodiments, the alkali-containing glass comprises 0 to 2.1 mass percent of BaO, and can be selected from any one or any two of the following ranges in percentage by mass: 0%, 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1%, 1.1%, 1.2%, 1.3%, 1.4%, 1.5%, 1.6%, 1.7%, 1.8%, 1.9%, 2%, 2.1%, and the like.
In some embodiments, the alkaline-containing glass comprises the following components in percentage by mass: 0 to 4 percent of MgO, 0 to 2 percent of CaO, 0 to 1.2 percent of SrO and 0 to 2.1 percent of BaO.
In some embodiments, the alkali-containing glass comprises 0 to 2.6 percent of La in percentage by mass 2 O 3 The composition may also be selected from any one of the following or any two of the following ranges: 0%, 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1%, 1.1%, 1.2%, 1.3%, 1.4%, 1.5%, 1.6%, 1.7%, 1.8%, 1.9%, 2%, 2.1%, 2.2%, 2.3%, 2.4%, 2.5%, 2.6%, etc.
In some embodiments, the alkali-containing glass comprises 0 to 1.3 percent of Lu by mass percent 2 O 3 The composition may also be selected from any one of the following or any two of the following ranges: 0%, 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1%, 1.1%, 1.2%, 1.3%, etc.
In some embodiments, the alkali-containing glass comprises 0 to 2.5 percent of Er in percentage by mass 2 O 3 The composition may also be selected from any one of the following or any two of the following ranges: 0%, 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1%, 1.1%, 1.2%, 1.3%, 1.4%, 1.5%, 1.6%, 1.7%, 1.8%, 1.9%, 2%, 2.1%, 2.2%, 2.3%, 2.4%, 2.5%, etc.
In some embodiments, the alkali-containing glass comprises 0 to 1 percent of CeO according to mass percent 2 The composition may also be selected from any one of the following or any two of the following ranges: 0%, 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1% and the like.
In some embodiments, the alkali-containing glass comprises 0 to 0.8 percent of Nd in percentage by mass 2 O 3 The composition may also be selected from any one of the following or any two of the following ranges: 0%, 0.1%0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, etc.
In some embodiments, the alkali-containing glass comprises 0 to 0.6 mass percent of Eu 2 O 3 The composition may also be selected from any one of the following or any two of the following ranges: 0%, 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, etc.
In some embodiments, the alkali-containing glass comprises 0 to 1.9 percent of Dy in percentage by mass 2 O 3 The composition may also be selected from any one of the following or any two of the following ranges: 0%, 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1%, 1.1%, 1.2%, 1.3%, 1.4%, 1.5%, 1.6%, 1.7%, 1.8%, 1.9%, etc.
In some embodiments, the alkali-containing glass comprises 0 to 0.6 percent of Y by mass percent 2 O 3 Further, the composition may be selected from any one of the following ranges by mass percent or any two ranges by mass percent: 0%, 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, etc.
In some embodiments, the alkali-containing glass comprises 0 to 1 percent of Sm in percentage by mass 2 O 3 The composition may also be selected from any one of the following or any two of the following ranges: 0%, 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1% and the like.
In some embodiments, the alkali-containing glass comprises the following components in percentage by mass: 0 to 2.6 percent of La 2 O 3 0 to 1.3 percent of Lu 2 O 3 0% -2.5% of Er 2 O 3 CeO 0% -1% 2 0 to 0.8 percent of Nd 2 O 3 0 to 0.6 percent of Eu 2 O 3 Dy 0-1.9% 2 O 3 0 to 0.6 percent of Y 2 O 3 And 0% to 1% Sm 2 O 3 。
In the present application, 1.4B may be used unless otherwise specified 2 O 3 /(0.9SiO 2 +Al 2 O 3 +0.7P 2 O 5 ) Denoted as α. I.e. the mass percentages of the corresponding components in the alkali-containing glass are taken into account,
α＝1.4B 2 O 3 /(0.9SiO 2 +Al 2 O 3 +0.7P 2 O 5 )。
in some embodiments, the alkali-containing glass is incorporated in 1.4B as a percentage of the mass of the components 2 O 3 /(0.9SiO 2 +Al 2 O 3 +0.7P 2 O 5 ) That is, the value range of α is 0.05 to 0.35, and may be selected from any one or two of the following ranges: 0.05, 0.06, 0.07, 0.08, 0.1, 0.12, 0.13, 0.14, 0.15, 0.16, 0.17, 0.18, 0.2, 0.23, 0.25, 0.3, 0.35, etc. The inventors of the present application have found that a more suitable value of α is more advantageous for obtaining glass with chemical stability and dielectric properties (e.g., dielectric constant, dielectric loss, and coefficient of thermal expansion parameters, etc.). If the value of α is too low, it may cause [ BO ] in the glass network 4 ]The tetrahedron content is low, which is disadvantageous to the reduction of dielectric constant, dielectric loss and thermal expansion coefficient; if the value of α is too large, it may result in [ BO ] in the glass network 4 ]Has partial conversion to [ BO ] 3 ]The glass network is broken, resulting in a decrease in chemical stability of the glass, while the dielectric constant, dielectric loss, and thermal expansion coefficient are increased.
In the present application, (3 Al may be used unless otherwise specified 2 O 3 +4B 2 O 3 )/(10Li 2 O+5Na 2 O+3K 2 O+2P 2 O 5 ) Denoted as beta. I.e. the mass percentage of the corresponding components in the alkali-containing glass is calculated, and beta= (3 Al) 2 O 3 +4B 2 O 3 )/(10Li 2 O+5Na 2 O+3K 2 O+2P 2 O 5 )。
In some embodiments, the alkali-containingIn the glass, (3 Al 2 O 3 +4B 2 O 3 )/(10Li 2 O+5Na 2 O+3K 2 O+2P 2 O 5 ) That is, the value of β is in the range of 0.3 to 1.31, and may be selected from any one or two of the following ranges: 0.3, 0.31, 0.35, 0.5, 0.53, 0.6, 0.63, 0.66, 0.7, 0.72, 0.78, 0.8, 0.81, 0.82, 0.86, 0.88, 0.9, 0.93, 1, 1.06, 1.08, 1.09, 1.1, 1.2, 1.3, 1.31, and the like. The inventors of the present application found that a more suitable value of beta is more advantageous for obtaining glass with chemical stability and dielectric properties. If the value of beta is too large, aluminum oxide and boron oxide can not be completely converted towards respective network tetrahedra, so that the structure of a glass network is poor, even the network structure can not be formed, but the network structure is partially used as an external network body, and adverse effects are brought to the dielectric constant, dielectric loss and thermal expansion coefficient of the glass; if the value of β is too small, the alkali metal content as an external body of the glass network may become large, and the network breakage effect on the glass network becomes remarkable, and adverse effects may be caused on the dielectric constant, dielectric loss and thermal expansion coefficient of the glass.
In the present application, unless otherwise specified, (5 Li 2 O+2Na 2 O+K 2 O)/(9MgO+4CaO+2SrO+BaO+8ZnO+9TiO 2 +5ZrO 2 ) And is denoted as gamma. I.e. the mass percentages of the corresponding components in the alkali-containing glass are taken into account,
γ＝(5Li 2 O+2Na 2 O+K 2 O)/(9MgO+4CaO+2SrO+BaO+8ZnO+9TiO 2 +5ZrO 2 )。
in some embodiments, the alkali-containing glass is incorporated in the composition in mass percent, (5 Li 2 O+2Na 2 O+K 2 O)/(9MgO+4CaO+2SrO+BaO+8ZnO+9TiO 2 +5ZrO 2 ) The value range of (2) is 0.15-0.5, and can be selected from any one or two of the following values: 0.15, 0.16, 0.17, 0.19, 0.2, 0.21, 0.24, 0.25, 0.26, 0.28, 0.29, 0.3, 0.34, 0.35, 0.37, 0.4, 0.44, 0.45, 0.5, etc. If the value of gamma is too low, it may result in a lower alkali metal content,for [ BO in glass 3 ]Conversion to [ BO 4 ]Disadvantageously, the network structure of the glass is deteriorated, the thermal expansion coefficient, dielectric constant, dielectric loss are increased, and the low content of alkali metal is also disadvantageous for melting the glass. If the value of γ is too high, it may result in a smaller ion content with a larger field strength, and the inhibition effect on the migration of alkali metal ions is not obvious, thereby being unfavorable for the decrease of the dielectric constant and dielectric loss of glass and the increase of the volume resistivity.
In the present application, na may be used unless otherwise specified 2 O/K 2 O is denoted as θ. I.e. by taking the mass percentages of the corresponding components in the alkali-containing glass into account, θ=na 2 O/K 2 O。
In some embodiments, in the alkali-containing glass, na 2 Mass percent of O relative to K 2 The value range of the mass percent of O is 0.5-1.3, and the O can be selected from any one or two of the following numerical values: 0.5, 0.55, 0.57, 0.6, 0.61, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.94, 0.95, 0.96, 0.98, 0.99, 1, 1.03, 1.04, 1.05, 1.06, 1.1, 1.15, 1.2, 1.23, 1.25, 1.3, and the like. The proper value of theta is favorable for obtaining glass with better dielectric property. If θ is too high or too low, the alkali metal mixed alkali effect in the glass may be adversely affected, which may cause the migration of alkali metal in the glass network to be higher or easier, and further deteriorate the dielectric properties of the glass.
In some embodiments, the alkali-containing glass has a coefficient of thermal expansion CTE (50-350 ℃) of less than 9X 10 -6 K, can also be selected from any of the following coefficients of thermal expansion: is less than or equal to 5 multiplied by 10 -6 /K、≤5.5×10 -6 /K、≤5.6×10 -6 /K、≤6×10 -6 /K、≤6.2×10 -6 /K、≤6.5×10 -6 /K、≤6.6×10 -6 /K、≤6.7×10 -6 /K、≤6.9×10 -6 /K、≤7×10 -6 /K、≤7.1×10 -6 /K、≤7.2×10 -6 /K、≤7.3×10 -6 /K、≤7.4×10 -6 /K、≤7.5×10 -6 /K、≤7.6×10 -6 /K、≤7.8×10 -6 /K、≤7.9×10 -6 /K、≤8×10 -6 /K、≤8.2×10 -6 /K、≤8.5×10 -6 K is equal to or less than 9X 10 -6 /K, etc.
In some embodiments, the alkali-containing glass may have a coefficient of thermal expansion CTE (50-350 ℃) selected from the interval consisting of two coefficients of thermal expansion: 5X 10 -6 /K、5.5×10 -6 /K、5.6×10 -6 /K、6×10 -6 /K、6.2×10 -6 /K、6.5×10 -6 /K、6.6×10 -6 /K、6.7×10 -6 /K、6.9×10 -6 /K、7×10 -6 /K、7.1×10 -6 /K、7.2×10 -6 /K、7.3×10 -6 /K、7.4×10 -6 /K、7.5×10 -6 /K、7.6×10 -6 /K、7.8×10 -6 /K、7.9×10 -6 /K、8×10 -6 /K、8.2×10 -6 /K、8.5×10 -6 K and 9X 10 -6 /K, etc.
In some embodiments, the alkali-containing glass has a dielectric constant ε at 1MHz at 25 DEG C r Less than 8, may also be selected from any of the following dielectric constants: 4.1, 4.2, 4.4, 4.6, 4.7, 4.8, 4.9, 5, 5.1, 5.5, 5.7, 6.2, 6.4, 6.5, 6.7, 6.9, 7, 7.2, 7.5, 7.6, 7.8, 8, etc.
In some embodiments, the alkali-containing glass has a dielectric constant ε at 1MHz at 25 DEG C r The dielectric constant may be selected from the interval consisting of any two of the following: 4.1, 4.2, 4.4, 4.5, 4.6, 4.7, 4.8, 4.9, 5, 5.1, 5.5, 5.7, 6, 6.2, 6.4, 6.5, 6.7, 6.9, 7, 7.2, 7.5, 7.6, 7.8, 8, etc.
Dielectric loss refers to a phenomenon in which a dielectric medium itself heats up in an alternating electric field due to consumption of a part of electric energy. The reason is that the dielectric medium contains conductive carriers, and under the action of an external electric field, conductive current is generated, so that a part of electric energy is consumed and converted into heat energy.
In some embodiments, the alkali-containing glass has a dielectric loss, tan delta, of less than 8 x 10 at a frequency of 1MHz -3 The dielectric loss may also be selected from any of the following:≤3.8×10 -3 、≤4×10 -3 、≤4.5×10 -3 、≤4.6×10 -3 、≤4.8×10 -3 、≤4.9×10 -3 、≤5×10 -3 、≤5.3×10 -3 、≤5.5×10 -3 、≤5.6×10 -3 、≤5.7×10 -3 、≤5.9×10 -3 、≤6×10 -3 、≤6.1×10 -3 、≤6.3×10 -3 、≤6.5×10 -3 、≤7×10 -3 、≤7.2×10 -3 、≤7.4×10 -3 、≤7.5×10 -3 、≤7.6×10 -3 、≤7.7×10 -3 、≤7.8×10 -3 or less than or equal to 8 multiplied by 10 -3 Etc.
In some embodiments, the dielectric loss tan delta of the alkali-containing glass at a frequency of 1MHz can also be selected from the interval consisting of any two dielectric losses: 3.8X10 -3 、4×10 -3 、4.5×10 -3 、4.6×10 -3 、4.8×10 -3 、4.9×10 -3 、5×10 -3 、5.3×10 -3 、5.5×10 -3 、5.6×10 -3 、5.7×10 -3 、5.9×10 -3 、6×10 -3 、6.1×10 -3 、6.3×10 -3 、6.5×10 -3 、7×10 -3 、7.2×10 -3 、7.4×10 -3 、7.5×10 -3 、7.6×10 -3 、7.7×10 -3 、7.8×10 -3 And 8X 10 -3 Etc.
In some embodiments, the alkali-containing glass has a volume resistivity greater than 1 x 10 at 250 DEG C 8 Ω·cm, may also be selected from any of the following volume resistivities: not less than 1X 10 8 Ω·cm、≥1.5×10 8 Ω·cm、≥1.6×10 8 Ω·cm、≥1.7×10 8 Ω·cm、≥1.8×10 8 Ω·cm、≥1.9×10 8 Ω·cm、≥2×10 8 Omega cm or more than or equal to 2.1X10 8 Omega cm, etc.
In some embodiments, the alkali-containing glass has a volume resistivity at 250 ℃ and may also be selected from the interval consisting of any two of the following volume resistivities: 1X 10 8 Ω·cm、1.5×10 8 Ω·cm、1.6×10 8 Ω·cm、1.7×10 8 Ω·cm、1.8×10 8 Ω·cm、1.9×10 8 Ω·cm、2×10 8 Omega cm and 2.1X10 8 Omega cm, etc.
According to a second aspect of the application, a preparation method of alkali-containing glass is provided, and the alkali-containing glass in the first aspect can be obtained by vegetation.
In some embodiments, the method for preparing alkali-containing glass comprises the steps of:
s100: mixing the components of the alkali-containing glass of the first aspect to obtain a batch;
s200: processing the batch into glass liquid;
s300: and processing the glass liquid into alkali-containing glass.
In some embodiments, in step S200 of the preparation method, the step of processing the batch material into molten glass comprises: heating, clarifying, homogenizing to obtain glass liquid.
In some embodiments, in step S200 of the preparation method, the step of processing the molten glass into alkali-containing glass includes: and (5) forming, annealing and cooling to obtain the alkali-containing glass.
In some embodiments, the method for preparing alkali-containing glass comprises the steps of:
s100: mixing the components of the alkali-containing glass of the first aspect to obtain a batch;
s200: heating the batch, clarifying and homogenizing to obtain glass liquid;
s300: and (3) forming, annealing and cooling the glass liquid to obtain the alkali-containing glass.
The preparation method of the alkali-containing glass provided by the application has the advantages of simple integral process and low energy consumption.
In some embodiments, the temperature of the heating treatment is 1560 to 1650 ℃.
In some embodiments, in the method of making, the annealing is between 570 and 650 ℃.
In a third aspect of the application, there is provided a glass-containing article comprising a glass structure comprising an alkali-containing glass according to the first aspect or an alkali-containing glass prepared by a method of preparation according to the second aspect.
The glass-containing article provided by the application can achieve lower dielectric constant, dielectric loss and thermal expansion coefficient and has higher volume resistivity.
In a fourth aspect of the application, there is provided an electronic product comprising the glass-containing article of the third aspect.
The electronic product provided by the application adopts the alkali-containing glass which has better dielectric property, and the electronic product can obtain better performance.
According to a fifth aspect of the application, there is provided an application of the alkali-containing glass according to the first aspect or the alkali-containing glass prepared by the preparation method according to the second aspect in manufacturing of electronic products.
The alkali-containing glass provided by the application is applied to the manufacturing process of electronic products, so that the purchasing cost is low, the packaging process is simple, and better performance can be obtained.
In order that the application may be more readily understood and put into practical effect, the following more particular examples and comparative examples are provided as reference.
Unless otherwise specified, the raw materials used in each of the following experiments are commercially available.
Example 1
Preparation of alkali-containing glass:
raw materials are weighed according to the composition of raw material components in table 1, put into a mixer for mixing, the mixed batch is poured into a platinum crucible, melted and clarified for 2-5 hours in a high-temperature furnace at 1560-1650 ℃, and then molten glass is poured into a mould for molding. And then the formed glass is quickly transferred into an annealing furnace at 570-650 ℃ for annealing treatment, and after annealing is finished, the glass is cooled to room temperature along with the furnace, so that alkali-containing glass is obtained.
(II) performance test:
(1) Coefficient of thermal expansion test
Determination of average linear thermal expansion coefficient of GB/T16920-2015 glass
(2) Dielectric constant and dielectric loss test
Solid insulating material dielectric and resistive properties part 6: dielectric characteristics (AC method) relative permittivity and dielectric loss factor (frequency 0.1 Hz-10 MHz) GB/T31838.6-2021
(3) Volume resistivity test
Solid insulating material dielectric and resistive properties part 7: resistance characteristics (DC method) volume resistance and volume resistivity GB/T31838.7-2021 were measured at high temperature.
With the above method, the measured results are as follows:
the alkali-containing glass obtained in example 1 has a thermal expansion coefficient (50 to 350 ℃) of 6.9X10 -6 K, dielectric constant at 25℃at 1MHz is 6.2, dielectric loss at frequency 1MHz is 5.7X10 -3 Volume resistivity at 250℃is 1.9X10 8 Omega cm (see Table 2).
Examples 2 to 20
Preparation of alkali-containing glass:
the preparation methods of examples 2 to 20 were substantially the same as example 1, except that the raw material components of the glasses in examples 2 to 20 were different (see tables 1 and 3).
The alkali-containing glass thus obtained was subjected to a performance test in the same manner as in example 1, and the test results are shown in tables 2 and 4.
These test results show that the alkali-containing glasses prepared in examples 1 to 20 have smaller thermal expansion coefficient, dielectric coefficient and dielectric loss and larger volume resistivity.
Table 1 raw material components of alkali-containing glasses of examples 1 to 10 and the calculated parameter values were carried in the raw material components
TABLE 2 Properties of alkali-containing glasses prepared in examples 1 to 10
TABLE 3 raw material components of alkali-containing glasses of examples 11 to 20 and the calculated parameter values were carried in the raw material components
TABLE 4 Properties of alkali-containing glasses prepared in examples 11 to 20
Comparative example 1
Preparation of alkali-containing glass:
the production method of comparative example 1 was substantially the same as in example 1 except that the raw material components of the glass in comparative example 1 were different (see table 5). The alkali-containing glass thus obtained was subjected to a performance test in the same manner as in example 1, and the test results are shown in Table 6.
The results show that the alkali-containing glass prepared in comparative example 1 has a larger thermal expansion coefficient and dielectric loss, and a smaller volume resistivity, probably because the glass does not contain B 2 O 3 Alpha at this time
(1.4B 2 O 3 /(0.9SiO 2 +Al 2 O 3 +0.7P 2 O 5 ) The value of 0) so that tetrahedra in the glass network structure are not compact enough, the expansion coefficient of the glass is increased, and the mobility of metal ions in a larger network is high, thereby causing the dielectric loss to be increased and the volume resistivity to be correspondingly reduced.
Comparative example 2
Preparation of alkali-containing glass:
the production method of comparative example 2 was substantially the same as in example 1 except that the raw material components of the glass in comparative example 2 were different (see table 5). The alkali-containing glass thus obtained was subjected to a performance test in the same manner as in example 1, and the test results are shown in Table 6.
The results show that the alkali-containing glass prepared in comparative example 2 has larger thermal expansion coefficient and dielectric loss, smaller volume resistivity, and probably due to Al in the glass 2 O 3 Too high a content results in a large network space of glass, which increases the coefficient of thermal expansion, and a larger network space results in a larger mobility of metal ions in the glass network, which leads to a decrease in dielectric loss and resistivity. Gamma ray
((5Li 2 O+2Na 2 O+K 2 O)/(9MgO+4CaO+2SrO+BaO+8ZnO+9TiO 2 +5ZrO 2 ) And θ (Na) 2 O/K 2 The values of O) are too high, so that the ion pressing effect of high-field-intensity ions on easy migration is weakened and the double alkali effect is poor, and the dielectric loss of the glass is increased and the volume resistivity is reduced.
Comparative example 3
Preparation of alkali-containing glass:
the production method of comparative example 3 was substantially the same as in example 1 except that the raw material components of the glass in comparative example 3 were different (see table 5). The alkali-containing glass thus obtained was subjected to a performance test in the same manner as in example 1, and the test results are shown in Table 6.
The results show that the alkali-containing glass prepared in comparative example 3 has a larger thermal expansion coefficient, dielectric coefficient and dielectric loss, and a smaller volume resistivity, probably due to P in the glass 2 O 5 Too high content of beta
((3Al 2 O 3 +4B 2 O 3 )/(10Li 2 O+5Na 2 O+3K 2 O+2P 2 O 5 ) Smaller value, thereby making the glass network space larger, so the thermal expansion coefficient is increased. At the same time, the larger network space also makes the ions easy to migrate, resulting in increased dielectric loss and reduced volume resistivity. At the same time [ PO 4 ]The bond length is longer and is also easily polarized so that the dielectric constant is also increased.
Comparative example 4
Preparation of alkali-containing glass:
the production method of comparative example 4 was substantially the same as in example 1 except that the raw material components of the glass in comparative example 4 were different (see table 5). The alkali-containing glass thus obtained was subjected to a performance test in the same manner as in example 1, and the test results are shown in Table 6.
The results show that the alkali-containing glass prepared in comparative example 4 has a higher dielectric constant and dielectric loss, and a lower volume resistivity, probably due to a higher alkali oxide content in the glass, θ (Na 2 O/K 2 O) has larger value, the double alkali effect is weakened, ions are more easy to migrate, and the dielectric loss of the glass is increased and the volume resistivity is reduced. The high alkali ion content also results in a high glass ion polarizability, resulting in a high dielectric constant.
Comparative example 5
Preparation of alkali-containing glass:
the preparation method of comparative example 5 is substantially the same as that of example 1 except that the raw material components of the glass in comparative example 5 are different (see table 5).
The alkali-containing glass thus obtained was subjected to a performance test in the same manner as in example 1, and the test results are shown in Table 6.
The results show that the alkali-containing glass prepared in comparative example 5 has a higher thermal expansion coefficient, dielectric coefficient and dielectric loss, and a smaller volume resistivity, probably due to the introduction of the calculated gamma rays into the glass components
((5Li 2 O+2Na 2 O+K 2 O)/(9MgO+4CaO+2SrO+BaO+8ZnO+9TiO 2 +5ZrO 2 ) The value of the glass is larger, so that the pressing effect of high-field-intensity ions in the glass on alkali metal ions which are easy to migrate is greatly weakened, the migration of the alkali metal ions is easier, the dielectric loss of the glass is increased, and the volume resistivity is reduced. At the same time, the metal ion polarizability increases, resulting in an increase in dielectric constant. At the same time a higher content of Li 2 O, which is a large damage to the glass network, increases the coefficient of thermal expansion.
Comparative example 6
Preparation of alkali-containing glass:
the preparation method of comparative example 6 was substantially the same as in example 1 except that the raw material components of the glass in comparative example 6 were different (see table 5). The alkali-containing glass thus obtained was subjected to a performance test in the same manner as in example 1, and the test results are shown in Table 6.
The results show that the alkali-containing glass prepared in comparative example 6 has a larger thermal expansion coefficient and dielectric loss, and a smaller volume resistivity, probably due to Al in the glass 2 O 3 Too high a content results in a large network space of glass, which increases the coefficient of thermal expansion, and a larger network space results in a larger mobility of metal ions in the glass network, which leads to a decrease in dielectric loss and volume resistivity. At the same time, the components in the glass are brought into the calculated beta ((3 Al) 2 O 3 +4B 2 O 3 )/(10Li 2 O+5Na 2 O+3K 2 O+2P 2 O 5 ) The value is larger, so that part of boron oxide of the glass is in a triangular structure and does not participate in the tetrahedral network of the glass, so that the network structure is loose, and the thermal expansion coefficient of the glass is increased.
Comparative example 7
Preparation of alkali-containing glass:
the preparation method of comparative example 7 was substantially the same as in example 1 except that the raw material components of the glass in comparative example 7 were different (see table 5). The alkali-containing glass thus obtained was subjected to a performance test in the same manner as in example 1, and the test results are shown in Table 6.
The results show that the volume resistivity of the alkali-containing glass prepared in comparative example 7 is low. Possible reasons are that the components in the glass are incorporated into the calculated θ (Na 2 O/K 2 O) has lower value, and the double alkali effect of the glass is weakened, so that alkali metal is easier to migrate in a glass network, the dielectric property of the glass is deteriorated, and the volume resistivity is lower.
TABLE 5 raw material components of alkali-containing glasses of comparative examples 1 to 7 and the calculated parameter values were carried in the raw material components
TABLE 6 Properties of alkali-containing glasses prepared in comparative examples 1 to 7
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. The scope of the application should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.

Claims (10)

1. The alkali-containing glass is characterized by comprising the following components in percentage by mass: 60% -80% of SiO 2 1 to 8 percent of Al 2 O 3 3 to 15 percent of B 2 O 3 0 to 3 percent of P 2 O 5 4 to 20 percent of alkali metal oxide, 0 to 5 percent of alkaline earth metal oxide, 0 to 8 percent of ZnO and 1 to 8 percent of TiO 2 ZrO 0-5% 2 And 0% -5% rare earth oxide;
wherein the alkali metal oxide is selected from Li 2 O、Na 2 O and K 2 One or more of O;
the alkaline earth metal oxide is selected from one or more of MgO, caO, srO, baO;
the rare earth oxide is selected from La 2 O 3 、Lu 2 O 3 、Er 2 O 3 、CeO 2 、Nd 2 O 3 、Eu 2 O 3 、Dy 2 O 3 、Y 2 O 3 And Sm 2 O 3 One or more of the following;
calculated by the mass percent of the components, (3 Al 2 O 3 +4B 2 O 3 )/(10Li 2 O+5Na 2 O+3K 2 O+2P 2 O 5 ) The value range of (2) is 0.3-1.31;
Na 2 mass percent of O relative to K 2 The value range of the mass percent of O is 0.5-1.3.
2. The alkali-containing glass according to claim 1, comprising the following components in percentage by mass: 60.3 to 80 percent of SiO 2 1 to 8 percent of Al 2 O 3 3 to 15 percent of B 2 O 3 0 to 2 percent of P 2 O 5 4 to 16.5 percent of alkali metal oxide, 0 to 5 percent of alkaline earth metal oxide, 0 to 8 percent of ZnO and 1 to 8 percent of TiO 2 ZrO 0-5% 2 And 0% -5% rare earth oxide.
3. The alkali-containing glass according to claim 1, wherein one or more of the following conditions (1) to (3) are satisfied:
(1) The alkali metal oxide comprises the following components in percentage by mass: 0% -2% of Li 2 O, na 2-9% 2 O, 2-9% of K 2 O；
(2) The alkaline earth metal oxide comprises the following components in percentage by mass of alkali-containing glass: 0 to 4.9 percent of MgO, 0 to 2 percent of CaO, 0 to 1.2 percent of SrO and 0 to 2.1 percent of BaO;
(3) The rare earth metal oxide comprises the following components in percentage by mass of alkali-containing glass: 0 to 2.6 percent of La 2 O 3 0 to 1.3 percent of Lu 2 O 3 0% -2.5% of Er 2 O 3 CeO 0% -1% 2 0 to 0.8 percent of Nd 2 O 3 0 to 0.6 percent of Eu 2 O 3 Dy 0-1.9% 2 O 3 0 to 0.6 percent of Y 2 O 3 And 0% to 1% Sm 2 O 3 。
4. The alkali-containing glass according to claim 1, wherein one or more of the following conditions (1) to (4) are satisfied:
(1) 1.4B by mass percent of the components 2 O 3 /(0.9SiO 2 +Al 2 O 3 +0.7P 2 O 5 ) The value range of (2) is 0.05-0.35;
(2) Calculated as the mass percent of the components, (5 Li) 2 O+2Na 2 O+K 2 O)/(9MgO+4CaO+2SrO+BaO+8ZnO+9TiO 2 +5ZrO 2 ) The range of the value of (2) is 0.15-0.5.
5. The alkali-containing glass according to claim 1, wherein one or more of the following conditions (1) to (4) are satisfied:
(1) The alkali-containing glass has a coefficient of thermal expansion CTE (50-350 ℃) of less than 9 x 10 -6 /K；
(2) The dielectric constant epsilon of the alkali-containing glass at 25 ℃ and 1MHz r Less than 8;
(3) The dielectric loss tan delta of the alkali-containing glass at 1MHz is less than 8 multiplied by 10 -3 ，
(4) The volume resistivity of the alkali-containing glass at 250 ℃ is more than 1 multiplied by 10 8 Ω·cm。
6. The preparation method of the alkali-containing glass is characterized by comprising the following steps of:
mixing the alkali-containing glass components of any one of claims 1-3 to obtain a batch;
processing the batch into glass liquid;
and processing the glass liquid into alkali-containing glass.
7. The production method according to claim 6, wherein one or both of the following conditions (1) to (2) are satisfied:
(1) The step of processing the batch into the molten glass comprises heating treatment, wherein the temperature of the heating treatment is 1560-1650 ℃;
(2) The step of processing the glass liquid into the alkali-containing glass comprises annealing treatment, wherein the annealing is carried out at 570-650 ℃.
8. A glass-containing article comprising a glass structure comprising an alkali-containing glass as defined in any one of claims 1 to 5 or an alkali-containing glass produced by the method of claim 6 or 7.
9. An electronic product comprising the glass-containing article of claim 8.
10. Use of an alkali-containing glass as defined in any one of claims 1 to 5 or an alkali-containing glass as defined in claim 6 or 7 in the manufacture of electronic products.
CN202310775270.9A 2023-06-28 2023-06-28 Alkali-containing glass, preparation method thereof, glass-containing product, electronic product and application Pending CN116789361A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310775270.9A CN116789361A (en) 2023-06-28 2023-06-28 Alkali-containing glass, preparation method thereof, glass-containing product, electronic product and application

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310775270.9A CN116789361A (en) 2023-06-28 2023-06-28 Alkali-containing glass, preparation method thereof, glass-containing product, electronic product and application

Publications (1)

Publication Number Publication Date
CN116789361A true CN116789361A (en) 2023-09-22

Family

ID=88034162

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310775270.9A Pending CN116789361A (en) 2023-06-28 2023-06-28 Alkali-containing glass, preparation method thereof, glass-containing product, electronic product and application

Country Status (1)

Country Link
CN (1) CN116789361A (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5599753A (en) * 1994-08-30 1997-02-04 Jenaer Glaswerck Gmbh Borosilicate glass weak in boric acid
CN1541963A (en) * 2003-11-04 2004-11-03 上海大学 Substrate glass material for magnetic recording memory medium and preparing process thereof
CN101454252A (en) * 2006-05-25 2009-06-10 日本电气硝子株式会社 Tempered glass and process for producing the same
CN107986618A (en) * 2017-12-28 2018-05-04 中建材蚌埠玻璃工业设计研究院有限公司 A kind of high strain-point alumina silicate glass with high-ohmic
CN110255895A (en) * 2019-07-16 2019-09-20 醴陵旗滨电子玻璃有限公司 Containing alkali borosilicate glass and preparation method thereof
CN111423111A (en) * 2020-05-27 2020-07-17 成都光明光电股份有限公司 Glass material
CN112694254A (en) * 2021-01-04 2021-04-23 河北光兴半导体技术有限公司 Medium borosilicate glass composition, medium borosilicate glass, and preparation method and application thereof
CN113582539A (en) * 2021-08-30 2021-11-02 郑州大学 Aluminosilicate glass and application

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5599753A (en) * 1994-08-30 1997-02-04 Jenaer Glaswerck Gmbh Borosilicate glass weak in boric acid
CN1541963A (en) * 2003-11-04 2004-11-03 上海大学 Substrate glass material for magnetic recording memory medium and preparing process thereof
CN101454252A (en) * 2006-05-25 2009-06-10 日本电气硝子株式会社 Tempered glass and process for producing the same
CN107986618A (en) * 2017-12-28 2018-05-04 中建材蚌埠玻璃工业设计研究院有限公司 A kind of high strain-point alumina silicate glass with high-ohmic
CN110255895A (en) * 2019-07-16 2019-09-20 醴陵旗滨电子玻璃有限公司 Containing alkali borosilicate glass and preparation method thereof
CN111423111A (en) * 2020-05-27 2020-07-17 成都光明光电股份有限公司 Glass material
CN112694254A (en) * 2021-01-04 2021-04-23 河北光兴半导体技术有限公司 Medium borosilicate glass composition, medium borosilicate glass, and preparation method and application thereof
CN113582539A (en) * 2021-08-30 2021-11-02 郑州大学 Aluminosilicate glass and application

Similar Documents

Publication Publication Date Title
CN112047626B (en) Low bubble number, low dielectric constant glass composition and glass fiber made therefrom
TWI408118B (en) Low dielectric glass and fiber glass for electronic applications
US8377834B2 (en) Glass composition for substrates and process for its production
JP7466729B2 (en) Electronic grade glass fiber composition, glass fiber and electronic grade glass fiber fabric
CN102718406B (en) The glass fiber with low dielectric constant that a kind of wire-drawing temperature is low
CN110028249A (en) A kind of dielectric glass fibre component and its manufacturing method
EP3954663B1 (en) Alkali-free glass and glass plate
JP2022522986A (en) Low dielectric loss glass for electronic devices
CN108423999A (en) A kind of low dielectric glass fiber of free-floride and preparation method thereof that rare earth oxide is co-doped with
CN115818966A (en) Electronic-grade glass fiber composition, glass fiber thereof and electronic cloth
KR101090783B1 (en) Glass substrate for flat panel display device
CN116789361A (en) Alkali-containing glass, preparation method thereof, glass-containing product, electronic product and application
CN105271786A (en) Low-dielectric-constant glass fiber composite material and preparation method thereof
JP3741526B2 (en) Substrate glass for display devices
TW202118743A (en) Low-dielectric glass composition, low-dielectric glass and low-dielectric glass fiber being low in dielectric constant and dielectric tangent loss
WO2022228340A1 (en) Low dielectric sealing glass powder for miniature radio-frequency glass insulator
CN113277730B (en) Low dielectric constant glass composition
CN112723737B (en) Low-dielectric phosphorus glass and preparation method and application thereof
CN109052936A (en) Silicate glass and preparation method thereof, glass substrate and display
JP2008100866A (en) Crystallized glass, electric circuit board material containing crystallized glass, laminated circut board material, low temperature firing board material and high frequnecy circuit board material
CN101962265A (en) Glass composition, and preparation method and application thereof
CN109502972A (en) A kind of preparation method of the electric substrate glass with boron anomalous effect
Zou et al. Microwave dielectric properties of a novel Li2O–Al2O3–B2O3 glass-ceramic for ULTCC application
CN117362015B (en) High-purity corundum brick and preparation method thereof
TW202342389A (en) Method of improving dielectric performance of alumino-borosilicate glass

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination