CN105271786A - Low-dielectric-constant glass fiber composite material and preparation method thereof - Google Patents
Low-dielectric-constant glass fiber composite material and preparation method thereof Download PDFInfo
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- CN105271786A CN105271786A CN201510655757.9A CN201510655757A CN105271786A CN 105271786 A CN105271786 A CN 105271786A CN 201510655757 A CN201510655757 A CN 201510655757A CN 105271786 A CN105271786 A CN 105271786A
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Abstract
The invention relates to a low-dielectric-constant glass fiber composite material and a preparation method thereof. The composite material is prepared by filling epoxy resin with glass fiber. The glass fiber is composed of, in percent by weight, 51%-52% of SiO2, 20%-25% of B2O3, 10%-15% of Al2O3, 2%-6% of CaO, 2%-6% of MgO, 0.15%-0.3% of Na2O, 0-0.3% of K2O, 0-0.3% of Li2O, 0-0.9% of CaF2, 0-2% of TiO2, and 0-0.5% of ZrO2. The composite material possesses relatively good dielectric property, and possesses the dielectric constant of about 4.5 under 1 MHz. Also, the raw material cost is low, subsequent processing is easy, and the composite material is applicable as an enhanced material for a substrate of a printing circuit, and possesses relatively large commercial prospect.
Description
Technical field
The invention belongs to glass fiber compound material and preparation method thereof field, particularly a kind of glass fiber compound material with low-k and preparation method thereof.
Background technology
Penetrate into the every aspect in daily life gradually along with digital technique, numerous frequency applications also from ordinary consumer more and more close to.Higher frequency means the raising of electron-propagation speed, thus also more strict to the requirement of board substrate.The ratio of the specific inductivity i.e. electric capacity of certain dielectric capacitor and the same electrical condenser constructed electric capacity under vacuum conditions, conventional ε represents.ε is large, represents that storage of electrical energy is large, and in circuit, signal velocity will step-down; ε is little, and propagation of electrical signals speed is just fast.Usually, the sense of current of current signal in printed board, be the alternately change mutually of positive electricity, negative electricity, the exchange of such frequency, is equivalent to the process of " recharge-discharge-charging ".In exchange, as long as there is a small amount of electric capacity to retain, will affect transmission speed, the energy of loss increases along with the increase of specific inductivity.
For board substrate, several parameter is important.First, minimum physical property requirement must be met, there is suitable machinability, so that cutting and brill micro through hole; Next is the demand that specific inductivity will meet use, because they determine the energy waste of base material.
Electron glass fiber is a kind of alkali free glass fibre of aluminoborosilicate system, has that tensile strength is high, electrical insulation capability good, thermotolerance and a feature such as corrosion resistance is good, is widely used in baseplate material in the electronics industry.The one of glass fiber with low dielectric constant electron glass fiber just, in recent years due to the technical progress of IT industry, and compactization of the electronic product such as computer, mobile telephone, the fast development of high speed, estimate global electronic industry to the demand of dielectric glass fibre and goods industry, maintenance to be grown at top speed, year the growth rate of demand will reach 18.6%.Developing by leaps and bounds of electronics and information industry, has higher requirement to glass fibre and electronics cloth, copper-clad plate (CCL), printed circuit board (PCB) (PCB).Be on the one hand the lifting in product performance, require Signal transmissions high frequency, high-fidelity, highly to maintain secrecy; Be the increase in product function on the other hand, require that copper-clad plate not only serves as substrate, also will bear signal transmission line function, characteristic impedance accuracy controlling functions, in multi-ply wood, serve as built-in passive element function etc.And continual high frequency, shift the low-k of PCB onto the limit.Very limited by the space of improving resin, moulding process reduces Dk, in the urgent need to reducing the specific inductivity of glass, reach new requirement.
Find that the electric property of glass and working parameter cannot be satisfactory to both parties by document and experimental summary, namely when electric property meets the demands, glass makes fibroblast temperature too high because the content of alkali and alkaline earth metal ions ion is lower; Otherwise in order to make glass have suitable fibroblast temperature, when improving the content of the alkali and alkaline earth metal ions ion in glass, electric property receives impact again.In addition the technological problems such as glass phase-separating and boron volatilization, hinders the practical application of low dielectric constant electron glass fiber.
For Problems existing, domestic and international worker also expands the research of series.Han Lixiong etc. mention in " high-performance glass fiber characteristic and present Research ", and early stage glass fiber with low dielectric constant is also referred to as D glass, and its main component is about 73%SiO
2, 22%B
2o
3, 3%R
2o.D glass fibre dielectric properties are very good, and under 10GHz frequency, its specific inductivity is about 4.1, and under equal conditions, E glass dielectric constant is about 6.6.But D glass forming temperature is up to more than 1400 DEG C, fusing forming difficulty, production difficulty is too large, and cost is very high.And the boring of goods CCL, thermotolerance, poor water resistance, be thus difficult to wide popularization and application in the printed circuit boards.
CN101012105A discloses a kind of glass fiber with low dielectric constant, and its optimal proportion is: represent with weight percent, SiO
252% ~ 57%, Al
2o
36% ~ 9.5%, B
2o
330.5% ~ 35%, Na
2o0 ~ 0.3%, K
2o0 ~ 0.3%, Li
2o0 ~ 0.3%, CaO0 ~ 2.5%, MgO0 ~ 2.5%, ZnO0.5% ~ 2.5%, TiO
20.5% ~ 3%.The glass fibre that the composition proportion adopting this invention to provide produces, has good dielectric properties.At room temperature, when frequency is 1MHz, specific inductivity is 3.9 ~ 4.4, and wire-drawing temperature is not substantially higher than 1350 DEG C simultaneously.But B in the formula that this invention provides
2o
3proportioning too high, easily cause glass phase-separating, and volatile quantity is excessive, in spinning process, easily fracture of wire occurs, be unfavorable for industrialized continuous seepage.
CN101594987A also discloses a kind of glass fibre with low-k, and it comprises SiO by weight
252% ~ 60%, Al
2o
311% ~ 16%, B
2o
320% ~ 30%, CaO4% ~ 8%, substantially not containing MgO, Li
2o, Na
2o, K
2o and TiO
2, also can include up to the CaF of about 2% weight
2; Glass fibre disclosed in it substantially not containing MgO for the consideration of batching cost, increasing in order to avoid causing the specific inductivity of this glass composition and the reduction of glass composition water tolerance, substantially not containing Li
2o, K
2o and Na
2o, avoiding is separated simultaneously causes the chemical durability of glass fibre to reduce substantially not containing TiO
2.But the glass fibre of this disclosure of the invention is difficult to the coordinating and unifying realizing dielectric properties and wire-drawing temperature, and when specific inductivity is less than 4.5, often wire-drawing temperature is higher, and after wire-drawing temperature reduces, specific inductivity can not reach requirement again.
CN101696089A relates to a kind of glass fiber with low dielectric constant for high frequency high-density circuit board, and the weight percent of its optimum composition and each component comprises: SiO
250% ~ 55%, Al
2o
312.7% ~ 15.6%, CaO0.02 ~ 0.08%, MgO1.0% ~ 1.9%, ZnO0.5% ~ 1.3%, B
2o
322% ~ 26%, Li
2o0.07% ~ 0.18%, Na
2o0.05% ~ 0.17%, TiO
20.4% ~ 2.1%, CaF
20.8% ~ 2.3%, CeO
20.25% ~ 0.5%; The glass fibre wherein provided has low-k, and be easy to production, water-tolerant, with resin sticking power good, be easy to the features such as following process, but wire-drawing temperature is too high.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of glass fiber compound material with low-k and preparation method thereof, this matrix material is made up of glass fibre filling epoxy resin, there is lower specific inductivity, be suitable as tellite material.The glass fibre of filling has lower wire-drawing temperature and higher intensity simultaneously, is applicable to industrialization continuous seepage.
A kind of glass fiber compound material with low-k of the present invention, described matrix material is made up of glass fibre filling epoxy resin; Wherein, glass fibre is 2 ~ 4:10 with weight epoxy ratio.
The composition of described glass fibre comprises by mass percentage: SiO
251% ~ 52%, B
2o
320% ~ 25%, Al
2o
310% ~ 15%, CaO2% ~ 6%, MgO2% ~ 6%, Na
2o0.15% ~ 0.3%, K
2o0 ~ 0.3%, Li
2o0 ~ 0.3%, CaF
20 ~ 0.9%, TiO
20 ~ 2%, ZrO
20 ~ 0.5%.
The weight percent sum of described CaO and MgO is 8%.
Described Na
2o, K
2o and Li
2the weight percent of O meets: Na
2o+K
2o+Li
2o=0.3% ~ 0.6%, wherein, Na
2o=K
2o or Na
2o=K
2o+Li
2o.
Described CaF
2weight percent be 0.9%.
Described TiO
2weight percent be 2%.
Described ZrO
2weight percent be 0.5%.
The spinning temperature of described glass fibre is 1340 ~ 1350 DEG C, and can continuous wire drawing.
Tensile strength and the alkali free glass fibre of described glass fibre are suitable.
Described matrix material is when frequency is 1MHz, and specific inductivity is about 4.5, decrease beyond 30% than the specific inductivity of the matrix material of filling equivalent alkali free glass fibre.
A kind of preparation method with the glass fiber compound material of low-k of the present invention, comprising:
(1) take each composition of glass fibre, mixing is placed in crucible, melting 6 ~ 8h at 1500 ~ 1550 DEG C, and quenching, obtains glass cullet; Joined by glass cullet in the crucible of glass fiber single filament experiment line, 1340 ~ 1350 DEG C of second melting 0.5 ~ 1h, wire drawing, obtains glass fibre, gets 0.5 ~ 1g glass fibre and is laid in mould, puts into 50 DEG C of baking oven preheatings;
(2) extracting epoxy resin and solidifying agent in mass ratio 10:1 mix, stir, ultrasonic, leave standstill; Then join in the mould of step (1), solidification, obtains the glass fiber compound material with low-k; Wherein, in mould, glass fibre is 2 ~ 4:10 with weight epoxy ratio.
In described step (1), preheating is carried out in an oven, removes open bubble.
In described step (2), churning time is 10min, is stirred to the liquid state of micro-heat release; Ultrasonic time is 5min, and time of repose is that 30min is to eliminate the bubble produced in whipping process.
In described step (2), solidification process is in vacuum drying oven, 50 DEG C of insulation 0.5h, 80 DEG C of insulation 2h, 120 DEG C of insulation 4h.
In described glass fiber component, SiO
2be glass-former, define the network structure of glass.Work as SiO
2content very few time, general specific inductivity is comparatively large, and glass water resistance and chemical stability all can decline.Work as SiO
2when content is too much, be unfavorable for that glass metal melts clarification, spinning temperature is too high.
B
2o
3be Network former equally, have good fluxibility, the high temperature viscosity of glass can be reduced.Work as B
2o
3time less, effect of fluxing lowers, and is unfavorable for the thawing of glass.If too high levels, can, because of reasons such as volatilizations, the chemical stability of glass be caused to be deteriorated.
Al
2o
3be network intermediate, mainly play the effect suppressing devitrification of glass and improve chemical durability of glass.If content is very few, the specific inductivity of glass can be excessive, and water tolerance is poor.When content is too much, glass metal high temperature viscosity is excessive, easily fracture of wire occurs in drawing process.
CaO and MgO is network outer body, and they can not generate glass separately, do not participate in network, and Main Function is to provide extra oxonium ion.The introducing of CaO, MgO can reduce the high temperature viscosity of glass, improves the stability of glass.Usually, CaO+MgO is very few, then do not have effect; Too high levels, then the specific inductivity of glass fibre is high.
Na
2o, K
2o, Li
2o is also network outer body, can effectively reduce temperature of fusion and the wire-drawing temperature of glass, but glass network structural damage effect is also very significant, affects dielectric properties, needs suitable introducing.
TiO
2play and fall low viscous effect, contribute to glass melting.But excessive, then can cause crystallization, and specific inductivity can raise.
F
-glass is played to the effect of fusing clarification, reduce temperature of fusion and time, but the chemical stability adding excessive then glass is deteriorated.
ZrO
2be on the basis not reducing glass fundamental property, introducing some ancillary components has the effect of fluxing and clarifying, and can also play the effect increasing glass fiber strength.
beneficial effect
(1) matrix material of the present invention has good dielectric properties, and under 1MHz, specific inductivity is about 4.5, decrease beyond 30% than the specific inductivity of the matrix material of filling equivalent alkali free glass fibre;
(2) the present invention's glass fiber wire-drawing temperature of filling is below 1350 DEG C, and fiberizability is very good, can the wire drawing of serialization, is conducive to suitability for industrialized production; The tensile strength that simultaneously being and not being alkali glass is suitable, is easy to following process, be suitable as the substrate of printed wiring strongthener, there is larger commercial promise;
(3) matrix material of the present invention contains less or does not substantially contain Li
2o, can effectively reduce raw materials cost.Simultaneously not containing poisonous Sb
2o
3, avoid affecting HUMAN HEALTH and to environment;
(4) method of the present invention is simple, general, is suitable for industrial continuous production.
Accompanying drawing explanation
Fig. 1 is the stereoscan photograph of glass fibre in embodiment 1;
Fig. 2 is the tensile strength contrast of glass fibre and E glass in embodiment 1;
The specific inductivity of the matrix material that Fig. 3 is epoxy resin, obtain in E glass and embodiment 1 ~ 4.
Embodiment
Below in conjunction with specific embodiment, set forth the present invention further.Should be understood that these embodiments are only not used in for illustration of the present invention to limit the scope of the invention.In addition should be understood that those skilled in the art can make various changes or modifications the present invention, and these equivalent form of values fall within the application's appended claims limited range equally after the content of having read the present invention's instruction.
Embodiment 1
The glass fibre composition of this embodiment and the weight percent of each component comprise: SiO
251.3%, B
2o
325%, Al
2o
312%, CaO5.5%, MgO2.5%, Na
2o0.15%, K
2o0.15%, CaF
20.9%, TiO
22%, ZrO
20.5%.According to the various raw material 200g of formula precise in agate mortar, in the full and uniform rear loading alumina crucible of powder mixing, put into electric furnace and carry out high-temperature fusion, melt temperature is 1500 DEG C, insulation 8h.After having founded, glass metal is poured into shift to an earlier date in ready cold water and quench, obtain glass cullet.Joined by glass cullet in the crucible of glass fiber single filament experiment line, the temperature of crucible is 1340 DEG C.Glass needs insulation 1h to carry out second melting in crucible, by the state of drain hole sight glass liquid, closes drain hole, start from orifice drawn glass fiber when glass metal can fall naturally from drain hole.Fig. 1 is the stereoscan photograph of this embodiment glass fibre, and diameter is about 10 μm.Fig. 2 is the tensile strength of this embodiment glass fibre, suitable with alkali free glass fibre (E glass).The glass fibre prepared gets 1g tiling in a mold, is 4:10 with epoxy resin mass ratio.Put it into preheating in 50 DEG C of baking ovens, remove open bubble.Epoxy resin mixes with the ratio of solidifying agent diethylenetriamine according to mass ratio 10:1, stirs the liquid state of 10min to micro-heat release.Leave standstill 30min again after ultrasonic 5min to eliminate the bubble produced in whipping process, be then poured in the mould of the good glass fibre of tiling of preheating, put into vacuum drying oven, 50 DEG C of insulation 0.5h, 80 DEG C of insulation 2h, 120 DEG C of insulation 4h, solidify completely to make it.The sample surfaces obtained like this is smooth, and defect is few, does not almost have bubble.Composite sample is disc-shaped, and two sides is smooth, and diameter is 3cm, and thickness is 5mm.Adopt STD-A type non-metallic material dielectric loss and specific inductivity instrument to test, method is resonance method, and frequency is 1MHz.The specific inductivity of the matrix material of this embodiment as shown in Figure 3, is 4.49.
Embodiment 2
The glass fibre composition of this embodiment and the weight percent of each component comprise: SiO
251.3%, B
2o
322%, Al
2o
315%, CaO5.5%, MgO2.5%, Na
2o2.5%, K
2o0.15%, CaF
20.9%, TiO
22%, ZrO
20.5%.According to the various raw material 200g of formula precise in agate mortar, in the full and uniform rear loading alumina crucible of powder mixing, put into electric furnace and carry out high-temperature fusion, melt temperature 1500 DEG C, insulation 8h.After having founded, glass metal is poured into shift to an earlier date in ready cold water and quench, obtain glass cullet.Joined by glass cullet in the crucible of glass fiber single filament experiment line, the temperature of crucible is 1340 DEG C.Glass needs insulation 1h to carry out second melting in crucible, by the state of drain hole sight glass liquid, closes drain hole, start from orifice drawn glass fiber when glass metal can fall naturally from drain hole.The glass fibre prepared gets 1g tiling in a mold, is 4:10 with epoxy resin mass ratio.Put it into preheating in 50 DEG C of baking ovens, remove open bubble.Epoxy resin mixes with the ratio of solidifying agent diethylenetriamine according to mass ratio 10:1, stirs the liquid state of 10min to micro-heat release.Leave standstill 30min again after ultrasonic 5min to eliminate the bubble produced in whipping process, be then poured in the mould of the good glass fibre of tiling of preheating, put into vacuum drying oven, 50 DEG C of insulation 0.5h, 80 DEG C of insulation 2h, 120 DEG C of insulation 4h, solidify completely to make it.The sample surfaces obtained like this is smooth, and defect is few, does not almost have bubble.Composite sample is disc-shaped, and two sides is smooth, and diameter is 3cm, and thickness is 5mm.Adopt STD-A type non-metallic material dielectric loss and specific inductivity instrument to test, method is resonance method, and frequency is 1MHz.The specific inductivity of the matrix material of this embodiment as shown in Figure 3, is 4.52.
Embodiment 3
The glass fibre composition of this embodiment and the weight percent of each component comprise: SiO
251.3%, B
2o
325%, Al
2o
312%, CaO2.5%, MgO5.5%, Na
2o0.15%, K
2o0.15%, CaF
20.9%, TiO
22%, ZrO
20.5%.According to the various raw material 200g of formula precise in agate mortar, in the full and uniform rear loading alumina crucible of powder mixing, put into electric furnace and carry out high-temperature fusion, melt temperature is 1550 DEG C, insulation 6h.After having founded, glass metal is poured into shift to an earlier date in ready cold water and quench, obtain glass cullet.Joined by glass cullet in the crucible of glass fiber single filament experiment line, the temperature of crucible is 1350 DEG C.Glass needs insulation 0.5h to carry out second melting in crucible, by the state of drain hole sight glass liquid, closes drain hole, start from orifice drawn glass fiber when glass metal can fall naturally from drain hole.The glass fibre prepared gets 0.5g tiling in a mold, is 2:10 with epoxy resin mass ratio.Put it into preheating in 50 DEG C of baking ovens, remove open bubble.Epoxy resin mixes with the ratio of solidifying agent diethylenetriamine according to mass ratio 10:1, stirs the liquid state of 10min to micro-heat release.Leave standstill 30min again after ultrasonic 5min to eliminate the bubble produced in whipping process, be then poured in the mould of the good glass fibre of tiling of preheating, put into vacuum drying oven, 50 DEG C of insulation 0.5h, 80 DEG C of insulation 2h, 120 DEG C of insulation 4h, solidify completely to make it.The sample surfaces obtained like this is smooth, and defect is few, does not almost have bubble.Composite sample is disc-shaped, and two sides is smooth, and diameter is 3cm, and thickness is 5mm.Adopt STD-A type non-metallic material dielectric loss and specific inductivity instrument to test, method is resonance method, and frequency is 1MHz.The specific inductivity of the matrix material of this embodiment as shown in Figure 3, is 4.48.
Embodiment 4
The glass fibre composition of this embodiment and the weight percent of each component comprise: SiO
251%, B
2o
325%, Al
2o
312%, CaO5.5%, MgO2.5%, Na
2o0.3%, K
2o0.15%, CaF
20.9%, TiO
22%, ZrO
20.5%.According to the various raw material 200g of formula precise in agate mortar, in the full and uniform rear loading alumina crucible of powder mixing, put into electric furnace and carry out high-temperature fusion, melt temperature is 1550 DEG C, insulation 6h.After having founded, glass metal is poured into shift to an earlier date in ready cold water and quench, obtain glass cullet.Joined by glass cullet in the crucible of glass fiber single filament experiment line, the temperature of crucible is 1350 DEG C.Glass needs insulation 0.5h to carry out second melting in crucible, by the state of drain hole sight glass liquid, closes drain hole, start from orifice drawn glass fiber when glass metal can fall naturally from drain hole.The glass fibre prepared gets 0.5g tiling in a mold, is 2:10 with epoxy resin mass ratio.Put it into preheating in 50 DEG C of baking ovens, remove open bubble.Epoxy resin mixes with the ratio of solidifying agent diethylenetriamine according to mass ratio 10:1, stirs the liquid state of 10min to micro-heat release.Leave standstill 30min again after ultrasonic 5min to eliminate the bubble produced in whipping process, be then poured in the mould of the good glass fibre of tiling of preheating, put into vacuum drying oven, 50 DEG C of insulation 0.5h, 80 DEG C of insulation 2h, 120 DEG C of insulation 4h, solidify completely to make it.The sample surfaces obtained like this is smooth, and defect is few, does not almost have bubble.Composite sample is disc-shaped, and two sides is smooth, and diameter is 3cm, and thickness is 5mm.Adopt STD-A type non-metallic material dielectric loss and specific inductivity instrument to test, method is resonance method, and frequency is 1MHz.The specific inductivity of the matrix material of this embodiment as shown in Figure 3, is 4.45.
Claims (10)
1. have a glass fiber compound material for low-k, it is characterized in that, described matrix material is made up of glass fibre filling epoxy resin; Wherein glass fibre is 2 ~ 4:10 with weight epoxy ratio.
2. a kind of glass fiber compound material with low-k according to claim 1, it is characterized in that, the composition of described glass fibre comprises by weight percentage: SiO
251% ~ 52%, B
2o
320% ~ 25%, Al
2o
310% ~ 15%, CaO2% ~ 6%, MgO2% ~ 6%, Na
2o0.15% ~ 0.3%, K
2o0 ~ 0.3%, Li
2o0 ~ 0.3%, CaF
20 ~ 0.9%, TiO
20 ~ 2%, ZrO
20 ~ 0.5%.
3. a kind of glass fiber compound material with low-k according to claim 2, is characterized in that, described CaO and MgO weight percent meets: CaO+MgO=8%.
4. a kind of glass fiber compound material with low-k according to claim 2, is characterized in that, described Na
2o, K
2o and Li
2the weight percent of O meets: Na
2o+K
2o+Li
2o=0.3% ~ 0.6%, wherein, Na
2o=K
2o or Na
2o=K
2o+Li
2o.
5. a kind of glass fiber compound material with low-k according to claim 2, is characterized in that, described CaF
2weight percent be 0.9%.
6. a kind of glass fiber compound material with low-k according to claim 2, is characterized in that, described TiO
2weight percent be 2%.
7. a kind of glass fiber compound material with low-k according to claim 2, is characterized in that, described ZrO
2weight percent be 0.5%.
8. a kind of glass fiber compound material with low-k according to claim 1, is characterized in that, the spinning temperature of described glass fibre is 1340 ~ 1350 DEG C.
9. a kind of glass fiber compound material with low-k according to claim 1, is characterized in that, described matrix material is when frequency is 1MHz, and specific inductivity is about 4.5.
10. there is a preparation method for the glass fiber compound material of low-k, comprising:
(1) take each composition of glass fibre, mixing is placed in crucible, melting 6 ~ 8h at 1500 ~ 1550 DEG C, and quenching, obtains glass cullet; Joined by glass cullet in the crucible of glass fiber single filament experiment line, second melting 0.5 ~ 1h at 1340 ~ 1350 DEG C, wire drawing, obtains glass fibre, gets 0.5 ~ 1g glass fibre and is laid in Teflon mould, puts into 50 DEG C of baking oven preheatings;
(2) extracting epoxy resin and solidifying agent in mass ratio 10:1 mix, stir, ultrasonic, leave standstill; Then join in the mould of step (1), solidification, obtains the glass fiber compound material with low-k; Wherein, glass fibre is 2 ~ 4:10 with weight epoxy ratio.
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| CN108383378A (en) * | 2018-06-04 | 2018-08-10 | 中建材蚌埠玻璃工业设计研究院有限公司 | A kind of glass with low dielectric constant |
| CN108411446A (en) * | 2017-02-10 | 2018-08-17 | 旭化成株式会社 | Glass cloth, prepreg and printed circuit board |
| CN111943515A (en) * | 2020-08-25 | 2020-11-17 | 四川华原玻璃纤维有限责任公司 | Low-dielectric-constant glass fiber and preparation method thereof |
| WO2022105185A1 (en) * | 2020-11-18 | 2022-05-27 | 南京玻璃纤维研究设计院有限公司 | Low dielectric glass fiber and preparation method therefor, glass fiber product, composite material and application thereof |
| CN117691199A (en) * | 2024-01-31 | 2024-03-12 | 帕瓦(长沙)新能源科技有限公司 | Glass fiber-based composite material and preparation method and application thereof |
| CN117691199B (en) * | 2024-01-31 | 2024-05-10 | 帕瓦(长沙)新能源科技有限公司 | Glass fiber-based composite material and preparation method and application thereof |
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| CN108411446A (en) * | 2017-02-10 | 2018-08-17 | 旭化成株式会社 | Glass cloth, prepreg and printed circuit board |
| CN108383378A (en) * | 2018-06-04 | 2018-08-10 | 中建材蚌埠玻璃工业设计研究院有限公司 | A kind of glass with low dielectric constant |
| CN111943515A (en) * | 2020-08-25 | 2020-11-17 | 四川华原玻璃纤维有限责任公司 | Low-dielectric-constant glass fiber and preparation method thereof |
| WO2022105185A1 (en) * | 2020-11-18 | 2022-05-27 | 南京玻璃纤维研究设计院有限公司 | Low dielectric glass fiber and preparation method therefor, glass fiber product, composite material and application thereof |
| CN117691199A (en) * | 2024-01-31 | 2024-03-12 | 帕瓦(长沙)新能源科技有限公司 | Glass fiber-based composite material and preparation method and application thereof |
| CN117691199B (en) * | 2024-01-31 | 2024-05-10 | 帕瓦(长沙)新能源科技有限公司 | Glass fiber-based composite material and preparation method and application thereof |
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