CN1374826A - Laminating method and product of circuit board with low dielectric coefficient insulating material to inhibitor electromagnetic interference - Google Patents
Laminating method and product of circuit board with low dielectric coefficient insulating material to inhibitor electromagnetic interference Download PDFInfo
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- CN1374826A CN1374826A CN 01111239 CN01111239A CN1374826A CN 1374826 A CN1374826 A CN 1374826A CN 01111239 CN01111239 CN 01111239 CN 01111239 A CN01111239 A CN 01111239A CN 1374826 A CN1374826 A CN 1374826A
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Abstract
The circuit board with low dielectric coefficient insulating material to inhibit electromagnetic interference is one four-layered structure, including the first and the fourth signal wire layers, the second power source layer and the third earthing layer. The circuit board has one first insulating layer between the second and the third layers and one second insulating layer between the first and the second layers and between the third and the fourth layers. The dielectric coefficient of the first insulating layer is greater than that of the second insulating layer, so that the thickness of the second insulating layer may be smaller to reduce electromagnetic interference and suit to high speed signal.
Description
The present invention relates to a kind of insulating material that utilizes low-k and suppress circuit board compression method of electromagnetic interference and products thereof, be meant especially and a kind ofly reduce electromagnetic interference and be applicable to circuit board compression method of high speed signal and products thereof.
Scientific and technological progress now, make and be full of appliance and electronic in the life, yet these appliance and electronics in use, the problem that can generate electromagnetic waves mostly and disturb, and may cause the contiguous appliance and electronic can't normal operation, even human body had harmful effect, so the value that today, appliance and electronic such as circuit board can produce electromagnetic interference is fixed safety standard.
With reference to Fig. 1, be known four-layer circuit board, first and four layer of this circuit board is signal lead layer S1, S2, the second layer is that bus plane and the 3rd layer are ground plane GND, and this circuit board has one and lays respectively at the second insulating barrier I2 between first and two layer and the 3rd and four layer of this circuit board at the first insulating barrier I1 and two between second and three layer of this circuit board, the first insulating barrier I1 is that base material (thin core) and all second insulating barrier I2 are film (prepreg), the thickness H1 of the first insulating barrier I1 is that the thickness H2 of the 47mil and the second insulating barrier I2 is 5mil, general manufacturer adopts glass reinforced epoxy to make first, two insulating barrier I1, I2, so first, two insulating barrier I1, the dielectric coefficient of I2 is 4.5, signal lead layer S1 is for the relative resistance value RS1=signal lead layer S2 of bus plane resistance value RS2=60 ohm for ground plane GND, but because the signal frequency on the circuit board day by day improves (being increased to 133MHZ by 33MHZ), and shown in following formula 1, the magnetic field intensity of Electromagnetic Interference is directly proportional with frequency square, so Electromagnetic Interference is also risen with the increase of frequency.
Wherein: | E|: the magnetic field intensity of Electromagnetic Interference
F: the frequency of signal
I: the size of current of signal
A: the area that signal flow is crossed
D: with the distance of radiation source
At first, when above-listed formula 1 is applied in circuit board, the area A that signal flow is crossed is: the distance between the track lengths L that signal flow is crossed * signal lead layer S2 and the ground plane GND (is the thickness H2 of the second insulating barrier I2, so also be the distance H 2 between signal lead layer S1 and the bus plane), with reference to shown in Figure 2, be for European Region with radiation source be under the 10m (meter) apart from d, the standard value of allowed Electromagnetic Interference, and known circuit board is 100MHZ in the frequency of signal, with radiation source apart from d=10m, signal flow is crossed under the situation that track lengths L is 100mil (1mil=0.00254cm) and current value I=20mA, the magnetic field intensity of utilizing above-listed formula 1 Electromagnetic Interference that calculates is European specified standard value 30dB μ V for 34dB μ V is higher than, so known circuit board is conformance with standard not, and according to above-listed formula 1, if the area A that signal flow is crossed is dwindled, can allow the magnetic field intensity of Electromagnetic Interference dwindle thereupon, therefore, the H2 thickness of the second insulating barrier I2 is dwindled (when thickness is reduced into 3mil), then can make the magnetic field intensity of Electromagnetic Interference drop to conformance with standard (magnetic field intensity of Electromagnetic Interference is 29.56dB μ V), but the thickness H2 of the second insulating barrier I2 dwindles and can cause following shortcoming:
1. the circuit board gross thickness does not meet standard: because the gross thickness of the industrial standard of this kind four-layer circuit board should be certain value, but the thickness H2 of the second insulating barrier I2 is when dwindling, and gross thickness will be dwindled and no longer meets industrial standard.
2. relative impedance does not meet the impedance standard of high speed signal: when being 3mil owing to thickness H2, signal lead layer S1 is for the resistance value RS1=signal lead layer S2 of bus plane resistance value RS=37 ohm for ground plane GND, and this kind circuit board is when walking the high speed signal, the resistance value design of its transmission line, just the layer with layer between resistance value, preferably should be best according to the specification theoretical value that Intel sets at 55 Ω ± 10%, just be preferably between 49.5 Ω～60.5 Ω, so and do not meet the impedance standard of high speed signal.
In view of this, be the shortcoming of effectively avoiding known technology to exist, this case invention provides the insulating material that utilizes low-k to suppress circuit board compression method of electromagnetic interference and products thereof.
Purpose of the present invention suppresses circuit board compression method of electromagnetic interference and products thereof with regard to providing a kind of insulating material that utilizes low-k that can overcome the problem of described prior art existence.
According to a first aspect of the invention, the invention provides a kind of circuit board compression method that utilizes the insulating material inhibition electromagnetic interference of low-k, this circuit board is a four-layer circuit board, wherein first and four of this circuit board layer is the signal lead layer, the second layer is that bus plane and the 3rd layer are ground plane, and this circuit board has one and lays respectively at second insulating barrier between first and two and the 3rd and four layer of this circuit board at first insulating barrier and two between second and three layer, and this method comprises the steps: that (a) carries out pressing with the bus plane of described circuit board across the ground plane of this first insulating barrier and foregoing circuit plate; And (b) with in the step (a) two surfaces of the circuit board of pressing be lower than second insulating barrier of dielectric coefficient of this first insulating barrier and two signal lead laminations of described circuit board close across a dielectric coefficient respectively.Wherein, described second insulating layer material is to constitute by selecting one in the following group, this group is by glass fiber-reinforced polyamide, glass fiber-reinforced pi, glass fiber-reinforced fluoride, constitutes along Malaysia acyl triazine, thermmohardening barium titanate coforms and oxidation polyphenyl phenol alkene epoxy resin.
According to a second aspect of the invention, the invention provides the circuit board that a kind of insulating material that utilizes low-k suppresses electromagnetic interference, this circuit board is a four-layer circuit board, first and four layer of this circuit board is the signal lead layer, the second layer is that bus plane and the 3rd layer are ground plane, and this circuit board has one and lays respectively at second insulating barrier between first and two layer and the 3rd and four layer of this circuit board at first insulating barrier and two between second and three layer of this circuit board, it is characterized in that: the material of this second insulating barrier is to constitute by selecting one in the following group, this group is by glass fiber-reinforced polyamide, glass fiber-reinforced pi, glass fiber-reinforced fluoride, along Malaysia acyl triazine, thermmohardening barium titanate coforms and oxidation polyphenyl phenol alkene epoxy resin constitute, and the dielectric coefficient that causes this first insulating barrier is the dielectric coefficient greater than this second insulating barrier.
Relevant the present invention be achieve the above object, technological means and effect thereof that feature adopted, now exemplify preferred embodiment and accompanying drawings is as follows:
Fig. 1 is the schematic section of known four-layer circuit board.
Fig. 2 is the standard value chart of the Electromagnetic Interference in Europe.
Fig. 3 is the schematic section of preferred embodiment of the present invention.
Fig. 4 is the local enlarged diagram of preferred embodiment of the present invention.
At first, with reference to Fig. 3, be a preferred embodiment of the present invention, in the present embodiment, this circuit board is a four-layer circuit board, first of this circuit board, four layers is signal lead layer S1, S2, and this signal lead layer S1, also power sub-part of S2 is laid, and the second layer of this circuit board and the 3rd layer are respectively bus plane and ground plane GND, in addition, this circuit board has one and lays respectively at the second insulating barrier I2 between first and two and the 3rd and four layer of this circuit board at the first insulating barrier I1 and two between second and three layer, and for manufacturer, the first insulating barrier I1 is that base material (thin core) and each second insulating barrier I2 are film (prepreg).
As previously mentioned, each signal lead layer S1 of circuit board, the relative resistance value of S2 is preferably in 49.5～60.5 ohm of scopes of the theoretical resistance value of high-speed line of Intel regulation, and the thickness H2 of the second insulating barrier I2 can make the radiation intensity value of Electromagnetic Interference descend when dwindling, but can make signal lead layer S1, the relative resistance value of S2 descends thereupon, and the present invention can make second insulating barrier I2 utilization make than the material of low-k, make each signal lead layer S1, the relative resistance value of S2 drops in 49.5～60.5 ohm of scopes of the theoretical resistance value of high-speed line of Intel regulation, and manufacturer was applied in insulating barrier I1 in the past, the material of I2 is that dielectric coefficient is 4.5 glass reinforced epoxy, so the present invention then adopts dielectric coefficient to be lower than 4.5 material and makes second insulating barrier, in addition, generally speaking, symmetry pressing for convenience, manufacturers design mostly makes the thickness H2 of two second insulating barrier I2 identical, comparatively convenient on not only making, also meet manufacture now, so the present invention improves according to the described material and the thickness of slab that carry out insulating barrier considered.
For making the present invention be more prone to clear, come general description the present invention by following formula, but it should be noted that following explanation is that the thickness of slab at the industrial standard of four-layer circuit board is that 1.6mil illustrates, but enforcement of the present invention should be not limited to the four-layer circuit board of thickness of slab 1.6mil:
At first, with reference to Fig. 4, calculate the resistance value R1 (also can be secondary signal routing layer S2 resistance value R2 with respect to ground plane GND) of the first signal lead layer S1 with respect to bus plane, can suppose earlier that the insulating material that the second insulating barrier H2 utilizes dielectric coefficient to be lower than 4.5 low-k makes, in the computing of present embodiment, getting dielectric coefficient and be 3.2 calculates, and the suitable thickness of the hypothesis second insulating barrier H2, utilize following formula 2 to obtain resistance value R1 (or R2 again, because of in the present embodiment, two second thickness of insulating layer are identical, so R1=R2):
Wherein: ER=dielectric coefficient=3.2
The thickness of H2=second insulating barrier
The W=live width=can be in 2～8mil scope, live width is 5mil in the present embodiment
The thickness of the T1=first signal lead layer S1
1H1+2H2+2T1+2T2=1.6mil ... formula 3
In addition, generally speaking, the skin of circuit board is first, binary signal routing layer S1, the thickness T 1 of S2 is 0.7mil, and internal layer is that bus plane and ground plane GND thickness T 2 are 1.4mil, and the gross thickness of circuit board must meet industrial standard 1.6mm (as formula 3), so utilize aforesaid condition and notion, the present invention utilizes above-listed mode, obtain a preferred embodiment of the present invention, promptly work as the thickness H1 of first insulating barrier in 38.25～63.75mil scope, is good at this with H1=51mil, the second thickness of insulating layer H2 is in the 0.5-5.5mil scope, with H2=3mil is good, and the first insulating barrier I1 can utilize dielectric coefficient in the past is 4.5 glass reinforced epoxy, and the second insulating barrier I2 to utilize dielectric coefficient be that the insulating material of 3.2 low dielectric is made, in the case, the first signal lead layer S1 is with respect to the resistance value R1=secondary signal routing layer S2 of bus plane resistance value R2=56 ohm with respect to ground plane GND, meet 2H2+1H1+2T1+2T2=2 * 3mil+1 * 51mil+2 * 0.7mil+2 * 1.4mil=61.2mil ≈ 1.55mm and each resistance value in 49.5～60.5 ohm of scopes of the theoretical resistance value of high-speed line of Intel regulation, and the radiation intensity value of Electromagnetic Interference descends, so can utilize the insulating material of low-k to reduce electromagnetic interference really and be applicable to the purpose of high speed signal.
Moreover, the material of the second insulating barrier I2 so long as dielectric coefficient get final product less than the dielectric coefficient of first insulating barrier, so the material of second insulating barrier can be glass fiber-reinforced polyamide (polyamide), glass fiber-reinforced pi, glass fiber-reinforced fluoride, along Malaysia acyl triazine (cis malaimidetriazine), the insulating material of the low-k of thermmohardening barium titanate coforms (as Rogers 4350) or oxidation polyphenyl phenol alkene (polyphenolene) epoxy resin and so on, the dielectric coefficient of these materials mostly about 3.5 all less than the dielectric coefficient (dielectric coefficient of present embodiment first insulating barrier is 4.5) of first insulating barrier, can be polytetrafluoroethylene (PTFE) as fluoride, its dielectric coefficient is approximately 2.8～3.0.
In sum, because of the present invention following advantage is arranged:
1. the thickness of circuit board meets industrial standard: because in the present embodiment, the gross thickness that can adjust circuit board is 1.6mm, so the gross thickness of circuit board of the present invention can meet industrial standard really.
2. be applicable to high speed signal: because of resistance value R1, R2 in theoretical resistance value 49.5～60.5 scopes of the high-speed line of Intel regulation, so be applicable to high speed signal, meeting now, manufacturing industry can improve the value of product and competitiveness toward the trend of high speed signal development.
3. reduce the magnetic field intensity of Electromagnetic Interference: owing to make the thickness of the second insulating barrier H2 reduce to 3mil by 5mil compared to known, the thickness that makes the second insulating barrier H2 of the present invention is 3/5ths of known second thickness of insulating layer, so the magnetic field intensity in the present embodiment Electromagnetic Interference can be compared to known minimizing 2/5ths, roughly reduce to 29.56db μ V, the present invention is lower than European Region regulation safety value, so can reach the effect of the magnetic field intensity that reduces Electromagnetic Interference really.
4. meet economic benefits: owing to only need to change the thickness and the material of pressing condition such as insulating barrier, can reach desired magnetic field intensity of high speed signal and resistance value, and need not spend a large amount of human and material resources, revise layout on the circuit board, thereby the manpower and the material resources that can significantly reduce modification and spent, reach and meet economic benefits.
In sum, the insulating material that utilizes low-k of the present invention really can pass through above-mentioned disclosed structure, device for circuit board compression method of suppressing electromagnetic interference and products thereof, reaches its intended purposes and effect.
Accompanying drawing shown in above-mentioned and explanation are embodiments of the invention only, are not for limiting enforcement of the present invention; All those skilled in the art, according to feature category of the present invention, other equivalent variations or the modification done all should be encompassed in the claim of the present invention institute restricted portion.
Claims (18)
1. an insulating material that utilizes low-k suppresses the circuit board compression method of electromagnetic interference, this circuit board is a four-layer circuit board, wherein first and four of this circuit board layer is that bus plane and the 3rd layer are ground plane for signal lead layer, the second layer, and this circuit board has one and lays respectively at second insulating barrier between first and two and the 3rd and four layer of this circuit board at first insulating barrier and two between second and three layer, and this method comprises the steps:
(a) bus plane with described circuit board carries out pressing across the ground plane of this first insulating barrier and described circuit board; And
(b) with in the step (a) two surfaces of the circuit board of pressing be lower than second insulating barrier of dielectric coefficient of this first insulating barrier and two signal lead laminations of described circuit board close across a dielectric coefficient respectively, wherein, described second insulating layer material is to constitute by selecting one in the following group, this group is by glass fiber-reinforced polyamide, glass fiber-reinforced pi, glass fiber-reinforced fluoride, constitutes along Malaysia acyl triazine, thermmohardening barium titanate coforms and oxidation polyphenyl phenol alkene epoxy resin.
The method of claim 1, wherein in this step (a) dielectric coefficient of first insulating barrier be 4.5.
3. method as claimed in claim 2, wherein, the dielectric coefficient of second insulating barrier in each described step (b) is less than 4.5.
4. method as claimed in claim 3, wherein, the thickness of second insulating barrier in each described step (b) is in 0.5mil～5.5mil scope.
5. method as claimed in claim 4, wherein, the thickness of first insulating barrier in this step (a) is in 38.25～63.75mil scope.
6. method as claimed in claim 4, wherein, the thickness of second insulating barrier in each described step (b) is 3mil.
7. method as claimed in claim 5, wherein, the thickness of first insulating barrier in this step (a) is 51mil.
8. method as claimed in claim 1 or 2, wherein, the material of first insulating barrier in this step (a) is a glass reinforced epoxy.
9. the method for claim 1, wherein the fluoride of this glass fiber-reinforced fluoride is a polytetrafluoroethylene.
10. an insulating material that utilizes low-k suppresses the circuit board of electromagnetic interference, this circuit board is a four-layer circuit board, first and four layer of this circuit board is that bus plane and the 3rd layer are ground plane for signal lead layer, the second layer, and this circuit board has one and lays respectively at second insulating barrier between first and two layer and the 3rd and four layer of this circuit board at first insulating barrier and two between second and three layer of this circuit board, it is characterized in that:
The material of this second insulating barrier is to constitute by selecting one in the following group, this group is by glass fiber-reinforced polyamide, glass fiber-reinforced pi, glass fiber-reinforced fluoride, is constituted along Malaysia acyl triazine, thermmohardening barium titanate coforms and oxidation polyphenyl phenol alkene epoxy resin, causes the dielectric coefficient of the dielectric coefficient of this first insulating barrier greater than described second insulating barrier.
11. circuit board as claimed in claim 10, wherein, the dielectric coefficient of this first insulating barrier is 4.5.
12. circuit board as claimed in claim 11, wherein, the dielectric coefficient of described second insulating barrier is less than 4.5.
13. circuit board as claimed in claim 12, wherein, the thickness of each described second insulating barrier is in 0.5mil～5.5mil scope.
14. circuit board as claimed in claim 13, wherein, the thickness of this first insulating barrier is in 38.25～63.75mil scope.
15. circuit board as claimed in claim 13, wherein, the thickness of each described second insulating barrier is 3mil.
16. circuit board as claimed in claim 15, wherein, the thickness of this first insulating barrier is 51mil.
17. circuit board as claimed in claim 10, wherein, the material of this first insulating barrier is a glass reinforced epoxy.
18. circuit board as claimed in claim 10, wherein the fluoride of this glass fiber-reinforced fluoride is to be polytetrafluoroethylene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01111239 CN1268181C (en) | 2001-03-08 | 2001-03-08 | Laminating method and product of circuit board with low dielectric coefficient insulating material to inhibitor electromagnetic interference |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01111239 CN1268181C (en) | 2001-03-08 | 2001-03-08 | Laminating method and product of circuit board with low dielectric coefficient insulating material to inhibitor electromagnetic interference |
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| Publication Number | Publication Date |
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| CN1374826A true CN1374826A (en) | 2002-10-16 |
| CN1268181C CN1268181C (en) | 2006-08-02 |
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| CN 01111239 Expired - Fee Related CN1268181C (en) | 2001-03-08 | 2001-03-08 | Laminating method and product of circuit board with low dielectric coefficient insulating material to inhibitor electromagnetic interference |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101283137B (en) * | 2005-08-17 | 2012-03-21 | 茵奈格利迪有限责任公司 | Composite materials including high modulus polyolefin fibers and method of making same |
| CN104247587A (en) * | 2012-03-01 | 2014-12-24 | 奥托立夫开发公司 | An electronic unit with a PCB and two housing parts |
| CN105271786A (en) * | 2015-10-12 | 2016-01-27 | 东华大学 | Low-dielectric-constant glass fiber composite material and preparation method thereof |
-
2001
- 2001-03-08 CN CN 01111239 patent/CN1268181C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101283137B (en) * | 2005-08-17 | 2012-03-21 | 茵奈格利迪有限责任公司 | Composite materials including high modulus polyolefin fibers and method of making same |
| CN104247587A (en) * | 2012-03-01 | 2014-12-24 | 奥托立夫开发公司 | An electronic unit with a PCB and two housing parts |
| CN105271786A (en) * | 2015-10-12 | 2016-01-27 | 东华大学 | Low-dielectric-constant glass fiber composite material and preparation method thereof |
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| Publication number | Publication date |
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| CN1268181C (en) | 2006-08-02 |
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Granted publication date: 20060802 Termination date: 20140308 |